WO2017202250A1

WO2017202250A1 - Cooling structure for discrete computer graphics card and mounting structure therefor

Info

Publication number: WO2017202250A1
Application number: PCT/CN2017/085104
Authority: WO
Inventors: 周奋豪
Original assignee: 周奋豪
Priority date: 2015-05-25
Filing date: 2017-05-19
Publication date: 2017-11-30
Also published as: TWM550838U; CN205880770U; CN105807869A

Abstract

Disclosed is a cooling structure for a discrete computer graphics card, comprising a mounting structure for the discrete graphics card and a heat sink corresponding to the discrete graphic card. The heat sink is provided with a front surface and a rear surface and is flat as a whole. A thermally-conductive base is provided on the front surface of the heat sink. A body portion of the heat sink consists of cooling fins parallel to each other and arranged at intervals. A flat and outward-facing surface of the thermally-conductive base is parallel affixed onto a GPU chip of the discrete graphics card. The rear surface of the heat sink parallel touches a surface of a partition in the computer chassis. The partition divides the space in the computer chassis into two. Computer hardware, comprising a mainboard, a hard drive, a power supply unit, and a fan, are mounted parallel to or parallel touch either or both surfaces of the partition. The discrete graphics card is arranged parallel to the partition. Also disclosed is a mounting and fixing structure for the discrete computer graphics card. The present invention allows for compatibility with various discrete graphics cards in an ultrathin chassis, increases the effective cooling area for the discrete graphic cards, and enhances the cooling performance of the discrete graphics cards.

Description

Heat dissipation structure and installation structure of computer independent graphics card

Technical field

The invention relates to the technical field of computer hardware devices, in particular to a technology for installing and dissipating a structure of a computer independent graphics card.

Background technique

The mainstream of the existing conventional desktop mainframe is the tower mainframe, and its overall shape is a rectangular parallelepiped. Desktop mainframes are available in both horizontal and vertical styles, which are generally the most common. All physical components in the main chassis are generally referred to as computer hardware, including motherboards, hard drives, CPUs, memory modules, discrete graphics cards, optical drives and power supplies, and various heat sinks. The existing tower mainframe is a non-thin chassis, which is large in size and heavy in weight.

1) Hardware arrangement and routing: At present, the hardware layout in the traditional desktop mainframe is designed to be able to install almost one type of computer hardware in one location space, so in order to meet more hardware support, a lot of settings are provided in the main chassis. The installation space of each hardware, when some hardware installation bits are not used, can only be idle there, which greatly wastes the space volume in the main chassis, so that the space utilization rate in the main chassis is very low.

Most of the data or power connections between the hardware in the mainframe of a conventional desktop computer are RVV wires, which connect the associated hardware through wires. However, due to the backward layout and routing in the traditional mainframe, and the various hardware, the connecting wires formed are criss-crossed, complicated and complicated. Not only do users need to have certain professional basic knowledge, but also seriously affect the use. The interior of the main chassis is beautiful, and various traces also greatly occupy the space volume inside the chassis. In the traditional mainframe, due to the unreasonable reason of the hardware arrangement, and the connection of ordinary wires, and the connection distance between hardware is not the shortest, the shortest connection cannot be achieved, because it is too short, ordinary The wires become thick and hard, so it is very inconvenient for the user to install and use.

2) Structure of the CPU heat sink and its installation: The traditional CPU heat sink uses 4 screws/expansion bayonet, through the CPU mounting hole on the motherboard, rigid or nearly rigid material, structural way to fix the CPU heat sink on the motherboard on. The following five problems often occur: First, because the screw/expansion pin is tightened too much, the force between the heat sink and the main board is too large, causing the main board to deform and bend to different degrees. Second, sometimes the four screws are unbalanced when they are tightened, causing a partial tilt between the surface of the CPU chip and the heat-conducting base of the heat sink, resulting in a fine gap, which greatly increases the CPU chip and the heat-conductive base of the heat sink. The thermal conductivity hinders heat transfer from the CPU chip to the heat sink. Third, the traditional CPU heatsink and the matching buckles and parts are numerous and complicated to install. Most of them take several minutes to ten minutes. Fourth, when some conventional CPU heat sinks are mounted on the motherboard, they cannot move or can only move in one direction. Cause sometimes There is a drawback that the CPU heatsink conflicts with the position of the components on some motherboards, but cannot be installed properly. Fifth, most traditional high-end CPU heat sinks can only increase the size of the heat sink in order to achieve better heat dissipation. This makes the compatibility of the large CPU heatsink to the mainframe and the motherboard greatly reduced, and the cost of user purchase is also significantly increased.

In addition, most of the CPUs used by ordinary users consume less than 100W of TDP power. However, considering the demanding requirements of top CPUs and overclocking users, the CPU heatsink can carry more than 180W. Therefore, higher requirements are placed on the performance of the heat sink.

3) Installation and heat dissipation of the discrete graphics card: The discrete graphics card in the traditional desktop mainframe, if it is a low-end graphics card, generally uses the original heatsink of the graphics card for heat dissipation. If it is a high-power high-end graphics card, either use a high-cost, cumbersome water cooling solution, or re-install a better air-cooled heat sink. However, most of the independent graphics air-cooled heat sinks on the market have a certain range of compatibility, or there are many matching parts and the installation process is cumbersome. And users who don't have a certain amount of expertise don't even know what kind of radiator should be chosen.

In the traditional desktop mainframe, the discrete graphics card has the following problems in terms of heat dissipation:

First, if the discrete graphics card is air-cooled, the size of the heat sink can hardly exceed the size range of the graphics card itself due to the limitation of the installation method and size specifications. And the matching fan also occupies a part of the volume of the heat sink, so the actual heat dissipation area of the heat sink is limited.

Second, if water cooling is used, the high cost will not be said. Water tanks, pumps, radiators, fans, water pipes, etc., which are compatible with water cooling, need to increase the size and weight of the chassis. And the installation is cumbersome, and the user needs to have a certain professional ability when installing water cooling.

Third, the discrete graphics card is perpendicular to the air inlet of the side panel of the chassis. If air cooling is adopted, the cold air flowing in from the air inlet is disturbed by the common disorder of the CPU cooling fan and the graphics card cooling fan on the main board, and the cold air outside the chassis cannot be completely and unidirectionally flowed through the independent graphics card radiator. Efficient heat dissipation, because the unscientific and tight air duct in the chassis, the cold air flowing into the independent graphics card and the CPU radiator is caught with the returning hot air, which affects the heat exchange effect of the radiator.

Fourth, the discrete graphics card heatsinks are placed in parallel horizontally, which is very unfavorable for the natural upward movement of the air heat flow.

The traditional desktop host, the discrete graphics card is directly inserted vertically into the motherboard's graphics card slot. Since the main board and the discrete graphics card are both large-sized hardware in the chassis, the space in which the two are vertically mounted is large in size. But this way is very compatible with the hardware.

4) Cooling air duct: The design of the cooling air duct in the traditional desktop mainframe is unscientific and disordered, and almost all of them have the phenomenon of returning hot air. And in order to increase the effect of CPU or discrete graphics card cooling, blindly increase the dispersion The size of the heater is solved. There is no simple and effective way to transfer and diffuse a part of the heat source by means of the metal casing of the chassis itself.

In addition, the fan speed and the noise generated by it have always been a major contradiction between air cooling and heat dissipation. The fan speed in a traditional desktop mainframe usually has two forms: one is a fixed speed, and the other is a temperature-controlled speed by connecting a motherboard PWM jack. The former, regardless of the temperature inside the chassis is always a speed, unscientific; the latter, the fan must first have a PWM function, and then enter the motherboard BISS to open, set, the user needs to have certain professional knowledge. Moreover, there are many types of fans, and if the fan in the PWM speed control mode is too noisy or the wind speed is too small, there is almost no way for the user to effectively adjust.

5) Power supply: The power supply box in the traditional desktop mainframe is large in size. Its function is to directly convert the input municipal AC power into DC output of different voltage values required by each hardware, and connect with each hardware by using many RVV wires, plus The design of the traditional mainframe is backward, which causes the various wires of the inner box of the mainframe to be densely packed and criss-crossed. This greatly wastes the space in the mainframe and affects the aesthetics of the mainframe, and also hinders the convenience of the user. .

Summary of the invention

To overcome the shortcomings of the design and technology of existing products, the present invention aims to provide a heat dissipation structure capable of improving the heat dissipation performance of a discrete graphics card.

