CN207516905U - A kind of bus type heat pipe type water-cooling heat radiating device - Google Patents
A kind of bus type heat pipe type water-cooling heat radiating device Download PDFInfo
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- CN207516905U CN207516905U CN201720861258.XU CN201720861258U CN207516905U CN 207516905 U CN207516905 U CN 207516905U CN 201720861258 U CN201720861258 U CN 201720861258U CN 207516905 U CN207516905 U CN 207516905U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model is related to a kind of bus type heat pipe type water-cooling heat radiating devices, the heat concentration of memory bar, CPU, north and south bridge chip is transmitted in the cooled plate of cooled plate radiating subassembly by memory bar termal conductor module, CPU termal conductor modules, north bridge chips termal conductor module, South Bridge chip termal conductor module, then heat is taken away by cooled plate and outer circulation water, it is radiated using centralization and directly radiated to heating element, radiating efficiency is high, cooling system structure is simple, stablize, reliability is high, noiseless, low energy consumption.The manufacturing method of the utility model bus type heat pipe type water-cooling heat radiating system has the characteristics of simple for process, production cost is low, suitable for mass, large-scale production.
Description
Technical field
The utility model is related to heat pipe heat radiation field, more particularly to a kind of bus type heat pipe type water-cooling heat radiating device.
Background technology
At present, largely using Novel machine rack server and blade server in data center, in the process of operation
In can generate a large amount of heat.Existing server radiating mode has the air-cooled and direct liquid cooling type of cooling, but with server
Heat flow density improves year by year, and traditional wind-cooling heat dissipating has been unable to meet the radiating requirements of server, and energy consumption is big, resource utilization
Low, noise is big and tropical island effect protrudes；Since liquid is more much larger than the specific heat of air, radiating rate is also far longer than air, because
This refrigerating efficiency is far above wind-cooling heat dissipating, while eliminates fan, can also achieve the effect that reduce noise.But direct liquid cooling
Mode is that each heating element directly cools down to server internal, this proposes one for the sealing of each pipeline and greatly chooses
War, reliability is low and not easy care.Therefore, existing two kinds of radiating modes have its limitation.
Chinese patent application (application publication number：106125872 A of CN) disclose that " a kind of bus type heat pipe type water cooling dissipates
Thermal ", water-cooling heat radiating system is by the heat sink component of bus, CPU termal conductor modules, memory bar termal conductor module, South Bridge chip warm
Conducting subassembly, north bridge chips termal conductor module and cooled plate radiating subassembly composition, the CPU termal conductor modules, memory bar heat pass
Guide assembly, South Bridge chip termal conductor module, north bridge chips termal conductor module are fixed on heat sink group of bus by respective fixed block
It is on part bus is heat sink, CPU, memory bar, north and south bridge chip heat transfer is heat sink to the bus of the heat sink component of bus, then through grafting
Water cooling plate heat pipe give the heat sink heat transfer of bus to cooled plate radiating subassembly, realize that CPU, memory bar, north and south bridge chip dissipate
Heat.Above-mentioned bus type heat pipe type water-cooling heat radiating system structure is complex, miniaturization and light-weighted development with server
Trend, it is desirable that cooling system also further to minimize and lightweight.
Utility model content
For the technical problems in the prior art, the purpose of this utility model is：A kind of bus type heat pipe type is provided
Water-cooling heat radiating device, it is easy for installation, heat dissipation is efficient, noiseless, reliability is high, maintenance is simple, solve existing server cooling
The above problem existing for heat dissipation technology.
In order to achieve the above object, the utility model adopts the following technical solution：
A kind of bus type heat pipe type water-cooling heat radiating device, including cooled plate radiating subassembly, CPU termal conductor modules, memory bar
Termal conductor module, South Bridge chip termal conductor module and north bridge chips termal conductor module；
CPU termal conductor modules, the CPU connected including CPU heat pipes and through CPU heat pipes is heat sink；
Memory bar termal conductor module, including one piece of memory bar heat-conductive assembly fixed block and through the connection of memory bar heat pipe
Several groups of memory bar thermally conductive sheets, memory bar thermally conductive sheet by post respectively memory bar thermally conductive sheet matrix that one piece of memory bar heat conduction is pasted and
Memory bar thermally conductive sheet fixture block forms, and memory bar thermally conductive sheet matrix and memory bar thermally conductive sheet fixture block are connected by screw and are fixed as one
It is whole, form memory bar thermally conductive sheet；
South Bridge chip termal conductor module, the south bridge heat including one piece of south bridge fixed block and through the connection of South Bridge chip heat pipe
It is heavy；
North bridge chips termal conductor module, the north bridge heat including one piece of north bridge fixed block and through the connection of north bridge chips heat pipe
It is heavy；
Cooled plate radiating subassembly, the cooled plate for being internally provided with circulating water line including one piece, cooled plate middle part are equipped with heat pipe
Thermal hole, the CPU heat pipes of CPU termal conductor modules are plugged in heat pipe for thermal conductivity hole, in the circulating water line Inlet and outlet water of water cooling front edge of board
Mouth is connected to water inlet pipe and water outlet pipe connector, and memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips termal conductor module lead to
Respective fixed block is crossed to be fixed in the cooled plate of cooled plate radiating subassembly.
