TW201813028A - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a heat conduction block and a fin. The heat conduction block has a first thermal contacting part, a second thermal contacting surface and a third thermal contacting surface. The second thermal contacting surface and the third thermal contacting surface connect with the first thermal contacting part and are arranged oppositely. A first angle made by the second thermal contacting surface and the first thermal contacting part and a second angle made by the third thermal contacting surface and the first thermal contacting part are blunt angles when the first thermal contacting part is a planar structure. While the first thermal contacting part is a linear structure, a certain angle is formed between the second and the third thermal contacting surfaces. The fin has a groove, a bottom part, a first lateral surface and a second lateral surface. The first lateral surface and the second lateral surface connect with the bottom surface and are arranged oppositely. The heat conduction block is through the groove and the bottom part, the first lateral surface and the second lateral surface contact first thermal contacting part, the second thermal contacting surface and the third thermal contacting surface respectively.

Description

Heat sink

The invention relates to a heat dissipation device, in particular to a heat dissipation device with a groove in a fin.

As technology in the electronics field continues to evolve, the efficiency of the electronic components produced continues to increase. However, in general, the efficiency of electronic components increases, and the heat generated by them will increase accordingly. This heat is continuously accumulated on the electronic component, which causes the temperature of the electronic component itself to rise. If the heat cannot be removed from the electronic components effectively and the temperature of the electronic components drops, the electronic components will crash or even be burned. Therefore, the problem that the electronics industry generally faces now is how to effectively remove heat while improving efficiency.

Generally, the industry uses liquid-cooled heat sinks and air-cooled heat sinks to remove heat generated by electronic components. The heat dissipation principle of the liquid-cooled heat dissipation device refers to the use of a compressor or a pump to drive the cooling fluid in the cooling tube to perform heat exchange with the electronic components to remove the heat of the electronic components. The heat dissipation principle of air-cooled heat dissipation device refers to the use of a fan to guide cold air to flow through the heat dissipation fins that are in thermal contact with the electronic components to dissipate the heat dissipation fins. Compared with liquid-cooled heat sinks, air-cooled heat sinks have cost advantages because they do not require compressors, pumps, and cooling fluids. Therefore, the industry generally uses air-cooled heat sinks to remove heat from electronic components.

The air-cooled heat dissipation device usually has a plurality of metal fins extending from a metal base plate to increase the heat dissipation surface area. The heat from the heat source is first transmitted to the metal fins through the metal base plate, and then is dissipated into the air through the metal fins and taken away. Since all the heat of the electronic components is conducted from the metal base plate to the metal fins, the heat dissipation effect of the metal fins is limited to the heat transfer effect of the metal base plate.

The invention aims to provide a heat dissipation device, thereby solving the problem that the heat dissipation effect of the metal fins in the prior art is limited to the heat transfer effect of the metal base plate.

The heat dissipation device disclosed in one embodiment of the present invention includes a heat conducting block and a plurality of first fins. The thermal block has a first thermal contact portion, a second thermal contact portion and a third thermal contact portion opposite to each other. The second thermal contact portion and the third thermal contact portion are respectively connected to the first thermal contact portion and are oppositely disposed, and the second thermal contact portion and the third thermal contact portion are respectively sandwiched with a first thermal contact portion. The included angle and a second included angle are both obtuse. Each of these first fins has a groove, a groove bottom forming the groove, a first groove side surface and a second groove side surface. The side surface of the first groove and the side surface of the second groove are respectively connected to the bottom of the groove and are oppositely disposed. The heat conducting block passes through each groove, and the bottoms of the grooves, the sides of the first grooves, and the sides of the second grooves are in thermal contact with the first thermal contact portion, the second thermal contact portion, and the third thermal contact portion, respectively.

