CN202033710U - Notebook cooling pad - Google Patents
Notebook cooling pad Download PDFInfo
- Publication number
- CN202033710U CN202033710U CN2011201205867U CN201120120586U CN202033710U CN 202033710 U CN202033710 U CN 202033710U CN 2011201205867 U CN2011201205867 U CN 2011201205867U CN 201120120586 U CN201120120586 U CN 201120120586U CN 202033710 U CN202033710 U CN 202033710U
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- China
- Prior art keywords
- notebook computer
- notebook
- cooling pad
- heat
- cushion
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- Expired - Fee Related
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Abstract
The utility model relates to a notebook cooling pad, which comprises a notebook cushion, a heat conduction board, a semiconductor refrigerating plate, a fan and a power switch. The heat conduction board is arranged in the notebook cushion and below a notebook hard disk and a central processing unit (CPU) area, the lower surface of the heat conduction board is tightly attached to the semiconductor refrigerating plate, and fins and the fan are arranged on the lower surface of the semiconductor refrigerating plate. The notebook cooling pad is strong in heat dissipation capacity, low in manufacturing cost, light and portable and capable of helping large computer software users, computer game enthusiasts and users who like to realize CPU overclocking phenomena to solve the problems of blue screen, crash and the like caused by excess temperature of the CPU and a graphics card.
Description
Technical field
The utility model relates to a kind of heat radiator for notebook computer, particularly a kind of heat radiator for notebook computer that adopts the semiconductor chilling plate cooling.
Background technology
At present, along with the exploitation and the continual renovation of various large softwares are regenerated, it is particularly outstanding that the problem of notebook computer poor heat radiation seems.Miscellaneous parts such as the CPU of notebook computer and video card are when running up, can produce very big heat, more there is a kind of computer amateur extremely to hanker after " computer overclocking ", made the running of computer exceed its specified security parameter, allow it reach computing velocity faster, and computer was in high loaded process this moment, can produce more heat, it is bad to dispel the heat, and can cause computer operation speed slack-off, even can crash or burn computer part.
Because a variety of causes does not still have the device that any a mode with refrigeration solves the heat radiation of notebook computer at present.Be fan cooling pad and water bag cooling pad on the market, far do not satisfy the heat radiation requirement of notebook computer when environment temperature height or high loaded process.And, also rarely have notebook computer can support the CPU overclocking at present because heat radiation is not enough.
Summary of the invention
The utility model is the technical matters that will solve existing cooling pad of notebook computer heat-sinking capability difference, and a kind of novel cooling pad of notebook computer is proposed, this cooling pad comes the notebook computer cooling has been improved the notebook heat-sinking capability greatly in the mode of semiconductor refrigerating.
The technical solution of the utility model is: a kind of cooling pad of notebook computer, comprise the notebook computer cushion, heat-conducting plate, semiconductor chilling plate, fan, power switch, be characterized in: heat-conducting plate places the notebook computer cushion, and be positioned at notebook hard disk and CPU zone below, the heat-conducting plate lower surface is close to semiconductor chilling plate, and the semiconductor chilling plate lower surface is equipped with fin and fan.
Power switch connects cooling pad of notebook computer and notebook computer.Use the cushion shore supports respectively below four jiaos of the computer cushions.Paste with heat conductive silica gel between semiconductor chilling plate and heat-conducting plate and the fin.
The beneficial effects of the utility model are: the utility model cooling pad of notebook computer, heat-sinking capability is strong, cost is low, lightly portable, can help giant brain software user, computer game fan and like ardently the user who realizes CPU overclocking phenomenon to solve the too high and problems such as the blue screen that occurs and deadlock of CPU and video card temperature.
Description of drawings
Fig. 1 is a front view of the present utility model;
Fig. 2 is the vertical view of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described.
