CN204539684U - A kind of large power supply module heat dissipation structure - Google Patents
A kind of large power supply module heat dissipation structure Download PDFInfo
- Publication number
- CN204539684U CN204539684U CN201420836037.3U CN201420836037U CN204539684U CN 204539684 U CN204539684 U CN 204539684U CN 201420836037 U CN201420836037 U CN 201420836037U CN 204539684 U CN204539684 U CN 204539684U
- Authority
- CN
- China
- Prior art keywords
- power supply
- cold drawing
- heat
- liner plate
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of large power supply module heat dissipation structure, using cold drawing and liner plate simultaneously, dispelling the heat to being arranged on printed circuit on board supply device, improves the radiating effect of power supply chip, makes up the shortcoming of fin radiating effect deficiency.Cold drawing provides larger area of dissipation and contact area, the electronic devices and components heat conduction glue-line and the cold drawing that are configured in cold drawing side form good contact, heat conduction glue-line closely attaches between heat dissipation cold plate and electronic devices and components, and heat is passed to cold drawing, and cold drawing is fixed on cavity by screw; Printed circuit board (PCB) and power module are arranged on liner plate jointly by screw, power module lead-out wire welds on a printed circuit through after liner plate, liner plate by the heat conduction bottom power supply to cavity, housing surface has radiating fin, be conducive to the release of heat, other device on the heat effects printed circuit board (PCB) can avoiding power module.Cold drawing and liner plate combine, and form stable, efficient and reliable radiator structure, this radiator structure is fairly simple, be convenient to processing, with low cost, achieve good effect in actual applications, be applicable to very much the large power supply module heat dissipating application that caloric value is large and reliability requirement is higher.
Description
Technical field
The utility model relates to large power supply module heat dissipating field, specifically a kind of structure of jointly being dispelled the heat by liner plate and cold drawing to the power supply apparatus installed on a printed circuit.
Background technology
Along with electronic power components is towards high power and highdensity future development, the heat of components and parts unit are also increases accordingly.In powerful functional module, the heating of power module is especially outstanding, if this part heat can not discharge timely and effectively, will have influence on the service behaviour of device, thus reduces the reliability of system works, even damages device.Therefore the thermal design of high power device has become key one ring of design of electronic products.The effect of thermal design is also directly connected to normal, the stable work that can electronic equipment long-term.Common is power module heat dissipating method mainly fan, fin and heat pipe, but when being subject to the restriction of volume and structure, when power module can not take fan and heat pipe to dispel the heat, needs finned, to increase area of dissipation.And the shortcoming of finned method is can only can not heat bottom dispensing device by the thermal release of top device, have impact on the radiating effect of power supply.
Summary of the invention
The purpose of this utility model is to provide a kind of large power supply module heat dissipation structure, using cold drawing and liner plate simultaneously, dispelling the heat to being arranged on printed circuit on board supply device, improves the radiating effect of power supply chip, makes up the shortcoming of fin radiating effect deficiency.
For achieving the above object, the technical scheme that the cold drawing radiator structure of power module of the present utility model adopts is: this power module adopts the heat radiation of " liner plate+cold drawing " radiator structure, its main feature has, described cold drawing radiator structure comprises the cold drawing and soft sheet heat conduction glue-line with radiating fin, cold drawing provides larger area of dissipation and contact area, the electronic devices and components being configured in cold drawing side can form good contact by sheet heat conduction glue-line and cold drawing, by sheet heat conduction glue-line, heat is passed to cold drawing, cold drawing is fixed on cavity by screw, heat conduction glue-line adhere well between heat dissipation cold plate and electronic devices and components, thus formed stable, efficient and reliable radiator structure.Power module and printed circuit board (PCB) are kept apart by the liner plate of cavity, by the heat conduction bottom power supply to cavity, housing surface has radiating fin, is conducive to the release of heat, other device performance on the heat effects printed circuit board (PCB) simultaneously can avoiding power module.
This printed circuit board (PCB) and power module are arranged on liner plate jointly by screw, and power module lead-out wire welds on a printed circuit through after liner plate.Heat conduction to cavity is used for rejecting heat to module-external by liner plate, and the radiating fin of cavity wall can improve area of dissipation.
The cold drawing front of this large power supply module heat dissipation structure is radiating fin, for improving area of dissipation.
The cold drawing sheet heat conduction glue-line of this large power supply module heat dissipation structure and electronic devices and components form good contact.
