TWI795198B - Rapid heat dissipation device - Google Patents

Abstract

A rapid heat dissipation device having a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device is provided to use for a heat source. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged in one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and the other end of the heat pipe is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and the other end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlaps up and down with the heat pipe and has a same direction to achieve uniform heat dissipation and cooling.

Description

Rapid cooling device

The present invention relates to a cooling device, and in particular to a fast cooling device.

The traditional heat dissipation device mainly uses a heat conduction plate attached to the heat source, and then arranges a radiator such as a plurality of fins on the heat conduction plate, and transfers heat to the fins or radiator through the heat conduction plate , so as to provide the heat dissipation required by the heat source.

However, as the demand for heat dissipation continues to increase, under the existing structure of the heat sink, in addition to providing heat dissipation through the addition of other external forces such as fans or water cooling, each part of the heat sink itself also has refrigerant or work through such as heat pipes or vapor chambers. Fluid and other substances to improve its heat dissipation or cooling effect.

However, the above-mentioned structure still has the following problems. During the heat transfer process, it is inevitable that heat will be concentrated on the heat source or accumulated in a part of the heat sink, causing the heat sink to receive uneven heat and dissipate heat, so that the heat dissipation or cooling effect cannot be fully exerted.

In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's development.

The present invention provides a rapid heat dissipation device, which uses a siphon heat dissipation structure to overlap with the heated flow field of a heat pipe up and down in the same direction, so that the rapid heat dissipation device has the advantages of uniform heat dissipation and cooling.

In an embodiment of the present invention, the present invention provides a rapid heat dissipation device for a heat source. The rapid heat dissipation device includes: a heat conduction plate thermally bonded to the heat source; a heat dissipation fin group disposed on the heat conduction plate at least one heat pipe, one end of which is fixed to the heat conduction plate and the other end is fixed to the heat dissipation fin group; and a siphon heat dissipation structure, stacked above the at least one heat pipe and one end of which is fixed to the heat conduction plate And the other end is fixedly connected to the cooling fin group.

Based on the above, the siphon heat dissipation structure is stacked above the heat pipe, and one end of the heat pipe and the siphon heat dissipation structure is fixed to the heat conducting plate and the other end is fixed to the heat dissipation fin group, so that the heat flow field between the siphon heat dissipation structure and the heat pipe , overlapping and in the same direction, so as to avoid heat concentration in the heat source or heat accumulation in the heat dissipation device during the heat transfer process, so as to achieve the advantages of uniform heat dissipation and cooling of the rapid heat dissipation device.

10: Rapid cooling device

1: heat conduction plate

11: One-shaped slot

2: cooling fin group

21: Substrate

211: top surface

212: Bottom

213: L-shaped slot

22: First fin

3: heat pipe

31: L-shaped bending section

4: Siphon cooling structure

41: Evaporator

42: Condenser

421: extension tube

422: cooling plate

423: second fin

43: Delivery pipe

5: C-type buckle

6: Corner

61: Groove

s: spacing

100: heat source

Fig. 1 is a three-dimensional exploded view of the rapid heat dissipation device of the present invention.

Fig. 2 is another three-dimensional exploded view of the rapid heat dissipation device of the present invention.

Fig. 3 is another three-dimensional exploded view of the rapid heat dissipation device of the present invention.

Fig. 4 is another three-dimensional exploded view of the rapid heat dissipation device of the present invention.

Fig. 5 is a three-dimensional assembly diagram of the rapid heat dissipation device of the present invention.

Fig. 6 is another three-dimensional assembled view of the rapid heat dissipation device of the present invention.

Fig. 7 is a combined sectional view of the rapid heat dissipation device of the present invention.

The detailed description and technical content of the present invention will be described as follows with accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present invention.

Please refer to Figures 1 to 7, the present invention provides a rapid cooling device for a heat source 100, the rapid cooling device 10 mainly includes a heat conducting plate 1, a cooling fin group 2, one or a plurality of heat pipes 3 and A siphon heat dissipation structure 4 .

As shown in FIG. 1 , FIG. 3 to FIG. 7 , the heat conduction plate 1 is made of heat conduction material. The heat conduction plate 1 is thermally bonded to the heat source 100 . The heat conduction plate 1 is provided with an inline groove 11 .

