CN101980101A - Semiconductor refrigerating cooling pad for laptop - Google Patents

Semiconductor refrigerating cooling pad for laptop Download PDF

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Publication number
CN101980101A
CN101980101A CN 201010535296 CN201010535296A CN101980101A CN 101980101 A CN101980101 A CN 101980101A CN 201010535296 CN201010535296 CN 201010535296 CN 201010535296 A CN201010535296 A CN 201010535296A CN 101980101 A CN101980101 A CN 101980101A
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CN
China
Prior art keywords
laptop
semiconductor refrigerating
notebook computer
heat
cpu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201010535296
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Chinese (zh)
Inventor
余敏
马龙
茅今哲
刘亚
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University of Shanghai for Science and Technology
Original Assignee
University of Shanghai for Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Shanghai for Science and Technology filed Critical University of Shanghai for Science and Technology
Priority to CN 201010535296 priority Critical patent/CN101980101A/en
Publication of CN101980101A publication Critical patent/CN101980101A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a semiconductor refrigerating cooling pad for a laptop. A semiconductor refrigerating piece is the core of equipment, arranged in a cushion of the laptop and opposite to a laptop hard disk and a central processing unit (CPU) area, and provides cold quantity required by cooling the laptop; a heating conducting plate quickly and approximately uniformly diffuses the cold quantity produced by the semiconductor refrigerating piece to the lower part of the laptop; and a fan and a fin assist the hot end of the semiconductor refrigerating piece in dissipating heat to enhance the refrigerating effect of the cold end of the semiconductor refrigerating piece. The semiconductor refrigerating cooling pad for the laptop has high heat dissipation capability and low manufacturing cost, is light and portable, and can solve the problems of blue screen and crash caused by overhigh temperature of a CPU and a display card for large computer software users, computer game enthusiasts and users who are fond of realizing the overclocking phenomenon of the CPU.

Description

Notebook computer semiconductor refrigeration radiating pad
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of notebook computer semiconductor refrigeration radiating pad.
Background technology
At present, along with the exploitation and the continual renovation of various large softwares are regenerated, it is particularly outstanding that the problem of notebook computer poor heat radiation seems.Miscellaneous parts such as the CPU of notebook computer and video card are when running up, can produce very big heat, more there is a kind of computer amateur extremely to hanker after " computer overclocking ", made the running of computer exceed its specified security parameter, allow it reach computing velocity faster, and computer was in high loaded process this moment, can produce more heat, it is bad to dispel the heat, and can cause computer operation speed slack-off, even can crash or burn computer part.
Because a variety of causes does not still have the device that any a mode with refrigeration solves the heat radiation of notebook computer at present.Be fan cooling pad and water bag cooling pad on the market, far do not satisfy the heat radiation requirement of notebook computer when environment temperature height or high loaded process.And, also rarely have notebook computer can support the CPU overclocking at present because heat radiation is not enough.
Summary of the invention
The present invention be directed to the problem of existing cooling pad of notebook computer heat-sinking capability deficiency, proposed a kind of notebook computer semiconductor refrigeration radiating pad, come the notebook computer cooling has been improved the notebook heat-sinking capability greatly in the mode of refrigeration.
Technical scheme of the present invention is: a kind of notebook computer semiconductor refrigeration radiating pad, comprise notebook computer cushion, semiconductor chilling plate, heat-conducting plate, fin, fan, power switch, heat-conducting plate places the notebook computer cushion, face notebook hard disk and CPU zone, semiconductor chilling plate is close to the heat-conducting plate below, lower surface at semiconductor chilling plate is equipped with fin and fan, and semiconductor chilling plate and heat-conducting plate and fin are pasted with heat conductive silica gel.
Described power switch connects cooling pad of notebook computer and notebook computer, uses notebook USB mouth that its required voltage is provided.
Beneficial effect of the present invention is: notebook computer semiconductor refrigeration radiating pad of the present invention, heat-sinking capability is strong, cost is low, lightly portable, can help giant brain software user, computer game fan and like ardently the user who realizes CPU overclocking phenomenon that to solve CPU and video card temperature too high and the problem of blue screen and deadlock occurs.
Description of drawings
Fig. 1 is a notebook computer semiconductor refrigeration radiating pad vertical view of the present invention;
Fig. 2 is a notebook computer semiconductor refrigeration radiating pad front elevation of the present invention.
Embodiment
Notebook computer semiconductor refrigeration radiating pad shown in Fig. 1 ~ 2 comprises semiconductor chilling plate 4, heat-conducting plate 3, notebook computer cushion 1, fin 5, fan 6, power switch 7 and pilot lamp etc.The notebook computer cushion has 4 cushion pillars 2 for 1 time, heat-conducting plate 3 places notebook computer cushion 1, face notebook hard disk and CPU zone, semiconductor chilling plate 4 is close to below the heat-conducting plate 3, after turning on the power switch 7, semiconductor chilling plate 4 begins refrigeration, and the cold that semiconductor chilling plate 4 upper surfaces produce reaches the notebook computer below by heat-conducting plate 3, thereby notebook computer is dispelled the heat.Lower surface at semiconductor chilling plate 4 is equipped with fin 5 and fan 6, and the two acting in conjunction sheds the heat in semiconductor chilling plate 4 hot junctions, guarantees the refrigeration of semiconductor chilling plate 4.For improving refrigerating efficiency, semiconductor chilling plate 4 is pasted with heat-conducting plate 3 and fin 5 usefulness heat conductive silica gels.
The entire equipment dispense with outer connecting power uses notebook USB mouth that its required voltage can be provided, and power switch 7 connects cooling pad of notebook computer and notebook computer, utilizes the power supply of notebook computer USB mouth as this cooling pad, and the start and stop of this cooling pad of may command.
The present invention adopts semiconductor chilling plate, mode with refrigeration comes notebook computer is lowered the temperature, this equipment good refrigeration effect, simple in structure, cost is low, lightly portable, no refrigeration working medium, friction, pollution-free, start fast, control flexibly, the life-span is long, reliability is high, be convenient to maintenance, has reached very high heat radiation requirement again.Solved giant brain software user, computer game fan and liked ardently the user that realizes CPU overclocking phenomenon worry, the development of following notebook computer heat dissipation technology has been had certain reference value the too high problem of notebook computer temperature.

