CN202995598U - Cooling radiator for laptops - Google Patents
Cooling radiator for laptops Download PDFInfo
- Publication number
- CN202995598U CN202995598U CN 201220589911 CN201220589911U CN202995598U CN 202995598 U CN202995598 U CN 202995598U CN 201220589911 CN201220589911 CN 201220589911 CN 201220589911 U CN201220589911 U CN 201220589911U CN 202995598 U CN202995598 U CN 202995598U
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- CN
- China
- Prior art keywords
- upper cover
- plate
- cover plate
- cooling
- notebook computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling radiator for laptops comprises an upper cover plate, a bottom plate and a support. The upper surface of the upper cover plate matches with the bottom of a laptop in shape. The upper cover plate is detachably connected with the bottom plate. The bottom plate is provided with a hole corresponding to a fan. The support is fixed below the bottom plate. A clamp plate is disposed between the upper cover plate and the bottom plate and is provided with a plurality of removable cooling radiating modules. Each cooling radiating module comprises a radiating fin upper cover, semiconductor cooling fins and a radiating fin lower cover, the radiating fin upper cover is contacted with the upper cover plate, and a fan is disposed between the clamp plate and the bottom plate. The cooling effect of the original radiator is improved greatly. The laptop is directly cooled by semiconductor cooling fin technology, cooling by cold surfaces of semiconductor fins and thermal conduction. The fan is used for cooling heat surfaces of the radiating fins and is not blown to the laptop directly, so that air convection is decreased. Accumulating dust is decreased. The cooling radiator is evidently beneficial.
Description
Technical field
The utility model relates to a kind of heat radiator for notebook computer, particularly a kind of heat radiator for notebook computer that can freeze.
Background technology
Along with exploitation and the continuous renewal of various large softwares are regenerated, the not good problem of laptop radiating seems particularly outstanding.The miscellaneous parts such as the CPU of notebook computer and video card are when running up, can produce very large heat, more there is a kind of computer amateur extremely to hanker after " computer overclocking ", make the running of computer exceed its load rated safety parameter, allow it reach computing velocity faster, and this moment computer place and high loaded process, can produce more heat, dispel the heat bad, can cause computer operation speed slack-off, even can crash or burn computer part.Cooling pad in the market all adopts wind-cooling heat dissipating or water-cooling, wind-cooling heat dissipating is provided with fan on base namely, by accelerating the mode distribute heat of Air Flow, reduce the temperature of notebook computer, the shortcoming of this mode be fan increased to the air of notebook computer to flow, but can increase the accumulation of dust, and the accumulation of too much dust all is harmful to notebook computer and user, and this method refrigeration intensity is limited, the heat radiation requirement of notebook computer in the time of far can not satisfying, high loaded process high in environment temperature or overclocking running; Water-cooling namely utilizes recirculated water to take away the heat that computer produces, the shortcoming of this mode is in hot environment, circulating water is untimely, heat sinking function is also very limited, and the easy seepage of recirculated water, the lighter can allow the desktop shambles, and severe one water flows in notebook computer may cause scrapping of computer.
The utility model content
The utility model is for defective and the deficiency of prior art, and a kind of notebook computer refrigeration radiating pad that uses simple, good heat dissipation effect, do not accumulate dust, safe ready is provided.
the technical solution of the utility model is: a kind of notebook computer refrigeration and heat radiator, comprise upper cover plate, base plate and support, the shape of the upper surface of described upper cover plate and the bottom of notebook computer are complementary, upper cover plate is connected with base plate is detachable, be provided with the perforate corresponding with fan on base plate, described support is fixed in floor below, be provided with clamping plate between upper cover plate and base plate, these clamping plate are provided with some dismountable refrigeration radiating modules, the refrigeration radiating module comprises the heat radiator upper cover plate, semiconductor chilling plate and heat radiator lower cover slip, described heat radiator upper cover plate and upper cover plate contact with each other, be provided with fan between clamping plate and base plate.
Preferably, the part that adapts of the bottom of the upper surface of described upper cover plate and notebook computer is the good heat dissipation metal net of heat conduction.
Preferably, dismountable being connected on upper cover plate of described heat dissipation metal net.
Preferably, described support is jack column, is articulated in floor below.
