CN204166472U - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
- Publication number
- CN204166472U CN204166472U CN201420690766.2U CN201420690766U CN204166472U CN 204166472 U CN204166472 U CN 204166472U CN 201420690766 U CN201420690766 U CN 201420690766U CN 204166472 U CN204166472 U CN 204166472U
- Authority
- CN
- China
- Prior art keywords
- insert box
- cabinet
- semiconductor chilling
- chilling plate
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 18
- 235000012149 noodles Nutrition 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims description 16
- 239000004606 Fillers/Extenders Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000010425 asbestos Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000011490 mineral wool Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229910052895 riebeckite Inorganic materials 0.000 claims description 3
- 230000005679 Peltier effect Effects 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 abstract description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of semiconductor cooling device, comprise insert box, insert box is hollow structure, comprises top panel, front panel and rear panel; Installation of heat radiator, control module, heating board, semiconductor chilling plate in insert box; Board is smooth contacts for the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and heating, and the hot side of semiconductor chilling plate contacts with heating radiator is smooth, and heating radiator is arranged downwards as base plate; Heating board and the middle temperature sensor that is sticked of semiconductor chilling plate, temperature sensor is connected with control module signal.It is the one electricity refrigerating method utilizing Peltier effect, have that volume is little, noise is low, movement-less part and the advantage such as regulable control is convenient, utilize it to control feature easily and improve coefficient of refrigerating performance as far as possible, the cooling problem of the electronic equipment under high power device and rugged surroundings can be solved.
Description
Technical field
The utility model relates to a kind of semiconductor cooling device, belongs to technical field of communication equipment.
Background technology
At present, the nonstandard intermediate frequency process cabinet of development is made up of multiple heating board assembly, can the equipment of complete independently data processing function.Some heating board thermal values are very large, if the radiating efficiency of cooling system does not reach requirement, temperature in chassis can raise in a short period of time and exceed usable range, the performance of each heating board of serious impact, even can cause the damage of heating board.
At present, intermediate frequency process cabinet mainly dispels the heat in mode that is air-cooled or water-cooled.The common ground of these two kinds of radiating modes is, is all by the heat of cabinet inside, is transferred in external environment condition.But when the temperature of external environment condition raises, the efficiency of these two kinds of radiating modes will reduce, thus causes the constant temperature in cabinet to raise.
In sum, there is the lower problem of radiating efficiency in existing intermediate frequency process cabinet.
Utility model content
Object: in order to overcome the deficiencies in the prior art, the utility model provides a kind of semiconductor cooling device, is intended to solve the problem that the radiating efficiency of existing intermediate frequency process cabinet existence is lower.
Technical scheme: for solving the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of semiconductor cooling device, comprise insert box, insert box is hollow structure, comprises top panel, front panel and rear panel; Installation of heat radiator, control module, heating board, semiconductor chilling plate in insert box;
Board is smooth contacts for the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and heating, and the hot side of semiconductor chilling plate contacts with heating radiator is smooth, and heating radiator is arranged downwards as base plate; Described heating board and the middle temperature sensor that is sticked of semiconductor chilling plate, temperature sensor is connected with control module signal.
Described a kind of semiconductor cooling device, is characterized in that: bond thermofin between insert box top panel inside surface and heating board.
Described a kind of semiconductor cooling device, is characterized in that, the material of described thermofin is asbestos or rock wool.
Described a kind of semiconductor cooling device, is characterized in that: the upper and lower surface of described semiconductor chilling plate is coated with heat-conducting silicone grease; And/or the upper and lower surface of semiconductor chilling plate is sticked chill bar;
Described a kind of semiconductor cooling device, is characterized in that: heating radiator is splintery, and material is aluminium.
Described a kind of semiconductor cooling device, is characterized in that: described insert box rear panel arranges card extender.
A kind of intermediate frequency process machine, is characterized in that, comprising: above-described insert box, fan, cabinet, power supply, air inlet, base plate, radiating circuit;
The surface of cabinet arranges radiating circuit, smoothly on radiating circuit arranges base plate, described base plate is provided with multiple slot, for the multiple insert box of grafting; Insert box is fixedly connected with the base plate on cabinet by latch mechanism; Be provided with air intake opening bottom described cabinet, enclosure top is provided with fan, for extracting hot blast or the cold wind of cabinet inside; Power supply is arranged on the side of cabinet, for providing the power supply of relevant voltage for equipment each in cabinet; The power end of the output terminal link control module of power supply.
