CN217506480U - Radiator and 2U server - Google Patents

Abstract

The application provides a radiator and 2U server, the radiator includes: a soaking plate for contacting the CPU; a primary set of heat dissipating fins; one end of the main heat pipe group is connected with the soaking plate, and the other end of the main heat pipe group is connected with the main heat radiating fin group; a plurality of secondary cooling fin groups; one end of each auxiliary heat pipe group is connected with the soaking plate, and the other end of each auxiliary heat pipe group is connected with different auxiliary radiating fin groups; the main radiating fin group and the auxiliary radiating fin group respectively comprise a plurality of heat pipes, and each heat pipe is independent in heat conduction. The application provides a radiator heat conduction speed is fast, the samming is effectual, heat conduction efficiency is high for the radiating effect has obtained further improvement, can satisfy the heat dissipation demand of the server of high-power consumption, high heat flux density.

Description

Radiator and 2U server

Technical Field

The application relates to the technical field of electronic equipment, in particular to a radiator and a 2U server.

Background

With the rapid development of electronic technology, the integration level of various CPUs is higher and higher, the speed is higher and higher, the size is smaller and smaller, and the heat productivity is higher and higher, which puts forward higher requirements on the heat dissipation effect of the heat sink, so that providing a better heat dissipation effect for the CPUs becomes a problem to be solved by those skilled in the art.

Disclosure of Invention

In view of this, the present application provides a heat sink, which can further improve the heat dissipation effect on the CPU. The application also provides a 2U server with the radiator.

In order to achieve the above purpose, the present application provides the following technical solutions:

a heat sink for dissipating heat from a CPU, comprising:

a soaking plate for contacting the CPU;

a primary set of heat dissipating fins;

one end of the main heat pipe group is connected with the soaking plate, and the other end of the main heat pipe group is connected with the main heat radiating fin group;

a plurality of secondary cooling fin groups;

one end of each auxiliary heat pipe group is connected with the soaking plate, and the other end of each auxiliary heat pipe group is connected with different auxiliary radiating fin groups;

the main radiating fin group and the auxiliary radiating fin group respectively comprise a plurality of heat pipes, and each heat pipe is independent in heat conduction.

The radiator with the structure realizes rapid and uniform conduction of heat by arranging the soaking plate; the arrangement of the main radiating fin group and the auxiliary radiating fin group increases the radiating area; each heat pipe conducts heat independently, and the heat dissipation efficiency is improved.

Optionally, in the heat sink, the main heat dissipation fin group is connected to the soaking plate and located at the top of the soaking plate; the auxiliary radiating fin groups are positioned on the side parts of the soaking plate, and all the auxiliary radiating fin groups are positioned on the same side of the soaking plate.

The main radiating fin group is connected to the top of the soaking plate, so that the radiating effect is improved, and the structure is more compact; the plurality of auxiliary radiating fin groups are positioned on the same side part of the soaking plate, so that the structure of the radiator is optimized.

Optionally, in the heat sink, the main heat dissipation fin set includes:

the first side part is arranged on the soaking plate and close to the auxiliary radiating fin group;

the second side part is arranged on the soaking plate far away from the auxiliary radiating fin group, and an avoidance notch is formed in the second side part.

The avoidance notch is formed in the main radiating fin group, so that the radiator can meet the use requirement of a server for mounting the full-length PCIE card.

Optionally, in the above heat sink, the plurality of secondary heat dissipating fin groups include a first secondary fin group and a second secondary fin group having the same structure, and the first secondary fin group and the second secondary fin group are disposed at two ends of the same supporting plate.

The structure of the radiator can be more stable and the layout is more reasonable due to the arrangement of the plurality of auxiliary radiating fin groups.

Optionally, in the radiator, the main heat pipe group is connected to the first side portion;

the plurality of secondary heat pipe groups include: the first auxiliary heat pipe set is connected with the first auxiliary fin set and the soaking plate; the second auxiliary heat pipe group is the same as the first auxiliary heat pipe group in structure and is connected with the second auxiliary fin group and the soaking plate; the first auxiliary heat dissipation structure composed of the first auxiliary fin group and the first auxiliary heat pipe group and the second auxiliary heat dissipation structure composed of the second auxiliary fin group and the second auxiliary heat pipe group are arranged in a mirror image mode.

The arrangement can further optimize the structure of the radiator.

