CN210516704U

CN210516704U - Heat radiation module

Info

Publication number: CN210516704U
Application number: CN201920662302.3U
Authority: CN
Inventors: 洪银树; 廖津均; 古惟仁
Original assignee: Sunon Electronics Kunshan Co Ltd
Current assignee: Sunon Electronics Kunshan Co Ltd
Priority date: 2019-04-29
Filing date: 2019-05-09
Publication date: 2020-05-12
Anticipated expiration: 2029-05-09
Also published as: CN111863747A; TWI686130B; TW202041132A

Abstract

The utility model provides a heat dissipation module for the structure of buckling of solving current heat dissipation module is naked, leads to the not good problem of radiating efficiency, and it includes: at least one heat pipe having a bent portion between an evaporation portion and a condensation portion; at least one heat conducting plate connected to the bent part of the heat pipe; and a heat radiation fin group located at the condensation part of the heat pipe.

Description

Heat radiation module

Technical Field

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat through heat transfer of a heat pipe.

Background

The existing heat dissipation module is used for absorbing heat generated by the electronic element through a heat absorption end and guiding the absorbed heat into a heat dissipation fin set through a heat pipe so as to dissipate the heat, so that the heat dissipation module can dissipate the heat of the electronic element.

However, the heat pipe of the conventional heat dissipation module passes through the heat dissipation fin set to transfer heat, and when the heat pipe has a bent structure in order to meet the requirements of installation or design, the bent structure cannot pass through the heat dissipation fin set, and must be exposed, which results in poor heat dissipation efficiency of the heat dissipation module at the bent structure.

In view of the above, there is still a need for improvement of the conventional heat dissipation module.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, an object of the present invention is to provide a heat dissipation module, which can improve the heat dissipation efficiency of the heat pipe, so as to further increase the overall heat dissipation efficiency.

An object of the utility model is to provide a radiating module can increase the heat transfer scope of pipe.

The utility model discloses a heat dissipation module, include: at least one heat pipe having a bend between an evaporation section and a condensation section; at least one heat conducting plate connected to the bent part of the heat pipe; and a heat radiation fin group located at the condensation part of the heat pipe.

Therefore, the heat dissipation module of the present invention can absorb the heat of the bending portion of the heat pipe through the heat conducting plate, so that the bending portion is not exposed and can fully transfer heat, thereby increasing the heat transfer range of the heat pipe and enhancing the heat dissipation efficiency of the heat dissipation module. The utility model discloses a heat radiation module can enlarge heat radiation module's heat radiating area and promote its radiating efficiency certainly to reach the effect that promotes heat radiation module's radiating effect.

The heat conducting plate can be provided with a first surface and a second surface which are opposite, the first surface is concavely provided with a channel, and the peripheral surface of the bent part is connected with the wall surface of the channel in a heat conduction way. Therefore, the heat conducting plate has the function of ensuring that the heat of the working liquid in the bent part can be transferred to the heat conducting plate.

Wherein, the outer peripheral surface of the bending part can have an area of more than 25% and is positioned in the channel. Therefore, the heat conducting plate has the function of ensuring that the heat of the working liquid in the bent part can be transferred to the heat conducting plate.

The number of the heat conduction plates can be two, and the channels of the two heat conduction plates jointly wrap the peripheral surfaces of the bending parts. Therefore, the outer peripheral surface of the bent part can be completely covered by the two heat conduction plates, and the heat dissipation efficiency is further improved.

The channels of the two heat conducting plates can completely cover the peripheral surfaces of the bending parts, and the first surfaces of the two heat conducting plates are connected. Therefore, the outer peripheral surface of the bent part can be completely covered by the two heat conduction plates, and the heat dissipation efficiency is further improved.

The heat-radiating fin group can be connected with the second surface of the heat-conducting plate. Therefore, after the heat conducting plate absorbs the heat of the bent part of the heat pipe, the heat can be transmitted to the radiating fin group through the second surface to be radiated, and the radiating efficiency of the bent part is further improved.

Wherein, the second surface of the heat conducting plate can be provided with a plurality of convex ribs. Therefore, the radiating efficiency can be further improved on the premise of not increasing the overall longitudinal height of the radiating module.