In addition, the heat conduction plate 1 of this embodiment is thermally attached to the top of the heat source 100, and the inline slot 11 is opened from the bottom of the heat conduction plate 1, but it is not limited thereto, and the heat source 100 can also be embedded in the heat conduction plate 1, the inline slot 11 can also be opened from the top of the heat conduction plate 1 or run through the heat conduction plate 1.

As shown in Fig. 1, Fig. 3 to Fig. 7, the cooling fin group 2 is arranged on one side of the heat conducting plate 1, and the cooling fin group 2 includes a substrate 21 and is connected to the substrate 21 by means of extrusion, shoveling or welding. The plurality of first fins 22, the substrate 21 and the first fins 22 are made of thermally conductive metal materials such as aluminum or copper.

Furthermore, the substrate 21 has a top surface 211 and a bottom surface 212. The top surface 211 of the substrate 21 in this embodiment is provided with a plurality of L-shaped slots 213 opened from the middle to both sides, and the plurality of first fins 22 are connected to the substrate. The bottom surface 212 of 21, but not limited thereto.

As shown in FIG. 1 , FIG. 3 to FIG. 7 , one end of a heat pipe 3 is fixed to the heat conducting plate 1 and the other end is fixed to the cooling fin set 2 . Wherein, the number of heat pipes 3 in this embodiment is plural, one end of the plurality of heat pipes 3 is parallel to each other and embedded in the inline groove 11 and the other end is extended with a plurality of L-shaped bending sections embedded in each L-shaped groove 213 31 , so that the heat is transferred from the middle of the substrate 21 to both sides of the substrate 21 through the plurality of L-shaped bent sections 31 .

As shown in FIGS. 2 to 7 , the siphon heat dissipation structure 4 is stacked above the heat pipe 3 and one end is fixed to the heat conducting plate 1 and the other end is fixed to the heat dissipation fin set 2 .

The details are as follows, the siphon heat dissipation structure 4 includes an evaporator 41, a condenser 42, a delivery pipe 43 and a working fluid, the evaporator 41 is stacked and fixed above the heat conducting plate 1, the condenser 42 is stacked and fixed Connected to the top of the cooling fin set 2 , the delivery pipe 43 is stacked on the top of the heat pipe 3 and both ends communicate with the evaporator 41 and the condenser 42 .

Wherein, the evaporator 41 of this embodiment is a hollow shell made of a heat-conducting material, and the conveying pipe 43 is a hollow pipe made of a heat-conducting material, and the working fluid is filled in the evaporator 41, the condenser 42 and the conveying pipe. 43 inside, and the evaporator 41 can be fixed on the top of the heat conducting plate 1 by locking or welding.

In addition, the condenser 42 includes an extension pipe 421 extending from the delivery pipe 43 away from the end of the evaporator 41, a heat dissipation plate 422 fixed on the extension pipe 421, and a plurality of second fins 423 connected to the heat dissipation plate 422. The two fins 423 are sandwiched between the heat dissipation plate 422 and the heat dissipation fin set 2 and arranged on both sides of the extension pipe 421 , and there is a distance s between the delivery pipe 43 and the heat pipe 3 .

Moreover, the plurality of second fins 423 of this embodiment are connected to the heat sink 422 by means of extruding, shoveling or welding, and are sandwiched between the heat sink 422 and the top surface 211 of the substrate 21. The extension tube 421 is connected to the heat sink. The plates 422 are combined with each other by welding, but not limited thereto.

As shown in FIGS. 3 to 6 , the rapid heat dissipation device 10 of the present invention further includes a plurality of C-shaped buckles 5 , which are socketed and buckled on the outside of the base plate 21 and the cooling plate 422 .

In addition, the substrate 21 and the heat dissipation plate 422 of this embodiment have a plurality of corners 6 and a plurality of grooves 61 are recessed from the plurality of corners 6, and the two ends of each C-shaped buckle 5 are embedded in the upper and lower opposite two concave The slot 61 is used to make the base plate 21 and the heat dissipation plate 422 stacked up and down firmly.

