CN2664184Y - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- CN2664184Y CN2664184Y CN200320118360.9U CN200320118360U CN2664184Y CN 2664184 Y CN2664184 Y CN 2664184Y CN 200320118360 U CN200320118360 U CN 200320118360U CN 2664184 Y CN2664184 Y CN 2664184Y
- Authority
- CN
- China
- Prior art keywords
- heat
- base
- heat abstractor
- radiating fins
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat sink mainly comprises a three-dimensional radiating base, a plurality of radiating fins and two thermotubes. The three-dimensional radiating base mainly comprises a base and two heat conduction parts extended up slantly from two sides of the base; the base and the two heat conduction parts surround to form a space; an upper surface of the base is provided with two grooves. The radiating fins are clung to the two heat conduction parts of the three-dimensional radiating base tightly; two sides of the radiating fin are provided with perforations respectively. Ends of the thermotubes are arranged inside the two grooves of the base tightly, thereby keeping good thermocontact with the three-dimensional radiating base; the other ends of the thermotubes are arranged in the perforations of the radiating fins, thereby effectively conducting heat of the three-dimensional radiating base to the radiating fins.
Description
[technical field]
The utility model is about a kind of heat abstractor, the heat abstractor particularly less about a kind of quality, that heat conductivility is good.
[background technology]
Along with development of electronic technology, the processing speed of central processing unit improves constantly, its heat that gives off is also more and more, by it is controlled in the temperature range of energy operate as normal, therefore require heat abstractor to have higher radiating efficiency, adopting the heat abstractor of three-dimensional cooling base because its radiating efficiency more generally adopts the heat abstractor height of flat cooling base, therefore recently is that institute of heat abstractor manufacturer extensively adopts.
Shown in Figure 3 is a kind of heat abstractor 50 that adopts three-dimensional cooling base, and this heat abstractor 50 mainly comprises a three-dimensional cooling base 52 and a multi-disc radiating fin 54, and these radiating fins 54 are the both sides, top of amplexiforming to this solid cooling base 52.Three-dimensional cooling base 52 weight that this heat abstractor 50 adopts are big, have big thermal capacitance; And radiating fin 54 is the both sides, top of amplexiforming to this solid cooling base 52, and radiating fin 54 is also obvious greater than the general flat cooling base that uses, so this heat abstractor 50 has heat dispersion preferably with the contact length of three-dimensional cooling base 52.But weight is greatly a big shortcoming of this heat abstractor 50, especially along with the raising of manufacturing technology, central processing unit adopts more tiny processing procedure, and its core becomes more and more littler, adopts the huge heat abstractor of this quality 50 even can damage fragile central processing unit by pressure.
Shown in Figure 4 is the another kind of heat abstractor 60 that adopts three-dimensional cooling base, and this heat abstractor 60 mainly comprises a three-dimensional cooling base 62, two heat pipes 64 and multi-disc radiating fin 66.These solid cooling base 62 middle parts are provided with two through hole 68, thereby this two heat pipe 64 is to be plugged in the capacity of heat transmission that strengthens this solid cooling base 62 in this two through hole 68.But this heat abstractor 60 still has bigger weight, and because this heat pipe 64 is to be plugged in the through hole 68 of this solid cooling base 62, therefore the scaling powder or the thermal conducting agent that spread upon on the heat pipe 64 are often concentrated a side that is distributed in insertion heat pipe 64 and are difficult to form uniform distribution, cause the applying of 62 of heat pipe 64 and three-dimensional cooling bases not tight, thermal resistance increases, so can not effectively improve the thermal conductivity of three-dimensional cooling base 62.The method for arranging of this in addition heat pipe 64 can not directly be passed to radiating fin 66 with the heat on the three-dimensional cooling base 62.
[summary of the invention]
The purpose of this utility model is to provide the heat abstractor that a kind of quality is less, heat conductivility is good.
For achieving the above object, the utility model has adopted following technical scheme: the utility model heat abstractor mainly comprises a three-dimensional cooling base, multi-disc radiating fin and two heat pipes, this solid cooling base mainly comprises a base and two heat-conducting parts that are inclined upwardly and extended by these base both sides, wherein surround between this base and this two heat-conducting part and form a space, and this base upper surface is provided with two grooves.These radiating fins are two heat-conducting parts to this solid cooling base of closely being sticked, and the both sides of these radiating fins are equipped with a perforation.One end of this two heat pipe is closely to be installed up in the groove of this base, and its other end then is closely to wear to the perforation of these radiating fins.
Compared with prior art, the utility model heat abstractor is formed with a space owing to surrounding between base and the heat-conducting part, its quality more generally adopts the heat abstractor of three-dimensional cooling base little, the heat pipe of this heat abstractor is closely to be installed up in the groove of this base upper surface, thereby this installing mode helps fitting tightly of heat pipe and base reduces thermal resistance, the heat of this base can be directly conducted to radiating fin by heat-conducting part or two kinds of approach of heat pipe in addition, has effectively promoted the radiating efficiency of heat abstractor.