According to the heat dissipating device of the above embodiment, the first fin is penetrated through the thermally conductive block, so that the heat emitted by the heat source is transmitted to both sides of the first fin through the thermally conductive substrate, and is transmitted to the first through the thermally conductive block. The fin is farther away from one side of the thermally conductive substrate. Therefore, the heat emitted by the heat source can be quickly transferred to each corner of the first fin, so as to improve the heat dissipation speed of the heat dissipation device.

In addition, through the guidance of the inclined second thermal contact portion and the third thermal contact portion, it flows more quickly to both sides of the first fin. In this way, the heat dissipation airflow can flow in smoothly from the upper edge of the airflow channel, and flow out from the left and right sides of the airflow channel. In other words, the heat radiation airflow is less susceptible to the airflow rebounded by the thermally conductive substrate, thereby reducing the smoothness of the heat radiation airflow. In this way, the heat dissipation speed of the heat sink can be further improved.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

See Figures 1 to 4. FIG. 1 is a schematic perspective view of a heat dissipation device according to a first embodiment of the present invention. FIG. 2 is an exploded view of the heat sink of FIG. 1 with a fan removed. FIG. 3 is a schematic side view of FIG. 2. FIG. 4 is a schematic cross-sectional view of FIG. 2.

As shown in FIG. 1 and FIG. 2, the heat dissipation device 10 of this embodiment includes a thermally conductive substrate 100, a thermally conductive block 200, multiple first fins 300, multiple second fins 400, multiple heat pipes 500, and multiple Fan 600.

As shown in FIGS. 2 and 4, the material of the thermally conductive substrate 100 is, for example, a metal having a high thermal conductivity, such as gold, silver, copper, or aluminum. The material of the thermally conductive block 200 is, for example, a metal having a high thermal conductivity, such as gold, silver, copper, or aluminum. The thermal conductive block 200 has a first thermal contact portion 210 and a second thermal contact portion 220 and a third thermal contact portion 230 opposite to each other. In this embodiment, the first thermal contact portion 210 is a planar structure, the second thermal contact portion 220 and the third thermal contact portion 230 are respectively connected to opposite sides of the first thermal contact portion 210, and the second thermal contact portion The first and second included angles θ1 and θ2 between 220 and the third thermal contact portion 230 and the first thermal contact portion 210 are obtuse angles, respectively, so that the second thermal contact portion 220 and the third thermal contact portion 230 and the first The thermal contact portion 210 and the thermally conductive substrate 100 form a trapezoidal cross-section. In this embodiment, the angles of the two included angles θ1 and θ2 are equal, but are not limited thereto. In other embodiments, the angles of the two included angles θ1 and θ2 may be different.

In this embodiment, the first included angle is between 115 and 145 degrees, and the second included angle is between 115 and 145 degrees.

In this embodiment, the first thermal contact portion 210, the second thermal contact portion 220, and the third thermal contact portion 230 are all planar structures, and the heat is guided through the inclined second contact surface 220 and the third thermal contact portion 230. Airflow F (see Figure 5) flows to both sides.

As shown in FIGS. 2 to 4, the fin group formed by the first fins 300 has a bottom surface 305, a groove 310, a groove bottom 311, a first groove side 312 and a second groove side 313. The groove 310 is recessed from the bottom surface 305 toward the groove bottom 311. In this embodiment, the groove bottom portion 311 is a planar structure, and the first groove side surface 312 and the second groove side surface 313 are respectively inclined with respect to the groove bottom portion 311. The first groove side surface 312 and the second groove side surface 313 are respectively connected to opposite sides of the groove bottom portion 311, and the groove bottom portion 311, the first groove side surface 312 and the second groove side surface 313 surround the groove 310. In addition, the heat conduction block 200 passes through each groove 310, and the shape of the groove 310 matches the shape of the heat conduction block 200. The bottom surface 305 is in thermal contact with the heat conduction substrate 100, and the groove bottoms 311, the first groove sides 312, and The second groove side surface 313 is in thermal contact with the first thermal contact portion 210, the second thermal contact portion 220, and the third thermal contact portion 230, respectively.

