CN116321980A - Composite water cooling plate - Google Patents
Composite water cooling plate Download PDFInfo
- Publication number
- CN116321980A CN116321980A CN202310345201.4A CN202310345201A CN116321980A CN 116321980 A CN116321980 A CN 116321980A CN 202310345201 A CN202310345201 A CN 202310345201A CN 116321980 A CN116321980 A CN 116321980A
- Authority
- CN
- China
- Prior art keywords
- upper cover
- copper
- cooling
- copper net
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 claims abstract description 86
- 239000010949 copper Substances 0.000 claims abstract description 86
- 239000000110 cooling liquid Substances 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 10
- 239000002826 coolant Substances 0.000 abstract description 9
- 239000000498 cooling water Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses a composite water cooling plate, which relates to the technical field of water cooling plates and comprises a cooling assembly and an upper cover convex hull, wherein the cooling assembly comprises a lower cover, a first copper net, copper columns, a second copper net, a temperature equalizing plate upper cover and first cooling liquid, the temperature equalizing plate upper cover is arranged at the edge of the surface of the lower cover, the first cooling liquid is stored in the first copper net and the second copper net, and the upper cover convex hull is arranged on the surface of the temperature equalizing plate upper cover. This compound water-cooling board, samming board upper cover and lower cover form a vacuum cavity, the heat that produces when IGBT module operation is conducted through lower cover, first copper net, copper post, second copper net and first coolant liquid, until heat conduction to samming board upper cover convex closure department on upper cover surface, the upper cover convex closure soaks inside the second coolant liquid, utilize the second coolant liquid of outer loop to take away the heat on upper cover convex closure surface, wherein because first copper net, second copper net are the silk screen form, greatly reduced water-cooling board weight in the time of keeping heat conduction from this.
Description
Technical Field
The invention relates to the technical field of water cooling plates, in particular to a composite water cooling plate.
Background
The electric vehicle inverter often needs the water-cooling board to dispel the heat, and the water-cooling board is through evenly distributed a plurality of entity copper post on entity copper spare, and the copper post absorbs the heat that the inverter gives off, and the external circulation cold liquid absorbs copper post heat and brings to realize the cooling heat dissipation to the electric vehicle inverter.
The patent document with the application number of CN201310225575.9 discloses a water cooling plate, the water cooling plate is divided into two plane water tanks from top to bottom, the front end of an upper water tank is provided with a distribution structure for spreading cooling level on the plane of the upper water tank, the front end of a lower water tank is provided with a collection structure for collecting cooling water on the plane of the lower water tank, the rear end of the upper water tank is communicated with the rear end of the lower water tank through a circulation structure and used for spreading the cooling water of the upper water tank on the plane of the lower water tank, the side surface of the water cooling plate is provided with a water inlet and a water outlet, the water inlet is connected with the distribution structure, the water outlet is connected with the collection structure, the embodiment of the invention provides a cold water plate, a waterway of the water cooling plate is the plane of the whole water cooling plate, the water tank plane of the whole water cooling plate is spread with the cooling water, so that the heat exchange area of the water cooling plate and the cooling water is maximum, and the heat dissipation effect is good.
Water-cooled panels similar to the above application currently suffer from the following disadvantages:
the existing water cooling plate needs to bring heat generated by the inverter IGBT into an external circulating cooling water body, the water cooling plate is a solid copper plate and a copper column, and is a conductive heat dissipation mode in practice, so that the heat conduction efficiency is low, the weight is increased, and the cruising ability is not improved.
Accordingly, in view of the above, research and improvement have been made on the conventional structure and the conventional defects, and a composite water-cooling plate has been proposed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a composite water cooling plate, which solves the problems in the prior art.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a compound water-cooling board, includes cooling module and upper cover convex closure, cooling module includes lower cover, first copper mesh, copper column, second copper mesh, samming board upper cover and first coolant liquid, the surface edge of lower cover is provided with samming board upper cover, and samming board upper cover's inner wall bottom welding has first copper mesh, the fixed surface of first copper mesh has the copper column, the top of copper column is fixed with the second copper mesh, the inside injection of first copper mesh, second copper mesh has first coolant liquid, the upper cover convex closure sets up in samming board upper cover's surface.
Further, the upper cover and the upper cover convex hull of the temperature equalization plate are of an integrated structure, and the upper cover convex hull is formed by stamping.
Further, the outer part of the upper cover convex hull is soaked with second cooling liquid.
Furthermore, the upper cover convex hull can be formed by forging.
Further, the upper cover convex hull is of an arc-shaped structure.
Further, the second cooling liquid is external circulating water.
Further, the lower cover and the upper cover of the temperature equalization plate form a vacuum cavity through welding.
Further, the first copper net, the second copper net and the upper cover of the temperature equalization plate are welded together through sintering.
Further, the weight of the water cooling plate is reduced.
