CN106163242A - A kind of rack heat-exchange system and server - Google Patents
A kind of rack heat-exchange system and server Download PDFInfo
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- CN106163242A CN106163242A CN201610797184.8A CN201610797184A CN106163242A CN 106163242 A CN106163242 A CN 106163242A CN 201610797184 A CN201610797184 A CN 201610797184A CN 106163242 A CN106163242 A CN 106163242A
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- 239000007788 liquid Substances 0.000 claims description 69
- 238000001816 cooling Methods 0.000 claims description 48
- 239000002826 coolant Substances 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 17
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000004134 energy conservation Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
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- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of rack heat-exchange system and server, relates to server technology field, it is possible on the premise of the requirement of the device heat radiation in meeting information technoloy equipment, makes heat exchanger be not take up the space outerpace of rack and it need not be separately provided fan.This rack heat-exchange system includes: rack, it is provided with interpolation frame in described rack, information technoloy equipment and fan it is provided with in described interpolation frame, it is provided with heat exchanger between inwall and the described interpolation frame of described rack, the air-flow that described fan produces forms wind closed circuit at described interior of equipment cabinet, and described information technoloy equipment and described heat exchanger are in described wind closed circuit.The present invention can be used for the heat radiation of information technoloy equipment rack in server product.
Description
Technical field
The present invention relates to server technology field, particularly relate to a kind of rack heat-exchange system and server.
Background technology
In the server product (such as E9000 server) of information technoloy equipment veneer layout, generally comprise CPU (central
Processing unit central processing unit), internal memory, hard disk, RAID card (Redundant Array of Independent
Disks RAID) etc. device, CPU and internal memory are typically carried out the cold design of liquid by current information technoloy equipment heat sink conception,
Both are taken away by liquid cold plate by heat, and take to outside machine room by pipeline by heat, other device such as hard disk and RAID card
Deng the wind heat radiation of the fan blowout using information technoloy equipment to carry, the heat that wind is taken away then is freezed by air conditioner in machine room.Owing to using sky
Adjusting the lifting that the air-cooled heat taken away refrigeration is unfavorable for efficiency, therefore, industry occurs in that some full liquid cooling schemes (100%),
I.e. on veneer, the heat of all devices is all walked by liquid cold belt.
The rack heat-exchange system of existing a kind of server product, as it is shown in figure 1, arrange one between two IT racks 01
Individual heat exchange rack 03, has heat exchanger 04 and fan 05, heat exchanger 04 generally fin-tube type structure, information technoloy equipment 02 in heat exchange rack 03
In the wind heat radiation that blown out by fan 05 of the device heat directly taken away not over liquid cold plate, the heat that wind is taken away is then by changing
Liquid in the pipeline of hot device 04 is taken away, and thus achieves full liquid cooling.
But, in actual application, inventor finds following problem: owing to arranging one in the middle of two IT racks 01
Heat exchanger 04, takies the most very much machine room space.It addition, heat exchanger 04 self band fan 05, it is unfavorable for the energy-conservation of rack.
Summary of the invention
The present invention implements to provide a kind of rack heat-exchange system, it is possible to before the requirement of the device heat radiation in meeting information technoloy equipment
Put, make heat exchanger be not take up the space outerpace of rack and it need not be separately provided fan.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
First aspect, discloses a kind of rack heat-exchange system, including: rack, it is provided with interpolation frame in rack, in interpolation frame, is provided with IT
Equipment and fan, be provided with heat exchanger between inwall and the interpolation frame of rack, the air-flow that fan produces forms wind circulation at interior of equipment cabinet
Loop, information technoloy equipment and heat exchanger are in wind closed circuit.
Owing to heat exchanger is provided between the inwall of rack and interpolation frame, thus without being separately provided a heat exchange cabinet use
Placing heat exchanger, heat exchanger avoids the need for taking the space outerpace of rack.Owing to the air-flow of the fan generation in interpolation frame is at machine
Cabinet is internally formed wind closed circuit, information technoloy equipment and heat exchanger and is in wind closed circuit, and the air-flow that such fan produces can
The heat that information technoloy equipment produces is taken away, and carries out delivering to information technoloy equipment again after heat exchange generates the air-flow that temperature is relatively low at heat exchanger
Device in information technoloy equipment is lowered the temperature by place, and the fan in interpolation frame just disclosure satisfy that the requirement of the device heat radiation in information technoloy equipment, by
Fan in interpolation frame is the fan that information technoloy equipment carries, and such heat exchanger is no need for individually arranging fan again.
