CN202512500U - Refrigeration-type heat radiation base for notebook computer - Google Patents

Abstract

The utility model discloses a cooling type notebook computer heat dissipation base, which is in the shape of a square flat box and is placed under the notebook computer. Two large and small panel fans for supplying air to the inside of the computer are arranged under the panel, wherein the large panel fan The top is facing the computer CPU; the bottom is a cold room made of heat-insulating foam boards. The cold room is equipped with a cold conduction module and a heat conduction module, and a semiconductor refrigeration sheet is installed between the cold conduction module and the heat conduction module. The cold end and the hot end of the semiconductor refrigerating sheet are respectively connected with the cold conduction module and the heat conduction module, a fan is installed under the cold conduction module, and a cooling fan is installed on one side of the heat conduction module. This refrigerated notebook computer cooling base is more suitable for the working state of the computer. If the computer runs large-scale software or games and generates a lot of heat, it can be cooled by a semiconductor cooling chip and send cold air to the computer; small software or games will not generate much heat. , can be air-cooled. The use of the computer radiator not only saves electric energy, but also achieves a good cooling effect.

Description

Cooling Laptop Cooling Base

technical field

The utility model relates to a computer radiator, in particular to a device for dissipating heat from a notebook computer by using air cooling and a semiconductor refrigeration sheet.

Background technique

In recent years, microprocessor CPU chips have developed rapidly towards high integration, high miniaturization and high frequency. However, while the performance of the CPU is continuously improved, the heat generation is also continuously increased, which seriously affects the stability, reliability and service life of the computer. For notebook computers, due to space constraints, the heat dissipation mechanism itself cannot satisfy the operation of some large-scale software and games. The quality of heat dissipation directly affects the speed and stability of computer operation. Therefore, the general notebook user department will configure the radiator.

At present, notebook computer radiators on the market generally adopt the air-cooling method to dissipate heat, and the fan rotates to force air convection to take away heat. This kind of radiator has the advantages of simple structure and low price, but its heat dissipation capacity is limited, and it is greatly affected by the ambient temperature, that is, it has a certain effect in winter, but the heat dissipation effect is not good in summer. In terms of semiconductor cooling notebook computer radiators, since the heating efficiency of the semiconductor cooling sheet is much greater than its cooling efficiency, a large heat sink must be installed on the hot end of the cooling sheet so that the temperature difference between the two ends is within the allowable range, so there are Certain flaws. In view of the above reasons, it is necessary to develop a cooling device for notebook computers that can utilize both air cooling and semiconductor refrigeration to dissipate heat for computers, and the speed of the fan is adjustable to make the radiator in the best state.

Utility model content

The technical problem to be solved by the utility model is to provide a refrigerated notebook computer heat dissipation base, which solves the problem of using air cooling and semiconductor refrigeration to dissipate heat for the notebook computer at the same time.

The technical problem to be solved by the utility model is realized by the following structure: cooling type notebook computer heat dissipation base, in the shape of a square flat box, is placed under the notebook computer, including a panel, a semiconductor refrigeration sheet, a heat dissipation fan, a cold room and a circuit part. The feature is that two large and small panel fans are installed under the panel for supplying air to the inside of the computer, wherein the top of the large panel fan faces the CPU of the computer; A cold conduction module and a heat conduction module are respectively installed, and a semiconductive refrigeration sheet is installed between the cold conduction module and the heat conduction module. The cold end and the hot end of the semiconductive refrigeration sheet are respectively connected with the cold conduction module and the heat conduction module. A fan is installed, and a cooling fan is installed on one side of the heat conduction module.

The utility model also includes the following structure: the upper surface of the panel is pasted with heat-insulating foam strips. Heat conduction silicone grease is coated between the cold end and the heat end of the semiconductor refrigeration sheet and the connection contact surfaces of the cold conduction module and the heat conduction module. Both the semiconductor refrigerating sheet and the fan are connected to the external power supply through the circuit part and the power socket. Switches K1, K2 and fan speed potentiometers for controlling the work of semiconductor refrigeration chips are respectively installed on the front of the heat dissipation base. The back of the heat dissipation base is equipped with a power socket and has a hot air outlet.

The working principle of the utility model is as follows: connect the heat dissipation base of the cooling type notebook computer to a 12V DC power supply, and control the operation of the semiconductor refrigeration sheet through the switch K1; the switch K2 controls the start and stop of the fan. After the semiconductor refrigerating sheet cools the cooling module, the gas in the cold room is cooled, and then a fan sends cold air into the computer. The fan on the cooling module is used to send the cold air out, while preventing the cooling module from condensation. The heat dissipation fan on the heat conduction module is used for heat dissipation at the hot end to ensure that the temperature difference between the two ends of the semiconductor cooling sheet is within the allowable range. The potentiometer controls the fan speed to ensure that there is a surplus of cold air in the cold room.

