CN104851855A - Semiconductor liquid-cooling radiator - Google Patents

Abstract

The invention relates to a semiconductor liquid-cooled heat dissipation device, which has a semiconductor refrigeration device and a liquid-cooled heat dissipation device. The cold end of the semiconductor refrigeration device is placed on a high-power electronic component for cooling the high-power electronic component; The hot end of the semiconductor refrigeration device is connected to the liquid cooling device, and the temperature is cooled by the liquid cooling device. The invention uses semiconductor refrigeration technology to cool high-power electronic components, and cools the hot end of the semiconductor refrigeration device through a liquid cooling device, so as to meet the cooling requirements of high-power electronic equipment.

Description

Semiconductor liquid cooling heat sink

technical field

The invention relates to a heat dissipation device for high-power electronic components, in particular to a cooling method that utilizes a combination of semiconductor refrigeration and liquid cooling to dissipate heat, and can provide a heat dissipation device with good cooling effect for high-power electronic components.

Background technique

With the development of the global information age, the use of electronic equipment is becoming more and more extensive. High-power electronic components also generate a lot of heat while running, and long-term operation of electronic components in a high-temperature environment will reduce their work efficiency and service life. Choosing a reasonable heat dissipation method for electronic components can greatly improve their performance.

Commonly used cooling methods for high-power electronic components include natural convection cooling, forced convection cooling, liquid cooling, cooling by refrigeration or energy conduction during the cooling process.

Semiconductor refrigeration belongs to the cooling method of refrigeration. Its working principle is based on the Peltier principle, that is, when a circuit composed of two different conductors A and B is connected with direct current, a certain amount of heat will be released at the joint in addition to Joule heat. other heat, while the other joint absorbs heat.

With the rapid development of semiconductor materials in the 1950s, semiconductor refrigerators gradually moved from laboratories to engineering practice, and were applied in fields such as industry, agriculture, and daily life.

Semiconductor refrigerators are small in size and light in weight, and microrefrigerators can often be as small as a few grams or tens of grams. There is no mechanical transmission part, no noise during work, no liquid or gas working medium, so it does not pollute the environment. Refrigeration parameters are not affected by spatial direction and gravity, and can work normally under large mechanical overload conditions. By adjusting the size of the working current, the cooling rate can be adjusted conveniently, the action speed is fast, the service life is long, and it is easy to control.

Liquid cooling uses a pump to circulate and cool the coolant in the heat pipes. The liquid cold plate is used to absorb heat from high-power electronic components, and then transfer the heat to the liquid cooling radiator through the cooling liquid to discharge to the outside of the machine.

Liquid cooling has been widely used in industrial ways, such as the heat dissipation of automobiles and aircraft engines, and is a mature cooling technology.

The biggest advantage of liquid cooling is that the convective heat transfer capacity of liquid is much greater than that of air, so liquid cooling radiators often have a good cooling effect, and at the same time, the noise can be well controlled.

However, there is currently no heat sink that uses semiconductor refrigeration to obtain a cold source that can be used for cooling high-power electronic components and uses liquid cooling to dissipate heat from the hot end of the semiconductor refrigeration device.

Contents of the invention

The object of the present invention is to provide a semi-conductor liquid-cooled heat dissipation device, which uses semiconductor refrigeration to obtain a cold source that can be used for cooling high-power electronic components, and uses liquid-cooled heat dissipation to take away the heat from the hot end of the semiconductor refrigeration device, thereby meeting the requirements of the electronic components. temperature conditions.

In order to realize the above-mentioned purpose of the invention, the concrete technical scheme that the present invention takes is as follows:

A semiconductor liquid-cooled heat dissipation device, which has a semiconductor refrigeration device and a liquid-cooled heat dissipation device. The cold end of the semiconductor refrigeration device is placed on a high-power electronic component for cooling and cooling the high-power electronic component; the semiconductor refrigeration device The hot end of the heat sink is connected to a liquid-cooled heat sink, and the temperature is cooled by the liquid-cooled heat sink.

The cold end of the semiconductor refrigeration device is connected with the heating surface of the high-power electronic component through the auxiliary heat-conducting material.

The hot end of the semiconductor refrigerating device is connected to the liquid cooling plate through thermal conductive glue, and the liquid cooling plate is connected to the liquid cooling radiator and the small water pump of the liquid cooling heat dissipation device through water inlet and outlet pipes respectively.

The high-power electronic components and the semiconductor refrigeration device are packaged with heat insulating material 1 to avoid direct contact with the outside air.

The medium in the liquid cooling heat dissipation device is water or cooling liquid. The rear end of the liquid cooling radiator is provided with ribs and a cooling fan is installed.

The beneficial effects of the present invention are:

The invention uses the cold energy obtained from the cold end of the semiconductor refrigeration device to cool the high-power electronic components, which can meet the temperature conditions required by the high-power electronic components. The heating surface of the electronic component is in contact with the cold end of the semiconductor refrigeration device through the auxiliary heat-conducting material, because the cold end of the semiconductor refrigeration device is generally larger than the electronic component, and auxiliary heat-conducting materials are needed to conduct heat from the core of the electronic component to the semiconductor refrigeration device The cold end is conducive to making full use of the cooling effect of the semiconductor refrigeration device. High-power electronic components and semiconductor refrigeration devices are packaged with heat-insulating materials to avoid direct contact with the outside air and prevent frost from dampening the electronic components.

