CN114641188A - Built-in temperature-uniforming plate with heat radiation structure - Google Patents
Built-in temperature-uniforming plate with heat radiation structure Download PDFInfo
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- CN114641188A CN114641188A CN202210333787.8A CN202210333787A CN114641188A CN 114641188 A CN114641188 A CN 114641188A CN 202210333787 A CN202210333787 A CN 202210333787A CN 114641188 A CN114641188 A CN 114641188A
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- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature-uniforming plate with a built-in heat dissipation structure, and belongs to the technical field of heat dissipation of electronic devices. The temperature-uniforming plate comprises an upper sheet body and a lower sheet body, wherein the upper sheet body is sunken to form a convex groove, the upper sheet body is attached to the lower sheet body, so that the upper sheet body, the lower sheet body and the convex groove form a vacuum cavity for placing cooling liquid, and a heat dissipation structure is arranged in the vacuum cavity. According to the invention, the heat dissipation structure is arranged in the vacuum cavity formed by the upper sheet body and the lower sheet body, so that the functions of reinforcing and supporting and increasing the pressure resistance of the temperature equalizing plate are achieved, the heat conductivity of the temperature equalizing plate is increased, and the heat dissipation of an electronic element is accelerated.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic devices, in particular to a temperature-uniforming plate with a built-in heat dissipation structure.
Background
In addition to the miniaturization of the device, the amount of heat generated by the device is also greatly increased, and the amount of heat generated during the operation is considerable. Currently, various electronic heating components are provided with corresponding radiators or heat dissipation devices to maintain their normal operation at an allowable temperature. In addition, heat transfer through a heat pipe or a vapor chamber is also an application of the prior art, and the vapor chamber and the heat pipe have the same principle and provide heat transfer through the cyclic change of gas-liquid phase. The temperature equalizing plate has the characteristics of high heat transfer capacity, high heat transfer rate, light weight, simple structure, multiple purposes and the like, so that the temperature equalizing plate is widely applied to the heat accumulation phenomenon of electronic heating components.
However, in the existing vapor chamber, a mesh-shaped capillary structure is usually embedded in the vapor chamber, which is beneficial to generating a capillary effect in the vapor chamber, but the mesh-shaped structure only has a function of generating the capillary effect, which cannot increase the pressure resistance of the vapor chamber, and the mesh-shaped capillary structure has a narrow contact surface, which is not good for heat dissipation.
Disclosure of Invention
The invention aims to provide a temperature-uniforming plate with a built-in heat dissipation structure, which solves the problems that the existing temperature-uniforming plate is slow in heat dissipation and low in compressive strength. According to the temperature-uniforming plate with the built-in heat dissipation structure, the heat dissipation performance of the temperature-uniforming plate is improved, the pressure resistance of the temperature-uniforming plate is improved, and the temperature-uniforming plate is prevented from being extruded and deformed to influence the heat dissipation effect when being installed. The technical scheme adopted by the invention is as follows:
according to one aspect of the invention, a temperature-uniforming plate with a built-in heat dissipation structure is provided, which comprises an upper plate body and a lower plate body, wherein the lower side of the upper plate body is recessed upwards to form a convex groove, the upper plate body is connected with the lower plate body, a vacuum cavity for placing cooling liquid is formed among the upper plate body, the lower plate body and the convex groove, the heat dissipation structure is arranged in the vacuum cavity, the upper end of the heat dissipation mechanism is connected with the inner side wall of the convex groove, the lower end of the heat dissipation mechanism is connected with the inner side wall of the lower plate body, foamy copper is arranged on the inner side wall of the lower plate body, and a copper mesh is arranged on the outer side wall of the heat dissipation mechanism.
Preferably, the heat dissipation structure is a plurality of heat pipes which are uniformly distributed in the vacuum cavity, one end of each heat pipe is connected with the inner side wall of the corresponding convex groove, and the other end of each heat pipe is connected with the lower sheet body.
Preferably, the inner side walls of the heat pipes are provided with foam copper, and the outer side walls of the heat pipes are connected with the copper mesh.
