CN115951768A - Computer water-cooling heat abstractor - Google Patents
Computer water-cooling heat abstractor Download PDFInfo
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- CN115951768A CN115951768A CN202310141680.8A CN202310141680A CN115951768A CN 115951768 A CN115951768 A CN 115951768A CN 202310141680 A CN202310141680 A CN 202310141680A CN 115951768 A CN115951768 A CN 115951768A
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- case
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- 238000001816 cooling Methods 0.000 title claims abstract description 103
- 230000017525 heat dissipation Effects 0.000 claims abstract description 88
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 238000007789 sealing Methods 0.000 claims description 23
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of computers, in particular to a water-cooling heat dissipation device for a computer, which comprises a case, wherein a heat dissipation mechanism is arranged in the case, a dustproof mechanism is arranged on the left side of the case, a liquid adding mechanism is fixedly connected in the case and above the heat dissipation mechanism, and a dustproof net is fixedly connected to the top of the case; the heat dissipation mechanism comprises a heat dissipation plate fixedly connected to the top of the inner wall of the case, a heat dissipation groove is formed in the heat dissipation plate, a liquid inlet pipe and a liquid outlet pipe are fixedly connected to the two sides of the heat dissipation plate respectively, a liquid guide pipe and a lower liquid guide pipe are fixedly connected to the outer wall of the liquid outlet pipe and the outer wall of the liquid inlet pipe from top to bottom respectively, a cooling head is mounted inside the liquid guide pipe, heat dissipation of the chip and the display card is achieved by the aid of the heat dissipation mechanism in the device through design of the computer water-cooling heat dissipation device, the problem that the existing case is poor in heat dissipation effect, and water-cooling heat dissipation of the chip and the display card cannot be achieved simultaneously is solved.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a water-cooling heat dissipation device for a computer.
Background
The case is a device for installing equipment such as a mainboard chip, a display card and the like in a computer, but the existing case still has the defects, specifically: the existing case has poor heat dissipation effect and cannot perform water-cooling heat dissipation on the chip and the display card simultaneously.
Therefore, a computer water-cooling heat sink is needed to solve the above problems in the prior art.
Disclosure of Invention
The present invention is directed to a computer water-cooling heat dissipation device to solve the problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
a computer water-cooling heat dissipation device comprises a case, wherein a heat dissipation mechanism is arranged inside the case, a dustproof mechanism is arranged on the left side of the case, a liquid adding mechanism is fixedly connected inside the case and above the heat dissipation mechanism, and a dustproof net is fixedly connected to the top of the case;
the utility model discloses a cooling device, including heat dissipation mechanism, including the heat dissipation mechanism, the heat dissipation mechanism includes the heating panel of fixed connection at quick-witted incasement wall top, the radiating groove has been seted up to the inside of heating panel, the both sides difference fixedly connected with feed liquor pipe and drain pipe of heating panel, the outer wall from the top down difference fixedly connected with of drain pipe and feed liquor pipe goes up honeycomb duct and honeycomb duct down, the internally mounted of going up the honeycomb duct has the cooling head, the equal fixedly connected with mounting panel in both sides of cooling head, the inside sliding connection of cooling head has the mounting screw, the internally mounted of honeycomb duct has the display card cooling plate down, the bottom fixedly connected with telescopic tube of display card cooling plate, the inside sliding connection of telescopic tube has fixed cardboard, the top of fixed cardboard just is fixedly connected with pressure spring in the telescopic tube, the outer wall fixedly connected with blotter of fixed cardboard, the equal fixedly connected with heat conduction pad of outer wall of cooling head and display card cooling plate, the inside of going up honeycomb duct and down just at the both sides difference fixedly connected with check valve of cooling head and display card cooling plate, the internally mounted of radiating groove has the baffling board, the inside of radiating groove just is close to the heat dissipation fan fixed connection of liquid level sensor and is located the heat dissipation panel is located the fixed connection of LED heat dissipation panel and is located the fixed connection with the heat dissipation panel.
As a preferable scheme of the present invention, the dustproof mechanism includes an installation seat fixedly connected to an outer wall of the chassis, the interior of the installation seat is rotatably connected with a rotating shaft, the outer wall of the rotating shaft is fixedly connected with a dustproof plate, and the outer wall of the rotating shaft is fixedly connected with a volute spiral spring on both the front side and the back side of the dustproof plate.