The invention can control the refrigerating capacity of the cold end by adjusting the power of the semiconductor refrigerating device, so as to meet the heat dissipation requirements of different electronic components. The flow rate of the cooling liquid can be controlled by adjusting the power of the small water pump in the liquid cooling heat dissipation device, so as to meet the heat dissipation requirements of different electronic components. The heat dissipation effect of the liquid cooling radiator can be controlled by adjusting the speed of the cooling fan at the end of the liquid cooling radiator in the liquid cooling heat dissipation device, so as to meet the heat dissipation requirements of different electronic components.

The invention has the advantages of simple structure, convenient use and strong adjustability, and can meet the heat dissipation requirements of high-power electronic components.

Description of drawings

FIG. 1 is a schematic diagram of a semiconductor liquid cooling heat dissipation device of the present invention.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

As shown in Figure 1, a semiconductor liquid-cooled heat dissipation device includes a heat insulating material 1, a high-power electronic component 2, a heat-conducting glue 3, an auxiliary heat-conducting material 4, a semiconductor refrigeration device 5, a liquid cooling plate 6, an outlet pipe 7, an inlet Water pipe 8, small water pump 9, liquid cooling radiator 10, cooling fan 11.

The cold end of the semiconductor refrigeration device 5 is placed on the high-power electronic component 2 for cooling and cooling of the high-power electronic component 2; the hot end of the semiconductor refrigeration device 5 is connected to a liquid cooling device, and the liquid cooling device is used for cooling and cooling. The cold end of the semiconductor refrigeration device 5 is connected to the heating surface of the high-power electronic component 2 through the auxiliary heat-conducting material 4 .

The hot end of the semiconductor refrigeration device 5 is connected with the liquid cold plate 6 through the thermal conductive glue 3 . The hot end of the semiconductor refrigeration device is directly in contact with the liquid cold plate 6 after being coated with the thermally conductive glue 3 , and the size of the liquid cold plate 6 should be consistent with the size of the semiconductor hot end.

The liquid cooling heat dissipation device is composed of a small water pump 9, a liquid cooling radiator 10, a cooling fan 11, and water inlet and outlet pipes 7 and 8. The liquid cooling plate 6 is connected to the liquid cooling radiator 10 and the small water pump 9 through the water inlet and outlet pipes 7 and 8 respectively connect. The high-power electronic components 2 and the semiconductor refrigeration device 5 are packaged with a heat insulating material 1 to avoid direct contact with the outside air. The coolant in the liquid cooling heat sink can be water or other coolants with suitable specific heat capacity. The rear end of the liquid-cooled radiator 10 is provided with ribs and a cooling fan 11 is additionally installed. The liquid-cooled heat dissipation terminal can use various forms of heat dissipation. The common method is the structure of fins and small fans. If the principle is the same, other heat dissipation methods can be used. The liquid-cooling heat dissipation device is driven by a small water pump, and the cooling liquid whose temperature rises through the liquid-cooling plate 6 is sent to the liquid-cooling radiator 10 for cooling.

The high-power electronic components 2 work normally to generate heat, while the semiconductor refrigeration device 5 works normally, the cold end generates cold energy, and the hot end generates heat. The cold energy generated by the semiconductor refrigeration device 5 reaches the high-power electronic component 2 through the auxiliary heat-conducting material 4 to lower its temperature. The heat of the hot end of the semiconductor refrigeration device is transferred to the liquid cold plate 6 through the thermal conductive glue, and the heat is passed through the convective heat exchange in the liquid cold plate 6 to increase the temperature of the coolant in the liquid cold plate 6 . Under the action of the small-sized water pump 9, the coolant after the temperature rises passes through the outlet pipe 7 and reaches the liquid cooling radiator 10. Under the combined action of the liquid-cooled radiator 10 and the cooling fan 11, the temperature of the coolant drops, and returns to the liquid-cooled plate through the water inlet pipe 8 to complete the entire cycle.

The invention has the advantages of simple structure, convenient use and strong adjustability, and can meet the heat dissipation requirements of high-power electronic components.

Claims (6)

1. a semiconductor liquid-cooling heat radiator, there is a semiconductor cooling device (5), a liquid-cooling heat radiator, it is characterized in that: the cold junction of described semiconductor cooling device (5) is placed in above large power, electrically sub-element (2), cools for large power, electrically sub-element (2); The hot junction connecting fluid cooling and radiation device of described semiconductor cooling device (5), is cooled by liquid-cooling heat radiator.

2. semiconductor liquid-cooling heat radiator according to claim 1, is characterized in that: the cold junction of described semiconductor cooling device (5) is connected by the heating face of auxiliary heat conduction material (4) with large power, electrically sub-element (2).

3. semiconductor liquid-cooling heat radiator according to claim 1, it is characterized in that: the hot junction of described semiconductor cooling device (5) is connected with liquid cooling plate (6) by heat-conducting glue (3), described liquid cooling plate (6) is connected with small pump (9) with the liquid cooling heat radiator (10) of described liquid-cooling heat radiator respectively by inlet tube and outlet tube (7,8).

4. semiconductor liquid-cooling heat radiator according to claim 1, it is characterized in that: described large power, electrically sub-element (2) encapsulates with semiconductor cooling device (5) heat-barrier material (1), avoids directly contacting with outside air.

5. semiconductor liquid-cooling heat radiator according to claim 1, is characterized in that: the medium in described liquid-cooling heat radiator is water or cooling fluid.

6. semiconductor liquid-cooling heat radiator according to claim 3, is characterized in that: described liquid cooling heat radiator (10) rear end is provided with fin, adds radiator fan (11).