The invention provides a composite water-cooling plate, which has the following beneficial effects:
this compound water-cooling board, samming board upper cover and lower cover form a vacuum cavity, first copper net, the copper post, second copper net and first coolant liquid all are located this cavity, the heat that produces when IGBT module operation conducts through lower cover, first copper net, the copper post, second copper net and first coolant liquid, until heat conduction reaches the upper cover convex closure department on samming board upper cover surface, the upper cover convex closure soaks inside the second coolant liquid, utilize the second coolant liquid of outer loop to take away the heat on upper cover convex closure surface, wherein because first copper net, second copper net are silk screen form, greatly reduced water-cooling board weight when keeping heat conduction from this.
Drawings
FIG. 1 is a schematic diagram of the front view of a composite water-cooled plate according to the present invention;
FIG. 2 is an exploded perspective view of a cooling assembly of a composite water-cooled panel according to the present invention;
FIG. 3 is a schematic perspective view of an external circulation box of a composite water-cooled plate according to the present invention;
fig. 4 is a schematic diagram of a cross-sectional structure of an upper cover of a temperature equalization plate of a composite water-cooling plate according to the present invention.
In the figure: 1. a cooling assembly; 101. a lower cover; 102. a first copper mesh; 103. copper columns; 104. a second copper mesh; 105. a cover on the temperature equalizing plate; 106. a first cooling liquid; 2. an upper cover convex hull; 3. and a second cooling liquid.
Description of the embodiments
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
As shown in fig. 1 to 4, the present invention provides the following technical solutions: the composite water cooling plate comprises a cooling assembly 1 and an upper cover convex hull 2, wherein the cooling assembly 1 comprises a lower cover 101, a first copper net 102, copper columns 103, a second copper net 104, an upper cover 105 of the temperature equalizing plate and first cooling liquid 106, the upper cover 105 of the temperature equalizing plate is arranged at the surface edge of the lower cover 101, the first copper net 102 is welded at the bottom of the inner wall of the upper cover 105 of the temperature equalizing plate, the copper columns 103 are fixed on the surface of the first copper net 102, the second copper net 104 is fixed on the top of the copper columns 103, the first cooling liquid 106 is injected into the first copper net 102 and the second copper net 104, the upper cover convex hull 2 is arranged on the surface of the upper cover 105 of the temperature equalizing plate, the upper cover 105 and the upper cover convex hull 2 are of an integrated structure, the upper cover convex hull 2 is formed by stamping, the second cooling liquid 3 is soaked outside the upper cover convex hull 2, the upper cover convex hull 2 is of an arc-shaped structure, the second cooling liquid 3 is outside circulating water, the lower cover 101 and the temperature equalizing plate are formed by welding the first copper net 105 and the second copper net 104 together, and the upper cover 105 are welded together by the first copper net 104 and the second copper net 104;
the method specifically comprises the following steps that a first copper mesh 102 and a second copper mesh 104 are welded in an inner cavity of an upper cover 105 of a temperature equalization plate from bottom to top, the first copper mesh 102 and the second copper mesh 104 are connected through copper columns 103, the upper cover 105 of the temperature equalization plate is bonded with a lower cover 101 and sealed, then the processing is completed, the upper cover 105 of the temperature equalization plate and the lower cover 101 form a vacuum cavity, heat generated during operation of an IGBT module is conducted through the lower cover 101, the first copper mesh 102, the copper columns 103, the second copper mesh 104 and a first cooling liquid 106 until the heat is conducted to an upper cover convex hull 2 on the surface of the upper cover 105 of the temperature equalization plate, the upper cover convex hull 2 is soaked in the second cooling liquid 3, the second cooling liquid 3 circulates outside and takes away the heat on the surface of the upper cover convex hull 2, and the first copper mesh 102 and the second copper mesh 104 are in a silk-screen shape, and the first cooling liquid 106 is injected as a medium, so that the weight can be reduced, the weight of the water cooling plate is kept, the heat is greatly reduced, and the heat conducting weight is also the upper cover convex hull 2 can be welded or the heat radiating fin can be welded on the surface of a part.
In summary, as shown in fig. 1-4, when the composite water-cooling plate is used, first, the first copper mesh 102 and the second copper mesh 104 are welded in the inner cavity of the upper cover 105 of the temperature-equalizing plate from bottom to top, the first copper mesh 102 and the second copper mesh 104 are connected through the copper column 103, the copper column 103 plays a supporting role, the upper cover 105 of the temperature-equalizing plate is bonded and sealed with the lower cover 101 to finish processing, the upper cover 105 of the temperature-equalizing plate and the lower cover 101 form a vacuum cavity, heat generated during operation of the IGBT module is conducted through the lower cover 101, the first copper mesh 102, the copper column 103, the second copper mesh 104 and the first cooling liquid 106 until the heat is conducted to the upper cover convex hull 2 on the surface of the upper cover 105 of the temperature-equalizing plate, the upper cover convex hull 2 is soaked in the second cooling liquid 3, the second cooling liquid 3 circulates outside to take away the heat on the surface of the upper cover convex hull 2, and the first copper mesh 102 and the second copper mesh 104 are injected into the first screen, and the first cooling liquid 106 is used as a heat-conducting medium, and the weight of the heat-conducting plate can be greatly reduced.
