CN103677005A - Temperature control system for reflective optical component - Google Patents
Temperature control system for reflective optical component Download PDFInfo
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- CN103677005A CN103677005A CN201310665292.6A CN201310665292A CN103677005A CN 103677005 A CN103677005 A CN 103677005A CN 201310665292 A CN201310665292 A CN 201310665292A CN 103677005 A CN103677005 A CN 103677005A
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Abstract
The invention discloses a temperature control system for a reflective optical component. The temperature control system for the reflective optical component comprises a temperature measuring unit, a control unit and a cooling unit, wherein the cooling unit is used for cooling the reflective optical component in a controllable mode according to a control instruction sent by the control unit. The cooling unit comprises a heat diffusion plate (22), a loop heat pipe (23), a semiconductor cooler (24) and a liquid cooling system (27), wherein the loop heat pipe (23) comprises a flexible pipeline (23b), and the flexible pipeline is used for transmitting heat generated by the optical component (11), and is also used for preventing vibration generated by the liquid cooling system (27) from being transmitted to the optical component (11). According to the temperature control system for the reflective optical component, effective and high-precision temperature control can be carried out on the extreme ultraviolet optical component in a vacuum environment, and a vibration source and polluting gas cannot be introduced into the vacuum environment.
Description
Technical field
The present invention relates to a kind of temperature control system, particularly a kind of temperature control system that is applicable to extreme ultraviolet photolithographic reflection type optical element.
Background technology
Extreme ultraviolet photolithographic (EUVL) be at present in the world tool potentiality, can meet the photoetching technique of the node IC volume productions such as CD32/22/16nm.The extreme ultraviolet, especially hydrocarbon, the water vapour etc. that due to most of gas, all absorb 13.5nm have strong absorption effect to extreme ultraviolet, therefore need to offer the clean vacuum environment of litho machine.
Fig. 1 has shown the principle schematic of extreme ultraviolet etching system.As shown in Figure 1, extreme ultraviolet etching system comprises vacuum chamber 10 and the special-purpose reflection type optical element 11 in vacuum chamber 10 (mask and optical system), reflection type optical element 11 relies on multilayer coating technology can obtain more than 60% reflectivity at extreme ultraviolet wave band, also be reflection type optical element in vacuum chamber 10 width that is subject to EUV exposure light 12 according to time, can absorb about 30%～40% projectile energy, thereby produce heating effect.
The coefficient of heat conductivity of general optical material is less, can produce certain thermograde, thereby cause the thermal deformation of optical element when heat radiation.Extreme ultraviolet (EUV) optical system requires very harsh to the deformation of the reflecting surface of optical element 11, generally only allow within the scope of 0.1nm.The glass of manufacturing optical element 11 has very low thermal expansivity, and it is when a certain temperature, and thermal expansivity is zero, and this temperature is called zero thermal expansion temperature, is also optimum working temperature.As long as in this temperature, just can there is not deformation in optical element 11 temperature in assurance work.General, this temperature and room temperature (22 ℃) are very nearly the same.Therefore, must carry out high-precision temperature control to optical element 11, so that it is operated in zero thermal expansion temperature, thereby reduce as far as possible its thermal deformation.
Meanwhile, the vibration of optical element 11 also can produce greatly impact to lithographic accuracy, when carrying out temperature control, can not introduce vibration source.
Summary of the invention
(1) technical matters that will solve
In order to guarantee the normal work of reflection type optical element, must solve following problem: carry out effectively under vacuum environment (1), high precision temperature control, guarantees that its working temperature approaches zero thermal expansion temperature as far as possible; (2), when carrying out temperature control, can not introduce vibration source to optical element; (3), when carrying out temperature control, can not introduce pollution gas to vacuum environment, as hydrocarbon, water vapour, hydrogen bromide etc.
(2) technical scheme
For solving the problems of the technologies described above, the present invention proposes a kind of reflection type optical element temperature control system, comprise temperature measuring unit, control module and cooling unit, temperature measuring unit is for detection of Temperature Distribution or the thermal deformation of reflection type optical element, for control module provides decision-making foundation; Control module, for receiving the Real-time Monitoring Data of temperature measuring unit transmission, sends to cooling unit by control command; Cooling unit controllably carries out cooling to reflection type optical element for the control command of sending according to control module, described cooling unit comprises loop circuit heat pipe, described loop circuit heat pipe comprises that this flexible conduit is also passed to described optical element for the isolated vibration being produced by liquid cooling system for transmitting the flexible conduit of the heat of described optical element generation.
According to a kind of embodiment of the present invention, described flexible conduit is elongated and have flexible smooth tube.
According to a kind of embodiment of the present invention, described loop circuit heat pipe also comprises evaporator and condenser,
According to a kind of embodiment of the present invention, described cooling unit also comprises expansion hot plate, described expansion hot plate is arranged on the bottom of described optical element, and for temperature and the reinforced heat conduction of optical element described in homogenising, the evaporator of described loop circuit heat pipe is connected with this expansion hot plate.
