CN214155153U - Three-dimensional radiator - Google Patents

Three-dimensional radiator Download PDF

Info

Publication number
CN214155153U
CN214155153U CN202021512438.5U CN202021512438U CN214155153U CN 214155153 U CN214155153 U CN 214155153U CN 202021512438 U CN202021512438 U CN 202021512438U CN 214155153 U CN214155153 U CN 214155153U
Authority
CN
China
Prior art keywords
plate
heat
radiator
temperature
dimensional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021512438.5U
Other languages
Chinese (zh)
Inventor
叶博森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Longhui Electronic Technology Co ltd
Original Assignee
Guangzhou Longhui Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Longhui Electronic Technology Co ltd filed Critical Guangzhou Longhui Electronic Technology Co ltd
Priority to CN202021512438.5U priority Critical patent/CN214155153U/en
Application granted granted Critical
Publication of CN214155153U publication Critical patent/CN214155153U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a three-dimensional radiator, which comprises a radiator and a temperature-equalizing plate, wherein the radiator is arranged on the temperature-equalizing plate and used for transferring the heat of the temperature-equalizing plate to the outside; the temperature-uniforming plate at least comprises a first plate body and a second plate body which are communicated, wherein the first plate body and the second plate body are located on different planes, the temperature-uniforming plate further comprises a third plate body, the third plate body and the second plate body are located on different planes, the third plate body is opposite to the first plate body, the radiator is arranged between the first plate body and the third plate body, or the third plate body and the first plate body are staggered, a radiator is arranged between the first plate body and the second plate body, and another radiator is arranged between the second plate body and the third plate body. Because the first plate body, the second plate body and the third plate body on the temperature equalizing plate are all located on different planes, the three-dimensional radiator can be simultaneously suitable for three heat sources located on different planes, a plurality of heat sources located on different planes can share one radiator, the application range is wider, and the cost is lower.

