CN2865211Y - Radiator specially for electronic component - Google Patents
Radiator specially for electronic component Download PDFInfo
- Publication number
- CN2865211Y CN2865211Y CN 200520140483 CN200520140483U CN2865211Y CN 2865211 Y CN2865211 Y CN 2865211Y CN 200520140483 CN200520140483 CN 200520140483 CN 200520140483 U CN200520140483 U CN 200520140483U CN 2865211 Y CN2865211 Y CN 2865211Y
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating fins
- tube
- radiator
- butterfly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a special-purpose heat radiator for electronic elements comprising a base (1) and a group of heat tubes (2) arranged on the base (1). The difference is: each heat tube (2) is upright U-shaped closed tube (21), which holds work media. The inner wall of each U-shaped closed tube (21) has a ladder helical groove (23). At up outside of the tube (21), butterfly radiating fins (3) are arranged, which have flanges (32) and a plurality of convecting holes (31). The inner wall of the heat radiator tube is in ladder helical groove, the flanges (32) of butterfly radiating fins can increase contact surface between the radiating fins and the heat tubes, the heat-transmission resistance is reduced, speed quickened, and efficiency increased. Several convecting holes are arranged in the butterfly radiating fins, this can speed up the air flow surrounding the radiating fins, quicken the heat-transmission rate and improve efficiency. For a given heat dissipation, the materials needed for butterfly radiating fins are less, the manufacturing cost is lower and the volume is smaller.
Description
Technical field
The utility model relates to a kind of phase transition of vacuum heat-pipe radiator that is used for, and belongs to heat-exchange apparatus.Relate to a kind of electronic component 5 heat radiation heat-exchange devices specifically.
Background technology
The instrument of existing various automatic controls, instrument, use various semiconductor chips in the apparatus such as computer widely, the a large amount of heats of its chip generation in service, there is multiple mode to be lowered the temperature at present, there is a kind of mode to adopt the heat pipe-type heat dissipation technology to lower the temperature, heat pipe is to utilize undergoing phase transition of material (aqueous, conversion mutually between the vapour shape) temperature does not change and can absorb or emit the principle of a large amount of heats in the process, establish a pipeline that is connected at thermal source and cooled region, place a certain amount of working media (water in the pipeline, fluorine Lyons, alcohol etc.), pipeline keeps the certain vacuum degree simultaneously, be that the interior air pressure of pipeline is less than atmospheric pressure, hydraulic fluid near thermal source (claiming evaporation ends usually) in the pipeline is subjected to thermal evaporation to diffuse to condensation end, flow back to evaporation ends after being cooled to liquid, and reciprocal above-mentioned circulation, thereby a large amount of heats are transported to colling end by heat source side, because the liquid convection heat transfer rate is fast, thus the thermal conductance of heat-pipe type radiator to pass efficient much higher with respect to common heat abstractor.For the thermal medium that makes the heat pipe colling end cools off sooner, multiple version has been adopted in colling end outside at heat pipe, for example, Chinese patent technology " steel butterfly wing radiator " (patent No. 02125517.2), this butterfly wing radiator comprises a heat pipe and a radiator, radiator is that press casting surface becomes, and has a pedestal and a plurality of parallel radiating fin that goes out from this base extension; This radiating tube is and vertically is fixed in the middle of the radiator, and comprising first end and second end, first end is positioned on the radiator base, and second end is to pass in the middle of the radiating fin on radiator top.The parallel radiating fin that is equipped with on this heat pipe condensation end, radiating fin are that die casting forms, and conduction resistance is big, and heat transfer rate is slow, and volume is big, and heat transfer efficiency is low, and under the condition that satisfies equal heat radiation, the material usage of its radiating fin is more, the manufacturing cost height.Also has a kind of radiator, this heat pipe inwall is the face of cylinder, it adopts the copper mesh liquid sucting core structure, though the working media in its pipe and the contact area of copper mesh have increased, but the contact area of its increase is not directly to contact with tube wall, and the working media in its pipe and the contact area of tube wall do not increase, therefore, this radiator heat transmission efficiency improves not obvious, and the manufacturing cost height.In addition, the copper mesh liquid sucting core structure is placed in the heat pipe also can stop gas flow, also can influence radiating efficiency.
Summary of the invention
In order to overcome the problem that heat transfer efficiency is low, manufacturing cost is high that existing heat-pipe type radiator exists, it is heat radiator dedicated that above-mentioned technical problem to be solved in the utility model provides a kind of electronic component, it can not only improve the heat transfer efficiency of heat-pipe type radiator, and under the condition of equal heat radiation, save material therefor, reduce manufacturing cost.
The technical scheme in the invention for solving the technical problem is: heat radiator dedicated base and the base-mounted one group of heat pipe of comprising of above-mentioned electronic component, difference is, the U-shaped closure tube of above-mentioned each heat pipe for erectting, in the U-shaped closure tube working media is housed, each U-shaped closure tube inwall is equipped with the trapezoid spiral groove, and each U-shaped closure tube upper outside is equipped with the butterfly fin.
Above-mentioned butterfly fin is equipped with hole flanging and some to discharge orifice.