Described a kind of intermediate frequency process machine, it is characterized in that: also comprise connector, connector is arranged on the side of cabinet, for the input and output of cabinet signal and power supply.
Described a kind of intermediate frequency process machine, is characterized in that: described insert box rear panel arranges card extender, and insert box is connected with base plate by card extender.
Described a kind of intermediate frequency process machine, is characterized in that: described base plate also offers multiple reserved through hole, for each insert box provides communication channel.
Beneficial effect: a kind of semiconductor cooling device that the utility model provides, it is the one electricity refrigerating method utilizing Peltier effect, have that volume is little, noise is low, movement-less part and the advantage such as regulable control is convenient, utilize it to control feature easily and improve coefficient of refrigerating performance as far as possible, the cooling problem of the electronic equipment under high power device and rugged surroundings can be solved; In intermediate frequency process cabinet, the temperature sensor of each insert box is time too high or too low for temperature, and temperature signal is transferred to control module, and control module will control the voltage input of semiconductor chilling plate, play effect that is cold to heating board blocking or heating; The thermofin on insert box surface can prevent the impact of ambient temperature; Meanwhile, the fan of enclosure top can take away hot gas or the cold air of generation at any time, ensures the normal work of whole cabinet.
Accompanying drawing explanation
Fig. 1 is the front view of the utility model intermediate frequency process machine;
Fig. 2 is the side view of the utility model intermediate frequency process machine;
Fig. 3 is insert box inner structure schematic diagram in the utility model;
In figure, insert box 1, fan 2, cabinet 3, power supply 4, connector 5, air inlet 6, base plate 7, radiating circuit 8, heating radiator 9, card extender 10, control module 11, thermofin 12, heating board 13, temperature sensor 14, semiconductor chilling plate 15.
Embodiment
Below in conjunction with specific embodiment, the utility model is further described.
As shown in Figure 3, a kind of semiconductor cooling device, comprises insert box 1, and insert box 1 is hollow structure, comprises top panel, front panel and rear panel; Installation of heat radiator 9, card extender 10, control module 11, thermofin 12, heating board 13, temperature sensor 14, semiconductor chilling plate 15 in insert box 1;
Board 13 is smooth contacts for the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 15 and heating, and the hot side of semiconductor chilling plate 15 contacts with heating radiator 9 is smooth, and heating radiator 9 is arranged downwards as base plate; Described heating board 13 be sticked temperature sensor 14 middle with semiconductor chilling plate 15, temperature sensor 14 is connected with control module 11 signal.Described insert box 1 rear panel arranges card extender 10.
Huyashi-chuuka (cold chinese-style noodles) and heating board 13 close contact of semiconductor chilling plate 15, the hot side of semiconductor chilling plate 15 and heating radiator 9 close contact, for ensureing the two sides contact of semiconductor chilling plate 15 closely, can coat heat-conducting silicone grease; For ensureing that semiconductor chilling plate 15 is not by outside destroy, can stick the chill bar of applicable thickness.
Further, insert box 1 also comprises thermofin 12, bonds thermofin 12 between insert box 1 top panel inside surface and heating board 13, and in the present embodiment, thermofin 12 and insert box 1 inside surface bond, and its material is asbestos, rock wool etc.By increasing thermofin 12, the heat that semiconductor chilling plate 15 can be avoided to produce conducts go back to insert box 1 inside by the inside surface of insert box 1, the impact that the radiating efficiency of temperature on radiating circuit 8 that simultaneously also can reduce external environment condition further causes, can also prevent the produced steam that colds and heat succeed each other.
Further, heating radiator 9 is splintery, and material is aluminium.By increasing heat radiator 9, the area of dissipation of semiconductor chilling plate 15 hot side can be increased, and then its radiating efficiency can be improved.
