CN102446877A - Semiconductor cooling device - Google Patents
Semiconductor cooling device Download PDFInfo
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- CN102446877A CN102446877A CN2010105027159A CN201010502715A CN102446877A CN 102446877 A CN102446877 A CN 102446877A CN 2010105027159 A CN2010105027159 A CN 2010105027159A CN 201010502715 A CN201010502715 A CN 201010502715A CN 102446877 A CN102446877 A CN 102446877A
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- heat dissipation
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- dissipation device
- cooling device
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Abstract
The invention is suitable for the technical field of heat dissipation, and provides a semiconductor cooling device. In the invention, compared with the traditional passive heat dissipation manners such as a fan, a cooling fin, a heat pipe and the like for cooling an exothermic electronic component, the semiconductor cooling device has the advantages that a semiconductor material with a thermoelectric energy conversion characteristic is utilized, so that the semiconductor cooling device has a refrigeration function when powered on so as to initiatively and rapidly absorb a great deal of heat generated by the exothermic electronic component in the work; and meanwhile, ceramic adopted at the hot end of the semiconductor cooling device is provided with cooling fins, so that the heat dissipation area is enlarged, therefore, the heat dissipation effect is better, and the cooling device has no noises and no mechanical part and is more convenient in use, thus the work efficiency of the electronic component is higher, and the service life of the electronic component is longer.
Description
Technical field
The invention belongs to the heat dissipation technology field, relate in particular to a kind of semiconductor heat dissipation device.
Background technology
IC chip, light-emitting diode etc. all are the higher electronic devices and components of caloric value, because heat is concentrated, if radiating treatment is improper, then might causes these electronic devices and components cisco unity malfunctions, even burn.
At present the cooling measure to these electronic devices and components mainly is to adopt fin, or fin adds the mode of fan, and adopting the fin mode merely is that many shortcomings are arranged: the one, need large tracts of land, large space; The 2nd, heat refluxes.Much be used for the machine components of drive fan for adding the mode that fan comes auxiliary heat dissipation, comprising, any one in these parts breaks down all might cause the irregular working of fan, and this obviously can cause inappropriate cooling; In addition, have steam and dust in the air that fan is sent into, and these steam and dust can cover on the cooling system, and the component capabilities of cooling system is reduced and damage these parts.
A kind of in addition existing cooling system is that to utilize water or other liquid-cooling systems be the heat pipe heat dissipation technology; The shortcoming of this heat pipe heat radiation technology is: compare with common fin; The thermal resistance of heat radiation has obtained minimizing, but because the volume of heat pipe is big, the design of heat radiation slide glass will receive the restriction of heat pipe shape; And the heat of heating electronic component is that radiating efficiency is not thoroughly improved through the passive conduction of heat pipe convection type; In addition,, cause the cost of heat pipe also higher, influenced actual application because the processing technology of heat pipe inner capillary tube is had relatively high expectations.
Now; Semiconductor heat dissipation device also occurred heating electronic component is carried out the active cooling heat dissipation, the semiconductor heat dissipation device utilization has the semi-conducting material of thermoelectric energy transfer characteristic, when energising, just has refrigerating function; The a large amount of heats that produce when initiatively absorbing electronic devices and components work rapidly; For between heating electronic component and the heat radiation slide glass heat dissipation channel efficiently being provided, still, existing semiconductor heat dissipation device all is the compound mode that adopts semiconductor cooling fin radiation fin; The shortcoming of this compound mode is to bond to cooling fin and fin with highly heat-conductive material; And the capacity of heat transmission of this so-called highly heat-conductive material is lower at present, promptly on the heat dissipation channel of electronic devices and components, has increased thermal resistance, is unfavorable for heat radiation.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of semiconductor heat dissipation device, is intended to solve the conventional semiconductor heat abstractor and has the bad problem of radiating effect.
The embodiment of the invention is to realize like this; A kind of semiconductor heat dissipation device; Said semiconductor heat dissipation device comprises a cold junction, a hot junction and several to P type semiconductor and N type semiconductor between said cold junction and hot junction; Said several every pair of P type semiconductor is connected through electrode with N type semiconductor end to end to P type semiconductor and N type semiconductor alternately, forms series loop; Said semiconductor heat dissipation device also comprises the insulation and thermal insulation material that is positioned at said P type semiconductor and N type semiconductor periphery, and the material of said hot junction and cold junction is a ceramic material.
In the said structure, said ceramic material is Al
2O
3The pottery, AlN is ceramic, SiC is ceramic, B
4C pottery or BN pottery.