Wherein, the bending part of the heat pipe to the tail end of the condensation part can be connected with the heat conducting plate. Therefore, the bending part of the heat pipe extends to the peripheral surface of the condensation part, heat can be transferred through the heat conducting plate, and the bending part and the condensation part of the heat pipe can be covered through the heat conducting plate, so that a more perfect heat dissipation effect is generated.

Wherein, a straight line section is arranged between the bending part and the evaporation part of the heat pipe, and the heat conducting plate can be connected with the bending part and the straight line section. Thus, the heat pipe has the function of increasing the heat transfer range of the heat pipe.

The cross section of the bending part of the heat pipe can be circular, or the ratio of the longitudinal height to the transverse width is ≧ 0.75. Therefore, the forming is convenient to simplify the manufacturing steps, the integrity of the capillary structure of the inner wall of the heat pipe can be maintained, and the effect of the working liquid on the convection circulation is avoided being influenced.

The cross section of the bending part of the heat pipe can be in the shape of a flat pipe, wherein the ratio of the longitudinal height to the transverse width is equal to or less than 0.5. Therefore, the area connected with the heat conducting plate can be increased, and the effect of improving the heat conducting efficiency is achieved.

The heat pipe may have a bent portion having two opposite planes, and the heat conducting plate has a first surface attached to one of the planes. Therefore, the area connected with the heat conducting plate can be increased, and the effect of improving the heat conducting efficiency is achieved.

Drawings

Fig. 1 is an exploded perspective view of a first embodiment of the present invention.

Fig. 2 is a combined top view of the first embodiment of the present invention.

Fig. 3 is a sectional view of the heat pipe partially covered by the heat conducting plate according to the first embodiment of the present invention.

Fig. 4 is a sectional view of a heat-conducting plate fully covering a heat pipe according to a first embodiment of the present invention.

Fig. 5 is a cross-sectional view of the heat-conducting plate of the first embodiment of the present invention attached to the outer peripheral surface of the heat pipe.

Fig. 6 is a top view of the heat-conducting plate covering the straight section according to the first embodiment of the present invention.

Fig. 7 is an exploded perspective view of a second embodiment of the present invention.

Fig. 8 is a cross-sectional view of a heat-dissipating fin set connecting plate according to a second embodiment of the present invention.

Fig. 9 is a cross-sectional view of a second embodiment of the present invention with a heat-dissipating fin set partially attached to a heat-conducting plate.

FIG. 10 is a second cross-sectional view of the heat sink fin assembly partially connected to a heat conductive plate.

Fig. 11 is a partially exploded perspective view of a third embodiment of the present invention.

Fig. 12 is a combination view of a third embodiment of the present invention.

Description of the reference numerals

1 Heat pipe

11 evaporation part

12 condensation part

13 bending part

131 plane

14 straight line segment

2 Heat-conducting plate

21 first surface

22 second surface

23 channel

24 ribs

3 radiating fin group

31 heat sink fin

32 to secure the aperture.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:

in the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used for assisting the explanation and understanding of the embodiments of the present invention, but not for limiting the present invention.

The elements and components described throughout the present invention are referred to by the term "a" or "an" merely for convenience and to provide a general meaning of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.

Please refer to fig. 1 and 2, which are first embodiments of a heat dissipation module of the present invention, including at least one heat pipe 1, at least one heat conduction plate 2 is connected between two ends of the heat pipe 1, and one of the two ends of the heat pipe 1 has a heat dissipation fin set 3, so that heat absorbed by the heat pipe 1 can be transferred to the heat conduction plate 2 and the heat dissipation fin set 3 for heat dissipation.

