CN207601706U - A kind of casing structure for facilitating heat dissipation - Google Patents

A kind of casing structure for facilitating heat dissipation Download PDF

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Publication number
CN207601706U
CN207601706U CN201721495491.7U CN201721495491U CN207601706U CN 207601706 U CN207601706 U CN 207601706U CN 201721495491 U CN201721495491 U CN 201721495491U CN 207601706 U CN207601706 U CN 207601706U
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CN
China
Prior art keywords
circuit board
babinet
box body
heat dissipation
shaped pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721495491.7U
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Chinese (zh)
Inventor
肖敏
郭美
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Xiangnan University
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Xiangnan University
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Publication date
Application filed by Xiangnan University filed Critical Xiangnan University
Priority to CN201721495491.7U priority Critical patent/CN207601706U/en
Application granted granted Critical
Publication of CN207601706U publication Critical patent/CN207601706U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of casing structures for facilitating heat dissipation; including babinet; the inner cavity of the babinet is provided with circuit board; the circuit board is mounted on by the screw of its quadrangle on the inner wall of babinet; the front of the circuit board is equipped with protective cover; radiating vane is installed in the protective cover; box body is installed at the top of the cabinets cavity; the left and right sides of the box cavity is symmetrical arranged there are two partition board; the box body is divided into two reclaiming chambers and a cooling chamber by partition board, and the bottom of the box body is equipped with the first connector.This facilitates the casing structure of heat dissipation, by being leading using circulated water-cooled heat sink, using radiator fan as auxiliary, cool down relative to traditional radiator fan formula, its significant effect improves, and temperature fall time is shorter, and radiating vane belongs to same closed circuit with circuit board, i.e. circuit board work just drives radiating vane rotation, so as to carry out auxiliary temperature-reducing.

