TWI603443B - Heat dissipation device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device with fins and grooves.

As the technology in the electronics field continues to evolve, the performance of the electronic components produced continues to increase. However, in general, the performance of electronic components is increased, and the amount of heat generated by them will increase accordingly. This heat is constantly accumulated on the electronic components, causing the temperature of the electronic components themselves to rise. If the heat cannot be effectively removed from the electronic components and the temperature of the electronic components is lowered, the electronic components will be destroyed or even burned. Therefore, the problem that the electronics industry now generally faces is how to effectively eliminate heat while improving efficiency.

In general, the industry uses liquid-cooled heat sinks and air-cooled heat sinks to eliminate the heat generated by electronic components. The heat dissipation principle of the liquid-cooled heat sink means that the cooling fluid in the cooling pipe is driven by the compressor or the pump to exchange heat with the electronic components to eliminate the heat of the electronic components. The heat dissipation principle of the air-cooled heat sink refers to the use of a fan to guide the cold air through the heat-dissipating fins that are in thermal contact with the electronic components to dissipate the heat-dissipating fins. Compared with liquid-cooled heat sinks, air-cooled heat sinks are cost-effective without the need for compressors, pumps, and cooling fluids. Therefore, air-cooled heat sinks are commonly used in the industry to remove heat from electronic components.

Air-cooled heat sinks typically have a plurality of metal fins extending over a metal base plate to increase the heat dissipation surface area. The heat of the heat source is first conducted through the metal base plate to the metal fins, and then the heat is dissipated into the air through the metal fins. Since all the heat of the electronic component is conducted from the metal substrate to the metal fin, the heat dissipation effect of the metal fin is limited to the heat transfer effect of the metal substrate.

The present invention provides a heat dissipating device for solving the problem that the heat dissipation effect of the metal fin in the prior art is limited to the heat transfer effect of the metal base plate.

The heat dissipation device disclosed in one embodiment of the present invention includes a heat conducting block and a plurality of first fins. The heat conducting block has a first thermal contact portion and an opposite second thermal contact portion and a third thermal contact portion. The second thermal contact portion and the third thermal contact portion are respectively connected to the first thermal contact portion and disposed opposite to each other, and the first thermal contact portion and the third thermal contact portion are respectively disposed first with the first thermal contact portion The angle between the angle and the second angle is an obtuse angle. Each of the first fins has a groove and a groove bottom forming a groove, a first groove side and a second groove side. The first groove side surface and the second groove side surface are respectively connected to the bottom of the groove and are oppositely disposed. The heat conducting block passes through the grooves, and the bottoms of the grooves, the first groove side surfaces and the second groove side surfaces are in thermal contact with the first thermal contact portion, the second thermal contact portion and the third thermal contact portion, respectively.

According to the heat dissipating device of the above embodiment, the heat radiating block passes through the first fin, so that the heat generated by the heat source is transmitted to the first side of the first fin through the heat conducting substrate, and is directly transmitted to the first through the heat conducting block. The fins are farther away from one side of the thermally conductive substrate. Therefore, the heat generated by the heat source can be transmitted to the corners of the first fin faster to improve the heat dissipation speed of the heat sink.

In addition, the second heat contact portion and the third heat contact portion are guided to flow toward the sides of the first fin more quickly. In this way, the heat-dissipating airflow can smoothly flow from the upper edge of the airflow path and flow out from the left and right sides of the airflow path. That is to say, the heat dissipation airflow is less susceptible to the airflow rebounded by the thermally conductive substrate, thereby reducing the flow smoothness of the heat dissipation airflow. In this way, the heat dissipation speed of the heat sink can be further improved.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

Please refer to Figure 1 to Figure 4. 1 is a perspective view of a heat sink according to a first embodiment of the present invention. 2 is an exploded perspective view of the heat sink removing fan of FIG. 1. Figure 3 is a side elevational view of Figure 2. Figure 4 is a schematic cross-sectional view of Figure 2.

As shown in FIG. 1 and FIG. 2 , the heat dissipation device 10 of the present embodiment includes a heat conductive substrate 100 , a heat conducting block 200 , a plurality of first fins 300 , a plurality of second fins 400 , a plurality of heat pipes 500 , and a plurality of Fan 600.

