CN217904919U

CN217904919U - Heat radiation structure of electronic device and heat radiation module thereof

Info

Publication number: CN217904919U
Application number: CN202221049126.4U
Authority: CN
Inventors: 林俊宏
Original assignee: MICROLOOPS CORP; Huizhou Huiliqin Electronic Technology Co ltd
Current assignee: MICROLOOPS CORP; Huizhou Huiliqin Electronic Technology Co ltd
Priority date: 2022-05-05
Filing date: 2022-05-05
Publication date: 2022-11-25
Anticipated expiration: 2032-05-05

Abstract

The utility model provides a heat dissipation module, it contains a samming board and an at least heat pipe. The temperature-uniforming plate includes a lower half-shell and an upper half-shell, the lower half-shell is closed by abutting against the upper half-shell, a lower projection is projected from the outer side of the lower half-shell, and an upper projection is projected from the outer side of the upper half-shell. One part of the heat pipe is attached to the upper boss, the heat pipe extends to the outside of the edge of the temperature-equalizing plate along the plane parallel to the temperature-equalizing plate, the heat pipe is provided with a plurality of fins, and at least one part of the fins is arranged adjacent to the edge of the temperature-equalizing plate. The utility model discloses a temperature-uniforming plate is by the half lower shell and the half upper shell component is used for increasing temperature-uniforming plate thickness and makes the space increase of the peripheral department of temperature-uniforming plate. Therefore, the heat pipe and the fins do not need to be changed in configuration to avoid the electronic components surrounding the temperature equalizing plate, and the heat-radiating section of the heat pipe can be effectively utilized. Has the advantage of high heat dissipation efficiency.

Description

Heat radiation structure of electronic device and heat radiation module thereof

Technical Field

The present invention relates to the field of heat pipe heat dissipation, and more particularly, to a heat pipe and vapor chamber heat dissipation module.

Background

Heat pipes are components commonly used in the field of electronic heat dissipation, and are mainly used for transferring heat energy. Generally, a heat pipe has a portion for absorbing heat and another portion for releasing heat, the heat absorbing portion is usually connected to a heat conductor, and the heat conductor is used for contacting a heat source to remove heat energy from the heat source and further transferring the heat energy to a heat releasing portion via the heat pipe for further discharging. The heat sink part of the heat pipe is connected with the temperature equalizing plate, and fins are arranged on other parts of the heat pipe to dissipate the heat absorbed into the heat pipe into the air. The heat source is usually a chip such as a central processing unit or an image processor, and the chip is generally disposed on a circuit board, and other electronic components for assisting the chip in working are disposed on the periphery of the chip. The bottom surface of the temperature-uniforming plate is attached to the chip and the top surface is attached to the heat pipe. However, the space between the top surface of the conventional thin temperature-uniforming plate and the circuit board is limited, so that there is not enough space for placing fins above the electronic components, and the heat pipe cannot exert the maximum efficiency. The current thin temperature equalization plates are all made of metal plates which are punched to form a cavity, and then the cavity is closed by overlapping another metal plate. The thickness of the metal plate is limited to about 0.3 mm due to the finished volume of the thin vapor chamber, but the metal plate is broken due to excessive deformation, so the allowable depth of the punch recess is limited, and the thickness of the vapor chamber made of the metal plate with the thickness is limited to a specific range.

In view of the above, the present inventors have made extensive studies and studies to solve the above problems in combination with the application of the above prior art, and as a result, the present inventors have improved the present invention.

SUMMERY OF THE UTILITY MODEL

The invention provides a heat pipe combined heat dissipation structure of a temperature equalization plate and a heat dissipation module thereof.

The utility model provides a heat dissipation module, it contains a temperature-uniforming plate and an at least heat pipe. The temperature equalizing plate comprises a lower half shell and an upper half shell, wherein the lower half shell is closed by butting with the upper half shell, a lower boss protrudes from the outer side of the lower half shell, and an upper boss protrudes from the outer side of the upper half shell. One part of the heat pipe is attached to the upper boss, the heat pipe extends to the outside of the edge of the temperature-equalizing plate along the plane parallel to the temperature-equalizing plate, the heat pipe is provided with a plurality of fins, and at least one part of the fins is arranged adjacent to the edge of the temperature-equalizing plate.