The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (4)
1. The utility model provides a compound water-cooling board, includes cooling module (1) and upper cover convex closure (2), its characterized in that: the cooling assembly (1) comprises a lower cover (101), a first copper net (102), copper columns (103), a second copper net (104), a temperature equalization plate upper cover (105) and a first cooling liquid (106), the surface edge of the lower cover (101) is provided with the temperature equalization plate upper cover (105), the first copper net (102) is welded at the bottom of the inner wall of the temperature equalization plate upper cover (105), the copper columns (103) are fixed on the surface of the first copper net (102), the second copper net (104) is fixed at the top of the copper columns (103), the first cooling liquid (106) is injected into the first copper net (102) and the second copper net (104), the upper cover convex hull (2) is arranged on the surface of the temperature equalization plate upper cover (105), the temperature equalization plate upper cover (105) and the upper cover convex hull (2) are of an integrated structure, the upper cover convex hull (2) is formed by stamping, the second cooling liquid (3) is soaked in the outer part of the upper cover convex hull (2), and the upper cover convex hull (2) can be formed on the surface of an arc-shaped part or an arc-shaped part.
2. A composite water cooled panel as claimed in claim 1, wherein: the second cooling liquid (3) is external circulating water.
3. A composite water cooled panel as claimed in claim 1, wherein: the lower cover (101) and the upper cover (105) of the temperature equalization plate form a vacuum cavity through welding.
4. A composite water cooled panel as claimed in claim 1, wherein: the first copper mesh (102), the second copper mesh (104) and the upper cover (105) of the temperature equalization plate are welded together through sintering.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310345201.4A CN116321980A (en) | 2023-04-03 | 2023-04-03 | Composite water cooling plate |
| CN202311724118.4A CN117881146A (en) | 2023-04-03 | 2023-12-14 | Multiple cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310345201.4A CN116321980A (en) | 2023-04-03 | 2023-04-03 | Composite water cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116321980A true CN116321980A (en) | 2023-06-23 |
Family
ID=86818644
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310345201.4A Pending CN116321980A (en) | 2023-04-03 | 2023-04-03 | Composite water cooling plate |
| CN202311724118.4A Pending CN117881146A (en) | 2023-04-03 | 2023-12-14 | Multiple cooling system |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311724118.4A Pending CN117881146A (en) | 2023-04-03 | 2023-12-14 | Multiple cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN116321980A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060098411A1 (en) * | 2004-11-11 | 2006-05-11 | Taiwan Microloops Corp. | Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same |
| CN103281890A (en) * | 2013-06-07 | 2013-09-04 | 武汉洛芙科技有限公司 | Water cooling plate |
| CN106655710A (en) * | 2015-10-29 | 2017-05-10 | 台达电子企业管理（上海）有限公司 | Power conversion device |
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN207516905U (en) * | 2017-07-14 | 2018-06-19 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating device |
| TW201833506A (en) * | 2017-03-13 | 2018-09-16 | 謝基生 | Diffusion method of small area cold surface and its flat cold plate |
| CN214676286U (en) * | 2021-03-31 | 2021-11-09 | 昆山奢茂电子科技有限公司 | Vacuum cavity temperature equalizing plate |
| CN114641188A (en) * | 2022-03-31 | 2022-06-17 | 深圳市嘉和达管业有限公司 | Built-in temperature-uniforming plate with heat radiation structure |
| CN217904961U (en) * | 2022-07-21 | 2022-11-25 | 苏州鸿利特机械有限公司 | Water-cooling protective housing of controller |
-
2023
- 2023-04-03 CN CN202310345201.4A patent/CN116321980A/en active Pending
- 2023-12-14 CN CN202311724118.4A patent/CN117881146A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060098411A1 (en) * | 2004-11-11 | 2006-05-11 | Taiwan Microloops Corp. | Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same |
| CN103281890A (en) * | 2013-06-07 | 2013-09-04 | 武汉洛芙科技有限公司 | Water cooling plate |
| CN106655710A (en) * | 2015-10-29 | 2017-05-10 | 台达电子企业管理（上海）有限公司 | Power conversion device |
| TW201833506A (en) * | 2017-03-13 | 2018-09-16 | 謝基生 | Diffusion method of small area cold surface and its flat cold plate |
| CN207516905U (en) * | 2017-07-14 | 2018-06-19 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating device |
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN214676286U (en) * | 2021-03-31 | 2021-11-09 | 昆山奢茂电子科技有限公司 | Vacuum cavity temperature equalizing plate |
| CN114641188A (en) * | 2022-03-31 | 2022-06-17 | 深圳市嘉和达管业有限公司 | Built-in temperature-uniforming plate with heat radiation structure |
| CN217904961U (en) * | 2022-07-21 | 2022-11-25 | 苏州鸿利特机械有限公司 | Water-cooling protective housing of controller |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117881146A (en) | 2024-04-12 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20230623 |