CN203433456U - Water-cooling heat dissipation device for notebook computer - Google Patents
Water-cooling heat dissipation device for notebook computer Download PDFInfo
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- CN203433456U CN203433456U CN201320607120.9U CN201320607120U CN203433456U CN 203433456 U CN203433456 U CN 203433456U CN 201320607120 U CN201320607120 U CN 201320607120U CN 203433456 U CN203433456 U CN 203433456U
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- heat sink
- notebook computer
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- water
- heat dissipation
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Abstract
The utility model discloses a water-cooling heat dissipation device for a notebook computer. The water-cooling heat dissipation device comprises a water pump, a pipeline, a main board internal power source, a heat sink, a foldable support frame and heat absorption devices, and is characterized in that one heat absorption device is arranged on each of the central processing unit and the display card both of the notebook computer; heat dissipation liquid in the heat sink is communicated with the heat absorption devices through the water pump and the pipeline, and then returns to the heat sink through the pipeline to form a heat dissipation loop. According to the utility model, the circular flow of liquid is utilized to realize heat dissipation, and the less power is used to realize higher heat dissipation effect, so that the noise caused by heat dissipation of the notebook computer is reduced; a foldable structure is adopted, so that the space utilization ratio is increased, and the water-cooling heat dissipation device facilitates the realization of green living and efficient work.
Description
Technical field
The utility model belongs to the heating radiator field of electronic devices and components, relates in particular to notebook computer water-cooling heat radiating device and application process thereof.
Background technology
At present, the heat radiator for notebook computer of main flow is used traditional air-cooled heat radiation mostly, adopt the cooling heater members of Forced Convection Air, by cooling-air force feed to radiating element surface so that this place's heat is taken away, this kind of scheme cooling effect is directly proportional to wind speed and the radiator surface area of fan.Yet, along with improving constantly of central processing unit performance and integrated level, the thermal value of central processing unit also increases thereupon, because notebook computer inner space is narrow and small, fan blade size is subject to installing space restriction to be difficult to increase, and improve rotation speed of the fan and can bring cost and noise problem again, and, once element heating density is too high, chilled air cools effect is by unsatisfactory.Air cooling mode radiating effect has not almost had the rising space at present, is difficult to adapt to notebook computer power consumption and continues the needs that increase.In addition, based on the special working environment of notebook computer and structure thereof, the hot blast that dispels the heat during working with notebook computer is easily blocked, and causes notebook computer ambient air temperature to rise, and is unfavorable for heat radiation.Meanwhile, in order to discharge heat radiation hot blast, need on shell, open louvre, the machine inner part of making can directly contact outside atmosphere, and the problem such as cause inner dust stratification, make moist increases probability of malfunction and maintenance cost.
Utility model content
In order to overcome the problem of existing heat radiator for notebook computer, especially above-mentioned three point problem, the utility model provides a kind of water-cooling heat radiating device, and it can significantly improve laptop radiating effect and overcome a series of deficiencies of wind-cooling heat dissipating.
The utility model solves the technical scheme that its technical matters adopts: a kind of notebook computer water-cooling heat radiating device, comprise water pump (1), pipeline (2), mainboard internal electric source (3), heat sink (4), foldable support frame (5) and heat sink (6), wherein, on the central processing unit of notebook computer and figure display chip, be respectively equipped with heat sink (6), liquid in heat sink (4) is connected heat sink (6) by water pump (1) with pipeline (2), then by pipeline (2), is connected and is got back to heat sink (4) composition heat-radiation loop.
Feature of the present utility model is also:
Sheet metal and one flat plate that described heat sink has ring-shaped groove by heat sink (4) by an inside form, two plate mix proportion fluid passages, and have at least an outside surface to be processed into corrugated or zigzag, increase the contact area of itself and air, augmentation of heat transfer effect.Heat sink fluid passage circularizes, and to increase flow process, makes cooling fluid have enough time and heat sink to carry out heat conduction.
