CN2311734Y - Thermoelectric semi-conductor cold-hot head apparatus - Google Patents
Thermoelectric semi-conductor cold-hot head apparatus Download PDFInfo
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- CN2311734Y CN2311734Y CN 97241814 CN97241814U CN2311734Y CN 2311734 Y CN2311734 Y CN 2311734Y CN 97241814 CN97241814 CN 97241814 CN 97241814 U CN97241814 U CN 97241814U CN 2311734 Y CN2311734 Y CN 2311734Y
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Abstract
The utility model discloses a thermoelectric semiconductor cold and hot head apparatus, particularly a semiconductor refrigerator needing providing a cold source as a cold head. The utility model is mainly composed of a thermoelectric semiconductor assembly, a heat pipe, a cold and a hot heads thereof, a finned radiator, and a fan. The utility model is characterized in that one side of the cold end of the thermoelectric semiconductor is provided with a heat pipe which is composed of a pipe casing and a liquid sucking core (a pipe core) which is arranged at the inner wall of the pipe casing and has a micropore and porous structure, and both ends of the pipe body of the heat pipe are respectively a condensing section and an evaporating section; when the utility model is under the refrigerating condition, and the evaporating section is the cold head of the cold and the hot head, and has the heat absorbing and refrigerating effect.
Description
The utility model is addressed the cold and hot head unit of a kind of thermoelectric semiconductor, particularly needs to provide the semiconductor cooling device as cold head of low-temperature receiver, belongs to the semiconductor application technical field.
Semiconductor application technology and semiconductor refrigerating technology have become the known technology in this professional range.Semiconductor subassembly is by many P-N type piece grain semiconductor element being constituted that copper sheet is connected in series, respectively be provided with an insulated ceramic plates in its both sides, semiconductor subassembly is under specific direct current forward energising situation, in both sides ceramic wafer outside, form cold junction and hot junction separately accordingly (under reverse energising situation, the cold junction of both sides and hot junction transposition accordingly then), its hot-fluid then flows to the hot junction by cold junction by semiconductor element, the outside, hot junction is then by radiator, and heat dissipation such as fan are gone out thermal transpiration.Needing the occasion of low-temperature receiver, need to be about to the object of cooling to contact with cold junction, then cold junction absorbs heat, make the object cooling, and this heat is emitted in the hot junction by semiconductor subassembly, and this is the overview of process of refrigerastion.Semiconductor refrigerating technology is widely used in numerous areas.
Needing the occasion of low-temperature receiver, adopting mechanical compression refrigeration mode or thermoelectric semiconductor refrigeration modes at present, but all have some shortcomings, not ideal.For instance, in the general environment temperature is employed thermostat in the laboratory more than 25 ℃, it requires to keep the constant temperature of 20 ℃ (Chinese Industrial Standards (CIS)s) or 25 ℃ (Unite States Standards), most uses is the mechanical refrigeration cooling water circulators at present, it need dispose appliance arrangements such as compressor, condenser, evaporimeter, expansion vessel, blower fan and cooling water circulating pump, must join with the coil pipe of two rubber tubes and thermostat in addition.Mechanical refrigeration cooling water circulators appearance and size is big, because of equipment is numerous and bulky, and the physique costliness, and be difficult for maintenance.Once the someone adopted thermoelectric semiconductor refrigeration cooling water circulators afterwards, replaced above-mentioned mechanical compression type refrigerating part with the thermoelectric semiconductor refrigerator, though volume slightly can dwindle, but expansion vessel, circulating pump still needs, and is indispensable, and will come recirculated cooling water by rubber tube equally.Compare with the mechanical compression refrigeration mode, its power consumption is big, and refrigerating efficiency is not high, also fails to substitute the mechanical type refrigeration.
