CN2485699Y - Phase changing heat radiator for fanless desk computer - Google Patents
Phase changing heat radiator for fanless desk computer Download PDFInfo
- Publication number
- CN2485699Y CN2485699Y CN 01237490 CN01237490U CN2485699Y CN 2485699 Y CN2485699 Y CN 2485699Y CN 01237490 CN01237490 CN 01237490 CN 01237490 U CN01237490 U CN 01237490U CN 2485699 Y CN2485699 Y CN 2485699Y
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- China
- Prior art keywords
- change heat
- phase
- copper
- heat transfer
- transfer pipe
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- Expired - Fee Related
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Abstract
The utility model relates to a CPU radiation device of a desktop computer, in particular to a phase transition radiator without a fan of the desktop computer. The utility model comprises a copper phase transition heat transmission tube, an aluminium radiation wing and also a copper base with a smooth lower surface; the vaporization end of the copper phase transition heat transmission tube is inserted into the copper base. A cooling sleeve is provided with the aluminium radiation wing, and inner wall and bottom are attached with a capillary liquid absorbing core.
Description
The utility model relates to a kind of CPU heat abstractor of desktop computer, is in particular a kind of desk-top computer phase-change heat sink that does not have fan.
At present, the fan noise of desktop cpu heating radiator has had a strong impact on operating environment and has diminished health, realizes that it is each computer user's strong desire that CPU does not have the fan heat radiation.
The purpose of this utility model is exactly to provide a kind of desk-top computer not have fan CPU phase-change heat sink for the above-mentioned defective that solves prior art.
The purpose of this utility model realizes by following technical solution:
A kind of desk-top computer phase-change heat sink that does not have fan, it includes copper phase-change heat transfer pipe, the aluminium radiating fin, it also includes copper pedestal, the lower surface of copper pedestal is smooth surface, the evaporation ends of copper phase-change heat transfer pipe is inserted in the copper pedestal, and the condensation segment of copper phase-change heat transfer pipe is with the aluminium radiating fin, and capillary wick is posted in copper phase-change heat transfer inside pipe wall and bottom.
The purpose of this utility model also can further realize by following technical measures:
Aforesaid a kind of desk-top computer phase-change heat sink that does not have fan, the wherein said capillary wick of copper phase-change heat transfer pipe that is is made of porosint, is thin copper mesh or tow, or metal powder sintered forming.
Aforesaid a kind of desk-top computer phase-change heat sink that does not have fan, the wherein said capillary wick of copper phase-change heat transfer pipe that is is made of porosint, is thin copper mesh or tow, or metal powder sintered forming.
Aforesaid a kind of desk-top computer phase-change heat sink that does not have fan, wherein said copper phase-change heat transfer pipe are circular, or pancake, and the radical of phase-change heat transfer pipe is at least one.
Aforesaid a kind of desk-top computer phase-change heat sink that does not have fan, the profile of wherein said copper pedestal and aluminium radiating fin is circular, or square.
Aforesaid a kind of desk-top computer phase-change heat sink that does not have fan, wherein said aluminium radiating fin are one-piece construction or are the every independent suit aluminium of copper phase-change heat transfer pipe radiating fin.
Aforesaid a kind of desk-top computer phase-change heat sink that does not have fan, the hydraulic fluid in the wherein said vacuum copper phase-change heat transfer pipe generally is a water, or alcohol, methyl alcohol, acetone.
Advantage of the present utility model is that thereby copper base has smooth bottom surface and can directly contact with the radiating surface of CPU and do not need any heat conduction pad to reduce thermal conduction resistance between CPU and the heating radiator bottom surface, effectively improves radiating effect.
Below in conjunction with accompanying drawing the utility model is further described:
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model copper pedestal structural representation.
As shown in Figure 1 and Figure 2, the utility model includes copper phase-change heat transfer pipe 5, aluminium radiating fin 7, it also includes copper pedestal 8, the bottom surface of copper pedestal 8 keeps quite smooth surface through machining, and this smooth surface is when contacting with the surface of CPU9, under the pressing force of the spring effect, good applying can be kept, thereby the heat conduction pad can be saved.The evaporation ends 1 of copper phase-change heat transfer pipe 5 is inserted in the copper pedestal 8, and the condensation segment 6 of copper phase-change heat transfer pipe 5 is with aluminium radiating fin 7, and capillary wick 10 is posted in copper phase-change heat transfer pipe 5 inwalls and bottom.The capillary wick 10 of copper phase-change heat transfer pipe 5 is made of porosint, is thin copper mesh or tow, or metal powder sintered forming.Copper phase-change heat transfer pipe 5 is circular, or pancake, and the radical of phase-change heat transfer pipe 5 is at least one.The number of the copper phase-change heat transfer pipe 5 on copper pedestal 8 can be decided according to heat dissipation capacity.Be generally 1-4.The profile of copper pedestal 8 and aluminium radiating fin 7 is circular, or square.Good in order to guarantee the heat radiator heat radiation, all have circular hole at the center of each aluminium radiating fin 7.After 7 of many aluminium heat radiation wings were nestable, circular hole had just formed a gas channel, and the hot gas of bottom is risen by gas channel, and was lost in the air by air guide cap 4 and goes.Can strengthen the gaseous exchange degree at heating radiator center like this, to reach better heat radiation.Aluminium radiating fin 7 is one-piece construction or is every copper phase-change heat transfer pipe 5 independent suit aluminium radiating fins.Hydraulic fluid in the vacuum copper phase-change heat transfer pipe generally is a water, or alcohol, methyl alcohol, acetone.
