CN203773456U - Mainboard radiator for sealed computer case - Google Patents
Mainboard radiator for sealed computer case Download PDFInfo
- Publication number
- CN203773456U CN203773456U CN201420128925.XU CN201420128925U CN203773456U CN 203773456 U CN203773456 U CN 203773456U CN 201420128925 U CN201420128925 U CN 201420128925U CN 203773456 U CN203773456 U CN 203773456U
- Authority
- CN
- China
- Prior art keywords
- heat
- mainboard
- heat pipe
- radiator
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a mainboard radiator for a sealed computer case. The mainboard radiator comprises a radiator base body, a heat pipe and a radiating copper block and is characterized in that the radiator base body is made of aluminum alloy high in heat conductivity; the radiating copper block includes two parts, one part is located at a chip position, requiring radiation, on the inner side of the radiator base body, the bottom of part is connected with a chip through heat conducting media, and the upper surface of the part is welded with the heat pipe; the other part of the radiating copper block is located at the cold end of the heat pipe, and the bottom of the part is welded with the heat pipe and connected to the radiating surface of the computer case; the heat end and the cold end of the radiator are connected by the heat pipe. By the mainboard radiator, radiation effect of a mainboard in the sealed computer case is increased, the working temperature of the chip of the mainboard is lowered, and working stability of the main board is enhanced.
Description
Technical field
The utility model relates to a kind of sealed cabinet mainboard heat ink.
Background technology
Along with the raising of Computing processing power, chip thermal value is also increasing with surprising rapidity.In the cabinet ventilating in open type, mainly adopt heat radiator to add air-cooled radiating mode, be all designed with rational air channel and dispel the heat.And in some fully-sealed electric subsets, the server category equipment of especially large power consumption, after performance constantly improves, mainboard heat ink, as first order heat radiation in cooling system, faces very large challenge.If radiator heat-dissipation scarce capacity or can not will concentrate heat to be delivered in this large cooling system of cabinet fast, can be due to overheated and cisco unity malfunction will cause equipment to use under long-time or hot environment time, or brings potential danger.
Summary of the invention
Technical problem to be solved in the utility model is: the heating radiator that a kind of high power consumption services device mainboard is provided.
Technical solution adopted in the utility model is:
The utility model is mainly the principle design that is greater than the coefficient of heat conductivity of aluminium alloy and the quick conductive ability of heat pipe according to the coefficient of heat conductivity of copper.
A kind of sealed cabinet mainboard heat ink, comprises heat sink, heat pipe, heat radiation copper billet, and heat sink adopts high thermal conductivity coefficient aluminum alloy materials, utilizes its weight and the good capacity of heat transmission; Heat radiation copper billet is divided into two parts, and a part is positioned at heat sink inner side needs the chip position of heat radiation, and bottom surface is connected by heat-conducting medium with chip, and with heat pipe welding, another part is positioned at heat pipe cold junction above, and bottom surface and heat pipe welding, be connected to case radiation face; Heat pipe connects heating radiator hot junction and cold junction, and heat is transmitted to rapidly to radiating surface by thermal source concentrated parts such as CPU.
On heat sink, be provided with fin, increased area of dissipation.
The beneficial effects of the utility model are: the utility model has improved the radiating effect of sealed cabinet mainboard, have reduced the working temperature of mainboard chip, have strengthened the job stability of mainboard.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model scheme of installation;
Wherein: 1, heat radiation copper billet, 2, heat pipe, 3, heat sink, 4, mainboard, 5, fin, 6, case radiation wall.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described further.
A kind of sealed cabinet mainboard heat ink, comprises heat sink 3, heat pipe 2, heat radiation copper billet 1, and wherein, heat sink 3 adopts high thermal conductivity coefficient aluminum alloy materials, is mainly according to its weight and the good capacity of heat transmission, reference server mainboard size design; ; Heat radiation copper billet 1 is divided into two parts, and a part is positioned at heat sink 3 inner sides needs the chip position of heat radiation, and bottom surface is connected by heat-conducting medium with chip, weld with heat pipe 2 above, another part is positioned at heat pipe 2 cold junctions, and bottom surface and heat pipe 2 weld, and are connected to case radiation face; Heat pipe 2 is mainly to connect heating radiator hot junction and cold junction, and heat is transmitted to rapidly to radiating surface by thermal source concentrated parts such as CPU.
It is characterized in that: on heat sink, be provided with fin 5, increased area of dissipation.
Mainboard 4 is arranged in cabinet, and heating radiator is arranged on mainboard by screw, and wherein a part of copper billet and mainboard 4 heat radiation chips link together by heat-conducting medium, and another part copper billet is connected with case radiation wall by screw, and centre connects by heat-conducting medium.
Because heat radiation chip is combined closely by heat-conducting medium and heat radiation copper billet, in the time that mainboard is worked, the heat of chip passes to heat radiation copper billet by heat-conducting medium, the heat radiation copper billet back side is heat pipe hot junction, therefore heat can be rapidly by heat pipe hot junction guiding heat pipe cold junction, in conductive process, heat is delivered on heat sink 3 simultaneously, on heat sink 3, be designed with fin 5 simultaneously, increase area of dissipation, heat pipe cold junction is connected with copper billet, copper billet is connected with case radiation wall 6, fast heat transmission is disperseed to sweep on case radiation wall, thereby complete the whole heat radiation process of mainboard.
Claims (2)
1. a sealed cabinet mainboard heat ink, comprises heat sink, heat pipe, heat radiation copper billet, it is characterized in that: heat sink adopts high thermal conductivity coefficient aluminum alloy materials; Heat radiation copper billet is divided into two parts, and a part is positioned at heat sink inner side needs the chip position of heat radiation, and bottom surface is connected by heat-conducting medium with chip, and with heat pipe welding, another part is positioned at heat pipe cold junction above, and bottom surface and heat pipe welding, be connected to case radiation face; Heat pipe connects heating radiator hot junction and cold junction.
2. a kind of sealed cabinet mainboard heat ink according to claim 1, is characterized in that: on heat sink, be provided with fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420128925.XU CN203773456U (en) | 2014-03-21 | 2014-03-21 | Mainboard radiator for sealed computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420128925.XU CN203773456U (en) | 2014-03-21 | 2014-03-21 | Mainboard radiator for sealed computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203773456U true CN203773456U (en) | 2014-08-13 |
Family
ID=51290623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420128925.XU Expired - Fee Related CN203773456U (en) | 2014-03-21 | 2014-03-21 | Mainboard radiator for sealed computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203773456U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107300963A (en) * | 2017-07-27 | 2017-10-27 | 湖南中科信为科技有限公司 | A kind of high power consumption CPCI mainboard heat dissipation cold plates |
-
2014
- 2014-03-21 CN CN201420128925.XU patent/CN203773456U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107300963A (en) * | 2017-07-27 | 2017-10-27 | 湖南中科信为科技有限公司 | A kind of high power consumption CPCI mainboard heat dissipation cold plates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20160321 |