CN209168016U - A kind of built-in notebook computer radiating device with high heat dispersion - Google Patents
A kind of built-in notebook computer radiating device with high heat dispersion Download PDFInfo
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- CN209168016U CN209168016U CN201821896854.2U CN201821896854U CN209168016U CN 209168016 U CN209168016 U CN 209168016U CN 201821896854 U CN201821896854 U CN 201821896854U CN 209168016 U CN209168016 U CN 209168016U
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- water
- built
- cooling
- notebook computer
- radiating device
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- 239000006185 dispersion Substances 0.000 title claims description 14
- 238000001816 cooling Methods 0.000 claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 8
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 238000003032 molecular docking Methods 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000001550 time effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种具有高散热性能的内置笔记本散热装置，包括风冷部和水冷部，水冷部包括水冷散热板和散热水管，水冷散热板为中空结构，紧贴在笔记本CPU、GPU及PCH上，散热水管内置到水冷散热板内，进水端通过水泵连接到水箱，出水端连接到水箱，风冷部包括风冷散热体和风扇，风冷散热体一端连接在水冷散热板上，并通过内置导热管连通水冷散热板内部，风扇安装在风冷散热体旁，且风扇出风口正对风冷散热体，风冷散热体位于笔记本出风口处。本实用新型实现笔记本的快速高效散热，散热性能更好，适合用于大功率的笔记本散热，大大提高该类笔记本的处理器、显卡、南桥的处理速度，确保笔记本的运行性能稳定可靠。
The utility model discloses a built-in notebook cooling device with high heat dissipation performance. On the PCH, the cooling water pipe is built into the water-cooled cooling plate, the water inlet is connected to the water tank through the water pump, and the water outlet is connected to the water tank. The air-cooled part includes an air-cooled heat sink and a fan. The inside of the water-cooled heat sink is connected through a built-in heat pipe, the fan is installed next to the air-cooled heat sink, and the fan outlet is facing the air-cooled heat sink, and the air-cooled heat sink is located at the air outlet of the notebook. The utility model realizes fast and efficient heat dissipation of notebooks, has better heat dissipation performance, is suitable for heat dissipation of high-power notebooks, greatly improves the processing speed of processors, graphics cards and south bridges of such notebooks, and ensures stable and reliable operation performance of the notebooks.
Description
Technical field
The utility model relates to a kind of built-in notebook computer radiating device with high heat dispersion belongs to built-in notebook and dissipates
Thermal technical field.
Background technique
For notebook in running, many internal components can generate a large amount of thermal energy, and notebook is enclosed construction, wherein work
The heat dissipation capacity for making highest CPU, GPU and PCH three of load is maximum, and the core of current CPU is more and more, and GPU power consumption is increasingly
Greatly, when system runs high image quality game, central processing unit and drawing chip processor are in higher load condition, while also can
Cause a large amount of thermal energy to generate, if these thermal energy cannot effectively disperse, gently leads to central processing unit or drawing chip processing
The efficiency of device declines, and the damage for causing central processing unit or drawing chip processor or service life are more likely to when serious substantially
It reduces.
The radiating mode of traditional notebook adds the air cooling equipment that fan is constituted using radiating fin, however processor produces
It is raw to be thermally conducted to force loss by way of the air-flow that fan generates, but be limited to air after radiating fin itself
Heat conduction property it is poor, therefore forced air cooling itself still has its limit, is unable to satisfy heat dissipation performance, especially high power consumption high-performance
It is required that notebook.
Summary of the invention
Technical problem to be solved by the utility model is: providing a kind of built-in laptop heat-dissipation dress with high heat dispersion
It sets, to solve above-mentioned problems of the prior art.
The technical solution that the utility model is taken are as follows: a kind of built-in notebook computer radiating device with high heat dispersion, packet
Air-cooled portion and water cooling portion are included, water cooling portion includes water-cooling plate and heat dissipation pipe, and water-cooling plate is hollow structure, is tightly attached to pen
Remember on this CPU, GPU and PCH, heat dissipation pipe is built into water-cooling plate, and water inlet end is connected to water tank, water outlet by water pump
It is connected to water tank, air-cooled portion includes wind-cooling heat dissipating body and fan, and wind-cooling heat dissipating body one end is connected on water-cooling plate, and is passed through
Built-in heat conducting pipe is connected to water-cooling intralamellar part, and fan is mounted on by wind-cooling heat dissipating body, and fan outlet face wind-cooling heat dissipating
Body, wind-cooling heat dissipating body are located at notebook air outlet.