A further objective is to reduce the space occupied by the discrete graphics card in the mainframe, and to increase the aesthetics of the discrete graphics in the mainframe.

The object of the present invention is to provide a computer-independent graphics card installation structure that is compatible with various independent graphics cards in an ultra-thin chassis, and increases the actual heat dissipation area and heat dissipation effect of the discrete graphics cards.

The invention is achieved by the following technical solutions:

The heat dissipation structure of the computer discrete graphics card includes a heat sink mounted on the discrete graphics card, wherein the heat sink has a front side and a back surface and is generally flat, and the front surface of the heat sink is provided with a heat conductive base, and the heat sink is The main body portion is composed of heat dissipating fins arranged in parallel with each other. The flat side of the heat conducting base is flatly attached to the GPU chip of the independent graphics card, and the back surface of the heat sink is in parallel with the partition surface of the mainframe of the computer. The partition divides the space of the mainframe of the computer into two parts, and installs computer hardware including a main board, a hard disk, a power supply box, and a fan in parallel or parallel on one or both sides of the partition, and the independent graphics card and the partition are arranged in parallel .

The heat sink further includes an arranged vacuum heat pipe, each vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded on the heat conductive base in an orderly manner. The condensing end of the vacuum heat pipe is extruded through a die into a semi-arc or flat cross section, which is closely attached to the heat sink. The fins, some or all of the condensation ends of the vacuum heat pipes are distributed on the back surface of the flat heat sink and are in parallel contact with the separator surface for heat conduction.

A condensation end of a portion of the vacuum heat pipe on the heat conducting base of the heat sink extends to the inner wall of the metal shell of the main body, and is closely attached to the inner wall of the metal shell of the main body in parallel.

The GPU chip of the foregoing discrete graphics card is vertically projected to the center of the back area of the PCB of the graphics card, and the insulating silica gel is pasted or placed. The pressure generated by the insulating silicone is pressed by the side panel of the mainframe of the computer to fix the heat conductive base of the heat sink. The flat side of the condensation end of the vacuum heat pipe distributed on the surface of the GPU chip of the discrete graphics card or the back surface of the heat sink is in close contact with the surface of the spacer to complete the conduction of thermal energy.

All fins are arranged in parallel with the I/O interface of the discrete graphics card 7 or at an angle of ≤ 45°, and all the fins are perpendicular to the spacer surface.

The following is the technical solution for the installation structure of the computer independent graphics card:

A computer independent graphics card installation structure, comprising a separate graphics card, a motherboard, an I/O interface group of a discrete graphics card, and an I/O interface group on the motherboard, an I/O interface group of the discrete graphics card, and an I/O on the motherboard The interface group refers to a separate graphics card and an input/output interface on the main board for connecting with a device external to the mainframe of the computer, wherein the PCB surface of the independent graphics card is disposed on the back of the motherboard parallel to the PCB surface of the motherboard, and the independent graphics card The socket of the upper I/O interface group is oriented in the same direction as the socket of the I/O interface group on the motherboard, and a heat sink is mounted on one side of the PCB of the independent graphics card, and the parallel display has a parallel heat conduction between the independent graphics card and the motherboard. a partition of the material, the partition divides the space of the mainframe of the computer into two, and installs computer hardware including a main board, a hard disk, a power supply box, and a fan in parallel or parallel on one or both sides of the partition, The heat sink is provided with a front surface and a back surface and is generally flat. The front surface of the heat sink is provided with a heat conducting base, and the main body portion of the heat sink is composed of heat radiating fins arranged in parallel with each other, and the heat conducting base is outwardly flat. The surface is flatly attached to the GPU chip of the discrete graphics card, and the back surface of the heat sink is in parallel with the surface of the partition plate. The side of the separate graphics card with the heat sink is opposite to the surface of the partition plate, and the PCB of the independent graphics card The other side of the heat sink is not mounted opposite the back of the motherboard and is adjacent to the side panel of the housing of the mainframe.

The edge of the PCB board on which the I/O interface group is located on the above-mentioned discrete graphics card is protruded in the direction of the I/O interface group socket from the edge of the PCB board where the I/O interface group on the motherboard is located at a distance of 15 to 40 mm. .

The foregoing discrete graphics card is connected to the corresponding graphics card slot on the motherboard through the interface matching paddle socket or the graphics card adapter card and the extension cable, and the gold finger interface on the independent graphics card is connected to the corresponding independent graphics card slot on the motherboard.

The heat sink further includes an arranged vacuum heat pipe, each vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded on the heat conductive base in an orderly manner. The condensing end of the vacuum heat pipe is extruded through a die into a semi-arc or flat cross section, which fits snugly The heat fins, some or all of the condensation ends of the vacuum heat pipes are distributed on the back surface of the flat heat sink and are in parallel contact with the separator surface for heat conduction.

The GPU chip of the foregoing discrete graphics card is vertically projected to the center of the back area of the PCB of the graphics card, and the insulating silica gel is pasted or placed. The pressure generated by the insulating silicone is pressed by the side panel of the mainframe of the computer to fix the heat conductive base of the heat sink. The flat side of the condensation end of the vacuum heat pipe distributed on the surface of the GPU chip of the discrete graphics card or the back surface of the heat sink is in close contact with the surface of the spacer to complete the conduction of thermal energy. The beneficial effects of the invention are:

The invention is mainly used for an ultra-thin vertical mainframe, which is about 1/6 of the size of a conventional desktop mainframe. In the case of fully loaded hardware, the mainframe is about half the weight of a conventional desktop mainframe. This ultra-thin vertical mainframe can meet almost all conventional motherboard models (such as ATX, M-ATX, ITX, etc.) on the market. It can be installed to support all 3.5-inch hard drives, 2.5-inch hard drives, and can be installed to support all full heights. , half-height, ultra-long, high-power discrete graphics, can be installed to support notebook optical drive within 14mm thickness. The hardware in the main chassis has been rearranged and the connection form is defined. There is a metal plate in the box, and the hardware is installed in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately. The main box has a matching integrated "U". The glyph slider housing (this slider housing is available in a transparent, translucent material) provides an extremely simple mode of operation for the user to open/close the main unit. The overall one has excellent heat dissipation performance and humanized one-button intelligent temperature control system. The CPU heatsink, discrete graphics heatsink, power supply box, and exhaust fan in this ultra-thin chassis are custom-sized models that match this chassis.

The invention is arranged on the back side of a partition plate (the side on which the main board is mounted on the partition plate is used as the front side of the partition plate), and in view of the requirement that the various materials mounted on the back side of the partition plate have parallel heat, there is a certain demand for heat dissipation, In addition to the recessed baffle circuit contacts that match the power box, power distribution module, and bulkhead socket mounting, the surface of the other areas on the back of the bulkhead is presented as a flat, thermally conductive metal plate.

The discrete graphics card of the present invention adopts a back-mounted installation structure:

1 Internal dispersion type: Its role is first, the parallel connection and close-range placement between the main board and the independent graphics card greatly reduce the occupied space volume. Second, because the I/O interfaces of the mid- to high-end discrete graphics cards are mostly double-layered, considering the need to fully compatible with all graphics cards, and to minimize the space occupied by them, it is ingenious to I/ on the discrete graphics card. The O interface area is partially translated out of the west end of the motherboard. In addition, there is no barrier between the I/O interface area of the discrete graphics card and the motherboard, so that the I/O interface of the discrete graphics card is single-layer or double-layer, which does not affect its installation and use in the chassis. As good compatibility as a traditional chassis.

2 external dispersion: its role is the first, the motherboard and the independent graphics card use parallel, close-range placement, greatly reducing the occupied space. Second, the biggest advantage of this method is that you do not need to modify the radiator and fan of the discrete graphics card, you can use the original radiator and fan of the discrete graphics card. And this way is very compatible. The disadvantage is that the required chassis space is larger than the "inside" type.

Internally-distributed discrete graphics card heatsink: its role is first, the internal-scattering discrete graphics card heatsink is thin and flat, occupying a small volume. Second, since the heat sink is intimately contacted with the metal partition or the inner wall of the metal casing of the case through the condensation section of the vacuum heat pipe, and the graphics card heatsink fan is not mounted on the heat sink, there is no additional space for occupying the heat sink. Therefore, the actual heat dissipation area of the discrete graphics card is greatly increased. Third, due to the heat dissipation of the metal separator and the chassis metal casing itself, the material cost and the quality of the graphics card heatsink are greatly saved. Fourth, because the strip-shaped fins of the graphics card heat sink have a certain angle of inclination with the geographical vertical direction, it is beneficial to the natural upward lift of the air heat flow.

