CN102404972A - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN102404972A CN102404972A CN2010102772361A CN201010277236A CN102404972A CN 102404972 A CN102404972 A CN 102404972A CN 2010102772361 A CN2010102772361 A CN 2010102772361A CN 201010277236 A CN201010277236 A CN 201010277236A CN 102404972 A CN102404972 A CN 102404972A
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- CN
- China
- Prior art keywords
- heat
- tec
- sink modules
- conducting plate
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A radiating device is used for radiating a heating electronic assembly. The radiating device comprises a heating conduction plate arranged on the heating electronic assembly, a radiating fin module arranged on the heat conduction plate and a thermoelectric refrigerating unit. A base board bottom of the radiating fin module is provided with a groove for containing the thermoelectric refrigerating unit. A refrigerating side of the thermoelectric refrigerating unit is arranged downward and in the same plane as the bottom face of the base board of the radiating fin module. One part of the heat conduction plate is closely contacted with the bottom face of the base board of the radiating fin base board. The other part of the heat conduction plate is closely contacted with the refrigerating side of the thermoelectric refrigerating unit. The radiating device can effectively improve radiating efficiency.
Description
Technical field
The present invention relates to a kind of heat abstractor.
Background technology
In computer system or server system; For the heating electronic building brick; Like central processing unit (Central Processing Unit; CPU) heat radiation is normally used a radiator and is carried out radiating and cooling, and traditional cpu heat mainly is through with the heat sink modules that CPU directly contacts heat being drawn, utilizing the fan blow air of heat sink modules top to flow so that the heat of heat sink modules absorption is taken away then.But; The heat sink modules of this cpu heat directly contacts with CPU; And the temperature difference of itself and air is little, is not fine thereby cause radiating effect, if ambient temperature is too high; Its radiating effect is will be more bad so, be easy to cause system speed slack-off, crash, burn consequence such as CPU.
Summary of the invention
In view of foregoing, be necessary to provide a kind of heat abstractor that can better dispel the heat to electronic building brick.
A kind of heat abstractor; Be used for dispelling the heat to a heating electronic building brick; This heat abstractor comprises that the heat-conducting plate, that is arranged on this heating electronic building brick is arranged on a heat sink modules and a TEC on this heat-conducting plate; The base plate bottom of this heat sink modules offers the fluting of ccontaining this TEC; One of this TEC refrigeration faces down and is provided with and is positioned on the same plane with the bottom surface of the substrate of this heat sink modules, and the some of this heat-conducting plate closely contacts with the bottom surface of the substrate of this heat sink modules, and another of this heat-conducting plate partly closely contacts with the one side that this TEC freezes.
Above-mentioned heat abstractor is offered fluting through the base plate bottom in this heat sink modules; And TEC is placed in this fluting, and the some of this heat-conducting plate is closely contacted with the substrate bottom surface of this heat sink modules, another of this heat-conducting plate partly closely contacts with the one side of this TEC refrigeration; So; Both can utilize the function of this substrate conduction heat, the function that also can utilize this TEC that this heat-conducting plate is freezed, both combinations can promote radiating effect greatly.
Description of drawings
Combine preferred embodiments that the present invention is described in further detail with reference to the accompanying drawings:
Fig. 1 is the sketch map of heat abstractor preferred embodiments of the present invention.
The main element symbol description
Heat abstractor 10
Heat-conducting plate 12
Heat sink modules 14
Radiating fin 144
Fluting 1462
TEC 18
Motherboard 30
Embodiment
Please refer to Fig. 1; Heat abstractor 10 of the present invention is used for to a heating electronic building brick; As the central processing unit 20 that is arranged on the motherboard 30 dispels the heat; The preferred embodiments of this heat abstractor 10 comprises a heat-conducting plate 12, a heat sink modules 14, a fan 16 and a TEC (Thermo-Electric Cooler, TEC) 18.This heat sink modules 14 comprises a substrate 146 and some radiating fins 144 that is vertically installed on this substrate 146.
One side of these substrate 146 bottoms offer one just can ccontaining this TEC 18 fluting 1462; And this TEC 18 is arranged in this fluting 1462; And making one of this TEC 18 refrigeration settings that face down, the one side that this TEC 18 freezes is positioned on the same plane with the bottom surface of the substrate 146 of this heat sink modules 14.Here need to prove also that provide the cable of these TEC 18 power supplys and control signal not shown in the drawings, this cable can directly connect corresponding connector on the motherboard 30.
This central processing unit 20 closely contacts (scribbling thermal grease usually between the two) with the bottom surface of this heat-conducting plate 12; The some of these heat-conducting plate 12 end faces (side keeps left among the figure) closely contacts with the bottom surface of this substrate 146; Another of these heat-conducting plate 12 end faces partly (among the figure on the right side) then the one side with these TEC 18 refrigeration closely contact (also can be coated with thermal grease between the two) to improve radiating effect.This fan 16 is located on this heat sink modules 14, to flow through blow air the heat of these heat sink modules 14 absorptions is taken away.