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor.
Fig. 2 is the three-dimensional combination figure of the utility model heat abstractor.
Fig. 3 is a kind of three-dimensional combination figure that adopts three-dimensional cooling base heat abstractor.
Fig. 4 is the another kind of three-dimensional combination figure that adopts three-dimensional cooling base heat abstractor.
[embodiment]
See also Fig. 1 to Fig. 2, the utility model heat abstractor mainly comprises a three-dimensional cooling base 10, multi-disc radiating fin 30 and two heat pipes 40.This solid cooling base 10 mainly comprises a base 12 and is tilted to last extended two heat-conducting parts 14 by these base 12 both sides, this base 12 surrounds with this two heat-conducting part 14 and forms a space 16, these 16 tops, space offer a gas channel 17, thereby cooling blast can enter in this space 16 from this gas channel 17 and directly this solid cooling base 10 cooled off.The lower surface of this base 12 is closely to be sticked to a central processing unit (figure does not show), and its upper face center then is provided with two halves arc-shaped groove 18.
These radiating fins 30 are structure in the form of sheets, its bottom is provided with an inverted v-shaped opening 32, a flanging 34 is all stretched out to the one pleurapophysis in these inverted v-shaped opening 32 both sides, thereby make these radiating fins 30 can keep appropriate intervals and closely amplexiform two heat-conducting parts 14 to this solid cooling base 10, the both sides of these radiating fins 30 respectively are provided with a perforation 36.
This two heat pipe 40 is U font structure, its inside is filled with hydraulic fluid that low pressure easily boils (as ammoniacal liquor, alcohol etc.), an end of this two heat pipe 40 closely is installed in two grooves 18 of this solid cooling base 10, and its other end then closely is located in the perforation 36 of these radiating fins 30.When this heat pipe 40 is welded to the groove 18 of base 12, only need scaling powder or heat-conducting glue on the coated on bottom side of heat pipe 40 1 ends, and heat pipe 40 is installed up to groove 18 from the top, the application of force is pushed itself and base 12 is combined closely then, welds at last to get final product again.Thereby the combination of this heat pipe 40 and groove 18 can make scaling powder or even distribution of heat-conducting glue between heat pipe 40 and the base 12 reduce thermal resistance.When this heat abstractor work, hydraulic fluid in this heat pipe 40 absorbs the heat that central processing unit is distributed to three-dimensional cooling base 10 in the end evaporation of three-dimensional cooling base 10 bases 12, then an end condensation of radiating fin 30 and with heat discharge to radiating fin 30, because heat pipe 40 has high thermal conductivity, thereby can be effectively the heat of three-dimensional cooling base 10 bases 12 be conducted to radiating fin 30.
Claims (8)
1. heat abstractor, it mainly comprises a cooling base, multi-disc radiating fin and at least one heat pipe, this cooling base mainly comprises a base and two heat-conducting parts that extended upward by this base, it is characterized in that: surround between this base and this two heat-conducting part and form a space, and this base upper surface is provided with at least one groove, these radiating fins are two heat-conducting parts to this cooling base of closely being sticked, one end of this heat pipe is closely to amplexiform to the groove of this base, and its other end then is closely to amplexiform to these radiating fins.
2. heat abstractor as claimed in claim 1 is characterized in that: this two heat-conducting part is that the both sides by this base are tilted to and extend.
3. heat abstractor as claimed in claim 2 is characterized in that: the bottom of these radiating fins is provided with an inverted v-shaped opening.
4. heat abstractor as claimed in claim 3 is characterized in that: a flanging is all stretched out to the one pleurapophysis in the both sides of this inverted v-shaped opening, thereby makes these radiating fins can keep appropriate intervals ground closely to amplexiform to this heat-conducting part.
5. heat abstractor as claimed in claim 1 is characterized in that: this top, space offers a gas channel.
6. heat abstractor as claimed in claim 1 is characterized in that: this heat abstractor includes two heat pipes.
7. heat abstractor as claimed in claim 6 is characterized in that: the both sides of these radiating fins respectively are provided with a through hole.
