CN209168016U - A kind of built-in notebook computer radiating device with high heat dispersion - Google Patents

A kind of built-in notebook computer radiating device with high heat dispersion Download PDF

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Publication number
CN209168016U
CN209168016U CN201821896854.2U CN201821896854U CN209168016U CN 209168016 U CN209168016 U CN 209168016U CN 201821896854 U CN201821896854 U CN 201821896854U CN 209168016 U CN209168016 U CN 209168016U
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CN
China
Prior art keywords
water
cooling
built
notebook
wind
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821896854.2U
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Chinese (zh)
Inventor
崔鹏
高同
李慧强
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Guizhou University of Finance and Economics
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Guizhou University of Finance and Economics
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Filing date
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Priority to CN201821896854.2U priority Critical patent/CN209168016U/en
Application granted granted Critical
Publication of CN209168016U publication Critical patent/CN209168016U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of built-in notebook computer radiating device with high heat dispersion, including air-cooled portion and water cooling portion, water cooling portion includes water-cooling plate and heat dissipation pipe, water-cooling plate is hollow structure, it is tightly attached to notebook CPU, on GPU and PCH, heat dissipation pipe is built into water-cooling plate, water inlet end is connected to water tank by water pump, water outlet is connected to water tank, air-cooled portion includes wind-cooling heat dissipating body and fan, wind-cooling heat dissipating body one end is connected on water-cooling plate, and water-cooling intralamellar part is connected to by built-in heat conducting pipe, fan is mounted on by wind-cooling heat dissipating body, and fan outlet face wind-cooling heat dissipating body, wind-cooling heat dissipating body is located at notebook air outlet.The utility model realizes the rapidly and efficiently heat dissipation of notebook, and heat dissipation performance is more preferable, is suitable for powerful laptop heat-dissipation, greatly improves the processor of such notebook, the processing speed of video card, south bridge, it is ensured that the runnability of notebook is reliable and stable.