As depicted in figs. 1 and 2, a kind of intermediate frequency process machine, comprising: above-described insert box 1, fan 2, cabinet 3, power supply 4, connector 5, air inlet 6, base plate 7, radiating circuit 8; The inside surface of cabinet 3 arranges radiating circuit 8, smoothly on radiating circuit 8 arranges base plate 7, described base plate 7 is provided with multiple slot, for the multiple insert box 1 of grafting; Described base plate 7 also offers multiple reserved through hole, for each insert box provides communication channel.Insert box 1 is fixedly connected with the base plate on cabinet 3 by latch mechanism; Be provided with air intake opening 6 bottom described cabinet 3, cabinet 3 top is provided with fan 2, for extracting hot blast or the cold wind of cabinet inside; Power supply 4 is arranged on the side of cabinet 3, for providing the power supply of relevant voltage for equipment each in cabinet 3; The power end of the output terminal link control module 11 of power supply 4.Connector 5 is arranged on the side of cabinet 3, for the input and output of cabinet 3 signal and power supply.Insert box 1 rear panel arranges card extender 10, and insert box 1 is connected with base plate 7 by card extender 10.
In the present embodiment, semiconductor chilling plate 15 is also thermoelectric cooling sheet, thermoelectric module or electronic refrigerating sheet, is to utilize the peltier effect in thermoelectric effect to freeze.Its principle is, charge carrier moves formation electric current in the conductor.Because charge carrier is in different energy levels in different materials, when it moves from high level to low-lying level, just discharge unnecessary energy; Otherwise when moving from low-lying level to high level, just need to absorb heat semiconductor chilling plate 15 from the external world and can adopt one or more levels thermoelectric pile, its quantity also can be one or more.And when its quantity is multiple time, can carry out being connected in parallel or being connected in series.
Temperature sensor 14 is attached in the middle of heating board 13 and semiconductor chilling plate 15, and the change of Real-Time Monitoring temperature also passes to control module 11.Temperature sensor 14 can adopt thermoelectricity occasionally thermistor design, it belongs to prior art, does not repeat them here.
Concrete, temperature sensor 14 sends the temperature conditions of insert box 1 inside to control module 11, control module 11 is according to preset temperature, judge that whether the temperature of insert box 1 inside is higher, if temperature is too high, then connect the power supply of semiconductor chilling plate 15, freezed by the air of chill surface to insert box 1 inside.Meanwhile, the heat that the face that heats of semiconductor chilling plate 15 produces, then distributed by heating radiator 9.When the temperature of insert box 1 inside reaches preset temperature, disconnect the power supply of semiconductor chilling plate 15, stop refrigeration.Such iterative cycles, thus reach the effect to insert box 1 internal heat dissipating.
In the present embodiment, fan 2 is arranged on the top of cabinet 3, and it is inner that air-flow enters cabinet 3 by the air intake opening 6 of cabinet 3 bottom, then by the vertical heating radiator 9 installed in radiating circuit 8 surface, is extracted out cabinet 3 by fan 2.Cabinet 3 each local temperature equalization inner can be made like this, accelerate the air flowing of cabinet 3 inside, avoid local temperature too high.This fan has power end, can access external power source.
The power end of the output terminal link control module 11 of power supply 4.In the present embodiment, by power supply 4 for control module 11 and fan 2 are powered, its output terminal can comprise at least one voltage and export, as 5V, 12V or 3.3V, with the demand of satisfied different electricity consumption device.
The above is only preferred implementation of the present utility model; be noted that for those skilled in the art; under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (10)
1. a semiconductor cooling device, is characterized in that: comprise insert box, and insert box is hollow structure, comprises top panel, front panel and rear panel; Installation of heat radiator, control module, heating board, semiconductor chilling plate in insert box;
Board is smooth contacts for the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and heating, and the hot side of semiconductor chilling plate contacts with heating radiator is smooth, and heating radiator is arranged downwards as base plate; Described heating board and the middle temperature sensor that is sticked of semiconductor chilling plate, temperature sensor is connected with control module signal.
2. a kind of semiconductor cooling device according to claim 1, is characterized in that: bond thermofin between insert box top panel inside surface and heating board.
3. a kind of semiconductor cooling device according to claim 2, is characterized in that, the material of described thermofin is asbestos or rock wool.
4. a kind of semiconductor cooling device according to claim 1, is characterized in that: the upper and lower surface of described semiconductor chilling plate is coated with heat-conducting silicone grease; And/or the upper and lower surface of semiconductor chilling plate is sticked chill bar.
5. a kind of semiconductor cooling device according to claim 1, is characterized in that: heating radiator is splintery, and material is aluminium.