As shown in Figures 3 to 7, the use state of the rapid heat dissipation device 10 of the present invention is to use the siphon heat dissipation structure 4 to be stacked above the heat pipe 3, and one end of the heat pipe 3 and the siphon heat dissipation structure 4 are all fixed to the heat conducting plate 1 and the other end are fixedly connected to the cooling fin set 2. In this way, through the connection between the siphon heat dissipation structure 4 and the heat pipe 3 The heated flow field overlaps upwards and downwards in the same direction, thereby preventing heat from being concentrated on the heat source or accumulating in the heat dissipation device during the heat transfer process, so as to achieve the advantages of uniform heat dissipation and cooling of the rapid heat dissipation device 10 .

In addition, a plurality of C-shaped buckles 5 are socketed and buckled on the outside of the base plate 21 and the heat dissipation plate 422, so that the heat dissipation fin set 2 and the condenser 42 are stacked up and down firmly, so as to improve the fast heat dissipation device 10. Structural strength.

To sum up, the rapid heat dissipation device of the present invention has never been seen in similar products and public use, and has industrial applicability, novelty and progress, and fully meets the requirements of patent application. Please file an application in accordance with the Patent Law. Please check carefully And granted the patent of this case to protect the inventor's rights.

10: Rapid cooling device

1: heat conduction plate

11: One-shaped slot

2: cooling fin group

21: Substrate

22: First fin

3: heat pipe

4: Siphon cooling structure

41: Evaporator

42: Condenser

421: extension tube

422: cooling plate

423: second fin

43: Delivery pipe

5: C-type buckle

61: Groove

Claims (9)

A rapid heat dissipation device for a heat source, the rapid heat dissipation device comprising: A heat conducting plate, thermally attached to the heat source; a cooling fin group, arranged on one side of the heat conducting plate; At least one heat pipe, one end is fixed to the heat conducting plate and the other end is fixed to the heat dissipation fin set; and A siphon heat dissipation structure is stacked above the at least one heat pipe and one end is fixed to the heat conduction plate and the other end is fixed to the heat dissipation fin group. The rapid heat dissipation device as described in claim 1, wherein the siphon heat dissipation structure includes an evaporator, a condenser, a delivery pipe and a working fluid, the evaporator is stacked and fixed above the heat conducting plate, and the condensing The heat sink is stacked and fixed above the cooling fin group, the delivery pipe is stacked above the at least one heat pipe and its two ends are connected to the evaporator and the condenser, and the working fluid is filled in the evaporator and the condenser with the delivery tube inside. The rapid heat dissipation device as described in claim 2, wherein the condenser includes an extension pipe extending from the end of the delivery pipe away from the evaporator, a heat dissipation plate fixed above the extension pipe, and a plurality of heat dissipation plates connected to the heat dissipation plate The second fins, the plurality of second fins are interposed between the heat dissipation plate and the heat dissipation fin group and arranged on both sides of the extension tube. The rapid heat dissipating device as described in claim 3, which further includes a plurality of C-shaped buttons, the cooling fin set includes a substrate and a plurality of first fins connected to the substrate, and the plurality of C-shaped buttons are socketed and snapped on The substrate and the exterior of the heat sink. The rapid heat dissipation device as described in claim 4, wherein the substrate and the heat dissipation plate have a plurality of corners and a plurality of grooves are formed from the plurality of corners, and the two ends of each C-shaped buckle are embedded in each upper and lower Opposite the two grooves. The rapid heat dissipation device as described in claim 4, wherein the substrate has a top surface and a bottom surface, the plurality of first fins are connected to the bottom surface, and the plurality of second fins are connected to the heat dissipation plate and sandwiched between the heat dissipation plate between the board and the top surface. The rapid heat dissipation device as described in claim 6, wherein the number of heat pipes is plural, the heat conduction plate is provided with an inline slot, and the base plate is provided with a plurality of L-shaped slots opened from the middle to both sides, the plurality of heat pipes One end is juxtaposed with each other and embedded in the inline slot, and the other end is extended with a plurality of L-shaped bending sections embedded in each of the L-shaped slots. The rapid heat dissipation device according to claim 7, wherein the plurality of L-shaped slots are opened from the top surface of the substrate, and the inline slots are opened from the bottom of the heat conducting plate. The rapid heat dissipation device as claimed in claim 4, wherein there is a distance between the conveying pipe and the at least one heat pipe.

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