In conjunction with first aspect, in the first possible implementation of first aspect,
Heat exchanger is heat exchange of heat pipe, is provided with and the liquid cooling apparatus of information technoloy equipment contact heat-exchanging in interpolation frame, and liquid cooling apparatus connects
There are rack feed tube and rack drain pipe, heat exchange of heat pipe and rack feed tube contact heat-exchanging.
Owing to being provided with in interpolation frame and the liquid cooling apparatus of information technoloy equipment contact heat-exchanging, liquid cooling apparatus connects rack feed tube and machine
Cabinet drain pipe, the liquid in such rack feed tube, will enter into in the liquid cooling apparatus of information technoloy equipment contact heat-exchanging, information technoloy equipment
In components and parts produce heat will be absorbed by the liquid in liquid cooling apparatus, and by rack drain pipe discharge rack.With
Time, the heat being not suitable in information technoloy equipment with liquid-cooling heat radiation element produces taken away by air-flow produced by fan, and this air-flow is at heat pipe
Heat exchange occurs at heat exchanger, and its heat is absorbed by heat exchange of heat pipe.Owing to heat exchange of heat pipe contacts with rack feed tube, heat pipe
The heat that heat exchanger absorbs is absorbed by the liquid in rack feed tube again, and discharges rack by rack drain pipe.Pass through
Liquid cooling apparatus coordinates with heat exchange of heat pipe, it is possible to taken away by the heat that the components and parts in information technoloy equipment produce, and reaches full liquid cooling and dissipates
The purpose of heat.
In conjunction with the first possible implementation of first aspect, the implementation that the second in first aspect is possible
In,
Heat exchange of heat pipe includes heat pipe, is connected with cooling medium in heat pipe, the outer surface of heat pipe and the appearance of rack feed tube
Face contact heat-exchanging.
Owing to the outer surface of heat pipe can contact with the outer surface of rack feed tube, such heat exchange of heat pipe blows with fan
Air heat exchange and the heat that absorbed by cooling medium then absorbed by the liquid in rack feed tube, liquid is by rack drain pipe
Take heat out of rack.
In conjunction with the implementation that the second of first aspect is possible, in the third possible implementation of first aspect
In,
Connection on heat pipe has fin.Fin can increase the heat exchange area of heat pipe and air-flow.
In conjunction with the first possible implementation of first aspect, in the 4th kind of possible implementation of first aspect
In,
Heat exchange of heat pipe can be directly anchored on rack feed tube, such as welds, alternatively, it is also possible to connected by heat conduction
Plate is fixed on rack feed tube, contacts for face between heat conduction connecting plate with rack feed tube.Compare and be directly anchored to rack and enter
On liquid pipe, heat exchange of heat pipe is fixed on rack feed tube by heat conduction connecting plate, can increase and heat pipe and rack feed tube
Contact area, the heat in heat pipe fully can pass to the liquid in rack feed tube by heat-conducting plate, thus improve
Heat exchange efficiency.
In conjunction with the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation of first aspect
In,
Heat conduction connecting plate can weld with rack feed tube, it is also possible to is connected by screw.
In conjunction with the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation of first aspect
In,
When heat conduction connecting plate is connected by screw with rack feed tube, it is provided with between heat conduction connecting plate and rack feed tube
Heat-conducting layer.
During owing to connecting with screw, easily produce gap between heat conduction connecting plate and rack feed tube, so can affect heat
Transfer efficiency, therefore, is provided with heat-conducting layer between heat conduction connecting plate and rack feed tube and can fill up the gap between them, thus
Improve hot transfer efficiency.
In conjunction with first aspect, in the 7th kind of possible implementation of first aspect,
Heat exchanger is fin-tube type heat exchanger, and fin-tube type heat exchanger includes heat exchanger tube and the fin being fixed on heat exchanger tube, changes
Heat pipe concatenation is in the coolant circuit being connected with cooling medium.