6. a kind of semiconductor cooling device according to claim 1, is characterized in that: described insert box rear panel arranges card extender.
7. an intermediate frequency process machine, is characterized in that, comprising: the insert box as described in any one of claim 1-6, fan, cabinet, power supply, air inlet, base plate, radiating circuit;
The surface of cabinet arranges radiating circuit, smoothly on radiating circuit arranges base plate, described base plate is provided with multiple slot, for the multiple insert box of grafting; Insert box is fixedly connected with the base plate on cabinet by latch mechanism; Be provided with air intake opening bottom described cabinet, enclosure top is provided with fan, for extracting hot blast or the cold wind of cabinet inside; Power supply is arranged on the side of cabinet, for providing the power supply of relevant voltage for equipment each in cabinet; The power end of the output terminal link control module of power supply.
8. a kind of intermediate frequency process machine according to claim 7, it is characterized in that: also comprise connector, connector is arranged on the side of cabinet, for the input and output of cabinet signal and power supply.
9. a kind of intermediate frequency process machine according to claim 7, is characterized in that: described insert box rear panel arranges card extender, and insert box is connected with base plate by card extender.
10. a kind of intermediate frequency process machine according to claim 7, is characterized in that: described base plate also offers multiple reserved through hole, for each insert box provides communication channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420690766.2U CN204166472U (en) | 2014-11-18 | 2014-11-18 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420690766.2U CN204166472U (en) | 2014-11-18 | 2014-11-18 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204166472U true CN204166472U (en) | 2015-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420690766.2U Expired - Fee Related CN204166472U (en) | 2014-11-18 | 2014-11-18 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204166472U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793669A (en) * | 2015-11-20 | 2017-05-31 | 华为技术有限公司 | A kind of radiating subassembly and communication equipment |
| CN107340789A (en) * | 2017-08-30 | 2017-11-10 | 中国医科大学附属第医院 | Cryo tissue embeds adapter |
| CN108307607A (en) * | 2017-01-13 | 2018-07-20 | 慧与发展有限责任合伙企业 | Inlet channel with thermoelectric cooling element |
| CN108551753A (en) * | 2018-06-19 | 2018-09-18 | 广州开能电气实业有限公司 | A fully enclosed power quality comprehensive control device |
| CN113608108A (en) * | 2021-08-09 | 2021-11-05 | 湖南博匠信息科技有限公司 | VPX integrated circuit board intelligence test fixture |
| CN114428540A (en) * | 2020-10-29 | 2022-05-03 | 广州塔克兰森信息科技有限公司 | MIXD-C1 intelligent conference platform |
-
2014
- 2014-11-18 CN CN201420690766.2U patent/CN204166472U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793669A (en) * | 2015-11-20 | 2017-05-31 | 华为技术有限公司 | A kind of radiating subassembly and communication equipment |
| CN106793669B (en) * | 2015-11-20 | 2019-04-19 | 华为技术有限公司 | A heat dissipation component and communication equipment |
| CN108307607A (en) * | 2017-01-13 | 2018-07-20 | 慧与发展有限责任合伙企业 | Inlet channel with thermoelectric cooling element |
| CN108307607B (en) * | 2017-01-13 | 2020-05-26 | 慧与发展有限责任合伙企业 | Intake passage with thermoelectric cooling element |
| CN107340789A (en) * | 2017-08-30 | 2017-11-10 | 中国医科大学附属第医院 | Cryo tissue embeds adapter |
| CN107340789B (en) * | 2017-08-30 | 2022-10-21 | 中国医科大学附属第一医院 | Low-temperature tissue embedding adapter |
| CN108551753A (en) * | 2018-06-19 | 2018-09-18 | 广州开能电气实业有限公司 | A fully enclosed power quality comprehensive control device |
| CN114428540A (en) * | 2020-10-29 | 2022-05-03 | 广州塔克兰森信息科技有限公司 | MIXD-C1 intelligent conference platform |
| CN113608108A (en) * | 2021-08-09 | 2021-11-05 | 湖南博匠信息科技有限公司 | VPX integrated circuit board intelligence test fixture |
| CN113608108B (en) * | 2021-08-09 | 2023-10-20 | 湖南博匠信息科技有限公司 | VPX integrated circuit board intelligent test frock |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 Termination date: 20181118 |