Described heat sink is the can that an inside is provided with baffle, it is characterized in that: it has a heat-absorbent surface, and this heat-absorbent surface is close to the central processing unit of notebook computer and the heating face on figure display chip; Each heat sink is provided with two pipe adapters of water inlet water delivering orifice; Baffle improves the hold-up time of liquid coolant on the one hand, also increases the turbulivity of cooling fluid simultaneously, thereby more effectively takes away the heat that processor produces.Heat sink housing surface and baffle surface working engrail or corrugated, to increase the disturbance of fluid, the surface that heat sink contacts with central processing unit and figure display chip is through grinding or polishing, thereby the contact area of increase and central processing unit and figure display chip, thennal conduction enhancement effect.。
Described foldable support frame is arranged on screen rear.The long 5-20cm of support.Divide and launch and folding two states, when not working, include in groove reserved on heat sink after support-folding, now, heat sink is close to screen, is easy to carry; During work, support launches, and the heat sink segment distance that frames out, can contact with air heat sink both sides, makes its area increase contacting with air, enhance heat effect, and meanwhile, the high temperature of heat sink is unlikely to have influence on the normal operation of screen.During work, conduct because the temperature difference produces heat with central processing unit and figure display chip on heat sink (6) surface, thereby absorb the heat that central processing unit and figure display chip produce, cooling fluid in heat sink (6) absorbs solid surface heat, drive by water pump (1) forms circular flow, thereby constantly takes away the heat of central processing unit and the generation of figure display chip.
As preferably, metal and intermetallic adopt soldering, thereby prevent from producing due to generic connectivity mode the damage that the phenomenons such as sepage leakage produce notebook computer.
As preferably, between metal and flexible pipe, adopt and glued joint, adopt industrial AB glue, thereby prevent from producing due to common glue non-refractory the damage that the phenomenons such as sepage leakage produce notebook computer.
As preferably, metal adopts aluminium alloy, because its endothermic effect is good, quality is light, meets product appeal.
The beneficial effects of the utility model are:
1) adopt liquid as thermal barrier, because specific heat of liquid is larger than gas, cooling effectiveness is high; Utilize the passive heat radiation of circular flow, little and solve noise problem without fan power;
2) built-in many baffles of heat absorption aluminium box, liquid chute is " labyrinth type ", meets the principle that increases turbulivity enhance heat.
3) water pump can be worked under the condition of 3-6V, and the 5V power work providing on main board for notebook computer is provided, without another distribution source.
4) heat sink surface working becomes corrugated, meets and increases and air contact area, strengthens the principle of heat dispersion.
5) by foldable support frame, connect notebook basic computer and heat sink, when heat abstractor is not worked, pack up support and save space, stent during work, enhance heat effect also protects notebook computer liquid crystal not to be subject to high temperature injury.
Accompanying drawing explanation
Fig. 1 is heat radiator for notebook computer structural representation
Fig. 2 is heat radiator for notebook computer principle of work schematic diagram
Fig. 3 is heat sink structural representation
Fig. 4 is cooling plate structure schematic diagram
Embodiment
A water-cooling heat radiating device, in Fig. 1, is comprised of following several parts, water pump (1), pipeline (2), mainboard internal electric source (3), heat sink (4), foldable support frame (5) and heat sink (6).Described water pump (1) relies on notebook computer self power drives, and the normal working voltage of water pump (1) is 3-6V, adopts for simplicity the 5V USB power supply of notebook computer or uses the power supply of former notebook computer fan.As shown in Figure 3, heat sink (6) is established the can of baffle in being, can inside surface and baffle surface working toothing surface are to increase flow disturbance enlarge active surface, heat sink (6) is provided with water inlet and two pipe adapters of water delivering orifice, and both sides are provided with overhanging support plate, on support plate, have through hole, screw screws in mainboard with fixing heat sink (6) through through hole, and the position of screw can be identical with the screw position of fixing heat absorption copper sheet on former main board for notebook computer.As shown in Figure 4, sheet metal and one flat plate that heat sink (4) has ring-shaped groove by an inside form, and two plate mix proportion fluid passages, and have at least an outside surface to be processed into corrugated or zigzag increase the contact area of itself and air.Heat sink (4) is arranged on one end of foldable support frame (5), the other end of foldable support frame 5 is arranged on the body of notebook computer, its minute expansion and folding two states, when not working, after support-folding, include in groove reserved on heat sink, now, heat sink is close to screen, is easy to carry; During work, support launches, and the heat sink segment distance that frames out, can contact with air heat sink both sides, makes its area increase contacting with air, enhance heat effect, and meanwhile, the high temperature of heat sink is unlikely to have influence on the normal operation of screen.