Preferably, heat radiation structure is the fin, the fin is established to a plurality ofly, and is a plurality of the fin interval sets up in the tongue, the upside of fin with the inside wall of tongue is connected, the downside of fin with the lamellar body is connected down, the left and right sides of fin all is equipped with the copper mesh.
Preferably, the fins are straight fins or S-fins.
Preferably, the convex groove is formed by stamping the upper sheet body.
Preferably, the joint of the upper sheet body and the lower sheet body is welded together by brazing.
Preferably, the width of the convex groove ranges from 10mm to 1000mm, the height ranges from 0.1 mm to 20mm, and the length ranges from 10mm to 1000 mm.
The technical scheme adopted by the invention has the following remarkable effects:
(1) the temperature-uniforming plate comprises an upper plate body and a lower plate body, wherein a convex groove is formed on the upper plate body in a concave mode, the upper plate body is attached to the lower plate body, a vacuum cavity used for containing cooling liquid is formed by the upper plate body, the lower plate body and the convex groove, and a heat dissipation structure is arranged in the vacuum cavity. According to the invention, the heat dissipation structure is arranged in the vacuum cavity formed by the upper sheet body and the lower sheet body, so that the functions of reinforcing and supporting and increasing the pressure resistance of the temperature equalizing plate are achieved, the heat conductivity of the temperature equalizing plate is increased, and the heat dissipation of an electronic element is accelerated.
(2) The heat dissipation structure is a heat pipe, the upper end of the heat pipe is connected with the inner side wall of the convex groove, the lower end of the heat pipe is connected with the lower sheet body, the inner side wall of the heat pipe is provided with foam copper, the outer side wall of the heat pipe is provided with a copper mesh, cooling liquid is added into the heat pipe, the heat pipe not only plays a role in supporting points and enhancing the pressure resistance of the temperature equalization plate, but also is internally provided with an independent water vapor circulation space, and the heat dissipation performance of the temperature equalization plate is enhanced.
(3) The heat dissipation structure is provided with the fins, the vacuum cavity is divided into the plurality of semi-sealed cavities, different flowing cavities are formed, the cavities are independent and related to each other, the upper sides of the fins are connected with the convex grooves, and the lower sides of the fins are connected with the lower sheet body, so that a certain supporting effect is achieved, the heat exchange area is increased through the fins, the cooling capacity of the temperature equalizing plate is enhanced, and the heat dissipation performance is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of embodiment 1 of the present invention;
FIG. 3 is a schematic structural view of embodiment 2 of the present invention;
FIG. 4 is a schematic structural view of embodiment 3 of the present invention;
fig. 5 is a schematic structural view of a comparative example of the present invention.
1-upper sheet body, 2-lower sheet body, 3-convex groove, 4-heat pipe, 5-foam copper, 6-straight fin and 7-S fin.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and preferred embodiments. It should be noted, however, that the numerous details set forth in the description are merely for the purpose of providing the reader with a thorough understanding of one or more aspects of the present invention, which may be practiced without these specific details.
Example 1
As shown in fig. 1-2, the temperature-uniforming plate with a built-in heat dissipation structure according to the present invention comprises an upper plate body and a lower plate body, wherein the lower side of the upper plate body is recessed upwards to form a tongue, the tongue is formed by stamping the upper plate body with a stamping machine, the tongue has a width of 100mm, a height of 10mm and a length of 200 mm. Go up the lamellar body and adopt the braze welding together with lower lamellar body, make and go up the lamellar body, form the vacuum cavity that is used for placing the coolant liquid between lamellar body and the tongue down, be equipped with heat radiation structure in the vacuum cavity, heat radiation mechanism is the heat pipe, the heat pipe is established to a plurality ofly, a plurality of heat pipe evenly distributed is in the vacuum cavity, the one end and the tongue inside wall of heat pipe are connected, the other end and the lower lamellar body of heat pipe are connected, all be equipped with the foamy copper on the inside lateral wall of heat pipe, be connected with the copper mesh on the lateral wall of heat pipe. The lower lamellar body pastes on the source that generates heat and is the hot junction, and the coolant liquid in vacuum cavity and the heat pipe is heated the evaporation, becomes vapour state from liquid state, takes away the heat, and the coolant liquid of vapour state rises the cold junction that contacts the upside of tongue or the upside of heat pipe, becomes liquid from vapour state, falls back to the hot junction, forms the compatible diphase circulation system of steam, and the heat pipe can be used and dispels the heat at low temperature, guarantees that operating temperature is less than vapour liquefaction point time, also can realize carrying out the steam circulation. The one end and the tongue inside wall of heat pipe are connected, the other end and the lower lamellar body inside wall of heat pipe are connected, play the effect of support, have strengthened the compressive capacity of temperature equalization board to outside, and the heat pipe establishes to a plurality ofly, and a plurality of heat pipe evenly distributed have improved the holistic resistance to pressure of temperature equalization board in the vacuum chamber, improve the intensity of temperature equalization board when transportation or installation, avoid the temperature equalization board to receive outside extrusion and take place deformation, influence the heat dispersion of temperature equalization board.