Optionally, in the heat sink, the main heat dissipation fin group is connected to the soaking plate and located at the top of the soaking plate; the heat pipe is fan-shaped distribution, and arbitrary two adjacent settings contained angle homogeneous phase between the heat pipe.

The heat pipes are distributed in a fan shape and at equal included angles, so that heat can be more uniformly conducted to the main radiating fin group, and the radiating efficiency is improved.

Optionally, in the above heat sink, each of the heat pipes includes:

the heat absorption section is connected with the soaking plate;

the heat dissipation section is connected with the main heat dissipation fin group or the auxiliary heat dissipation fin group;

the connecting section is used for connecting the heat absorption section and the heat dissipation section;

and the main radiating fin group is provided with an accommodating hole for accommodating the radiating section and an accommodating groove for accommodating the connecting section.

The connecting section and the radiating section are accommodated in the main radiating fin group, so that the main heat pipe group and the main radiating fin group have larger contact area, and the heat conduction is more efficient.

Optionally, in the above heat sink, the heat absorbing section is a flattened section with an oval cross-sectional shape, and all the heat absorbing sections of the heat pipes connected to the main heat dissipating fin group are disposed close to and parallel to the soaking plate.

The structure that so sets up and to make the radiator is compacter, and the volume is littleer to also can improve the radiating effect.

Optionally, in the above heat sink, the heat absorbing section is a flattened section with an oval cross-sectional shape, and all the heat absorbing sections of the heat pipes connected to the main heat dissipating fin group are disposed close to and parallel to the soaking plate.

Therefore, the volume of the radiator can be further reduced, and the radiating effect is further improved.

A2U server comprises a shell and a radiator arranged in the shell and used for radiating heat of a CPU, wherein the radiator is the radiator in any one of the above parts.

Through using the radiator that the volume is littleer, the structure is compacter in 2U server, when guaranteeing the radiating effect, can also reserve bigger installation space for the setting of other parts, make the part distribution of 2U server can be more leisurely, reasonable.

The utility model provides a radiator, the part that will contact with CPU sets up to the soaking plate, thereby can be quicker, even realization is to the thermal conduction of CPU, and simultaneously, it sets up to a plurality ofly to be used for radiating fin group, including main radiating fin group and a plurality of vice radiating fin group promptly, make the heat radiating area of radiator obtain the increase, it is more high-efficient to dispel the heat, and still follow the soaking plate with the heat through main heat pipe group and a plurality of vice heat pipe group and conduct main radiating fin group and a plurality of vice radiating fin group respectively, and main heat pipe group and a plurality of vice heat pipe group's every heat pipe all independently conduct heat, can make the radiator have more heat conduction paths in order to match with bigger heat radiating area, thereby can further improve the radiating effect of radiator. The radiator with the structure has the advantages of high heat conduction speed, good temperature equalizing effect and high heat conduction efficiency, so that the heat dissipation effect is further improved, and the heat dissipation requirement of a server with high heat flow density can be met.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a front view of a heat sink provided in an embodiment of the present application;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is an exploded view of a main heat dissipating fin set, a main heat pipe set, a vapor chamber and a CPU without an avoidance gap;

fig. 4 is a front view of the structure of fig. 3 after assembly.

In fig. 1-4:

1-soaking plate, 2-main radiating fin group, 3-main heat pipe group, 4-first auxiliary fin group, 5-second auxiliary fin group, 6-support plate, 7-first auxiliary heat pipe group, 8-second auxiliary heat pipe group, 9-containing hole, 10-containing groove and 11-CPU;

201-first side, 202-second side, 203-avoidance notch, 301-first heat pipe, 302-second heat pipe, 303-third heat pipe, 304-fourth heat pipe, 305-fifth heat pipe.

Detailed Description

The application provides a radiator, can further improve the radiating effect to CPU.