The heat that CPU9 produced conducts to copper pedestal, because the coefficient of heat conductivity of copper pedestal is very big, and heat can be sent very soon to the bottom of phase-change heat transfer pipe, it is the evaporator section 1 of phase-change heat transfer pipe, the liquid pool 2 that in the evaporator section pipe, has hydraulic fluid to form, the imbibition core of on liquid pool bottom and wall, forming 10 by copper mesh, in the time of when heat is reached pipe by the evaporator section tube wall in, the liquid in the imbibition core and the liquid of liquid-pool surface are under the state of negative pressure, heat absorption is vaporizated into steam, rise to the condensation segment 6 of phase-change heat transfer pipe along tube's axis, be with the round fin 7 of aluminium on the condensation segment, coagulate the continuous condensation of steam in the section and emit heat and pass to the outer aluminium fin 7 of pipe, and by fin with heat dissipation in air.Steam is condensed into liquid and is back to continuation heat absorption vaporization in the evaporator section of bottom along tube wall again in condensation segment.So constantly circulate, the heat that CPU9 produced constantly is dispersed in the air goes.
Phase-change heat transfer pipe 5 inside are high vacuums when not working.Thereby the steam that produced of bottom liquid pool 2 and evaporator section tube wall can very fast arrival condensation segment the top.Therefore Nei Bu heat transmission resistance almost can be ignored.Calculating shows: its heat radiation resistance of the aluminium flake of equal height is bigger 200 times than phase-change heat transfer pipe.
Claims (6)
1. desk-top computer phase-change heat sink that does not have fan, it includes copper phase-change heat transfer pipe, the aluminium radiating fin, it is characterized in that it also includes copper pedestal, the lower surface of copper pedestal is smooth surface, the evaporation ends of copper phase-change heat transfer pipe is inserted in the copper pedestal, and the condensation segment of copper phase-change heat transfer pipe is with the aluminium radiating fin, and capillary wick is posted in copper phase-change heat transfer inside pipe wall and bottom.
2. a kind of desk-top computer phase-change heat sink that does not have fan according to claim 1 is characterized in that the capillary wick of copper phase-change heat transfer pipe is made of porosint, is thin copper mesh or tow, or metal powder sintered forming.
3. a kind of desk-top computer phase-change heat sink that does not have fan according to claim 1 is characterized in that copper phase-change heat transfer pipe is circular, or pancake, and the radical of phase-change heat transfer pipe is at least one.
4. a kind of desk-top computer phase-change heat sink that does not have fan according to claim 1 is characterized in that the profile of copper pedestal and aluminium radiating fin is circular, or square.
5. a kind of desk-top computer phase-change heat sink that does not have fan according to claim 1 is characterized in that the aluminium radiating fin is one-piece construction or is the every independent suit aluminium of copper phase-change heat transfer pipe radiating fin.