The utility model discloses a heat radiation module, its heat pipe has a heat absorption section, and the heat absorption section is attached in last boss. One side of the heat absorption section is provided with a heat exchange plane, and the heat exchange plane is attached to the upper boss.

The utility model discloses a heat radiation module, its heat pipe are several, and each heat pipe has a heat absorption section respectively, and attached in last boss of these a little heat absorption sections, these a little heat absorption sections contact each other and dispose side by side.

The utility model discloses a heat radiation module, its heat absorption section is flat tubulose or half round tube shape.

The utility model discloses a heat radiation module, the interval of the edge of its fin interval arrangement and temperature-uniforming plate and adjacent fin is not more than the interval of these some fins.

The utility model also provides an electron device's heat radiation structure, it contains a circuit board and aforementioned heat radiation module. One surface of the circuit board is provided with a chip and a plurality of electronic components arranged around the chip. The lower boss is attached to the chip, and the fin adjacent to the edge of the temperature-uniforming plate is positioned above at least one part of the electronic component.

The utility model discloses a heat radiation structure of electronic device and heat radiation module thereof, its temperature-uniforming plate is by half lower shell and half first shell component increase temperature-uniforming plate thickness (temperature-uniforming plate upper surface to circuit board height promptly) and make the space increase of the peripheral department of temperature-uniforming plate. Therefore, the heat pipe and the fins do not need to be changed in configuration to avoid the electronic components surrounding the temperature equalizing plate, and the heat-radiating section of the heat pipe can be effectively utilized.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipation structure of an electronic device according to a preferred embodiment of the present invention.

Fig. 2 is a cross-sectional view of a heat dissipation structure of an electronic device according to a preferred embodiment of the present invention.

Fig. 3 is a partial enlarged view of the area 3 shown in fig. 2.

Fig. 4 is a perspective view of a heat dissipation module according to a preferred embodiment of the present invention.

Fig. 5 is a cross-sectional view of a heat dissipation module according to a preferred embodiment of the present invention.

Fig. 6 is a schematic perspective exploded view of a vapor chamber and a heat pipe in a heat dissipation module according to a preferred embodiment of the present invention.

Fig. 7 is a schematic perspective view of a vapor chamber and a heat pipe in a heat dissipation module according to a preferred embodiment of the present invention.

Fig. 8 is a sectional view of a vapor chamber and a heat pipe in a heat dissipation module according to a preferred embodiment of the present invention.

Symbolic description in the drawings:

the heat dissipation module comprises a circuit board 10, a chip 21, an electronic assembly 22, a heat dissipation module 30, a temperature equalization plate 100, a lower half shell 110, a lower concave part 111, a lower boss 112, an upper half shell 120, an upper concave part 121, an upper boss 122, a capillary structure 130, a heat pipe 200, a heat absorption section 210, a heat exchange plane 211 and fins 220.

Detailed Description

Referring to fig. 1 to 3, a heat dissipation structure of an electronic device according to a preferred embodiment of the present invention includes a circuit board 10 and a heat dissipation module 30. One side of the circuit board 10 is provided with a chip 21 and a plurality of electronic components 22, and the electronic components 22 surround the chip 21 and are disposed adjacent to the chip 21.

Referring to fig. 4 to 5, the heat dissipation module 30 includes a temperature equalization plate 100 and at least one heat pipe 200. In this embodiment, the heat dissipation module 30 preferably includes a plurality of heat pipes 200, and then only one of the heat pipes 200 is used to illustrate the structure of the heat pipe 200, but the structure is not limited to all of the heat pipes 200, that is, at least one of the heat pipes 200 conforms to the structure described later.

Referring to fig. 5 and 8, in the present embodiment, the vapor chamber 100 includes a lower half-shell 110 and an upper half-shell 120. The lower half-shell 110 is made of a metal sheet by stamping, the inner side of the lower half-shell 110 is recessed to form a lower recess 111, and the outer side of the lower half-shell 110 is protruded to form a lower boss 112. The upper half-shell 120 is made of a metal sheet by stamping, the inner side of the upper half-shell 120 is recessed to form an upper recess 121, and the outer side of the upper half-shell 120 is protruded to form an upper boss 122. The lower housing half 110 is abutted against the upper housing half 120 to close the lower recess 111 and the upper recess 121 for filling with a working fluid (not shown). And the walls of the lower recess 111 and the upper recess 121 are covered with a capillary structure 130 for adsorbing the working fluid. The lower boss 112 is attached to the chip 21, a portion of the heat pipe 200 is attached to the upper boss 122, and the heat pipe 200 extends to the outside of the edge of the vapor chamber 100 along a plane parallel to the vapor chamber 100.

