CN202512500U - Refrigeration-type heat radiation base for notebook computer - Google Patents
Refrigeration-type heat radiation base for notebook computer Download PDFInfo
- Publication number
- CN202512500U CN202512500U CN2012201513114U CN201220151311U CN202512500U CN 202512500 U CN202512500 U CN 202512500U CN 2012201513114 U CN2012201513114 U CN 2012201513114U CN 201220151311 U CN201220151311 U CN 201220151311U CN 202512500 U CN202512500 U CN 202512500U
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- heat
- refrigeration
- fan
- notebook computer
- computer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a refrigeration-type heat radiation base for a notebook computer. The refrigeration-type heat radiation base is shaped as a square flat box and arranged under the notebook computer; a big panel fan and a small panel fan which are used for supplying air to inside of the computer are arranged under a panel of the refrigeration-type heat radiation base, wherein the upper surface of the big panel fan is over against a CPU (Central Processing Unit) of the computer; a cold chamber made of heat-insulation foam sheets is arranged under the big panel fan, the cold chamber is internally provided with a cold conduction module and a heat conduction module, and a semiconductor refrigeration sheet is arranged between the cold conduction module and the heat conduction module; and a cold end and a heat end of the semiconductor refrigeration sheet are respectively connected with the cold conduction module and the heat conduction module, wherein a fan is arranged under the cold conduction module and a heat radiation fan is arranged at one side of the heat conduction module. The refrigeration-type heat radiation base for the notebook computer is more applicable to the working state of the computer; the semiconductor refrigeration sheet can be used for refrigerating the computer which runs large-scale software or games and has great heat productivity and supplying cold air to the computer; and the computer which runs small-scale software or games and has no great heat productivity can be air-cooled. The refrigeration-type heat radiation base for the notebook computer can save electric energy and achieves a favorable refrigerating effect.
Description
Technical field
The utility model relates to a kind of computer radiator, refers in particular to a kind of air-cooled device that notebook computer is dispelled the heat with semiconductor chilling plate that utilizes.
Background technology
In recent years, the microprocessor CPU chip is towards highly integrated, high microminiaturization and the fast development of high frequency direction.Constantly increase but when cpu performance improves constantly, also be accompanied by thermal value, had a strong impact on stability, reliability and the serviceable life of computing machine.And for notebook computer, because space constraint, the cooling mechanism of itself can not satisfy its some large softwares of operation and recreation at all, and the quality of heat radiation has directly influenced speed and stability that computer moves.So general notebook can dispose heating radiator with the Ministry of Revenue.
Present notebook PC radiator on the market generally adopts air cooling method to dispel the heat, and fan rotation forced air convective zone is walked heat.This heating radiator has simple in structure, cheap advantage, but heat-sinking capability is limited, and it is bigger influenced by ambient temperature, and certain effect is promptly arranged in winter, and summer radiating effect bad.Aspect the semiconductor refrigeration type notebook PC radiator,, make its two ends temperature difference in allowed band, so also have certain defective because the heating efficiency of semiconductor chilling plate necessarily requires large-scale heat radiator to be installed on the cooling piece hot junction much larger than its refrigerating efficiency.In view of the foregoing, develop and a kind ofly can utilize the air-cooled semiconductor refrigerating that can utilize again to be computer heat radiation, rotation speed of the fan is adjustable simultaneously, and the heat radiator for notebook computer that makes heating radiator be in optimum condition is necessary.
The utility model content
The technical matters that the utility model will solve provides a kind of refrigeration-type notebook computer heat dissipation base, and this heat dissipation base has solved and utilized air-cooled problem of dispelling the heat for notebook computer with semiconductor refrigerating simultaneously.
The technical matters that the utility model will solve is realized by following structure: refrigeration-type notebook computer heat dissipation base; It is flat box-like to be square; Be placed on the notebook computer below; Comprise panel, semiconductor chilling plate, radiator fan, cold house and circuit part, it is characterized in that: large and small two the panel fans that are used for to the computer inner blower are housed below the said panel, above the wherein big panel fan over against computer CPU; Be the cold house of processing below with the heat insulation foam plate; Inside and outside conduction cooling module and the heat conducting module of being equipped with respectively in cold house; Between conduction cooling module and the heat conducting module semiconductor chilling plate is installed; The cool and heat ends of said semiconductor chilling plate is connected with heat conducting module with the conduction cooling module respectively, fan is housed below the said conduction cooling module, and a side of said heat conducting module is equipped with radiator fan.