The fixing method between the scattered independent graphics card heat sink and the independent graphics card of the invention: the traditional desktop mainframe, the independent graphics card is directly inserted vertically in the graphics card slot of the motherboard. Since the main board and the discrete graphics card are both large-sized hardware in the chassis, the space in which the two are vertically mounted is large in size. But this way is very compatible with the hardware.

It has the following functions: First, the fixed heat sink achieves a historic speed in the ease of installation with a discrete graphics card, and is installed in almost one second. Secondly, the fixed heat sink is pressed by the elastic silicone pad to vertically project the GPU chip to the center of the back of the graphics card PCB, so that the surface of the GPU chip is flat on the front surface of the heat conductive base. Because of the central force, the force between the GPU chip and the thermal base is naturally balanced. Third, the user no longer has to worry about the heat transfer effect caused by the uneven force of the four screws when installing the conventional heat sink. Fourth, because some computer mainframes are used for centralized or nuclear display, there is no separate graphics card in the host. At this time, the position of the discrete graphics card on the partition is idle. Other computer hardware such as a hard disk, a power supply box, an optical drive, etc. can be installed at this position parallel to the partition surface according to the needs of the user.

DRAWINGS

FIG. 1 is a schematic structural diagram of a computer case in use according to an embodiment of the present invention; FIG.

Figure 9‐12 is a schematic view showing the structure of the partition of the computer case;

Figure 13 is a schematic view showing the structure of a computer case with a sliding cover;

Figure 14 is a schematic view of the structure of the slider;

Figure 15 is a schematic view showing the installation structure when the display card of the embodiment of the present invention is mounted on the partition plate;

Figure 16 is a schematic structural view of the graphics card in the embodiment of the present invention installed on the partition plate;

17 is a schematic structural view of a discrete graphics card heat sink according to an embodiment of the present invention;

Figure 18 is a schematic structural view of a power supply box;

Figure 19 is a schematic structural view of a power distribution module;

Figure 20 is a schematic structural view of a movable partition socket;

21 is a schematic structural view of a CPU heat sink when installed;

Figure 22 is a schematic view showing the structure of a mounting and fixing device for a CPU heat sink.

The following is a description of the logo in each figure:

1, the main box shell; 11, the top of the main box shell; 12, the bottom of the main box shell; 13, the tail of the main box shell; 14, the side top air inlet; 15, the bottom of the box air inlet; 16, the main board I / O block Plate partition card slot; 17, exhaust air opening; 18, manual adjustment switch;

2, slide cover; 21, slide front panel (front of the chassis shell); 22, CPU air inlet; 23, graphics card air inlet; 24, into the disc opening; 25, dust-proof net;

3, partition; 31, main board support column; 32, partition circuit; 33, concave contact point; 34, fixed partition socket; 35, movable partition socket; 36, positioning hole; 37, temperature probe ; 38, ventilation holes; 39, graphics card windshield;

4, motherboard; 41, motherboard I / O interface group; 42, CPU chip; 43, PCI‐E / graphics card slot; 44, memory slot; 45, motherboard main power supply slot; 46, motherboard auxiliary power supply slot ; 47, motherboard mounting hole;

5, the buckle; 51, the support column, also known as the buckle support column; 52, the sliding rod; 53, the bridge pressure rod; 54, the expansion pin;

6, CPU heatsink; 61, (CPU) thermal base; 62, (CPU) vacuum heat pipe; 63, (CPU) heat sink fins; 64, CPU additional heatsink;

7, discrete graphics; 70, discrete graphics PCB; 71, discrete graphics I / O interface group; 72, GPU chip; 73, independent graphics card auxiliary power supply slot; 74, (independent graphics) gold finger;

8, independent graphics card radiator; 81, (independent graphics card radiator) thermal base; 82, (independent graphics card radiator) vacuum heat pipe; 83, (independent graphics card radiator) cooling fins;

9, power box; 91, bottom; 92, output port; 93, contact copper; 94, positioning pin;

10, power distribution module; 101, (the bottom of the power distribution module); 102, DC input port; 103, DC output port; 104, shrapnel;

201, fan; 202, 2.5-inch hard disk; 203, hard disk; 204, optical drive; 205, expansion socket; 206, silicone pad; 208, motherboard I / O baffle.

detailed description

The present invention is further described below in conjunction with the accompanying drawings:

The computer mainframe is referred to as the computer case.

As shown in Figure 1-14, a computer case includes a main chassis 1 frame and a computer hardware, wherein the computer hardware includes a motherboard 4, a hard disk 203/power box 9 and a corresponding heat sink, and the main chassis 1/skeleton is provided. There is a partition 3 which divides the cavity formed by the main casing 1/skeleton into two, and the main plate 4 is fixed on one side of the partition 3, which is the front surface of the partition 3. A hard disk 203/power supply box 9 is provided on the other side of the partition 3, which is the back surface of the partition 3. The main board 4, the hard disk 203/the power supply box 9 are all parallel to the side of the partition 3, and the circuit is provided on the front side or/and the back side of the partition 3 or the partition 3, and the partition 3 is provided with a circuit for connecting the computer hardware. Board socket. When the separator 3 is made of a metal material, it is called a metal separator.

The mainframe of the computer is a vertical ultra-thin computer mainframe, and the overall outline is a flat square body, but the partial corners and planes have different angles or configurations, and the volume is about 1/6 of that of a conventional PC mainframe, and the hardware is fully loaded. In this case, this ultra-thin host is about half the weight of a traditional PC mainframe. At the same time, you can install motherboard 4 models (such as: ATX, M-ATX, ITX, etc.) that support almost all PCs currently on the market. An optical drive 204 is mounted on the partition 3, and a notebook optical drive 204 supporting a thickness of 14 mm is preferentially mounted. The hardware in this ultra-thin host has been rearranged and the connection form definition. There is a metal plate in the box, and the hardware is installed in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately; this ultra-thin host has a matching integrated "U" The glyph slide 2 housing (this slider 2 housing can be a transparent, translucent material) provides an extremely simple operating mode for the user to open/close the main unit. The front surface of the partition plate 3 is further provided with a main board support column 31 (on which the main board 4 is mounted), a partition 3 invisible circuit, a partition socket, a CPU heat sink 6 buckle 5, a CUP additional heat sink, an inner wall expansion socket 205, and a main board. I/O baffle spacer card slot 16.

The specific structure is as follows:

01) Main board support column 31

The front surface of the partition plate 3 is provided with a main plate support column 31, and the main plate 4 is fixed to the surface of the partition plate 3 through the main plate support column 31. The main board support column 31 has an internal thread hole perpendicular to the plate surface of the partition plate 3 or a bayonet hole matched with the expansion bayonet. The main board support column 31 suspends the main board 4 in parallel on the front surface of the partition plate 3, and the main board 4 The back surface is opposite to the front surface of the partition plate 3, and the main plate 4 is fixed in the main plate support column 31 on the partition plate 3 by screws or expansion bayons. The main board 4 and the partition 3 are suspended so that the protruding pins on the circuit board on the back side of the main board 4 do not come into contact with the surface of the partition 3 to cause a short circuit.

A plurality of main board support columns 31 are disposed on the front surface of the partition plate 3, and the height of the board surface of the partition plate 3 is 4-7 mm, and the distribution positions of the main board support columns 31 are opposite to the mounting holes of the corresponding supporting main board 4. One by one match. The main board support column 31 is made of a conductive metal material and is fastened and electrically connected to the partition plate 3.

The main board support column 31 in the present application not only has the function of the main board support column 31 in the conventional chassis, Also, because the ultra-thin PC main box is designed as the main body of the DC negative/ground bearing of the whole machine, the mounting hole of the conventional main board is connected with the output DC negative pole and the ground of the main board 4, the conductive screw or the bayonet The motherboard main body mounting hole 47 is fixed in the main board support column 31 on the partition plate 3, that is, the direct connection between the output DC negative pole/ground of the main board 4 and the partition plate 3 is realized.

02) Separator 3 with stealth circuit

The above circuit is a flat conductor circuit and the maximum thickness of the conductor is ≤0.5 mm, and the flat conductor circuit and the separator 3 are insulated from each other, and the surface height of the flat conductor circuit is not higher than the height of the surface of the partition plate 3 around it, except for the socket. The entire surface of the circuit outside the area is covered by an insulating and wear-resistant layer. A plurality of pieces of hardware are mounted in parallel on both sides of the partition plate 3, and most of the wires connected between the respective hardware are covered on the surface of the partition plate 3 or embedded in the partition plate 3 by the above-mentioned very flat conductor circuit, and are densely packed. Arrangement and centralized routing, effectively solve the signal and power transmission between hardware, rearrange the hardware, and greatly reduce the size of the chassis.