The purpose of this utility model provides and designs the cold and hot head unit of a kind of thermoelectric semiconductive, particularly a kind of cold head, make it can cancel cooling water circulating system required when in the past freezing, adopt custom-designed heat pipe to replace circulating pump, expansion vessel, evaporimeter and condenser; Replace the mechanical refrigeration part with the thermoelectric semiconductor assembly, form an efficient height, integral body that volume is little, and make the cold head of heat pipe directly provide low-temperature receiver in the mode of inserting.In addition, its advantage is a little power consumption, and cost is low.
The utility model achieves the above object by following technological means.
The utility model is the cold and hot head unit of a kind of thermoelectric semiconductor, and mainly by thermoelectric semiconductor assembly, heat pipe and cold and hot head thereof, finned radiator and fan are formed.Semiconductor subassembly include by copper sheet be connected in series many to P-N type bismuth telluride semiconductor element, respectively be provided with an insulated ceramic plates, semiconductor subassembly in its both sides under specific direct current forward energising situation, inboard ceramic wafer outside forms the cold junction of heat absorption, and outside ceramic wafer outside forms the hot junction of heat release (under reverse situation promptly under reverse energising situation, its cold junction and hot junction transposition accordingly then), its hot-fluid then flows to the hot junction by cold junction by semiconductor element, the hot junction arranged outside has finned radiator and fan, so that heat is exhaled.Heat pipe is made up of shell and the imbibition core with micropore loose structure (being tube core) that is arranged at inner wall of tube shell, is contained with the working medium that can carry out phase transformation in the heat pipe package.Heat pipe pipe shaft two ends are respectively condensation segment and evaporator section.Of the present utility model being characterised in that organically combined thermoelectric semiconductor assembly and heat pipe, is about to the thermoelectric semiconductor technology and organically combines with hot pipe technique, constitutes a kind of cold and hot head unit of high efficiency plug-in type of novelty.Under cooling condition, heat pipe pipe shaft epimere is a condensation segment, and hypomere is an evaporator section.The pipeline section of the cold junction of adjacent semiconductor assembly inboard can insert and constitute condenser in the copper billet; The evaporator section pipeline section can add the metal nest plate that enlarges heat-transfer area or form other parts formation evaporimeter that this evaporator section or evaporimeter are the cold head of the cold and hot head of the utility model institute appellation.Under reverse situation, promptly under heating condition, also be that thermoelectric semiconductor subassembly is under reverse energising situation, the hot junction is correspondingly changed in cold junction position originally, this moment, the heat pipe epimere pipe shaft section with this hot junction adjacency became evaporator section, and heat pipe hypomere pipe shaft Duan Ze becomes and is condensation segment, and produces exothermic effect, and the condensation segment of this moment is the hot head of the cold and hot head of the utility model institute appellation.Semiconductor subassembly can be made of many semiconductor element mat copper sheet series connection to P-N type bismuth telluride rectangle small-particle usually, the ceramic wafer of its both sides can be an alumina ceramic chip, under direct current forward energising situation, promptly under cooling condition, the cold junction of semiconductor subassembly inboard and described heat pipe are adjacent, the hot junction in its outside then is equipped with finned radiator and fan, to strengthen radiating effect.For ease of explanation, in the utility model design semiconductor subassembly, radiator and fan three's formation is made up specific appellation and be " one group of complete combiner of semiconductor ".Adopt one or two heat pipes and only be provided with " one group of complete combiner of semiconductor " and constituted the cold and hot head unit of the simplest semiconductive of the utility model (referring to cold head herein) in the one side.Adopt one or two heat pipes and be provided with symmetrical two in both sides and form or the complete combiner of above-mentioned semiconductor of four groups or more groups; Perhaps adopt one or two heat pipes and be provided with two groups or the more groups of complete combiners of above-mentioned semiconductor of symmetry in its left and right sides and both sides, front and back, promptly constitute square and be discharged to arrangement form, and heat pipe is positioned at the central part of square structure, can constitute refrigerating capacity more greatly or bigger semiconductor cold-hot head unit (being cold head).Heat pipe has the imbibition core (or tube core) with the mutually bonding micropore cellular structure of inner wall of tube shell, be back to the other end (being evaporator section) of heat pipe at the capillary pump-absorb action of the liquid phase working fluid mat imbibition core of condensation segment, the central cavity of ripe pipe pipe shaft then is the flow channel of gas phase working medium, and gas phase working medium flows to condensation segment from evaporator section by this central cavity passage.
