CN101102657A - Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator - Google Patents
Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator Download PDFInfo
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- CN101102657A CN101102657A CNA2007101194235A CN200710119423A CN101102657A CN 101102657 A CN101102657 A CN 101102657A CN A2007101194235 A CNA2007101194235 A CN A2007101194235A CN 200710119423 A CN200710119423 A CN 200710119423A CN 101102657 A CN101102657 A CN 101102657A
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- liquid absorption
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- imbibition
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- 239000007788 liquid Substances 0.000 title claims description 48
- 238000010521 absorption reaction Methods 0.000 title claims description 36
- 239000002131 composite material Substances 0.000 claims abstract description 14
- 238000005213 imbibition Methods 0.000 claims description 53
- 238000010276 construction Methods 0.000 claims description 18
- 238000001704 evaporation Methods 0.000 claims description 9
- 230000008020 evaporation Effects 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000002657 fibrous material Substances 0.000 claims description 4
- 230000009466 transformation Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 24
- 230000005855 radiation Effects 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
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Abstract
In the invention, the wicks with heat absorbing capability are sequentially arranged; one the end part of the wick plate there is a chamfer angle in order to form a fuse well used for holding the solder between adjacent wicks. The invention also relates to a micro slot group wick, which comprises a cap of chamber and a frame; in the chamber, the wicks and composite structure plates are sequentially arranged. The invention also reveals a cooler with heat pip, which comprises cap, frame and wicks mounted in the camber limited by the cap and frame.
Description
Technical field
The present invention relates to a kind of micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat pipe radiator, especially a kind of imbibition chip, imbibition chip and loose structure, fibre structure or the micro slot cluster liquid absorption core of screen net structure combination and integrated heat pipe radiator that adopts above-mentioned imbibition chip and liquid sucting core structure with the molten hole of brace type welding microflute structure.
Background technology
At present, the computer CPU chip because use double-core and the actual caloric value of multi-core technology computer on a declining curve in a period of time, return conventional art and simply satisfy this variation and will bring huge impact the electronic radiation industry of hot as fire once.The development of electronics industry and user benefit demand all demand improving existing plane heat transfer technology urgently, and market demand high efficiency, low energy consumption, low cost, little, the lightweight product of size need the mode with the alternative active heat removal of mode of passive heat radiation.
Figure 11 is the structural representation of existing microflute group radiator, two cover plates 3 and two frames 4 are formed in the cavity, wick is set in the cavity, wick is made up of the imbibition chip 1 that is arranged in order, and any two adjacent imbibition chips 1 are that condensate liquid returns the capillary conduit 2 that is subjected to focus with the capillary gap that upper and lower two cover plates 3 surround.Figure 12 is the structural representation of imbibition chip in the structure shown in Figure 11, for having similar cinefilm sheet metal with holes.Hole in the imbibition chip 1 is the passage 11 of heat pipe phase transformation flow of steam, entity 12 between any two adjacent steam channels 11 of any two imbibition chips 1 is the fluid passages of linking up capillary conduit 4, be again the support of bearing inside and outside pressure simultaneously, the breach 13 on imbibition chip 1 both sides is fluid passages that adjacent two capillary conduits 2 are linked up.By imbibition chip 1 each hole is stacked together relatively, be arranged in the cavity that surrounds by upper and lower cover plate 3, left and right frame 4, just can form a closed cavity through soldering.This closed cavity vacuumizing, the perfusion small amount of liquid can form heat pipe (hot plate) structure with phase-change heat transfer ability, possesses all structural conditions of heat pipe (hot plate) phase-change heat transfer.
Figure 13 is a structure welding schematic diagram shown in Figure 11.Capillary conduit 2 is the passages that guarantee that the hot plate condensate liquid refluxes smoothly, and enough capillary forces need capillary conduit gap enough little.For example, for imbibition chip 1 with square-section, because ordinary circumstance is used for making the imbibition chip thickness D of imbibition chip greater than capillary conduit gap d, be D＞d, sometimes imbibition chip thickness D is several times of capillary conduit gap d, even tens times, when welding, scolder between imbibition chip 1 and the cover plate 3 is easy to be squeezed in the capillary conduit 2, make that packed height is the scolder of h in the capillary conduit 2, when scolder more for a long time, might stop up the capillary conduit, make the condensate liquid of heat pipe can not return the hot junction smoothly, even cause hot plate to lose efficacy.