As shown in FIG. 2 and FIG. 4, the material of the heat conductive substrate 100 is, for example, a metal having a high thermal conductivity such as gold, silver, copper or aluminum. The material of the heat transfer block 200 is, for example, a metal having a high thermal conductivity such as gold, silver, copper or aluminum. The heat conducting block 200 has a first thermal contact portion 210 and an opposite second thermal contact portion 220 and a third thermal contact portion 230. In this embodiment, the first thermal contact portion 210 is a planar structure, and the second thermal contact portion 220 and the third thermal contact portion 230 are respectively connected to opposite sides of the first thermal contact portion 210, and the second thermal contact portion is The first angle θ1 and the second angle θ2 of the second thermal contact portion 230 and the first thermal contact portion 210 are respectively obtuse angles, so that the second thermal contact portion 220 and the third thermal contact portion 230 are first. The thermal contact portion 210 and the thermally conductive substrate 100 form a structure having a trapezoidal cross section. In the present embodiment, the angles of the two angles θ1 and θ2 are equal, but not limited thereto. In other embodiments, the angles of the two angles θ1 and θ2 may also be different.

In this embodiment, the first included angle is between 115 and 145 degrees and the second included angle is between 115 and 145 degrees.

In this embodiment, the first thermal contact portion 210, the second thermal contact portion 220, and the third thermal contact portion 230 are all planar structures to guide the heat dissipation through the inclined second contact surface 220 and the third thermal contact portion 230. Airflow F (see Figure 5) flows to both sides.

As shown in FIG. 2 to FIG. 4 , the fin sets formed by the first fins 300 have a bottom surface 305 , a groove 310 , a groove bottom 311 , a first groove side 312 , and a second groove side 313 . The groove 310 is recessed from the bottom surface 305 toward the groove bottom 311. In this embodiment, the bottom portion 311 of the groove is a one-sided structure, and the first groove side surface 312 and the second groove side surface 313 are inclined with respect to the groove bottom portion 311, respectively. The first groove side surface 312 and the second groove side surface 313 are respectively connected to opposite sides of the groove bottom portion 311, and the groove bottom portion 311, the first groove side surface 312 and the second groove side surface 313 surround the groove 310. In addition, the heat conducting block 200 passes through the grooves 310, and the shape of the groove 310 matches the shape of the heat conducting block 200, wherein the bottom surface 305 is in thermal contact with the heat conducting substrate 100, and the groove bottom 311, the first groove side surfaces 312, and the like The second groove side surface 313 is in thermal contact with the first thermal contact portion 210, the second thermal contact portion 220, and the third thermal contact portion 230, respectively.

In the present embodiment, the ratio of the depth D of the groove 310 of the first fin 300 to the height H of the first fin 300 may be, for example, about 90%. And, the ratio of the width W2 of the first thermal contact portion 311 of the first fin 300 to the width W1 of the first fin 300 may be, for example, about 35%.

As shown in FIG. 2 and FIG. 3 , the second fins 400 are disposed side by side of the first fins 300 and cover the recesses 310 of the first fins 300 closest to the second fins 400 and are located in the grooves. Thermal block 200. In other words, these second fins 400 do not have grooves 310 for the heat conducting blocks 200 to pass through like the first fins 300.

In addition, the adjacent first fins 300 are spaced apart, and the adjacent second fins 400 are also spaced apart to form a plurality of airflows between adjacent first fins 300 and adjacent second fins 400. Road 350.

As shown in FIG. 2 to FIG. 4, each of the heat pipes 500 has a heat absorption section 510, a heat release section 520, and a connection section 530 connecting the heat absorption section 510 and the heat release section 520. The heat absorbing section 510 is closer to the heat conductive substrate 100 than the heat releasing section 520. In some embodiments, the heat absorbing section 510 is in contact with the heat conductive substrate 100, or the heat collecting tube direct touch technology, that is, the heat absorbing section 510 has a plane and the plane directly contacts the heat conductive substrate 100. . In this embodiment, the heat conducting block 200, the first fin 300, and the second fin 400 are each provided with a through hole. The length of the heat absorbing section 510 is smaller than the heat releasing section 520, and the heat absorbing section 510 of the part of the heat pipe 500 passes through the heat conducting block 200. The heat dissipation block 520 is inserted into the heat dissipation block 200 , and the heat dissipation portion 520 of the heat pipe 500 is inserted into the first fin 300 through the through hole of the first fin 300 and inserted into the second fin 400 through the through hole of the second fin 400 . The heat absorbing section 510 and the partial heat releasing section 520 of the part of the heat pipe 500 are inserted into the heat conducting block 200.

As shown in FIG. 1 and FIG. 5 , the two fans 600 are located on one side of the first fins 300 away from the heat conductive substrate 100 . In this embodiment, the two projections of the two fans 600 on the first fins 300 do not overlap with the same airflow path 350 to prevent the airflow generated by the two fans 600 from interfering with each other in the same airflow channel 350.