The heat pipe package inwall adheres to the imbibition core (being tube core) of the micropore cellular structure that is provided with, and can be the copper powder sinter, also can constitute imbibition core (being tube core) or other forms of tube core for the multiple layer metal silk screen.But when under cooling condition, when the position of condensation segment is higher than the position of evaporator section, also imbibition core (tube core) can be set, the heat pipe of this moment promptly is referred to as gravity assisted heat pipe.In the case, for the evaporative condenser heat transfer area of the inner surface that increases gravity assisted heat pipe, often adopt the pipe that has inner rib plate.
Under heating condition, be that above-mentioned semiconductor subassembly is under oppositely energising situation of direct current, then its principle is similar fully to process, corresponding exchange is done in the cold junction and the position, hot junction of different is semiconductor subassembly, and the condensation segment of heat pipe and evaporator section are also done corresponding exchange in top and the bottom, and the cold and hot head of this moment promptly becomes hot head.
More under the refrigeration requirement condition of low temperature, can constitute the multilevel semiconductor cooling assembly at needs by the overlapping superposition of a plurality of semiconductor subassemblies, the multilevel semiconductor refrigeration can reach and be lower than-50 ℃ effect.
The cooling and warming temperature range of the cold and hot head unit of the utility model thermoelectric semiconductor is wider, and its practical temperature can be-70 ℃～120 ℃ temperature range.
The cold and hot head unit of the utility model thermoelectric semiconductor can be used to substitute habitual mechanical type or the semiconductor cooling device of tradition at present, has particularly substituted the habitual in the past mechanical type cooling water circulating device with facility such as huge evaporimeter, condenser, circulating pump, expansion vessel, rubber tube and device.
Thereby the utility model created simple in structure, volume is little, movement-less part, good operation reliability, practical, the semiconductor cold head of provided low-temperature receiver easy to use.The laboratory thermostat of low-temperature receiver is provided as needs, be its normal temperature require for+20 ℃ or+low temperature thermostat bath of 25 ℃ (Unite States Standards), then the cold head of heat pipe in the utility model directly can be inserted in the hole of this thermostat, can reach the required normal temperature of this thermostat.In addition, this semiconductor cold head also can be used for the cooling of the heater element of the cooling of CPU in the computer (central processing unit) and other electronic units.The outstanding advantage of the cold and hot head unit of the utility model thermoelectric semiconductor is that consuming electric power is less, and cost is also low, and environment is not had any pollution yet.
Now that description of drawings of the present utility model is as follows:
Fig. 1 is the schematic diagram that has heat pipe and only be provided with cold and hot head unit of simple semiconductor (referring to cold head) of forming cover combiner constituting in the one side.
Fig. 2 is for heat pipe and the schematic diagram of the semiconductor cold-hot head unit (referring to cold head herein) that symmetrical two groups of complete combiners of semiconductor are constituted is set in its both sides.
Fig. 3 is the schematic diagram with cold and hot head unit of thermoelectric semiconductor (referring to the low temperature cold head herein) of secondary refrigeration semiconductor subassembly.
Fig. 4 is for heat pipe and about its left and right sides and both sides, front and back are provided with and the schematic diagram of the semiconductor cold-hot head unit (referring to cold head herein) that constituted of four groups of complete combiners of semiconductor of front and back symmetry.