Referring to fig. 2 to 3 and 5 to 8, the heat pipe 200 has a heat absorbing section 211, the heat absorbing section 211 may be located at one end or a middle section of the heat pipe 200, one side of the heat absorbing section 211 has a heat exchanging plane 211, and the heat exchanging plane 211 is attached to the upper boss 122 to absorb heat energy from the temperature equalizing plate 100. In the present embodiment, the heat absorbing section 211 is preferably in a flat tubular shape, but the invention is not limited thereto, for example, the heat absorbing section 211 may also be in a semi-circular tubular shape. In the present embodiment, each heat pipe 200 has a heat absorbing section 211, the heat absorbing sections 211 are attached to the upper bosses 122, and the heat absorbing sections 211 are disposed side by side in contact with each other.

The heat pipe 200 has a plurality of fins 220, and particularly, the fins 220 can be disposed in the remaining sections of the heat absorbing section 211 to dissipate the heat energy in the heat pipe 200. At least a portion of the fins 220 (i.e., one or more of the fins 220) is disposed adjacent to and along the edge of the vapor chamber 100. In this embodiment, the fins 220 are arranged at intervals, at least one fin 220 is disposed adjacent to the edge of the temperature-uniforming plate 100, and the fin 220 adjacent to the edge of the temperature-uniforming plate 100 is located above the electronic components 22 (i.e., one or more of the electronic components 22) at least partially surrounding the temperature-uniforming plate 100, so that the heat dissipatable section of the heat pipe 200 can be effectively utilized. Preferably, the distance between the edge of the vapor chamber 100 and the adjacent part of the fins 220 is not greater than the distance between the remaining part of the fins 220.

To sum up, the heat dissipating structure of the electronic device and the heat dissipating module 30 of the present invention have the temperature-uniforming plate 100 composed of the lower half-shell 110 and the upper half-shell 120 to increase the thickness of the temperature-uniforming plate 100 (i.e. the height from the upper surface of the temperature-uniforming plate 100 to the circuit board 10) and increase the space at the periphery of the temperature-uniforming plate 100. Therefore, the heat pipe 200 and the fins 220 do not need to be configured to avoid the electronic components 22 surrounding the vapor chamber 100, and the heat-dissipating section of the heat pipe 200 can be effectively utilized.

The above mentioned are only preferred embodiments of the present invention, not intended to limit the scope of the present invention, other equivalent variations of the spirit of the present invention should all belong to the scope of the present invention.

Claims

1. A heat dissipation module, comprising: the temperature equalizing plate comprises a lower half shell and an upper half shell, the lower half shell is closed by being butted with the upper half shell, a lower boss protrudes from the outer side of the lower half shell, and an upper boss protrudes from the outer side of the upper half shell;

and at least one heat pipe, a part of which is attached to the upper boss and extends to the outside of the edge of the temperature-uniforming plate along the plane parallel to the temperature-uniforming plate, the heat pipe is provided with a plurality of fins, and at least one part of the fins is arranged adjacent to the edge of the temperature-uniforming plate.

2. The heat dissipation module of claim 1, wherein the heat pipe has a heat sink section attached to the upper ledge.

3. The heat dissipating module of claim 2, wherein a heat exchanging plane is disposed at one side of the heat absorbing section and attached to the upper boss.

4. The heat dissipation module of claim 1, wherein the heat pipes are a plurality of heat pipes, each of the heat pipes has a heat absorption section attached to the upper boss, and the heat absorption sections are disposed side by side in contact with each other.

5. The thermal module of claim 2, wherein the heat sink section is in the shape of a flattened tube or a semi-circular tube.

6. The heat dissipating module of claim 1, wherein the fins are spaced apart and the edge of the temperature uniforming plate is spaced apart from the adjacent fins by a distance not greater than the spacing of the fins.

7. A heat dissipation structure of an electronic device, comprising: a circuit board, wherein a chip and a plurality of electronic components arranged around the chip are arranged on one surface of the circuit board; the heat dissipation module of any of claims 1-6, wherein the lower boss is attached to the chip, and the fins adjacent to the edge of the vapor chamber are over at least a portion of the electronic components.