CN105759923A - Separating type radiating device and method for closed industrial computer - Google Patents
Separating type radiating device and method for closed industrial computer Download PDFInfo
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- CN105759923A CN105759923A CN201410785573.XA CN201410785573A CN105759923A CN 105759923 A CN105759923 A CN 105759923A CN 201410785573 A CN201410785573 A CN 201410785573A CN 105759923 A CN105759923 A CN 105759923A
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Abstract
The invention is applicable to the technical field of radiation of computers and discloses a separating type radiating device and method for a closed industrial computer. The separating type radiating device comprises a computer case, a mainboard, a CPU (central processing unit), a heat-conducting medium, a first radiator and a second radiator, wherein the first radiator is located on an upper cover of the computer case, an opening is formed in the first radiator, the heat-conducting medium extends from the inside of the case to the outside via the opening in the first radiator, and the CPU is connected with the second radiator located outside the case through the heat-conducting medium. With the adoption of the separating type radiating device and method, radiation of high-power components can be effectively separated from radiation of low-power components, so that radiation of the high-power components cannot affect the low-power components, the service life of the components is prolonged, the radiation effect is good, the maintenance rate of the closed industrial computer is decreased, and the maintenance cost is reduced.
Description
Technical field
The invention belongs to the technical field of heat dissipation of computer, particularly relate to Separated radiating device and the heat dissipating method of a kind of closed industrial computer.
Background technology
At present, being unevenly distributed of closed industrial computer internal heat resource, concentrating the bigger thermal source that generates heat is CPU, and the caloric value that the low-power devices such as bridge chip, hard disk, inductance, mosfet stack up all to be not so good as CPU big.The path of complete machine heat transmission is divided into two links, and one is the internal heat resource heat transmission to casing, including being directly connected to the conduction of heat of shell and not being directly connected to the heat radiation of shell；Another is the heat radiation of casing outwardly environment.The heat that the radiator structure of current closed industrial computer is CPU and other low-power device passes to same shell fin, CPU is the conduction of heat of direct contact type, other low-power device is contactless heat radiation, owing to cpu power is big, the temperature of shell fin can be significantly high, the operating temperature of some low-power device can be exceeded, the heating of such CPU and the continuous high temperature state of shell fin can directly affect the heat radiation of cabinet inside temperature and other low-power device, cause other low-power device operation irregularities, break down and even damage, also the maintenance rate of closed industrial computer is added accordingly.
, miniature internal industrial computer middle or small particularly with fan-free, its inner space is narrow and small, CPU
After high performance components reaches casing fin by conduction of heat, the temperature making casing fin raises, operating temperature higher than cabinet inside, now, heat on radiator will radiate to cabinet inside, it may appear that heat cannot be scattered to the situation on case radiation sheet by other low-power device by thermal-radiating mode, after working long hours, can cause that small-power components and parts break down, affect that fan-free is middle or small, the normal work and use of miniature internal industrial computer.Add the human cost that industrial computer is safeguarded and keeped in repair.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, provide Separated radiating device and the heat dissipating method of a kind of closed industrial computer, the heat dissipation path of high performance components and small-power components and parts can be easily separated by it, can accomplish that small-power components and parts will not be produced impact by the heat radiation of high performance components, improve components and parts service life, excellent in heat dissipation effect, reduces the maintenance rate of closed industrial computer, reduces the cost safeguarded and keep in repair.
The technical scheme is that the Separated radiating device of a kind of closed industrial computer, including computer box, mainboard, CPU, it is characterised in that also include heat-conducting medium, the first radiator and the second radiator.
Described first radiator is positioned at the upper cover of described closed industrial computer casing, and has a perforate；
Described heat-conducting medium extends to outside by the perforate of described first radiator inside closed industrial computer；
Described CPU is connected to described second radiator by described heat-conducting medium.
Preferably, the big I of described second radiator carries out self-defined setting according to the heat dissipation capacity of CPU.
Preferably, described heat-conducting medium can be heat-conducting block, heat pipe.
Preferably, cold-producing medium can be added between described heat-conducting medium and described second radiator.
Preferably, the gap foam between described heat-conducting medium and described first radiator is filled with, to guarantee its industry complete machine sealing.