It is to be noted that the heat-conducting substrate 100, the second fins 400, the heat pipe 500 and the fan 600 in the above embodiments are not intended to limit the present invention. In other embodiments, the heat-dissipating device may only include the heat-conducting block 200 and the first The fins 300, while the thermally conductive block 200 is in direct thermal contact with the heat source.

In another embodiment, the first thermal contact portion 210 is a linear structure, and correspondingly, the groove bottom portion 311 is also a linear structure. That is, the first thermal contact portion 210 of the thermal block 200 is actually one side, so that the second thermal contact portion 220, the third thermal contact portion 230, and the thermally conductive substrate 100 form a structure having a triangular cross section, and the first angle does not exist at this time. The second angle, but the second thermal contact portion 220 and the third thermal contact portion 230 directly form an angle, such as an obtuse angle; correspondingly, the fin portion 311 formed by the first fin 300 has a groove bottom 311 actually The one side is such that the groove 310 has a triangular shape and cooperates with the shape of the heat conducting block 200 so that the heat conducting block 200 can be accommodated in the groove 310.

Please refer to Figure 5. FIG. 5 is a schematic view showing the use of the heat sink of FIG. 1 in a heat source.

As shown in FIG. 5, the thermally conductive substrate 100 of the heat sink 10 is in thermal contact with the heat source 22 on the circuit board 20. The heat source 22 is, for example, a central processing unit, a south bridge, a north bridge or the like.

The heat generated by the heat source 22 is transmitted to the first fin 300 through the heat conducting block 200 to the side of the first fin 300 and is farther away from the heat conducting substrate 100 than the one side of the heat conducting substrate 100. Therefore, the heat generated by the heat source 22 can be transmitted to the corners of the first fin 300 relatively quickly to improve the heat dissipation speed of the heat sink 10.

In addition, when the fan 600 is in operation, the heat dissipation airflow F formed by the fan 600 not only flows straight toward the heat conductive substrate 100, but is also more rapidly guided by the inclined second thermal contact portion 220 and the third thermal contact portion 230. The ground flows to the sides of the first fin 300. As a result, the heat-dissipating airflow F can smoothly flow from the upper edge of the airflow path 350 and flow out from the left and right sides of the airflow path 350. That is to say, the heat dissipation airflow F is less susceptible to the airflow rebounded by the thermally conductive substrate 100, and the flow smoothness of the heat dissipation airflow F is reduced. In this way, the heat dissipation speed of the heat sink 10 can be further improved.

According to the heat dissipating device of the above embodiment, the heat radiating block passes through the first fin, so that the heat generated by the heat source is transmitted to the first side of the first fin through the heat conducting substrate, and is directly transmitted to the first through the heat conducting block. The fins are farther away from one side of the thermally conductive substrate. Therefore, the heat generated by the heat source can be transmitted to the corners of the first fin faster to improve the heat dissipation speed of the heat sink.

In addition, the second heat contact portion and the third heat contact portion are guided to flow toward the sides of the first fin more quickly. In this way, the heat-dissipating airflow can smoothly flow from the upper edge of the airflow path and flow out from the left and right sides of the airflow path. That is to say, the heat dissipation airflow is less susceptible to the airflow rebounded by the thermally conductive substrate, thereby reducing the flow smoothness of the heat dissipation airflow. In this way, the heat dissipation speed of the heat sink can be further improved.

The heat dissipation method includes two stages of heat transfer and heat dissipation. The heat pipe is a good heat exchanger. In the present invention, a combination of a large cross-sectional area metal (such as the above-mentioned heat conducting block) and a heat pipe connects the heat source and the fins together, thereby increasing the cross-sectional area of the heat transfer path. Enhanced fin heat dissipation efficiency. And because there are quite a few temperatures close to the heat source, here is the bottleneck of the traditional heat dissipation, and the heat transfer bottleneck is solved by the combination of the heat conducting block and the heat pipe in the present case. In addition, in terms of heat dissipation, the heat pipe and the heat conducting block having a higher temperature are distributed in a high-speed flow region away from the fan axis, the flow rate is high, and the air temperature is lower, that is, the temperature difference between the air and the fin is larger, thereby improving heat dissipation. s efficiency.