The utility model has the advantages: the cooling base of the notebook computer can be more adapted to the working state of the computer. If the computer runs large-scale software or the game generates a lot of heat, it can be cooled by a semiconductor refrigeration chip and the cold air is sent to the computer; When the heat is not large, air cooling can be used. It not only saves electric energy, but also achieves a good cooling effect.

Description of drawings

Fig. 1 is a perspective view of a heat dissipation base of a cooling type notebook computer (viewed from the upper rear).

FIG. 2 is a cross-sectional view of FIG. 1 .

Fig. 3 is A---A figure of Fig. 2.

FIG. 4 is a front view of FIG. 1 .

Detailed ways

As shown in Figures 1-3, the cooling base of a cooling notebook computer is in the shape of a square flat box, and is placed under the notebook computer during use. The panel 1 is pasted with heat-insulating foam strips 2 all around. Two panel fans 3, 4 of 5V and 12V for air supply to the inside of the computer are housed below the panel 1, wherein the 12V panel fan 4 faces the computer CPU above; A cold conduction module 7 and a heat conduction module 8 are respectively installed inside and outside the cold chamber 6 , and a semiconductor cooling chip 9 is installed between the cool conduction module 7 and the heat conduction module 8 . The cold end and the hot end of the semiconductor cooling plate 9 are respectively connected with the cold conduction module 7 and the heat conduction module 8, and heat conduction silicone grease is coated between the contact surfaces. A 5V fan 10 is installed under the cooling module 7 , and a 12V cooling fan 11 is installed on one side of the heat-conducting module 8 . Both the semiconductor cooling sheet 9 and the fan are connected with the external power supply through the circuit part and the power supply socket 12 . The back of this cooling base is equipped with a power supply socket 12 and has a hot air outlet 13.

As shown in Figure 4, switches K1, K2 and a fan speed potentiometer 14 for controlling the operation of the semiconductor refrigeration sheet 9 are respectively installed on the front of the heat dissipation base. When the switch K1 is closed, the semiconductor cooling chip 9 works, and the gas in the cold room 6 is refrigerated. At the same time, the 12V panel fan 4 on the panel 1 starts to send the cold air in the cold room 6 to the position of the computer CPU, and the 5V panel fan 3 cools the room temperature environment. The low-temperature wind is sent to other parts of the computer. This state is used when the computer generates a lot of heat. The same is true when switch K2 is closed and switch K1 is closed. When the switch K2 is closed and the switch K1 is disconnected, only the 12V panel fan 4 on the panel 1 and the fan in the cold room 6 work, and the wind at room temperature is sent to the computer. This state is used when the computer generates less heat. The switch K1 and the switch K2 are turned off at the same time, and the cooling base stops working. By adjusting the fan speed potentiometer 14 to control the speed of the fans of the panel 1 and the cold room 1, the air supply volume is controlled to achieve good results.

Claims (6)

1. refrigeration-type notebook computer heat dissipation base; It is flat box-like to be square; Be placed on the notebook computer below; Comprise panel, semiconductor chilling plate, radiator fan, cold house and circuit part, it is characterized in that: large and small two the panel fans that are used for to the computer inner blower are housed below the said panel, above the wherein big panel fan over against computer CPU; Be the cold house of processing below with the heat insulation foam plate; Inside and outside conduction cooling module and the heat conducting module of being equipped with respectively in cold house; Between conduction cooling module and the heat conducting module semiconductor chilling plate is installed; The cool and heat ends of said semiconductor chilling plate is connected with heat conducting module with the conduction cooling module respectively, fan is housed below the said conduction cooling module, and a side of said heat conducting module is equipped with radiator fan.

2. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: post the heat insulation foam bar around above the said panel.

3. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: the cool and heat ends of said semiconductor chilling plate is connected with heat conducting module with the conduction cooling module and scribbles heat-conducting silicone grease between surface of contact.

4. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: described semiconductor chilling plate, fan all are connected with extraneous power supply with outlet through described circuit part.

5. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: the front of said heat dissipation base is K switch 1, K2 and the rotation speed of the fan potentiometer of the work of installation and control semiconductor chilling plate respectively.

6. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: the back dress outlet of said heat dissipation base also has hot-blast outlet.

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