Preferably, the type of described first radiator and described second radiator can be set as required, such as fin slices radiator.
Present invention also offers the separate type heat dissipating method of a kind of closed industrial computer, adopt the Separated radiating device of above-mentioned closed industrial computer, comprise the following steps, the CPU being positioned on described mainboard is connected with described second radiator by heat-conducting medium, and its heat is scattered via the second radiator by the mode of conduction of heat；Heat is scattered via the first radiator being positioned at chassis cover by other the little components and parts except CPU being positioned on described mainboard by the mode of thermal diffusion.
The Separated radiating device of a kind of closed industrial computer provided by the present invention and heat dissipating method, it is by being easily separated the heat radiation of high performance components Yu small-power components and parts, small-power components and parts will not be produced impact by the heat radiation making high performance components, improve components and parts service life, excellent in heat dissipation effect, reduce the maintenance rate of closed industrial computer, reduce the cost safeguarded and keep in repair.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is existing enclosed industry computer heat abstractor exterior contour schematic diagram；
Fig. 2 is existing enclosed industry computer heat sink interior structural representation；
Fig. 3 is the Separated radiating device schematic diagram of a kind of closed industrial computer that the embodiment of the present invention provides；
Fig. 4 is the Separated radiating device schematic diagram of the another kind of closed industrial computer that the embodiment of the present invention provides；
Fig. 5 is the separate type heat dissipating method flow chart of a kind of closed industrial computer that the embodiment of the present invention provides.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
It should be noted that be referred to as " being fixed on " or " being arranged at " another element when element, it can directly on another element or may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can be directly to another element or may be simultaneously present centering elements.
Also, it should be noted the orientation term such as left and right, upper and lower in the present embodiment, be only relative concept or with the normal operating condition of product for reference each other, and should not be regarded as have restrictive.
It is the schematic diagram of existing enclosed industry computer heat abstractor exterior contour and internal structure as shown in Figure 1 and Figure 2, radiator 104 is a face of case box 10, the i.e. upper cover of cabinet, the CPU102 being positioned on mainboard 101 is connected with the radiator 104 being positioned at casing 10 upper cover by heat-conducting medium 103, radiator 104 and cabinet 10 internal medium fully in contact with, between itself and casing 10 inner air, and there is heat exchange between other low-power device in mainboard 101, so can form heat radiation interference.When described CPU102 power consumption is relatively larger, especially with when on described mainboard 101, the caloric value of other low-power device differs greatly, the temperature of described radiator 104 can exceed the temperature of described casing 10 inner air, also the temperature of other low-power device on described mainboard 101 can be exceeded, heat on so described radiator 104 to described casing 10 internal radiation, will affect the heat radiation of other low-power device on described mainboard 101.
It is illustrated in figure 3 the Separated radiating device schematic diagram of a kind of closed industrial computer that the embodiment of the present invention provides, including casing 20, mainboard 201, CPU202, heat-conducting medium the 203, first radiator the 204, second radiator 205.Described first radiator 204 is positioned at the upper cover of described casing 20, and have a perforate, described heat-conducting medium 203 extends to the outside of casing 20 by the perforate of described casing 20 upper cover from the inside of casing 20, described heat-conducting medium 203 is connected with described CPU202 in the one end within described casing 20, and described heat-conducting medium 203 is connected with described second radiator 205 in the one end outside described casing 20.Therefore, the heat of described CPU202 can be shed being positioned on the second radiator 205 outside described casing 20 of being connected with described heat-conducting medium 203 by the mode of conduction of heat, and other small-power components and parts being positioned on described mainboard 201 except CPU202 can be shed at the first radiator 204 being positioned at described casing 20 upper cover by thermal-radiating mode.Because heat is scattered to the outside of casing 20 by the big CPU202 of heat dissipation capacity by the second radiator 205, produce to affect thus without on the heat radiation of other small-power components and parts casing 20 within.
Described heat-conducting medium 203 can select any medium that can realize heat conduction such as heat-conducting block, heat pipe as required.
In a preferred embodiment, the radiating requirements according to CPU202, can customize the size of described second radiator 205, when CPU202 heat dissipation capacity is big, the size of the second radiator 205 can be strengthened to guarantee radiating effect.