The liner plate of this large power supply module heat dissipation structure is between power module and circuit board.
Liner plate and the cavity of this large power supply module heat dissipation structure are integrated.
The cold drawing material of this large power supply module heat dissipation structure can be aluminium matter or copper.
The liner material quality of this large power supply module heat dissipation structure can be aluminium matter or copper.
The sheet heat conduction glue-line of this large power supply module heat dissipation structure is the soft heat-conducting glue under a kind of normality with fixed profile.
The beneficial effects of the utility model are, the radiator structure area of dissipation of " cold drawing+liner plate " is large, reliability is high, the radiating effect of the large device of the caloric values such as power module can be significantly improved, reduce heat to the impact of other devices, be especially applicable to quality and the higher electronic product of reliability requirement.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the structure decomposition map of power module radiator structure of the present utility model.
Fig. 2 is the structure profile diagram of power module radiator structure of the present utility model.
Fig. 3 is power module radiator structure cold drawing end view of the present utility model.
Fig. 4 is power module radiator structure printed circuit board (PCB) end view of the present utility model.
1. printed circuit board (PCB) mounting screw, 2. printed circuit board (PCB), 3. cavity, 4. liner plate, 5. power supplys, 6. sheet heat conduction glue-line, 7. cold drawing, 8. power supply mounting screw, 9. cold drawing mounting screw, 10. cold drawing fin in figure, 11. printed circuit board component faces.
Embodiment
In order to can clearer understanding technology contents of the present utility model, describe in detail especially exemplified by following examples.
Refer to shown in Fig. 1 to Fig. 4.In FIG, embodiment of the present utility model includes: printed circuit board (PCB) mounting screw (1), printed circuit board (PCB) (2), cavity (3), liner plate (4), power module (5), sheet heat conduction glue-line (6), cold drawing (7), power module mounting screw (8), cold drawing mounting screw (9).Power module (5) transfers heat to heat dissipation cold plate (7) by sheet heat conduction glue-line (6), printed circuit board (PCB) mounting screw (1) and power module mounting screw (8), be arranged on printed circuit board (PCB) and power module on liner plate (4).Heat dissipation cold plate (7) is fixed on cavity (3) by cold drawing mounting screw (9).
Fig. 2 is the structure profile diagram of embodiment, and heat is passed to heat dissipation cold plate (7) by heat-conducting glue (6) by power module (5).Heat dissipation cold plate (7) adopts has high thermal conductivity and the making of the aluminum alloy materials of lighter in weight.Sheet heat conduction glue-line (6) adopts as silica gel material is made, and infiltrate the particulate with thermal conductivity wherein, become a kind of softness and possess the heat-conducting glue of the capacity of heat transmission, embodiment contains and this heat-conducting glue is made into tool figurate sheet heat conduction glue-line (6) under normality, owing to having fixing profile under normality, so do not need support or the packaging of remaining component, can be directly installed between cold drawing (7) and power module (5), preferably heat transfer medium is provided.
Fig. 3 is cold drawing (7) end view of embodiment, the bar shaped radiating fin (10) on cold drawing (7) surface makes heat dissipation cold plate (7) increase with the contact area of (as the air) of surrounding medium, thus improves heat dissipation cold plate (7) thermal heat transfer capability outwardly.
Figure 4 shows that printed circuit board (PCB) (2) end view of embodiment, power module (5) is isolated by liner plate (4) and printed circuit board (PCB) (2), can ensure that the device in printed circuit board component face (11) is less by the impact that power module (5) generates heat.
Have employed above-mentioned power module cold drawing radiator structure, larger area of dissipation can be obtained, good heat dissipation effect; Liner plate (4) and cavity (3) are integrated, and heat dissipation cold plate (1) and liner plate (4) complete the heat radiation to power module (5) jointly by cavity (3); This radiator structure is fairly simple, is convenient to processing, with low cost; This radiator structure reliability is high, is applicable to very much the cooling application of the large power, electrically source module that caloric value is large and reliability requirement is higher.
Claims (8)
1. a large power supply module heat dissipation structure, it is characterized in that: this radiator structure adopts " liner plate+cold drawing " form, dispel the heat to being arranged on printed circuit on board supply device, improve the radiating effect of power supply chip, cold drawing provides larger area of dissipation and contact area, heat conduction glue-line closely attaches between heat dissipation cold plate and electronic devices and components, heat is passed to cold drawing, cold drawing is fixed on cavity by screw, printed circuit board (PCB) and power module are arranged on liner plate jointly by screw, power module lead-out wire welds on a printed circuit through after liner plate, liner plate by the heat conduction bottom power supply to cavity, housing surface has radiating fin, for improving area of dissipation.