Summary of the invention
First aspect of the present invention provides a kind of micro slot cluster liquid absorption chip, by the molten hole of brace type welding microflute structure, effectively solve that the capillary conduit is stopped up by scolder easily in the manufacturing of microflute group radiator, make the condensate liquid of heat pipe not return the hot junction smoothly even cause technological deficiency such as hot plate inefficacy.
Second aspect of the present invention provides a kind of micro slot cluster liquid absorption core, by the combination of imbibition chip and loose structure, fibre structure or screen net structure, reduces brace type welding micro slot cluster liquid absorption chip consumption, reduces cost, and raises the efficiency.
The 3rd aspect of the present invention provides a kind of integrated heat pipe radiator, has advantages such as the large and small thermal resistance of area of dissipation, uniform temperature, for realizing that computer substitutes active heat removal with passive heat radiation a kind of choice of technology is provided.
First aspect of the present invention provides a kind of micro slot cluster liquid absorption chip by some embodiment, can form wick by being arranged in order with phase-change heat transfer ability, the end of described imbibition chip is provided with chamfering, makes the molten well that forms the ccontaining scolder of energy between the adjacent imbibition chip.
Trapezoidal shape can be arranged in the end of described imbibition chip, also can be arranged to the boss shape.
On the technique scheme basis, the side wall surface of described molten well is provided with the molten hole of the ccontaining scolder of energy, and further, described molten hole is a cavity.
First aspect of the present invention is provided with chamfering by the end at imbibition chip, and the weld length of its end and cover plate is reduced, and the scolder of discharging during welding is less, and unnecessary scolder is placed in the molten hole, therefore can not stop up the capillary conduit.Further, the side of molten well is provided with molten hole, can prevent more effectively that the capillary conduit from stopping up.
Second aspect of the present invention provides a kind of micro slot cluster liquid absorption core by some embodiment, comprises the cover plate and the frame that limit a cavity, is provided with spaced successively imbibition chip and can be as the composite construction sheet of capillary conduit in the described cavity.
Described composite construction sheet is porous material, fiber material or web material goods.
Second aspect of the present invention proposed the combining structure of wick parts such as a kind of imbibition chip and loose structure, fibre structure, screen net structure, can under the prerequisite that does not influence radiator performance, reduce brace type welding micro slot cluster liquid absorption chip consumption, reach the purpose that reduces cost, raises the efficiency.
Third aspect of the present invention provides a kind of integrated heat pipe radiator by some embodiment, comprise cover plate, frame and be arranged on wick in the cavity that limits by described cover plate and frame, at least two wick unit forming described wick are provided with successively at interval, and the phase transformation steam flow channel of two adjacent groups wick unit is interlaced.
Wherein, also be included in the metallic plate that evaporation ends is connected with described cover plate.
Third aspect of the present invention has proposed a kind of integrated heat pipe radiator, vertically place in the use, have the large and small thermal resistance of area of dissipation, uniform temperature and advantage such as applied widely, both can be used for the heat radiation that evenly distribution divides source of heat release, be suitable for having the heat radiation of concentrating high-power thermal source again, also can be used as the computer cabinet side plate, solve the heat dissipation problem of desktop computer well.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Fig. 1 is the structural representation of brace type welding microflute molten hole structure first embodiment of the present invention;
Fig. 2 is the structural representation of brace type welding microflute molten hole structure second embodiment of the present invention;
Fig. 3 is the structural representation of brace type welding microflute molten hole structure the 3rd embodiment of the present invention;
Fig. 4 is the structural representation of brace type welding microflute molten hole structure the 4th embodiment of the present invention;
Fig. 5 is the structural representation of micro slot cluster liquid absorption core one embodiment of the present invention;
Fig. 6 is the structural representation of another embodiment of micro slot cluster liquid absorption core of the present invention;
Fig. 7 is the structural representation of integrated heat pipe radiator of the present invention;
Fig. 8 is a kind of application structure of integrated heat pipe radiator shown in Figure 7;
Fig. 9 is used for a kind of enforcement structure of LED road lamp cooling for integrated heat pipe radiator of the present invention;
Figure 10 has the enforcement structure chart of the integrated heat pipe radiator in co-evaporated chamber for the present invention;
Figure 11 is the structural representation of existing microflute group radiator;
Figure 12 is the structural representation of imbibition chip in the structure shown in Figure 11;
Figure 13 is a structure welding schematic diagram shown in Figure 11.
