CN104216436B - Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors - Google Patents
Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors Download PDFInfo
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- CN104216436B CN104216436B CN201410407591.4A CN201410407591A CN104216436B CN 104216436 B CN104216436 B CN 104216436B CN 201410407591 A CN201410407591 A CN 201410407591A CN 104216436 B CN104216436 B CN 104216436B
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Abstract
The invention discloses a temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors. The temperature control device comprises a loop heat pipe, a heat collecting plate, a cold plate, a semiconductor refrigerator array, a heat pipe air-cooling radiator array, a temperature controller, a temperature sensor and a power source. The loop heat pipe comprises an evaporator, a condenser and a pipeline, and the evaporator is connected with the condenser by the pipeline; the evaporator of the loop heat pipe is mounted between two panels of the heat collecting plate, the cold plate is a panel, the condenser of the loop heat pipe is mounted on the lower surface of the cold plate, the upper surface of the cold plate and a cold surface of the semiconductor refrigerator array are mounted in a heat conduction manner, and the heat pipe air-cooling radiator array is mounted on a hot surface of the semiconductor refrigerator array; the temperature sensor is arranged on the cold plate and is electrically connected to the temperature controller; the power source supplies power to the semiconductor refrigerator array and the heat pipe air-cooling radiator array via the temperature controller. The temperature control device has the advantages that adverse effects of vibration, airflow disturbance and the like on the tests on the optical remote sensors can be effectively eliminated, and pollution can be prevented.
Description
Technical field
The present invention relates to a kind of temperature regulating device, belongs to optical sensor Evolution of Thermal Control Technique field.
Background technology
Normal temperature and pressure test is space optical remote sensor development, the important step of remote sensing satellite general assembly test phase, it is desirable to
Carry out under stable temperature conditionss.During test, optical sensor focal plane electronics equipment produces amount of heat.Needs are had
The thermal design heat rejection and removal of effect, by focal plane electronic equipment temperature control in rational scope, reduces temperature fluctuation, is that test is carried
For good temperature environment.Prior art mainly has two kinds：The first, using forced air cooling heat dissipation technology, heat is directly arranged
To air ambient, shortcoming has two, and one is that the flow perturbation for thus bringing is adversely affected to remote sensor test, two be can not
There is provided low-temperature receiver, it is impossible to meet the job requirement of remote sensor sensing element topical hypothermia；Second, using industrial refrigeration machine to remote sensor
Focal plane electronics equipment radiates, although can overcome the shortcoming of first method, but its shortcoming to be：One is followed outside industrial refrigeration machine
Loop back path is non-tight loop, and refrigerating medium working medium has risk of leakage, once leakage can cause remote sensor sensing element and satellite
The pollution of other parts, two is that the vibration produced when industrial refrigeration machine works can be to optical sensor, remote sensing satellite test work
Adversely affect.
The content of the invention
The present invention technology solve problem be：Overcome the deficiencies in the prior art, there is provided a kind of space optical remote sensor normal temperature
Normal pressure test temperature regulating device, the temperature regulating device is without friction, airless is disturbed, pollution-free, solves the survey of optical sensor air
Focal plane electronics equipment temperature control problem during examination.
The technical solution of the present invention：A kind of space optical remote sensor normal temperature and pressure test temperature regulating device, for sky
Between optical sensor normal temperature and pressure test when focal plane electronics equipment temperature control, including loop circuit heat pipe, collecting plate, cold drawing,
Semiconductor cooler array, heat pipe-type air-cooled radiator array, temperature controller, temperature sensor and power supply；Loop circuit heat pipe includes
Evaporimeter, condenser and pipeline, evaporimeter and condenser are connected by pipeline；Collecting plate includes two pieces of aluminum flat boards, evaporimeter
Between two pieces of flat boards of collecting plate；Cold drawing is aluminum flat board, and condenser is arranged on the lower surface of cold drawing, the upper table of cold drawing
Face is installed with the huyashi-chuuka (cold chinese-style noodles) heat conduction of semiconductor cooler array, heat pipe-type is provided with the hot face of semiconductor cooler array air-cooled scattered
Hot device array；Temperature sensor is arranged on cold drawing, and temperature sensor is electrically connected to temperature controller；Power supply is partly to lead by temperature controller
Chiller array and heat pipe-type air-cooled radiator powering arrays.
The semiconductor cooler array is made up of the semiconductor cooler that 2 row N are arranged, heat pipe-type air-cooled radiator array by
The heat pipe-type air-cooled radiator of 2 row N row is constituted, and N is natural number, N >=1.
The uniform filling heat-conducting silicone grease between the huyashi-chuuka (cold chinese-style noodles) of the upper surface of cold drawing and semiconductor cooler array, and cold drawing is upper
The huyashi-chuuka (cold chinese-style noodles) of surface and semiconductor cooler array links together, and wherein heat-conducting silicone grease thickness is less than 0.1mm.
Present invention advantage compared with prior art is：
(1) present invention achieves radiating parts (cold drawing, semiconductor cooler array, heat pipe-type air-cooled radiator array)
With being spatially separating for heating in heating part, the adverse effect that vibration, flow perturbation etc. are tested optical sensor is effectively eliminated.
(2) collecting plate of the present invention, cold drawing, semiconductor cooler, temperature controller and temperature sensor etc. are not contained
, there is no leakage problem in liquid working substance；Using loop circuit heat pipe, heat pipe-type air-cooled radiator in working medium be Seal Design,
Leakage possibility is extremely low.Therefore the pollution of remote sensor sensing element and satellite other parts will not be caused because of refrigerant leakage.
Description of the drawings
Fig. 1 is present invention radiating parts annexation schematic diagram；
Fig. 2 is control circuit schematic diagram of the present invention, wherein (a) is semiconductor cooler array and heat pipe-type air-cooled radiator
The schematic diagram of array in parallel, (b) schematic diagram connected for semiconductor cooler array and heat pipe-type air-cooled radiator array.
Specific embodiment
The present invention includes at least a set of loop circuit heat pipe 1, collecting plate 2, cold drawing 3, semiconductor cooler array 4, heat pipe-type wind
Cold heat sink array 5, temperature controller 6, temperature sensor 7 and power supply 8；Wherein loop circuit heat pipe 1, collecting plate 2, cold drawing 3, semiconductor system
Cooler array 4 and heat pipe-type air-cooled radiator array 5 are radiating parts, are illustrated in figure 1 the annexation of radiating parts
Schematic diagram.Loop circuit heat pipe 1 is constituted including evaporimeter 11, condenser 12 and pipeline 13, and evaporimeter 11 and condenser 12 pass through pipeline
13 connections, for heat transmission；Collecting plate 2 includes two pieces of aluminum flat boards, and between two pieces of aluminum flat boards loop circuit heat pipe 1 is provided with
Evaporimeter 11；Cold drawing 3 is aluminum flat board, and the upper surface of cold drawing 3 is installed with the huyashi-chuuka (cold chinese-style noodles) heat conduction of semiconductor cooler array 4, cold drawing 3
Lower surface become one with the condenser 12 of loop circuit heat pipe 1；Heat pipe-type air-cooled radiator array 5 is arranged on semiconductor refrigerating
On the array thermal face of device 4.
Wherein the upper surface of cold drawing 3 is with the mode of the huyashi-chuuka (cold chinese-style noodles) heat conduction installation of semiconductor cooler array 4：In cold drawing 3
Uniform filling heat-conducting silicone grease between the huyashi-chuuka (cold chinese-style noodles) of upper surface and semiconductor cooler array 4, and upper surface and the semiconductor system of cold drawing 3
The huyashi-chuuka (cold chinese-style noodles) of cooler array 4 links together, and wherein heat-conducting silicone grease thickness is less than 0.1mm.
Temperature sensor 7 is arranged on cold drawing 3 (upper surface or lower surface), for measuring the temperature of cold drawing 3；Partly lead
Chiller array 4 and heat pipe-type air-cooled radiator array 5 are connected in parallel (in Fig. 2 shown in (a)) or are connected in series (as schemed
In 2 shown in (b)) it is connected with power supply 8 by temperature controller 6 afterwards；Temperature controller 6 is electrically connected to temperature sensor 7, receives to be passed from temperature
The signal of sensor 7, and the semiconductor cooler array 4, break-make of heat pipe-type air-cooled radiator array 5 is controlled accordingly.
Wherein semiconductor cooler array 4, the spread pattern of heat pipe-type air-cooled radiator array 5 are 2 row N row.Loop heat
Working medium in pipe 1, heat pipe-type air-cooled radiator array 5 is Seal Design, and the value of N is according to remote sensor heating power size
It is fixed, at least 1.
The course of work of the present invention is as follows：
When space optical remote sensor is tested, the heat that focal plane electronics equipment is produced is collected and led to by collecting plate 2
Cross loop circuit heat pipe 1 to transmit to cold drawing 3, cold drawing 3 is by the huyashi-chuuka (cold chinese-style noodles) of heat transmission to semiconductor cooler array 4.Temperature controller 6 is arranged and opened
Threshold value is closed, when the temperature value that temperature sensor 7 is measured is higher than switching threshold higher limit, temperature controller 6 is in the conduction state, power supply
8 is that semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5 are powered, semiconductor cooler array 4 and heat pipe-type
Air-cooled radiator array 5 is in running order, and the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler array 4 is by heat absorption and by installed in its hot face
On heat pipe-type air-cooled radiator array 5 to environment dissipation.The array huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler 4 constantly absorbs heat, at a temperature of cold drawing 3
Drop；When switching threshold lower limit is brought down below at a temperature of, temperature controller 6 disconnects, semiconductor cooler array 4 and heat pipe-type wind
Cold heat sink array 5 quits work, the temperature recovery of cold drawing 3.And so on, the temperature control of focal plane electronic equipment is realized.
Semiconductor cooler, heat pipe are selected according to space optical remote sensor focal plane electronics equipment heating power in the present invention
The specification of formula air-cooled radiator and the value of N, the quantity of loop circuit heat pipe 1 and specification, and according to remote sensor focal plane electronics equipment
Heating power designs the appearance and size of cold drawing 3.
When N values are excessive, multiple temperature sensors can be selected, each temperature sensor one temperature controller of correspondence, often
One temperature controller is used to control the m row of semiconductor cooler array 4 and heat pipe-type air-cooled radiator array 5, and multiple temperature are passed
Sensor and temperature controller realize the control to semiconductor array of coolers 4 and heat pipe-type air-cooled radiator array jointly, m less than etc.
In N.
The content not being described in detail in description of the invention belongs to the known technology of those skilled in the art.
Claims (3)
1. a kind of space optical remote sensor normal temperature and pressure test temperature regulating device, tests for space optical remote sensor normal temperature and pressure
When focal plane electronics equipment temperature control, it is characterised in that：Including loop circuit heat pipe (1), collecting plate (2), cold drawing (3), partly lead
Chiller array (4), heat pipe-type air-cooled radiator array (5), temperature controller (6), temperature sensor (7) and power supply (8)；Ring
Road heat pipe (1) includes evaporimeter (11), condenser (12) and pipeline (13), and evaporimeter (11) and condenser (12) are by pipeline
(13) connect；Collecting plate (2) includes two pieces of aluminum flat boards, and evaporimeter (11) is between two pieces of flat boards of collecting plate (2)；It is cold
Plate (3) is aluminum flat board, condenser (12) installed in cold drawing (3) lower surface, the upper surface of cold drawing (3) and semiconductor cooler
The huyashi-chuuka (cold chinese-style noodles) heat conduction of array (4) is installed, and heat pipe-type air-cooled radiator array is provided with the hot face of semiconductor cooler array (4)
(5)；Temperature sensor (7) is arranged on cold drawing (3), and temperature sensor (7) is electrically connected to temperature controller (6)；Power supply (8) is by temperature
Control device (6) is that semiconductor cooler array (4) and heat pipe-type air-cooled radiator array (5) are powered.
2. a kind of space optical remote sensor normal temperature and pressure test temperature regulating device according to claim 1, it is characterised in that：
The semiconductor cooler array (4) is made up of the semiconductor cooler that 2 row N are arranged, and heat pipe-type air-cooled radiator array (5) is by 2
The heat pipe-type air-cooled radiator of row N row is constituted, and N is natural number, N >=1.
3. a kind of space optical remote sensor normal temperature and pressure test temperature regulating device according to claim 1, it is characterised in that：
The uniform filling heat-conducting silicone grease between the huyashi-chuuka (cold chinese-style noodles) of the upper surface of cold drawing (3) and semiconductor cooler array (4), and cold drawing (3)
The huyashi-chuuka (cold chinese-style noodles) of upper surface and semiconductor cooler array (4) links together, and wherein heat-conducting silicone grease thickness is less than 0.1mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410407591.4A CN104216436B (en) | 2014-08-18 | 2014-08-18 | Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors |
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| CN201410407591.4A CN104216436B (en) | 2014-08-18 | 2014-08-18 | Temperature control device for normal-temperature and normal-pressure tests on space optical remote sensors |
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| CN104216436B true CN104216436B (en) | 2017-05-10 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105004801B (en) * | 2015-06-17 | 2017-04-12 | 北京空间机电研究所 | Loop heat pipe ammonia working medium purity analysis device |
| CN105466153A (en) * | 2016-01-13 | 2016-04-06 | 广东机电职业技术学院 | Portable cold and hot insulation box and temperature regulation method thereof |
| CN105867170B (en) * | 2016-05-06 | 2019-06-11 | 中国科学院长春光学精密机械与物理研究所 | Space flight optical remote sensor temperature-control circuit analogue system and emulation test method |
| CN111263566A (en) * | 2020-01-21 | 2020-06-09 | 北京百度网讯科技有限公司 | Temperature control system, temperature control method, electronic device, and computer-readable medium |
| CN115145325A (en) * | 2022-07-13 | 2022-10-04 | 中国电子科技集团公司第十八研究所 | Active temperature control device and method for high-calorific-value space device |
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| CN2311734Y (en) * | 1997-09-30 | 1999-03-24 | 郑万烈 | Thermoelectric semi-conductor cold-hot head apparatus |
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| CN2057768U (en) * | 1989-12-09 | 1990-05-30 | 北京市西城新开通用试验厂 | General sealing constant temp. industry controller |
| CA2473792C (en) * | 2002-01-29 | 2010-11-30 | Telefonaktiebolaget L M Ericsson (Publ) | A method and system of cooling a cabinet using dynamically controlled ciculating cooling fluid |
| CN102082133B (en) * | 2009-11-30 | 2013-01-23 | 华为技术有限公司 | Temperature-controlled radiator |
| CN103677005B (en) * | 2013-12-10 | 2016-03-02 | 中国科学院光电研究院 | A kind of temperature control system for reflective optical component |
| CN103869844B (en) * | 2014-03-10 | 2015-11-04 | 北京空间机电研究所 | A kind of space flight optical remote sensor CCD device thermostatically-controlled equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2311734Y (en) * | 1997-09-30 | 1999-03-24 | 郑万烈 | Thermoelectric semi-conductor cold-hot head apparatus |
Non-Patent Citations (1)
| Title |
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| "航天机械泵驱动两相流冷却环路循环特性的研究";刘杰;《中国优秀博士学位论文全文数据库工程科技II辑》;20080301(第7期);第6-14、41、43-46、78-82页，附图1-5，附图1-7 * |
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