In a preferred embodiment, in order to ensure the sealing of casing 20, can be filled with by the gap foam between heat-conducting medium 203 and described first radiator 204 perforate, it is ensured that the seamless link between described heat-conducting medium 203 and described first radiator.
In a preferred embodiment, described first radiator 204 uses the aluminum profile heat radiator with fin, described second radiator 205 to use fin slices radiator.This combination is one and does not preferred embodiment therefore limit the type of the first radiator 204 and the second radiator 205, and its type can rationally select according to actual needs.
Fig. 4 show the Separated radiating device schematic diagram of the another kind of closed industrial computer that the embodiment of the present invention provides, in conjunction with Fig. 3, except comprising the various piece of embodiment illustrated in fig. 3 in the present embodiment, also between described heat-conducting medium 203 and described second radiator 205, add cold-producing medium 206, such as semiconductor chilling plate.
The work process of the Separated radiating device of closed industrial computer is described in detail below using semiconductor chilling plate as cold-producing medium 206.
Semiconductor chilling plate is that the Peltier effect utilizing semi-conducting material is made, so-called Peltier effect, refers to that absorb heat in its one end, the phenomenon of one end heat release when DC current is by the galvanic couple of two kinds of semi-conducting material compositions.Semi-conductor thermoelectric material the most frequently used at present is Tellurobismuthite..Bismuth Telluride elements adopts electrically coupled in series, including some P types and N-type to (group), they are connected together by electrode, and it is clipped between two ceramic electrodes, when there being electric current to flow through from cooling piece, the heat that electric current produces can pass to opposite side from the side of cooling piece, produces " heat " side and " cold " side on cooling piece, here it is the heating of semiconductor chilling plate and refrigeration principle.This programme is exactly described semiconductor chilling plate joins described heat-conducting medium 203 and between described second radiator 205 outside described casing 20, " heat " side utilizing described semiconductor chilling plate is connected with described second radiator 205, strengthen the heat radiation dynamics of the second radiator 205, " the cold side " of described semiconductor chilling plate is connected with described heat-conducting medium 203, is better reduced the temperature of described CPU202 by described heat-conducting medium.
Above-mentioned Separated radiating device, by heat-conducting medium being extended to outside casing and being provided with the first radiator being positioned at casing and be positioned at the second radiator outside casing, effectively the heat radiation of high performance components Yu small-power components and parts can be easily separated, small-power components and parts will not be produced impact by the heat radiation making high performance components, improve components and parts service life, excellent in heat dissipation effect, reduces the maintenance rate of closed industrial computer, reduces the cost safeguarded and keep in repair.
Fig. 5 show the separate type heat dissipating method flow chart of a kind of closed industrial computer that the embodiment of the present invention provides, and described method is applied to the segregation apparatus of closed industrial computer described above, and shown in Fig. 3, described method includes:
S302, the CPU being positioned on mainboard is connected by heat-conducting medium and the second radiator, and its heat is scattered via the second radiator by the mode of conduction of heat；
S304, heat is scattered via the first radiator being positioned at chassis cover by other the little components and parts except CPU being positioned on mainboard by the mode of thermal diffusion.
Concrete, owing to described heat-conducting medium extends to casing outside and in described second radiator connection by the perforate of box cover, therefore the heat of described CPU is passed to the second radiator being positioned at outside casing by described heat-conducting medium, heat scatters outside casing via the second radiator, produces impact thus without on the heat radiation of the box house other little components and parts except CPU.
In the present embodiment, being defaulted as CPU is the components and parts that on casing mainboard, heat dissipation capacity is maximum, when in varied situations, when there are other bigger than CPU heat dissipation capacity components and parts, also components and parts bigger for described heat dissipation capacity can be connected to described heat-conducting medium, heat is scattered to the radiator being positioned at outside casing via the heat-conducting medium conduction extended to outside casing.
Above-mentioned separate type heat dissipating method, effectively the heat radiation of high performance components Yu small-power components and parts can be easily separated, small-power components and parts will not be produced impact by the heat radiation making high performance components, improve components and parts service life, excellent in heat dissipation effect, reduce the maintenance rate of closed industrial computer, reduce the cost safeguarded and keep in repair.