As a preferable scheme of the present invention, the liquid adding mechanism includes a connecting sleeve fixedly connected to an inner wall of the chassis, an inner wall of the connecting sleeve is slidably connected with a sealing plug, a top of the sealing plug is fixedly connected with a connecting rod, a top end of the connecting rod is fixedly connected with a screen, an outer wall of the connecting sleeve is in threaded connection with a sealing nut, and a top of the screen is fixedly connected with a return spring.
As the preferable scheme of the invention, the case is made of aluminum alloy, the outer wall of the case is sprayed with insulating paint, and four groups of anti-skid foot pads are installed at the bottom of the case.
According to the preferable scheme of the invention, the heat dissipation plate, the baffle plate, the connecting plate and the mounting plate are all made of aluminum alloy, the cooling head and the display card cooling plate are all made of red copper, the telescopic sleeve is fixedly connected with the compression spring, the cushion pad is made of silica gel, the fixing clamping plates are designed to be L-shaped structures, and the heat dissipation fans are provided with two groups.
As a preferable scheme of the present invention, serpentine cooling grooves are formed in the cooling head and the display card cooling plate, the heat conducting pad is made of heat conducting silicone grease, the mounting screws are provided with four groups, the four groups of mounting screws penetrate through the mounting plate and extend to the outside of the mounting plate, and the liquid outlet pipe, the liquid inlet pipe, the upper flow guide pipe and the lower flow guide pipe are all made of PVC plastic hoses.
According to the preferable scheme of the invention, the heat dissipation groove is designed in a snake-shaped structure, the baffle plates are provided with a plurality of groups, the one-way valve only allows liquid to flow from left to right, the micro delivery pump, the heat dissipation fan, the liquid level sensor, the LED display screen and the power supply socket are electrically connected, and the baffle plates, the telescopic sleeve, the fixed clamping plate, the compression spring and the cushion pad are provided with a plurality of groups.
As a preferable scheme of the invention, the mounting seat, the rotating shaft and the dust guard are all made of ABS plastic, the scroll spring is fixedly connected with the mounting seat, and the mounting seat is adhered to the outer wall of the case through pressure-sensitive adhesive.
As a preferable scheme of the present invention, the connection sleeve, the connection rod, the screen and the sealing nut are all made of aluminum alloy, the sealing plug is made of silica gel, the top end of the connection sleeve penetrates through the chassis and extends to the upper side of the chassis, the bottom end of the connection sleeve penetrates through the heat dissipation plate and extends into the heat dissipation groove, and the screen and the connection sleeve are connected in a sliding manner.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, by designing a computer water-cooling heat dissipation device, a chip and a display card are dissipated by a heat dissipation mechanism in the device, a user installs a mainboard, the chip and the display card in a case, an installation plate and a cooling head are fixed on the mainboard by using installation screws, the cooling head is tightly attached to the chip in the mainboard, then a display card cooling plate is placed at the top of the display card, a fixing clamping plate can clamp the display card, a power supply socket is connected with a power supply of the mainboard by using a lead, when the display card and the chip in the case operate, heat generated by the chip and the display card is transferred to the cooling head and the inside of the display card cooling plate respectively, cooling liquid in the cooling head and the inside of the display card cooling plate can absorb heat and convert the heat into a gas state, a micro delivery pump connected with a liquid inlet pipe can deliver the gas state cooling liquid into the heat dissipation plate, the gas state cooling liquid transfers the heat to the heat dissipation plate, after the heat is released, the gas state cooling liquid is changed back into liquid, the liquid can be re-delivered into the cooling liquid by a micro delivery pump connected with the liquid inlet pipe, the heat dissipation plate, the heat dissipation mechanism can not be interrupted when the heat dissipation mechanism in the case, and the heat dissipation mechanism can not be transferred to the chip, and the heat dissipation mechanism in the case, so that the chip and the chip can not be relatively poor heat dissipation range of the existing case.
2. According to the invention, by designing the computer water-cooling heat dissipation device, a user can know the amount of the cooling liquid in the heat dissipation mechanism in time by using the liquid adding mechanism and the liquid level sensor in the device, and the user can add the cooling liquid conveniently.
3. According to the invention, by designing the water-cooling heat dissipation device for the computer, some slots which are not frequently used on the outer wall of the case can be sealed by utilizing the dustproof mechanism in the device, so that dust is prevented from entering the slots, and the normal use of the slots is not influenced.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a front cross-sectional view of the heat dissipation mechanism of the present invention;
FIG. 3 is an enlarged view taken at A of FIG. 2 according to the present invention;
FIG. 4 is a schematic perspective view of a display card cooling plate according to the present invention;
FIG. 5 is a schematic perspective view of a liquid adding mechanism according to the present invention;
fig. 6 is a schematic perspective view of the dustproof mechanism of the present invention.