Description

Three-dimensional radiator
Technical Field
The utility model relates to a radiator technical field especially relates to a three-dimensional radiator.
Background
The conventional heat dissipation technology cannot meet the increasing power heat dissipation requirements, and at present, a relatively good heat dissipation technology is a vapor chamber heat sink, wherein the vapor chamber is a heat spreader, and an internal working fluid rapidly takes away heat by latent heat during flowing and evaporation of a capillary structure in a liquid state, so that heat concentration on a heat source can be avoided, and in addition, because the vapor chamber has the characteristics of no shape and size limitation, perforation design, stronger isothermal property and the like, the performance of the heat sink using the vapor chamber can be improved by 15% -30% compared with that of a heat sink using a heat pipe, so that the vapor chamber heat sink is widely applied to various heat dissipation fields, but the existing vapor chamber heat sink is only suitable for a single heat source and has a narrow application range, when the heat sink is applied to an environment having a plurality of heat sources distributed on different planes, one vapor chamber heat sink needs to be correspondingly configured for each heat source, the cost is high.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a three-dimensional radiator, it can be applicable to a plurality of heat sources that are located different planes simultaneously, and the range of application is wider.
The purpose of the utility model is realized by adopting the following technical scheme:
the three-dimensional radiator comprises a radiator and a temperature-equalizing plate, wherein the radiator is arranged on the temperature-equalizing plate and is used for transferring the heat of the temperature-equalizing plate to the outside; the temperature equalizing plate at least comprises a first plate body and a second plate body which are communicated, and the first plate body and the second plate body are located on different planes.
Furthermore, the temperature-uniforming plate further comprises a third plate body communicated with the second plate body, and the third plate body and the second plate body are located on different planes.
Further, the third plate body is opposite to the first plate body.
Further, the heat sink is located between the first board body and the third board body.
Furthermore, the heat radiator is a heat radiation fin module.
Furthermore, the heat dissipation fin module comprises a plurality of heat dissipation fins which are arranged in parallel and at intervals.
Furthermore, the extending direction of the through openings formed between the adjacent radiating fins is parallel to the second plate body.
Further, the heat dissipation fin module further comprises a top plate and a bottom plate, the top plate is arranged at the tops of the plurality of heat dissipation fins and connected with the third plate body, and the bottom plate is arranged at the bottoms of the plurality of heat dissipation fins and connected with the first plate body.
Further, the third plate body is staggered with the first plate body.
Furthermore, one of the radiators is disposed between the first board body and the second board body, and the other radiator is disposed between the second board body and the third board body.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the heat flow on the surface of the heat source can be rapidly transferred and diffused to a large-area condensation surface by utilizing the uniform temperature plate, so that the heat dissipation is promoted, the heat density on the surface of a component is reduced, the cooling of the heat source is realized, the heat flow on the condensation surface of the uniform temperature plate is rapidly transferred to the outside by utilizing the heat dissipation body, the cooling of the uniform temperature plate is realized, and the heat dissipation performance of the three-dimensional heat sink is greatly improved by utilizing a graded heat dissipation mode;
more importantly, because the first plate body and the second plate body on the temperature equalizing plate are positioned on different planes, the large-area outer surface of the first plate body and the large-area outer surface of the second plate body can be used as two heat source surfaces positioned on different planes, and heat conduction is realized by utilizing the contact of the heat source surfaces and the heat source, so that the three-dimensional radiator can be simultaneously suitable for at least two heat sources positioned on different planes, a plurality of heat sources positioned on different planes share one radiator, the application range is wider, and the cost is lower;
in addition, the three-dimensional radiator can also be suitable for a single heat source, is more flexible and convenient to use, and when being applied to the single heat source, one of the first plate body and the second plate body is in contact with the heat source, and the other one is not in contact with the heat source, so that the temperature is lower, the quick heat transfer is favorably realized, and the heat dissipation efficiency can be further improved.
Drawings
Fig. 1 is a schematic structural view of a three-dimensional heat sink of the present invention;
fig. 2 is an exploded view of the three-dimensional heat sink shown in fig. 1.
In the figure: 1. a temperature equalizing plate; 11. a first plate body; 12. a second plate body; 13. a third plate body; 2. a heat dissipation fin module; 21. heat dissipation fins; 22. a top plate; 23. a base plate.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.
Referring to fig. 1-2, a three-dimensional heat sink according to a preferred embodiment of the present invention is shown, and the three-dimensional heat sink includes a heat sink and a uniform temperature plate 1, the heat sink is disposed on the uniform temperature plate 1, and the heat sink is used for transferring heat of the uniform temperature plate 1 to the outside, so as to achieve rapid heat transfer and improve heat dissipation efficiency; the temperature equalizing plate 1 at least comprises a first plate body 11 and a second plate body 12 which are communicated with each other, and the first plate body 11 and the second plate body 12 are located on different planes, so that the three-dimensional heat radiator is provided with at least two heat source surfaces located on different planes.
The heat flow on the surface of the heat source can be rapidly transferred and diffused to a large-area condensation surface by utilizing the uniform temperature plate 1, so that the heat dissipation is promoted, the heat density on the surface of a component is reduced, the cooling of the heat source is realized, the heat flow on the condensation surface of the uniform temperature plate 1 is rapidly transferred to the outside by utilizing the radiator, the cooling of the uniform temperature plate 1 is realized, and the heat dissipation performance of the three-dimensional radiator is greatly improved by utilizing a graded heat dissipation mode; more importantly, because the first plate body 11 and the second plate body 12 on the uniform temperature plate 1 are located on different planes, the large-area outer surface of the first plate body 11 and the large-area outer surface of the second plate body 12 can be used as two heat source surfaces located on different planes, and heat conduction is realized by utilizing the contact of the heat source surfaces and the heat source, therefore, the three-dimensional radiator can be simultaneously suitable for at least two heat sources located on different planes, and a plurality of heat sources located on different planes share one radiator, so that the application range is wider, the cost is lower, meanwhile, the three-dimensional radiator can also be suitable for a single heat source, the use is more flexible and convenient, when the three-dimensional radiator is applied to a single heat source, one of the first plate body 11 and the second plate body 12 is in contact with the heat source, the other one is lower in temperature due to no contact with the heat source, the quick heat transfer is favorably realized, and the heat radiation efficiency can be further improved.
As a preferred embodiment, the vapor chamber 1 further includes a third plate 13 communicated with the second plate 12, and the third plate 13 and the second plate 12 are located on different planes, so that the three-dimensional heat sink can be applied to three heat sources located on different planes, and the application range is wider.
In a preferred embodiment, the third plate 13 is opposite to the first plate 11, so as to reduce the volume of the three-dimensional heat sink and save the installation space, and meanwhile, the three-dimensional heat sink with the structure can realize rapid heat transfer by only configuring one heat dissipation body.
As a preferred embodiment, the heat sink is located between the first board 11 and the third board 13 to reduce the volume of the three-dimensional heat sink, which is beneficial to miniaturization design, and meanwhile, the heat of the first board 11, the second board 12 and the third board 13 can be transferred to the heat sink at the same time, so that the heat dissipation is more efficient.
In this embodiment, the heat sink is the heat dissipation fin module 2, so that the three-dimensional heat sink can achieve efficient heat dissipation without configuring a heat dissipation fan, and meanwhile, noise-free heat dissipation can be achieved due to the absence of the heat dissipation fan.
More specifically, the heat sink module 2 includes a plurality of parallel heat sinks 21 arranged at intervals, and the adjacent heat sinks 21 are arranged at intervals to effectively avoid heat accumulation, thereby further improving heat dissipation efficiency.
As a preferred embodiment, the extending direction of the through hole formed between the adjacent heat dissipation fins 21 is parallel to the second plate 12, so that both ends of the through hole between the adjacent heat dissipation fins 21 are communicated with the outside without being obstructed, thereby further improving the heat dissipation effect. Of course, the extending direction of the through holes formed between the adjacent heat dissipation fins 21 may be perpendicular to the second plate 12, and the end of the through hole close to the second plate 12 is spaced from the second plate 12, which may also improve the heat dissipation effect.
As a preferred embodiment, the radiator fin module 2 further includes a top plate 22 and a bottom plate 23, the top plate 22 is disposed on the top of the plurality of radiator fins 21 and connected to the third plate 13, and the bottom plate 23 is disposed on the bottom of the plurality of radiator fins 21 and connected to the first plate 11, so as to increase the contact area between the radiator fin module 2 and the first plate 11 and the third plate 13, and improve the heat dissipation effect.
Of course, in other embodiments, the third plate 13 and the first plate 11 may be arranged in a staggered manner, that is, the first plate 11 and the third plate 13 are respectively located at two sides of the second plate 12, and the first plate 11 and the third plate 13 are located at different heights.
On the basis of the structure that the third board body 13 and the first board body 11 are arranged in a staggered manner, a radiator is arranged between the first board body 11 and the second board body 12, and another radiator is arranged between the second board body 12 and the third board body 13.
Of course, in other embodiments, the heat sink may specifically be a heat dissipation fan.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims (5)

