CN202033710U - Notebook cooling pad - Google Patents

Abstract

The utility model relates to a cooling pad for a notebook computer, which comprises a seat cushion for a notebook computer, a heat conduction plate, a semiconductor refrigeration sheet, a fan and a power switch. The heat conduction plate is placed in the seat cushion of the notebook computer, and is located under the hard disk and the CPU area of the notebook. The lower surface of the heat conduction plate is close to the semiconductor cooling sheet, and the lower surface of the semiconductor cooling sheet is equipped with fins and fans. The utility model has strong heat dissipation capability, low cost, light and portable, and can help large-scale computer software users, computer game enthusiasts and users who love to realize CPU overclocking to solve problems such as blue screen and crash caused by excessive temperature of CPU and graphics card.

Description

Laptop Cooling Pad

technical field

The utility model relates to a cooling device for a notebook computer, in particular to a cooling device for a notebook computer which adopts a semiconductor refrigeration sheet for cooling.

Background technique

At present, with the development and continuous upgrading of various large-scale software, the problem of poor heat dissipation of notebook computers is particularly prominent. When the CPU, graphics card and other components of a notebook computer run at high speed, they will generate a lot of heat. There is also a kind of computer enthusiast who is very keen on "computer overclocking", so that the operation of the computer exceeds its rated safety parameters, allowing it to reach a higher level. Fast calculation speed, while the computer is running at a high load at this time, it will generate more heat, poor heat dissipation will cause the computer to run slower, and even crash or burn computer components.

Due to various reasons, there is no device that solves the heat dissipation of the notebook computer in a cooling manner at present. There are fan cooling pads and water bag cooling pads on the market, which are far from meeting the cooling requirements of notebook computers when the ambient temperature is high or the laptop is running under a high load. Due to insufficient heat dissipation, there are few notebook computers that can support CPU overclocking.

Contents of the invention

The utility model aims to solve the technical problem of poor cooling capacity of the existing cooling pad for notebook computers, and proposes a new type of cooling pad for notebook computers. The cooling pad cools down the notebook computer in the form of semiconductor refrigeration, which greatly improves the cooling capacity of the notebook computer.

The technical scheme of the utility model is: a notebook computer heat dissipation pad, including a notebook computer seat cushion, a heat conduction plate, a semiconductor refrigeration sheet, a fan, and a power switch. Below the CPU area, the lower surface of the heat conduction plate is close to the semiconductor cooling sheet, and the lower surface of the semiconductor cooling sheet is equipped with fins and fans.

The power switch connects the cooling pad of the notebook computer with the notebook computer. The four corners of the computer cushion are respectively supported by cushion pillars below. Thermal silica gel is pasted between the semiconductor refrigeration sheet, the heat conduction plate and the fins.

The beneficial effects of the utility model are: the utility model notebook computer heat dissipation pad has strong heat dissipation capability, low cost, light and portable, and can help users of large-scale computer software, computer game enthusiasts and users who love to realize CPU overclocking to solve CPU and graphics card problems. Problems such as blue screen and crash caused by excessive temperature.

Description of drawings

Fig. 1 is the front view of the utility model;

FIG. 2 is a top view of FIG. 1 .

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is described further.

As shown in Figures 1 and 2, the notebook computer cooling pad of the present utility model includes a notebook computer cushion 1, a cushion pillar 2, a heat conducting plate 3, a semiconductor cooling plate 4, fins 5, a fan 6, a power switch 7 and an indicator light, etc. . Four cushion pillars 2 are installed under the four corners of the notebook computer cushion 1. The heat conduction plate 3 is placed in the notebook computer cushion 1, facing the notebook hard disk and the CPU area. Fins 5 and fans 6 are provided on the lower surface of the sheet 4 .

After the power switch 7 is turned on, the semiconductor refrigeration sheet 4 starts cooling, and the cold generated on the upper surface of the semiconductor refrigeration sheet 4 is transmitted to the bottom of the notebook computer through the heat conduction plate 3, thereby dissipating heat from the notebook computer. Fin 5 and fan 6 are housed on the lower surface of semiconductor refrigerating sheet 4, and the two work together to dissipate the heat at the hot end of semiconductor refrigerating sheet 4 to ensure the cooling effect of semiconductor refrigerating sheet 4. In order to improve the refrigeration efficiency, the semiconducting refrigeration sheet 4, the heat conduction plate 3 and the fins 5 are pasted with heat conduction silica gel.

The whole device does not need an external power supply, and the required voltage can be provided by using the notebook USB port. stop.

The utility model adopts a semiconductor refrigerating sheet to cool down a notebook computer in a refrigerating manner. The device has good refrigerating effect, simple structure, low cost, light and portable, no refrigerant, no pollution, quick start, flexible control, and long service life. It is easy to maintain and meets high heat dissipation requirements. It solves the worries of large-scale computer software users, computer game enthusiasts and users who love to realize the CPU overclocking phenomenon about the excessive temperature of notebook computers, and has certain reference value for the development of notebook computer heat dissipation technology in the future.

Claims (4)

1. A notebook computer heat dissipation pad, including a notebook computer seat cushion (1), a heat conduction plate (3), a semiconductor cooling sheet (4), a fan (6), and a power switch (7), characterized in that: the heat conduction plate ( 3) Place it in the laptop seat cushion (1), and it is located under the notebook hard disk and CPU area. The lower surface of the heat conduction plate (3) is close to the semiconductor cooling sheet (4), and the lower surface of the semiconductor cooling sheet (4) is equipped with fins ( 5) and fan (6). 2. The notebook computer cooling pad according to claim 1, wherein the power switch (7) is connected to the notebook computer cooling pad and the notebook computer. 3. The laptop cooling pad according to claim 1, characterized in that: the four corners of the computer cushion (1) are respectively supported by cushion pillars (2). 4. The notebook computer heat dissipation pad according to claim 1, characterized in that: the semiconductor cooling sheet (4), the heat conduction plate (3) and the fins (5) are pasted with heat conduction silica gel.

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