CN108376025A - A kind of enhanced heat exchange type computer radiator - Google Patents
A kind of enhanced heat exchange type computer radiator Download PDFInfo
- Publication number
- CN108376025A CN108376025A CN201810428658.0A CN201810428658A CN108376025A CN 108376025 A CN108376025 A CN 108376025A CN 201810428658 A CN201810428658 A CN 201810428658A CN 108376025 A CN108376025 A CN 108376025A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- semiconductor chilling
- chilling plate
- cold end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000013459 approach Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The cold end of a kind of enhanced heat exchange type computer radiator, including semiconductor chilling plate, semiconductor chilling plate connects heat pipe, and semiconductor chilling plate is fixed with heat pipe by metallic plate；Cold end wind turbine is arranged in connecting copper pipe fin on heat pipe, copper tube and fin top, and the hot junction of semiconductor chilling plate connects heat pipe, and semiconductor chilling plate is fixed with heat pipe by metallic plate；Hot junction fan is arranged in connecting copper pipe fin on heat pipe, copper tube and fin top.For hoisting wind pressure, accelerate fuselage interior air-flow speed, cooling piece air outlet is being connected into air inlet using a circular duct.The present invention can be efficiently solved computer is in overclocking or heat dissipation effect is bad when using for a long time, and since radiating rate leads to the problem that computer part is burnt etc. more slowly, a kind of new approaches are provided for computer heat radiation.
Description
Technical field
The invention belongs to computer radiator technical field more particularly to a kind of enhanced heat exchange type computer radiators.
Background technology
Heat dissipation is when solving CPU or core SoC actings, and electric energy is converted to heat, leads to the problem of the way of thermal energy accumulation
Diameter.One of main problem when poor heat radiation is computer operation, the excessively high system operation that can lead to computer of temperature is unstable, uses
Service life is greatly decreased, it could even be possible to causing section components to burn, especially for superhuge computer and laptop.
Currently, computer heat radiation is mainly the passive active heat removal two for radiating and being carried out using fan carried out using cooling fin
Kind.Due to the use of when higher working frequency can bring higher heat, use in particular for overclocking or for a long time use
Computer equipment, it is difficult to meet CPU, GPU and the radiating requirements of other video memorys.
Invention content
The present invention proposes a kind of enhanced heat exchange type for the present situation that existing radiator heat-dissipation is ineffective and radiates not in time
Computer radiator.
The present invention is achieved through the following technical solutions above-mentioned purpose, a kind of enhanced heat exchange type computer radiator, including half
The cold end of conductor cooling piece, semiconductor chilling plate connects heat pipe, and semiconductor chilling plate is fixed with heat pipe by metallic plate；On heat pipe
Cold end wind turbine is arranged in connecting copper pipe fin, copper tube and fin top, and the hot junction of semiconductor chilling plate connects heat pipe, semiconductor chilling plate
It is fixed by metallic plate with heat pipe；Hot junction fan is arranged in connecting copper pipe fin on heat pipe, copper tube and fin top.
Preferably, for hoisting wind pressure, accelerate fuselage interior air-flow speed, cooling piece air outlet is being used into a circle
Air hose connects air inlet.
Preferably, air outlet blocks in order to prevent, strainer is both provided at air outlet.
Enhanced heat exchange type computer radiator includes hot junction fan（1）, copper tube and fin（2）, the first heat pipe heat（3）, metallic plate
（4）, cold end fan（5）, semiconductor chilling plate（6）, the second heat pipe heat（7）；Semiconductor chilling plate（6）Cold end connection first heat
Pipe group（3）, the first heat pipe heat（3）It is made of 3 ~ 5 heat pipes that outer diameter is 8mm, semiconductor chilling plate（6）With the first heat pipe heat
（3）Pass through one piece of metallic plate（4）It is fixed, semiconductor chilling plate（6）Cold end and heat pipe engaging portion smear heat dissipating silicone grease；Partly lead
Body cooling piece（6）Hot junction connect the second heat pipe heat（7）, the second heat pipe heat（7）It is made of 3 ~ 5 heat pipes that outer diameter is 8mm, half
Conductor cooling piece（6）With the first heat pipe heat（7）Pass through one piece of metallic plate（4）, fixed semiconductor chilling plate（6）Hot junction and heat pipe
Engaging portion smear heat dissipating silicone grease；First heat pipe heat（3）Heat pipe on connecting copper pipe fin（2）, copper tube and fin（2）Top is arranged
Cold end fan（5）；Second heat pipe heat（7）Heat pipe on connecting copper pipe fin（2）, copper tube and fin（2）Cold end fan is arranged in top
（5）；Pass through the first heat pipe heat（3）With cold end fan（5）Cold air be sent to the CPU and computer core exothermic parts of computer,
Radiating and cooling is carried out to it.