The partition plate 3 is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate 3, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate 3, an ultra-thin insulating copper plate embedded partition plate 3 or a metal base. Conductive coated circuit separator 3. A platform for mounting fixed supports can be provided for each hardware.

Preferably, the separator 3 is a glass fiber/semi-glass fiber-based printed circuit-embedded separator 3, wherein the glass fiber/semi-glass fiber is a substrate, and the glass fiber/semi-glass is formed to meet the design requirements of the circuit wiring and the physical shape. The fiber-based PCB circuit board, the partition plate 3 is a metal plate made of aluminum alloy or copper, and a groove which is opposite to the shape and size of the corresponding PCB circuit board is processed at a position of one or both sides of the partition plate 3, The PCB circuit board is closely attached to the corresponding recess in the partition 3, so that the surface of the PCB circuit board is at the same plane height as the surface of the partition 3 on which it is placed. Since the flat conductor circuit on the separator 3 is closely integrated with the separator 3, the entire circuit surface is covered with the insulating layer and the wear layer except for the solder joints and the contact points of the circuit, so that almost no visible is observed. The circuit on the spacer 3 is collectively referred to as "invisible circuit spacer 3". The flat conductor circuit on the hidden circuit board 3 is hereinafter referred to as "separator circuit 32". The partition 3 of the embedded PCB circuit board is covered with an insulating layer and a wear layer.

The specific operation process is to process a groove having a depth of 0.1 to 1 mm on the partition plate 3. The position, shape and size of the groove are determined according to the specific requirements of the wire, and then the ultra-thin printed integrated PCB circuit board is filled to the concave surface. In the groove, the groove of the separator 3 and the surface of the PCB circuit board are insulated and coated, and the PCB circuit board is seamlessly fastened in the corresponding groove of the separator 3 by an adhesive. After tightening, the surface height of the PCB circuit board is basically the same as the height of the board surface of the partition plate 3, and finally the insulating and wear-resistant coating is applied on the entire surface of the partition plate 3 in which the PCB circuit board is fastened. Therefore, the partition 3 is integrated with the surface of the PCB circuit board, and the circuit inside is hardly seen.

Since the heat dissipation and heat dissipation of the back surface of the separator 3 is required, and the simplified design and process are integrated, the PCB circuit board is uniformly embedded in the front surface of the separator 3.

Preferably, the partition plate 3 is an ultra-thin insulating copper sheet embedded with the partition plate 3, that is, a process of etching, CNC milling or die-molding, and processing the position of the metal plate (separator 3) where the wires need to be routed. The desired shape and size of the groove. The copper sheet with a thickness of 0.05-0.5 mm is made into various traces required for the design by etching or die stamping and shearing process, and the outermost contour specifications of the copper traces are densely arranged and the metal The shape and size of the grooves on the flat plate (separator 3) match. The groove on the metal plate (separator 3) and the processed ultra-thin copper piece are routed, the surface is insulated, and finally the ultra-thin insulating copper piece is closely embedded in the metal plate (separator 3) by an adhesive. In the corresponding groove position, the surface height of the ultra-thin copper wire is not higher than the surface height of the surrounding metal plate (separator 3). This process scheme is suitable for designing circuit traces for discharging excessive current on a metal plate (separator 3).

Preferably, the partition 3 is an FPC flexible wire interposing partition 3, except that the embedded circuit material is an FPC flexible wire row, and other processes embedded in the separator 3 and the above-mentioned "glass fiber/semi-glass fiber base printing" The circuit board embedded partition 3" is basically the same.

Preferably, the separator 3 is a metal-based conductive coating circuit separator 3, that is, the metal surface is covered with an insulating layer, and then the liquid/colloidal/powder conductive coating is used to paint the desired trace circuit on the insulating layer. After curing by air drying or high temperature, a stable conductive circuit coating is formed, and finally the insulation and wear layer are covered on the entire circuit board 3 (except for the partial area connected to the bulkhead socket). The coatings and processes used in this solution are relatively expensive.

The partition plate 3 is made of the same material as the metal casing or the skeleton of the computer case, and is integrally formed by heat-melting or squeezing the material through a mold. The metal frame or casing of the partition 3 and the computer case may also be separated and separated, and the partition 3 is welded and fixed to the metal frame of the case or the inner wall of the case. Because the partition 3 is connected to the metal casing of the casing, it provides good heat conduction and heat dissipation support for the hardware that is mounted in parallel on the surface of the partition 3 in parallel. The above-mentioned "metal casing of the chassis" is the "main casing 1" in the figure.

The process of the separator 3 having the metal invisible circuit fixedly connected with the metal casing or the skeleton of the main box is: an integral type, that is, the partition 3 is integrated with the metal casing or the skeleton of the main box, and the material is thermally melted by a mold. Or integrally formed after extrusion. Then, the process is processed on the partition 3 in the formed main box, so that the ultra-thin circuit traces required for the design are arranged on/in the partition 3; the reflow soldering, the partition 3 and the metal frame or the outer casing of the chassis are Separate and independent, the ultra-thin circuit traces required for the design have been processed on/in the separator 3, and then the parts to be connected and fixed to the metal frame of the chassis or the inner wall of the case are soldered first, and the combination is matched. After that, it is placed in a reflow device for reflow soldering. After cooling out, the partition 3 is tightly fixed to the metal frame or casing of the chassis.

03) partition socket

The separator socket is directly soldered or contacted to the circuit of the corresponding partition 3. The hardware interface type of the partition socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk 203 interface, SAS hard disk 203 interface, SATA 7 +15pin data + power supply hard disk 203 interface, SATA 7+6pin data + power supply optical drive 204 interface, motherboard 4 boot pin POWER SW, motherboard 4 restart pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin Socket, motherboard 4 audio pin HD AUDIO, discrete graphics card PCI-E 16X slot, motherboard 4 main power supply 24pin slot, motherboard 4 auxiliary power supply 4/8pin slot and independent graphics card 7 auxiliary power supply 6 / 8pin slot, or any combination of the above hardware interfaces. Some hardware in the main chassis can be directly inserted into the bulkhead socket, and some need to connect the hardware to the corresponding bulkhead socket through the FFC wire row. Therefore, the bulkhead socket has different connections for matching with the hardware. Interface type and shape size. The bulkhead socket interfaces the hardware in the main chassis with the corresponding bulkhead circuit 32 according to the interface type of the different hardware. The advantage of the FFC line is that it is ultra-thin, soft, accurate, and capable of passing large currents. It is suitable for short-distance docking between the bulkhead and the hardware.

The "separator socket" described above is a general term for the following "welded/fixed bulkhead socket" and "movable bulkhead socket".

The bulkhead sockets are divided into welded and movable types according to the layout and design requirements in the chassis. The bottom of the "separator socket" is arranged with the corresponding pins (pins) of the socket. The corresponding mounting position of the spacer circuit 32 has solder joints, and the pins (pins) at the bottom of the "separator socket" are arranged. Direct soldering is fixed to the solder joint location of the corresponding spacer circuit 32. The welded bulkhead socket is also referred to as a fixed bulkhead receptacle 34.

In the movable type, the bottom of the "baffle socket" is arranged with the corresponding pins (pins) of the socket, and these pins (pins) are in the form of exposed conductive metal domes 104, and the metal at the bottom of the "separator socket" There are a plurality of positioning pins 94 around the shrapnel 104. The movable bulkhead socket 35 is generally used for the design of different hardware in the same partition 3 position, that is, to increase the number and type of hardware that can be extended in the chassis without increasing the volume of the chassis.

The area on the bulkhead circuit 32 for mounting the "moving bulkhead receptacle 35" has a concave configuration 33 in which the exposed conductive, flat circuit contacts are arranged in an orderly manner, said "circuit contact point". It is the "concave contact point 33" in the figure. There are a plurality of positioning holes 36 in the partition 3 on the outer periphery of the concave area, and the size, the number, and the hole distance of the positioning holes 36 are completely identical with the matching positioning pins 94 at the bottom of the "moving bulkhead socket 35". .

When the bottom of the movable bulkhead receptacle 35 faces the mounting area on the bulkhead circuit 32, only the contact points of the circuit contacts in the recessed area of the movable bulkhead receptacle 35 of the interface type and the bulkhead circuit 32 are arranged. When the circuit definition and the socket direction are completely matched, the positioning pin 94 at the bottom of the movable partition socket 35 It can be inserted into the positioning hole 36 of the concave area of the partition circuit 32, and finally the movable partition socket 35 is fixed on the partition 3 by the screw/expansion bayonet, at this time the bottom of the "moving partition socket 35" The conductive metal dome 104 and the circuit contacts in the recessed area on the spacer circuit 32 are in complete and precise contact with each other. Since the mounting position of the movable partition socket 35 on the partition circuit 32 is an inner concave portion, there is a bare circuit contact point in the concave portion, and the bare circuit in the concave portion is when other hardware is mounted at the same position. The surface height of the contact point is lower than the height of the surface of the surrounding partition 3, so that a short circuit is not caused by touching other hardware. When the recessed area is not used, the recessed area can be filled with a matching insulating patch to isolate insulation and dust.

Briefly, the bottom of the spacer socket is arranged with the corresponding pins of the socket, and the corresponding mounting position of the spacer circuit 32 has soldering points, and the pins at the bottom of the spacer socket are directly soldered and fixed to the corresponding spacers. The board circuit 32 is positioned; or the bottom of the bulkhead socket is arranged with the corresponding pins of the socket, and the pins are present in the form of bare conductive metal domes 104 around the shrapnel 104 at the bottom of the bulkhead socket. The positioning pin 94 is disposed, and the area for mounting the partition socket on the partition 3 has a concave structure, and the exposed conductive and flat circuit contact points are arranged in the concave area, outside the concave area. The peripheral partition plate 3 is provided with a corresponding positioning hole 36. The partition socket is fixed on the partition plate 3 by a screw/expansion bayonet, and the conductive metal dome 104 at the bottom of the partition socket and the circuit in the concave area on the partition plate 3 The contact points are precisely touched and turned on.

Some hardware in the main chassis can be directly inserted into the "separator socket", such as the 3.5-inch, 2.5-inch hard disk 202, because it is the hardware used more often, so that the design can be directly plugged in, very fast and user-friendly. Hardware that can't be plugged directly into the "baffle socket" uses the concept of the shortest threaded connection, and the cable is used to connect the hardware to the matching "baffle socket", which also greatly reduces the routing between hardware. Make the whole machine simple and beautiful.

04) Motherboard 4 orientation

As described above, the main board 4 is backed by the front surface of the partition plate 3 and is fixed in parallel to the main plate support column 31 on the front surface of the partition plate 3. Because the main box is a vertical design, on the one hand, the center of gravity of the whole machine should be moved down as much as possible, and the end of the main board 4 close to the CPU position is obviously biased, and the downward placement can lower the overall center of gravity of the main box, so that the main box On the other hand, the main box is vertical, and the air heat flow inside it is continuously rising, and is concentrated in the upper space of the main box. Compared with the upper air flow, the temperature of the lower airflow of the main box is required. It is low, so it is placed close to the north end of the motherboard 4 near the CPU, which is more conducive to the heat dissipation effect of the CPU heat sink 6 in the airflow.

Therefore, the north end side of the main board 4 near the CPU position is downward (can be vertical, or the angle between the downward direction and the vertical direction is ≤ 5°), and the west end side of the main board 4 (ie, one end of the main board I/O interface group 41) Towards the tail of the chassis In the portion 13, the back surface of the main board 4 faces the front surface of the partition plate 3, and is fixed to the main board support column 31 parallel to the partition plate 3. Due to the angular position between the north end side and the west end side of the main board 4, there is a main board auxiliary power supply slot 46, which is projected on the front side of the main board 4 on the front side of the main board 4 on the front side of the main board 4, close to this. The partition 3 of the main board auxiliary power supply slot 46 has a bulkhead socket at the front side. The bottom pin (pin) of the baffle socket is sequentially connected to the output +12V DC and the DC negative (ground) in the baffle circuit 32, and is inserted into the main board auxiliary power supply slot 46 on the main board 4 through one end of the wire. The other end of the wire is inserted into the bulkhead socket for communication, so that the corresponding power supply circuit on the partition 3 communicates with the main board auxiliary power supply slot 46 on the main board 4.

That is, the main board 4 is backed by the front side of the partition 3, the north end side of the main board 4 near the CPU position faces downward, and the west end of the main board 4, that is, one end of the main board I/O interface group 41 faces the tail of the chassis.

Projected on the north end of the main board 4 to the area on the front surface of the partition 3, a partition socket is disposed on the front side of the partition 3 adjacent to the auxiliary power supply slot of the main board 4, and the bottom stitch of the partition socket is connected to the partition circuit 32. One end of the wire is inserted into the motherboard auxiliary power supply slot 46 on the main board 4, and the other end of the wire is inserted into the bulkhead socket to connect the corresponding power supply circuit of the partition 3 to the main board auxiliary power supply slot 46 on the main board 4. .

05) CPU heat sink and CPU heat sink mounting fixture

The heat sink of the computer CPU includes a CPU additional heat sink 64 and a CPU heat sink 6. The CPU heat sink 6 is fixed by an H-bridge clamp device, that is, the mounting and fixing device of the CPU heat sink, the H-bridge press buckle The bracket comprises two sliding rods 52. The middle sections of the two sliding rods 52 are parallel to each other, and the two sliding rods 52 are bent at both ends, and are at an angle of 45° outward, at the two ends of the two sliding rods 52. Each of the bent sections has a support post 51 movable on the section. The bottom of the support post 51 has an expansion chuck. The size and shape of the expansion chuck are the same as the CPU heat sink 6 on the main board 4. The mounting holes are matched. Then, there are four movable support columns 51 at the two ends of the two sliding rods 52. Because of different types of the main board 4, the hole spacing between the mounting holes of the four CPU heat sinks 6 is different, so the sliding rod 52 is different. The support columns 51 at both ends are designed to be movable, and can meet the hole spacing requirements of various CPU heat sink 6 mounting holes, and are matched and fixed. The H-type bridge buckle bracket is the aforementioned buckle 5. The support post 51 is also referred to as a clip support post.

A bridge bar 53 which is freely movable in the direction of the axis of the two slide bars 52 is provided in a section parallel to the middle of the two slide bars 52, and the intermediate section of the bridge bar 53 has an inner groove structure. The two sliding rods 52 are resilient material members or the bridge pressing rods 53 are resilient material members. Since the sliding rod 52 of the buckle 5, the bridge pressing rod 53 and even the convex structure on the back surface of the heat-conducting base are resilient material, the heat-conducting base and the CPU chip are not caused by excessive force or imbalance during manual fastening. 42 guide between surfaces If the thermal coefficient changes too much, it is not easy to deform and bend the main board 4. The two sliding rods 52 and the bridge pressing rods 53 are combined to form the "H" type structure, so the fastener 5 of the CPU is referred to as an "H-shaped bridge fastener bracket".

One end of the CPU additional heat sink 64 is a flat vacuum heat pipe evaporation end, and the other end is a vacuum heat pipe condensation end to which the (CPU) heat sink fin 63 is welded, and the CPU is attached to the heat sink 64. The corrugated tube greatly enhances the flexibility of the (CPU) vacuum heat pipe 62, making it easier for the user to operate and adapt to different types of motherboards 4. The bottom of the condensation end of the CPU additional heat sink 64 is flat, and is fixed on the inner wall of the metal casing of the chassis closest to the CPU by screws or snaps, thereby transferring part of the heat of the CPU heat-conducting base 61 to the metal casing of the chassis and the CPU is attached. The heat sink fins on the condensation end of the heat sink 64 dissipate heat.

The CPU heat sink 6 is a vacuum heat pipe type heat sink, and the bottom of the CPU heat sink 6 has a heat conducting base mounted on the CPU chip 42. On the edge of the heat-conducting base of the CPU heat sink 6, there is a groove perpendicular to the direction of the vacuum heat pipe arranged on the heat-conducting base, and the shape of the groove is just matched with the evaporation end of the CPU additional heat sink 64, the CPU After the evaporating end of the additional heat sink 64 fits into the groove of the edge of the heat-conducting base, it is fastened to the edge of the heat-conducting base by a cover plate and a screw. The front side of the thermally conductive base is directly parallel to the surface of the CPU chip 42. The substantially central position of the back surface of the heat-conducting base has a convex structure, and the concave sliding groove of the middle portion of the bridge pressing rod 53 can just buckle the protruding structure, and the bridge pressing rod 53 is placed on the back surface of the heat-conductive base. Since the bridge pressing rod 53 of the buckle 5 passes through the convex structure at the center of the back surface of the heat-conducting base, the downward pressure generated when the buckle 5 is tightened is concentrated on the central area of the heat-conductive base, so that the heat-conductive base and the CPU chip 42 are The contact surfaces are evenly stressed, making the thermal conductivity between them stable.