Preferably, CPU heat pipes, memory bar heat pipe South Bridge chip heat pipe and north bridge chips heat pipe are slug type heat pipe, compound
Any one or the combination of several of them in type heat pipe or groove-shaped heat pipe.
Wherein, the cross section of South Bridge chip heat pipe and the linkage section of south bridge fixed block is D types, South Bridge chip heat pipe and south bridge
The cross section of heat sink linkage section is D types；
Wherein, the cross section of north bridge chips heat pipe and the linkage section of north bridge fixed block is D types, north bridge chips heat pipe and north bridge
The cross section of heat sink linkage section is D types；
Wherein, the cross section of memory bar heat pipe and memory bar heat-conductive assembly fixed block linkage section is D types.
Wherein, memory bar heat-conductive assembly fixed block, south bridge fixed block, north bridge fixed block, the peace with cooled plate radiating subassembly
Attaching contacting surface, is provided with heat conduction straight slot, and memory bar heat pipe, South Bridge chip heat pipe, north bridge chips heat pipe are flowed back by hot air convection
D types heat pipe end is closely adhesively fixed in the heat conduction straight slot of each fixed block, and pass through D type heat pipe transverse planes to cooled plate by weldering
Radiating subassembly conducts heat；CPU heat pipes and the cross section of the heat sink connecting pins of CPU are D types, and the other end of CPU heat pipes is plugged on
It in the heat pipe for thermal conductivity hole of cooled plate, is welded as a whole by hot air convection Reflow Soldering, and heat is conducted to cooled plate radiating subassembly.
Wherein, memory bar termal conductor module, including memory bar heat-conductive assembly fixed block and through the connection of memory bar heat pipe
Several groups of memory bar thermally conductive sheets, memory bar thermally conductive sheet are equipped with heat conduction through-hole, and memory bar heat pipe is plugged in heat conduction through-hole, passes through heat
Wind Convection Reflow is welded as a whole.
Further, every group of memory bar thermally conductive sheet is symmetrically posted one piece of memory bar heat conduction chip base of memory bar heat conduction patch by both sides
Block and two pieces of memory bar thermally conductive sheet fixture block compositions for posting memory bar heat conduction patch, two pieces of memory bar thermally conductive sheet fixture blocks are located at interior respectively
A both sides for thermally conductive sheet matrix are deposited, are symmetric, is connected by screw and is fixed as an entirety.
Alternatively, every group of memory bar thermally conductive sheet is pasted by the one piece of memory bar thermally conductive sheet matrix and one piece for posting memory bar heat conduction patch
The memory bar thermally conductive sheet fixture block pasted by memory bar heat conduction forms, and is connected by screw and is fixed as an entirety.
CPU is heat sink when being two, and the heat pipe for connected CPU heat pipes are respectively plugged in cooled plate that two CPU are heat sink is led
Hot hole.
Generally speaking, the utility model has the following advantages that：
A kind of bus type heat pipe type water-cooling heat radiating device passes through memory bar termal conductor module, CPU termal conductor modules, north bridge
The heat concentration of memory bar, CPU, north and south bridge chip is transmitted to water cooling by chip termal conductor module, South Bridge chip termal conductor module
In the cooled plate of plate radiating subassembly, then heat is taken away by cooled plate and outer circulation water, using centralization heat dissipation and directly
It connects and radiates to heating element, radiating efficiency is high, cooling system structure is simple, stablize, reliability is high, noiseless, energy consumption
It is low.The manufacturing method of the utility model bus type heat pipe type water-cooling heat radiating system, have it is simple for process, production cost is low, be applicable in
In mass, large-scale production the characteristics of.