8. heat abstractor as claimed in claim 7 is characterized in that: the other end of this two heat pipe is to wear to the through hole of these radiating fins.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200320118360.9U CN2664184Y (en) | 2003-11-17 | 2003-11-17 | Heat sink |
US10/946,950 US20050103476A1 (en) | 2003-11-17 | 2004-09-21 | Heat dissipating assembly with heat pipes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200320118360.9U CN2664184Y (en) | 2003-11-17 | 2003-11-17 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2664184Y true CN2664184Y (en) | 2004-12-15 |
Family
ID=34347264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200320118360.9U Expired - Lifetime CN2664184Y (en) | 2003-11-17 | 2003-11-17 | Heat sink |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050103476A1 (en) |
CN (1) | CN2664184Y (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100368756C (en) * | 2005-07-25 | 2008-02-13 | 苏州金美家具有限公司 | Heat pipe seat and its manufacturing method |
CN101616567B (en) * | 2008-06-25 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Heat sink |
CN101472439B (en) * | 2007-12-29 | 2011-09-28 | 富准精密工业(深圳)有限公司 | Radiating device |
CN101409996B (en) * | 2007-10-11 | 2012-05-23 | 曜越科技股份有限公司 | Method for preparing radiating module |
CN101742890B (en) * | 2008-11-14 | 2013-06-05 | 富准精密工业(深圳)有限公司 | Radiation device |
CN107872941A (en) * | 2016-09-27 | 2018-04-03 | 技嘉科技股份有限公司 | Heat abstractor |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM249410U (en) * | 2003-12-26 | 2004-11-01 | Hon Hai Prec Ind Co Ltd | Heat dissipating device using heat pipe |
CN100517665C (en) * | 2005-04-22 | 2009-07-22 | 富准精密工业(深圳)有限公司 | Heat-pipe radiating apparatus |
CN100446227C (en) * | 2005-09-30 | 2008-12-24 | 鸿富锦精密工业(深圳)有限公司 | Radiator and its production |
CN100534281C (en) * | 2006-06-21 | 2009-08-26 | 富准精密工业(深圳)有限公司 | Heat sink for heat pipe |
US7965511B2 (en) * | 2006-08-17 | 2011-06-21 | Ati Technologies Ulc | Cross-flow thermal management device and method of manufacture thereof |
US7942194B2 (en) * | 2007-04-10 | 2011-05-17 | Fujikura Ltd. | Heat sink |
US20090166006A1 (en) * | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100014251A1 (en) * | 2008-07-15 | 2010-01-21 | Advanced Micro Devices, Inc. | Multidimensional Thermal Management Device for an Integrated Circuit Chip |
TWI484895B (en) * | 2010-05-14 | 2015-05-11 | Asia Vital Components Co Ltd | Heat dissipation device |
WO2013047975A1 (en) * | 2011-09-26 | 2013-04-04 | Posco Led Company Ltd. | Optical semiconductor-based lighting apparatus |
CN103813689A (en) * | 2012-11-01 | 2014-05-21 | 恩斯迈电子(深圳)有限公司 | Heat radiation device and heat radiation fin thereof |
USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6382306B1 (en) * | 2000-08-15 | 2002-05-07 | Hul Chun Hsu | Geometrical streamline flow guiding and heat-dissipating structure |
TW530993U (en) * | 2002-01-14 | 2003-05-01 | Chia Cherne Industry Co Ltd | Dual tilted-side heat sink base structure to reduce the fan pressure reduction |
US6959755B2 (en) * | 2002-01-30 | 2005-11-01 | Kuo Jui Chen | Tube-style radiator structure for computer |
TW524434U (en) * | 2002-05-07 | 2003-03-11 | Polo Tech Co Ltd | Combinational structure of heat sink |
US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
US6827136B2 (en) * | 2002-10-18 | 2004-12-07 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating apparatus and method for producing same |
TWM249090U (en) * | 2002-12-25 | 2004-11-01 | Jiun-Fu Liou | Improved device for heat sink module |
US6779595B1 (en) * | 2003-09-16 | 2004-08-24 | Cpumate Inc. | Integrated heat dissipation apparatus |
US6958915B2 (en) * | 2003-10-07 | 2005-10-25 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating device for electronic component |
-
2003
- 2003-11-17 CN CN200320118360.9U patent/CN2664184Y/en not_active Expired - Lifetime
-
2004
- 2004-09-21 US US10/946,950 patent/US20050103476A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100368756C (en) * | 2005-07-25 | 2008-02-13 | 苏州金美家具有限公司 | Heat pipe seat and its manufacturing method |
CN101409996B (en) * | 2007-10-11 | 2012-05-23 | 曜越科技股份有限公司 | Method for preparing radiating module |
CN101472439B (en) * | 2007-12-29 | 2011-09-28 | 富准精密工业(深圳)有限公司 | Radiating device |
CN101616567B (en) * | 2008-06-25 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Heat sink |
CN101742890B (en) * | 2008-11-14 | 2013-06-05 | 富准精密工业(深圳)有限公司 | Radiation device |
CN107872941A (en) * | 2016-09-27 | 2018-04-03 | 技嘉科技股份有限公司 | Heat abstractor |
CN107872941B (en) * | 2016-09-27 | 2019-10-22 | 技嘉科技股份有限公司 | Radiator |
Also Published As
Publication number | Publication date |
---|---|
US20050103476A1 (en) | 2005-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20131117 Granted publication date: 20041215 |