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1-4, the present application provides a heat sink for dissipating heat from a CPU 11 of an electronic device, the heat sink mainly includes a soaking plate 1, a main heat dissipating fin group 2, a main heat pipe group 3, a plurality of sub heat dissipating fin groups and a plurality of sub heat pipe groups, wherein the soaking plate 1 is used for contacting with the CPU 11 to absorb heat generated during the operation of the CPU 11, before the soaking plate 1 contacts with the CPU 11, a layer of heat conductive silicone grease may be coated on the surface of the CPU 11 to eliminate a gap between the CPU 11 and the soaking plate 1 and reduce the conduction resistance, after the bottom wall of the soaking plate 1 contacts with the CPU 11, the bottom wall is heated to vaporize a cooling liquid in a capillary structure disposed on the inner surface of the bottom wall, the vaporized gas is dispersed into the entire inner cavity of the soaking plate 1 and is liquefied when contacting with the capillary structure disposed on the inner surface of the top wall, thereby with the even transmission of heat to roof (meet the coolant liquid after the cold liquefaction can drip and return to the capillary structure of diapire), because be connected with main hot-tube bank 3 and vice hot-tube bank on the surface of roof, and main hot-tube bank 3 is connected with main radiating fin group 2, vice hot-tube bank is connected with vice radiating fin group, so the heat of conduction to the roof can rethread main hot-tube bank 3 and the conduction of vice hot-tube bank and reach main radiating fin group 2 and vice radiating fin group, finally blow to main radiating fin group 2 and vice radiating fin group through the fan, so that main radiating fin group 2 and vice radiating fin group carry out the heat exchange with the air and realize thermal giving off.

According to the radiator with the structure, the solid substrate in the existing radiator is replaced by the soaking plate 1, so that the heat conduction speed can be increased, uniform heat conduction can be realized, and the heat dissipation effect of the radiator is improved; the heat radiating fin group comprises a plurality of main heat radiating fin groups 2 and a plurality of auxiliary heat radiating fin groups, and compared with the existing heat radiator with only one heat radiating fin group, the heat radiating area can be increased, so that the heat radiating efficiency of the heat radiator is higher; realize soaking plate 1 and main heat dissipation fin group 2's heat conduction, a plurality of heat pipe groups realize soaking plate 1 and a plurality of heat conduction of vice fin group (vice heat pipe group and vice fin group one-to-one), and every heat pipe group all includes a plurality of heat pipes, every heat pipe is all independently heat-conducting, make the radiator have more, the heat conduction route of parallelly connected setting, for the less current radiator in heat dissipation route, can make the heat dissipation more high-efficient. In conclusion, the heat radiator provided by the application has the advantages of high heat conduction speed, good temperature equalization effect and high heat conduction efficiency, so that the heat radiation effect is further improved, and the heat radiation requirement of a server with high power consumption and high heat flow density can be met.

As shown in fig. 1-4, the present application makes the main heat-dissipating fin group 2 connected to the soaking plate 1 and located on the top of the soaking plate 1; the auxiliary radiating fin groups are positioned at the side part of the soaking plate 1, and all the auxiliary radiating fin groups are positioned at the same side of the soaking plate 1. Wherein, for the support suspension that makes the radiating fin group pass through the heat pipe group in current radiator sets up the mode of setting at 1 top of soaking plate, this application directly lies in the advantage at 1 top of soaking plate with main radiating fin group 2 connection: on one hand, the heat on the soaking plate 1 can be conducted to the main radiating fin group 2 through the main heat pipe group 3, and meanwhile, the heat can be directly conducted to the main radiating fin group 2 due to the connection of the soaking plate 1 and the main radiating fin group 2, so that the heat has more conducting paths and conducting modes, and the radiating effect of the radiator is improved; on the other hand, the soaking plate 1 is in contact with and connected with the main radiating fin group 2, so that the structure of the radiator is more compact, the size is smaller, and the occupied space is smaller, so that the radiator provided by the application can be applied to electronic equipment with smaller size, for example, a 2U server with strict requirement on the size. In addition, the auxiliary radiating fin groups are arranged on the side portion of the soaking plate 1, so that the increase of the height of the radiator can be reduced or even avoided, the installation requirement of the radiator in a narrow space is met, all the auxiliary radiating fin groups are located on the same side of the soaking plate 1, the auxiliary radiating fin groups are structural components for optimizing the radiator, larger space occupation is avoided, the radiator can be better matched with electronic equipment such as a 2U server, and larger space is reserved for the layout of other components of the electronic equipment.