Description of reference numerals:
The 1-imbibition chip; 2-capillary conduit; The 3-cover plate;
The 4-frame; The 11-passage; 14-composite construction sheet;
21-melts well; The molten hole of 22-; The 5-wick;
The 10-integrated heat pipe radiator; The 20-metallic plate; The 30-LED street lamp.
Embodiment
First embodiment
Fig. 1 is the structural representation of micro slot cluster liquid absorption chip first embodiment of the present invention.The imbibition chip 1 that is arranged in order is formed the wick of microflute group radiator, and auxilliary cover plate and frame just can form the microflute group radiator.Present embodiment imbibition chip 1 has the square-section, any two adjacent imbibition chips 1 are that condensate liquid returns the capillary conduit 2 that is subjected to focus with the capillary gap that upper and lower two cover plates 3 surround, the side of imbibition chip 1 is provided with chamfering, forms molten well (hole) structure of brace type welding microflute that a kind of imbibition chip end is trapezoidal shape.Particularly, for the imbibition chip 1 of square-section, therefore its trapezoidal shape end portion thickness has formed the molten well 21 that is used for ccontaining scolder and has big volume less than the thickness at middle part in the imbibition chip end, can effectively avoid scolder to stop up capillary conduit 2.The molten well construction that is appreciated that micro slot cluster liquid absorption chip of the present invention is can stop up the trap of capillary conduit to prevent scolder by ccontaining excess solder in welding process.
As shown in Figure 1, compare with the technical scheme of the straight end of prior art imbibition chip, the trapezoidal shape end is reduced the imbibition chip 1 and the contact length of cover plate 3, thus the imbibition chip scolder of being discharged during with the cover plate welding directly the end imbibition chip to lack.Simultaneously, the distance H of adjacent two ends is greater than capillary conduit gap d, when the scolder of equal volume is discharged in welding, trapezoidal molten well 21 makes the straight end imbibition chip low (dotted line is the bead height of straight end imbibition chip among Fig. 1) of the bead height that enters the capillary conduit, therefore can not stop up the capillary conduit.
Second embodiment
Fig. 2 is the molten well construction of another kind of shape for the structural representation of micro slot cluster liquid absorption chip second embodiment of the present invention.Present embodiment imbibition chip 1 has the square-section, and the chamfering of imbibition chip 1 is arranged to asymmetric boss form, and the imbibition chip end is to lopsidedness.By these asymmetric molten well 21 structures, the scolder of being discharged during welding is discharged to the same side basically, and scolder is evenly distributed in each molten well, reduces the maximum height that enters capillary conduit scolder under limited structural condition as far as possible.
The 3rd embodiment
Fig. 3 is the structural representation of micro slot cluster liquid absorption chip the 3rd embodiment of the present invention, and present embodiment is on the first embodiment technical scheme basis, and the side of molten well is provided with molten hole 22.Consider that in the actual use, capillary conduit gap d is very little, as less than 0.02mm.Under so little gap situation, a small amount of melting solder still might be climbed up from molten well and be stopped up the capillary conduit.Therefore present embodiment by on molten well 21 side wall surfaces, be provided with can ccontaining a small amount of scolder molten hole 22, can prevent more effectively that the capillary conduit from stopping up.The molten hole structure that is appreciated that micro slot cluster liquid absorption chip of the present invention is the structure cavity of further ccontaining scolder, and the version of this cavity can be varied, as semi-circular, and triangle, or the usual recess shapes that adopts of those skilled in the art.