Description

A kind of casing structure for facilitating heat dissipation
Technical field
The utility model is related to technical field of electronic equipment, specially a kind of casing structure for facilitating heat dissipation.
Background technology
With the development of science and technology, more and more electronic equipments are full of in people live, people’s lives are both improved Quality brings many facilities, and electronic equipment relies on operation power, many equipment can generate heat in the process of running, such as Fruit generates heat and can not quickly discharge too much, it will equipment impacted, such as some computer servers The equipment cabinets etc. of cabinet, large data exchanger, some are dust-proof wait design factors due to, it is impossible to equipped with excessive opening Formula channel generally improves heat dissipation effect using built-in fans, but is only cooled down by heat emission fan, particularly in summer temperature When spending high, the heat in mainframe box can be concentrated in together largely, and a large amount of heat cannot in time be shed, therefore easily make cabinet Interior element is damaged.
Utility model content
The purpose of this utility model is to provide a kind of casing structure for facilitating heat dissipation, to solve to carry in above-mentioned background technology The problem of going out.
To achieve the above object, the utility model provides following technical solution:A kind of casing structure for facilitating heat dissipation, including Babinet, the inner cavity of the babinet are provided with circuit board, and the circuit board is mounted on by the screw of its quadrangle on the inner wall of babinet, The front of the circuit board is equipped with protective cover, and radiating vane, the top peace of the cabinets cavity are equipped in the protective cover Equipped with box body, the left and right sides of the box cavity is symmetrical arranged there are two partition board, and the box body is divided into two by partition board A reclaiming chamber and a cooling chamber, the bottom of the box body are equipped with the first connector, and the bottom of first connector is plugged with back Shape pipe, the bottom of the back-shaped pipe are equipped with the second connector, and the circuit board is located at the middle part side of back-shaped pipe, and described second connects The bottom of head is equipped with return duct, and side of the return duct far from the second connector extends to the inner cavity of box body, in the box body Return duct on the miniature pump housing is installed, the bottom of the reclaiming chamber is equipped with condenser pipe, and the bottom of the partition board, which offers, leads Chute, the outside of the babinet are provided with external interface.
Preferably, the outside of the babinet offers the first thermovent and the second thermovent respectively.
Preferably, be connected with geometrical clamp on the inner wall of the babinet, and the top and bottom of geometrical clamp be connected to it is back-shaped Guan Shang is connected with clip on the return duct.
Preferably, the circuit board is pasted with water absorption pad close to the side of back-shaped pipe.
Compared with prior art, the beneficial effects of the utility model are:This facilitates the casing structure of heat dissipation, by recycle Water-cooled temp.-lowering device is leading, using radiator fan as auxiliary, is cooled down relative to traditional radiator fan formula, significant effect carries Height, temperature fall time is shorter, and radiating vane belongs to same closed circuit with circuit board, i.e. circuit board work just drives radiating vane Rotation, so as to carry out auxiliary temperature-reducing, fills coolant, coolant passes through since gravity is flowed into back-shaped pipe in cooling chamber The detour design of back-shaped pipe, can increase back-shaped pipe and the overlapping area of circuit board, pass through the coolant absorbing circuit in back-shaped pipe The heat that plate work generates, and back-shaped pipe and the overlapping area of circuit board are big, therefore can make circuit board fast in a relatively short period of time Prompt drop temperature, its own temperature can be increased and be flowed into return duct after the coolant in back-shaped pipe absorbs heat, open the miniature pump housing, Coolant in return duct is recycled in reclaiming chamber, then the condensation by condenser pipe, cooled down to coolant, cooled down Coolant afterwards is reentered by diversion trench in cooling chamber, so as to fulfill the effect of circulation temperature lowering.
Description of the drawings
Fig. 1 is the structural profile illustration of the utility model;
Fig. 2 is the lateral partial structurtes sectional view of the utility model;
Fig. 3 is the structure diagram of the utility model;
Fig. 4 is the board structure of circuit schematic diagram of the utility model.
In figure:1 babinet, 2 circuit boards, 3 screws, 4 protective covers, 5 radiating vanes, 6 box bodys, 7 partition boards, 8 reclaiming chambers, 9 coolings Chamber, 10 first connectors, 11 back-shaped pipes, 12 second connectors, 13 return ducts, the 14 miniature pump housings, 15 condenser pipes, 16 diversion trenches, outside 17 Put interface, 18 first thermovents, 19 second thermovents, 20 geometrical clamps, 21 clips, 22 water absorption pads.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work All other embodiments obtained shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the utility model provides a kind of technical solution:A kind of casing structure for facilitating heat dissipation, by with Circulated water-cooled heat sink is leading, using radiator fan as auxiliary, is cooled down relative to traditional radiator fan formula, effect is shown It writes and improves, temperature fall time is shorter, and including babinet 1, the inner cavity of the babinet 1 is provided with circuit board 2, is connected on the circuit board 2 To realize various functions, circuit board 2 is mounted on by the screw 3 of its quadrangle on the inner wall of babinet 1 setting electric components, described The front of circuit board 2 is equipped with protective cover 4, and radiating vane 5 is equipped in the protective cover 4, sets protective cover 4, can play guarantor The effect of radiating vane 5 is protected, radiating vane 5 belongs to same closed circuit with circuit board 2, i.e. circuit board 2 works just to drive and dissipate Hot flabellum 5 rotates, and so as to carry out auxiliary temperature-reducing, box body 6, a left side for 6 inner cavity of box body are equipped at the top of 1 inner cavity of babinet Right both sides are symmetrical arranged there are two partition board 7, and the box body 6 is divided into two reclaiming chambers 8 and a cooling chamber 9 by partition board 7, The bottom of the box body 6 is equipped with the first connector 10, and the bottom of first connector 10 is plugged with back-shaped pipe 11, the back-shaped pipe 11 bottom is equipped with the second connector 12, and the circuit board 2 is located at the middle part of back-shaped pipe 11, coolant is filled in cooling chamber 9, cold But liquid is flowed into back-shaped pipe 11 due to gravity, is designed by the detour of back-shaped pipe 11, can be increased back-shaped pipe 11 and circuit board 2 Overlapping area, the heat generated by the work of coolant absorbing circuit plate 2 in back-shaped pipe 11, and back-shaped pipe 11 and circuit board 2 overlapping area can make circuit board 2 cool down rapidly in a relatively short period of time up to more than 70%, second connector 12 Bottom return duct 13 is installed, side of the return duct 13 far from the second connector 12 extends to the inner cavity of box body 6, the box The miniature pump housing 14 is installed, the bottom of the reclaiming chamber 8 is equipped with condenser pipe 15, and condenser pipe 15 is on the return duct 13 in body 6 The industrial products of the prior art, operation principle and structure belong to the prior art, are not repeated herein, the partition board 7 Bottom offers diversion trench 16, its own temperature can increase and flow into return duct 13 after the coolant in back-shaped pipe 11 absorbs heat It is interior, the miniature pump housing 14 is opened, the coolant in return duct 13 is recycled in reclaiming chamber 8, then is made by the condensation of condenser pipe 15 With cooling down to coolant, the coolant after cooling is reentered by diversion trench 16 in cooling chamber 9, so as to fulfill cycle The effect of cooling, the outside of the babinet 1 are provided with external interface 17.
Specifically, the outside of the babinet 1 offers the first thermovent 18 and the second thermovent 19, setting first respectively 18 and second thermovent 19 of thermovent, plays the role of auxiliary heat dissipation.
Specifically, geometrical clamp 20 is connected on the inner wall of the babinet 1, and the top and bottom of geometrical clamp 20 are clamped In back-shaped pipe 11, geometrical clamp 20 is connected with clip 21, clip 21 is for solid for fixing back-shaped pipe 11 on the return duct 13 Determine return duct 13.
Specifically, the circuit board 2 is pasted with water absorption pad 22 close to the side of back-shaped pipe 11, the cooling in back-shaped pipe 11 Liquid inevitably makes the surface of back-shaped pipe 11 condense a layer of water drops, to prevent droplet from entering electricity while heat is absorbed In road plate 2, droplet can be absorbed by water absorption pad 22, and water absorption pad 22 has good gas permeability, does not influence the ventilation of circuit board 2 Performance.
Operation principle:Radiating vane 5 belongs to same closed circuit with circuit board 2, i.e., circuit board 2, which works, just drives heat dissipation Flabellum 5 rotates, and so as to carry out auxiliary temperature-reducing, coolant is filled in cooling chamber 9, coolant flows into back-shaped pipe 11 due to gravity It is interior, it is designed by the detour of back-shaped pipe 11, the overlapping area of back-shaped pipe 11 and circuit board 2 can be increased, by back-shaped pipe 11 The heat that the work of coolant absorbing circuit plate 2 generates, and the overlapping area of back-shaped pipe 11 and circuit board 2 is up to more than 70%, because This can make circuit board 2 cool down rapidly in a relatively short period of time, and the coolant in back-shaped pipe 11 absorbs its own temperature meeting after heat It increases and flows into return duct 13, open the miniature pump housing 14, the coolant in return duct 13 is recycled in reclaiming chamber 8, then is led to The condensation of condenser pipe 15 is crossed, is cooled down to coolant, the coolant after cooling reenters cooling by diversion trench 16 In chamber 9, so as to fulfill the effect of circulation temperature lowering.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art, It is appreciated that can these embodiments be carried out with a variety of variations in the case of the principle and spirit for not departing from the utility model, repaiied Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.

