WO2018196339A1

WO2018196339A1 - Cabinet and micro data center

Info

Publication number: WO2018196339A1
Application number: PCT/CN2017/110957
Authority: WO
Inventors: 李棒; 林�智
Original assignee: 深圳绿色云图科技有限公司
Priority date: 2017-04-24
Filing date: 2017-11-14
Publication date: 2018-11-01
Also published as: CN106912186A

Abstract

The present invention provides a cabinet, which is used for a data center. The data center comprises an electronic device and a heat dissipation device. The cabinet comprises: an outer wall, the outer wall being located at the outer side of the heat dissipation device, the outer wall comprising a main body, and the main body having a receiving cavity having an open top; an inner wall, the inner wall being mounted inside the receiving cavity, the inner wall having a mounting cavity having an open top, the mounting cavity being used for mounting the electronic device, and the mounting cavity being further used for containing a cooling liquid that allows the electronic device to be immersed for heat dissipation; and a cooling assembly, the cooling assembly being mounted on the inner wall and being connected to the heat dissipation device to perform heat dissipation on the cooling liquid. The present invention also provides a data center.

Description

Cabinet and micro data center

Technical field

The present invention relates to the field of computer technologies, and in particular, to a cabinet and a micro data center.

Background technique

With the rapid development of the Internet economy, enterprises are increasingly demanding data analysis and processing capabilities, and their emphasis on their own data information is constantly increasing. More and more enterprises are starting to build their own data centers to meet the growing demand for data analysis and processing capabilities and to protect the security of their data. But for some companies, especially small and medium-sized enterprises, the data centers they need are small, but the supporting facilities needed in the data are not too small. However, traditional data center construction methods are costly and long-term, and cannot meet the needs of such customers. Therefore, more small and medium-sized enterprises are looking for new micro data center solutions.

IT equipment emits a lot of heat when it is running, and traditional data centers use air-cooled methods to cool IT equipment. Since the air heat conduction efficiency is low and the specific volume heat capacity is small, this requires a relatively large air volume for cooling the IT equipment, but the high speed operation of the fan not only consumes a large amount of energy but also generates a large noise. In addition, air-cooled cooling also has certain requirements on air quality. The moisture, dust, nitrogen oxides, sulfur oxides, etc. contained in the air will increase the failure rate of IT equipment and shorten the service life.

Summary of the invention

In view of the above, it is necessary to provide a cabinet with good heat dissipation performance and a micro data center.

A cabinet for a micro data center, the micro data center comprising an IT device and a heat sink, the cabinet comprising: an outer wall, the outer wall being located outside the heat sink, the outer wall comprising a body, the body having a top open receiving cavity; an inner wall, the inner wall being mounted in the receiving cavity, the inner wall having a top open mounting cavity, the mounting cavity for mounting the IT device, the mounting cavity also being used for housing The IT device is immersed in a cooling liquid for dissipating heat; a cooling assembly is mounted to the inner wall and connected to the heat dissipating device to dissipate heat from the cooling liquid.

Further, the cooling assembly includes a cooling coil between the inner wall and the outer wall, the cooling coil abutting the inner wall, and the cooling tube is for connecting to the heat sink The coolant is dissipated.

Further, the cooling coil has a plurality of groups, and the plurality of sets of the cooling coils uniformly surround the inner wall.

Further, the cooling assembly further includes a plurality of first circulation pumps installed in the installation cavity, and the first circulation pump is configured to drive the coolant.

Further, the plurality of sets of cooling coils included in the cooling assembly may be replaced by a cooling coil module installed in the mounting cavity, and the second circulating pump may replace the first circulating pump Used to drive the coolant.

Further, the insulation layer is disposed between the outer wall and the inner wall to insulate the cooling coil or the cooling coil module.

Further, an inner side of the inner wall is provided with an inner frame, and the inner frame includes a first tube and a second tube, and the first tube and the second tube are used to support the IT device.

Further, the inner side of the inner wall is provided with a plurality of ribs, and a flow channel is provided between each two adjacent ribs, the flow channel is used for the cooling liquid to flow, and the flow channel is also used for receiving The network cable and power cable of the IT device.

Further, the data center further includes a power distribution module for connecting to a power line of the IT device, a first side of the outer wall being higher than a first side of the inner wall, and a first side of the outer wall Installing the power distribution module above the inner wall.

Further, the outer wall is provided with a network cable interface for connecting to the network cable of the IT device and a power cable interface for connecting to the power distribution module on a side adjacent to the first side thereof.

Further, the outer wall further includes a cover plate for covering the receiving cavity, and the cover plate is pivotally connected to the first side of the outer wall.

A miniature data center that includes the cabinets described above.

Compared with the prior art, in the above cabinet and the micro data center, the heat dissipating device dissipates heat from the electronic device through the cooling component and the cooling liquid, and can quickly reduce the temperature of the electronic device, and the heat dissipation performance is good.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following description will be made on the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in the drawings The drawings obtain other figures.