The beneficial effects of the utility model are:
1, this notebook computer refrigeration radiating pad adopts semiconductor refrigerating technology, and the heat that utilizes the temperature difference directly to absorb notebook computer descends the notebook computer temperature, and not influenced by ambient temperature during use, heat-sinking capability is strong;
2, not directly to the computer blowing, can reduce the accumulation of dust;
3, the utility model cost is low, and is lightly portable, can help giant brain software user, computer game fan and like ardently that the user who realizes CPU overclocking phenomenon solves CPU and video card excess Temperature and problem that blue screen and deadlock occur.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model specific embodiment;
Accompanying drawing 2 is the utility model specific embodiment side schematic view.
Embodiment
In order further to understand structure of the present utility model, feature and other purpose, now be described in detail as follows in conjunction with appended preferred embodiment, illustrated preferred embodiment only is used for the explanation the technical solution of the utility model, and non-limiting the utility model.
as depicted in figs. 1 and 2, a kind of notebook computer refrigeration and heat radiator, comprise upper cover plate 1, base plate 2 and support 3, the shape of the upper surface of described upper cover plate 1 and the bottom of notebook computer are complementary, the part that wherein adapts with the bottom of notebook computer is the good heat dissipation metal net 10 of heat conduction, detachable being connected on upper cover plate 1, upper cover plate 1 is connected with base plate 2 is detachable, be provided with the perforate corresponding with fan on base plate 2, described support 3 is jack column, be articulated in base plate 2 belows, be provided with clamping plate 4 between upper cover plate 1 and base plate 2, these clamping plate 4 are provided with some dismountable refrigeration radiating modules 5, refrigeration radiating module 5 comprises heat radiator upper cover plate 6, semiconductor chilling plate 7 and heat radiator lower cover slip 8, described heat radiator upper cover plate 6 contacts with each other with upper cover plate 1, be provided with fan 9 between clamping plate 4 and base plate 2.
The principle of work of semiconductor chilling plate in this notebook computer refrigeration radiating pad: (TE also is thermoelectric cooling module to semiconductor cooler, be a kind of heat pump, its advantage is there is no slide unit, is applied in some spaces and is restricted, reliability requirement is high, the occasion that cryogen-free pollutes.The work of semiconductor cooler running is use DC current, but its not only refrigeration but also can heat, the polarity by the change DC current decides and realize refrigeration or heating on same refrigerator, and the generation of this effect is exactly the principle by thermoelectricity.Semiconductor cooler is to utilize the Peltier effect of semiconductor material to make.So-called Peltier effect refers to when DC current is passed through the galvanic couple of two kinds of semiconductor materials compositions the heat absorption of one end, the phenomenon of an end heat release.Mainly as the semiconductor material of TEC, the bismuth telluride element adopts the electricity series connection to the bismuth telluride of heavily doped N-type and P type, and is parallel heating.TEC comprises some P types and N-type to group, and they connect together by electrode, and are clipped between two ceramic electrodes; The effect of the ceramic electrode of each side of TEC assembly is the short circuit that prevents the laser tube core that caused by the TEC circuit; The control temperature of TEC can reach 30 ℃-40 ℃, and when having electric current to flow through from TEC, the heat that electric current produces can pass to opposite side from the side of TEC, produces " heat " side and " cold " side on TEC, heating and the refrigeration principle of Here it is TEC.Refrigeration or heating, and the speed of refrigeration, heating, decided by direction of current and size by it.In actual applications, TEC is arranged between heat sink and package shell usually.Its cold side contacts with the laser instrument core, plays refrigeration, and its hot side contacts with heat radiator, heat is fallen apart go to the outside, and this is also the most general a kind of situation.
This heating radiator is divided into three parts: the clamping plate 4 at upper cover plate 1, base plate 2 and middle part.The connection that upper cover plate 1 is connected with base plate is to be realized by securing member, and concrete fastening position can be decided according to actual processing.Base plate 2 is main bodys of an inclination, and central authorities have by motor-operated fan, realizes the radiating treatment to hot side.Base plate 2 has the support 3 that can regulate, the angle that can regulate inclination.Upper cover plate 1 is to play a supportive role, and the centre is heat dissipation metal net 10, and upper cover plate 1, base plate 2 also have the supporting construction of clamping plate 4, all can be by plastic production.Heat dissipation metal net 10 passes to the temperature of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate the bottom of notebook computer, realizes cooling.Core component is clamping plate 4 devices that the middle part can be extracted out.The above is distributing eight semiconductor chilling plates 7 by the heat radiator of aluminum parcel, and can be used for to the notebook cooling summer, and the words in winter can be extracted out, and electrode is reversed, and is used for some things of heating.