The heat conducting base is attached to the CPU chip 42 by a protruding structure that is fastened to the back surface thereof by the bridge pressing rod 53, and the bridge pressing rod 53 is movably fixed to the two sliding rods 52, and the two sliding rods 52 are movable. The chucks on the support columns 51 are respectively inserted into the mounting holes of the four CPU heat sinks 6 on the main board 4, and finally the expansion pins 54 are inserted into the pin holes supported therein, thereby the entire clip 5 brackets together with the CPU heat sink 6 Fastened together on the main board 4. Since the convex structure on the back surface of the heat conducting base can move in the concave sliding rail groove in the bridge pressing rod 53, the bridge pressing rod 53 can move on the sliding rod 52, so that the entire CPU heat sink 6 can be small in any direction in the plane of the main board 4. The translation of the range greatly reduces the chance that the edge of the CPU heat sink 6 will not be properly installed due to the conflict with the position of the components on the motherboard 4.

The CPU additional heat sink 64 adopts a movable installation mode, and the user can freely select whether to install according to requirements, without replacing the entire CPU heat sink 6, which greatly saves the user's economic expenses. Although the main chassis is small in size, it cleverly utilizes the metal casing of the chassis to quickly transfer part of the CPU heat to the casing for heat dissipation, which greatly increases the effective area of heat dissipation.

Since the buckle 5 bracket adopts a movable fixed design in many places, it is almost compatible with all conventional motherboard models. The buckle 5 has few accessories and light weight, and the disassembly and assembly operation is extremely convenient, and the disassembly and assembly can be completed in 10 seconds.

Moreover, the bottom 12 of the ultra-thin PC main box casing has an elongated strip-shaped air inlet opening, which increases the airflow exchange around the bottom plate of the chassis; and because of this long opening, the partition 3 is greatly hindered. The heat on the chassis floor area in the front space is transferred to the chassis floor area of the back space of the partition 3 and the partition 3 itself, so that the CPU attached to the chassis floor installed in the front space of the partition 3 is attached with the heat sink 64. The heat transferred can be taken away by the airflow more quickly, and it will not be transmitted to other parts of the chassis and affect the heat dissipation of other hardware.

06) inner wall expansion socket 205

The computer chassis is vertical. The motherboard 4 is placed close to the CPU end, that is, the north end of the motherboard 4 is placed downward. The south end of the motherboard 4 is upward. The inner wall of the chassis near the south end of the motherboard 4 is the top inner wall of the chassis, and the inner wall is vertically higher than the main board. 4 In the long strip-shaped area of 15~45mm on the front side, a long strip-shaped socket is arranged to form an inner wall expansion socket 205, and the inner wall expansion socket 205 includes three interfaces, a DC+5V, DC negative power supply interface. , 7+6pin SATA optical drive 204 interface and 7+15pin SATA hard drive interface.

The inner wall expansion socket 205 adopts a long strip PCB circuit board to concentrate the wires, the long strip PCB circuit board closely fits the inner wall of the chassis, the circuit board portion extends to the edge of the front surface of the partition plate 3, and the extension portion of the long strip PCB circuit board The circuit is connected to the corresponding circuit on the partition 3, and is fixed by welding. The pins on the bottom of the interface socket are fixed on the corresponding circuit of the long PCB circuit board by soldering or contact, and the socket interface is oriented parallel to the surface of the partition 3.

Considering the computer hardware of the optical drive 204, most users use the frequency very low, so the user-friendly "inner wall expansion socket 205" is designed to be an active installation type, and the user can select whether to install according to his own use requirements.

When the notebook optical drive 204 or the 2.5-inch hard disk 202 is inserted into the inner wall expansion socket 205, the notebook optical drive 204 or the 2.5-inch hard disk 202 is parallel to the main board 4 and is located above the south end side of the main board 4. Considering the practicability, the input port of the notebook optical drive 204 faces the front of the main chassis. Cleverly and efficiently utilized the free space above the south end of the motherboard 4, since the notebook optical drive 204 and the 2.5-inch hard disk 202 are very light and low in heat generation, the influence on the center of gravity and heat dissipation of the entire chassis can be neglected. In addition, since the motherboard 4 has a lot of pins, slots and wires on the south end side, the effect is beautiful, and the notebook optical drive 204 and the 2.5-inch hard disk 202 which are installed in parallel at the position of the main board 4 can be subtly blocked and the whole chassis can be shielded. The arrangement is more beautiful.

07) Main board I/O bezel partition card slot 16

Projecting the edge portion of the main board 4 where the I/O interface group is located on the west end of the main board 4 to the partition 3 The main board I/O baffle partition slot 16 is provided, and the slot is a straight groove/hole slit having a slit width of about 1 mm and a seam depth of 2 to 3 mm, and the total length of the slot/opening ≥ the main board The total length of the I/O baffle 208 (the main board 4 tailgate) is inserted into the long side of the main board I/O bezel 208 (the main board 4 rear bezel) before the main board 4 is loaded into the main unit. In the recess/hole of the partition 3, the entire motherboard I/O baffle 208 (the main board 4 tailgate) is snapped into the main board I/O baffle 208 (the main board 4 tailgate) at the rear of the chassis to match Fixed in the opening. Since the mainframe adopts the ultra-thin design concept, in order to minimize the height space required for the motherboard 4 in the chassis, the motherboard I/O barrier 208 (the motherboard 4 tailgate) is close to the back of the motherboard 4. One side snaps into the slot of the partition 3 and is mounted in a manner that is as simple as a conventional chassis.

The hardware installed in the space on the back side of the partition 3 includes a separate graphics card 7 including a heat sink, a power supply box 9, a turbo fan 201, a hard disk 203, and a power distribution module 10, all of which are mounted in parallel on the partition 3, due to the parallel stickers. A variety of hardware mounted on the back of the partition 3 has a certain requirement for heat dissipation, so that the back surface of the partition 3 is in contact with the concave partition circuit 32 which is matched with the power supply box 9, the partition socket, and the power distribution module 10. In addition, the surface of the other areas on the back side of the spacer 3 is presented as a flat, thermally conductive metal plate. The specific structure is as follows:

08) Standalone graphics card 7

The discrete graphics card 7 is disposed in parallel with the back surface of the spacer 3. This ultra-thin computer chassis can be installed to support all full-height, half-height, ultra-long, high-power discrete graphics cards7. The I/O interface on the discrete graphics card 7 is oriented the same as the I/O interface on the motherboard 4, and the I/O interface area on the discrete graphics card 7 is offset from the edge of the motherboard 4 PCB board, and the edge of the motherboard 4 PCB is set. The edge of the PCB board of the /O interface, that is, the west end edge of the motherboard 4. The above-mentioned "I/O interface on the discrete graphics card 7" is the "independent graphics I/O interface group 71" in the figure, and the above "I/O interface on the motherboard 4" is the "mainboard I/O interface group 41" in the figure. ".

Parallel installation of the discrete graphics card 7 on the back of the motherboard 4 includes the following two forms:

1 Internal dispersion type: There is a parallel heat conduction material partition plate 3 between the independent graphics card 7 and the main board 4. The side of the independent graphics card 7 with the heat sink is opposite to the surface of the partition plate 3, and the PCB surface of the independent graphics card 7 is close to The side panel of the outer casing of the computer case, that is, one side of the slide cover 2 in FIG. The "PCB board of the discrete graphics card 7" is the "independent graphics card PCB board 70" in the figure. The end side of the PCB board on which the I/O interface group 71 on the discrete graphics card 7 is located is oriented in the direction in which the I/O interface is oriented, and the end side of the PCB board on which the I/O interface group on the main board 4 is located 15 ~40mm distance. The motherboard 4 and the PCB card of the discrete graphics card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space volume.

Specifically, there is a metal plate between the discrete graphics card 7 and the motherboard 4, that is, the motherboard 4 is mounted parallel to one side of the metal plate, the metal plate is opposite to the back surface of the motherboard 4, and the independent graphics card 7 is mounted in parallel on the other side of the metal plate. The discrete graphics card 7 has a facing metal plate of the GPU chip 72 and a discrete graphics card. 7 is placed in parallel on the back side of the main board 4 near the south end side.