Claims (2)

1. notebook computer semiconductor refrigeration radiating pad, it is characterized in that, comprise notebook computer cushion (1), heat-conducting plate (3), semiconductor chilling plate (4), fin (5), fan (6), power switch (7), heat-conducting plate (3) places notebook computer cushion (1), face notebook hard disk and CPU zone, semiconductor chilling plate (4) is close to heat-conducting plate (3) below, lower surface at semiconductor chilling plate (4) is equipped with fin (5) and fan (6), and semiconductor chilling plate (4) is pasted with heat conductive silica gel with heat-conducting plate (3) and fin (5).
2. according to the described notebook computer semiconductor refrigeration radiating of claim 1 pad, it is characterized in that described power switch (7) connects cooling pad of notebook computer and notebook computer, use notebook USB mouth that its required voltage is provided.
CN 201010535296 2010-11-09 2010-11-09 Semiconductor refrigerating cooling pad for laptop Pending CN101980101A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010535296 CN101980101A (en) 2010-11-09 2010-11-09 Semiconductor refrigerating cooling pad for laptop

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201010535296 CN101980101A (en) 2010-11-09 2010-11-09 Semiconductor refrigerating cooling pad for laptop

Publications (1)

Publication Number Publication Date
CN101980101A true CN101980101A (en) 2011-02-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201010535296 Pending CN101980101A (en) 2010-11-09 2010-11-09 Semiconductor refrigerating cooling pad for laptop

Country Status (1)

Country Link
CN (1) CN101980101A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104049689A (en) * 2014-05-27 2014-09-17 李思思 Method for preparing portable three-temperature worktable of laptop
CN104281237A (en) * 2013-07-03 2015-01-14 南京化工职业技术学院 Automatic control notebook computer radiating rack
CN109828651A (en) * 2019-03-21 2019-05-31 沈阳工程学院 Notebook PC radiator based on thermoelectric heat pump

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2677993Y (en) * 2004-01-09 2005-02-09 晟铭电子科技股份有限公司 Radiating base of note-book computer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2677993Y (en) * 2004-01-09 2005-02-09 晟铭电子科技股份有限公司 Radiating base of note-book computer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104281237A (en) * 2013-07-03 2015-01-14 南京化工职业技术学院 Automatic control notebook computer radiating rack
CN104049689A (en) * 2014-05-27 2014-09-17 李思思 Method for preparing portable three-temperature worktable of laptop
CN109828651A (en) * 2019-03-21 2019-05-31 沈阳工程学院 Notebook PC radiator based on thermoelectric heat pump

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Application publication date: 20110223