1 is an assembled, isometric view of a cabinet provided by an embodiment of the first aspect of the present invention.

2 is a cross-sectional view of the cabinet of FIG. 1.

3 is a schematic view of a portion of the components and heat sink of the cabinet of FIG. 1.

4 is a cross-sectional view of a cabinet provided by an embodiment of the second aspect of the present invention.

detailed description

The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Referring to Figures 1 and 3, an embodiment of the first aspect of the present invention provides a cabinet 100 for a micro data center, the micro data center including an IT device 107 and a heat sink. The IT device 107 includes a server and a network switch. Further, the micro data center further includes a power distribution module 110 for connecting to a power line of the IT device 107. Further, the heat sink includes an expansion valve 115, a refrigerant pipe 304, and a refrigerating outdoor unit 301. The refrigerating outdoor unit 301 includes a refrigerating compressor 302 and an air-cooling condenser 303. The heat sink and the cooling coil 112 form a complete vapor compression refrigeration cycle, the interior of which is filled with a refrigerant.

The cabinet 100 includes an outer wall 104, an inner wall 103, and a cooling assembly.

The outer wall 104 is located outside of the heat sink, and the outer wall 104 includes a body having a receiving cavity with an open top. Further, the outer wall 104 has a first side. Further, the outer wall 104 is provided on a side adjacent to the first side thereof with a network cable interface 108 for connecting to the network cable of the IT device 107, and a power supply for connecting to the power line of the IT device 107. Line interface 109. Further, the outer wall 104 further includes a cover plate 101 for covering the receiving cavity. Further, the cover plate 101 is pivotally coupled to the first side of the outer wall 104. Further, when the cover plate 101 is in the closed state, the cover plate 101 seals the entire cabinet by pressing the seal. This This prevents the coolant from flowing out of the cabinet during transportation and prevents external foreign matter from entering the cabinet.

Referring to FIGS. 1 and 2, the inner wall 103 is mounted in the receiving cavity, and the inner wall 103 has a top open mounting cavity for mounting the IT device 107, and the mounting cavity is also used. The coolant 111 for immersing the IT device 107 for heat dissipation is contained. Further, the inner side of the inner wall 103 is provided with an inner frame 102, and the inner frame 102 includes a first tube 201 and an opposite second tube 202 arranged in parallel, and the first tube 201 and the second tube 202 are used. The IT device 107 is supported. Further, a plurality of ribs 106 are disposed on an inner side of the inner wall 103, and a flow passage is provided between each two adjacent ribs 106, and the flow passage is used for the coolant 111 to flow through, the flow passage It is also used to house the network cable and the power cord of the IT device 107. Further, a weak electric wire slot 105 is disposed between the outer wall 104 and the inner wall 103 for wiring the network cable and the sensor wire in the cabinet. Further, an insulating layer 113 is further disposed between the outer wall 104 and the inner wall 103 to insulate the cooling liquid 111. Further, a first side of the outer wall 104 is higher than a first side of the inner wall 103, and a first side of the outer wall 104 is for mounting the power distribution module 110 above the inner wall 103, The power distribution module 110 is used to supply power to the IT equipment in the cabinet, and is equipped with an air switch and a lightning protection device. Further, the expansion valve 115 is disposed inside the cabinet 100 (please refer to FIG. 3).

Referring to FIG. 2 and FIG. 3 together, the cooling assembly is mounted on the inner wall 103 and connected to the heat dissipating device to dissipate the cooling liquid 111. Further, the cooling assembly includes a cooling coil 112 located between the inner wall 103 and the outer wall 104, the cooling coil 112 abutting the inner wall 103, the cooling coil 112 is configured to be connected to the heat sink to dissipate heat from the coolant 111. Further, there are a plurality of cooling coils 112, and a plurality of the cooling coils 112 uniformly surround the inner wall 103. Further, the cooling coil 112 is connected to the refrigerating unit 301 through the refrigerant pipe 304 for heat dissipation. Further, the cooling assembly further includes a first circulation pump 114 installed in the installation cavity and used for immersing in the coolant 111, and the first circulation pump 114 is used to drive the The coolant 111 is described. The first circulation pump 114 is immersed in the coolant 111, so that noise and vibration are small.

Referring to Figures 1-3, in use, the cover 101 of the outer wall 104 is pivoted relative to the body of the outer wall 104. The coolant 111 is poured into the mounting cavity of the inner wall 103. The IT device 107 is immersed in the cooling liquid 111. The cover 101 of the outer wall 104 is covered. The first circulation pump 114 is activated. The heat sink is activated.