When thermal current passes through the gap of fin on heat exchanger tube, heat can be passed to heat exchanger tube by fin by air-flow, this
Time in heat exchanger tube the cooling medium of flowing can transfer to other places by heat absorption and by coolant circuit.
In conjunction with the 7th kind of possible implementation of first aspect, in the 8th kind of possible implementation of first aspect
In,
Heat exchanger tube can concatenate in the coolant circuit different from two respectively with liquid cooling apparatus, it addition, heat exchanger tube and liquid
Device for cooling can also be serially connected with in same coolant circuit in parallel connection, specifically, is provided with and information technoloy equipment contact heat-exchanging in interpolation frame
Liquid cooling apparatus, liquid cooling apparatus connects rack feed tube and rack drain pipe, rack feed tube, liquid cooling apparatus and rack drain pipe
It is interior and in parallel with heat exchanger tube that the stream formed is serially connected with coolant circuit.Compare heat exchanger tube be serially connected with liquid cooling apparatus two different
Coolant circuit, coolant circuit so can be made simpler, the most energy-conservation, rack also need not arrange two feed tubes
And drain pipe, meanwhile, the cold liquid of liquid in the cooling medium in heat exchanger tube and liquid cooling apparatus is all a kind of liquid, be more beneficial for its
Heat exchanger tube and liquid cooling apparatus circulate.
In conjunction with the 7th kind of possible implementation of first aspect, in the 9th kind of possible implementation of first aspect
In,
Fin-tube type heat exchanger can be arranged in parallel relative to the inwall set-up mode of rack, alternatively, it is also possible to be obliquely installed,
The air channel i.e. causing air flow through fin-tube type heat exchanger is zigzag, compares and be arranged in parallel, and fin-tube type heat exchanger is relative in rack
Wall is obliquely installed, and air-flow can significantly improve heat exchange efficiency along zigzag air channel by fin-tube type heat exchanger.This is due to fin-tube type
Heat exchanger left and right side is more than upper and lower side, is obliquely installed and a part of air-flow can be made logical from side around along zigzag air channel
Cross, increase the contact area of air-flow and fin-tube type heat exchanger, make air-flow and fin-tube type heat exchanger be fully contacted and heat exchange, thus
Improve heat exchange efficiency.
In conjunction with the 9th kind of possible implementation of first aspect, in the tenth kind of possible implementation of first aspect
In,
Fin-tube type heat exchanger is 10 degree～30 degree relative to the angle of inclination of the inwall of rack.So can not increase machine
On the premise of cabinet is long-pending, increase the contact area of air-flow and fin-tube type heat exchanger.
In conjunction with any one in first to the tenth kind of possible implementation of first aspect or first aspect, in first party
In the 11st kind of possible implementation in face,
Heat exchanger is two, and two heat exchangers are symmetricly set at two opposed inner walls of rack, are provided with two wind in interpolation frame
Fan, two fans are arranged respectively close to two heat exchangers.
Owing to two heat exchangers are symmetricly set at two opposed inner walls of rack, information technoloy equipment in rack not only can be increased
Radiating effect but also the balance of beneficially rack.It addition, two fans are arranged respectively close to two heat exchangers, so can carry
The heat exchange efficiency of high gas and heat exchanger, it is to avoid it is very few that two fans cause the air-flow to arrive during heat exchanger too far from heat exchanger.
In conjunction with any one in first to the tenth kind of possible implementation of first aspect or first aspect, in first party
In the 12nd kind of possible implementation in face,
Cooling medium in heat exchanger is hot water, and the temperature of hot water is 40 DEG C～50 DEG C.So can make rack heat exchange system
Unite more energy-conservation.
Second aspect, discloses a kind of server, including above-mentioned first aspect and any one may be in implementation
Rack heat-exchange system.
Due to the rack heat-exchange system and the above-mentioned first aspect that use in server disclosed in second aspect and various
Disclosed in possible implementation, rack heat-exchange system is identical, and therefore the two can solve the problem that identical technical problem, and reaches phase
Same Expected Results.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is existing rack heat-exchange system schematic diagram；
The rack heat-exchange system schematic diagram that Fig. 2 provides for the embodiment of the present invention；
Fig. 3 is the rack heat-exchange system schematic diagram provided in the embodiment of the present invention one；
Fig. 4 is connected with rack water inlet pipe for heat exchange of heat pipe in the rack heat-exchange system that provides in the embodiment of the present invention one and shows
It is intended to (B is the direction of air-flow)；
Fig. 5 is connected A for heat exchange of heat pipe in the rack heat-exchange system of offer in the embodiment of the present invention one with rack water inlet pipe
Direction view；
Fig. 6 is rack heat-exchange system schematic diagram (fin-tube type heat exchanger be arranged in parallel) provided in the embodiment of the present invention two；
Fig. 7 is fin-tube type heat exchanger pipeline Inlet and outlet water schematic diagram in the rack heat-exchange system of offer in the embodiment of the present invention two
(B is the direction of air-flow)；
Fig. 8 is obliquely installed schematic diagram for fin-tube type heat exchanger in the rack heat-exchange system of offer in the embodiment of the present invention two；
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
In describing the invention, it is to be understood that term " " center ", " on ", D score, "front", "rear", " left ",
Orientation or the position relationship of the instruction such as " right ", " vertically ", " level ", " top ", " end ", " interior ", " outward " are based on shown in the drawings
Orientation or position relationship, be for only for ease of describe the present invention and simplify describe rather than instruction or hint indication device or
Element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected；Right
For those of ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood with concrete condition.
Be presented herein below in the embodiment of the present invention occur explanation of nouns:
PUE:(Power Usage Effectiveness power supply service efficiency) PUE value has become as relatively more logical in the world
The measurement index of data center's electricity usage efficiency of row.PUE value refers to that all energy that data center consumes disappear with IT load
The ratio of the energy of consumption.PUE value is closer to 1, represents that the green degree of a data center is the highest, and efficiency level is the best.
RAID:(Redundant Array of Independent Disks RAID) a kind of polylith
Independent hard disk (physical hard disk) combines to form a hard disk groups (logic hard disk) differently, thus provides ratio single
The higher storage performance of hard disk and the technology of offer data redundancy.
RAID card: be just used to realize the board of RAID function, it is common that by I/O processor, hard disk controller, hard disk even
Connect what a series of spare part such as device and caching was constituted.
The embodiment of the present invention provides a kind of rack 1 cooling system, as in figure 2 it is shown, include rack 1, is provided with slotting in rack 1
Frame, is provided with information technoloy equipment 2 and fan 4 in interpolation frame, be provided with heat exchanger 3 between inwall and the interpolation frame of rack 1, the air-flow that fan 4 produces
It is internally formed wind closed circuit, information technoloy equipment 2 and heat exchanger 3 at rack 1 to be in wind closed circuit.
Owing to heat exchanger 3 is provided between inwall and the interpolation frame of rack 1, rack so can be maximally utilised
The inner space of 1, makes rack 1 internal unit arrange compacter, is no need for being separately provided a heat exchange cabinet for placing heat exchange
Device 3, heat exchanger 3 avoids the need for taking the space outerpace of rack 1.Owing to the air-flow of fan 4 generation in interpolation frame is inside rack 1
Forming wind closed circuit, information technoloy equipment 2 and heat exchanger 3 are in wind closed circuit, and the air-flow that such fan 4 produces can be by IT
The heat that equipment 2 produces is taken away, and carries out delivering to information technoloy equipment 2 again after heat exchange generates the air-flow that temperature is relatively low at heat exchanger 3
Device in information technoloy equipment 2 is lowered the temperature by place, and the fan 4 in interpolation frame just disclosure satisfy that the requirement of the device heat radiation in information technoloy equipment 2.
Owing to the fan 4 in interpolation frame is the fan that system carries, such heat exchanger 3 is no need for individually arranging fan again, makes this heat exchange system
Unite more energy efficient.Therefore, on the premise of the program disclosure satisfy that the requirement of the device heat radiation in information technoloy equipment 2, heat exchanger 3 is made to be not take up
The space outerpace of rack 1 and its need not be separately provided fan.
Embodiment one
The kind of heat exchanger 3 is not unique, and such as heat exchanger 3 can be heat exchange of heat pipe 31, it is also possible to be that fin-tube type changes
Hot device 32 etc..In the present embodiment, heat exchanger 3 is heat exchange of heat pipe 31, specifically, as it is shown on figure 3, heat exchanger 3 is heat exchange of heat pipe
31, it is provided with in interpolation frame and the liquid cooling apparatus of information technoloy equipment 2 contact heat-exchanging, liquid cooling apparatus connects has rack feed tube 5 and rack to go out liquid
Pipe 6, heat exchange of heat pipe 31 and rack feed tube 5 contact heat-exchanging.Owing to being provided with in interpolation frame and the liquid cold charge of information technoloy equipment 2 contact heat-exchanging
Putting, liquid cooling apparatus connects rack feed tube 5 and rack drain pipe 6, the liquid in such rack feed tube 5, such as water etc., just
Can enter into the liquid cooling apparatus of information technoloy equipment 2 contact heat-exchanging, the heat that the element in information technoloy equipment 2 produces will be by liquid cooling apparatus
In liquid absorbed, and discharge rack 1 by rack drain pipe 6.Meanwhile, heat exchange of heat pipe 31 contacts with rack feed tube 5
Heat exchange, detailed process is: the heat being not suitable for the generation of liquid-cooling heat radiation element in information technoloy equipment 2 is taken away by air-flow produced by fan 4,
There is heat exchange in this air-flow at heat exchange of heat pipe 31, its heat is absorbed by heat exchange of heat pipe 31.Due to heat exchange of heat pipe 31 with
Rack feed tube 5 contacts, and the heat that heat exchange of heat pipe 31 absorbs is absorbed by the liquid in rack feed tube 5 again, and passes through
Rack drain pipe 6 discharges rack 1.By coordinating of liquid cooling apparatus and heat exchange of heat pipe 31, it is possible to by the components and parts in information technoloy equipment 2
The heat produced is taken away, and reaches the purpose of full liquid cooling heat radiation.
It should be understood that some element is suitable for liquid-cooling heat radiation in information technoloy equipment 2 veneer, such as CPU, internal memory etc., additionally also
Having some to be not suitable for liquid-cooling heat radiation, such as hard disk, RAID card etc., this is due to hard disk and RAID card maintenance to be plugged, particularly
Hard disk individually to plug, not power-off service, it has not been convenient to liquid-cooling heat radiation, if hard disk and RAID card are also with liquid-cooling heat radiation, then liquid
Cold plate structure is extremely complex, and heat radiation cost is the highest.In information technoloy equipment 2, this part is not suitable for the heat that the element of liquid-cooling heat radiation produces
The air-flow that amount is then blown out by fan 4 is taken away and in heat exchanger 3 heat exchange, is finally taken away by the liquid in heat exchanger 3.
Seeing Fig. 4 and Fig. 5, heat exchange of heat pipe 31 includes heat pipe 311, is connected with cooling medium in heat pipe 311, heat pipe 311
Outer surface and the outer surface contact heat-exchanging of rack feed tube 5.When thermal current by heat exchange of heat pipe 31 time, air-flow with and its connect
There is heat exchange in this part heat pipe 311 touched, the cooling medium generation state in heat pipe 311 changes (such as evaporation) and absorbs
The heat of gas, now this part heat pipe 311 pressure raises, and makes cooling medium to another part of heat pipe 311 (not with air-flow phase
The part of contact, the part that i.e. outer surface with rack feed tube 5 contacts) motion, and heat is taken to this portion of heat pipe 311
Point, and with the outer surface contact heat-exchanging of rack feed tube 5, the liquid in rack feed tube 5 absorbs this partial heat, and heat pipe
Cooling medium in 311 then returns to original state, and has returned to the part that heat pipe 311 contacts with air-flow, follows with this
Ring, to complete the heat of air-flow higher for temperature is passed to liquid in rack feed tube 5.
See Fig. 4 and Fig. 5, in order to increase the heat exchange area of heat pipe 311 and air-flow, preferably connect on heat pipe 311 and have wing
Sheet 312.The thin slice being made up of the material that heat conductivity is the strongest due to fin 312, when thermal current is by fin 312 on heat pipe 311
Gap time, fin 312 and air-flow have the biggest contact area, and the heat of air-flow is just easy to pass to heat by fin 312
Pipe 311, which increases the heat exchange area of air-flow and heat pipe 311, improves heat exchange efficiency.