Example 2
As shown in fig. 3, the temperature-uniforming plate with a built-in heat dissipation structure according to the present invention comprises an upper plate and a lower plate, wherein the lower side of the upper plate is recessed upwards to form a tongue, the tongue is formed by stamping the upper plate with a stamping press, and the tongue has a width of 500mm, a height of 20mm and a length of 500 mm. Go up the lamellar body and adopt the braze welding together with lower lamellar body, make and go up the lamellar body, form the vacuum cavity that is used for placing the coolant liquid between lamellar body and the tongue down, be equipped with heat radiation structure in the vacuum cavity, heat radiation structure is straight fin, and straight fin establishes to a plurality ofly, and a plurality of straight fin intervals set up in the tongue, and the upside of straight fin is connected with the inside wall of tongue, and the downside and the lower lamellar body of straight fin are connected, and the left and right sides of straight fin all is equipped with the copper mesh. The straight fin divides the vacuum cavity into a plurality of semi-sealed cavities, different flowing cavities are formed, each cavity is independent and related, the upper side of the straight fin is connected with the convex groove, the lower side of the straight fin is connected with the lower sheet body, a certain supporting effect is achieved, the overall pressure resistance of the uniform temperature plate is also enhanced, when the uniform temperature plate works, cooling liquid is heated and evaporated, liquid backflow can be formed on the inner side wall of the upper side of the straight fin and the inner side wall of the convex groove, the liquid cooling liquid flows back to the hot end along the pipe wall of the straight fin, the damage to the uniform temperature plate caused by long-term dripping of the liquid cooling liquid is reduced, the straight fin increases the heat exchange area, the cooling capacity of the uniform temperature plate is enhanced, and the heat dissipation performance is improved.
Example 3
As shown in fig. 4, this embodiment is substantially the same as embodiment 2, and the only difference is that the fins are S-fins. The S fins increase the heat exchange area of the vacuum cavity in unit length, enhance the heat dissipation capacity, slightly enhance the supporting capacity relative to straight fins, and improve the pressure resistance of the temperature equalizing plate.
A manufacturing method of a temperature-equalizing plate with a built-in heat dissipation structure comprises the following steps:
(1) firstly, stamping an upper sheet body by using a stamping machine to obtain the upper sheet body with a convex groove, and setting specification data of the stamped convex groove on the stamping machine before stamping;
(2) placing a heat dissipation structure in the convex groove, welding one side of the heat dissipation structure with the bottom of the convex groove, enabling the height of the heat dissipation structure to be consistent with the depth of the convex groove, and injecting cooling liquid into the convex groove after the heat dissipation structure and the convex groove are fixed;
(3) the lower sheet body is made into the same size as the upper sheet body, mounting holes are respectively drilled at four corners of the upper sheet body and the lower sheet body, then the mounting holes of the upper sheet body and the mounting holes of the lower sheet body are correspondingly aligned, and the upper sheet body and the lower sheet body are welded together through brazing.