Now that embodiment accompanying drawings of the present utility model is as follows:
One, embodiment one
Present embodiment is the simplest device of the utility model, referring to Fig. 1, semiconductor subassembly includes some P-N type bismuth telluride semiconductor element 7 is formed by copper sheet 6 series connection bindings, this semiconductor subassembly can be made up of 127 pairs of P-N type rectangle fritter grains usually, respectively be provided with the insulation porcelain plate 5 of an aluminium oxide in its both sides, semiconductor subassembly is under specific direct current forward energising situation, porcelain plate 5 outsides, left side form the cold junction of heat absorption, and porcelain plate 5 outsides in right side form the hot junction of heat release (under reverse situation, promptly under reverse energising situation, its cold junction and hot junction transposition accordingly then), its hot-fluid then flows to the hot junction by cold junction by semiconductor element, the hot junction arranged outside has finned radiator 8 and fan 9, so that heat is exhaled.In above-mentioned cold junction side (then being the hot junction side when oppositely switching on) heat pipe is set, heat pipe is made up of shell 1 and the imbibition core (tube core) 2 with micropore loose structure that is arranged at shell 1 inwall.Imbibition core (tube core) can be with a kind of copper metal powder sinter.The heat pipe package internal memory is placed with the working medium that can carry out phase transformation, and working medium can be with methyl alcohol or ethanol.Heat pipe pipe shaft two ends are respectively condensation segment and evaporator section.Under cooling condition, the heat pipe epimere is a condensation segment, and hypomere is evaporator section (oppositely energising promptly heats under the situation down, and correspondingly exchange is done in both positions).The condensation segment pipeline section of adjacent semiconductor assembly inserts in the copper billet 4 and constitutes condenser, and condenser produces exothermic effect, and evaporator section adds that the metal nest plate 3 or other form parts that enlarge heat-transfer area constitute evaporimeter, and evaporimeter produces endothermic effect.Under cooling condition, this evaporator section is the cold head of the cold and hot head of the utility model appellation.Under heating condition, then situation is opposite, and the heat pipe pipe shaft section in its adjacent semiconductor assembly hot junction becomes and is evaporator section, and the other end becomes and is condensation segment, produces exothermic effect, and this moment, this condensation segment was the hot head of the cold and hot head of the utility model institute appellation.Adopt 12 volts of voltages of direct current when thermoelectric semiconductor assembly (127 pairs) forward is switched on usually, operating current is about 4 amperes.When concrete the use, as in needing the low temperature thermostat bath of low-temperature receiver (as maintain the standard temperature 20 ℃), this cold and hot head (cold head) can be inserted in the top aperture of thermostat and get final product, use very convenient.Moreover, also can be used for the refrigeration of beverage in summer, can be in the container for drink of heat or cup direct this cold head of insertion.In addition, also can be used for the cooling of CPU in the computer (central processing unit) and the cooling of other electronic unit heater elements.
Two, embodiment two
Referring to Fig. 2, present embodiment is the semiconductor cold-hot head unit (cold head) that symmetrical two groups of complete combiners of semiconductor of heat pipe and both sides setting thereof are constituted.