In the figure: 1. a chassis; 2. a heat dissipation mechanism; 3. a dust-proof mechanism; 4. a liquid adding mechanism; 5. a dust screen; 201. a heat dissipation plate; 202. a heat sink; 203. a liquid inlet pipe; 204. a liquid outlet pipe; 205. an upper flow guide pipe; 206. a lower guide pipe; 207. a cooling head; 208. mounting a plate; 209. mounting screws; 210. a graphics card cooling plate; 211. a telescopic sleeve; 212. fixing the clamping plate; 213. a compression spring; 214. a cushion pad; 215. a thermally conductive pad; 216. a one-way valve; 217. a baffle plate; 218. a micro delivery pump; 219. a heat radiation fan; 220. a power supply socket; 221. a liquid level sensor; 222. an LED display screen; 223. a connecting plate; 301. a mounting seat; 302. a rotating shaft; 303. a dust-proof plate; 304. a volute spiral spring; 401. a connecting sleeve; 402. a sealing plug; 403. a connecting rod; 404. screening a screen; 405. a sealing nut; 406. a return spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without any creative work based on the embodiments of the present invention belong to the protection scope of the present invention.
While several embodiments of the present invention will be described below in order to facilitate an understanding of the invention, with reference to the accompanying drawings, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed to provide a description of the invention rather than a description thereof.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the terms used herein in the specification of the present invention are for the purpose of describing particular embodiments only and are not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In an embodiment, referring to fig. 1 to 6, the present invention provides a technical solution:
a computer water-cooling heat dissipation device comprises a case 1, wherein a heat dissipation mechanism 2 is arranged inside the case 1, a dustproof mechanism 3 is arranged on the left side of the case 1, a liquid adding mechanism 4 is fixedly connected inside the case 1 and above the heat dissipation mechanism 2, and a dustproof net 5 is fixedly connected to the top of the case 1;
the machine case 1 is made of aluminum alloy, the outer wall of the machine case 1 is sprayed with insulating paint, and four groups of anti-skidding foot pads are mounted at the bottom of the machine case 1;
in this embodiment, referring to fig. 2, 3 and 4, the heat dissipation mechanism 2 includes a heat dissipation plate 201 fixedly connected to the top of the inner wall of the chassis 1, a heat dissipation groove 202 is formed in the heat dissipation plate 201, a liquid inlet pipe 203 and a liquid outlet pipe 204 are fixedly connected to both sides of the heat dissipation plate 201, an upper flow guide pipe 205 and a lower flow guide pipe 206 are fixedly connected to outer walls of the liquid outlet pipe 204 and the liquid inlet pipe 203 from top to bottom, a cooling head 207 is installed in the upper flow guide pipe 205, a mounting plate 208 is fixedly connected to both sides of the cooling head 207, a mounting screw 209 is slidably connected to the inside of the mounting plate 208, a graphics card cooling plate 210 is installed in the lower flow guide pipe 206, a telescopic sleeve 211 is fixedly connected to the bottom of the graphics card cooling plate 210, a fixing clip 212 is slidably connected to the inside of the telescopic sleeve 211, a cushion 214 is fixedly connected to the outer walls of the fixing clip cooling plate 212, a heat dissipation cushion 215 is fixedly connected to the outer walls of the cooling head 207 and the graphics card cooling plate 210, a heat dissipation plate 220 is connected to the heat dissipation plate 201, a heat dissipation fan 220 is connected to the heat dissipation plate 220, and a heat dissipation fan 220 is connected to the heat dissipation plate 201;
the cooling plate 201, the baffle plate 217, the connecting plate 223 and the mounting plate 208 are made of aluminum alloy, the cooling head 207 and the display card cooling plate 210 are made of red copper, the telescopic sleeve 211 is fixedly connected with the compression spring 213 in a connection mode, the cushion 214 is made of silica gel, the fixing clamp plate 212 is in an L-shaped structural design, two groups of cooling fans 219 are arranged, serpentine cooling grooves are formed in the cooling head 207 and the display card cooling plate 210, the heat conducting pad 215 is made of heat conducting silicone grease, four groups of mounting screws 209 are arranged, the four groups of mounting screws 209 penetrate through the mounting plate 208 and extend out of the mounting plate 208, the liquid outlet pipe 204, the liquid inlet pipe 203, the upper flow guide pipe 205 and the lower flow guide pipe 206 are made of PVC plastic hoses, the cooling grooves 202 are in a serpentine structural design, the baffle plate 217 is provided with multiple groups, the one-way valve 216 only allows liquid to flow from left to right, the micro delivery pump 218, the cooling fans 219, the liquid level sensor 221 and the LED display screen 222 are electrically connected with the power supply socket 220, and the baffle plate 217, the telescopic sleeve 211, the fixing clamp plate 212, the compression spring 213 and the cushion 214 are provided with multiple groups;