As Fig. 2, cooling fluid provides power to flow into heat sink (6) by water pump (1), now carry out heat exchange with central processing unit and figure display chip, the obvious temperature of cooling fluid rises, the cooling fluid flowing out from heat sink (6) water delivering orifice flows into heat sink (4) through pipeline 2, by heat sink (4) and air, carries out heat exchange, and cooling fluid temperature declines, the liquid that temperature declines flows back to water pump (1), forms a complete liquid radiating circulation.
Claims (5)
1. a notebook computer water-cooling heat radiating device, it is characterized in that: comprise water pump (1), pipeline (2), mainboard internal electric source (3), heat sink (4), foldable support frame (5) and heat sink (6), wherein, on the central processing unit of notebook computer and figure display chip, be respectively equipped with heat sink (6), cooling fluid in heat sink (4) is communicated to heat sink (6) by water pump (1) and pipeline (2), then by pipeline (2), gets back to heat sink (4) and forms heat-radiation loop.
2. notebook computer water-cooling heat radiating device as claimed in claim 1, be characterised in that mainboard internal electric source (3) is the 5V power supply that maintains water pump (1) normal operation that main board for notebook computer provides, wherein, the operating voltage of water pump (1) is 3-6V.
3. notebook computer water-cooling heat radiating device as claimed in claim 1, be characterised in that sheet metal and one flat plate that heat sink (4) has ring-shaped groove by an inside form, two plate mix proportion fluid passages, and have at least an outside surface to be processed into corrugated or zigzag.
4. notebook computer water-cooling heat radiating device as claimed in claim 1, the screen rear that is characterised in that notebook computer is provided with foldable support frame (5), the other end of (5) of foldable support frame is installed heat sink (4), and after foldable support frame during work (5) launches, heat sink (4) is positioned at rear or the top of screen.
5. notebook computer water-cooling heat radiating device as claimed in claim 1, be characterised in that heat sink (6) is the can that an inside is provided with baffle, it has a heat-absorbent surface, this heat-absorbent surface is close to the central processing unit of notebook computer and the heating face on figure display chip, each heat sink (6) is provided with two pipe adapters of water inlet water delivering orifice, wherein, hackly surface is all processed on the inside surface of can and the surface of baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320607120.9U CN203433456U (en) | 2013-09-19 | 2013-09-19 | Water-cooling heat dissipation device for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320607120.9U CN203433456U (en) | 2013-09-19 | 2013-09-19 | Water-cooling heat dissipation device for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203433456U true CN203433456U (en) | 2014-02-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320607120.9U Expired - Fee Related CN203433456U (en) | 2013-09-19 | 2013-09-19 | Water-cooling heat dissipation device for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203433456U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304758A (en) * | 2015-05-27 | 2017-01-04 | 奇鋐科技股份有限公司 | Bendable discharging the retained water water cooling plant |
| CN106773498A (en) * | 2016-12-19 | 2017-05-31 | 李业清 | Combined type screen structure |
| CN107643815A (en) * | 2017-11-10 | 2018-01-30 | 山东超越数控电子股份有限公司 | A kind of fan-free laptop heat-dissipation system |
| CN114792822A (en) * | 2021-01-26 | 2022-07-26 | 北京理工大学 | Heat exchange device, fuel cell and heat exchange method |
-
2013
- 2013-09-19 CN CN201320607120.9U patent/CN203433456U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304758A (en) * | 2015-05-27 | 2017-01-04 | 奇鋐科技股份有限公司 | Bendable discharging the retained water water cooling plant |
| CN106304758B (en) * | 2015-05-27 | 2019-04-12 | 奇鋐科技股份有限公司 | Bent water cooling plant |
| CN106773498A (en) * | 2016-12-19 | 2017-05-31 | 李业清 | Combined type screen structure |
| CN107643815A (en) * | 2017-11-10 | 2018-01-30 | 山东超越数控电子股份有限公司 | A kind of fan-free laptop heat-dissipation system |
| CN114792822A (en) * | 2021-01-26 | 2022-07-26 | 北京理工大学 | Heat exchange device, fuel cell and heat exchange method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20140919 |
|
| EXPY | Termination of patent right or utility model |