Semiconductor chilling plate（6）For long 40mm, wide 40mm, the tablet of thick 3.75mm.Metallic plate（4）It is wide for long 60mm
45mm, the tablet of thick 3mm.Heat pipe（3）Outer diameter is 8mm.Hot junction fan（1）A diameter of 80mm.Cold end fan（5）It is a diameter of
80mm.Cold end fan（5）One section of circular duct is connected between the CPU and computer core exothermic parts of computer.
The beneficial effects of the invention are as follows：By being applied in combination for two groups of heat pipes and semiconductor chilling plate, computer is made to generate
Heat quickly sheds, to increase heat dissipation effect.Circular air hose is designed by the air outlet in cooling piece hot junction wind turbine, makes wind
Pressure is promoted, and accelerates fuselage interior air-flow speed.By designing strainer in air outlet, air outlet is made to be not easy to plug.Radiator, which has, to be dissipated
Hot area is big, and radiating rate is fast, the big advantage of temperature drop.
The present invention can efficiently solve the bad present situation of heat dissipation effect when computer is in overclocking or use for a long time, preferably
Ground solves the problems, such as that radiator heat-dissipation speed causes computer part to burn more slowly, and a kind of new approaches are provided for computer heat radiation.
Description of the drawings
Fig. 1 is enhanced heat exchange type computer radiator three-dimensional axonometric drawing of the present invention；
In Fig. 1,1, hot junction fan；2, copper tube and fin；3, the first heat pipe heat；5, cold end fan；7, the second heat pipe heat.
Fig. 2 is the half-sectional three-dimensional axonometric drawing in the part of enhanced heat exchange type computer radiator of the present invention；
In Fig. 2,1, hot junction fan；2, copper tube and fin；3, the first heat pipe heat；4, metallic plate；5, cold end fan；6, semiconductor chilling plate.
Fig. 3 is enhanced heat exchange type computer radiator three-dimensional half sectional view of the present invention；
In Fig. 3,2, copper tube and fin；3, the first heat pipe heat；7, the second heat pipe heat.
Specific implementation mode
Operating process to make the present invention realize is easy to understand with creation characteristic, With reference to embodiment,
The present invention is further explained.
Enhanced heat exchange type computer radiator includes hot junction fan 1, copper tube and fin 2, the first heat pipe heat 3, metallic plate 4, cold end
Fan 5, semiconductor chilling plate 6, the second heat pipe heat 7；The cold end of semiconductor chilling plate 6 connects the first heat pipe heat 3, the first heat pipe heat
3 are made of 3 ~ 5 heat pipes that outer diameter is 8mm, and semiconductor chilling plate 6 and the first heat pipe heat 3 are fixed by one piece of metallic plate 4, and half
Heat dissipating silicone grease is smeared in the cold end of conductor cooling piece 6 and the engaging portion of heat pipe；The hot junction of semiconductor chilling plate 6 connects the second heat pipe heat
7, the second heat pipe heat 7 is made of 3 ~ 5 heat pipes that outer diameter is 8mm, and semiconductor chilling plate 6 and the first heat pipe heat 7 pass through one block of gold
Belong to plate 4, heat dissipating silicone grease is smeared in the hot junction of fixed semiconductor chilling plate 6 and the engaging portion of heat pipe；Connect on the heat pipe of first heat pipe heat 3
Connect copper tube and fin 2,2 top setting cold end fan 5 of copper tube and fin；Connecting copper pipe fin 2 on the heat pipe of second heat pipe heat 7, copper pipe
2 top setting cold end fan 5 of fin；The CPU and electricity of computer are sent to by the cold air of the first heat pipe heat 3 and cold end fan 5
Brain core exothermic parts carry out radiating and cooling to it.
