CN209803724U - Large core heat radiation module in MIMI-PC host - Google Patents

Abstract

The utility model discloses a large core radiating module in MIMI-PC host, which comprises a heat conducting pipe, radiating fins, a heat conducting plate and a fan; the heat conducting plate is a substrate, one surface of the heat conducting plate is provided with a fan mounting part and a pipe welding area, the pipe welding area is a groove body, a notch is formed in the plate body with the inner end outwards, and the notch extends towards the edge of the plate body to form a long groove hole; the fan is arranged on the fan mounting part; the heat conducting pipe is L-shaped, one side rod body of the heat conducting pipe is arranged in the notch, the end part of the side rod body is welded on a pipe welding area, and the other side rod body of the heat conducting pipe is arranged on the edge of the side edge of the heat conducting plate and enables the end part of the heat conducting pipe to be close to the convex hook part on the heat conducting plate; and the radiating fins are welded on the upper side of the heat conducting plate through solder paste and cover the transverse tube parts of the heat conducting tube. The utility model discloses ingenious heat pipe and radiating fin have been set up, make whole heat radiation structure's heat can the high efficiency discharge, and then can improve CPU's output.

Description

Large core heat radiation module in MIMI-PC host

Technical Field

The utility model relates to a heat dissipation technology, specific saying so relates to a big nuclear heat dissipation module in MIMI-PC host computer.

Background

One of the main reasons why the performance of MIMI PC hosts on the market cannot be compared with that of ordinary computer hosts is: due to the space piece, the designed heat dissipation module can not meet the heat dissipation requirement of the CPU with high power.

the traditional design is as follows:

1. The heat dissipation copper plate or aluminum plate contacts with the CPU to conduct the heat generated by the CPU to the copper plate or aluminum plate, and the surface of the copper plate or aluminum plate is utilized to dissipate the heat. The number of heat dissipation W achieved by the scheme can reach about 10W.

And 2, the FIN sheet and the copper sheet are added with a fan for heat dissipation, the FIN sheet is used for conducting heat, and the fan is used for blowing out the heat, so that the heat dissipation is accelerated to cool. The number of heat dissipation W achieved by the scheme can reach about 25W.

therefore, in order to meet the requirement of high-power CPU heat dissipation, a large-core heat dissipation module needs to be developed to solve the existing technical problem.

SUMMERY OF THE UTILITY MODEL

To the not enough among the prior art, the to-be-solved technical problem of the utility model lies in providing a big nuclear heat dissipation module in MIMI-PC host computer, the purpose of designing this heat dissipation module is in order to realize the powerful CPU heat dissipation demand.

In order to solve the technical problem, the utility model discloses a following scheme realizes: a big nuclear heat radiation module in MIMI-PC host computer, including heat conduction pipe, radiating fin, heat conduction plate and fan;

the heat conducting plate is a substrate, one surface of the heat conducting plate is provided with a fan mounting part and a pipe welding area, the pipe welding area is a groove body, a notch is formed in the plate body with the inner end outwards, and the notch extends towards the edge of the plate body to form a long groove hole;

the fan is arranged on the fan mounting part;

The heat conducting pipe is L-shaped, one side rod body of the heat conducting pipe is arranged in the notch, the end part of the side rod body is welded on a pipe welding area, and the other side rod body of the heat conducting pipe is arranged on the edge of the side edge of the heat conducting plate and enables the end part of the heat conducting pipe to be close to the convex hook part on the heat conducting plate;

And the radiating fins are welded on the upper side of the heat conducting plate through solder paste and cover the transverse tube parts of the heat conducting tube.

Furthermore, a CPU contact area is arranged on the mounting surface of the heat conducting plate and the CPU, and the contact area is opposite to the pipe welding area.

Further, the heat radiating fins are welded with the contact area of the heat conducting pipe.

further, the heat conducting plate comprises one of a copper plate and an aluminum alloy plate.

Further, the radiating fins are aluminum alloy radiating fins.

furthermore, the air outlet end of the fan faces the heat conducting plate and the heat conducting pipe.

compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses big nuclear heat dissipation module frame is on PCBA board, and the CPU contact zone and the CPU contact of heat-conducting plate, CPU's heat pass through the heat-conducting plate and conduct to on heat pipe and the radiating fin, through blowing of fan, blow away the heat. The utility model discloses ingenious heat pipe and radiating fin have been set up, make whole heat radiation structure's heat can the high efficiency discharge, and then can improve CPU's output.

Drawings

Fig. 1 is an exploded view of the large core heat dissipation module of the present invention.

Fig. 2 is an assembly view of the large core heat dissipation module of the present invention.

Fig. 3 is a schematic diagram of the meganuclear heat dissipation module of the present invention.

Fig. 4 is a left side view of fig. 2.

Fig. 5 is a bottom plan view of fig. 2.