As Fig. 1, shown in 2, cooling pad of notebook computer of the present utility model comprises notebook computer cushion 1, cushion pillar 2, heat-conducting plate 3, semiconductor chilling plate 4, fin 5, fan 6, power switch 7 and pilot lamp etc.Four cushion pillars 2 are housed below four jiaos of notebook computer cushion 1, heat-conducting plate 3 places notebook computer cushion 1, face notebook hard disk and CPU zone, semiconductor chilling plate 4 is close to heat-conducting plate 3 lower surfaces, and semiconductor chilling plate 4 lower surfaces are equipped with fin 5 and fan 6.
After turning on the power switch 7, semiconductor chilling plate 4 begins refrigeration, and the cold that semiconductor chilling plate 4 upper surfaces produce reaches the notebook computer below by heat-conducting plate 3, thereby notebook computer is dispelled the heat.Lower surface at semiconductor chilling plate 4 is equipped with fin 5 and fan 6, and the two acting in conjunction sheds the heat in semiconductor chilling plate 4 hot junctions, guarantees the refrigeration of semiconductor chilling plate 4.For improving refrigerating efficiency, semiconductor chilling plate 4 is pasted with heat-conducting plate 3 and fin 5 usefulness heat conductive silica gels.
The entire equipment dispense with outer connecting power uses notebook USB mouth that its required voltage can be provided, and power switch 7 connects cooling pad of notebook computer and notebook computer, utilizes the power supply of notebook computer USB mouth as this cooling pad, and the start and stop of this cooling pad of may command.
The utility model adopts semiconductor chilling plate, mode with refrigeration comes notebook computer is lowered the temperature, this equipment good refrigeration effect, simple in structure, cost is low, lightly portable, no refrigeration working medium, pollution-free, start fast, control flexibly, the life-span is long, be convenient to maintenance, reached very high heat radiation requirement again.Solved giant brain software user, computer game fan and liked ardently the user that realizes CPU overclocking phenomenon worry, the development of following notebook computer heat dissipation technology has been had certain reference value the too high problem of notebook computer temperature.
Claims (4)
1. cooling pad of notebook computer, comprise notebook computer cushion (1), heat-conducting plate (3), semiconductor chilling plate (4), fan (6), power switch (7), it is characterized in that: described heat-conducting plate (3) places notebook computer cushion (1), and be positioned at notebook hard disk and CPU zone below, heat-conducting plate (3) lower surface is close to semiconductor chilling plate (4), and semiconductor chilling plate (4) lower surface is equipped with fin (5) and fan (6).
2. according to the described cooling pad of notebook computer of claim 1, it is characterized in that: described power switch (7) connects cooling pad of notebook computer and notebook computer.
3. according to the described cooling pad of notebook computer of claim 1, it is characterized in that: use cushion pillar (2) to support below (1) four jiao of the described computer cushion respectively.
4. according to the described cooling pad of notebook computer of claim 1, it is characterized in that: paste with heat conductive silica gel between described semiconductor chilling plate (4) and heat-conducting plate (3) and the fin (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201205867U CN202033710U (en) | 2011-04-22 | 2011-04-22 | Notebook cooling pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201205867U CN202033710U (en) | 2011-04-22 | 2011-04-22 | Notebook cooling pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202033710U true CN202033710U (en) | 2011-11-09 |
Family
ID=44895999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201205867U Expired - Fee Related CN202033710U (en) | 2011-04-22 | 2011-04-22 | Notebook cooling pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202033710U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104375609A (en) * | 2014-11-14 | 2015-02-25 | 浙江大学 | Notebook computer cooler based on temperature difference power generation |
| CN104536548A (en) * | 2014-12-09 | 2015-04-22 | 成都格瑞思文化传播有限公司 | Notebook computer cooling plate |
-
2011
- 2011-04-22 CN CN2011201205867U patent/CN202033710U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104375609A (en) * | 2014-11-14 | 2015-02-25 | 浙江大学 | Notebook computer cooler based on temperature difference power generation |
| CN104536548A (en) * | 2014-12-09 | 2015-04-22 | 成都格瑞思文化传播有限公司 | Notebook computer cooling plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111109 Termination date: 20120422 |