The heat pipe 1 may be made of a material with high thermal conductivity, such as copper or aluminum, and a working fluid may be filled in the heat pipe 1, where the working fluid may be water, alcohol, or other liquid with a low boiling point, so that the working fluid may absorb heat from a liquid state and evaporate into a gaseous state. The inner wall of the heat pipe 1 may have a capillary structure such as a wire mesh, a micro-groove, etc. to help the working fluid to flow back, which is known to those skilled in the art, and the present invention is not described herein. In detail, an end of the heat pipe 1 may have an evaporation portion 11, the evaporation portion 11 is used to absorb heat energy of a heat source, the heat source may be, for example, a cpu or an electronic component such as a chip that generates heat due to operation on a circuit board, so that the working fluid in the heat pipe 1 can absorb heat at the evaporation portion 11 and evaporate from a liquid state to a gaseous state, and an end of the heat pipe 1 away from the evaporation portion 11 may have a condensation portion 12, whereby the working fluid carries the heat energy to move to the condensation portion 12 with a relatively low temperature to release the heat energy and return to the liquid state, so as to flow back to the evaporation portion 11 to absorb the heat energy to form a convection cycle. In this embodiment, the number of the heat pipes 1 may be multiple, so that the heat transfer is performed on the electronic component through the multiple heat pipes 1 at the same time; at least one bending part 13 may be disposed between the evaporation part 11 and the condensation part 12 of each heat pipe 1, so that the plurality of heat pipes 1 can extend in different directions through the bending part 13 to meet design requirements, and each condensation part 12 has sufficient heat dissipation space to improve the heat dissipation efficiency of the electronic component.

Referring to fig. 3, 4 and 5, the cross section of the bending portion 13 of the heat pipe 1 may be any geometric shape, which is not limited herein. In this embodiment, the bending portion 13 may have a longitudinal height and a transverse width (in the direction of the drawing) passing through the center of the cross section, and the ratio of the longitudinal height to the transverse width is ≧ 0.75, so that the cross section of the bending portion 13 may be a slightly circular shape (as shown in fig. 3 and 4), and the cross section may be a perfectly circular shape for easy formation to simplify the manufacturing steps, and maintain the integrity of the capillary structure of the inner wall of the heat pipe, and avoid affecting the convection circulation of the working fluid; or the ratio of the longitudinal height to the transverse width is ≦ 0.5, so that the cross section of the bending portion 13 may be in a flat tube shape (as shown in fig. 5), and the bending portion 13 may have two opposite planes 131, that is, two planes 131 are disposed at two longitudinally opposite positions of the outer peripheral surface of the bending portion 13 in the drawing direction, and the two planes 131 may increase the area connected with the heat conducting plate 2, thereby increasing the heat conducting efficiency.

Referring to fig. 1, the heat conducting plate 2 can be connected to the bent portion 13 of the heat pipe 1 in a heat conducting manner, so as to dissipate heat from the bent portion 13. In detail, each heat conducting plate 2 may have a first surface 21 and a second surface 22 opposite to each other, the first surface 21 is used to attach to the outer peripheral surface of the bent portion 13 to directly absorb the heat of the working fluid in the bent portion 13 and dissipate the heat through the second surface 22. In this embodiment, the first surface 21 may have at least one groove 23 corresponding to the bending portion 13, and the groove 23 may be formed by recessing the first surface 21, such that the first surface 21 may be correspondingly connected to the outer peripheral surface of the bending portion 13 through the wall surface of the groove 23.

Referring to fig. 3 and 4, for example, when the cross section of the bending portion 13 is a circular shape, the cross section of the wall surface of the groove 23 may form an arc surface corresponding to the portion of the outer peripheral surface of the bending portion 13, when the heat conducting plate 2 is one, the outer peripheral surface of the bending portion 13 may have an area of more than 25% located in the groove 23, thereby ensuring that the heat of the working fluid in the bending portion 13 can be transferred to the heat conducting plate 2.

It should be noted that the number of the heat conducting plates 2 may be two, so that the two heat conducting plates 2 jointly clamp the bending portion 13 of the heat pipe 1; that is, the first surfaces 21 of the two heat conducting plates 2 may respectively have the grooves 23, the grooves 23 of the two heat conducting plates 2 can clamp the bending portion 13, so that the grooves 23 of the two heat conducting plates 2 partially cover the outer peripheral surface of the bending portion 13 together, thereby the outer peripheral surface of the bending portion 13 has an area of more than 50% located in the grooves 23 of the two heat conducting plates 2 opposite to each other (as shown in fig. 3), and preferably, the two grooves 23 can completely cover the outer peripheral surface of the bending portion 13 (as shown in fig. 4), so as to connect the first surfaces 21 of the two heat conducting plates 2, whereby the outer peripheral surface of the bending portion 13 can be completely covered by the two heat conducting plates 2, thereby further improving the heat dissipation efficiency. In addition, the first surface 21 of the heat conducting plate 2 and the bent portion 13 may be soldered by applying solder paste, so that the outer peripheral surface of the bent portion 13 and the first surface 21 of the heat conducting plate 2 do not need to be specially matched, or the first surface 21 may not have the channel 23, or the gap between the first surface 21 and the bent portion 13 may be filled by the high coating property and the shapeability of the solder paste, so as to increase the heat transfer area of the first surface 21 and the bent portion 13, thereby achieving a good heat transfer effect.