At this time, the first circulation pump 114 drives the coolant 111 to perform cyclic convection, absorbing heat generated by the IT device 107, so that the temperature of the coolant 111 is raised. The refrigerant in the cooling coil 112 absorbs the heat of the coolant 111 through the inner wall 103 and the ribs 106 to cool the coolant 111, and the cooled coolant 111 flows back to continue to absorb the IT device 107. The heat generated. The heat dissipating device and the cooling coil 112 constitute a complete vapor compression refrigeration cycle, and the heat dissipating device dissipates the heat absorbed by the refrigerant in the cooling coil 112 to the external environment.

In the cabinet 100 provided by the embodiment of the first aspect of the present invention, the heat sink dissipates the IT device 107 through the cooling component and the coolant 111, and the temperature of the IT device 107 can be quickly reduced, and the heat dissipation performance is good.

An embodiment of the second aspect of the invention provides a cabinet. Referring to FIG. 4, the cabinet is different from the cabinet 100 in that the cooling coil 112 of the cooling assembly can be replaced by a cooling coil module 401, and the cooling coil module 401 is mounted on the mounting cavity. The cooling coil module 401 is configured to be connected to the heat sink to dissipate heat from the coolant 111. Further, a second circulation pump 402 may be used instead of the first circulation pump 114 for driving the coolant, the second circulation pump 402 is installed in the installation cavity, and the second circulation pump 402 is used for driving The coolant 111. The second circulation pump 402 is immersed in the coolant 111, so that the noise is small.

In the cabinet provided by the embodiment of the second aspect of the present invention, the heat sink dissipates the IT device 107 through the cooling component and the coolant 111, and the temperature of the IT device 107 can be quickly reduced, and the heat dissipation performance is good.

An embodiment of the third aspect of the invention provides a micro data center. The micro data center includes the cabinet described above.

In the micro data center provided by the embodiment of the third aspect of the present invention, the heat sink dissipates the IT device 107 through the cooling component and the coolant 111, and the temperature of the IT device 107 can be quickly reduced, and the heat dissipation performance is good.

A person skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the system, the device and the assembly described above can refer to the corresponding processes in the foregoing method embodiments, and details are not described herein again.

The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It should be covered by the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

A cabinet for a micro data center, the micro data center including an IT device and a heat sink, wherein the cabinet includes:

An outer wall, the outer wall is located outside the heat dissipating device, the outer wall includes a main body, and the main body has a receiving cavity with an open top;

An inner wall, the inner wall is mounted in the receiving cavity, the inner wall has a top open mounting cavity, the mounting cavity is for mounting the IT device, and the mounting cavity is further configured to receive the IT device to be immersed Coolant for heat dissipation;

a cooling assembly mounted to the inner wall and coupled to the heat sink to dissipate heat from the coolant.
The cabinet according to claim 1, wherein said cooling assembly comprises a cooling coil, said cooling coil being located between said inner wall and said outer wall, said cooling coil abutting said inner wall, The cooling tube is for connecting to the heat sink to dissipate heat from the coolant.
The cabinet according to claim 2, wherein said cooling coil has a plurality of sets, and said plurality of said cooling coils uniformly surround said inner wall.
The cabinet according to claim 2, wherein said cooling assembly further comprises a plurality of first circulation pumps, said first circulation pump being mounted in said installation chamber, said first circulation pump being for driving said Said cooling liquid.
A cabinet according to any one of claims 2 to 4, wherein the plurality of sets of cooling coils included in the cooling assembly are replaced by a cooling coil module, and the cooling coil module is mounted to the mounting In the chamber, a second circulation pump may be used in place of the first circulation pump for driving the coolant.
A cabinet according to any one of claims 5 to 4, wherein said insulating layer is provided between said outer wall and said inner wall to insulate said cooling coil or cooling coil module.
A cabinet according to any one of claims 2 to 4, wherein an inner side of the inner wall is provided with an inner frame, and the inner frame includes a first tube and a second tube which are arranged in parallel, the first tube and The second tube is for supporting the IT device.
The cabinet according to any one of claims 2 to 4, wherein a plurality of ribs are disposed on an inner side of the inner wall, and a flow passage is provided between each two adjacent ribs, and the flow passage is used for The coolant flows through, The flow channel is also used to receive a network cable and a power line of the IT device.
The cabinet according to claim 8, wherein said data center further comprises a power distribution module for connecting to a power line of said IT device, said first side of said outer wall being higher than said first wall The first side of the outer wall is for mounting the power distribution module above the inner wall.
A cabinet according to claim 9, wherein said outer wall is provided with a network cable interface for connecting to said network cable of said IT device on a side adjacent to said first side thereof, and for connecting to said power source Assign the power cord interface of the module.
The cabinet of claim 9 wherein said outer wall further comprises a cover plate for covering said receiving cavity, said cover plate being pivotally coupled to the first side of said outer wall.
A micro data center comprising the cabinet of any of claims 1-11.