The 4th embodiment
Fig. 4 is the molten hole structure of another kind of shape for the structural representation of micro slot cluster liquid absorption chip the 4th embodiment of the present invention.Compare with Fig. 2, structure shown in Figure 3, the chamfering of present embodiment imbibition chip 1 side is arranged to asymmetrical form, the molten hole 22 that has than small curvature radius is arranged on the side wall surface of molten well 21, by asymmetric molten well construction, the scolder of being discharged when making welding is contained in the molten hole 22 of a side as far as possible, avoids the obstruction of capillary conduit to greatest extent.
Fig. 5 is the structural representation of micro slot cluster liquid absorption core one embodiment of the present invention, micro slot cluster liquid absorption core is arranged in the cavity of being made up of cover plate 3 and frame 4, by spaced imbibition chip 1 and composite construction sheet 14 are formed successively, in the space that surrounds with upper and lower two cover plates 3 between the adjacent imbibition chip 1 composite construction sheet 14 is set, utilizes the pore space structure of composite construction sheet 14 to return the capillary conduit that is subjected to focus as condensate liquid.In the present embodiment, the structure of imbibition chip 1 can adopt traditional square-section, also can adopt above-mentioned Fig. 1～molten well (hole) structure of brace type welding microflute shown in Figure 4.
Fig. 6 is the structural representation of another embodiment of micro slot cluster liquid absorption core of the present invention, be with the difference of structure shown in Figure 5, be provided with one or more composite construction sheets 14 between two or two groups of imbibition chips 1, utilize the pore space structure of composite construction sheet 14 to return the capillary conduit that is subjected to focus as condensate liquid.
In Fig. 5 and technical scheme shown in Figure 6, composite construction sheet 14 can be made by porous material, fiber material or web material, changes material self and has pore space structure, and therefore can form condensate liquid returns the capillary conduit that is subjected to focus.Be used for the gravitational field heat dissipation environment, the combining structure of wick parts such as present embodiment imbibition chip and loose structure, fibre structure, screen net structure can be under the prerequisite that does not influence radiator performance, reduce brace type welding micro slot cluster liquid absorption chip consumption, reach the purpose that reduces cost, raises the efficiency.Being provided with of imbibition chip can increase hot plate intensity and rigidity, can also equably the condensate liquid that relies on gravity to return be distributed in the hot plate evaporation ends.
Fig. 7 is the structural representation of integrated heat pipe radiator of the present invention, comprise cover plate 3 and frame 4, wick 5 is arranged on by last, in the cavity that lower cover 3 and annular peripheral frame 4 limit, wick 5 is made up of four groups of wick unit, wick unit A and wick unit B are provided with successively at interval, the passage 11 of two adjacent groups wick unit phase transformation flow of steam interlaces, form the wick combining structure, and each wick unit adopts above-mentioned Fig. 5 and micro slot cluster liquid absorption core shown in Figure 6, and imbibition chip wherein adopts above-mentioned Fig. 1～molten well (hole) structure of brace type welding microflute shown in Figure 4.In actual use, can directly connect between wick unit A and the wick unit B, also can adopt by composite construction to connect, composite construction can be porous material, fiber material or web material.
Fig. 8 is a kind of application structure of integrated heat pipe radiator shown in Figure 7,4 groups of integrated heat pipe radiators 10 link together by the metallic plate 20 of bottom, connected mode can be welding, as soldering, also can adopt other modes affixed, the top of integrated heat pipe radiator 10 also can use connectors such as plate, rod fixing to strengthen overall structure rigidity in addition.In actual use, because integrated heat pipe radiator is vertically placed, therefore its inner wick can adopt two kinds of versions, the wick that connects metallic plate one end adopts has Fig. 1～the molten wick of cheating structure of brace type welding microflute of the present invention shown in Figure 4, the wick at other positions can adopt conventional supporting construction, as dull and stereotyped punching press have a steam channel supporting construction etc., concrete structure can be referring to Chinese patent ZL200620115025.7 " microchannel-group integrated heat-pipe radiator ".Because the wick difficulty of processing of the molten hole of brace type welding microflute structure is bigger, so this set can be saved wide variety of materials and processing cost on the basis that guarantees radiating effect.