Claims (4)

1. a kind of casing structure for facilitating heat dissipation, including babinet (1), it is characterised in that:The inner cavity of the babinet (1) is provided with electricity Road plate (2), the circuit board (2) by the screw (3) of its quadrangle on the inner wall of babinet (1), the circuit board (2) Front is equipped with protective cover (4), and radiating vane (5), the top peace of babinet (1) inner cavity are equipped in the protective cover (4) Equipped with box body (6), the left and right sides of box body (6) inner cavity is symmetrical arranged there are two partition board (7), the box body (6) by every Plate (7) is divided into two reclaiming chambers (8) and a cooling chamber (9), and the bottom of the box body (6) is equipped with the first connector (10), the bottom of first connector (10) is plugged with back-shaped pipe (11), and the bottom of the back-shaped pipe (11) is equipped with second and connects Head (12), the circuit board (2) are equipped with reflux positioned at the middle part side of back-shaped pipe (11), the bottom of second connector (12) It manages (13), side of the return duct (13) far from the second connector (12) extends to the inner cavity of box body (6), and the box body (6) is interior Return duct (13) on the miniature pump housing (14) is installed, the bottom of the reclaiming chamber (8) is equipped with condenser pipe (15), the partition board (7) bottom offers diversion trench (16), and the outside of the babinet (1) is provided with external interface (17).
2. a kind of casing structure for facilitating heat dissipation according to claim 1, it is characterised in that:The outside of the babinet (1) The first thermovent (18) and the second thermovent (19) are offered respectively.
3. a kind of casing structure for facilitating heat dissipation according to claim 1, it is characterised in that:The inner wall of the babinet (1) On be connected with geometrical clamp (20), and the top and bottom of geometrical clamp (20) are connected in back-shaped pipe (11), the return duct (13) clip (21) is connected on.
4. a kind of casing structure for facilitating heat dissipation according to claim 1, it is characterised in that:The circuit board (2) is close The side of back-shaped pipe (11) is pasted with water absorption pad (22).
CN201721495491.7U 2017-11-10 2017-11-10 A kind of casing structure for facilitating heat dissipation Expired - Fee Related CN207601706U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721495491.7U CN207601706U (en) 2017-11-10 2017-11-10 A kind of casing structure for facilitating heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721495491.7U CN207601706U (en) 2017-11-10 2017-11-10 A kind of casing structure for facilitating heat dissipation

Publications (1)

Publication Number Publication Date
CN207601706U true CN207601706U (en) 2018-07-10

Family

ID=62757933

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721495491.7U Expired - Fee Related CN207601706U (en) 2017-11-10 2017-11-10 A kind of casing structure for facilitating heat dissipation

Country Status (1)

Country Link
CN (1) CN207601706U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111587028A (en) * 2019-02-18 2020-08-25 成都立心天地电子科技有限公司 Digital circuit control system
CN115951768A (en) * 2023-02-21 2023-04-11 西安翎飞鸾信息科技有限公司 Computer water-cooling heat abstractor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111587028A (en) * 2019-02-18 2020-08-25 成都立心天地电子科技有限公司 Digital circuit control system
CN111587028B (en) * 2019-02-18 2024-03-15 湖南硕特电子科技有限公司 Digital circuit control system
CN115951768A (en) * 2023-02-21 2023-04-11 西安翎飞鸾信息科技有限公司 Computer water-cooling heat abstractor

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180710

Termination date: 20191110

CF01 Termination of patent right due to non-payment of annual fee