These are only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement or improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (7)
1. a Separated radiating device for closed industrial computer, including computer box, mainboard, CPU, it is characterised in that also include heat-conducting medium, the first radiator and the second radiator；
Described first radiator is positioned at the upper cover of described closed industrial computer casing, and has a perforate；
Described heat-conducting medium extends to outside by the perforate of described first radiator inside closed industrial computer；
Described CPU is connected to described second radiator by described heat-conducting medium.
2. the Separated radiating device of a kind of closed industrial computer as claimed in claim 1, it is characterised in that the big I of described second radiator carries out self-defined setting according to the heat dissipation capacity of CPU.
3. the Separated radiating device of a kind of closed industrial computer as claimed in claim 1, it is characterised in that described heat-conducting medium can be heat-conducting block, heat pipe.
4. the Separated radiating device of a kind of closed industrial computer as claimed in claim 1, it is characterised in that cold-producing medium can be added between described heat-conducting medium and described second radiator, such as semiconductor chilling plate.
5. the Separated radiating device of a kind of closed industrial computer as claimed in claim 1, it is characterised in that the gap foam between described heat-conducting medium and described first radiator is filled with, to guarantee its industry complete machine sealing.
6. the Separated radiating device of a kind of closed industrial computer as claimed in claim 1, it is characterised in that the type of described first radiator and described second radiator can be set as required, such as fin slices radiator.
7. a separate type heat dissipating method, it is characterized in that, the Separated radiating device of employing closed industrial computer as according to any one of claim 1 to 6, comprise the following steps, the CPU being positioned on described mainboard is connected with described second radiator by heat-conducting medium, and its heat is scattered via the second radiator by the mode of conduction of heat；Heat is scattered via the first radiator being positioned at chassis cover by other the little components and parts except CPU being positioned on described mainboard by the mode of thermal diffusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410785573.XA CN105759923A (en) | 2014-12-18 | 2014-12-18 | Separating type radiating device and method for closed industrial computer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410785573.XA CN105759923A (en) | 2014-12-18 | 2014-12-18 | Separating type radiating device and method for closed industrial computer |
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| CN105759923A true CN105759923A (en) | 2016-07-13 |
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| CN201410785573.XA Pending CN105759923A (en) | 2014-12-18 | 2014-12-18 | Separating type radiating device and method for closed industrial computer |
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Cited By (6)
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| CN106231866A (en) * | 2016-08-03 | 2016-12-14 | 福建星海通信科技有限公司 | The heat abstractor of totally-enclosed cabinet |
| CN108112221A (en) * | 2017-12-27 | 2018-06-01 | 北斗地网（重庆）科技集团有限公司 | A kind of electrical equipment and its radiator |
| CN109473537A (en) * | 2018-10-23 | 2019-03-15 | 惠州市精鸿精密科技有限公司 | A kind of radiating subassembly, the preparation method of thermal dispersant coatings and its assembling equipment |
| CN111538393A (en) * | 2020-04-24 | 2020-08-14 | 齐鲁工业大学 | Convenient heat abstractor who dismantles based on thing networking computer |
| CN112667036A (en) * | 2019-10-16 | 2021-04-16 | 北京百度网讯科技有限公司 | Computer server |
| WO2023115351A1 (en) * | 2021-12-21 | 2023-06-29 | Siemens Aktiengesellschaft | Industrial person computer |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106231866A (en) * | 2016-08-03 | 2016-12-14 | 福建星海通信科技有限公司 | The heat abstractor of totally-enclosed cabinet |
| CN108112221A (en) * | 2017-12-27 | 2018-06-01 | 北斗地网（重庆）科技集团有限公司 | A kind of electrical equipment and its radiator |
| CN109473537A (en) * | 2018-10-23 | 2019-03-15 | 惠州市精鸿精密科技有限公司 | A kind of radiating subassembly, the preparation method of thermal dispersant coatings and its assembling equipment |
| CN112667036A (en) * | 2019-10-16 | 2021-04-16 | 北京百度网讯科技有限公司 | Computer server |
| CN111538393A (en) * | 2020-04-24 | 2020-08-14 | 齐鲁工业大学 | Convenient heat abstractor who dismantles based on thing networking computer |
| WO2023115351A1 (en) * | 2021-12-21 | 2023-06-29 | Siemens Aktiengesellschaft | Industrial person computer |
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