in this embodiment, referring to fig. 2 and 5, the dust-proof mechanism 3 includes a mounting seat 301 fixedly connected to the outer wall of the chassis 1, a rotating shaft 302 is rotatably connected to the inside of the mounting seat 301, a dust-proof plate 303 is fixedly connected to the outer wall of the rotating shaft 302, and a spiral spring 304 is fixedly connected to the outer wall of the rotating shaft 302 and both the front side and the back side of the dust-proof plate 303;
the mounting seat 301, the rotating shaft 302 and the dust-proof plate 303 are all made of ABS plastic, the volute spiral spring 304 is fixedly connected with the mounting seat 301, and the mounting seat 301 is adhered to the outer wall of the case 1 through pressure-sensitive adhesive;
in this embodiment, referring to fig. 2 and fig. 6, the liquid adding mechanism 4 includes a connecting sleeve 401 fixedly connected to the inner wall of the chassis 1, the inner wall of the connecting sleeve 401 is slidably connected with a sealing plug 402, the top of the sealing plug 402 is fixedly connected with a connecting rod 403, the top of the connecting rod 403 is fixedly connected with a screen 404, the outer wall of the connecting sleeve 401 is connected with a sealing nut 405 in a threaded manner, and the top of the screen 404 is fixedly connected with a return spring 406;
wherein connecting sleeve 401, connecting rod 403, screen cloth 404 and sealing nut 405 are made by the aluminum alloy, and sealing plug 402 is made by silica gel, and connecting sleeve 401's top is run through quick-witted case 1 and is extended to quick-witted case 1 top, and connecting sleeve 401's bottom is run through heating panel 201 and is extended to in the radiating groove 202, and the connected mode of screen cloth 404 and connecting sleeve 401 is sliding connection.
The working process of the invention is as follows: when the computer water-cooling heat dissipation device designed by the scheme is used, a user installs a computer mainboard in a case 1, then installs a chip on the mainboard, fixes a mounting plate 208 and a cooling head 207 on the mainboard by using a mounting screw 209, tightly attaches the cooling head 207 to the chip in the mainboard, pulls a connecting plate 223, the connecting plate 223 can drive a fixed clamping plate 212 to meet downwards, the fixed clamping plate 212 is far away from a display card cooling plate 210, when the distance between the fixed clamping plate 212 and the display card cooling plate 210 is matched with the thickness of a display card, the user stops pulling the connecting plate 223, the display card is placed between the display card cooling plate 210 and the fixed clamping plate 212, releases the connecting plate 223, a compression spring 213 can drive the fixed clamping plate 212 to move reversely, the fixed clamping plate 212 and the display card cooling plate 210 can clamp the display card, thereby fixing the display card cooling plate 210 on the display card, and the user installs the display card on the mainboard, the power supply socket 220 is connected with a mainboard power supply by using a lead, the mainboard is started, the display card and the chip in the mainboard start to operate, the micro delivery pump 218 is started, the micro delivery pump 218 connected with the liquid outlet pipe 204 sends cooling liquid in the heat dissipation plate 201 to the upper flow guide pipe 205 and the lower flow guide pipe 206 along the liquid outlet pipe 204 respectively, the cooling liquid in the upper flow guide pipe 205 and the lower flow guide pipe 206 respectively flows into the cooling head 207 and the display card cooling plate 210, when the micro display card and the chip operate, heat generated by the chip and the display card is respectively transmitted to the cooling head 207 and the display card cooling plate 210, the cooling liquid in the cooling head 207 and the display card cooling plate 210 absorbs heat and is converted into gas, the micro delivery pump 218 connected with the liquid inlet pipe 203 sends the gas-state cooling liquid into the heat dissipation plate 201, the gas-state cooling liquid transmits the heat to the heat dissipation plate 201, and after the heat is released, the gaseous cooling liquid is changed back into liquid again, the liquid cooling liquid can be respectively sent into the cooling head 207 and the display card cooling plate 210 again through the liquid outlet pipe 204, the upper flow guide pipe 205 or the lower flow guide pipe 206 by the micro delivery pump 218 connected with the liquid outlet pipe 204, and meanwhile, the air flow rate at the top of the cooling plate 201 can be accelerated by the cooling fan 219, so that the heat in the cooling plate 201 can be quickly taken away by the air, and the heat generated when the chip and the display card operate can be timely transferred out of the case 1;