1. The three-dimensional radiator is characterized by comprising a radiator and a temperature-equalizing plate, wherein the radiator is arranged on the temperature-equalizing plate and is used for transferring the heat of the temperature-equalizing plate to the outside;
the temperature equalizing plate at least comprises a first plate body and a second plate body which are communicated, and the first plate body and the second plate body are positioned on different planes;
the temperature equalizing plate further comprises a third plate body communicated with the second plate body, the third plate body and the second plate body are located on different planes, the third plate body is opposite to the first plate body, and the heat radiator is located between the first plate body and the third plate body;
or, the third plate body and the first plate body are staggered, one radiator is arranged between the first plate body and the second plate body, and the other radiator is arranged between the second plate body and the third plate body.
2. The stereoscopic heat sink of claim 1, wherein the heat sink is a heat fin module.
3. The three-dimensional heat sink as claimed in claim 2, wherein the heat sink module comprises a plurality of parallel and spaced heat sinks.
4. The heat sink as claimed in claim 3, wherein the through openings formed between adjacent fins extend in a direction parallel to the second plate.
5. The stereoscopic heat sink of claim 2, wherein the heat dissipating fin module further comprises a top plate and a bottom plate, the top plate is disposed on top of the plurality of heat dissipating fins and connected to the third plate, and the bottom plate is disposed on bottom of the plurality of heat dissipating fins and connected to the first plate.
CN202021512438.5U 2020-07-27 2020-07-27 Three-dimensional radiator Active CN214155153U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021512438.5U CN214155153U (en) 2020-07-27 2020-07-27 Three-dimensional radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021512438.5U CN214155153U (en) 2020-07-27 2020-07-27 Three-dimensional radiator

Publications (1)

Publication Number Publication Date
CN214155153U true CN214155153U (en) 2021-09-07

Family

ID=77521562

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021512438.5U Active CN214155153U (en) 2020-07-27 2020-07-27 Three-dimensional radiator

Country Status (1)

Country Link
CN (1) CN214155153U (en)

Similar Documents

Publication Publication Date Title
JP4391366B2 (en) Heat sink with heat pipe and method of manufacturing the same
CN100456461C (en) Heat sink of heat pipe
US20100126700A1 (en) Heat-radiating base plate and heat sink using the same
TW201240587A (en) Vapor chamber
KR20110084343A (en) Socket apparatus for semiconductor module
US20130168055A1 (en) Thermal module
CN214155153U (en) Three-dimensional radiator
JP2006196786A (en) Heat sink with heat pipe
CN110198611B (en) Heat sink device
CN101005751A (en) Heat sink
US10578368B2 (en) Two-phase fluid heat transfer structure
TWI450680B (en) Heat dissipation device and heat dissipation method thereof
CN208487601U (en) A kind of radiator for high-power LED light source
CN216389334U (en) Phase change substrate and power module
CN209914359U (en) Extension plate type heat pipe
CN215725361U (en) High heat conduction type radiator
CN208093545U (en) Large power heat pipe radiator
CN210516704U (en) Heat radiation module
CN211457851U (en) Power electronic power unit
CN211669608U (en) Heat dissipation machine case and 5G basic station
CN211456983U (en) Power electronic power unit
CN210671157U (en) Radiator and communication equipment
CN215379642U (en) Heat radiator
CN211716667U (en) Heating body with good heat dissipation performance
CN210112504U (en) Phase change heat dissipation equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant