CN208013876U - A kind of CPU water-filled radiators - Google Patents
A kind of CPU water-filled radiators Download PDFInfo
- Publication number
- CN208013876U CN208013876U CN201820369109.6U CN201820369109U CN208013876U CN 208013876 U CN208013876 U CN 208013876U CN 201820369109 U CN201820369109 U CN 201820369109U CN 208013876 U CN208013876 U CN 208013876U
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- China
- Prior art keywords
- heat
- cpu
- conducting plate
- water tank
- water
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of CPU water-filled radiators, for the CPU heat dissipations for computer, the upper surfaces CPU are provided with a heat-conducting plate, the heat-conducting plate quadrangle is provided with the first latch for being fixed on heat-conducting plate on mainboard, the first locking hole is provided on first latch, the heat-conducting plate both sides are connected with several radiating fins；A cooling water tank contacted with heat-conducting plate upper surface is provided on the heat-conducting plate, it is provided with micro pump in the cooling water tank, the water outlet of the micro pump is connected with conduction cooling pipe, and the conduction cooling pipe passes through radiating fin, and the water outlet of conduction cooling pipe is connected with the upper end of cooling water tank.Radiating fin and water cooling are combined as a whole by CPU water-filled radiators provided by the utility model, accelerate the cooling velocity of CPU so that the cooling effect of CPU is more preferable.
Description
Technical field
The utility model is related to field of computer technology, more particularly, to a kind of CPU water-filled radiators.
Background technology
Central processing unit (CPU) is one of capital equipment of electronic computer, the core part in computer.Its function is main
It is the data in interpretive machine instruction and processing computer software.All operations are all responsible for reading instruction by CPU in computer,
To Instruction decoding and the core component that executes instruction.CPU will produce a large amount of heat at work, and excessively high temperature can influence
The working performance of CPU results even in CPU and is stopped, and needs to carry out auxiliary heat dissipation, the effect quality of auxiliary heat dissipation to CPU
Conclusive effect is played to the stable operation of CPU.
Existing radiating mode is mainly bonded a radiator fan on CPU and radiates, but this mode radiates
It is inefficient, seriously affect the operational performance of high-performance computer.
Invention content
The utility model provides a kind of CPU water-filled radiators, and to solve, existing cpu heat radiating efficiency is low to ask
Topic.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is summarized as follows：
A kind of CPU water-filled radiators, for radiating for the CPU of computer, the upper surfaces CPU are provided with a heat-conducting plate, institute
It states heat-conducting plate quadrangle and is provided with the first latch for being fixed on heat-conducting plate on mainboard, be provided on first latch
First locking hole, the heat-conducting plate both sides are connected with several radiating fins；
It is provided with a cooling water tank contacted with heat-conducting plate upper surface on the heat-conducting plate, is provided in the cooling water tank
The water outlet of micro pump, the micro pump is connected with conduction cooling pipe, and the conduction cooling pipe passes through radiating fin, the water outlet of conduction cooling pipe
End is connected with the upper end of cooling water tank；
The heat-conducting plate both sides are provided with support column, and the support column lower end, which is provided with, is fixed on support column on mainboard
Second latch is provided with several second locking holes on second latch, and the cooling water tank both sides are provided with and support
The support ear of column flexible connection.
Further, the conduction cooling pipe takes the shape of the letter U across radiating fin；Contact of the conduction cooling pipe with radiating fin can be increased
Face so that heat exchange is more abundant, to enable conduction cooling pipe that can utmostly take away the heat of radiating fin.
Further, radiator fan, the both sides of the radiator fan and support column are provided with above the cooling water tank
Flexible connection；Auxiliary heat dissipation is carried out using radiator fan, further decreases CPU temperature nearby so that heat dissipation effect is more preferable.
Further, two groups of flabellums are provided in the radiator fan；So that the wind-force that radiator fan generates is more strong
Strength, heat dissipation effect are more preferable.