Description

A kind of built-in notebook computer radiating device with high heat dispersion
Technical field
The utility model relates to a kind of built-in notebook computer radiating device with high heat dispersion belongs to built-in notebook and dissipates Thermal technical field.
Background technique
For notebook in running, many internal components can generate a large amount of thermal energy, and notebook is enclosed construction, wherein work The heat dissipation capacity for making highest CPU, GPU and PCH three of load is maximum, and the core of current CPU is more and more, and GPU power consumption is increasingly Greatly, when system runs high image quality game, central processing unit and drawing chip processor are in higher load condition, while also can Cause a large amount of thermal energy to generate, if these thermal energy cannot effectively disperse, gently leads to central processing unit or drawing chip processing The efficiency of device declines, and the damage for causing central processing unit or drawing chip processor or service life are more likely to when serious substantially It reduces.
The radiating mode of traditional notebook adds the air cooling equipment that fan is constituted using radiating fin, however processor produces It is raw to be thermally conducted to force loss by way of the air-flow that fan generates, but be limited to air after radiating fin itself Heat conduction property it is poor, therefore forced air cooling itself still has its limit, is unable to satisfy heat dissipation performance, especially high power consumption high-performance It is required that notebook.
Summary of the invention
Technical problem to be solved by the utility model is: providing a kind of built-in laptop heat-dissipation dress with high heat dispersion It sets, to solve above-mentioned problems of the prior art.
The technical solution that the utility model is taken are as follows: a kind of built-in notebook computer radiating device with high heat dispersion, packet Air-cooled portion and water cooling portion are included, water cooling portion includes water-cooling plate and heat dissipation pipe, and water-cooling plate is hollow structure, is tightly attached to pen Remember on this CPU, GPU and PCH, heat dissipation pipe is built into water-cooling plate, and water inlet end is connected to water tank, water outlet by water pump It is connected to water tank, air-cooled portion includes wind-cooling heat dissipating body and fan, and wind-cooling heat dissipating body one end is connected on water-cooling plate, and is passed through Built-in heat conducting pipe is connected to water-cooling intralamellar part, and fan is mounted on by wind-cooling heat dissipating body, and fan outlet face wind-cooling heat dissipating Body, wind-cooling heat dissipating body are located at notebook air outlet.
Preferably, heat dissipation scales are provided on above-mentioned wind-cooling heat dissipating body.
Preferably, above-mentioned water-cooling plate includes the soaking plate and copper plate for being close to notebook CPU, GPU and PCH, soaking Plate and copper plate are fixed using docking mode.
Preferably, heat dissipation salient point is provided on above-mentioned copper plate.
Preferably, above-mentioned heat dissipation pipe is flat type structure in water-cooling plate, using snakelike close arrangement, flat type two sides Face is tightly attached on water-cooling plate.
Preferably, above-mentioned heat dissipation pipe uses the two-tube serpentine configuration of doubling or single-tube serpentine structure.
Preferably, temperature sensor is installed on the water outlet of above-mentioned heat dissipation pipe.
Preferably, above-mentioned temperature sensor is connected to controller, and controller is connected to water pump.
The utility model has the beneficial effects that compared with prior art, the utility model by notebook CPU, GPU and Water-cooling plate is set on PCH and its heat is further shifted into dynamic wind-cooling heat dissipating body, realizes rapidly and efficiently dissipating for notebook Heat, heat dissipation performance is more preferable, is especially suitable for the powerful laptop heat-dissipation of high-performance, greatly improves the processing of such notebook The processing speed of device, video card, south bridge, it is ensured that the runnability of notebook is reliable and stable, the utility model also have structure it is simple, Feature at low cost.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the utility model;
Fig. 2 is the overlooking structure diagram of the utility model;
Fig. 3 is the forward sight structural schematic diagram of the utility model.
Specific embodiment
With reference to the accompanying drawing and the utility model is described further in specific embodiment.
Embodiment 1: as shown in Figure 1-Figure 3, a kind of built-in notebook computer radiating device with high heat dispersion, including it is air-cooled Portion 1 and water cooling portion 2, water cooling portion 2 include water-cooling plate 201 and heat dissipation pipe 202, and water-cooling plate 201 is hollow structure, tightly It is attached on notebook CPU, GPU and PCH and is fixedly connected in notebook by screw, heat dissipation pipe 202 is built into water cooling and dissipates In hot plate 201, water inlet end is connected to water tank 203 by water pump 205, and water outlet is connected to water tank, and air-cooled portion 1 includes wind-cooling heat dissipating Body 101 and fan 102,101 one end of wind-cooling heat dissipating body is connected on water-cooling plate 201, and is connected to water by built-in heat conducting pipe Inside cold heat sink 201, fan 102 is mounted on by wind-cooling heat dissipating body 101, and 102 air outlet face wind-cooling heat dissipating body of fan 101, wind-cooling heat dissipating body 101 is located at notebook air outlet, and the water inlet end of heat dissipation pipe 202 and water outlet are inserted using fast plug Sealing is connect, heat conducting pipe, which is inserted into water-cooling plate 201, abuts the side notebook CPU, GPU and PCH.
Preferably, heat dissipation scales 103 are provided on above-mentioned wind-cooling heat dissipating body 101, wind-cooling heat dissipating effect can be further provided for Fruit, heat dissipation performance are more preferable.
Preferably, above-mentioned water-cooling plate 201 includes the soaking plate 207 and copper plate for being close to notebook CPU, GPU and PCH 208, soaking plate and copper plate are fixed using docking mode, soaking plate by thermal grease paste notebook CPU, GPU and PCH, it can be ensured that notebook CPU, GPU and PCH heat dissipation performance is more preferable, and heat dissipation effect can be also further provided for using copper plate Fruit, the two are close to heat dissipation pipe, and heat dissipation is greatly speeded up, and soaking plate 207 is close to the face notebook CPU, GPU and PCH and is provided with heat dissipation Layer of silica gel.
Preferably, it is provided with heat dissipation salient point 204 on above-mentioned copper plate 208, increases heat dissipation area, improves heat dissipation effect.
Preferably, above-mentioned heat dissipation pipe 202 is flat type structure in water-cooling plate 201, flat using snakelike close arrangement Type two sides are tightly attached on water-cooling plate 201, increase the contact area of heat dissipation pipe and water-cooling plate, it is further provided are dissipated Thermal effect.
Preferably, above-mentioned heat dissipation pipe 202 is using the two-tube serpentine configuration of doubling or single-tube serpentine structure, convenient for arrangement.
Preferably, temperature sensor 206 is installed on the water outlet of above-mentioned heat dissipation pipe 202, heat dissipation can be monitored in real time Effect.
Preferably, above-mentioned temperature sensor is connected to controller, and controller is connected to water pump 202, when temperature is greater than setting When threshold value, controller controls water pump and accelerates water velocity, improves heat dissipation effect and water pump utilization rate.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation Or replacement, it should be covered within the scope of the utility model, therefore, the protection scope of the utility model should be with the power Subject to the protection scope that benefit requires.