In an alternative embodiment, as shown in fig. 1 and 2, the primary set of heat dissipating fins 2 comprises: a first side portion 201 which is arranged on the soaking plate 1 and close to the auxiliary radiating fin group; the second side 202 is arranged on the soaking plate 1 far away from the secondary radiating fin group, and the second side 202 is provided with an avoiding notch 203. In this structure, an avoidance notch 203 is provided on one side of the main heat dissipating fin group 2 away from the auxiliary heat dissipating fin group, and the avoidance notch 203 is located at the top of the main heat dissipating fin group 2 away from the soaking plate 1, that is, in the viewing angle of fig. 1, the avoidance notch 203 is located at the upper left corner of the whole main heat dissipating fin group 2. So set up, because when being applied to the server with the radiator, some server application scenes can install full length PCIE card (length exceeds 300mm), its occupation space is great, can interfere with main heat dissipation fin group 2, consequently for dodging full length PCIE card for the server has the function of installing full length PCIE card, has cut rectangular shape's main heat dissipation fin group 2, thereby forms in its upper left corner and dodges breach 203. Meanwhile, due to the arrangement of the plurality of auxiliary radiating fin groups, the overall radiating effect of the radiator cannot be reduced due to the fact that the main radiating fin group 2 is provided with the avoidance notch 203, namely the auxiliary radiating fin groups can make up for the reduction of the radiating capacity caused by cutting the main radiating fin group 2.

In addition to providing the escape notch 203, as shown in fig. 1, the main heat pipe group 3 is connected to the first side portion 201. Because the volume that remains behind second lateral part 202 formation dodge breach 203 through the cutting is less, is unfavorable for main hot-water line group 3's setting, so this application makes main hot-water line group 3 be connected with the great first lateral part 201 of volume to when guaranteeing to have good radiating effect, make the radiator change in the shaping more easily.

In addition, in order to improve the heat dissipation effect of the heat sink without installing a full-length PCIE card in the server, as shown in fig. 3 and 4, in another optional embodiment, the main heat dissipation fin group 2 is made to have a rectangular structure without an avoidance notch 203, and the cross-sectional area of the main heat dissipation fin group 2 is not smaller than the area of the soaking plate 1, so that the heat dissipation fin group and the soaking plate 1 are in omnibearing contact and connected.

Specifically, the main heat pipe group 3 and the sub heat pipe group are each composed of a plurality of heat pipes which are independently heat-conductive, and among these heat pipes, each heat pipe includes: the heat absorption section is connected with the soaking plate 1; the heat dissipation section is connected with the main heat dissipation fin group 2 or the auxiliary heat dissipation fin group; the connecting section is connected with the heat absorption section and the heat dissipation section. That is, different parts of the heat pipe are divided, wherein a pipe section of the heat pipe, which is used for connecting the soaking plate 1 and absorbing heat of the soaking plate 1, is called a heat absorption section, a pipe section of the heat pipe, which is used for connecting the main heat dissipation fin group 2 or the auxiliary heat dissipation fin group and conducting heat to the main heat dissipation fin group 2 or the auxiliary heat dissipation fin group, is called a heat dissipation section, and a pipe section of the heat pipe, which is used for connecting the heat absorption section and the heat dissipation section, is called a connection section.

In the present application, as shown in fig. 1 and fig. 2, the plurality of secondary heat dissipating fin groups include a first secondary fin group 4 and a second secondary fin group 5 having the same structure, and the first secondary fin group 4 and the second secondary fin group 5 are disposed at two ends of the same supporting plate 6. Based on the comprehensive consideration of the heat dissipation effect and the structural layout, the number of the preferred secondary heat dissipation fin groups is two, namely, the first secondary fin group 4 and the second secondary fin group 5. Meanwhile, in order to facilitate forming, distribution and installation, the two secondary fin groups are identical in structure and are arranged at two ends of the same supporting plate 6, so that convenience is brought to the use of the radiator.

Since the secondary heat dissipating fin group is a reinforcing structure of the primary heat dissipating fin group 2 and a compensating structure of a missing portion (i.e., a portion lost by forming the avoidance notch 203), in order to reduce the occupied space of the heat sink as much as possible, it is preferable that the volume of the secondary heat dissipating fin group is smaller than that of the primary heat dissipating fin group 2, and the heat dissipating capacity of the plurality of secondary heat dissipating fin groups is not smaller than that of the missing portion.