In conclusion by adopting the above-described technical solution, the utility model has the beneficial effects that：
When in use, the heat of COU constantly passes to heat-conducting plate and heat radiating fin to water-filled radiator provided by the utility model
Piece, and with the unlatching of computer, cooling water tank is also switched on power supply, starts to cool down for the water in water tank, and the water after cooling down
Enter conduction cooling Guan Zhongyu radiating fins under the action of micro pump and carry out sufficient heat exchange, simultaneously because heat-conducting plate and cooling
Water tank is in contact, and the heat of heat-conducting plate also constantly exchanges heat, two-phase auxiliary so that the heat energy that CPU is distributed with cooling water tank
It is fast and effeciently passed away, promotes the performance of CPU.
Description of the drawings
Fig. 1 is the utility model structure diagram；
In figure label for：1-CPU, 2- heat-conducting plate, the first latch of 201-, the first locking holes of 202-, 203- radiating fins,
3- cooling water tanks, 301- conduction cooling pipes, 302- support ears, 4- support columns, the second latch of 401-, the second locking holes of 402-, 5- dissipate
Hot-air fan.
Specific implementation mode
The utility model is described in further detail with reference to the accompanying drawings and detailed description.The reality of the utility model
The mode of applying includes but not limited to the following example.
Embodiment 1
As shown in Figure 1, a kind of CPU water-filled radiators, for radiating for the CPU1 of computer, the upper surfaces CPU1 are provided with one
The heat-conducting plate 2 contacted with the upper surfaces CPU1,2 four jiaos of heat-conducting plate are provided with the first latch being fixed on heat-conducting plate 2 on mainboard
201, be provided with the first locking hole 202 for screwing in screw heat-conducting plate 2 being fixed on mainboard on the first latch 201,
And 2 both sides of heat-conducting plate are connected with several radiating fins 203,203 side of radiating fin is fixedly connected with heat-conducting plate 2, bottom with
The upper surfaces CPU1 are in contact, and radiating fin 203 preferably transmits the heat of CPU1, be provided on heat-conducting plate 2 bottom with
The cooling water tank 3 that the top of heat-conducting plate 2 is in contact, 3 bottom of cooling water tank are made of the good material of heat-transfer effect, with heat-conducting plate 2
Sufficient heat exchange is carried out, the construction of cooling water tank 3 is identical as the cooling device construction for generally connecing electricity, setting in cooling water tank 3
There is a micro pump, the water outlet of micro pump is connected with conduction cooling pipe 301, and conduction cooling pipe 301 is by good heat dissipation effect and good airproof performance
Material is made, and the water in cooling water tank 3 is pumped into conduction cooling pipe 301 using micro pump, conduction cooling pipe 301 passes through radiating fin
203, sufficient heat exchange is carried out to take away the heat on radiating fin 203 with radiating fin 203 using the cold water in conduction cooling pipe 301
Amount, 2 both sides of heat-conducting plate are provided with support column 4, be fixedly connected with support column 4 with mainboard second are provided on support column 4
Latch 401 is provided on second latch 401 several for screwing in the second of the screw being fixed on support column 4 on mainboard
Locking hole 402,3 both sides of cooling water tank are provided with the support ear 302 being fixed on water tank on support column 4, support ear 302 and cooling
Water tank 3 is fixedly connected, is flexibly connected with support column 4.
Further, conduction cooling pipe 301 takes the shape of the letter U across radiating fin 203；Conduction cooling pipe 301 and radiating fin 203 can be increased
Contact surface so that heat exchange is more abundant, to enable conduction cooling pipe 301 that can utmostly take away the heat of radiating fin 203.
Embodiment 2
CPU water-filled radiators described in the present embodiment are roughly the same with CPU water-filled radiators described in embodiment 1, most
It is big the difference is that, the top of cooling water tank 3 is provided with radiator fan 5, the construction of radiator fan 5 and general computer wind
The construction of fan is identical, and the both sides of radiator fan 5 are flexibly connected with support column 4；Auxiliary heat dissipation is carried out using radiator fan 5, into one
Step reduces CPU1 temperature nearby so that heat dissipation effect is more preferable.
Further, two groups of flabellums are provided in the radiator fan 5；So that the wind-force that radiator fan 5 generates is more strong
Strength, heat dissipation effect are more preferable.
In conclusion water-filled radiator provided by the utility model is when in use, the heat of COU constantly passes to heat-conducting plate
And radiating fin, and with the unlatching of computer, cooling water tank is also switched on power supply, starts to cool down for the water in water tank, and drops
Water after temperature enters conduction cooling Guan Zhongyu radiating fins under the action of micro pump and carries out sufficient heat exchange, simultaneously because heat conduction
Plate is in contact with cooling water tank, and the heat of heat-conducting plate also constantly exchanges heat, two-phase auxiliary so that CPU is distributed with cooling water tank
Heat can fast and effeciently be passed away, promote the performance of CPU.
It is the embodiments of the present invention as described above.The utility model is not limited to the above embodiment, anyone
It should learn the structure change made under the enlightenment of the utility model, it is every that there is same or similar skill with the utility model
Art scheme, each falls within the scope of protection of the utility model.
Claims (4)
1. a kind of CPU water-filled radiators, for radiating for the CPU (1) of computer, which is characterized in that CPU (1) upper surface is set
It is equipped with a heat-conducting plate (2), heat-conducting plate (2) quadrangle is provided with the first locking for being fixed on heat-conducting plate (2) on mainboard
Plate (201) is provided with the first locking hole (202) on first latch (201), and the heat-conducting plate (2) is if both sides are connected with
Dry radiating fin (203)；
A cooling water tank (3) contacted with heat-conducting plate (2) upper surface, the cooling water tank (3) are provided on the heat-conducting plate (2)
It is inside provided with micro pump, the water outlet of the micro pump is connected with conduction cooling pipe (301), and the conduction cooling pipe (301), which passes through, to be dissipated
The water outlet of hot fin (203), conduction cooling pipe (301) is connected with the upper end of cooling water tank (3)；
Heat-conducting plate (2) both sides are provided with support column (4), and support column (4) lower end, which is provided with, is fixed on support column (4)
The second latch (401) on mainboard is provided with several second locking holes (402) on second latch (401), described cold
But water tank (3) both sides are provided with the support ear (302) being flexibly connected with support column (4).
2. a kind of CPU water-filled radiators as described in claim 1, which is characterized in that the conduction cooling pipe (301) take the shape of the letter U across
Radiating fin (203).
3. a kind of CPU water-filled radiators as claimed in claim 1 or 2, which is characterized in that set above the cooling water tank (3)
It is equipped with radiator fan (5), the both sides of the radiator fan (5) are flexibly connected with support column (4).
4. a kind of CPU water-filled radiators as claimed in claim 3, which is characterized in that be provided with two in the radiator fan (5)
Group flabellum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820369109.6U CN208013876U (en) | 2018-03-19 | 2018-03-19 | A kind of CPU water-filled radiators |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820369109.6U CN208013876U (en) | 2018-03-19 | 2018-03-19 | A kind of CPU water-filled radiators |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208013876U true CN208013876U (en) | 2018-10-26 |
Family
ID=63889775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820369109.6U Expired - Fee Related CN208013876U (en) | 2018-03-19 | 2018-03-19 | A kind of CPU water-filled radiators |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208013876U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
| CN109947225A (en) * | 2019-03-30 | 2019-06-28 | 佳木斯大学 | A kind of computer water-cooling system |
| CN110225653A (en) * | 2019-07-15 | 2019-09-10 | 桂林电子科技大学 | A kind of cooling mechanism of component heat transfer system |
-
2018
- 2018-03-19 CN CN201820369109.6U patent/CN208013876U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
| CN109947225A (en) * | 2019-03-30 | 2019-06-28 | 佳木斯大学 | A kind of computer water-cooling system |
| CN109947225B (en) * | 2019-03-30 | 2020-07-28 | 佳木斯大学 | Computer water cooling system |
| CN110225653A (en) * | 2019-07-15 | 2019-09-10 | 桂林电子科技大学 | A kind of cooling mechanism of component heat transfer system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 Termination date: 20200319 |