The utility model also comprises following structure: post the heat insulation foam bar around above the said panel.The cool and heat ends of said semiconductor chilling plate is connected with heat conducting module with the conduction cooling module and scribbles heat-conducting silicone grease between surface of contact.Described semiconductor chilling plate, fan all are connected with extraneous power supply with outlet through described circuit part.The front of said heat dissipation base is K switch 1, K2 and the rotation speed of the fan potentiometer of the work of installation and control semiconductor chilling plate respectively.The back dress outlet of said heat dissipation base also has hot-blast outlet.
The principle of work of the utility model: refrigeration-type notebook computer heat dissipation base is connected on the direct supply of 12V, and whether the work through K switch 1 control semiconductor chilling plate; The start and stop of K switch 2 control fans.Semiconductor chilling plate makes gas refrigeration in the cold house after the conduction cooling module is freezed, and has fan that cold wind is sent into computer again, and the fan on the conduction cooling module is used for cold wind is seen off, prevents conduction cooling module dewfall simultaneously.Radiator fan is used for hot-side heat dissipation on the heat conducting module, guarantees that the semiconductor chilling plate two ends temperature difference is in allowed band.Potentiometer is controlled rotation speed of the fan, guarantees to have in the cold house cold air of surplus.
The advantage of the utility model: refrigeration-type notebook computer heat dissipation base more can adapt to the computer work state, if when computer operation large software or recreation thermal value are very big, and available semiconductor chilling plate refrigeration, and cold wind sent into computer; When small-sized software or recreation thermal value are little, available air-cooled.Both save electric energy, and can reach good refrigeration again.
Description of drawings
Fig. 1 is the stereographic map (back upper place is looked) of refrigeration-type notebook computer heat dissipation base.
Fig. 2 is the cross-sectional view of Fig. 1.
Fig. 3 is the A---A figure of Fig. 2.
Fig. 4 is the prior figures of Fig. 1.
Embodiment
Like Fig. 1-shown in Figure 3, refrigeration-type notebook computer heat dissipation base is square flat box-like, is placed on the notebook computer below during use.Post heat insulation foam bar 2 around above the panel 1.5V and two panel fans of 12V 3,4 of being used for to the computer inner blower are housed below the panel 1, and wherein 12V panel fan 4 is top over against computer CPU; Be the cold house 6 of processing below with heat insulation foam plate 5.Cold house's 6 inside and outside conduction cooling module 7 and heat conducting modules 8 of being equipped with are respectively installed semiconductor chilling plate 9 between conduction cooling module 7 and the heat conducting module 8.The cool and heat ends of semiconductor chilling plate 9 is connected with heat conducting module 8 with conduction cooling module 7 respectively, scribbles heat-conducting silicone grease between its surface of contact.5V fan 10 is housed below the conduction cooling module 7, and a side of heat conducting module 8 is equipped with 12V radiator fan 11.Semiconductor chilling plate 9 all is connected with extraneous power supply with outlet 12 through circuit part with fan.The back dress outlet 12 of this heat dissipation base also has hot-blast outlet 13.
As shown in Figure 4, the front of this heat dissipation base is K switch 1, K2 and the rotation speed of the fan potentiometer 14 of 9 work of installation and control semiconductor chilling plate respectively.When K switch 1 closure; Semiconductor chilling plate 9 work; Gas is freezed in the cold house 6; Simultaneously 12V panel fan 4 begins the cold wind of cold house 6 is sent into the position of computer CPU on the panel 1, and 5V panel fan 3 is sent the low temperature wind of room temperature environment into other position of computer, and this state is used for the computer thermal value when big.When K switch 2 closures, K switch 1 closure, situation is identical.When K switch 2 closures, K switch 1 are broken off, have only 12V panel fan 4 and cold house's 6 fan work on the panel 1, the wind of ambient temperature is admitted to computer, and this state is used for the computer thermal value hour.K switch 1, K switch 2 are broken off simultaneously, and this heat dissipation base quits work.The rotating speed of the fan through regulating rotation speed of the fan potentiometer 14 control panels 1 and cold house 1, the control air output is to reach good result.
Claims (6)
1. refrigeration-type notebook computer heat dissipation base; It is flat box-like to be square; Be placed on the notebook computer below; Comprise panel, semiconductor chilling plate, radiator fan, cold house and circuit part, it is characterized in that: large and small two the panel fans that are used for to the computer inner blower are housed below the said panel, above the wherein big panel fan over against computer CPU; Be the cold house of processing below with the heat insulation foam plate; Inside and outside conduction cooling module and the heat conducting module of being equipped with respectively in cold house; Between conduction cooling module and the heat conducting module semiconductor chilling plate is installed; The cool and heat ends of said semiconductor chilling plate is connected with heat conducting module with the conduction cooling module respectively, fan is housed below the said conduction cooling module, and a side of said heat conducting module is equipped with radiator fan.
2. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: post the heat insulation foam bar around above the said panel.
3. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: the cool and heat ends of said semiconductor chilling plate is connected with heat conducting module with the conduction cooling module and scribbles heat-conducting silicone grease between surface of contact.
4. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: described semiconductor chilling plate, fan all are connected with extraneous power supply with outlet through described circuit part.
5. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: the front of said heat dissipation base is K switch 1, K2 and the rotation speed of the fan potentiometer of the work of installation and control semiconductor chilling plate respectively.
6. refrigeration-type notebook computer heat dissipation base according to claim 1 is characterized in that: the back dress outlet of said heat dissipation base also has hot-blast outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201513114U CN202512500U (en) | 2012-04-01 | 2012-04-01 | Refrigeration-type heat radiation base for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201513114U CN202512500U (en) | 2012-04-01 | 2012-04-01 | Refrigeration-type heat radiation base for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202512500U true CN202512500U (en) | 2012-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201513114U Expired - Fee Related CN202512500U (en) | 2012-04-01 | 2012-04-01 | Refrigeration-type heat radiation base for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202512500U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353787A (en) * | 2013-07-26 | 2013-10-16 | 浪潮电子信息产业股份有限公司 | CPU cooler without cable |
| CN104850199A (en) * | 2015-05-25 | 2015-08-19 | 福建农林大学 | Notebook computer heat dissipation pad capable of cooling, and control method therefor |
| CN104866050A (en) * | 2015-06-15 | 2015-08-26 | 河海大学常州校区 | Thermoelectric cooling type air purifying base for notebook computer |
| CN106455424A (en) * | 2016-09-26 | 2017-02-22 | 珠海格力电器股份有限公司 | Mobile terminal, and operation control method and device of mobile terminal |
| CN107357379A (en) * | 2017-07-31 | 2017-11-17 | 合肥桥旭科技有限公司 | A kind of double-radiation function type computer host box |
| CN108376025A (en) * | 2018-05-07 | 2018-08-07 | 上海海洋大学 | A kind of enhanced heat exchange type computer radiator |
| CN109798693A (en) * | 2018-12-18 | 2019-05-24 | 武汉西山艺创文化有限公司 | A kind of electronic refrigeration plant and its method |
| CN111813199A (en) * | 2020-06-23 | 2020-10-23 | 常艺馨 | Notebook computer cooling system |
-
2012
- 2012-04-01 CN CN2012201513114U patent/CN202512500U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353787A (en) * | 2013-07-26 | 2013-10-16 | 浪潮电子信息产业股份有限公司 | CPU cooler without cable |
| CN104850199A (en) * | 2015-05-25 | 2015-08-19 | 福建农林大学 | Notebook computer heat dissipation pad capable of cooling, and control method therefor |
| CN104866050A (en) * | 2015-06-15 | 2015-08-26 | 河海大学常州校区 | Thermoelectric cooling type air purifying base for notebook computer |
| CN104866050B (en) * | 2015-06-15 | 2018-06-22 | 河海大学常州校区 | Notebook thermoelectric cooling formula air purification pedestal |
| CN106455424A (en) * | 2016-09-26 | 2017-02-22 | 珠海格力电器股份有限公司 | Mobile terminal, and operation control method and device of mobile terminal |
| CN106455424B (en) * | 2016-09-26 | 2019-05-14 | 珠海格力电器股份有限公司 | Mobile terminal, and operation control method and device of mobile terminal |
| CN107357379A (en) * | 2017-07-31 | 2017-11-17 | 合肥桥旭科技有限公司 | A kind of double-radiation function type computer host box |
| CN108376025A (en) * | 2018-05-07 | 2018-08-07 | 上海海洋大学 | A kind of enhanced heat exchange type computer radiator |
| CN109798693A (en) * | 2018-12-18 | 2019-05-24 | 武汉西山艺创文化有限公司 | A kind of electronic refrigeration plant and its method |
| CN111813199A (en) * | 2020-06-23 | 2020-10-23 | 常艺馨 | Notebook computer cooling system |
| CN111813199B (en) * | 2020-06-23 | 2022-05-17 | 东莞市洋海实业有限公司 | Notebook computer cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhu Shiwei Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Wang Wenjie Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20130401 |