The apparatus structure of present embodiment and operation principle and the foregoing description one are identical.Different is that two side symmetric arrangement have two groups of semiconductor kits about heat pipe top, and said here " one group of semiconductor kit " is to refer in particular to semiconductor subassembly 7, the grip assembly that radiator 8 and blower fan 9 threes constitute.This device has big refrigerating capacity, except being used for thermostat, also can be used for other field.Present embodiment adopts two groups 40 * 40 millimeters 127 pairs P-N type bismuth telluride semiconductor elements 7.The heat pipe package material can be made of copper or nickel, the imbibition core (tube core) 2 that adhesion is arranged on shell 1 inwall is the metal sintered body solid matter of layer of copper, be that the micropore cellular structure is arranged, semiconductor element is connected in series by copper sheet 6, and both sides are in abutting connection with insulating oxide aluminium porcelain plate 5 is arranged.The pipeline section of heat pipe top condensation segment inserts in the copper billet 4 and constitutes condenser, (the copper pipe inwall is stained with the imbibition core can to insert 1 or 2 diameter in the solid copper billet and be 12 millimeters copper pipe, be a kind of material of micropore loose structure), can soldering be connected between copper pipe and the copper billet, also can be bonding with heat-conducting glue; Also can will hollow out the formation condenser in the middle of the copper billet, between copper pipe and copper billet only the connecting place soldering it.Cold and hot head is made of the nest plate that adds copper or aluminium on the copper pipe.Under cooling condition, the evaporator section pipeline section of heat pipe pipe shaft bottom adds that the copper sheathing sheet on it promptly constitutes cold head.Its cold and hot head part also can be made the coil form of spring-like, to increase area of dissipation.50 millimeters of 15 diameters that cold and hot head part adopts in the present embodiment, thick is 1 millimeter copper sheathing sheet.When reality was used, this cold and hot head (cold head) directly can be inserted needed in the device of low-temperature receiver, obtains refrigeration.As can be used in the low temperature thermostat bath.
Three, embodiment three
Referring to Fig. 3, this embodiment is the cold and hot head unit of thermoelectric semiconductor with secondary refrigeration semiconductor subassembly.The structure of this embodiment semiconductor cold-hot head unit and operation principle and the foregoing description one and embodiment two are identical, and its difference place respectively is provided with the multilevel semiconductor cooling assembly that is made of two groups of overlapping superpositions of semiconductor subassembly in pipe shaft both sides, heat pipe top.In practicality, first order semiconductor subassembly is made of 40 * 40 millimeters 127 pairs P-N type bismuth telluride semiconductor elements, the second level is that 20 * 20 millimeters 31 pairs P-N type bismuth telluride semiconductor elements constitute, the evaporimeter that stretch out the heat pipe bottom, it is the cold head of cold and hot head, can use under lower temperature refrigeration condition, its system temperature can reach-50 ℃.For ease of manipulating under some special occasions, the cold head part of the cold and hot head described in the present embodiment also can make the corrugated flexible hose form, also can make the straight tube form that band helps sheet, also can make spring shape coil form, or form of annular rings or the like.
The sum of series group number of the cold and hot head of thermoelectric semiconductor is decided by desired temperature and refrigerating capacity.
Present embodiment can be used for the laboratory, and hospital and other need the occasion of low-temperature receiver, can obtain lower cryogenic temperature.
In addition, because the multi-stage refrigerating temperature is low, require to use aluminium ammonia heat pipe, promptly the working medium in the heat pipe shell is ammonia, and the shell material adopts metallic aluminium, and this is a compatibility of considering metal material and working medium under low temperature refrigeration (multi-stage refrigerating) situation more.
Among Fig. 3 of embodiment three, each digital code representative is as follows: 4 expression central authorities have the square copper billet of circular hole slot, and 8 expressions help sheet heat radiator, 9 expression fans, 10 expression heat pipes, 11 expression first order semiconductor refrigerating assemblies, 12 expression second level semiconductor refrigerating assemblies.
Four, embodiment four
Referring to Fig. 4, the characteristics of present embodiment are to be provided with two groups of symmetrical complete combiners of semiconductor in the heat pipe left and right sides and both sides, front and back, every group of semiconductor subassembly wherein is made up of the assembly of two overlapping superpositions, this is secondary refrigeration semiconductor subassembly, these secondary refrigeration semiconductor subassemblies constitute the square arrangement arrangement form, and heat pipe is positioned at the central part of square structure, and this kind structure can constitute refrigerating capacity more greatly or bigger semiconductor cold-hot head unit (being cold head).The cold head of present embodiment is particularly suitable for inserting certain and measures in the handle hole on the copper billet in viscosity instrument, both can obtain low-temperature receiver easily, can solve the difficult problem in the practical operation again.The structure member of present embodiment and operation principle and the various embodiments described above are basic identical.Here it should be noted that the every group of semiconductor subassembly that is arranged in squares in the present embodiment, can be secondary or multilevel semiconductor cooling assembly, also can be single-stage semiconductor refrigerating assembly.The single-stage refrigeration modes of present embodiment also can increase refrigerating capacity, and the secondary of present embodiment or multi-stage refrigerating mode then can reach lower low temperature.Present embodiment can use in laboratory, hospital and other need the occasion of low-temperature receiver.