Fig. 6 is a top plan view of fig. 2.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Embodiment 1, the utility model discloses a specific structure as follows:

Referring to fig. 1-6, the present invention relates to a big core heat dissipation module in a MIMI-PC host, which comprises a heat conduction pipe 1, a heat dissipation fin 2, a heat conduction plate 3 and a fan 4;

The heat conducting plate 3 is a substrate, one surface of which is provided with a fan mounting part and a pipe welding area 31, the pipe welding area 31 is a groove body, a notch 33 is arranged on the plate body with the inner end outwards, and the notch 33 extends towards the edge of the plate body to form a long groove hole;

The fan 4 is installed on the fan installation part;

the heat conducting pipe 1 is L-shaped, one side rod body of the heat conducting pipe is arranged in the notch 33, the end part of the side rod body is welded on the pipe welding area 31, and the other side rod body of the heat conducting pipe is arranged on the edge of the side edge of the heat conducting plate 3, and the end part of the heat conducting pipe is close to the convex hook part on the heat conducting plate 3;

And the heat radiating fins 2 are welded to the upper side of the heat conducting plate 3 through solder paste and cover the transverse tube parts of the heat conducting tube 1.

The preferable technical scheme of the implementation is as follows: the heat conductive plate 3 is provided with a CPU contact area 32 on the surface thereof to be mounted on the CPU, and the contact area 32 faces away from the tube pad 31.

The preferable technical scheme of the implementation is as follows: the heat radiating fins 2 are welded with the contact area of the heat conducting pipe 1.

The preferable technical scheme of the implementation is as follows: the heat conducting plate 3 comprises one of a copper plate and an aluminum alloy plate.

The preferable technical scheme of the implementation is as follows: the radiating fins 2 are aluminum alloy radiating fins.

the preferable technical scheme of the implementation is as follows: the air outlet end of the fan 4 faces the heat conducting plate 3 and the heat conducting pipe 1.

Example 2:

Heat-conducting plate 3 and the welding of heat pipe 1, radiating fin 2 and the welding of 1 horizontal part of heat pipe, heat-conducting plate 3 and radiating fin contact zone welding, the screw fixation of fan 4 forms on heat-conducting plate 3 the utility model discloses a heat dissipation module, this module is whole to be installed on the PCBA board, is provided with CPU on the PCBA board.

the CPU generates heat, the heat is firstly conducted to the heat conduction plate 3, the heat conduction plate 3 conducts the heat to the heat conduction pipe 1 and the radiating fin 2, and the heat on the heat conduction plate 3, the heat conduction pipe 1 and the radiating fin 2 is rapidly discharged through the blowing of the fan 4. The utility model discloses ingenious heat pipe and radiating fin have been set up, make whole heat radiation structure's heat can the high efficiency discharge, and then can improve CPU's output.

the above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims (6)

1. The utility model provides a big nuclear heat dissipation module in MIMI-PC host computer which characterized in that: comprises a heat conduction pipe (1), radiating fins (2), a heat conduction plate (3) and a fan (4);

The heat conducting plate (3) is a substrate, a fan mounting part and a pipe welding area (31) are arranged on one surface of the heat conducting plate, the pipe welding area (31) is a groove body, a notch (33) is formed in the outward plate body at the inner end of the groove body, and the notch (33) extends towards the edge of the plate body to form a long groove hole;

The fan (4) is installed on the fan installation part;

the heat conduction pipe (1) is L-shaped, one side rod body of the heat conduction pipe is arranged in the notch (33), the end part of the side rod body is welded on a pipe welding area (31), and the other side rod body of the heat conduction pipe is arranged on the edge of the side edge of the heat conduction plate (3) and the end part of the heat conduction pipe is close to the convex hook part on the heat conduction plate (3);

and the radiating fins (2) are welded on the upper side of the heat conducting plate (3) through solder paste and cover the transverse tube parts of the heat conducting tube (1).

2. The MIMI-PC host macrocore heat dissipation module of claim 1, wherein: the mounting surface of the heat conducting plate (3) and the CPU is provided with a CPU contact area (32), and the contact area (32) is back to the pipe welding area (31).

3. The MIMI-PC host macrocore heat dissipation module of claim 1, wherein: the heat radiating fins (2) are welded with the contact area of the heat conducting pipe (1).

4. The MIMI-PC host macrocore heat dissipation module of claim 1, wherein: the heat conducting plate (3) comprises one of a copper plate and an aluminum alloy plate.

5. The MIMI-PC host macrocore heat dissipation module of claim 1, wherein: the radiating fins (2) are aluminum alloy radiating fins.

6. The MIMI-PC host macrocore heat dissipation module of claim 1, wherein: the air outlet end of the fan (4) faces the heat conducting plate (3) and the heat conducting pipe (1).