when the cooling liquid in the heat dissipation groove 202 is too little, a user unscrews the sealing nut 405, inserts the water pipe into the connecting sleeve 401, pushes the water pipe, extrudes the screen 404 through the water pipe, the screen 404 drives the sealing plug 402 to move downwards through the connecting rod 403, the sealing plug 402 does not block the connecting sleeve 401, the user supplements the cooling liquid to the heat dissipation plate 201 through the water pipe and the connecting sleeve 401, after the supplementation is completed, the user pulls out the water pipe, the water pipe does not extrude the screen 404 any more, the return spring 406 drives the screen 404, the connecting rod 403 and the sealing plug 402 to move reversely, the sealing plug 402 blocks the connecting sleeve 401 again, and the user screws the sealing nut 405 into the top of the connecting sleeve 401 again;
when a user sends a connecting wire into the case 1, the user selects a suitable slot on the case 1 and pushes the dust-proof plate 303 at the position of the slot, the dust-proof plate 303 rotates upward, the user sends the connecting wire into the case 1 along the slot, and after the connecting wire is pulled out, the scroll spring 304 drives the dust-proof plate 303 to rotate reversely, and the dust-proof plate 303 covers the slot again.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a computer water-cooling heat abstractor, includes quick-witted case (1), its characterized in that: a heat dissipation mechanism (2) is arranged in the case (1), a dustproof mechanism (3) is arranged on the left side of the case (1), a liquid adding mechanism (4) is fixedly connected in the case (1) and above the heat dissipation mechanism (2), and a dustproof net (5) is fixedly connected to the top of the case (1);
the heat dissipation mechanism (2) comprises a heat dissipation plate (201) fixedly connected to the top of the inner wall of the case (1), a heat dissipation groove (202) is formed in the heat dissipation plate (201), liquid inlet pipes (203) and liquid outlet pipes (204) are fixedly connected to the two sides of the heat dissipation plate (201) respectively, an upper guide pipe (205) and a lower guide pipe (206) are fixedly connected to the outer walls of the liquid outlet pipes (204) and the liquid inlet pipes (203) respectively from top to bottom, a cooling head (207) is arranged inside the upper guide pipe (205), mounting plates (208) are fixedly connected to the two sides of the cooling head (207), mounting screws (209) are arranged inside the mounting plates (208), a display card cooling plate (210) is arranged inside the lower guide pipe (206), a telescopic sleeve (211) is fixedly connected to the bottom of the display card cooling plate (210), a fixed clamping plate (212) is slidably connected to the inside of the telescopic sleeve (211), a compression spring (213) is fixedly connected to the top of the fixed clamping plate (212) and is fixedly connected to the telescopic sleeve (211), a buffer cushion (214) is fixedly connected to the outer wall of the fixed clamping plate (207) and a cooling pad (215) and a cooling pad (206), and the cooling plate (206) are arranged inside the upper guide pipe (207) and the lower guide pipe (206), and the cooling pad (207), and the cooling pad (206), and the cooling plate (206) are connected to the cooling pad (207), and the heat dissipation plate (206), and the cooling pad 210 The both sides of) respectively fixedly connected with check valve (216), the internally mounted of radiating groove (202) has baffling board (217), the inside of radiating groove (202) and respectively installing miniature delivery pump (218) near drain pipe (204) and feed liquor pipe (203) position department, the top fixedly connected with radiator fan (219) of radiator plate (201), the right side of radiator plate (201) just is being close to radiator fan (219) position fixedly connected with power supply socket (220), fixedly connected with level sensor (221) is located at the inside center of radiator plate (201), the positive fixedly connected with LED display screen (222) of radiator plate (201), the bottom fixedly connected with connecting plate (223) of fixed cardboard (212).