Preferably, heat dissipation scales are provided on above-mentioned wind-cooling heat dissipating body.
Preferably, above-mentioned water-cooling plate includes the soaking plate and copper plate for being close to notebook CPU, GPU and PCH, soaking
Plate and copper plate are fixed using docking mode.
Preferably, heat dissipation salient point is provided on above-mentioned copper plate.
Preferably, above-mentioned heat dissipation pipe is flat type structure in water-cooling plate, using snakelike close arrangement, flat type two sides
Face is tightly attached on water-cooling plate.
Preferably, above-mentioned heat dissipation pipe uses the two-tube serpentine configuration of doubling or single-tube serpentine structure.
Preferably, temperature sensor is installed on the water outlet of above-mentioned heat dissipation pipe.
Preferably, above-mentioned temperature sensor is connected to controller, and controller is connected to water pump.
The utility model has the beneficial effects that compared with prior art, the utility model by notebook CPU, GPU and
Water-cooling plate is set on PCH and its heat is further shifted into dynamic wind-cooling heat dissipating body, realizes rapidly and efficiently dissipating for notebook
Heat, heat dissipation performance is more preferable, is especially suitable for the powerful laptop heat-dissipation of high-performance, greatly improves the processing of such notebook
The processing speed of device, video card, south bridge, it is ensured that the runnability of notebook is reliable and stable, the utility model also have structure it is simple,
Feature at low cost.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the utility model；
Fig. 2 is the overlooking structure diagram of the utility model；
Fig. 3 is the forward sight structural schematic diagram of the utility model.
Specific embodiment
With reference to the accompanying drawing and the utility model is described further in specific embodiment.
Embodiment 1: as shown in Figure 1-Figure 3, a kind of built-in notebook computer radiating device with high heat dispersion, including it is air-cooled
Portion 1 and water cooling portion 2, water cooling portion 2 include water-cooling plate 201 and heat dissipation pipe 202, and water-cooling plate 201 is hollow structure, tightly
It is attached on notebook CPU, GPU and PCH and is fixedly connected in notebook by screw, heat dissipation pipe 202 is built into water cooling and dissipates
In hot plate 201, water inlet end is connected to water tank 203 by water pump 205, and water outlet is connected to water tank, and air-cooled portion 1 includes wind-cooling heat dissipating
Body 101 and fan 102,101 one end of wind-cooling heat dissipating body is connected on water-cooling plate 201, and is connected to water by built-in heat conducting pipe
Inside cold heat sink 201, fan 102 is mounted on by wind-cooling heat dissipating body 101, and 102 air outlet face wind-cooling heat dissipating body of fan
101, wind-cooling heat dissipating body 101 is located at notebook air outlet, and the water inlet end of heat dissipation pipe 202 and water outlet are inserted using fast plug
Sealing is connect, heat conducting pipe, which is inserted into water-cooling plate 201, abuts the side notebook CPU, GPU and PCH.
Preferably, heat dissipation scales 103 are provided on above-mentioned wind-cooling heat dissipating body 101, wind-cooling heat dissipating effect can be further provided for
Fruit, heat dissipation performance are more preferable.
Preferably, above-mentioned water-cooling plate 201 includes the soaking plate 207 and copper plate for being close to notebook CPU, GPU and PCH
208, soaking plate and copper plate are fixed using docking mode, soaking plate by thermal grease paste notebook CPU, GPU and
PCH, it can be ensured that notebook CPU, GPU and PCH heat dissipation performance is more preferable, and heat dissipation effect can be also further provided for using copper plate
Fruit, the two are close to heat dissipation pipe, and heat dissipation is greatly speeded up, and soaking plate 207 is close to the face notebook CPU, GPU and PCH and is provided with heat dissipation
Layer of silica gel.
Preferably, it is provided with heat dissipation salient point 204 on above-mentioned copper plate 208, increases heat dissipation area, improves heat dissipation effect.
Preferably, above-mentioned heat dissipation pipe 202 is flat type structure in water-cooling plate 201, flat using snakelike close arrangement
Type two sides are tightly attached on water-cooling plate 201, increase the contact area of heat dissipation pipe and water-cooling plate, it is further provided are dissipated
Thermal effect.