Description of the drawings
Fig. 1 is the utility model bus type heat pipe type water-cooling heat radiating device structure diagram；
Fig. 2 is the utility model cooled plate heat radiation assembly structure schematic diagram；
Fig. 3 is the utility model CPU termal conductor module structure diagrams；
Fig. 4 a, Fig. 4 b are the utility model memory bar termal conductor module structure diagrams；
Fig. 5 is the utility model South Bridge chip termal conductor module structure diagram；
Fig. 6 is the utility model north bridge chips termal conductor module structure diagram；
Fig. 7 is the another form of memory bar termal conductor module structure diagram of the utility model；
Fig. 8 is the another form of CPU termal conductor modules structure diagram of the utility model.
Include in wherein Fig. 1 to Fig. 8：
1. cooled plate radiating subassembly, 10. cooled plates, 11. water inlet pipe and water outlet pipe connectors, 12. circulating water line intake-outlets, 13.
Threaded hole, 14. heat pipe for thermal conductivity holes；
2.CPU termal conductor modules, 21.CPU heat pipes, 22.CPU is heat sink；
3. memory bar termal conductor module, 31. memory bar heat pipes, 32. memory bar heat-conductive assembly fixed blocks, 33. memory bars are led
Backing, 34. memory bar thermally conductive sheet matrixs, 35. memory bar thermally conductive sheet fixture blocks, 36. memory bar heat conduction patch, 37. heat conduction through-holes；
4. South Bridge chip termal conductor module, 41. South Bridge chip heat pipes, 42. south bridge fixed blocks, 43. south bridges are heat sink；
5. north bridge chips termal conductor module, 51. north bridge chips heat pipes, 52. north bridge fixed blocks, 53. north bridges are heat sink；
6. heat conduction straight slot.
Specific embodiment
It is next below that the utility model is described in more detail.
A kind of bus type heat pipe type water-cooling heat radiating device, as shown in Figure 1, water-cooling heat radiating system by cooled plate radiating subassembly 1,
5 groups of CPU termal conductor modules 2, memory bar termal conductor module 3, South Bridge chip termal conductor module 4 and north bridge chips termal conductor module
Into the memory bar termal conductor module 3, South Bridge chip termal conductor module 4 and north bridge chips termal conductor module 5, by respective
Fixed block is fixed in the cooled plate 10 of cooled plate radiating subassembly 1, the CPU termal conductor modules 2 pass through hot air convection Reflow Soldering
CPU heat pipes 21 are fixed in the heat pipe for thermal conductivity hole 14 of cooled plate 10, CPU, memory bar, north and south bridge chip heat transfer are fed water
Cold plate radiating subassembly 1 realizes the heat dissipation of CPU, memory bar, north and south bridge chip.
As shown in Fig. 2, the cooled plate radiating subassembly 1 of the utility model, the water for being internally provided with circulating water line including one piece
Cold plate 10, the top of cooled plate 10 are equipped with fixed memory termal conductor module 3, South Bridge chip termal conductor module 4, north bridge chips heat
The threaded hole 13 of each fixed block of conducting subassembly 5, the middle part of cooled plate 10 are equipped with the heat pipe for thermal conductivity hole of transverse splicing CPU heat pipes 21
14, the circulating water line intake-outlet 12 in 10 front end of cooled plate is connected to water inlet pipe and water outlet pipe connector 11.The utility model it is total
Wire type heat pipe type water-cooling heat radiating device, due to memory bar termal conductor module 3, South Bridge chip termal conductor module 4 and north bridge chips heat
On threaded hole 13 of the conducting subassembly 5 by 10 top of the cooled plate of screw locking to cooled plate radiating subassembly 1, so as to each component with
The connection and dismounting of cooled plate radiating subassembly 1 are very convenient.
As shown in figure 3, the CPU termal conductor modules 2 of the utility model, including several CPU heat pipes 21 and through CPU heat pipes
The CPU heat sink 22 of 21 connections.
As shown in figures 4 a and 4b, the memory bar termal conductor module 3 of the utility model, including one piece of memory bar heat-conductive assembly
Fixed block 32 and several groups of memory bar thermally conductive sheets 33 connected through memory bar heat pipe 31, the memory bar thermally conductive sheet 33 is by dividing
The memory bar thermally conductive sheet matrix 34 and memory bar thermally conductive sheet fixture block 35 for not posting one piece of memory bar heat conduction patch 36 form, and memory bar is led
Backing matrix 34 and memory bar thermally conductive sheet fixture block 35, which are connected by screw, is fixed as an entirety；
As shown in figure 5, the South Bridge chip termal conductor module 4 of the utility model, including one piece of south bridge fixed block 42 and
The south bridge heat sink 43 connected through South Bridge chip heat pipe 41.