2. large power supply module heat dissipation structure according to claim 1, is characterized in that: adopt the form that liner plate, cold drawing combine.
3. large power supply module heat dissipation structure according to claim 1, is characterized in that: cold drawing forms good contact by sheet heat conduction glue-line and electronic devices and components.
4. large power supply module heat dissipation structure according to claim 1, is characterized in that: liner plate is between power module and printed circuit board (PCB).
5. large power supply module heat dissipation structure according to claim 1, is characterized in that: liner plate and cavity are integrated.
6. large power supply module heat dissipation structure according to claim 1, is characterized in that: cold drawing material can be aluminium matter or copper.
7. large power supply module heat dissipation structure according to claim 1, is characterized in that: liner material quality can be aluminium matter or copper.
8. large power supply module heat dissipation structure according to claim 1, is characterized in that: sheet heat conduction glue-line is the soft heat-conducting glue under a kind of normality with fixed profile.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420836037.3U CN204539684U (en) | 2014-12-26 | 2014-12-26 | A kind of large power supply module heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420836037.3U CN204539684U (en) | 2014-12-26 | 2014-12-26 | A kind of large power supply module heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204539684U true CN204539684U (en) | 2015-08-05 |
Family
ID=53753639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420836037.3U Expired - Fee Related CN204539684U (en) | 2014-12-26 | 2014-12-26 | A kind of large power supply module heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204539684U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113348591A (en) * | 2018-10-30 | 2021-09-03 | 株式会社Kmw | Antenna device |
| CN113490368A (en) * | 2021-07-07 | 2021-10-08 | 台达电子企业管理（上海）有限公司 | Power supply device and high-power lighting system |
-
2014
- 2014-12-26 CN CN201420836037.3U patent/CN204539684U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113348591A (en) * | 2018-10-30 | 2021-09-03 | 株式会社Kmw | Antenna device |
| CN113490368A (en) * | 2021-07-07 | 2021-10-08 | 台达电子企业管理（上海）有限公司 | Power supply device and high-power lighting system |
| CN113490368B (en) * | 2021-07-07 | 2023-03-21 | 台达电子企业管理（上海）有限公司 | Power supply device and high-power lighting system |
| US11662087B2 (en) | 2021-07-07 | 2023-05-30 | Delta Electronics (Shanghai) Co., Ltd. | Power supply device and high-power illumination system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203633032U (en) | Heat-radiating device for electronic parts and components | |
| CN101325862A (en) | Cabinet, radiating device and method for installing the radiating device | |
| CN204539684U (en) | A kind of large power supply module heat dissipation structure | |
| CN205883830U (en) | High -efficient heat abstractor of liquid cooling VPX machine case based on soaking board | |
| CN107871723A (en) | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment | |
| CN201230432Y (en) | Machine box and heat radiating device | |
| TW201212802A (en) | Heat dissipation apparatus | |
| CN202918629U (en) | Printed circuit board cooling plate heat-dissipation structure | |
| CN105470222B (en) | Cooling device for electronic component | |
| CN201555083U (en) | Multi-chip high-power LED lamp and a radiator structure | |
| CN208609315U (en) | Novel electronic radiator | |
| CN205609502U (en) | Copper aluminium composite substrate with fin structure | |
| CN209087822U (en) | A kind of novel heat sink strip convenient for clamping | |
| CN101566329B (en) | Method for applying ultravacuum heat sink to modular high-power LED street lamp | |
| CN204516803U (en) | Great power LED low thermal resistance radiator structure | |
| CN204390151U (en) | A kind of air-cooled heat-pipe radiator | |
| CN103928413A (en) | Cooling device | |
| CN210039638U (en) | M.2 solid state hard drives with high-efficient heat dissipation function | |
| CN209594178U (en) | A kind of switching tube radiator structure and vehicle power supply | |
| CN209627785U (en) | A kind of high efficiency and heat radiation circuit board | |
| CN207835921U (en) | A kind of circuit board cooling fin | |
| CN208638869U (en) | A kind of radiator structure | |
| CN207817623U (en) | Cooling and heat dissipation plate for main frame central processing unit | |
| CN206713232U (en) | A kind of radiator | |
| CN203773456U (en) | Mainboard radiator for sealed computer case |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20191226 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |