CN203054134U - Electronic component aging test module - Google Patents
Electronic component aging test module Download PDFInfo
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- CN203054134U CN203054134U CN 201320052226 CN201320052226U CN203054134U CN 203054134 U CN203054134 U CN 203054134U CN 201320052226 CN201320052226 CN 201320052226 CN 201320052226 U CN201320052226 U CN 201320052226U CN 203054134 U CN203054134 U CN 203054134U
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- heat
- carrier
- heat dissipation
- test module
- aging test
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Abstract
The utility model relates to the testing apparatus equipment technology field and specifically relates to an electronic component aging test module comprising a carrier, a semiconductor cooler and a heat dissipation device, wherein a thermal conductance system is formed by interconnecting the carrier, and the semiconductor cooler and the heat dissipation device; the carrier is provided with a product placement zone, the product placement zone is used for placement of tested products and forms thermal conductance connection, and heating tubes are arranged in the carrier; the heat dissipation device consists of heat conduction blocks, heat conduction tubes, heat dissipation fins, and a heat dissipation fan; and thermal conductance connection is formed by the heat conduction blocks and the semiconductor cooler, the heat conduction tubes which are arranged opposite to the front faces of the heat dissipation fins run through the heat dissipation fins, and heat conducting air mediums and liquid mediums are arranged in the heat conduction tubes. The electronic component aging test module can match with an electronic component aging test box or device in utilization processes. The electronic component aging test module is advantaged by realization of aging test temperature control effects, realized auxiliary heating and rapid cooling effects, high reliability, refrigerant pollution-free property, wide applicability, conformity with industrial utilization, remarkable heat dissipation effects of the heat dissipation device, greatly improved testing efficiency, and greatly economic benefits and social benefits.
Description
Technical field
The utility model relates to the testing tool equipment technical field, especially relates to electronic devices and components burn-in test Instrument technology field.
Background technology
At present, after coming out for Electronic Components Manufacturing, need do an assessment to its life-span, especially aging assessment under the environment of limit high temperature and low temperature.When carrying out burn-in test, usually adopt thermopair to gather the shell temperature of electronic devices and components, like this, the temperature that the control module of aging monitoring system just can collect according to thermopair, the shell temperature basic controlling of electronic devices and components on a fixed temperature, is only allowed its fluctuation that (is generally 1 one 2 ℃ of scholars) in the upper and lower limit scope of this fixed temperature.The structure that is used for the electronic devices and components burn-in test at present mainly is the realization temperature control that freezes, and based on water-cooled and oil cooling, this class temperature control method can only be realized the temperature control of miniwatt electronics components and parts, and situations such as leakage easily take place, the influence test, serviceable life is short, and testing efficiency is low; But exist for high-power electronic component or to the exigent situation of electronic devices and components environment temperature simultaneously and can't realize accurate temperature controlling, the problem that thermal velocity slowly or at all can't temperature control; Even realized temperature control, because the refrigeration part long-term work is at full capacity or under the overload state, also can shorten rapidly its serviceable life.
The spirit that the applicant is adhering to research innovation, keeping on improving is utilized its professional eye and professional knowledge, works out a kind of novelly, practical, and can be rapidly heated, lower the temperature, and the electronic devices and components burn-in test module of accurate temperature controlling.
Summary of the invention
The purpose of this utility model provides a kind of simple in structure, and is scientific and reasonable, easily makes, and can be rapidly heated, lower the temperature, and the electronic devices and components burn-in test module of accurate temperature controlling, meet the industry utilization, long service life.
For achieving the above object, the utility model adopts following technical scheme:
Electronic devices and components burn-in test module, this module includes carrier, semiconductor cooler and the heating radiator that is interconnected to constitute the thermal conductance system at least, described carrier is provided with for test product and bears and form the product rest area that thermal conductance connects, and is provided with heat-generating pipe in the carrier; Described heating radiator is made of heat-conducting block, heat pipe, radiating fin and radiator fan at least, and heat pipe connects heat-conducting block and radiating fin, and heat-conducting block forms thermal conductance with carrier or semiconductor cooler and is connected.
In the such scheme, for pasting, face links together between described carrier, semiconductor cooler and the heat-conducting block.
Described heat pipe wears facing to the radiating fin front, is provided with air dielectric or the liquid medium of heat conduction in the heat pipe.Liquid medium in the heat pipe can be the circulation form.
Described heat pipe designs for U-shaped, root and the heat-conducting block of bending link together, and two adjutages of heat pipe wear facing to two groups of radiating fin fronts respectively, radiator fan is arranged between the opposed end of two groups of radiating fins, and the air supply direction of radiator fan is over against the fin gap of radiating fin.
The effective design test module of the utility model, this module can mate the electronic devices and components ageing test box or equipment uses, and plays burn-in test temperature control effect.Be furnished with heat-generating pipe and semiconductor cooler in the module, play auxiliary heating and fast cooling effect, convenient test, the refrigeration work movement-less part, reliability is also than higher, no cold-producing medium pollutes, the auxiliary heating of heat-generating pipe is applicable to the temperature control test of miniwatt electronics components and parts, widely applicable, meet the industry utilization, and heating radiator is made of heat-conducting block, heat pipe, radiating fin and radiator fan at least, radiating effect is more remarkable, promote testing efficiency greatly, have high economic benefit and social benefit.
The utility model is simple in structure, and is scientific and reasonable, easily makes, and cost is low, uses and easy maintenance, and dirigibility is good, long service life, the operability of lifting means and operation ratio greatly.
Description of drawings:
Accompanying drawing 1 is the perspective view of the utility model one embodiment;
Accompanying drawing 2 is another visual angle perspective view of Fig. 1 embodiment;
Accompanying drawing 3 is the side-looking structural representation of Fig. 1 embodiment;
Accompanying drawing 4 is the plan structure synoptic diagram of Fig. 1 embodiment.
Embodiment:
Below in conjunction with accompanying drawing the utility model is further specified:
Consult shown in Fig. 1 ~ 4, the relevant a kind of electronic devices and components burn-in test module of the utility model, this module includes carrier 1, semiconductor cooler 2 and the heating radiator 3 that is interconnected to constitute the thermal conductance system at least, described carrier 1 is provided with for test product and bears and form the product rest area 11 that thermal conductance connects, and is provided with heat-generating pipe 12 in the carrier 1; Described heating radiator 3 is made of heat-conducting block 31, heat pipe 32, radiating fin 33 and radiator fan 34 at least, and heat pipe 32 connects heat-conducting block 31 and radiating fin 33, and heat-conducting block 31 forms thermal conductance with carrier 1 or semiconductor cooler 2 and is connected.In the present embodiment, link together for face pastes between carrier 1, semiconductor cooler 2 and the heat-conducting block 31, for being cascading, thermal conductivity is good; Utilize heat-generating pipe 12 heating in the carrier 1, can reach auxiliary and heat up, satisfy the needs of the temperature control test of miniwatt electronics components and parts, increase applicable surface, the propelling industry is utilized.During work, test product is placed on product rest area 11, and the product rest area 11 of present embodiment is a plane, also can supportingly be provided with auxiliaries such as tool certainly on the product rest area 11, to make things convenient for the test product location firm.Test product energising work, the heat of generation is delivered on the module, and the thermal conductance system that the carrier 1 of this module, semiconductor cooler 2 and heating radiator 3 constitute controls on a fixed temperature, thereby carries out burn-in test the shell temperature management and control of test product.In the work, heat-generating pipe 12 in the carrier 1 plays auxiliary heating, and semiconductor cooler 2 plays fast cooling, heating radiator 3 dispels the heat, to realize temperature control, work for carrier 1 and semiconductor cooler 2 can start additional effect according to actual needs, and semiconductor cooler 2 is prior art, and its principle of work is given unnecessary details no longer in detail at this.
Shown in Fig. 1 ~ 4, in the present embodiment, the heat pipe 32 in the described heating radiator 3 wears facing to radiating fin 33 fronts, is provided with air dielectric or the liquid medium of heat conduction in the heat pipe 32.In order to increase radiating effect, the liquid medium in the heat pipe 32 can be the circulation form.In the present embodiment, the many heat pipes 32 that design side by side design for U-shaped, root and the heat-conducting block 31 of bending link together, and two adjutages of heat pipe 32 wear facing to two groups of radiating fin 33 fronts respectively, increase radiating surface thus, radiator fan 34 is arranged between the opposed end of two groups of radiating fins 33, and the air supply direction of radiator fan 34 is over against the fin gap of radiating fin 33, radiator fan 34 work thus, then can realize cooling off air be followed successively by flow through two groups of radiating fin 33(one of them for inhalation flow, and another is mobile for blowing out), reach heat radiation work, thereby better heat-radiation effect, temperature control is more accurate.
Module that the utility model provides has solved thermal velocity slowly or problem that at all can't temperature control; Can reduce simultaneously refrigeration part and be operated at full capacity or the state of overload longer service life.Simple in structure, scientific and reasonable, easily to make, cost is low, uses and easy maintenance, and dirigibility is good, long service life, the operability of lifting means and operation ratio have high economic benefit and social benefit greatly.
Claims (5)
1. electronic devices and components burn-in test module, it is characterized in that: this module includes carrier (1), semiconductor cooler (2) and the heating radiator (3) that is interconnected to constitute the thermal conductance system at least, described carrier (1) is provided with for test product and bears and form the product rest area (11) that thermal conductance connects, and is provided with heat-generating pipe (12) in the carrier (1); Described heating radiator (3) is made of heat-conducting block (31), heat pipe (32), radiating fin (33) and radiator fan (34) at least, heat pipe (32) connects heat-conducting block (31) and radiating fin (33), and heat-conducting block (31) forms thermal conductance with carrier (1) or semiconductor cooler (2) and is connected.
2. electronic devices and components burn-in test module according to claim 1 is characterized in that: link together for face pastes between described carrier (1), semiconductor cooler (2) and the heat-conducting block (31).
3. electronic devices and components burn-in test module according to claim 1 is characterized in that: described heat pipe (32) wears facing to radiating fin (33) front, is provided with air dielectric or the liquid medium of heat conduction in the heat pipe (32).
4. according to claim 1 or 3 described electronic devices and components burn-in test modules, it is characterized in that: described heat pipe (32) designs for U-shaped, root and the heat-conducting block (31) of bending link together, and two adjutages of heat pipe (32) wear facing to two groups of radiating fins (33) front respectively, radiator fan (34) is arranged between the opposed end of two groups of radiating fins (33), and the air supply direction of radiator fan (34) is over against the fin gap of radiating fin (33).
5. electronic devices and components burn-in test module according to claim 3 is characterized in that: the liquid medium in the heat pipe (32) is the circulation form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320052226 CN203054134U (en) | 2013-01-30 | 2013-01-30 | Electronic component aging test module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320052226 CN203054134U (en) | 2013-01-30 | 2013-01-30 | Electronic component aging test module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203054134U true CN203054134U (en) | 2013-07-10 |
Family
ID=48737074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320052226 Expired - Lifetime CN203054134U (en) | 2013-01-30 | 2013-01-30 | Electronic component aging test module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203054134U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119127A (en) * | 2018-08-30 | 2019-01-01 | 武汉精鸿电子技术有限公司 | A kind of semiconductor memory high/low temperature ageing test box |
| CN111426891A (en) * | 2019-11-19 | 2020-07-17 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN113253102A (en) * | 2021-06-22 | 2021-08-13 | 浙江杭可仪器有限公司 | Large capacity aging testing case |
-
2013
- 2013-01-30 CN CN 201320052226 patent/CN203054134U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119127A (en) * | 2018-08-30 | 2019-01-01 | 武汉精鸿电子技术有限公司 | A kind of semiconductor memory high/low temperature ageing test box |
| CN111426891A (en) * | 2019-11-19 | 2020-07-17 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN111426891B (en) * | 2019-11-19 | 2022-08-12 | 杭州大和热磁电子有限公司 | Cooling and heating device for electronic equipment test and control method thereof |
| CN113253102A (en) * | 2021-06-22 | 2021-08-13 | 浙江杭可仪器有限公司 | Large capacity aging testing case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170626 Address after: 523000 Guangdong province Dongguan city street Changping Zhen Gang Zi Cun Gang Zi No. 18 South Road Patentee after: HUIZHOU U-CRD DETECTION TECHNOLOGY CO.,LTD. Address before: 523000 room 4, building 33, No. 502 Sima deep North Road, Changping Town, Guangdong, Dongguan Patentee before: Dai Leiyu |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130710 |
|
| CX01 | Expiry of patent term |