As shown in fig. 6, the north bridge chips termal conductor module 5 of the utility model, including one piece of north bridge fixed block 52 and
The north bridge heat sink 53 connected through north bridge chips heat pipe 51.
As shown in figure 8, it is another form of the CPU termal conductor modules 2 of the utility model in practice, including one
Block CPU termal conductor modules fixed block 22 and the two pieces of CPU heat sink 22 connected through several CPU heat pipes 21.
The CPU heat pipes 21,31 South Bridge chip heat pipe 41 of memory bar heat pipe and north bridge chips heat pipe 51 of the utility model, to burn
Junction type heat pipe is composite type heat pipe or is groove-shaped heat pipe, wherein, the company of South Bridge chip heat pipe 41 and south bridge fixed block 42
The cross section for connecing section is D types, and other parts is cylindrical, the cross section of South Bridge chip heat pipe 41 and the linkage section of south bridge heat sink 43
For D types, other parts are cylinder；Wherein, the cross section of north bridge chips heat pipe 51 and the linkage section of north bridge fixed block 52 is D
The cross section of type, north bridge chips heat pipe 51 and the linkage section of north bridge heat sink 53 is D types, and other parts are cylinder；Wherein, it is interior
The cross section for depositing a heat pipe 31 and 32 linkage section of memory bar heat-conductive assembly fixed block is D types.
The memory bar heat-conductive assembly fixed block 32, south bridge fixed block 42, north bridge fixed block 52, dissipate with the cooled plate
The installation contact surface of hot component 1 is provided with heat conduction straight slot 6, the memory bar heat pipe 31, South Bridge chip heat pipe 41, north bridge chips
D types heat pipe end is closely adhesively fixed in the heat conduction straight slot 6 of each fixed block by heat pipe 51 by pressing or soldering, and
Heat is conducted to cooled plate radiating subassembly 1 by D type heat pipe transverse planes；The CPU heat pipes 21 and CPU is heat sink, and 22 connecting pin is
D types, remaining position are circle, and CPU heat pipes 21 are plugged in the heat pipe for thermal conductivity hole 14 of the cooled plate 10 of cooled plate radiating subassembly 1,
It is welded as a whole using hot air convection reflow soldering process, and heat is conducted to cooled plate radiating subassembly 1.
The cooled plate radiating subassembly 1 of the utility model and CPU termal conductor modules 2, memory bar termal conductor module 3, south bridge core
When piece termal conductor module 4 and north bridge chips termal conductor module 5 carry out installing fixed, by the memory bar heat pipe 31, south bridge core
Piece heat pipe 41 and north bridge chips heat pipe 51 are placed in the heat sink heat conduction straight slot 6 with fixed block of respective termal conductor module, CPU is warm
Pipe 21 is plugged in the heat pipe for thermal conductivity hole 14 of cooled plate 10, after carrying out hot air convection Reflow Soldering welding, then contact plane is carried out
Surface polishes, and ensures the heat sink flatness with fixed block of respective termal conductor module.It is and heat sink, fixed in respective termal conductor module
Uniform heat-conducting silicone grease is coated on block and 10 contact surface of heat pipe and cooled plate, then the consolidating each component by clamping screw
Determine block to fit closely be fixed as one (CPU heat pipes 21 are directly welded in cooled plate 10, without fixed block) with cooled plate 10, it will
The heat of the absorption of each component is directly conducted to cooled plate 10, and the recirculated water that heat is water cooled inside plate 10 absorbs, by recirculated water
The water inlet pipe and water outlet pipe connector 11 of pipeline intake-outlet 12 is transported in external cooling recirculation system.
The memory bar termal conductor module 3 of the utility model can also be another structure type, as shown in fig. 7, comprises one
Block memory bar termal conductor module fixed block 32 and several groups of memory bar thermally conductive sheets 33 connected through memory bar heat pipe 31, it is described interior
Deposit a thermally conductive sheet 33 symmetrically posted by both sides memory bar heat conduction patch 36 one piece of memory bar thermally conductive sheet matrix 34 and two pieces post in
It deposits a memory bar thermally conductive sheet fixture block 35 for heat conduction patch 36 to form, the memory bar thermally conductive sheet fixture block 35 is located at memory bar heat conduction chip base
34 both sides of block, are symmetric, and are connected by screw and are fixed as an entirety.