In addition, referring to fig. 6, a straight section 14 may be disposed between the bending portion 13 and the evaporation portion 11 of the heat pipe 1, and the heat conducting plate 2 may also extend from the bending portion 13 to the straight section 14, so as to increase the heat absorption range of the heat conducting plate 2 to the heat pipe 1, and the heat conducting plate 2 is preferably spaced from the evaporation portion 11 at a distance on the straight section 14, so as to prevent the heat conducting plate 2 from being too close to the evaporation portion 11 to affect the phase change of the working fluid in the heat pipe 1, thereby reducing the overall heat dissipation efficiency.

Referring to fig. 1 and 2, the heat-dissipating fin set 3 is located in the condensing portion 12 of the heat pipe 1, so that the working fluid in a gaseous state can dissipate heat in the condensing portion 12 to return to a liquid state; the arrangement of the heat dissipating fin group 3 is not limited, and the heat dissipating fin group can receive and dissipate the heat carried by the working liquid of the heat pipe 1, and can blow airflow by a heat dissipating fan to improve the dissipation of the heat. In this embodiment, the condensation portions 12 of the heat pipes 1 may extend in two opposite directions through the bending portions 13 to have the opposite heat dissipation fin sets 3. In detail, the heat dissipating fin set 3 may have a plurality of heat dissipating fins 31, the plurality of heat dissipating fins 31 may be stacked to have a gap therebetween or be spaced apart from each other, and the present invention is not limited thereto, and the plurality of heat dissipating fins 31 may be arranged in parallel, each heat dissipating fin 31 may have a fixing hole 32 for the condensing portion 12 of the heat pipe 1 to pass through, and in addition, the condensing portion 12 of the heat pipe 1 may also be fixed in the fixing hole 32 by solder paste welding.

Referring to fig. 7 to 10, a second embodiment of the heat dissipation module of the present invention is shown, the heat dissipating fin set 3 can be extended and connected to the second surface 22 of the heat conducting plate 2, so that after the heat conducting plate 2 absorbs the heat of the bending portion 13 of the heat pipe 1, the heat can be dissipated by transferring the heat to the heat dissipating fin set 3 through the second surface 22, which has the effect of further increasing the heat dissipating efficiency of the bent portion 13, when the number of the heat conducting plates 2 is two and clamped on the bent portion 13, the heat sink fin set 3 can be selectively connected to the second surfaces 22 of the two heat conductive plates 2 (as shown in fig. 8), thereby achieving the effect of further improving the heat dissipation efficiency, or only to the second surface 22 of one of the heat-conducting plates 2 (as shown in fig. 9), so as to reduce the overall longitudinal height of the heat-dissipating module, thereby achieving miniaturization. In addition, the second surface 22 of the heat-conducting plate 2 may be optionally not connected to the heat-dissipating fin set 3, but has a plurality of ribs 24, and the plurality of ribs 24 may increase the surface area of the second surface 22 to improve the heat-dissipating efficiency of the heat-conducting plate 2 (as shown in fig. 10). For example, these a plurality of fins 24 can be the straight rib or the wave rib that parallel arrangement each other to extend to another edge by an edge of this second surface 22, or these a plurality of fins 24 can be crisscross in order to interconnect, and these a plurality of fins 24 also can be for cutting off the form short rib of arranging according to the preface, again perhaps be nearly cylindric needle rib, the utility model discloses here is not limited, according to this, have and can be under the prerequisite that does not increase this heat dissipation module's whole longitudinal height, further promote the effect of radiating efficiency.