During work, the heat that this this central processing unit 20 of heat-conducting plate 12 conduction produces, and with heat transferred to substrate that is in contact with it 146 and TEC 18.On the one hand, the part that contacts with this heat-conducting plate 12 on this substrate 146 will absorb the part heat of these heat-conducting plate 12 conduction, and this part heat is distributed through radiating fin 144; On the other hand, the part that contacts with this heat-conducting plate 12 on this TEC 18 is carried out heat transferred with another part heat of this heat-conducting plate 12 conduction refrigeration modes through this TEC 18, is commonly called as the heat pump conduction pattern.
Why the present invention not only contacts this heat-conducting plate 12 but also contacts with this TEC 18 with this substrate 146; Rather than all only contact with this TEC 18; Be because setting both can utilize the function that these substrate 146 conduction heats are given radiating fin 144 like this; The function that also can utilize 18 pairs of these heat-conducting plates 12 of this TEC to freeze, both combinations can promote the radiating effect of 10 pairs of central processing units 20 of heat abstractor greatly.
Claims (4)
1. heat abstractor; Be used for dispelling the heat to a heating electronic building brick; This heat abstractor comprises that the heat-conducting plate and that is arranged on this heating electronic building brick is arranged on the heat sink modules on this heat-conducting plate; It is characterized in that: this heat abstractor also comprises a TEC, and the base plate bottom of this heat sink modules offers the fluting of ccontaining this TEC, and one of this TEC refrigeration faces down and is provided with and is positioned on the same plane with the bottom surface of the substrate of this heat sink modules; The some of this heat-conducting plate closely contacts with the bottom surface of the substrate of this heat sink modules, and another of this heat-conducting plate partly closely contacts with the one side of this TEC refrigeration.
2. heat abstractor as claimed in claim 1 is characterized in that: said heat abstractor comprises that also one is arranged at the fan of heat sink modules top.
3. heat abstractor as claimed in claim 1 is characterized in that: scribble thermal grease between the one side of the bottom surface of the substrate of this heat-conducting plate and this heat sink modules and this TEC refrigeration.
4. heat abstractor as claimed in claim 1 is characterized in that: this heat sink modules also comprises some radiating fins that are vertically installed on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102772361A CN102404972A (en) | 2010-09-09 | 2010-09-09 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102772361A CN102404972A (en) | 2010-09-09 | 2010-09-09 | Radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102404972A true CN102404972A (en) | 2012-04-04 |
Family
ID=45886593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102772361A Pending CN102404972A (en) | 2010-09-09 | 2010-09-09 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102404972A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050371A (en) * | 2015-09-02 | 2015-11-11 | 电子科技大学 | High-heat-flux electronic equipment hot spot removing device |
| CN105444462A (en) * | 2015-12-24 | 2016-03-30 | 广东富信科技股份有限公司 | Semiconductor refrigerating system |
| CN105805707A (en) * | 2014-12-31 | 2016-07-27 | 海信集团有限公司 | Heat dissipation system for closed wavelength conversion device and laser display system |
| CN106090843A (en) * | 2016-06-24 | 2016-11-09 | 安庆市奥立德光电有限公司 | A kind of LED heat abstractor |
| CN110134212A (en) * | 2019-05-22 | 2019-08-16 | 苏州浪潮智能科技有限公司 | A kind of server and its instant refrigeration heat-radiation structure |
| CN110944488A (en) * | 2019-11-01 | 2020-03-31 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050068737A1 (en) * | 2003-09-30 | 2005-03-31 | Intel Corporation | Heatsink device and method |
| CN101005053A (en) * | 2006-01-16 | 2007-07-25 | 华硕电脑股份有限公司 | Heat radiation module |
| CN201336789Y (en) * | 2008-12-16 | 2009-10-28 | 深圳市研祥通讯终端技术有限公司 | Electronic device radiator and electronic device provided with same |
-
2010
- 2010-09-09 CN CN2010102772361A patent/CN102404972A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050068737A1 (en) * | 2003-09-30 | 2005-03-31 | Intel Corporation | Heatsink device and method |
| CN101005053A (en) * | 2006-01-16 | 2007-07-25 | 华硕电脑股份有限公司 | Heat radiation module |
| CN201336789Y (en) * | 2008-12-16 | 2009-10-28 | 深圳市研祥通讯终端技术有限公司 | Electronic device radiator and electronic device provided with same |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105805707A (en) * | 2014-12-31 | 2016-07-27 | 海信集团有限公司 | Heat dissipation system for closed wavelength conversion device and laser display system |
| CN105050371A (en) * | 2015-09-02 | 2015-11-11 | 电子科技大学 | High-heat-flux electronic equipment hot spot removing device |
| CN105444462A (en) * | 2015-12-24 | 2016-03-30 | 广东富信科技股份有限公司 | Semiconductor refrigerating system |
| CN105444462B (en) * | 2015-12-24 | 2018-01-26 | 广东富信科技股份有限公司 | Semiconductor refrigeration system |
| CN106090843A (en) * | 2016-06-24 | 2016-11-09 | 安庆市奥立德光电有限公司 | A kind of LED heat abstractor |
| CN110134212A (en) * | 2019-05-22 | 2019-08-16 | 苏州浪潮智能科技有限公司 | A kind of server and its instant refrigeration heat-radiation structure |
| CN110944488A (en) * | 2019-11-01 | 2020-03-31 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120404 |