In addition to the above configuration, as shown in fig. 2, the plurality of sub heat pipe groups include: the first auxiliary heat pipe set 7 is connected with the first auxiliary fin set 4 and the soaking plate 1; the second auxiliary heat pipe group 8 is the same as the first auxiliary heat pipe group 7 in structure and is connected with the second auxiliary fin group 5 and the soaking plate 1; the first auxiliary heat dissipation structure composed of the first auxiliary fin group 4 and the first auxiliary heat pipe group 7 and the second auxiliary heat dissipation structure composed of the second auxiliary fin group 5 and the second auxiliary heat pipe group 8 are arranged in a mirror image mode. On the basis that the two auxiliary radiating fin groups have the same structure, in order to ensure the normal work of the auxiliary radiating fin groups, each auxiliary radiating fin group is required to be provided with an auxiliary heat pipe group, so that the two auxiliary heat pipe groups are also arranged, namely a first auxiliary heat pipe group 7 and a second auxiliary heat pipe group 8, the first auxiliary fin group 4 and the first auxiliary heat pipe group 7 form a first auxiliary radiating structure, the second auxiliary fin group 5 and the second auxiliary heat pipe group 8 form a second auxiliary radiating structure, meanwhile, in order to further optimize the structure, the structural layout of the radiator is more reasonable, and preferably, the first auxiliary radiating structure and the second auxiliary radiating structure are arranged in a mirror image mode.

Specifically, as shown in fig. 2, the first auxiliary heat pipe group 7 and the second auxiliary heat pipe group 8 which are arranged in a mirror image manner each include two heat pipes (the first auxiliary heat pipe group 7 and the second auxiliary heat pipe group 8 have the same structure), the heat absorption sections of the two heat pipes are welded to the soaking plate 1, the heat dissipation sections of the two heat pipes are inserted into the first auxiliary fin group 4 or the second auxiliary fin group 5 and welded to the first auxiliary fin group 4 or the second auxiliary fin group 5, and an included angle is formed between the heat absorption sections and the heat dissipation sections, on a projection plane parallel to the soaking plate 1, due to the included angle, the projection shapes of the two heat pipes are both L-like (i.e., the shapes are close to the L-shape), and in a direction perpendicular to the soaking plate 1, the heat dissipation section of the same heat pipe is higher than the heat absorption section, i.e., the connection section is a bending section (as shown in fig. 1). Meanwhile, on the same secondary fin group, the setting height of the heat dissipation section of one of the two heat pipes is greater than that of the heat dissipation section of the other heat pipe, and the two heat dissipation sections are aligned in the direction perpendicular to the soaking plate 1, as shown in fig. 1. So can make the structure of radiator more firm, it is more reasonable to arrange.

As shown in fig. 3 and 4, in the structure in which the avoidance notch 203 is not provided on the main heat radiation fin group 2, the main heat radiation fin group 2 is connected to the soaking plate 1 and is located at the top of the soaking plate 1; a plurality of heat pipes of the main heat pipe group 3 are distributed in a fan shape, and included angles between any two adjacent heat pipes are the same. Whether the main radiating fin group 2 is provided with the avoidance notch 203 or not, the main radiating fin group 2 and the soaking plate 1 are in direct contact and connection; in addition, a plurality of heat pipes constituting the main heat pipe group 3 are all in a U shape, in the U-shaped structure, one linear pipe section located at one side of the opening is a heat absorption section connected with the soaking plate 1, another linear pipe section located at the other side of the opening is a heat dissipation section connected with the main heat dissipation fin group 2, and a bent pipe section opposite to the opening is a connection section. When the plurality of U-shaped heat pipes are distributed, all the U-shaped heat pipes are distributed in a fan shape, and the included angles between any two adjacent heat pipes are the same, for example, when five U-shaped heat pipes are provided, the five U-shaped heat pipes are respectively called as a first heat pipe 301, a second heat pipe 302, a third heat pipe 303, a fourth heat pipe 304 and a fifth heat pipe 305, and the third heat pipe 303 is arranged perpendicular to the soaking plate 1 (the perpendicular means that the plane where the third heat pipe 303 is located is perpendicular to the soaking plate 1), the second heat pipe 302 and the fourth heat pipe 304 are respectively located at two sides of the third heat pipe 303, the first heat pipe 301 is located at one side of the second heat pipe 302 away from the third heat pipe 303, the fifth heat pipe 305 is located at one side of the fourth heat pipe 304 away from the third heat pipe 303, and the first heat pipe 301, the second heat pipe 302, the fourth heat pipe 304 and the fifth heat pipe 305 are all obliquely arranged relative to the soaking plate 1, and the second heat pipe 302 and the fourth heat pipe 304 are symmetrically arranged relative to the plane where the third heat pipe 303 is located, the first heat pipe 301 and the fifth heat pipe 305 are symmetrically arranged with respect to the plane where the third heat pipe 303 is located, the included angle between the first heat pipe 301 and the second heat pipe 302, the included angle between the second heat pipe 302 and the third heat pipe 303, the included angle between the third heat pipe 303 and the fourth heat pipe 304, and the included angle between the fourth heat pipe 304 and the fifth heat pipe 305 are all the same, and the included angle is, for example, 36 degrees, 30 degrees, 25 degrees, 20 degrees, or 15 degrees, and the like.