Semiconductor chilling plate 6 is long 40mm, wide 40mm, the tablet of thick 3.75mm.
Metallic plate 4 is long 60mm, wide 45mm, the tablet of thick 3mm.
3 outer diameter of heat pipe is 8mm.
1 a diameter of 80mm of hot junction fan.
5 a diameter of 80mm of cold end fan.
One section of circular duct is connected between cold end fan 5 and the CPU and computer core exothermic parts of computer.
In order to verify the effect of the present invention,
（1）Meteorological condition
Room temperature is set as being 20 DEG C by air-conditioning, relative humidity φwIt is 80%.
（2）Operating load
It is divided into daily operation（Underload）, limit load（High load capacity）Two kinds of situations are respectively calculated, and when underload takes standard
30% operation of thermal design power, high load capacity take the 95% of power consumption to run.
（3）Component data
Lab note this model 1762, CPU 3630qm.Cooling piece model 12706A, power 120w, operating voltage
12v, operating current 10a, heat conducting pipe 6, thermal coefficient 6790W/ (mK).
Table 1 is using the heat dissipation of former laptop, when underload operates（Occupancy 30%）When, the operation of CPU and GPU
Temperature；Table 2 be using enhanced heat exchange type computer radiator after, underload operate when（Occupancy 30%）When, the operation of CPU and GPU
Temperature.It is found that after use, cpu temperature declines 14 DEG C, and GPU declines 19 DEG C, and cooling-down effect is notable.
Table 1 uses the heat dissipation of former laptop, when underload operates（Occupancy 30%）When,
The running temperature of CPU and GPU
| Run time（min） | 1 | 3 | 5 | 7 | 30 | Mean temperature（℃） |
| CPU | 52 | 49 | 53 | 54 | 55 | |
| GPU | 40 | 42 | 39 | 41 | 40 |
After table 2 uses enhanced heat exchange type computer radiator, when underload operates（Occupancy 30%）When,
The running temperature of CPU and GPU
| Run time（min） | 1 | 3 | 5 | 7 | 30 | Mean temperature |
| CPU | 38 | 37 | 38 | 39 | 38 | |
| GPU | 25 | 26 | 26 | 25 | 25 |
Table 3 is using the heat dissipation of former laptop, when high load capacity operates（Occupancy 30%）When, the running temperature of CPU and GPU；
Table 4 be using enhanced heat exchange type computer radiator after, high load capacity operate when（Occupancy 30%）When, the running temperature of CPU and GPU.
It is found that after use, cpu temperature declines 12.5 DEG C, and GPU declines 12 DEG C, and cooling-down effect is also highly significant.
Table 3 uses the heat dissipation of former laptop, when high load capacity operates（Occupancy 95%）When,
The running temperature of CPU and GPU
| Run time（min） | 1 | 3 | 5 | 7 | 30 | Mean temperature |
| CPU | 78 | 85 | 87 | 85 | 86 | |
| GPU | 79 | 76 | 77 | 74 | 75 |
After table 4 uses enhanced heat exchange type computer radiator, when high load capacity operates（Occupancy 95%）When,
The running temperature of CPU and GPU
| Run time（min） | 1 | 3 | 5 | 7 | 30 | Mean temperature |
| CPU | 73 | 69 | 71 | 72 | 72 | |
| GPU | 67 | 64 | 62 | 65 | 65 |
Radiating rate of the present invention is fast, and temperature drop is big, can efficiently solve and radiate when computer is in overclocking or use for a long time
Ineffective problem.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology can all carry out modifications and changes to above-described embodiment without violating the spirit and scope of the present invention.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should by the present invention claim be covered.