In this embodiment, the ratio of the depth D of the groove 310 of the first fin 300 to the height H of the first fin 300 may be, for example, about 90%. And, the ratio of the width W2 of the first thermal contact portion 311 of the first fin 300 to the width W1 of the first fin 300 may be, for example, about 35%.

As shown in FIG. 2 and FIG. 3, the second fins 400 are arranged next to the first fins 300 in parallel, and cover the grooves 310 and the grooves of the first fins 300 closest to the second fins 400.的 热 块 200。 The thermal block 200. In other words, unlike the first fins 300, the second fins 400 do not have a groove 310 for the thermally conductive block 200 to pass through.

In addition, the adjacent first fins 300 maintain a distance, and the adjacent second fins 400 also maintain a distance to form a plurality of airflows between the adjacent first fins 300 and between the adjacent second fins 400. Road 350.

As shown in FIGS. 2 to 4, each of these heat pipes 500 has a heat absorbing section 510, a heat radiating section 520, and a connecting section 530 connecting the heat absorbing section 510 and the heat radiating section 520. The heat-absorbing section 510 is closer to the heat-conducting substrate 100 than the heat-emitting section 520. In some embodiments, the heat-absorbing section 510 is in contact with the heat-conducting substrate 100 or a direct-heating pipe technology, that is, the heat-absorbing section 510 has a plane and the plane directly contacts the heat-conducting substrate 100. . In this embodiment, the heat conducting block 200, the first fin 300, and the second fin 400 are all provided with through holes. The length of the heat absorbing section 510 is shorter than the heat radiating section 520. The heat absorbing section 510 of some heat pipes 500 passes through the heat conducting block 200. Holes are inserted in the heat conduction block 200, and a portion of the heat dissipation section 520 of the heat pipe 500 is inserted in the first fin 300 through the through hole of the first fin 300 and is inserted in the second fin 400 through the through hole of the second fin 400 The heat-absorbing section 510 and the heat-releasing section 520 of the partial heat pipe 500 are both inserted in the heat-conducting block 200.

As shown in FIGS. 1 and 5, the two fans 600 are located on one side of the first fins 300 away from the thermally conductive substrate 100. In this embodiment, the projections of the two fans 600 on the two of the first fins 300 do not overlap with the same airflow channel 350 to prevent the airflow generated by the two fans 600 from interfering with each other in the same airflow channel 350.

It is worth noting that the thermally conductive substrate 100, the second fin 400, the heat pipe 500, and the fan 600 in the above embodiments are not intended to limit the present invention. In other embodiments, the heat dissipation device may only include the thermally conductive block 200 and the first The fin 300 and the thermal block 200 directly contact the heat source.

In another embodiment, the first thermal contact portion 210 is a linear structure, and accordingly, the groove bottom portion 311 is also a linear structure. That is, the first thermal contact portion 210 of the thermally conductive block 200 is actually one edge, so that the second thermal contact portion 220, the third thermal contact portion 230, and the thermally conductive substrate 100 form a triangle-like structure in cross section. At this time, there is no first angle. , The second angle, but the second thermal contact portion 220 and the third thermal contact portion 230 directly form an angle, such as an obtuse angle; correspondingly, the groove bottom 311 of the fin group formed by the first fin 300 is actually It is a side, so that the groove 310 has a triangular shape, and is matched with the shape of the heat conducting block 200 so that the heat conducting block 200 can be accommodated in the groove 310 exactly.

See Figure 5. FIG. 5 is a schematic diagram of using the heat dissipation device of FIG. 1 as a heat source.

As shown in FIG. 5, the thermally conductive substrate 100 of the heat sink 10 is in thermal contact with the heat source 22 on the circuit board 20. The heat source 22 is, for example, a chip such as a central processing unit, a south bridge, or a north bridge.