Integrated heat pipe radiator of the present invention is used for evenly distribution and divides the heat radiation of source of heat release that special advantage is arranged.For example be applied in the LED road lamp cooling.Fig. 9 is used for a kind of enforcement structure of LED road lamp cooling for integrated heat pipe radiator of the present invention, during use, 3～5 watts every LED street lamps 30 (evenly distributing) are mounted on the metallic plate 20, the heat that LED street lamp 30 produces is delivered to the evaporation ends of integrated heat pipe radiator 10 by metallic plate 20, working medium heat absorption evaporation is also flowed in the vacuum chamber of integrated heat pipe radiator 10, emit latent heat at the condensation end that temperature is lower, be condensed into liquid, liquid returns evaporation ends and reuptakes heat under the effect of wick capillary force, begin new diabatic process, be a kind of effective passive radiating mode.This structure of present embodiment is owing to adopt metallic plate 20 to be connected with integrated heat pipe radiator 10 solderings, metallic plate 20 is convenient to mount with LED street lamp 30, help transmitting heat to the evaporation ends of integrated heat pipe radiator, also has greater advantage even therefore under small size, transmit heat, integrated heat pipe radiator provides greatly and effectively area of dissipation simultaneously, and the integral heat sink effect is significantly improved.
In addition, with the side plate of integrated heat pipe radiator of the present invention, can solve the heat dissipation problem of desktop computer well as computer cabinet.With conventional heat pipe the heat that thermals source such as cpu chip, video card produce is guided on the cabinet side board, utilized the enough area of dissipations of integrated heat pipe radiator of the present invention, little thermal resistance and uniform temperature heat can be dissipated the radiating efficiency height.Compare with traditional employing active heat removal (fan heat radiation) mode, advantages such as this application of the present invention has high efficiency, low energy consumption, low cost, size is little and in light weight are for realizing that computer substitutes active heat removal with passive heat radiation a kind of feasible choice of technology is provided.
Figure 10 has the enforcement structure chart of the integrated heat pipe radiator in co-evaporated chamber for the present invention, the wherein passage 11 of the flow of steam setting that interlaces in the wick 5 forms a whole evaporation cavity.The largest benefit of this version is that as long as base plate of radiator 20 (evaporating surface) is gone up any point contact thermal source, steam can distribute, condensation in all hot plate fins, be specially adapted to have the heat radiation of concentrating high-power thermal source.
It should be noted that at last: above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (9)
1. a micro slot cluster liquid absorption chip can be formed the wick with phase-change heat transfer ability by being arranged in order, and it is characterized in that the end of described imbibition chip is provided with chamfering, makes the molten well that forms the ccontaining scolder of energy between the adjacent imbibition chip.
2. micro slot cluster liquid absorption chip as claimed in claim 1 is characterized in that trapezoidal shape is arranged in the end of described imbibition chip.
3. micro slot cluster liquid absorption chip as claimed in claim 1 is characterized in that the boss shape is arranged in the end of described imbibition chip.
4. as the described micro slot cluster liquid absorption chip of arbitrary claim in the claim 1～3, it is characterized in that the side wall surface of described molten well is provided with the molten hole of the ccontaining scolder of energy.
5. micro slot cluster liquid absorption chip as claimed in claim 4 is characterized in that, described molten hole is a cavity.
6. micro slot cluster liquid absorption core that adopts the described micro slot cluster liquid absorption chip of arbitrary claim in the claim 1～5, comprise the cover plate and the frame that limit a cavity, it is characterized in that, be provided with spaced successively imbibition chip and can be in the described cavity as the composite construction sheet of capillary conduit.