In the said structure, the profile of said cold junction is configured to the thin plate of smooth, and the profile structure of this thin plate is suitable with the profile structure on several said N type semiconductors that are connected in series each other and plane that P type semiconductor forms.
In the said structure, the said hot junction surface of said cold junction dorsad is provided with some regularly arranged fins.
In the said structure, said electrode is copper or aluminium.
In embodiments of the present invention, semiconductor heat dissipation device and tradition are compared passive radiating modes such as the fan of heating electronic component heat radiation, fin, heat pipes, utilize the semi-conducting material with thermoelectric energy transfer characteristic; When energising, just have refrigerating function, a large amount of heats that produce when initiatively absorbing heating electronic component work rapidly, simultaneously; Because the pottery that adopt in the hot junction of semiconductor heat dissipation device has radiating fin, strengthened area of dissipation, so radiating effect is better; And noiselessness, nothing machinery parts; Use more convenient, thereby make that the operating efficiency of electronic devices and components is higher, longer service life.
Description of drawings
Fig. 1 is the structure chart of the semiconductor heat dissipation device that provides of the embodiment of the invention.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Fig. 1 shows the structure of the semiconductor heat dissipation device that the embodiment of the invention provides, and for the ease of explanation, only shows the part relevant with the present invention.
Semiconductor heat dissipation device comprises a cold junction 1, a hot junction 2 and several to P type semiconductor 3 and N type semiconductor 4 between cold junction 1 and hot junction 2; Several to P type semiconductor 3 and N type semiconductor 4 alternately; Every pair of P type semiconductor 3 is connected through electrode 5 with N type semiconductor 4 end to end; Form series loop; Semiconductor heat dissipation device also comprises the insulation and thermal insulation material 6 that is positioned at P type semiconductor 3 and N type semiconductor 4 peripheries, so that in making, transportation, use, protect inner components and parts, the material of hot junction 2 and cold junction 1 is a ceramic material.
As one embodiment of the invention, ceramic material is Al
2O
3The pottery, AlN is ceramic, SiC is ceramic, B4C is ceramic or BN is ceramic.
As one embodiment of the invention, the profile of cold junction 1 is configured to the thin plate of smooth, and the profile structure of this thin plate is suitable with the profile structure on several N type semiconductors that are connected in series each other 4 and P type semiconductor 3 plane that forms.
As one embodiment of the invention, hot junction 2 surface of cold junction 1 dorsad is provided with some regularly arranged fins.
As one embodiment of the invention, electrode 5 is copper or aluminium.
As one embodiment of the invention, bond through solder(ing) paste between the cold junction 1 of semiconductor heat dissipation device, hot junction 2, P type semiconductor 3, N type semiconductor 4, electrode 5 and the insulation and thermal insulation material 6.In actual use, as shown in Figure 1, the both positive and negative polarity of electrode shown in pressing inserts external power source, behind the connection DC power supply, according to paltie effect, in a P type semiconductor 3 and the transfer that N type semiconductor 4 junctions will produce the temperature difference and heat.A superincumbent junction, the sense of current is N-＞P, temperature descends and heat absorption, Here it is cold junction 1, and a junction below, the sense of current is P-＞N, temperature rises and heat release, is hot junction 2 therefore.So, the electronic devices and components of needs coolings being fixed on the cold junction 1 of semiconductor heat dissipation device, just can the heat that these electronic devices and components produce be taken away.
In embodiments of the present invention, semiconductor heat dissipation device and tradition are compared passive radiating modes such as the fan of heating electronic component heat radiation, fin, heat pipes, utilize the semi-conducting material with thermoelectric energy transfer characteristic; When energising, just have refrigerating function, a large amount of heats that produce when initiatively absorbing heating electronic component work rapidly, simultaneously; Because the pottery that adopt in the hot junction of semiconductor heat dissipation device has radiating fin, strengthened area of dissipation, so radiating effect is better; And noiselessness, nothing machinery parts; Use more convenient, thereby make that the operating efficiency of electronic devices and components is higher, longer service life.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. semiconductor heat dissipation device; Said semiconductor heat dissipation device comprises a cold junction, a hot junction and several to P type semiconductor and N type semiconductor between said cold junction and hot junction; Said several to P type semiconductor and N type semiconductor alternately; Every pair of P type semiconductor is connected through electrode with N type semiconductor end to end, forms series loop, and said semiconductor heat dissipation device also comprises the insulation and thermal insulation material that is positioned at said P type semiconductor and N type semiconductor periphery; It is characterized in that the material of said hot junction and cold junction is ceramic material.