Because the heat emitted by the heat source 22 is transmitted to both sides of the first fin 300 through the thermally conductive substrate 100 laterally, it is also transmitted to the first fin 300 farther away from the thermally conductive substrate 100 through the thermally conductive block 200. Therefore, the heat emitted by the heat source 22 can be quickly transferred to each corner of the first fin 300 to improve the heat dissipation speed of the heat dissipation device 10.

In addition, when the fan 600 is running, the heat radiation airflow F formed by the fan 600 not only flows straight toward the thermally conductive substrate 100, but also is guided by the inclined second thermal contact portion 220 and the third thermal contact portion 230 to be faster. The ground flows to both sides of the first fin 300. In this way, the heat dissipation airflow F can flow in smoothly from the upper edge of the airflow channel 350 and flow out from the left and right sides of the airflow channel 350. That is, the heat radiation airflow F is less susceptible to the airflow rebounded by the thermally conductive substrate 100 and reduces the smoothness of the heat radiation airflow F. In this way, the heat dissipation speed of the heat sink 10 can be further improved.

According to the heat dissipating device of the above embodiment, the first fin is passed through the thermally conductive block, so that the heat emitted by the heat source is transmitted to the two sides of the first fin through the thermally conductive substrate, and is also transmitted to the first through the thermally conductive block. The fin is farther away from one side of the thermally conductive substrate. Therefore, the heat emitted by the heat source can be quickly transferred to each corner of the first fin, so as to improve the heat dissipation speed of the heat dissipation device.

In addition, through the guidance of the inclined second thermal contact portion and the third thermal contact portion, it flows more quickly to both sides of the first fin. In this way, the heat dissipation airflow can flow in smoothly from the upper edge of the airflow channel, and flow out from the left and right sides of the airflow channel. In other words, the heat radiation airflow is less susceptible to the airflow rebounded by the thermally conductive substrate, thereby reducing the smoothness of the heat radiation airflow. In this way, the heat dissipation speed of the heat sink can be further improved.

The heat dissipation method includes two stages of heat transfer and heat dissipation. The heat pipe is a good heat exchanger. In the present invention, a combination of a large cross-sectional area of metal (such as the aforementioned heat-conducting block) and a heat pipe is used to connect the heat source and the fins to increase the cross-sectional area of the heat transfer path. Improved fin heat dissipation efficiency. And because the temperature near the heat source is quite several, here is the bottleneck of traditional heat dissipation. The heat transfer bottleneck is solved by the combination of the thermal block and the heat pipe in this case. In addition, in terms of heat dissipation, the higher temperature heat pipes and heat conducting blocks are distributed in the high-speed flow area far from the fan axis. The flow velocity is high, and the lower the air temperature, that is, the larger the temperature difference between the air and the fins, which can improve heat dissipation. s efficiency.

As before, the two inclined thermal contact surfaces of the thermally conductive block in the present invention help to guide the wind on both sides and prevent turbulence. Secondly, the two inclined surfaces of the thermally conductive block having a higher temperature (ie, the thermal contact surface) are disposed. On both sides of the center of the fan with the highest wind speed, it helps to dissipate heat. Again, the heat transfer path related to the heat pipe can be increased by the heat conduction block, thereby enhancing the heat transfer efficiency.

Although the present invention is disclosed in the foregoing preferred embodiments as above, it is not intended to limit the present invention. Any person skilled in similar arts can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of patent protection of an invention shall be determined by the scope of patent application attached to this specification.