Wherein, heat pipe 311 can be directly connected to rack feed tube 5, such as welds, it addition, as shown in Figure 4 and Figure 5, and heat
Heat exchange of heat pipe 31 can also be fixed on rack feed tube 5 by heat conduction connecting plate 313, heat conduction connecting plate 313 and rack feed liquor
Contact for face between pipe 5.Comparing heat pipe 311 to be directly connected to rack feed tube 5, heat conduction connecting plate 313 can increase and heat pipe
311 and the contact area of rack feed tube 5, the heat in heat pipe 311 fully can pass to rack feed tube 5 by heat-conducting plate
In liquid, thus improve heat exchange efficiency.
Heat conduction connecting plate 313 can be to weld with the connected mode of rack feed tube 5, it is also possible to is connected by screw, this
In do not limit.When heat conduction connecting plate 313 is connected by screw with rack feed tube 5, enter with rack to improve heat-conducting plate
Hot transfer efficiency between liquid pipe 5, is preferably provided with heat-conducting layer between heat conduction connecting plate 313 and rack feed tube 5.Due to screw
During connection, between heat conduction connecting plate 313 and rack feed tube 5, easily produce gap, so can affect hot transfer efficiency, therefore,
It is provided with heat-conducting layer between heat conduction connecting plate 313 and rack feed tube 5 and can fill up the gap between them, thus improve heat biography
Efficiency.Wherein, heat-conducting layer can be heat conductive pad, it is also possible to be silicone oil etc., in this no limit.
Embodiment two
Heat exchanger 3 in the present embodiment is fin-tube type heat exchanger 32.Specifically, as shown in Figure 6, heat exchanger 3 is fin-tube type
Heat exchanger 32, fin-tube type heat exchanger 32 includes heat exchanger tube 321 and the fin 322 being fixed on heat exchanger tube 321, and heat exchanger tube 321 is gone here and there
It is connected to be connected with in the coolant circuit of cooling medium.When thermal current passes through the gap of fin 322 on heat exchanger tube 321, air-flow meeting
By fin 322, heat is passed to heat exchanger tube 321, and at this moment in heat exchanger tube 321, the cooling medium of flowing can be by heat absorption
And transfer to other places by coolant circuit.In order to improve fin-tube type heat exchanger 32 heat exchange efficiency, heat exchanger tube 321 can preferably set
Count serpentine-like, so can increase the contact area of fin 322 and heat exchanger tube 321, thus improve heat exchange efficiency.
Wherein, heat exchanger tube 321 can concatenate in the coolant circuit different from two respectively with liquid cooling apparatus, it addition, change
Heat pipe 321 and liquid cooling apparatus can also be serially connected with in same coolant circuit, specifically, as it is shown in fig. 7, set in interpolation frame in parallel connection
Having and the liquid cooling apparatus of information technoloy equipment 2 contact heat-exchanging, liquid cooling apparatus connects rack feed tube 5 and rack drain pipe 6, rack feed liquor
It is interior and in parallel with heat exchanger tube 321 that the stream that pipe 5, liquid cooling apparatus and rack drain pipe 6 are formed is serially connected with coolant circuit.Compare and change
Heat pipe 321 is serially connected with two different coolant circuits with liquid cooling apparatus, and scheme shown in Fig. 7 can make coolant circuit simpler
Single, the most energy-conservation, rack 1 also need not arrange two feed tubes and drain pipe, meanwhile, the cooling medium in heat exchanger tube 321
Liquid cold with the liquid in liquid cooling apparatus is all a kind of liquid, is more beneficial for it and circulates in heat exchanger tube 321 and liquid cooling apparatus.
Further, fin-tube type heat exchanger 32 can be arranged in parallel (such as Fig. 6 institute relative to the inwall set-up mode of rack 1
Show), it addition, as shown in Figure 8, it is also possible to being obliquely installed, the air channel i.e. causing air flow through fin-tube type heat exchanger 32 is zigzag, phase
Ratio be arranged in parallel, and fin-tube type heat exchanger 32 is obliquely installed relative to the inwall of rack 1, and air-flow passes through fin-tube type along zigzag air channel
Heat exchanger 32 can significantly improve heat exchange efficiency.This is owing to fin-tube type heat exchanger 32 left and right side is more than upper and lower side, tilts
Arrange and a part of air-flow can be made to pass through from side around along zigzag air channel, increase air-flow and fin-tube type heat exchanger 32
Contact area, makes air-flow and fin-tube type heat exchanger 32 be fully contacted and heat exchange, thus improves heat exchange efficiency.
In order to, on the premise of not increasing rack 1 volume, increase the contact area of air-flow and fin-tube type heat exchanger 32, pipe wing
Formula heat exchanger 32 is preferably 10 degree～30 degree relative to the angle of inclination of the inwall of rack 1.If angle of inclination is too small, major part
Air-flow from the lower side of fin-tube type heat exchanger 32 upwardly through, only one partial gas is the left side from fin-tube type heat exchanger 32
Right flank passes through, and such air-flow is inconspicuous with what the contact area of fin-tube type heat exchanger 32 increased；If angle of inclination is excessive, though
So increase considerably the contact area of air-flow and fin-tube type heat exchanger 32, but so made the left and right width of rack 1 increase, thus
The volume making rack 1 is consequently increased, and increases the space taking machine room.
In order to maximally utilise rack 1 limited space, information technoloy equipment 2 in rack 1 is dispelled the heat, such as Fig. 3, Fig. 6 and
Shown in Fig. 8, it is preferable that heat exchanger 3 is two, two heat exchangers 3 are symmetricly set at two opposed inner walls of rack 1, in interpolation frame
Being provided with two fans 4, two fans 4 are arranged respectively close to two heat exchangers 3.Owing to two heat exchangers 3 are symmetricly set in rack 1
Two opposed inner walls at, not only can increase the radiating effect of information technoloy equipment 2 in rack 1 but also the balance of beneficially rack 1.Separately
Outward, two fans 4 are arranged respectively close to two heat exchangers 3, so can improve the heat exchange efficiency of gas and heat exchanger 3, it is to avoid
Two fans 4 are very few when heat exchanger 3 causes air-flow to arrive heat exchanger 3 too far.
In order to make rack 1 heat-exchange system more energy-conservation, it is preferable that the cooling medium in heat exchanger 3 is hot water, the temperature of hot water
Degree is 40 DEG C～50 DEG C.If the temperature of water is too low, such as by frost water cooling, then need water temperature to be reduced with refrigeration plant,
This process needs to consume a large amount of electric energy；If the temperature of water is too high, making water-cooling decreased effectiveness, therefore, the temperature of water is excellent
Elect 40 DEG C～50 DEG C as, so can reduce energy consumption, make the PUE value of this system less than 1.1.
The embodiment of the present invention additionally provides a kind of server, including the rack heat-exchange system described in any of the above-described embodiment.
Due to the rack heat-exchange system used in the server of the present embodiment and the rack of offer in the various embodiments described above
Heat-exchange system is identical, and therefore the two can solve the problem that identical technical problem, and reaches identical Expected Results.Real about the present invention
Other composition of the server executing example waits and has been well known to those skilled in the art, and no longer describes in detail at this.Above-mentioned service
Device can be E9000 server etc., does not limits at this.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art, in the technical scope that the invention discloses, can readily occur in change or replace, should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should described be as the criterion with scope of the claims.
Claims (14)
1. a rack heat-exchange system, including rack, is provided with interpolation frame, is provided with information technoloy equipment and wind in described interpolation frame in described rack
Fan, it is characterised in that be provided with heat exchanger between inwall and the described interpolation frame of described rack, the air-flow that described fan produces is described
Interior of equipment cabinet forms wind closed circuit, and described information technoloy equipment and described heat exchanger are in described wind closed circuit.
Rack heat-exchange system the most according to claim 1, it is characterised in that described heat exchanger is heat exchange of heat pipe, described
Being provided with in interpolation frame and the liquid cooling apparatus of described information technoloy equipment contact heat-exchanging, described liquid cooling apparatus connects has rack feed tube and rack to go out
Liquid pipe, described heat exchange of heat pipe and described rack feed tube contact heat-exchanging.