As described above, the 7I/O interface of the discrete graphics card is oriented in the same direction as the 4I/O interface of the motherboard, and in the direction in which their I/O interfaces are oriented, the edge of the PCB board where the independent graphics card 7I/O interface is located protrudes from the motherboard 4I/ The distance between the edge of the PCB board where the O interface is located is 15 to 40 mm, that is, the I/O interface area on the discrete graphics card 7 is translated to the west end of the motherboard 4. Moreover, there is no partition 3 between the portion of the independent graphics card 7I/O interface area protruding from the west end of the main board 4 and the main board 4. Since the I/O interfaces of the high-end discrete graphics card 7 are mostly double-layered, it is ingenious to separate the I/O on the discrete graphics card 7 in consideration of being fully compatible with all the graphics cards and minimizing the space occupied by the graphics card. The interface area is partially translated out of the west end of the motherboard 4. In addition, there is no barrier between the 7I/O interface area of the discrete graphics card and the motherboard 4, so that the I/O interface of the discrete graphics card 7 is single-layer or double-layer, which does not affect its installation in the chassis. , to achieve the same good compatibility with the traditional chassis. The discrete graphics card 7 communicates with the corresponding graphics card slot 43 on the motherboard 4 through a riser card or an extension cable.

2 External type: The side (back side) on which the heat sink cannot be mounted on the discrete graphics board PCB board 70 faces the back of the motherboard 4. The board 4 and the discrete graphics card 7 do not necessarily have the partition 3, and the PCB board where the 7I/O interface of the discrete graphics card is located The edge does not have to protrude from the edge of the PCB where the 4I/O interface of the motherboard is located. The discrete graphics card 7 communicates with the corresponding graphics card slot on the motherboard 4 through a riser card or an extension cable. The motherboard 4 and the discrete graphics card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space. The biggest advantage of this method is that it does not need to modify the heatsink and fan 201 of the discrete graphics card 7, and the original heatsink and fan 201 of the discrete graphics card 7 can be used, and the compatibility is good in this way. The disadvantage is that the required chassis space is larger than the "inside" type.

09) Internal discrete graphics card cooler 8

The heat sink mounted on the discrete graphics card 7 is provided with a vacuum heat pipe 82 and a heat conducting base 81. The vacuum heat pipe has an evaporation end and a condensation end, and the evaporation end of all the vacuum heat pipes on the heat sink directly or indirectly with the independent graphics card 7 The GPU chip 72 is in contact with each other, and the condensation end of some or all of the vacuum heat pipes is directly or indirectly contacted with the partition 3 or the inner wall of the metal casing of the chassis. The "chassis metal casing" is the "main casing 1" in the figure.

The discrete graphics card heatsink 8 is a flat heatsink as a whole, occupying a small volume. It comprises aluminum or copper fins 83 arranged in parallel spaced, 2-8 vacuum heat pipes and 1 or 2 of said heat conducting bases. The aluminum or copper heat sink fins form the main part of the flat heat sink, and the flat heat sink is mounted in parallel on the discrete graphics card 7 or on the back surface of the bulkhead 3, and the heat conductive base is disposed on the front surface of the heat sink, the surface of the back surface of the heat sink The condensing end of the flat vacuum heat pipe is arranged in a row, and the evaporation end of the vacuum heat pipe is in close contact with a copper or aluminum heat conductive base. The condensation end of the vacuum heat pipe is extruded through a die The cross section is semi-arc or flat and closely fits on the fin. The condensing end of the semi-arc/flat vacuum heat pipe on the back of the heat sink is also in parallel with the back surface of the separator 3 for heat conduction.

The flat heat sink further includes an arranged vacuum heat pipe, each vacuum heat pipe having an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded in the heat transfer base in an orderly manner. The condensing end of the vacuum heat pipe is extruded through a die into a "D" shape in cross section, that is, a flat side is formed at the condensation end of the vacuum heat pipe, and the flat side is parallel to the back surface of the heat sink. And a non-flat side portion formed by the condensation end of the "D" shaped vacuum heat pipe is fixed to the back surface of the heat sink in combination with the heat dissipation fin of the heat sink. When the back surface of the flat heat sink is mounted in parallel or in contact with the surface of the partition plate, the flat side of the condensing end of the "D" shaped vacuum heat pipe will be in parallel with the surface of the partition plate for heat conduction.

Since the heat sink is intimately in contact with the partition wall 3 or the inner wall of the metal casing of the chassis through the condensation section of the vacuum heat pipe, and the graphics card heatsink fan 201 is not mounted on the heat sink, there is no additional space for the heat sink, so The actual heat dissipation area of the discrete graphics card 7 is greatly increased. Moreover, the partition 3 for heat dissipation and the metal casing of the chassis exist themselves, which also greatly saves the material cost and the quality of the graphics card heat sink.

The heat sink is fixed to the mounting position of the independent graphics card 7 on the back of the partition 3. The heat sink is provided with one or more heat conducting bases, and the heat conducting base is closely fitted with the evaporation end of the vacuum heat pipe, and the vacuum is installed. The condensation end of the heat pipe is processed into a flat shape, and is closely attached to the back surface of the separator 3 or the inner wall of the metal casing of the casing, and the heat-dissipating fins arranged in parallel are arranged in close contact with the partition plate 3 having the flat vacuum heat pipe. On the back or on the inner wall of the metal housing of the chassis.

Specifically, because the discrete graphics card 7 has one side of the GPU chip 72 parallel to the partition 3, the side of the discrete graphics card 7 facing the partition 3 and the partition 3 have a space in which a separate graphics card heat sink 8 is mounted. The heat dissipating fins in the heat sink are arranged in parallel and spaced apart, and the strip fins perpendicular to the partition 3 have a certain oblique angle with the geographical vertical direction. The heat conducting base of the heat sink is in close contact with the surface of the GPU chip 72 of the discrete graphics card 7, and the "evaporation section" in the vacuum heat pipe is tightly embedded in the heat conducting base; the "condensing section" of the other part of the vacuum heat pipe is distributed The back surface of the separator 3 is disposed between the heat dissipating fins and the separator 3 and the heat dissipating fins. Or distributed on the inner wall of the metal casing of the chassis near the graphics card, and closely fits the inner wall of the casing.

That is, the heat in the 7 GPU chip 72 of the discrete graphics card is conducted by the "evaporation section" of the vacuum heat pipe which is conducted by the heat-conducting base close to the surface, and is quickly transferred to the "condensation section" by the "evaporation section". The heat-dissipating fins, the partitions 3, or the metal casing of the chassis, which are in close contact with the "condensing section", exchange heat with the air for a large area to achieve heat dissipation.

10) Fixing method between the internal discrete type of graphics card heatsink 8 and the independent graphics card 7

Due to the "internal discrete graphics card cooler 8", hereinafter referred to as "graphic card cooler". The "graphics card" in the following is the "independent graphics card 7" in the figure. The "chassis cover/cover" in the following is the "slider 2" in the figure, and the "PCB board of the discrete graphics card 7" is shown in the figure. "Independent graphics card board 70". According to the design of the main box and user requirements, it is divided into two forms:

Active: After the graphics card heatsink is properly installed and fixed with the discrete graphics card board 70, the digital finger socket of the graphics card is inserted into the graphics card slot in the back space of the chassis, and the graphics card heatsink is parallel to the back of the partition 3. touch. Then, the GPU chip 72 of the discrete graphics card 7 is vertically projected to the center of the back of the PCB of the graphics card to paste/install the matched insulating elastic silicone pad 206. When the chassis cover is pushed through the slot in the chassis, the cover is independent. The spacing between the PCB boards of the graphics card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed to generate a rebound pressure which acts vertically on the back surface of the discrete graphics card board 70. Since the graphics card heatsink is fixed to the discrete graphics card board 70, the resulting pressure eventually causes the graphics card heatsink to adhere to the surface of the spacer 3. A part of the heat in the graphics card heat sink is efficiently conducted to the partition 3 for heat dissipation.

Fixed type: the graphics card heat sink is firstly mounted in parallel to the corresponding partition 3 position on the back space of the chassis. At this time, the "condensing section" of the vacuum heat pipe 82 in the heat sink is closely related to the surface of the partition 3 or the inner wall of the metal casing of the chassis. fit. Then, a matching insulating elastic silicone pad 206 is pasted/mounted in a center position of the vacant discrete graphics 7 GPU chip 72 vertically projected to the back of the graphics card PCB.