This structure type of the utility model memory bar termal conductor module 3, operation principle and composition form with it is aforementioned
Structure is identical, it is advantageous that a heat pipe can realize the heat conduction of two pieces of memory bars, space is greatly saved so that entire system
System is more convenient, flexible.
The CPU heat sink 22 of the CPU termal conductor modules 2 of the utility model is the not two pieces and two on a vertical line
When more than part, as shown in figure 8, it is by one piece of CPU fixed block 22, the CPU heat pipes 21 through separating respectively with each CPU heat sink 22
The heat conduction of more than one piece CPU is realized in connection.When server works, each CPU pairs of heat is respectively from the CPU heat pipes 21 respectively contacted
It is transmitted in cooled plate 10, realizes heat loss through conduction.
The fixed block or heat sink or heat pipe for thermal conductivity hole 14 that the utility model is connected with each component heat pipe both ends, use
Hot air convection reflow soldering process is welded.
During actual processing, need first to smear in the heat conduction straight slot 6 of each component or heat pipe for thermal conductivity hole 14 suitable
Then heat pipe is plugged in the 6 heat pipe for thermal conductivity hole 14 of heat conduction straight slot of each component, respectively using mold by Sn63Pb37 solder pastes
It after fixation, is positioned in the high temperature furnace that temperature is 280 DEG C~360 DEG C, heats 3min~8min, taking-up is air-cooled to room temperature, draws off
Mold obtains each termal conductor module.
The utility model bus type heat pipe type water-cooling heat radiating system, wherein by bolt by memory bar termal conductor module 3, south
Bridge chip termal conductor module 4 and north bridge chips termal conductor module 5 are fixed in the cooled plate 10 of cooled plate radiating subassembly 1 tight with it
Close fitting, wherein CPU heat pipes 21 are directly welded in cooled plate 10, so as to by memory bar, CPU, north and south bridge chip heat
Concentration is transmitted on cooled plate radiating subassembly 1, is then taken away heat by outer circulation water, is concentrated and directly to fever member device
Part radiates, and cooling system is stable, radiating efficiency is high, highly reliable, noiseless, low energy consumption.
Above-described embodiment is the preferable embodiment of the utility model, but the embodiment of the utility model is not by above-mentioned
The limitation of embodiment, the change made under other any Spirit Essences and principle without departing from the utility model are modified, are replaced
In generation, simplifies combination, should be equivalent substitute mode, is included within the scope of protection of the utility model.
Claims (8)
1. a kind of bus type heat pipe type water-cooling heat radiating device, it is characterised in that：
Including cooled plate radiating subassembly, CPU termal conductor modules, memory bar termal conductor module, South Bridge chip termal conductor module and north
Bridge chip termal conductor module；
CPU termal conductor modules, the CPU connected including CPU heat pipes and through CPU heat pipes is heat sink；
Memory bar termal conductor module, including one piece of memory bar heat-conductive assembly fixed block and through the several of memory bar heat pipe connection
Group memory bar thermally conductive sheet, the memory bar thermally conductive sheet matrix and memory that memory bar thermally conductive sheet is pasted by posting one piece of memory bar heat conduction respectively
Bar thermally conductive sheet fixture block composition, memory bar thermally conductive sheet matrix and memory bar thermally conductive sheet fixture block be connected by screw be fixed as one it is whole
Body forms memory bar thermally conductive sheet；
South Bridge chip termal conductor module, the south bridge connected including one piece of south bridge fixed block and through South Bridge chip heat pipe is heat sink；
North bridge chips termal conductor module, the north bridge connected including one piece of north bridge fixed block and through north bridge chips heat pipe is heat sink；
Cooled plate radiating subassembly, the cooled plate for being internally provided with circulating water line including one piece, cooled plate middle part are equipped with heat pipe for thermal conductivity
Hole, the CPU heat pipes of CPU termal conductor modules are plugged in heat pipe for thermal conductivity hole, are connect in the circulating water line intake-outlet of water cooling front edge of board
There are water inlet pipe and water outlet pipe connector, memory bar termal conductor module, South Bridge chip termal conductor module, north bridge chips termal conductor module, by each
From fixed block be fixed in the cooled plate of cooled plate radiating subassembly.
2. a kind of bus type heat pipe type water-cooling heat radiating device described in accordance with the claim 1, it is characterised in that：CPU heat pipes, memory
Heat pipe South Bridge chip heat pipe and north bridge chips heat pipe are appointing in slug type heat pipe, composite type heat pipe or groove-shaped heat pipe
The combination for one or more of anticipating.
