CN104216436A - Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors - Google Patents
Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors Download PDFInfo
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- CN104216436A CN104216436A CN201410407591.4A CN201410407591A CN104216436A CN 104216436 A CN104216436 A CN 104216436A CN 201410407591 A CN201410407591 A CN 201410407591A CN 104216436 A CN104216436 A CN 104216436A
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Abstract
The invention discloses a temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors. The temperature control device comprises a loop heat pipe, a heat collecting plate, a cold plate, a semiconductor refrigerator array, a heat pipe air-cooling radiator array, a temperature controller, a temperature sensor and a power source. The loop heat pipe comprises an evaporator, a condenser and a pipeline, and the evaporator is connected with the condenser by the pipeline; the evaporator of the loop heat pipe is mounted between two panels of the heat collecting plate, the cold plate is a panel, the condenser of the loop heat pipe is mounted on the lower surface of the cold plate, the upper surface of the cold plate and a cold surface of the semiconductor refrigerator array are mounted in a heat conduction manner, and the heat pipe air-cooling radiator array is mounted on a hot surface of the semiconductor refrigerator array; the temperature sensor is arranged on the cold plate and is electrically connected to the temperature controller; the power source supplies power to the semiconductor refrigerator array and the heat pipe air-cooling radiator array via the temperature controller. The temperature control device has the advantages that adverse effects of vibration, airflow disturbance and the like on the tests on the optical remote sensors can be effectively eliminated, and pollution can be prevented.
Description
Technical field
The present invention relates to a kind of temperature regulating device, belong to optical sensor Evolution of Thermal Control Technique field.
Background technology
Normal temperature and pressure test is the important step of space optical remote sensor development, remote sensing satellite general assembly test phase, requires to carry out under stable temperature conditions.During test, optical sensor focal plane electronics equipment produces amount of heat.Need to carry out effective thermal design heat rejection and removal, focal plane electronic equipment temperature is controlled in rational scope, reduce temperature fluctuation, for test provides good temperature environment.Prior art mainly contains two kinds: the first, adopt forced air cooling heat dissipation technology, by heat directly discharged to air ambient, shortcoming has two, one is that the flow perturbation brought thus causes adverse effect to remote sensor test, two is to provide low-temperature receiver, cannot meet the job requirement of remote sensor sensitive element topical hypothermia; The second, industrial refrigeration machine is adopted to dispel the heat to remote sensor focal plane electronics equipment, although the shortcoming of first method can be overcome, but its shortcoming is: one be industrial refrigeration machine outer circulation loop is non-tight loop, there is risk of leakage in refrigerating medium working medium, once leakage can cause the pollution of remote sensor sensitive element and other parts of satellite, two vibrations produced when being industrial refrigeration machine work can cause adverse effect to optical sensor, remote sensing satellite test job.
Summary of the invention
Technology of the present invention is dealt with problems and is: overcome the deficiencies in the prior art, a kind of space optical remote sensor normal temperature and pressure test temperature regulating device is provided, this temperature regulating device friction, airless disturbance, pollution-free, focal plane electronics equipment temperature control problem when solving the test of optical sensor air.
Technical solution of the present invention: a kind of space optical remote sensor normal temperature and pressure test temperature regulating device, when testing for space optical remote sensor normal temperature and pressure, the temperature of focal plane electronics equipment controls, and comprises loop circuit heat pipe, collecting plate, cold drawing, semiconductor cooler array, heat pipe-type air-cooled radiator array, temperature controller, temperature sensor and power supply; Loop circuit heat pipe comprises evaporator, condenser and pipeline, and evaporator is connected by pipeline with condenser; Collecting plate comprises two pieces of aluminum flat boards, and evaporator is arranged between two pieces of flat boards of collecting plate; Cold drawing is that aluminum is dull and stereotyped, and condenser is arranged on the lower surface of cold drawing, and the upper surface of cold drawing and the huyashi-chuuka (cold chinese-style noodles) heat conduction of semiconductor cooler array are installed, and the hot side of semiconductor cooler array are provided with heat pipe-type air-cooled radiator array; Temperature sensor is arranged on cold drawing, and temperature sensor is electrically connected on temperature controller; Power supply is semiconductor cooler array and heat pipe-type air-cooled radiator powering arrays by temperature controller.
The semiconductor cooler that described semiconductor cooler array is arranged by 2 row N is formed, and the heat pipe-type air-cooled radiator that heat pipe-type air-cooled radiator array is arranged by 2 row N is formed, and N is natural number, N >=1.
Uniform filling heat-conducting silicone grease between the upper surface and the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler array of cold drawing, and the huyashi-chuuka (cold chinese-style noodles) of the upper surface of cold drawing and semiconductor cooler array links together, wherein heat-conducting silicone grease thickness is no more than 0.1mm.
The present invention's advantage is compared with prior art:
(1) present invention achieves heat radiation parts (cold drawing, semiconductor cooler array, heat pipe-type air-cooled radiator array) to be separated with the space of heating part, effectively eliminate the adverse effect that vibration, flow perturbation etc. are tested optical sensor.
(2) collecting plate of the present invention, cold drawing, semiconductor cooler, temperature controller and temperature sensor etc. are not all containing liquid working substance, there is not leakage problem; Working medium in the loop circuit heat pipe adopted, heat pipe-type air-cooled radiator is Seal Design, and leakage possibility is extremely low.Therefore the pollution of remote sensor sensitive element and other parts of satellite can not be caused because of refrigerant leakage.
Accompanying drawing explanation
Fig. 1 is that the present invention is dispelled the heat parts annexation schematic diagram;
Fig. 2 is control circuit schematic diagram of the present invention, wherein (a) schematic diagram that is semiconductor cooler array and heat pipe-type air-cooled radiator array in parallel, the schematic diagram that (b) is semiconductor cooler array and the series connection of heat pipe-type air-cooled radiator array.
Embodiment
The present invention includes at least one cover loop circuit heat pipe 1, collecting plate 2, cold drawing 3, semiconductor cooler array 4, heat pipe-type air-cooled radiator array 5, temperature controller 6, temperature sensor 7 and power supply 8; Wherein loop circuit heat pipe 1, collecting plate 2, cold drawing 3, semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5 is heat radiation parts, is illustrated in figure 1 the annexation schematic diagram of heat radiation parts.Loop circuit heat pipe 1 comprises evaporator 11, condenser 12 and pipeline 13 and forms, and evaporator 11 is connected, for delivered heat by pipeline 13 with condenser 12; Collecting plate 2 comprises two pieces of aluminum flat boards, is provided with the evaporator 11 of loop circuit heat pipe 1 between two pieces of aluminum flat boards; Cold drawing 3 is that aluminum is dull and stereotyped, and the upper surface of cold drawing 3 and the huyashi-chuuka (cold chinese-style noodles) heat conduction of semiconductor cooler array 4 are installed, and the lower surface of cold drawing 3 and the condenser 12 of loop circuit heat pipe 1 become one; Heat pipe-type air-cooled radiator array 5 is arranged on semiconductor cooler 4 array hot side.
The mode that wherein upper surface of cold drawing 3 and the huyashi-chuuka (cold chinese-style noodles) heat conduction of semiconductor cooler array 4 are installed is: uniform filling heat-conducting silicone grease between the upper surface and the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler array 4 of cold drawing 3, and the huyashi-chuuka (cold chinese-style noodles) of the upper surface of cold drawing 3 and semiconductor cooler array 4 links together, wherein heat-conducting silicone grease thickness is no more than 0.1mm.
Temperature sensor 7 is arranged in (upper surface or lower surface) on cold drawing 3, for measuring the temperature of cold drawing 3; Semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5 are connected in parallel (as Suo Shi (a) in Fig. 2) or are connected in series (as Suo Shi (b) in Fig. 2) and be connected with power supply 8 by temperature controller 6 afterwards; Temperature controller 6 is electrically connected on temperature sensor 7, accepts the signal from temperature sensor 7, and controls the break-make of semiconductor cooler array 4, heat pipe-type air-cooled radiator array 5 accordingly.
Wherein the spread pattern of semiconductor cooler array 4, heat pipe-type air-cooled radiator array 5 is that 2 row N arrange.Working medium in loop circuit heat pipe 1, heat pipe-type air-cooled radiator array 5 is Seal Design, and the value of N is determined according to remote sensor heating power size, is at least 1.
The course of work of the present invention is as follows:
When space optical remote sensor is tested, the heat that focal plane electronics equipment produces is collected by collecting plate 2 and transfers to cold drawing 3 by loop circuit heat pipe 1, cold drawing 3 by delivered heat to the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler array 4.Temperature controller 6 arranges switching threshold, when the temperature value that temperature sensor 7 records is higher than switching threshold higher limit, temperature controller 6 is in conducting state, power supply 8 is powered for semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5, semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5 in running order, semiconductor cooler array 4 huyashi-chuuka (cold chinese-style noodles) is by being arranged on heat pipe-type air-cooled radiator array 5 on its hot side loose to environment row by heat absorption.Semiconductor cooler 4 array huyashi-chuuka (cold chinese-style noodles) constantly absorbs heat, and cold drawing 3 temperature declines; When temperature drops to lower than switching threshold lower limit, temperature controller 6 disconnects, and semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5 quit work, cold drawing 3 temperature recovery.And so forth, the temperature realizing focal plane electronic equipment controls.
Select specification and the value of N, the quantity of loop circuit heat pipe 1 and the specification of semiconductor cooler, heat pipe-type air-cooled radiator according to space optical remote sensor focal plane electronics equipment heating power in the present invention, and according to remote sensor focal plane electronics equipment heating power design cold drawing 3 physical dimension.
When N value is excessive, multiple temperature sensor can be selected, the corresponding temperature controller of each temperature sensor, each temperature controller is for controlling the m row of semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5, multiple temperature sensor and temperature controller realize the control to semiconductor array of coolers 4 and heat pipe-type air-cooled radiator array jointly, and m is less than or equal to N.
The content be not described in detail in instructions of the present invention belongs to the known technology of those skilled in the art.
Claims (3)
1. a space optical remote sensor normal temperature and pressure test temperature regulating device, when testing for space optical remote sensor normal temperature and pressure, the temperature of focal plane electronics equipment controls, and it is characterized in that: comprise loop circuit heat pipe (1), collecting plate (2), cold drawing (3), semiconductor cooler array (4), heat pipe-type air-cooled radiator array (5), temperature controller (6), temperature sensor (7) and power supply (8); Loop circuit heat pipe (1) comprises evaporator (11), condenser (12) and pipeline (13), and evaporator (11) is connected by pipeline (13) with condenser (12); Collecting plate (2) comprises two pieces of aluminum flat boards, and evaporator (11) is arranged between two pieces of flat boards of collecting plate (2); Cold drawing (3) is aluminum flat board, condenser (12) is arranged on the lower surface of cold drawing (3), the upper surface of cold drawing (3) and the huyashi-chuuka (cold chinese-style noodles) heat conduction of semiconductor cooler array (4) are installed, and the hot side of semiconductor cooler array (4) are provided with heat pipe-type air-cooled radiator array (5); Temperature sensor (7) is arranged on cold drawing (3), and temperature sensor (7) is electrically connected on temperature controller (6); Power supply (8) is semiconductor cooler array (4) and heat pipe-type air-cooled radiator array (5) power supply by temperature controller (6).
2. a kind of space optical remote sensor normal temperature and pressure test temperature regulating device according to claim 1, it is characterized in that: the semiconductor cooler that described semiconductor cooler array (4) is arranged by 2 row N is formed, the heat pipe-type air-cooled radiator that heat pipe-type air-cooled radiator array (5) is arranged by 2 row N is formed, N is natural number, N >=1.
3. a kind of space optical remote sensor normal temperature and pressure test temperature regulating device according to claim 1, it is characterized in that: uniform filling heat-conducting silicone grease between the upper surface and the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler array (4) of cold drawing (3), and the huyashi-chuuka (cold chinese-style noodles) of the upper surface of cold drawing (3) and semiconductor cooler array (4) links together, wherein heat-conducting silicone grease thickness is no more than 0.1mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410407591.4A CN104216436B (en) | 2014-08-18 | 2014-08-18 | Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors |
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| CN201410407591.4A CN104216436B (en) | 2014-08-18 | 2014-08-18 | Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105004801A (en) * | 2015-06-17 | 2015-10-28 | 北京空间机电研究所 | Loop heat pipe ammonia working medium purity analysis device |
| CN105466153A (en) * | 2016-01-13 | 2016-04-06 | 广东机电职业技术学院 | Portable cold and hot insulation box and temperature regulation method thereof |
| CN105867170A (en) * | 2016-05-06 | 2016-08-17 | 中国科学院长春光学精密机械与物理研究所 | Space optical remote sensor temperature control circuit simulation system and simulation testing method |
| CN111263566A (en) * | 2020-01-21 | 2020-06-09 | 北京百度网讯科技有限公司 | Temperature control system, temperature control method, electronic device, and computer-readable medium |
| CN115145325A (en) * | 2022-07-13 | 2022-10-04 | 中国电子科技集团公司第十八研究所 | Active temperature control device and method for high-calorific-value space device |
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| CN111263566A (en) * | 2020-01-21 | 2020-06-09 | 北京百度网讯科技有限公司 | Temperature control system, temperature control method, electronic device, and computer-readable medium |
| CN115145325A (en) * | 2022-07-13 | 2022-10-04 | 中国电子科技集团公司第十八研究所 | Active temperature control device and method for high-calorific-value space device |
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| CN104216436B (en) | 2017-05-10 |
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