Comparative example:
as shown in fig. 5, in the conventional temperature equalization plate, a mesh-shaped capillary structure is usually embedded in the temperature equalization plate, which is beneficial to generating a capillary effect in the temperature equalization plate, however, the mesh-shaped structure only has a function of generating the capillary effect, which cannot increase the pressure resistance of the temperature equalization plate, and the contact surface of the mesh-shaped capillary structure is narrow, which is not good for the heat dissipation effect.
The pressure resistance and thermal conductivity tests were performed according to the above examples 1 to 3 and comparative example, and the data are shown in table 1 below.
TABLE 1
As can be seen from the above table, the deformation of the upper sheets of examples 1-3 under different forces is smaller than that of the comparative examples, that is, under the same force, the pressure resistance of the temperature equalization plates of examples 1-3 is significantly more outstanding, and the heat pipe in example 1 is point-supported, and is slightly worse than the line-surface support in examples 2 and 3, while examples 2 and 3 are close to each other in terms of pressure resistance and heat conductivity.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (8)
1. The utility model provides an it has heat radiation structure's temperature-uniforming plate which characterized in that to embed: including last lamellar body and lower lamellar body, the downside of going up the lamellar body is upwards sunken to form the tongue, go up the lamellar body and be connected with lower lamellar body, make and go up the lamellar body, form the vacuum cavity that is used for placing the coolant liquid down between lamellar body and the tongue, be equipped with heat radiation structure in the vacuum cavity, heat radiation mechanism's upper end with the inside wall of tongue is connected, heat radiation mechanism's lower extreme with the inside wall of lower lamellar body is connected, be equipped with the foamy copper on the inside wall of lower lamellar body, be equipped with the copper mesh on heat radiation mechanism's the lateral wall.
2. The temperature equalization plate with a built-in heat dissipation structure as claimed in claim 1, wherein: the heat dissipation structure is a plurality of heat pipes which are uniformly distributed in the vacuum cavity, one end of each heat pipe is connected with the inner side wall of the corresponding convex groove, and the other end of each heat pipe is connected with the lower sheet body.
3. The temperature equalization plate with a built-in heat dissipation structure as claimed in claim 2, wherein: the side wall of the interior of the heat pipe is provided with foam copper, and the outer side wall of the heat pipe is connected with the copper mesh.
4. The temperature equalization plate with a built-in heat dissipation structure as claimed in claim 1, wherein: the radiating structure is a fin, the fin is set to be a plurality of, and is a plurality of the fin interval sets up in the tongue, the upside of fin with the inside wall of tongue is connected, the downside of fin with the lamellar body is connected down, the left and right sides of fin all is equipped with the copper mesh.
5. The temperature equalization plate with a built-in heat dissipation structure as claimed in claim 4, wherein: the fins are straight fins or S fins.
6. The temperature equalization plate with a built-in heat dissipation structure as claimed in claim 1, wherein: the convex groove is formed by stamping the upper sheet body.
7. The temperature equalizing plate with a built-in heat dissipating structure of claim 1, wherein: the joint of the upper sheet body and the lower sheet body is welded together by brazing.
8. The temperature equalization plate with a built-in heat dissipation structure as claimed in claim 1, wherein: the width range of the convex groove is 10-1000mm, the height range is 0.1-20mm, and the length range is 10-1000 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210333787.8A CN114641188A (en) | 2022-03-31 | 2022-03-31 | Built-in temperature-uniforming plate with heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210333787.8A CN114641188A (en) | 2022-03-31 | 2022-03-31 | Built-in temperature-uniforming plate with heat radiation structure |
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| CN114641188A true CN114641188A (en) | 2022-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210333787.8A Pending CN114641188A (en) | 2022-03-31 | 2022-03-31 | Built-in temperature-uniforming plate with heat radiation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321980A (en) * | 2023-04-03 | 2023-06-23 | 昆山捷桥电子科技有限公司 | Composite water cooling plate |
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2022
- 2022-03-31 CN CN202210333787.8A patent/CN114641188A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321980A (en) * | 2023-04-03 | 2023-06-23 | 昆山捷桥电子科技有限公司 | Composite water cooling plate |
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