6. a kind of desk-top computer phase-change heat sink that does not have fan according to claim 1 is characterized in that the hydraulic fluid in the vacuum copper phase-change heat transfer pipe generally is a water, or alcohol, methyl alcohol, acetone.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01237490 CN2485699Y (en) | 2001-04-24 | 2001-04-24 | Phase changing heat radiator for fanless desk computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01237490 CN2485699Y (en) | 2001-04-24 | 2001-04-24 | Phase changing heat radiator for fanless desk computer |
Publications (1)
Publication Number | Publication Date |
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CN2485699Y true CN2485699Y (en) | 2002-04-10 |
Family
ID=33650282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01237490 Expired - Fee Related CN2485699Y (en) | 2001-04-24 | 2001-04-24 | Phase changing heat radiator for fanless desk computer |
Country Status (1)
Country | Link |
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CN (1) | CN2485699Y (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100351602C (en) * | 2004-11-29 | 2007-11-28 | 杨洪武 | Foil sheet groove liquid sucking core of heat pipe radiator |
CN100367492C (en) * | 2005-02-23 | 2008-02-06 | 朋程科技股份有限公司 | Method for making radiating structure of rectifier |
CN100413392C (en) * | 2007-02-14 | 2008-08-20 | 南京理工大学 | Non-fan chip heat radiator |
CN102006542A (en) * | 2009-08-28 | 2011-04-06 | 清华大学 | Sound generating device |
US8457331B2 (en) | 2009-11-10 | 2013-06-04 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
US8462965B2 (en) | 2008-12-30 | 2013-06-11 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic module, thermoacoustic device, and method for making the same |
US8494187B2 (en) | 2009-11-06 | 2013-07-23 | Tsinghua University | Carbon nanotube speaker |
US8537640B2 (en) | 2009-09-11 | 2013-09-17 | Tsinghua University | Active sonar system |
US8615096B2 (en) | 2009-08-07 | 2013-12-24 | Tsinghua University | Thermoacoustic device |
US8811631B2 (en) | 2009-11-16 | 2014-08-19 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
US8905320B2 (en) | 2009-06-09 | 2014-12-09 | Tsinghua University | Room heating device capable of simultaneously producing sound waves |
CN104467695A (en) * | 2014-12-10 | 2015-03-25 | 成都锐思灵科技有限公司 | Microwave power amplifier heat radiating system |
CN107087384A (en) * | 2017-06-28 | 2017-08-22 | 合肥联宝信息技术有限公司 | Radiator and heat abstractor |
CN107577321A (en) * | 2017-10-26 | 2018-01-12 | 航天特种材料及工艺技术研究所 | A kind of radiator based on phase-change material |
CN110319720A (en) * | 2019-06-19 | 2019-10-11 | 同济大学 | A kind of unidirectional heat transfer unit (HTU) of phase-transition heat-storage and its manufacturing method |
-
2001
- 2001-04-24 CN CN 01237490 patent/CN2485699Y/en not_active Expired - Fee Related
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100351602C (en) * | 2004-11-29 | 2007-11-28 | 杨洪武 | Foil sheet groove liquid sucking core of heat pipe radiator |
CN100367492C (en) * | 2005-02-23 | 2008-02-06 | 朋程科技股份有限公司 | Method for making radiating structure of rectifier |
CN100413392C (en) * | 2007-02-14 | 2008-08-20 | 南京理工大学 | Non-fan chip heat radiator |
US8462965B2 (en) | 2008-12-30 | 2013-06-11 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic module, thermoacoustic device, and method for making the same |
US8763234B2 (en) | 2008-12-30 | 2014-07-01 | Beijing Funate Innovation Technology Co., Ltd. | Method for making thermoacoustic module |
US8905320B2 (en) | 2009-06-09 | 2014-12-09 | Tsinghua University | Room heating device capable of simultaneously producing sound waves |
US8615096B2 (en) | 2009-08-07 | 2013-12-24 | Tsinghua University | Thermoacoustic device |
CN102006542A (en) * | 2009-08-28 | 2011-04-06 | 清华大学 | Sound generating device |
US8406450B2 (en) | 2009-08-28 | 2013-03-26 | Tsinghua University | Thermoacoustic device with heat dissipating structure |
CN102006542B (en) * | 2009-08-28 | 2014-03-26 | 清华大学 | Sound generating device |
US8537640B2 (en) | 2009-09-11 | 2013-09-17 | Tsinghua University | Active sonar system |
US8494187B2 (en) | 2009-11-06 | 2013-07-23 | Tsinghua University | Carbon nanotube speaker |
US8457331B2 (en) | 2009-11-10 | 2013-06-04 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
US8811631B2 (en) | 2009-11-16 | 2014-08-19 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
CN104467695A (en) * | 2014-12-10 | 2015-03-25 | 成都锐思灵科技有限公司 | Microwave power amplifier heat radiating system |
CN107087384A (en) * | 2017-06-28 | 2017-08-22 | 合肥联宝信息技术有限公司 | Radiator and heat abstractor |
CN107087384B (en) * | 2017-06-28 | 2023-12-05 | 合肥联宝信息技术有限公司 | Radiator and heat dissipating device |
CN107577321A (en) * | 2017-10-26 | 2018-01-12 | 航天特种材料及工艺技术研究所 | A kind of radiator based on phase-change material |
CN107577321B (en) * | 2017-10-26 | 2023-09-29 | 航天特种材料及工艺技术研究所 | Radiator based on phase change material |
CN110319720A (en) * | 2019-06-19 | 2019-10-11 | 同济大学 | A kind of unidirectional heat transfer unit (HTU) of phase-transition heat-storage and its manufacturing method |
CN110319720B (en) * | 2019-06-19 | 2021-06-04 | 同济大学 | Phase-change heat-storage unidirectional heat transfer device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20020410 Termination date: 20100424 |