Electronic component of the present utility model is heat radiator dedicated, and to have advantage compared with prior art as follows: the U-shaped closure tube of each heat pipe of this radiator for erectting, its inside pipe wall is equipped with the trapezoid spiral groove, the liquid sucting core structure that the trapezoid spiral groove is constituted, the tube wall surface contact area of working media and this structure increases in its pipe, dispels the heat to the external world through tube wall, butterfly fin.Therefore, the heat conduction resistance of this radiator reduces, and heat transfer rate is accelerated,, the heat transfer efficiency height; Butterfly fin on this radiator is equipped with hole flanging and some to discharge orifice, the contact-making surface increase between hole flanging and heat pipe that falls on the butterfly fin, pair discharge orifice is arranged on the butterfly fin, not only in limited space, strengthened the heat radiation contact area, and the gas flow around the acceleration butterfly fin, can accelerate radiating rate, save material, reduce manufacturing cost; So this radiator is under the condition that satisfies equal heat radiation, the material usage of fin reduces, and not only manufacturing cost reduces, and volume also reduces.
Description of drawings
Fig. 1 is the heat radiator dedicated structural representation of electronic component of the present utility model;
Fig. 2 is that schematic diagram is looked on the left side of Fig. 1;
Fig. 3 is the A-A partial schematic sectional view among Fig. 1;
Fig. 4 is the B-B partial cutaway schematic diagram among Fig. 3;
Fig. 5 is U-shaped closure tube 21 partial schematic diagrams among Fig. 1.
Embodiment
Be described further electronic component of the present utility model is heat radiator dedicated below in conjunction with drawings and Examples.
As Figure 1-3, heat radiator dedicated base 1 and the one group of heat pipe 2 that is contained on the base 1 of comprising of above-mentioned electronic component, difference is, the U-shaped closure tube 21 of above-mentioned each heat pipe 2 for erectting, in the U-shaped closure tube 21 working media is housed, each U-shaped closure tube 21 inwall is equipped with ladder type spiral grooves 23, and each U-shaped closure tube 21 upper outside is equipped with butterfly fin 3.Above-mentioned butterfly fin 3 is equipped with hole flanging 32 and some to discharge orifice 31.
The heat radiation dynamic situation that electronic component of the present utility model is heat radiator dedicated, when pedestal 1 one sides of this radiator contact with semiconductor chip side face, when the electronic component chip heat that produces in service, be delivered to the evaporation ends of U-shaped closure tube 21 bottoms of heat pipe 2 through pedestal 1, the gasification of being heated of working medias in the U-shaped closure tube 21, the working media that has gasified rises to the top condensation end along falling perpendicular U-shaped closure tube, be that heat is delivered to the top condensation end by the bottom evaporation ends, the working media that has a heat is trapezoid spiral groove 23 shapes on the U-shaped closure tube tube wall passes to above-mentioned have hole flanging 32 and some spiral heat dissipation sheets 3 to discharge orifice 31, its heat is taken away by the air of convection current, be liquefied after the working media cooling in each U-shaped closure tube 2, again flow back into evaporation ends from condensation end along tube wall, working media in the U-shaped closure tube 2 is formed the heat exchange reciprocation cycle by liquid state → gaseous state → liquid state, and then realizes the lasting heat radiation to electronic component.
Claims (2)
1, a kind of electronic component is heat radiator dedicated, it comprises base (1) and is contained in one group of heat pipe (2) on the base (1), it is characterized in that: the U-shaped closed endless tube (21) of above-mentioned each heat pipe (2) for erectting, the U-shaped pipe is equipped with working media in (21), each U-shaped closure tube (21) inwall is equipped with ladder type spiral grooves (23), and each U-shaped closure tube (21) upper outside is equipped with butterfly fin (3).
2, electronic component according to claim 1 is heat radiator dedicated, it is characterized in that: above-mentioned butterfly fin (3) is equipped with hole flanging (32) and some to discharge orifice (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520140483 CN2865211Y (en) | 2005-12-30 | 2005-12-30 | Radiator specially for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520140483 CN2865211Y (en) | 2005-12-30 | 2005-12-30 | Radiator specially for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2865211Y true CN2865211Y (en) | 2007-01-31 |
Family
ID=37677662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520140483 Expired - Fee Related CN2865211Y (en) | 2005-12-30 | 2005-12-30 | Radiator specially for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2865211Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102138374B (en) * | 2008-08-27 | 2014-09-03 | 空中客车作业有限公司 | Aircraft signal computer system having a plurality of modular signal computer units |
| CN109470069A (en) * | 2018-11-08 | 2019-03-15 | 广东工业大学 | A kind of heat pipe heat exchanging external member and its manufacturing method |
| CN109844175A (en) * | 2016-10-05 | 2019-06-04 | 洛佩诗公司 | The method of epitaxial deposition reactor and cooling susceptor and substrate with the reflector outside reaction chamber |
-
2005
- 2005-12-30 CN CN 200520140483 patent/CN2865211Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102138374B (en) * | 2008-08-27 | 2014-09-03 | 空中客车作业有限公司 | Aircraft signal computer system having a plurality of modular signal computer units |
| CN109844175A (en) * | 2016-10-05 | 2019-06-04 | 洛佩诗公司 | The method of epitaxial deposition reactor and cooling susceptor and substrate with the reflector outside reaction chamber |
| CN109844175B (en) * | 2016-10-05 | 2021-10-08 | 洛佩诗公司 | Epitaxial deposition reactor with reflector outside reaction chamber and method for cooling susceptor and substrate |
| US11377754B2 (en) | 2016-10-05 | 2022-07-05 | Lpe S.P.A. | Epitaxial deposition reactor with reflector external to the reaction chamber and cooling method of a susceptor and substrates |
| CN109470069A (en) * | 2018-11-08 | 2019-03-15 | 广东工业大学 | A kind of heat pipe heat exchanging external member and its manufacturing method |
| CN109470069B (en) * | 2018-11-08 | 2024-02-09 | 广东工业大学 | Heat pipe heat exchange sleeve and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070131 Termination date: 20131230 |