CN102404972A

CN102404972A - heat sink

Info

Publication number: CN102404972A
Application number: CN2010102772361A
Authority: CN
Inventors: 谭子佳
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2010-09-09
Filing date: 2010-09-09
Publication date: 2012-04-04

Abstract

A heat dissipation device is used for dissipating heat of a heating electronic component and comprises a heat conduction plate arranged on the heating electronic component, a heat dissipation plate module arranged on the heat conduction plate and a thermoelectric refrigerator, wherein the bottom of a substrate of the heat dissipation plate module is provided with a slot for accommodating the thermoelectric refrigerator, one refrigerating surface of the thermoelectric refrigerator is arranged downwards and is positioned on the same plane with the bottom surface of the substrate of the heat dissipation plate module, one part of the heat conduction plate is in close contact with the bottom surface of the substrate of the heat dissipation plate module, and the other part of the heat conduction plate is in close contact with the refrigerating surface of the thermoelectric refrigerator. The heat dissipation device can effectively improve the heat dissipation efficiency.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor.

Background technology

In computer system or server system; For the heating electronic building brick; Like central processing unit (Central Processing Unit; CPU) heat radiation is normally used a radiator and is carried out radiating and cooling, and traditional cpu heat mainly is through with the heat sink modules that CPU directly contacts heat being drawn, utilizing the fan blow air of heat sink modules top to flow so that the heat of heat sink modules absorption is taken away then.But; The heat sink modules of this cpu heat directly contacts with CPU; And the temperature difference of itself and air is little, is not fine thereby cause radiating effect, if ambient temperature is too high; Its radiating effect is will be more bad so, be easy to cause system speed slack-off, crash, burn consequence such as CPU.

Summary of the invention

In view of foregoing, be necessary to provide a kind of heat abstractor that can better dispel the heat to electronic building brick.

A kind of heat abstractor; Be used for dispelling the heat to a heating electronic building brick; This heat abstractor comprises that the heat-conducting plate, that is arranged on this heating electronic building brick is arranged on a heat sink modules and a TEC on this heat-conducting plate; The base plate bottom of this heat sink modules offers the fluting of ccontaining this TEC; One of this TEC refrigeration faces down and is provided with and is positioned on the same plane with the bottom surface of the substrate of this heat sink modules, and the some of this heat-conducting plate closely contacts with the bottom surface of the substrate of this heat sink modules, and another of this heat-conducting plate partly closely contacts with the one side that this TEC freezes.

Above-mentioned heat abstractor is offered fluting through the base plate bottom in this heat sink modules; And TEC is placed in this fluting, and the some of this heat-conducting plate is closely contacted with the substrate bottom surface of this heat sink modules, another of this heat-conducting plate partly closely contacts with the one side of this TEC refrigeration; So; Both can utilize the function of this substrate conduction heat, the function that also can utilize this TEC that this heat-conducting plate is freezed, both combinations can promote radiating effect greatly.

Description of drawings

Combine preferred embodiments that the present invention is described in further detail with reference to the accompanying drawings:

Fig. 1 is the sketch map of heat abstractor preferred embodiments of the present invention.

The main element symbol description

Heat abstractor 10

Heat-conducting plate 12

Heat sink modules 14

Radiating fin 144

Substrate 146

Fluting 1462

Fan 16

TEC 18

Central processing unit 20

Motherboard 30

Embodiment

Please refer to Fig. 1; Heat abstractor 10 of the present invention is used for to a heating electronic building brick; As the central processing unit 20 that is arranged on the motherboard 30 dispels the heat; The preferred embodiments of this heat abstractor 10 comprises a heat-conducting plate 12, a heat sink modules 14, a fan 16 and a TEC (Thermo-Electric Cooler, TEC) 18.This heat sink modules 14 comprises a substrate 146 and some radiating fins 144 that is vertically installed on this substrate 146.

One side of these substrate 146 bottoms offer one just can ccontaining this TEC 18 fluting 1462; And this TEC 18 is arranged in this fluting 1462; And making one of this TEC 18 refrigeration settings that face down, the one side that this TEC 18 freezes is positioned on the same plane with the bottom surface of the substrate 146 of this heat sink modules 14.Here need to prove also that provide the cable of these TEC 18 power supplys and control signal not shown in the drawings, this cable can directly connect corresponding connector on the motherboard 30.

This central processing unit 20 closely contacts (scribbling thermal grease usually between the two) with the bottom surface of this heat-conducting plate 12; The some of these heat-conducting plate 12 end faces (side keeps left among the figure) closely contacts with the bottom surface of this substrate 146; Another of these heat-conducting plate 12 end faces partly (among the figure on the right side) then the one side with these TEC 18 refrigeration closely contact (also can be coated with thermal grease between the two) to improve radiating effect.This fan 16 is located on this heat sink modules 14, to flow through blow air the heat of these heat sink modules 14 absorptions is taken away.

During work, the heat that this this central processing unit 20 of heat-conducting plate 12 conduction produces, and with heat transferred to substrate that is in contact with it 146 and TEC 18.On the one hand, the part that contacts with this heat-conducting plate 12 on this substrate 146 will absorb the part heat of these heat-conducting plate 12 conduction, and this part heat is distributed through radiating fin 144; On the other hand, the part that contacts with this heat-conducting plate 12 on this TEC 18 is carried out heat transferred with another part heat of this heat-conducting plate 12 conduction refrigeration modes through this TEC 18, is commonly called as the heat pump conduction pattern.

Why the present invention not only contacts this heat-conducting plate 12 but also contacts with this TEC 18 with this substrate 146; Rather than all only contact with this TEC 18; Be because setting both can utilize the function that these substrate 146 conduction heats are given radiating fin 144 like this; The function that also can utilize 18 pairs of these heat-conducting plates 12 of this TEC to freeze, both combinations can promote the radiating effect of 10 pairs of central processing units 20 of heat abstractor greatly.

Claims

1. A heat dissipation device for dissipating heat from a heat-generating electronic component, the heat dissipation device comprising a heat-conducting plate arranged on the heat-generating electronic component and a heat sink module disposed on the heat-conducting plate, characterized in that: the The heat dissipation device also includes a thermoelectric cooler. The bottom of the base plate of the heat sink module is provided with a slot for accommodating the thermoelectric cooler. On the same plane, a part of the heat conduction plate is in close contact with the bottom surface of the base plate of the heat sink module, and another part of the heat conduction plate is in close contact with the cooling side of the thermoelectric cooler.

2. The heat dissipation device according to claim 1, further comprising a fan disposed above the heat sink module.

3 . The heat dissipation device according to claim 1 , wherein a heat dissipation paste is coated between the heat conducting plate, the bottom surface of the substrate of the heat dissipation fin module and the cooling surface of the thermoelectric cooler. 4 .

4. The heat dissipation device according to claim 1, wherein the heat dissipation module further comprises a plurality of heat dissipation fins vertically arranged on the substrate.