3. a kind of bus type heat pipe type water-cooling heat radiating device described in accordance with the claim 1, it is characterised in that：South Bridge chip heat pipe
It is D types with the cross section of the linkage section of south bridge fixed block, the cross section of South Bridge chip heat pipe and the heat sink linkage section of south bridge is D
Type；
The cross section of north bridge chips heat pipe and the linkage section of north bridge fixed block is D types, north bridge chips heat pipe and the heat sink company of north bridge
The cross section for connecing section is D types；
The cross section of memory bar heat pipe and memory bar heat-conductive assembly fixed block linkage section is D types.
4. a kind of bus type heat pipe type water-cooling heat radiating device described in accordance with the claim 3, it is characterised in that：Memory bar heat conduction group
Part fixed block, south bridge fixed block, north bridge fixed block, the installation contact surface with cooled plate radiating subassembly are provided with heat conduction straight slot, interior
A heat pipe, South Bridge chip heat pipe, north bridge chips heat pipe are deposited, is closely bonded D types heat pipe end admittedly by hot air convection Reflow Soldering
It is scheduled in the heat conduction straight slot of each fixed block, and passes through D type heat pipe transverse planes and conduct heat to cooled plate radiating subassembly；CPU heat pipes
Cross section with the heat sink connecting pins of CPU is D types, and the other end of CPU heat pipes is plugged in the heat pipe for thermal conductivity hole of cooled plate, passes through
Hot air convection Reflow Soldering is welded as a whole, and conducts heat to cooled plate radiating subassembly.
5. a kind of bus type heat pipe type water-cooling heat radiating device described in accordance with the claim 1, it is characterised in that：Memory bar heat transfer
Component, several groups of memory bar thermally conductive sheets connected including memory bar heat-conductive assembly fixed block and through memory bar heat pipe, memory bar
Thermally conductive sheet is equipped with heat conduction through-hole, and memory bar heat pipe is plugged in heat conduction through-hole, is welded as a whole by hot air convection Reflow Soldering.
6. according to a kind of bus type heat pipe type water-cooling heat radiating device described in claim 5, it is characterised in that：Every group of memory bar is led
Backing is symmetrically posted one piece of memory bar thermally conductive sheet matrix of memory bar heat conduction patch by both sides and two pieces are posted memory bar heat conduction patch
Memory bar thermally conductive sheet fixture block form, two pieces of memory bar thermally conductive sheet fixture blocks respectively be located at memory bar thermally conductive sheet matrix both sides, in pair
Claim distribution, be connected by screw and be fixed as an entirety.
7. according to a kind of bus type heat pipe type water-cooling heat radiating device described in claim 5, it is characterised in that：Every group of memory bar is led
The memory bar that backing is posted memory bar heat conduction patch by the one piece of memory bar thermally conductive sheet matrix and one piece that post memory bar heat conduction patch is led
Backing fixture block forms, and is connected by screw and is fixed as an entirety.
8. a kind of bus type heat pipe type water-cooling heat radiating device described in accordance with the claim 1, it is characterised in that：It is two that CPU is heat sink
When a, the heat pipe for thermal conductivity hole for connected CPU heat pipes are respectively plugged in cooled plate that two CPU are heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720861258.XU CN207516905U (en) | 2017-07-14 | 2017-07-14 | A kind of bus type heat pipe type water-cooling heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720861258.XU CN207516905U (en) | 2017-07-14 | 2017-07-14 | A kind of bus type heat pipe type water-cooling heat radiating device |
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| Publication Number | Publication Date |
|---|---|
| CN207516905U true CN207516905U (en) | 2018-06-19 |
Family
ID=62531895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201720861258.XU Active CN207516905U (en) | 2017-07-14 | 2017-07-14 | A kind of bus type heat pipe type water-cooling heat radiating device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108848658A (en) * | 2018-08-17 | 2018-11-20 | 中国科学院电工研究所 | A kind of controller inside cooling structure |
| CN116321980A (en) * | 2023-04-03 | 2023-06-23 | 昆山捷桥电子科技有限公司 | Composite water cooling plate |
-
2017
- 2017-07-14 CN CN201720861258.XU patent/CN207516905U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108848658A (en) * | 2018-08-17 | 2018-11-20 | 中国科学院电工研究所 | A kind of controller inside cooling structure |
| CN116321980A (en) * | 2023-04-03 | 2023-06-23 | 昆山捷桥电子科技有限公司 | Composite water cooling plate |
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