On the basis of above-mentioned structure, this application still makes the opening orientation of two adjacent U type heat pipes that set up opposite, so just so can make the linkage segment of different U type heat pipes be located the both sides of main heat dissipation fin group 2 respectively to make the overall arrangement of radiator more reasonable, the radiating effect is more outstanding.

Specifically, as shown in fig. 3, the main heat dissipating fin group 2 is provided with an accommodating hole 9 for accommodating the heat dissipating section and an accommodating groove 10 for accommodating the connecting section. That is to say, a plurality of accommodation holes 9 and a plurality of holding tank 10 have been seted up on main heat dissipation fin group 2, wherein, holding tank 10 is the strip groove of seting up on main heat dissipation fin group 2 surface, accommodation hole 9 then is located the one end of keeping away from soaking plate 1 of holding tank 10, and accommodation hole 9 runs through main heat dissipation fin group 2, when specifically assembling U type heat pipe and main heat dissipation fin group 2, make the one-to-one of radiating section of U type heat pipe insert in accommodation hole 9, along with the inserting of radiating section, the linkage segment can be close to holding tank 10, when the cooling tube runs through main heat dissipation fin group 2, the linkage segment enters into holding tank 10, later with the radiating section welding in accommodation hole 9, with the linkage segment welding in holding tank 10, just realized the equipment of main heat pipe group 3 and main heat dissipation fin group 2. Because the heat dissipation section is in contact with the inner peripheral wall of the accommodating hole 9, and the connection section is in contact with the bottom wall and/or the side wall of the accommodating groove 10, the U-shaped heat pipe can conduct heat to the main heat dissipation fin group 2 through the heat dissipation section and the connection section at the same time, and therefore the heat dissipation effect of the heat sink is further improved.

As shown in fig. 3, the heat absorbing section is a flattened section with an oval cross section, and the heat absorbing sections of all the heat pipes connected with the main heat dissipating fin group 2 are all arranged close to and parallel to each other on the soaking plate 1. In the structure, the heat absorption section is flattened into an oval shape and then connected with the soaking plate 1, so that the contact area between the heat absorption section and the soaking plate can be increased, namely the heat conduction area is increased, and the heat dissipation effect of the radiator is improved; and make the heat absorption section of whole U type heat pipes all be close to and parallel arrangement on vapor chamber 1, can optimize the structure for the heat absorption position of U type heat pipe corresponds with CPU 11's the position that sets up, thereby promotes the heat absorption effect, and can also make the heat absorption more high-efficient through the contact each other between the U type heat pipe.

Specifically, the thickness of preferred heat absorption section after flattening is not more than 2mm, just so can improve the degree of flattening of heat pipe for the height of the radiator after the equipment is littleer, and the structure is compacter, provides convenience for the use of the radiator that this application provided in the narrow and small electronic equipment of installation space such as 2U server.

Furthermore, a plurality of placing grooves for placing the heat absorbing sections one by one are formed in the top surface of the soaking plate 1, and the shapes of the placing grooves are matched with the shapes of the heat absorbing sections. The soaking plate 1 is provided with the placing groove for accommodating the heat absorbing section, on one hand, the shape of the placing groove is matched with that of the heat absorbing section, so that the contact area between the U-shaped heat pipe and the soaking plate 1 can be further increased, and the heat dissipation effect of the heat radiator is improved; on the other hand, the U-shaped heat pipe is embedded in the vapor chamber 1 by the aid of the arrangement groove, so that the height of the assembled radiator is further reduced, the structure is further compact, and the radiator is more convenient to use in electronic equipment with narrow installation space, such as a 2U server.