As before, in the present invention, the two obliquely disposed thermal contact faces of the heat conducting block contribute to the air guiding on both sides to prevent turbulent flow, and secondly, the two inclined faces (ie, the thermal contact faces) of the heat conducting block having a lower temperature drop are disposed. On both sides of the center of the fan with the highest wind speed, it helps to dissipate heat. Again, the heat transfer block can increase the heat transfer path associated with the heat pipe, thereby enhancing heat transfer efficiency.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10‧‧‧heating device
20‧‧‧ boards
22‧‧‧heat source
100‧‧‧thermal substrate
200‧‧‧thermal block
210‧‧‧First Thermal Contact
220‧‧‧Second Thermal Contact
230‧‧‧ Third Thermal Contact
300‧‧‧First fin
305‧‧‧ bottom
310‧‧‧ Groove
311‧‧‧ bottom of the trough
312‧‧‧ first groove side
313‧‧‧Second groove side
350‧‧ Airflow
400‧‧‧second fin
500‧‧‧ heat pipe
510‧‧‧heat absorption section
511‧‧‧ bottom
520‧‧‧heating section
530‧‧‧Connection section
600‧‧‧Fan θ1, θ2‧‧‧ angle
D‧‧‧Deep
H‧‧‧ Height
W1, W2‧‧‧ width
F‧‧‧heating airflow

1 is a perspective view of a heat sink according to a first embodiment of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1 after the fan is removed. Figure 3 is a side elevational view of Figure 2. Figure 4 is a schematic cross-sectional view of Figure 2. FIG. 5 is a schematic view showing the use of the heat sink of FIG. 1 in a heat source.

100‧‧‧thermal substrate

200‧‧‧thermal block

210‧‧‧First Thermal Contact

220‧‧‧Second Thermal Contact

230‧‧‧ Third Thermal Contact

300‧‧‧First fin

305‧‧‧ bottom

310‧‧‧ Groove

311‧‧‧ bottom of the trough

312‧‧‧ first groove side

313‧‧‧Second groove side

500‧‧‧ heat pipe

510‧‧‧heat absorption section

511‧‧‧ bottom

520‧‧‧heating section

Θ1, θ2‧‧‧ angle

D‧‧‧Deep

H‧‧‧ Height

W1, W2‧‧‧ width

Claims (9)

A heat dissipating device includes: a heat conducting block having a first thermal contact portion and an opposite second thermal contact portion and a third thermal contact portion, wherein the second thermal contact portion and the third thermal contact portion are respectively connected to the The first thermal contact portion is disposed opposite to each other. When the first thermal contact portion has a planar structure, the second thermal contact portion and the third thermal contact portion respectively overlap with the first thermal contact portion. An angle formed by the second angle is an obtuse angle, and when the first thermal contact portion is a linear structure, the second thermal contact portion and the third thermal contact portion are disposed at an angle; and the plurality of first fins Each of the first groove side and the second groove side is respectively connected to the bottom of the groove and has a groove, a groove and a groove bottom forming the groove, a first groove side and a second groove side. The first thermal contact portion and the second thermal contact portion are respectively in thermal contact with the first thermal contact portion and the second thermal contact portion, respectively. And the third thermal contact portion, the first fins are separated to be adjacent to the first fins Forming a plurality of air passages; at least one heat pipe having a heat absorbing section, a heat releasing section, and a connecting section connecting the heat absorbing section and the heat releasing section, wherein the heat releasing section is inserted into the first fins, and the heat absorbing section is The heat conducting block is inserted into the heat conducting block, and the heat absorbing section has a plane which is flush with the bottom surface. The heat dissipating device of claim 1, wherein the heat conducting block is provided with at least one through hole, and the first fins are respectively provided with at least one through hole, and the heat releasing portion of the heat pipe is inserted into the first fins The through hole of the sheet, the heat absorbing section of the heat pipe is inserted into the through hole of the heat conducting block. The heat dissipating device of claim 2, further comprising a plurality of second fins disposed side by side of the first fins and spaced apart from the first fins to form The air flow path and the adjacent two second fins are separated to form a plurality of the air flow paths. The heat dissipation device of claim 3, wherein the second fins are respectively provided with at least one through hole, and the heat dissipation portion of the heat pipe is inserted into the through holes of the first fins and the plurality of The through holes of the two fins. The heat dissipating device of claim 3, further comprising at least one fan, the fan being located on a side of the first fins away from the heat conducting block and/or the second fins, and when included When at least two fans are present, the projections of the at least two fans on the first fins and/or the second fins do not overlap the same airflow path. The heat dissipating device of claim 1, further comprising a heat conducting substrate, wherein the recesses are respectively recessed from the bottom surfaces toward the bottom of the slot, the bottom surface being in thermal contact with the heat conducting substrate. The heat sink of claim 1, wherein the first angle is between 115 and 145 degrees, and the second angle is between 115 and 145 degrees. The heat sink of claim 1, wherein the ratio of the depth of the groove to the height of the first fin is between 75% and 95%. The heat dissipating device of claim 1, wherein the first thermal contact portion, the second thermal contact portion and the third thermal contact portion are all planar structures; or the first thermal contact portion is a strip The second thermal contact portion and the third thermal contact portion are both planar structures.