Please refer to fig. 11 and 12, which illustrate a third embodiment of the heat dissipation module of the present invention, the bending portion 13 of the heat pipe 1 is connected to the heat conducting plate 2 to the end of the condensation portion 12, that is, the heat conducting plate 2 extends from the bending portion 13 to the condensation portion 12, thereby, the outer peripheral surface of the bending portion 13 of the heat pipe 1 extends to the outer peripheral surface of the condensation portion 12, and the heat can be transferred through the heat conducting plate 2, at this time, the heat dissipation fin set 3 can be connected to the second surface 22 of the heat conducting plate 2 to dissipate heat, so as to generate a more complete heat dissipation effect, each heat dissipation fin 31 of the heat dissipation fin set 3 does not need to be provided with a fixing hole 32 for the condensation portion 12 to pass through, and has an effect of improving the manufacturing convenience.

To sum up, the utility model discloses a radiating module can absorb the heat of the kink of this heat pipe through this heat-conducting plate, makes this kink not be the exposed form and can fully carry out the heat transfer. In addition, the heat conducting plate can cover the bending part, the condensing part and the straight line section between the bending part and the evaporating part of the heat pipe, so that the heat transfer range of the heat pipe can be improved, and the heat dissipation efficiency of the heat dissipation module can be improved. In addition, can know through the experimental result, with current heat dissipation module to this electronic component heat dissipation back, measurable this electronic component's temperature is 74.2 ~ 77 ℃, and the utility model discloses a heat dissipation module absorbs the heat of the kink of this heat pipe through this heat-conducting plate in order to dispel, and the temperature of surveying this electronic component again is about 67.3 ℃, and the temperature of having compared in current heat dissipation module has fallen 6.9 ~ 9.7 ℃, consequently the utility model discloses a heat dissipation module can enlarge heat dissipation module's heat radiating area really and promote its radiating efficiency to reach the effect that promotes heat dissipation module's radiating effect.

Although the present invention has been disclosed with reference to the above preferred embodiments, it is not intended to limit the present invention, and various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

Claims

1. A heat dissipation module, comprising:

at least one heat pipe having a bent portion between an evaporation portion and a condensation portion;

at least one heat conducting plate connected to the bent part of the heat pipe; and

and the heat radiating fin group is positioned at the condensation part of the heat pipe.

2. The thermal module of claim 1, wherein the thermal plate has a first surface and a second surface opposite to each other, the first surface is recessed with a channel, and the outer periphery of the bent portion is thermally connected to the wall of the channel.

3. The heat dissipating module of claim 2, wherein the outer peripheral surface of the bent portion has an area of 25% or more in the channel.

4. The heat dissipation module of claim 2, wherein the number of the heat conductive plates is two, and the channels of the two heat conductive plates jointly wrap the outer peripheral surface of the bent portion.

5. The heat dissipation module of claim 4, wherein the channels of the two thermal conductive plates completely cover the outer peripheral surfaces of the bent portions, and the first surfaces of the two thermal conductive plates are connected.

6. The thermal module of claim 2, wherein the set of thermal fins is coupled to the second surface of the thermal plate.

7. The heatsink module of claim 2, wherein the second surface of the thermally conductive plate has a plurality of ribs.

8. The heat dissipation module of any one of claims 1 to 7, wherein the heat pipe is connected to the thermal conductive plate from the bent portion to the end of the condensation portion.

9. The heat dissipation module of any one of claims 1-7, wherein a straight section is disposed between the bent portion and the evaporation portion of the heat pipe, and the thermal conductive plate connects the bent portion and the straight section.

10. The heat dissipation module of any one of claims 1 to 7, wherein the bent portion of the heat pipe has a circular cross section or a ratio of a longitudinal height to a transverse width of ≧ 0.75.

11. The heat dissipation module of claim 1 or 2, wherein the cross-section of the bent portion of the heat pipe is in the shape of a flat tube having a ratio of longitudinal height to transverse width of ≦ 0.5.

12. The thermal module of claim 11, wherein the bent portion of the heat pipe has two opposing planes, and the thermal plate has a first surface abutting one of the planes.