2. The water-cooling heat dissipation device for the computer of claim 1, wherein: dustproof mechanism (3) are including fixed connection in mount pad (301) of quick-witted case (1) outer wall, the inside of mount pad (301) is rotated and is connected with pivot (302), outer wall fixedly connected with dust guard (303) of pivot (302), the outer wall of pivot (302) and at the front of dust guard (303) and the equal fixedly connected with spiral spring (304) in the back.
3. The water-cooling heat dissipation device for the computer of claim 1, wherein: liquid feeding mechanism (4) are including fixed connection at connecting sleeve (401) of quick-witted case (1) inner wall, the inner wall sliding connection of connecting sleeve (401) has sealing plug (402), top fixedly connected with connecting rod (403) of sealing plug (402), the top fixedly connected with screen cloth (404) of connecting rod (403), the outer wall threaded connection of connecting sleeve (401) has sealing nut (405), the top fixedly connected with reset spring (406) of screen cloth (404).
4. The water-cooling heat dissipation device for the computer of claim 1, wherein: the machine case (1) is made of aluminum alloy, the outer wall of the machine case (1) is sprayed with insulating paint, and four groups of anti-skidding foot pads are installed at the bottom of the machine case (1).
5. The water-cooling heat dissipation device for the computer of claim 1, wherein: the cooling plate (201), the baffle plate (217), the connecting plate (223) and the mounting plate (208) are all made of aluminum alloy, the cooling head (207) and the display card cooling plate (210) are all made of red copper, the telescopic sleeve (211) is fixedly connected with the compression spring (213), the cushion pad (214) is made of silica gel, the fixing clamp plate (212) is designed to be of an L-shaped structure, and the cooling fan (219) is provided with two sets.
6. The water-cooling heat dissipation device for the computer of claim 1, wherein: snakelike cooling trough has all been seted up to the inside of cooling head (207) and display card cooling plate (210), heat conduction pad (215) are made by heat conduction silicone grease, mounting screw (209) are provided with four groups, and four groups mounting screw (209) all run through mounting panel (208) and extend to outside mounting panel (208), drain pipe (204), feed liquor pipe (203), go up honeycomb duct (205) and honeycomb duct (206) down are made by PVC plastic hose.
7. The water-cooling heat dissipation device for the computer of claim 1, wherein: the heat dissipation groove (202) is designed in a snake-shaped structure, the baffle plate (217) is provided with multiple groups, the one-way valve (216) only allows liquid to flow from left to right, the micro delivery pump (218), the heat dissipation fan (219), the liquid level sensor (221), the LED display screen (222) and the power supply socket (220) are electrically connected, and the baffle plate (217), the telescopic sleeve (211), the fixed clamping plate (212), the compression spring (213) and the cushion pad (214) are provided with multiple groups.
8. The water-cooling heat dissipation device for the computer of claim 2, wherein: mount pad (301), pivot (302) and dust guard (303) are made by ABS plastics, the connected mode of volute spiral spring (304) and mount pad (301) is fixed connection, mount pad (301) are through pressure sensitive adhesive gluing at quick-witted case (1) outer wall.
9. The water-cooling heat dissipation device for the computer of claim 3, wherein: connecting sleeve (401), connecting rod (403), screen cloth (404) and sealing nut (405) are made by the aluminum alloy, sealing plug (402) are made by silica gel, quick-witted case (1) is run through and extend to quick-witted case (1) top on the top of connecting sleeve (401), heating panel (201) is run through and extend to in radiating groove (202) in the bottom of connecting sleeve (401), screen cloth (404) are sliding connection with the connected mode of connecting sleeve (401).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310141680.8A CN115951768A (en) | 2023-02-21 | 2023-02-21 | Computer water-cooling heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310141680.8A CN115951768A (en) | 2023-02-21 | 2023-02-21 | Computer water-cooling heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115951768A true CN115951768A (en) | 2023-04-11 |
Family
ID=87286201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310141680.8A Pending CN115951768A (en) | 2023-02-21 | 2023-02-21 | Computer water-cooling heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115951768A (en) |
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| CN112764501A (en) * | 2021-01-05 | 2021-05-07 | 黑龙江中医药大学 | Heat dissipation integrated system of computer graphic display card |
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| JPH10213370A (en) * | 1996-12-31 | 1998-08-11 | Compaq Computer Corp | Liquid cooling device for electronic device |
| WO2001090867A1 (en) * | 2000-05-25 | 2001-11-29 | Kioan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
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Application publication date: 20230411 |