10‧‧‧Cooling device

20‧‧‧Circuit Board

22‧‧‧ heat source

100‧‧‧ thermal conductive substrate

200‧‧‧ Thermal block

210‧‧‧The first thermal contact

220‧‧‧Second Thermal Contact Section

230‧‧‧The third thermal contact

300‧‧‧ first fin

305‧‧‧ underside

310‧‧‧Groove

311‧‧‧ bottom of tank

312‧‧‧ side of the first slot

313‧‧‧Side of the second slot

350‧‧‧airway

400‧‧‧ second fin

500‧‧‧heat pipe

510‧‧‧Endothermic section

511‧‧‧ underside

520‧‧‧Exothermic section

530‧‧‧connection section

600‧‧‧fan

θ1, θ2‧‧‧angle

D‧‧‧ Depth

H‧‧‧ height

W1, W2‧‧‧Width

F‧‧‧cooling airflow

FIG. 1 is a schematic perspective view of a heat dissipation device according to a first embodiment of the present invention. FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 after a fan is removed. FIG. 3 is a schematic side view of FIG. 2. FIG. 4 is a schematic cross-sectional view of FIG. 2. FIG. 5 is a schematic diagram of using the heat dissipation device of FIG. 1 as a heat source.

Claims (10)

A heat dissipation device includes: a thermally conductive block having a first thermal contact portion and a second thermal contact portion and a third thermal contact portion opposite to each other; the second thermal contact portion and the third thermal contact portion are respectively connected to the The first thermal contact portion is oppositely disposed. When the first thermal contact portion is a planar structure, the second thermal contact portion and the third thermal contact portion are respectively sandwiched with a first thermal sandwiched portion of the first thermal contact portion. An included angle and a second included angle are formed as obtuse angles. When the first thermal contact portion is a linear structure, a certain angle is set between the second thermal contact portion and the third thermal contact portion; and a plurality of first fins The sheets each have a bottom surface, a groove, a groove bottom, a first groove side, and a second groove side, and the first groove side and the second groove side are connected to the bottom of the groove, respectively. It is arranged oppositely, the heat conduction block passes through each of the grooves, and the bottoms of the grooves, the sides of the first grooves, and the sides of the second grooves are in thermal contact with the first thermal contact portion and the second thermal contact portion, respectively. And the third thermal contact portion, the first fins are separated to be adjacent to the first fins A plurality of air channels are formed in between. The heat dissipation device described in item 1 of the scope of patent application, further includes at least one heat pipe, the heat pipe has a heat absorption section, a heat release section, and a connection section connecting the heat absorption section and the heat release section, and the heat conduction block is provided with at least one channel. Holes, the first fins are respectively provided with at least one through hole, the heat radiation section of the heat pipe is inserted into the through holes of the first fins, and the heat absorption section of the heat pipe is inserted into the through hole of the heat conduction block. The heat dissipation device according to item 2 of the scope of patent application, wherein the heat absorption section has a plane, and the plane is flush with the bottom surface. The heat dissipation device described in item 2 of the scope of patent application, further includes a plurality of second fins, which are arranged next to the first fins and spaced apart from the first fins by a certain distance to form the airflow channel, and Two adjacent second fins are separated to form a plurality of the airflow channels. According to the heat dissipating device described in item 4 of the scope of patent application, the second fins are respectively provided with at least one through hole, and the heat releasing section of the heat pipe is inserted into the through holes of the first fins and the first fins. The through holes of the two fins. The heat dissipation device described in item 4 of the scope of patent application, further comprises at least one fan, which is located on one side of the first fins away from the heat conducting block and / or on the second fins, and when When there are at least two fans, the projections of the at least two fans on the first fins and / or the second fins do not overlap with the same airflow channel. The heat dissipation device described in item 1 of the patent application scope further includes a heat conductive substrate, the grooves are recessed from the bottom surfaces toward the bottom of the groove, and the bottom surface is in thermal contact with the heat conductive substrate. The heat dissipation device according to item 1 of the scope of patent application, wherein the first included angle is between 115 and 145 degrees, and the second included angle is between 115 and 145 degrees. The heat dissipation device according to item 1 of the scope of patent application, wherein the ratio of the depth of the groove to the height of the first fin is between 75% and 95%. The heat dissipation device according to item 1 of the scope of patent application, wherein the first thermal contact portion, the second thermal contact portion, and the third thermal contact portion are all planar structures; or the first thermal contact portion is a strip structure. Both the second thermal contact portion and the third thermal contact portion are planar structures.