In addition, the embodiment of the application also provides a 2U server, which comprises a shell and a radiator arranged in the shell and used for radiating the CPU 11, wherein the radiator is the radiator.

From the above description, the heat sink has a smaller volume while having a better heat dissipation effect, and can reduce the occupied space. And the 2U server is for having the electronic equipment of strict demand to the volume, and its installation space is comparatively narrow and small, so install the volume littleer, the more compact above-mentioned radiator of structure in the 2U server, can reduce the occupation to 2U server installation space to can make the structure of 2U server obtain optimizing, the part can be more leisurely, rationally distributed, make the performance of making 2U server can obtain promoting.

In addition, other beneficial effects of the 2U server brought by the heat sink can be seen from the above, and are not described herein again.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

It should be understood that the terms "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used for clearly explaining the technical solutions, and are not used for limiting the protection scope of the present application.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

Claims (10)

1. A heat sink for dissipating heat from a CPU, comprising:

a soaking plate for contacting the CPU;

a primary set of heat dissipating fins;

one end of the main heat pipe group is connected with the soaking plate, and the other end of the main heat pipe group is connected with the main heat radiating fin group;

a plurality of secondary cooling fin groups;

one end of each auxiliary heat pipe group is connected with the soaking plate, and the other end of each auxiliary heat pipe group is connected with different auxiliary radiating fin groups;

the main radiating fin group and the auxiliary radiating fin group respectively comprise a plurality of heat pipes, and each heat pipe is independent in heat conduction.

2. The heat sink of claim 1, wherein the set of primary fins is attached to the heat spreader plate and is positioned on top of the heat spreader plate; the auxiliary radiating fin groups are positioned on the side portions of the soaking plate, and all the auxiliary radiating fin groups are positioned on the same side of the soaking plate.

3. The heat sink as claimed in claim 2, wherein the primary set of heat dissipating fins comprises:

the first side part is arranged on the soaking plate and close to the auxiliary radiating fin group;

the second side part is arranged on the soaking plate far away from the auxiliary radiating fin group, and an avoidance notch is formed in the second side part.

4. The heat sink as claimed in claim 3, wherein the plurality of secondary heat dissipating fin groups comprises a first secondary fin group and a second secondary fin group with the same structure, and the first secondary fin group and the second secondary fin group are disposed at two ends of the same supporting plate.

5. The heat sink of claim 4,

the main heat pipe group is connected with the first side part;

the plurality of secondary heat pipe groups include: the first auxiliary heat pipe set is connected with the first auxiliary fin set and the soaking plate; the second auxiliary heat pipe group is the same as the first auxiliary heat pipe group in structure and is connected with the second auxiliary fin group and the soaking plate; the first auxiliary heat dissipation structure composed of the first auxiliary fin group and the first auxiliary heat pipe group is arranged in a mirror image mode with the second auxiliary heat dissipation structure composed of the second auxiliary fin group and the second auxiliary heat pipe group.

6. The heat sink of claim 1, wherein the set of primary fins is attached to the heat spreader plate and is positioned on top of the heat spreader plate; the heat pipe is fan-shaped distribution, and arbitrary two adjacent settings contained angle homogeneous phase between the heat pipe.

7. The heat sink of claim 1, wherein each of the heat pipes comprises:

the heat absorption section is connected with the soaking plate;

the heat dissipation section is connected with the main heat dissipation fin group or the auxiliary heat dissipation fin group;

the connecting section is used for connecting the heat absorption section and the heat dissipation section;

and the main radiating fin group is provided with a containing hole for containing the radiating section and a containing groove for containing the connecting section.

8. The heat sink as claimed in claim 7, wherein the heat absorbing section is a flattened section with an oval cross-section, and the heat absorbing sections of all the heat pipes connected to the main heat dissipating fin group are disposed close to and parallel to each other on the heat spreader plate.

9. The heat sink as claimed in claim 8, wherein the top surface of the soaking plate is formed with a plurality of seating grooves for seating the heat absorbing sections one by one, and the shape of the seating grooves matches the shape of the heat absorbing sections.

10. A 2U server comprising a housing and a heat sink disposed within the housing for dissipating heat from a CPU, wherein the heat sink is the heat sink of any one of claims 1-9.

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