7. micro slot cluster liquid absorption core as claimed in claim 6 is characterized in that, described composite construction sheet is porous material, fiber material or web material goods.
8. an employing is as the integrated heat pipe radiator of micro slot cluster liquid absorption chip as described in arbitrary claim in the claim 1～5, comprise cover plate, frame and be arranged on wick in the cavity that limits by described cover plate and frame, it is characterized in that, at least two wick unit forming described wick are provided with successively at interval, and the phase transformation steam flow channel of two adjacent groups wick unit is interlaced.
9. integrated heat pipe radiator as claimed in claim 8 is characterized in that, also is included in the metallic plate that evaporation ends is connected with described cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101194235A CN100513975C (en) | 2007-07-24 | 2007-07-24 | Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101194235A CN100513975C (en) | 2007-07-24 | 2007-07-24 | Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101102657A true CN101102657A (en) | 2008-01-09 |
| CN100513975C CN100513975C (en) | 2009-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101194235A Expired - Fee Related CN100513975C (en) | 2007-07-24 | 2007-07-24 | Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| CN106856645A (en) * | 2015-12-09 | 2017-06-16 | 富葵精密组件(深圳)有限公司 | Radiator structure and preparation method thereof |
| CN108323099A (en) * | 2018-01-16 | 2018-07-24 | 南昌大学 | Finned heat pipe coupling radiator |
| CN110958814A (en) * | 2019-12-09 | 2020-04-03 | 华南理工大学 | Flexible phase-change heat transfer cooler for server |
| CN111644719A (en) * | 2020-04-21 | 2020-09-11 | 托伦斯半导体设备启东有限公司 | Brazing structure of cooling plate and manufacturing process thereof |
| CN114916193A (en) * | 2022-04-24 | 2022-08-16 | 大连保税区金宝至电子有限公司 | Method for counter-gravity liquid delivery and heat sink |
-
2007
- 2007-07-24 CN CNB2007101194235A patent/CN100513975C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856645A (en) * | 2015-12-09 | 2017-06-16 | 富葵精密组件(深圳)有限公司 | Radiator structure and preparation method thereof |
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| CN108323099A (en) * | 2018-01-16 | 2018-07-24 | 南昌大学 | Finned heat pipe coupling radiator |
| CN108323099B (en) * | 2018-01-16 | 2024-03-29 | 南昌大学 | Fin type heat pipe coupling radiator |
| CN110958814A (en) * | 2019-12-09 | 2020-04-03 | 华南理工大学 | Flexible phase-change heat transfer cooler for server |
| CN110958814B (en) * | 2019-12-09 | 2024-05-03 | 广州智冷节能科技有限公司 | Flexible phase-change heat transfer cooler for server |
| CN111644719A (en) * | 2020-04-21 | 2020-09-11 | 托伦斯半导体设备启东有限公司 | Brazing structure of cooling plate and manufacturing process thereof |
| CN114916193A (en) * | 2022-04-24 | 2022-08-16 | 大连保税区金宝至电子有限公司 | Method for counter-gravity liquid delivery and heat sink |
| CN114916193B (en) * | 2022-04-24 | 2024-01-09 | 大连保税区金宝至电子有限公司 | Method for conveying liquid against gravity and heat dissipating device |
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| CN100513975C (en) | 2009-07-15 |
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Effective date of registration: 20100629 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Address before: 116023, Xinghai Square, B3 District, Liaoning, Dalian, Xinghai 4, room 1501 Patentee before: Yang Hongwu |
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Owner name: DALIAN TERMALWAY HEAT TRANSFER TECHNOLOGY CO., LTD Effective date: 20130416 |
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Effective date of registration: 20130416 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Patentee after: Dalian Sanwei Heat Transfer Technology Co., Ltd. Address before: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee before: Dalian Termalway Technology Co., Ltd. |
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Granted publication date: 20090715 Termination date: 20160724 |
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| CF01 | Termination of patent right due to non-payment of annual fee |