Among present embodiment Fig. 4, the meaning of each digital code representative is as follows:
4 expression central authorities have the square copper billet of circular hole slot, 8 expression finned radiators, and 9 expression fans, 10 expression heat pipes, 11 expression first order semiconductor refrigerating assemblies, 12 represent second level semiconductor refrigerating assembly.
Claims (8)
1, the cold and hot head unit of a kind of thermoelectric semiconductor, mainly by thermoelectric semiconductor assembly, heat pipe and cold and hot head thereof, finned radiator and fan are formed; Semiconductor subassembly include by copper sheet (6) be connected in series many to P-N type bismuth telluride semiconductor element (7), respectively be provided with an insulated ceramic plates (5) in its both sides, under specific direct current forward energising situation, inboard ceramic wafer outside forms the cold junction of heat absorption, and outside ceramic wafer outside forms the hot junction of heat release under opposite energising situation, then its cold junction and hot junction transposition accordingly; The hot junction arranged outside has finned radiator (8) and fan (9); Heat pipe is by shell (1) and be arranged at the imbibition core with micropore loose structure of inner wall of tube shell, and promptly tube core (2) is formed, and is contained with the working medium that can carry out phase transformation in the shell, and heat pipe pipe shaft two ends are respectively condensation segment and evaporator section; Feature of the present utility model is under cooling condition, and heat pipe pipe shaft epimere is a condensation segment, and hypomere is an evaporator section; The pipeline section of the cold junction of adjacent semiconductor assembly inboard inserts and constitutes condenser in the copper billet (4); The evaporator section pipeline section adds the metal nest plate (3) that enlarges heat-transfer area or forms other forms of parts and constitutes evaporimeter, this evaporator section or evaporimeter are the cold head of the cold and hot head of the utility model institute appellation, under reverse situation, promptly under heating condition, also be that thermoelectric semiconductor subassembly is under reverse energising situation, cold junction position originally correspondingly becomes the hot junction, become with the heat pipe epimere pipe shaft section of this hot junction adjacency this moment and be evaporator section, and heat pipe hypomere pipe shaft Duan Ze becomes and is condensation segment, and generation exothermic effect, the condensation segment of this moment is the hot head of the cold and hot head of the utility model appellation, constitutes a kind of cold and hot head unit of plug-in type of novelty thus.
2, the cold and hot head unit of thermoelectric semiconductor according to claim 1, it is characterized in that described semiconductor subassembly can be made of 127 pairs of P-N type bismuth telluride rectangle fritter grain semiconductor elements (7) mat copper sheets (6) series connection, the insulated ceramic plates of its both sides (5) can be alumina ceramic chip; Under direct current forward energising situation, promptly under cooling condition, the cold junction of semiconductor subassembly inboard and described heat pipe adjacency, and the hot junction in its outside disposes finned radiator (8) and fan (9); In the utility model semiconductor subassembly, radiator and specific the constituting of fan three be called " one group of complete combiner of semiconductor ".
3, the cold and hot head unit of thermoelectric semiconductor according to claim 2, it is characterized in that adopting one or two heat pipes and only be provided with one group of above-mentioned complete combiner of semiconductor constituting the cold and hot head unit of the simplest thermoelectric semiconductor of the utility model, refer to cold head herein in the one side.
4, the cold and hot head unit of thermoelectric semiconductor according to claim 2, it is characterized in that adopting one or two heat pipes and be provided with symmetrical two groups or four groups in the heat pipe both sides or more groups the complete combiner of above-mentioned semiconductor, can constitute the bigger semiconductor cold-hot head unit of refrigerating capacity, refer to cold head herein.