The utility model has improved the cooling-down effect of original heating radiator greatly, has adopted the technology of semiconductor chilling plate, utilizes semiconductor chip huyashi-chuuka (cold chinese-style noodles) temperature to reduce, and conducts by heat, directly lowers the temperature for notebook computer; Fan is the hot side heat radiation to heat radiator, directly to the notebook computer blowing, does not reduce the circulation of air, can reduce the accumulation of dust, and beneficial effect is remarkable.
Claims (4)
1. notebook computer refrigeration and heat radiator, comprise upper cover plate (1), base plate (2) and support (3), it is characterized in that: the shape of the upper surface of described upper cover plate (1) and the bottom of notebook computer are complementary, upper cover plate (1) and detachable connection of base plate (2), be provided with the perforate corresponding with fan on base plate (2), described support (3) is fixed in below base plate (2), be provided with clamping plate (4) between upper cover plate (1) and base plate (2), these clamping plate (4) are provided with some dismountable refrigeration radiating modules (5), refrigeration radiating module (5) comprises heat radiator upper cover plate (6), semiconductor chilling plate (7) and heat radiator lower cover slip (8), described heat radiator upper cover plate (6) contacts with each other with upper cover plate (1), be provided with fan (9) between clamping plate (4) and base plate (2).
2. notebook computer refrigeration and heat radiator according to claim 1, it is characterized in that: the part that the upper surface of described upper cover plate (1) and the bottom of notebook computer adapt is heat dissipation metal net (10).
3. notebook computer refrigeration and heat radiator according to claim 2, it is characterized in that: described heat dissipation metal net (10) is dismountable to be connected on upper cover plate (1).
4. according to claim 1-3 described notebook computer refrigeration and heat radiators of any one, it is characterized in that: described support (3) is jack column, is articulated in base plate (2) below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220589911 CN202995598U (en) | 2012-11-12 | 2012-11-12 | Cooling radiator for laptops |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220589911 CN202995598U (en) | 2012-11-12 | 2012-11-12 | Cooling radiator for laptops |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202995598U true CN202995598U (en) | 2013-06-12 |
Family
ID=48566753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220589911 Expired - Fee Related CN202995598U (en) | 2012-11-12 | 2012-11-12 | Cooling radiator for laptops |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202995598U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503554A (en) * | 2014-12-08 | 2015-04-08 | 合肥宝龙达信息技术有限公司 | Notebook fan and mounting method thereof |
| CN106020390A (en) * | 2016-05-11 | 2016-10-12 | 程彬彬 | Easy-cleaning laptop cooling device |
| CN106895531A (en) * | 2017-04-26 | 2017-06-27 | 重庆大学 | A kind of semiconductor air conditioner support |
| CN111103954A (en) * | 2019-12-30 | 2020-05-05 | 黄冈师范学院 | Novel notebook computer heat dissipation frame |
-
2012
- 2012-11-12 CN CN 201220589911 patent/CN202995598U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503554A (en) * | 2014-12-08 | 2015-04-08 | 合肥宝龙达信息技术有限公司 | Notebook fan and mounting method thereof |
| CN104503554B (en) * | 2014-12-08 | 2018-02-23 | 合肥宝龙达信息技术有限公司 | A kind of notebook fan and its installation method |
| CN106020390A (en) * | 2016-05-11 | 2016-10-12 | 程彬彬 | Easy-cleaning laptop cooling device |
| CN106895531A (en) * | 2017-04-26 | 2017-06-27 | 重庆大学 | A kind of semiconductor air conditioner support |
| CN106895531B (en) * | 2017-04-26 | 2023-07-21 | 重庆大学 | Semiconductor air conditioner support |
| CN111103954A (en) * | 2019-12-30 | 2020-05-05 | 黄冈师范学院 | Novel notebook computer heat dissipation frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20131112 |