Rack heat-exchange system the most according to claim 2, it is characterised in that described heat exchange of heat pipe includes heat pipe, described
The outer surface contact heat-exchanging of cooling medium, the outer surface of described heat pipe and described rack feed tube it is connected with in heat pipe.
Rack heat-exchange system the most according to claim 3, it is characterised in that the connection on described heat pipe has fin.
Rack heat-exchange system the most according to claim 2, it is characterised in that described heat exchange of heat pipe passes through heat conduction connecting plate
It is fixed on described rack feed tube, contacts for face between described heat conduction connecting plate with described rack feed tube.
Rack heat-exchange system the most according to claim 5, it is characterised in that described heat conduction connecting plate and described rack feed liquor
Sealing of tube or be connected by screw.
Rack heat-exchange system the most according to claim 6, it is characterised in that when described heat conduction connecting plate enters with described rack
When liquid pipe is connected by screw, between described heat conduction connecting plate and described rack feed tube, it is provided with heat-conducting layer.
Rack heat-exchange system the most according to claim 1, it is characterised in that described heat exchanger is fin-tube type heat exchanger, institute
Stating fin-tube type heat exchanger and include heat exchanger tube and the fin being fixed on described heat exchanger tube, described heat exchanger tube is serially connected with and is connected with cooling Jie
In the coolant circuit of matter.
Rack heat-exchange system the most according to claim 8, it is characterised in that be provided with in described interpolation frame and connect with described information technoloy equipment
Touching the liquid cooling apparatus of heat exchange, described liquid cooling apparatus connects rack feed tube and rack drain pipe, and described rack feed tube, liquid are cold
It is interior and in parallel with described heat exchanger tube that the stream that device and rack drain pipe are formed is serially connected with described coolant circuit.
Rack heat-exchange system the most according to claim 8, it is characterised in that described fin-tube type heat exchanger is relative to described
The inwall of rack is obliquely installed.
11. rack heat-exchange systems according to claim 10, it is characterised in that described fin-tube type heat exchanger is relative to described
The angle of inclination of the inwall of rack is 10 degree～30 degree.
12. according to the rack heat-exchange system according to any one of claim 1～11, it is characterised in that described heat exchanger is two
Individual, two described heat exchangers are symmetricly set at two opposed inner walls of rack, are provided with two fans, described in two in described interpolation frame
Fan is arranged respectively close to two described heat exchangers.
13. according to the rack heat-exchange system according to any one of claim 1～11, it is characterised in that in described heat exchanger
Cooling medium is hot water, and the temperature of described hot water is 40 DEG C～50 DEG C.
14. 1 kinds of servers, it is characterised in that include the rack heat-exchange system according to any one of claim 1～13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610797184.8A CN106163242B (en) | 2016-08-31 | 2016-08-31 | A kind of cabinet heat-exchange system and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610797184.8A CN106163242B (en) | 2016-08-31 | 2016-08-31 | A kind of cabinet heat-exchange system and server |
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| CN106163242A true CN106163242A (en) | 2016-11-23 |
| CN106163242B CN106163242B (en) | 2019-05-28 |
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| CN201610797184.8A Active CN106163242B (en) | 2016-08-31 | 2016-08-31 | A kind of cabinet heat-exchange system and server |
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| CN106912186A (en) * | 2017-04-24 | 2017-06-30 | 深圳绿色云图科技有限公司 | Rack and miniature data center |
| CN107087381A (en) * | 2017-06-16 | 2017-08-22 | 吉林省通程科技有限公司 | A kind of energy conserving system |
| CN112616297A (en) * | 2020-12-18 | 2021-04-06 | 苏州浪潮智能科技有限公司 | Heat dissipation device, control method and server equipment |
| CN113365477A (en) * | 2021-06-22 | 2021-09-07 | 北京百度网讯科技有限公司 | Cooling device, cabinet and data processing equipment |
| WO2022205917A1 (en) * | 2021-04-02 | 2022-10-06 | 西安易朴通讯技术有限公司 | Liquid-cooling heat dissipation device, cabinet, and system |
| WO2023169286A1 (en) * | 2022-03-11 | 2023-09-14 | 北京有竹居网络技术有限公司 | Server cabinet and data center |
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