According to a kind of embodiment of the present invention, described cooling unit also comprises semiconductor cooler, and described semiconductor cooler has cold junction and hot junction.
According to a kind of embodiment of the present invention, described cooling unit also comprises cooling jacket and liquid cooling system.
According to a kind of embodiment of the present invention, described control module is controller, and described semiconductor cooler, controller and cooling jacket are placed in the vacuum seal of all-metal sealing.
(3) beneficial effect
Compared with prior art, the temperature control system that the present invention proposes can be under vacuum environment to extreme ultraviolet optics element carry out effectively, high precision temperature control, and can not introduce vibration source and pollution gas.
Accompanying drawing explanation
Fig. 1 is the principle schematic of extreme ultraviolet etching system;
Fig. 2 is the structural representation of the temperature control system of reflection type optical element of the present invention.
Embodiment
The present invention proposes a kind of temperature control system that is applied to the reflection type optical element of extreme ultraviolet etching system.Generally speaking, it comprises temperature measuring unit, control module and cooling unit.Temperature measuring unit is come Temperature Distribution or the thermal deformation of detection of reflected formula optical element by various sensors (thermal infrared imager, contact type temperature sensor or minute surface deformation sensor), thereby provides decision-making foundation for control module.Control module receives the Real-time Monitoring Data of temperature measuring unit transmission, makes a policy, and control command is sent to cooling unit according to control strategy.Cooling unit controllably carries out cooling to reflection type optical element for the control command of sending according to control module, it mainly comprises expansion hot plate, loop circuit heat pipe, semiconductor cooler and liquid cooling system.
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in further detail.
Fig. 2 is the structural representation of an embodiment of the temperature control system of reflection type optical element of the present invention.As shown in Figure 2, the system of this embodiment comprises vacuum chamber 10 and the special-purpose reflection type optical element 11 in vacuum chamber 10.The inside of vacuum chamber 10 is vacuum environment, and it is actuating medium that this extreme ultraviolet photolithographic machine be take the extreme ultraviolet 12 of 13.5nm, and reflection type optical element 11, when extreme ultraviolet 12 irradiation, can absorb about 30%～40% projectile energy, thereby produces heating effect.
The temperature control system of the reflection type optical element of this embodiment comprises thermal infrared imager 21, expands hot plate 22, loop circuit heat pipe 23, semiconductor cooler 24, controller 25, cooling jacket 26 and liquid cooling system 27.
Wherein, thermal infrared imager 21 forms temperature measuring unit, for monitoring Temperature Distribution or the thermal deformation of optical element, and sends the Real-time Monitoring Data of Temperature Distribution or thermal deformation to control module.It can be also contact type temperature sensor or minute surface deformation sensor, thereby provides decision-making foundation for control module.
Expand hot plate 22, loop circuit heat pipe 23, semiconductor cooler 24, cooling jacket 26 and liquid cooling system 27 and form cooling unit.
Expand the bottom that hot plate 22 is arranged on optical element 11, generally select the good metal material of heat conductivility, as copper, aluminium etc., play the effect of homogenising optical element 11 temperature and reinforced heat conduction.
Loop circuit heat pipe 23 expands hot plate 22 and semiconductor cooler 24 for connecting, it includes for transmitting the flexible conduit 23b of the heat being produced by optical element 11, and this flexible conduit 23b is also passed to described optical element 11 for the isolated vibration being produced by liquid cooling system 27.
Loop circuit heat pipe also comprises evaporator 23a, condenser 23c, and wherein evaporator 23a, condenser 23c contact with the cold junction that expands hot plate 22 and semiconductor cooler 24 respectively, and the two is communicated with by flexible conduit 23b.
The heat that the hot junction of semiconductor cooler 24 produces is taken to vacuum chamber 10 outsides by cooling jacket 26 by liquid cooling system 27.
In addition,, although the power-equipment of liquid cooling system 27 can cause vibration when work, this vibration is isolated by loop circuit heat pipe 23, can not be delivered to optical element 11.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a reflection type optical element temperature control system, comprises temperature measuring unit, control module and cooling unit, and temperature measuring unit is for detection of Temperature Distribution or the thermal deformation of reflection type optical element (11), for control module provides decision-making foundation; Control module, for receiving the Real-time Monitoring Data of temperature measuring unit transmission, sends to cooling unit by control command; Cooling unit controllably carries out cooling to reflection type optical element for the control command of sending according to control module, it is characterized in that: described cooling unit comprises loop circuit heat pipe (23), described loop circuit heat pipe (23) comprises that this flexible conduit is also passed to described optical element (11) for the isolated vibration being produced by liquid cooling system (27) for transmitting the flexible conduit (23b) of the heat of described optical element (11) generation.
2. reflection type optical element temperature control system as claimed in claim 1, is characterized in that: described flexible conduit (23b) is elongated and have flexible smooth tube.
3. reflection type optical element temperature control system as claimed in claim 1, is characterized in that: described loop circuit heat pipe (23) also comprises evaporator (23a) and condenser (23c).
4. reflection type optical element temperature control system as claimed in claim 3, it is characterized in that: described cooling unit also comprises expansion hot plate (22), described expansion hot plate (22) is arranged on the bottom of described optical element (11), for temperature and the reinforced heat conduction of optical element (11) described in homogenising, the evaporator (23a) of described loop circuit heat pipe (11) is connected with this expansion hot plate (22).
5. reflection type optical element temperature control system as claimed in claim 3, is characterized in that: described cooling unit also comprises semiconductor cooler (24), and described semiconductor cooler (24) has cold junction and hot junction.
6. reflection type optical element temperature control system as claimed in claim 3, is characterized in that: described cooling unit also comprises cooling jacket (26) and liquid cooling system (27).
7. reflection type optical element temperature control system as claimed in claim 3, it is characterized in that: described control module is controller (25), described semiconductor cooler (24), controller (25) and cooling jacket (26) are placed in the vacuum seal (28) of all-metal sealing.
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| CN201310665292.6A CN103677005B (en) | 2013-12-10 | 2013-12-10 | A kind of temperature control system for reflective optical component |
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| CN201310665292.6A CN103677005B (en) | 2013-12-10 | 2013-12-10 | A kind of temperature control system for reflective optical component |
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| CN103677005A true CN103677005A (en) | 2014-03-26 |
| CN103677005B CN103677005B (en) | 2016-03-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104216436A (en) * | 2014-08-18 | 2014-12-17 | 北京空间机电研究所 | Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors |
| CN113377137A (en) * | 2021-05-14 | 2021-09-10 | 中国科学院长春光学精密机械与物理研究所 | Temperature control device of optical element |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008102806A (en) * | 2006-10-20 | 2008-05-01 | Sony Corp | Temperature controller, method, and program |
| CN201340554Y (en) * | 2008-12-23 | 2009-11-04 | 林明建 | Constant temperature control device |
| CN102082133A (en) * | 2009-11-30 | 2011-06-01 | 华为技术有限公司 | Temperature-controlled radiator |
| CN202453751U (en) * | 2012-02-07 | 2012-09-26 | 山东省科学院海洋仪器仪表研究所 | Temperature control device for optical detecting device applied online |
| CN103245125A (en) * | 2013-04-28 | 2013-08-14 | 华为技术有限公司 | Heat conversion device, system and method |
| CN103299249A (en) * | 2007-10-09 | 2013-09-11 | 卡尔蔡司Smt有限责任公司 | Device for controlling temperature of an optical element |
-
2013
- 2013-12-10 CN CN201310665292.6A patent/CN103677005B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008102806A (en) * | 2006-10-20 | 2008-05-01 | Sony Corp | Temperature controller, method, and program |
| CN103299249A (en) * | 2007-10-09 | 2013-09-11 | 卡尔蔡司Smt有限责任公司 | Device for controlling temperature of an optical element |
| CN201340554Y (en) * | 2008-12-23 | 2009-11-04 | 林明建 | Constant temperature control device |
| CN102082133A (en) * | 2009-11-30 | 2011-06-01 | 华为技术有限公司 | Temperature-controlled radiator |
| CN202453751U (en) * | 2012-02-07 | 2012-09-26 | 山东省科学院海洋仪器仪表研究所 | Temperature control device for optical detecting device applied online |
| CN103245125A (en) * | 2013-04-28 | 2013-08-14 | 华为技术有限公司 | Heat conversion device, system and method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104216436A (en) * | 2014-08-18 | 2014-12-17 | 北京空间机电研究所 | Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors |
| CN113377137A (en) * | 2021-05-14 | 2021-09-10 | 中国科学院长春光学精密机械与物理研究所 | Temperature control device of optical element |
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| CN103677005B (en) | 2016-03-02 |
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Inventor after: Wang Kuibo Inventor after: Wu Xiaobin Inventor after: Wang Yu Inventor after: Chen Jinxin Inventor after: Zhang Luosha Inventor after: Luo Yan Inventor after: Xie Wanlu Inventor after: Zhang Xin Inventor after: Xu Xiangyu Inventor before: Wang Kuibo Inventor before: Wu Xiaobin Inventor before: Wang Yu Inventor before: Chen Jinxin Inventor before: Zhang Luosha Inventor before: Luo Yan Inventor before: Xie Wanlu |
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Effective date of registration: 20200805 Address after: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee after: Research Institute of aerospace information innovation, Chinese Academy of Sciences Address before: 100094, No. 9 Deng Nan Road, Beijing, Haidian District Patentee before: Academy of Opto-Electronics, Chinese Academy of Sciences Effective date of registration: 20200805 Address after: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee after: Institute of Microelectronics, Chinese Academy of Sciences Address before: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee before: Research Institute of aerospace information innovation, Chinese Academy of Sciences |