Claims (8)

1. a kind of built-in notebook computer radiating device with high heat dispersion, it is characterised in that: including air-cooled portion (1) and water cooling portion (2), water cooling portion (2) include water-cooling plate (201) and heat dissipation pipe (202), and water-cooling plate (201) is hollow structure, tightly It is attached on notebook CPU, GPU and PCH, heat dissipation pipe (202) is built into water-cooling plate (201), and water inlet end passes through water pump (205) it is connected to water tank (203), water outlet is connected to water tank, and air-cooled portion (1) includes wind-cooling heat dissipating body (101) and fan (102), wind-cooling heat dissipating body (101) one end is connected on water-cooling plate (201), and is connected to water-cooling by built-in heat conducting pipe Plate (201) is internal, and fan (102) is mounted on wind-cooling heat dissipating body (101) side, and fan (102) air outlet face wind-cooling heat dissipating body (101), wind-cooling heat dissipating body (101) is located at notebook air outlet.
2. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 1, it is characterised in that: wind Heat dissipation scales are provided on cold radiator (101).
3. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 1, it is characterised in that: water Cold heat sink (201) includes the soaking plate (207) and copper plate (208) for being close to notebook CPU, GPU and PCH, soaking plate (207) It is fixed with copper plate (208) using docking mode.
4. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 3, it is characterised in that: purple Heat dissipation salient point (204) is provided on copper sheet (208).
5. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 1, it is characterised in that: dissipate Hot-water line (202) is flat type structure in water-cooling plate (201), and using snakelike close arrangement, flat type two sides are tightly attached to water On cold heat sink (201).
6. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 5, it is characterised in that: dissipate Hot-water line (202) uses the two-tube serpentine configuration of doubling or single-tube serpentine structure.
7. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 5, it is characterised in that: dissipate Temperature sensor (206) are installed on the water outlet of hot-water line (202).
8. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 7, it is characterised in that: temperature Degree sensor is connected to controller, and controller is connected to water pump (205).
CN201821896854.2U 2018-11-16 2018-11-16 A kind of built-in notebook computer radiating device with high heat dispersion Expired - Fee Related CN209168016U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821896854.2U CN209168016U (en) 2018-11-16 2018-11-16 A kind of built-in notebook computer radiating device with high heat dispersion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821896854.2U CN209168016U (en) 2018-11-16 2018-11-16 A kind of built-in notebook computer radiating device with high heat dispersion

Publications (1)

Publication Number Publication Date
CN209168016U true CN209168016U (en) 2019-07-26

Family

ID=67338575

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821896854.2U Expired - Fee Related CN209168016U (en) 2018-11-16 2018-11-16 A kind of built-in notebook computer radiating device with high heat dispersion

Country Status (1)

Country Link
CN (1) CN209168016U (en)

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190726

Termination date: 20201116