2. semiconductor heat dissipation device as claimed in claim 1 is characterized in that, said ceramic material is Al
2O
3The pottery, AlN is ceramic, SiC is ceramic, B
4C pottery or BN pottery.
3. semiconductor heat dissipation device as claimed in claim 1; It is characterized in that; The profile of said cold junction is configured to the thin plate of smooth, and the profile structure of this thin plate is suitable with the profile structure on several said N type semiconductors that are connected in series each other and plane that P type semiconductor forms.
4. semiconductor heat dissipation device as claimed in claim 1 is characterized in that, the said hot junction surface of said cold junction dorsad is provided with some regularly arranged fins.
5. semiconductor heat dissipation device as claimed in claim 1 is characterized in that, said electrode is copper or aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105027159A CN102446877A (en) | 2010-10-11 | 2010-10-11 | Semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105027159A CN102446877A (en) | 2010-10-11 | 2010-10-11 | Semiconductor cooling device |
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| Publication Number | Publication Date |
|---|---|
| CN102446877A true CN102446877A (en) | 2012-05-09 |
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ID=46009245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105027159A Pending CN102446877A (en) | 2010-10-11 | 2010-10-11 | Semiconductor cooling device |
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| CN (1) | CN102446877A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103745960A (en) * | 2013-12-31 | 2014-04-23 | 吴江亿泰真空设备科技有限公司 | Miniature semiconductor heat radiation device |
| CN103794580A (en) * | 2012-10-26 | 2014-05-14 | 上海联星电子有限公司 | Insulating interconnected heat-radiating plate and power module |
| CN103836386A (en) * | 2012-11-23 | 2014-06-04 | 海洋王（东莞）照明科技有限公司 | Lamp and cooling device thereof |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN108379777A (en) * | 2018-05-15 | 2018-08-10 | 河北爱西欧医疗设备科技有限公司 | It is a kind of multifunctional body-building bed |
| CN112335813A (en) * | 2019-08-06 | 2021-02-09 | 青岛海尔特种电冰柜有限公司 | Radio frequency heating equipment and unfreezing box with same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2311734Y (en) * | 1997-09-30 | 1999-03-24 | 郑万烈 | Thermoelectric semi-conductor cold-hot head apparatus |
| CN2741186Y (en) * | 2004-11-17 | 2005-11-16 | 陈起 | Electronic radiator of semiconductor |
| CN201199528Y (en) * | 2008-04-03 | 2009-02-25 | 无锡职业技术学院 | Novel semiconductor refrigeration heat-production apparatus |
-
2010
- 2010-10-11 CN CN2010105027159A patent/CN102446877A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2311734Y (en) * | 1997-09-30 | 1999-03-24 | 郑万烈 | Thermoelectric semi-conductor cold-hot head apparatus |
| CN2741186Y (en) * | 2004-11-17 | 2005-11-16 | 陈起 | Electronic radiator of semiconductor |
| CN201199528Y (en) * | 2008-04-03 | 2009-02-25 | 无锡职业技术学院 | Novel semiconductor refrigeration heat-production apparatus |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794580A (en) * | 2012-10-26 | 2014-05-14 | 上海联星电子有限公司 | Insulating interconnected heat-radiating plate and power module |
| CN103794580B (en) * | 2012-10-26 | 2018-09-11 | 上海联星电子有限公司 | A kind of insulation interconnection heat sink and power module |
| CN103836386A (en) * | 2012-11-23 | 2014-06-04 | 海洋王（东莞）照明科技有限公司 | Lamp and cooling device thereof |
| CN103745960A (en) * | 2013-12-31 | 2014-04-23 | 吴江亿泰真空设备科技有限公司 | Miniature semiconductor heat radiation device |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN108379777A (en) * | 2018-05-15 | 2018-08-10 | 河北爱西欧医疗设备科技有限公司 | It is a kind of multifunctional body-building bed |
| CN108379777B (en) * | 2018-05-15 | 2023-11-14 | 河北爱西欧医疗设备科技有限公司 | Multifunctional body-building bed |
| CN112335813A (en) * | 2019-08-06 | 2021-02-09 | 青岛海尔特种电冰柜有限公司 | Radio frequency heating equipment and unfreezing box with same |
| CN112335813B (en) * | 2019-08-06 | 2023-11-14 | 青岛海尔特种电冰柜有限公司 | Radio frequency heating equipment and thawing box with same |
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Application publication date: 20120509 |