Preferably, above-mentioned heat dissipation pipe 202 is using the two-tube serpentine configuration of doubling or single-tube serpentine structure, convenient for arrangement.
Preferably, temperature sensor 206 is installed on the water outlet of above-mentioned heat dissipation pipe 202, heat dissipation can be monitored in real time
Effect.
Preferably, above-mentioned temperature sensor is connected to controller, and controller is connected to water pump 202, when temperature is greater than setting
When threshold value, controller controls water pump and accelerates water velocity, improves heat dissipation effect and water pump utilization rate.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model, therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (8)
1. a kind of built-in notebook computer radiating device with high heat dispersion, it is characterised in that: including air-cooled portion (1) and water cooling portion
(2), water cooling portion (2) include water-cooling plate (201) and heat dissipation pipe (202), and water-cooling plate (201) is hollow structure, tightly
It is attached on notebook CPU, GPU and PCH, heat dissipation pipe (202) is built into water-cooling plate (201), and water inlet end passes through water pump
(205) it is connected to water tank (203), water outlet is connected to water tank, and air-cooled portion (1) includes wind-cooling heat dissipating body (101) and fan
(102), wind-cooling heat dissipating body (101) one end is connected on water-cooling plate (201), and is connected to water-cooling by built-in heat conducting pipe
Plate (201) is internal, and fan (102) is mounted on wind-cooling heat dissipating body (101) side, and fan (102) air outlet face wind-cooling heat dissipating body
(101), wind-cooling heat dissipating body (101) is located at notebook air outlet.
2. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 1, it is characterised in that: wind
Heat dissipation scales are provided on cold radiator (101).
3. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 1, it is characterised in that: water
Cold heat sink (201) includes the soaking plate (207) and copper plate (208) for being close to notebook CPU, GPU and PCH, soaking plate (207)
It is fixed with copper plate (208) using docking mode.
4. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 3, it is characterised in that: purple
Heat dissipation salient point (204) is provided on copper sheet (208).
5. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 1, it is characterised in that: dissipate
Hot-water line (202) is flat type structure in water-cooling plate (201), and using snakelike close arrangement, flat type two sides are tightly attached to water
On cold heat sink (201).
6. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 5, it is characterised in that: dissipate
Hot-water line (202) uses the two-tube serpentine configuration of doubling or single-tube serpentine structure.
7. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 5, it is characterised in that: dissipate
Temperature sensor (206) are installed on the water outlet of hot-water line (202).
8. a kind of built-in notebook computer radiating device with high heat dispersion according to claim 7, it is characterised in that: temperature
Degree sensor is connected to controller, and controller is connected to water pump (205).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821896854.2U CN209168016U (en) | 2018-11-16 | 2018-11-16 | A kind of built-in notebook computer radiating device with high heat dispersion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821896854.2U CN209168016U (en) | 2018-11-16 | 2018-11-16 | A kind of built-in notebook computer radiating device with high heat dispersion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209168016U true CN209168016U (en) | 2019-07-26 |
Family
ID=67338575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821896854.2U Expired - Fee Related CN209168016U (en) | 2018-11-16 | 2018-11-16 | A kind of built-in notebook computer radiating device with high heat dispersion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209168016U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115576398A (en) * | 2021-07-06 | 2023-01-06 | 技嘉科技股份有限公司 | notebook computer |
| WO2023103489A1 (en) * | 2021-12-07 | 2023-06-15 | 中兴通讯股份有限公司 | Mobile terminal heat dissipation device, mobile terminal heat dissipation method, and mobile terminal |
| CN118210361A (en) * | 2024-03-25 | 2024-06-18 | 江苏商贸职业学院 | Notebook computer radiator based on environment detection and installation method thereof |
-
2018
- 2018-11-16 CN CN201821896854.2U patent/CN209168016U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115576398A (en) * | 2021-07-06 | 2023-01-06 | 技嘉科技股份有限公司 | notebook computer |
| WO2023103489A1 (en) * | 2021-12-07 | 2023-06-15 | 中兴通讯股份有限公司 | Mobile terminal heat dissipation device, mobile terminal heat dissipation method, and mobile terminal |
| CN118210361A (en) * | 2024-03-25 | 2024-06-18 | 江苏商贸职业学院 | Notebook computer radiator based on environment detection and installation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190726 Termination date: 20201116 |
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| CF01 | Termination of patent right due to non-payment of annual fee |