5, the cold and hot head unit of thermoelectric semiconductor according to claim 2, it is characterized in that adopting one or two heat pipes and be provided with two groups or more groups the complete combiner of above-mentioned semiconductor of symmetry in the heat pipe left and right sides and both sides, front and back, constitute the square arrangement arrangement form, and heat pipe is positioned at the central part of square structure; And the cold head of this evaporator section can make the bar-shaped plug-in type cold head of the pipe of not being with metal nest plate or fin.
6, according to claim 3 or the cold and hot head unit of 4 or 5 described thermoelectric semiconductors, it is characterized in that described semiconductor subassembly can constitute the multilevel semiconductor cooling assembly by the overlapping superposition of a plurality of semiconductor subassemblies, form the multi-stage refrigerating mode.
7, the cold and hot head unit of thermoelectric semiconductor according to claim 1 is characterized in that shell (1) inwall of described heat pipe is provided with the imbibition core of one deck micropore cellular structure, i.e. tube core is as metal sintered solids; Described working medium of carrying out phase transformation can be materials such as water, methyl alcohol, ethanol or ammonia; On the evaporator section pipeline section of heat pipe lower end external part except metal nest plate (3) can be set, also can adopt other forms of parts, as making corrugated flexible hose, spring-like coil pipe, ring in the heat pipe evaporator section end, having the straight tube of little fin, or pipe bar form not with ribbing, that be suitable for inserting certain device handle hole, be formed on the cold head that uses under the different refrigeration occasions.
8, the cold and hot head unit of thermoelectric semiconductor according to claim 6 is characterized in that under cooling condition, promptly the condensation segment of heat pipe is higher than under the situation of evaporator section, and this is gravity assisted heat pipe, and it is tube core that gravity assisted heat pipe can not be provided with the imbibition core; Gravity assisted heat pipe also can adopt the heat pipe that has inner rib plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97241814 CN2311734Y (en) | 1997-09-30 | 1997-09-30 | Thermoelectric semi-conductor cold-hot head apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97241814 CN2311734Y (en) | 1997-09-30 | 1997-09-30 | Thermoelectric semi-conductor cold-hot head apparatus |
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| Publication Number | Publication Date |
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| CN2311734Y true CN2311734Y (en) | 1999-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 97241814 Expired - Fee Related CN2311734Y (en) | 1997-09-30 | 1997-09-30 | Thermoelectric semi-conductor cold-hot head apparatus |
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| CN101847685A (en) * | 2010-04-16 | 2010-09-29 | 江西纳米克热电电子股份有限公司 | Heat-resistant stable bismuth telluride-based thermoelectric semiconductor generator and preparation method thereof |
| CN101865556A (en) * | 2010-06-30 | 2010-10-20 | 河南理工大学 | Semiconductor refrigerating sheet condensing device |
| WO2011150798A1 (en) * | 2010-11-25 | 2011-12-08 | 华为技术有限公司 | Tec refrigerating installation and electrical apparatus using same |
| CN102446877A (en) * | 2010-10-11 | 2012-05-09 | 海洋王照明科技股份有限公司 | Semiconductor cooling device |
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| CN101847685B (en) * | 2010-04-16 | 2011-11-09 | 江西纳米克热电电子股份有限公司 | Heat-resistant stable bismuth telluride-based thermoelectric semiconductor generator and preparation method thereof |
| CN101847685A (en) * | 2010-04-16 | 2010-09-29 | 江西纳米克热电电子股份有限公司 | Heat-resistant stable bismuth telluride-based thermoelectric semiconductor generator and preparation method thereof |
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| CN102446877A (en) * | 2010-10-11 | 2012-05-09 | 海洋王照明科技股份有限公司 | Semiconductor cooling device |
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