Claims (7)
1. a kind of enhanced heat exchange type computer radiator, it is characterised in that：Enhanced heat exchange type computer radiator includes hot junction fan
（1）, copper tube and fin（2）, the first heat pipe heat（3）, metallic plate（4）, cold end fan（5）, semiconductor chilling plate（6）, the second heat pipe
Group（7）；Semiconductor chilling plate（6）Cold end connect the first heat pipe heat（3）, the first heat pipe heat（3）By 3 ~ 5 that outer diameter is 8mm
Heat pipe forms, semiconductor chilling plate（6）With the first heat pipe heat（3）Pass through one piece of metallic plate（4）It is fixed, semiconductor chilling plate（6）
Cold end and heat pipe engaging portion smear heat dissipating silicone grease；Semiconductor chilling plate（6）Hot junction connect the second heat pipe heat（7）, second
Heat pipe heat（7）It is made of 3 ~ 5 heat pipes that outer diameter is 8mm, semiconductor chilling plate（6）With the first heat pipe heat（7）Pass through one block of gold
Belong to plate（4）, fixed semiconductor chilling plate（6）Hot junction and heat pipe engaging portion smear heat dissipating silicone grease；First heat pipe heat（3）Heat
Connecting copper pipe fin on pipe（2）, copper tube and fin（2）Cold end fan is arranged in top（5）；Second heat pipe heat（7）Heat pipe on connect
Copper tube and fin（2）, copper tube and fin（2）Cold end fan is arranged in top（5）；Pass through the first heat pipe heat（3）With cold end fan（5）It is cold
Air is sent to air hose, and cold air carries out radiating and cooling by the CPU that air hose is computer and computer core exothermic parts.
2. a kind of enhanced heat exchange type computer radiator as described in claim 1, it is characterised in that：Semiconductor chilling plate（6）For
Long 40mm, wide 40mm, the tablet of thick 3.75mm.
3. a kind of enhanced heat exchange type computer radiator as described in claim 1, it is characterised in that：Metallic plate（4）For long 60mm,
Wide 45mm, the tablet of thick 3mm.
4. a kind of enhanced heat exchange type computer radiator as described in claim 1, it is characterised in that：Heat pipe（3）Outer diameter is 8mm.
5. a kind of enhanced heat exchange type computer radiator as described in claim 1, it is characterised in that：Hot junction fan（1）It is a diameter of
80mm。
6. a kind of enhanced heat exchange type computer radiator as described in claim 1, it is characterised in that：Cold end fan（5）It is a diameter of
80mm。
7. a kind of enhanced heat exchange type computer radiator as described in claim 1, it is characterised in that：Cold end fan（5）With computer
CPU and computer core exothermic parts between connect one section of circular duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810428658.0A CN108376025A (en) | 2018-05-07 | 2018-05-07 | A kind of enhanced heat exchange type computer radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810428658.0A CN108376025A (en) | 2018-05-07 | 2018-05-07 | A kind of enhanced heat exchange type computer radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108376025A true CN108376025A (en) | 2018-08-07 |
Family
ID=63033425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810428658.0A Pending CN108376025A (en) | 2018-05-07 | 2018-05-07 | A kind of enhanced heat exchange type computer radiator |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109828651A (en) * | 2019-03-21 | 2019-05-31 | 沈阳工程学院 | Notebook PC radiator based on thermoelectric heat pump |
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-
2018
- 2018-05-07 CN CN201810428658.0A patent/CN108376025A/en active Pending
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|---|---|---|---|---|
| CN2503515Y (en) * | 2001-09-14 | 2002-07-31 | 招灼柱 | Improved structure of computer casing |
| DE102006021829A1 (en) * | 2006-05-10 | 2007-11-15 | Macs Technology Inc., Lu-Chu | Thermal radiator has thermoelectric cooler, and multiple thermal radiator module comprises thermal radiator module with set of cooling fin, where thermal conduction is connected with each fin of this set by cooling fins |
| CN101222836A (en) * | 2007-01-11 | 2008-07-16 | 杨伍民 | Direct conduction-Peltier effect refrigeration mixed cooling method and device |
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Application publication date: 20180807 |
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