The vacant discrete graphics card 7 has a GPU chip 72 facing the graphics card heatsink, and the gold finger interface on the discrete graphics card 7 is correctly inserted into the matching graphics card slot, and the GPU chip 72 and the graphics card of the discrete graphics card 7 are fixed. The heat conductive base 81 of the heat sink is close to each other. After the chassis cover is pushed through the slot in the chassis, the spacing between the cover and the PCB of the discrete graphics card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed to generate a rebound pressure. Vertically acts on the back of the discrete graphics PCB board 70. After the center of the back surface of the GPU chip 72 on the discrete graphics card 7 is subjected to the vertical pressure in the direction of the spacer 3, the surface of the GPU chip 72 is in parallel with the front surface of the thermal conduction base 81 of the graphics card heat sink.

The discrete graphics card 7 has been historically fast and easy to install with a fixed graphics card heatsink, installed in almost a second. Since the GPU chip 72 is subjected to the center position of the back, the surface of the GPU chip 72 can be smoothly attached to the surface of the heat-conducting base 81 of the graphics card heat sink, so that the force between the GPU chip 72 and the heat-conductive base 81 is naturally balanced, and the user Don't worry about the heat transfer effect caused by the uneven force of the four screws when installing the traditional heat sink.

11) Power supply box 9

The power box 9 is an ultra-thin contact type power supply box 9, which is provided with a bottom surface 91, a top surface and a side surface, and is also provided with a power supply. The output port 92 of the power supply box 9 and the output port 92 of the power supply box 9 are provided with a transmission structure that is directly connected to the corresponding circuit on the partition 3 in the computer case, and the power supply box 9 is turned on. There is no third-party plug or socket between the output port 92 and the corresponding circuit on the partition 3 in the computer case.

The side of the power supply box 9 which is in parallel with the surface of the partition plate 3 is set as the bottom surface of the power supply box 9. On the bottom surface of the power supply box 9, there are two sets of contact copper pieces 93 having protrusions of 0.5 to 3 mm, and the first group is arranged in an orderly manner. The independent contact copper piece 93 has a front surface which is very smooth and bare and electrically conductive, and the front surface of each contact copper piece 93 is parallel to the bottom surface of the power supply box 9, and the back surface of the contact copper piece 93 is fixed at On one layer of insulating elastic rubber, the insulating elastic rubber is fixed in the power supply box 9, and the back surface of each contact copper piece 93 is only in communication with the positive DC 12V output circuit in the power supply box 9. Each contact copper piece 93 has a positive area of 0.2 to 1 cm 2 ; the second set of copper pieces is a contact spring piece 104 which communicates with a VC 220 V circuit in the power supply box 9. And the two sets of contact copper sheets 93 and the bottom surface of the power supply box 9 are insulated from each other. a concave contact contact on the back surface of the partition 3 and matching the power supply installation area, and the bare contact circuit in the concave contact is in one-to-one correspondence with the contact copper piece 93 on the bottom surface of the power supply. There are a plurality of positioning holes 36 in the power supply installation area. The bottom surface of the power supply box 9 is flat and smooth except for the positioning pins 94 and the conductive contact copper pieces 93 which are protruded by 0.5 to 3 mm, and the bottom surface of the power supply box 9 is provided. It is connected to the negative DC 12V output circuit and the ground in the power supply box 9, and the power supply box 9 is fixed to the partition 3 by the fastening of the power supply box 9 by fastening screws.

Another form of power transmission port of the power box is: the power input port and the power output port of the power box are combined on the bottom surface of the power box into an integrated port, and the integrated port is directly connected to the The corresponding bare conductive circuits on the spacers are pressed and contacted one after another to form a contact copper strip group, and the contact copper strips in the contact copper strip group may have different circuit definitions and respectively The corresponding circuits in the box are connected. The bottom surface of the power box is mounted in parallel to a corresponding circuit area mounted on the partition surface.

The following is a scheme in which the bottom surface output port 92 of the power supply box 9 is in the form of a metal dome 104.

The power box 9 is mounted in parallel on the surface of the partition 3 in the chassis. The largest side of the power box 9 has its bottom surface, which is made of a conductive metal material and directly contacts the surface of the spacer 3 in parallel. The bottom of the power box 9 has an "output port 92". A plurality of bare conductive metal domes 104 are arranged in the output port 92 in a flat and orderly manner. The metal domes 104 are insulated from the bottom surface of the metal material of the power supply box 9, and the surface height of the metal domes 104 is protruded. The surface of the bottom surface of the power supply box 9 is 0.5 to 3 mm.

The metal dome 104 in the "output port 92" is divided into two groups of larger areas and smaller areas. The power box 9 has an "input port" into which the municipal alternating current or the matching direct current outside the chassis is inserted into the power box 9 by inserting a wire plug. Some of the municipal AC power is converted into a stable DC input by the power box 9. The DC positive pole is in communication with a set of metal domes 104 having a larger area within the "output port 92", the DC negative pole/ground is in communication with the conductive metal bottom surface of the power supply box 9; another portion of the municipal alternating current is connected to the "output port 92" "A small group of metal shrapnel 104 in the middle.

There are a plurality of protruding positioning pins 94 on the bottom surface of the power box 9, and a region of the partition 3 on which the power supply box 9 is mounted has a concave partition circuit 32 and a plurality of positioning holes 36, and a concave partition. Circuit 32 has exposed conductive, smooth, flat circuit contacts. And the concave-shaped spacer circuit 32 on the partition 3 and the positioning hole 36 and the metal elastic piece 104 in the "output port 92" of the bottom surface of the power supply box 9 and the protruding positioning pin 94 are in the size specification, The alignment position and the circuit definition are perfectly matched. The bottom surface of the power supply box 9 is opposed to the mounting area of the partition plate 3, and the positioning pin 94 on the bottom surface of the power supply box 9 is completely matched with the positioning hole 36 on the partition plate 3, and then inserted, and then screwed/expanded. The power supply box 9 is fastened to the partition 3. At this time, each set of conductive metal domes 104 in the "output port 92" at the bottom of the power box 9 and the corresponding concave-shaped diaphragm circuit 32 on the partition 3 are completely precisely matched and one-touch contact. Since the power supply box 9 is connected through the contact point of the concave partition circuit 32 on the partition 3, when the power supply box 9 is not mounted here, the concave area is filled with a matching insulating sheet, and the position can be at this position. Space to install additional hardware. Achieve multi-effect matching of the same location space in the chassis. At the same time, due to the extremely compact structure in the power box 9, and the direct connection with the diaphragm circuit 32 for transmission and power supply, no wires are used, which greatly reduces the space occupied by the power box 9 in the chassis.

Circuit definition: Considering the different power supply requirements of different users for the mainframe, two installation positions of the power supply box 9 are designed in the chassis, and two power supply boxes 9 can be installed at the same time and used in parallel. The partition 3 also has two corresponding recessed diaphragm circuits 32 contact points. Wherein the municipal alternating current is connected to the "input port" of the first power supply box 9 by a wire plug, and a group of metal domes 104 having a smaller area in the bottom surface "output port 92" are transmitted to the partition plate 3 through the spacer circuit 32. The second inner recessed diaphragm circuit 32 corresponds to the contact point, and the second power supply box 9 is properly mounted at the contact point of the second inner concave diaphragm circuit 32. That is, the municipal alternating current is input to the second power supply box 9 through the corresponding contact point of the second inner concave diaphragm circuit 32 to be converted into a desired stable direct current. The converted DC positive electrode in the second power supply box 9 communicates with a group of metal domes 104 having a larger area in the "output port 92", and passes through the contact point and the spacer circuit corresponding to the second concave-shaped spacer circuit 32. 32 transmits the DC positive pole to "Power Distribution Module 10".

The converted DC negative electrode in the power supply box 9 is connected to the bottom surface of the conductive metal of the power supply box 9. As can be seen from the above, the bottom surface of the power supply box 9 is mounted in parallel on the partition 3, and the partition 3 in the chassis serves as the main conductor of the DC negative/ground bearing of the whole machine. Therefore, the metal bottom surface of the power supply box 9 and the surface of the partition plate 3 are in close contact with each other and are electrically conductive. The DC negative electrode on the partition 3 can pass through the conductive metal bottom surface of the power supply box 9 to transmit a large area and a large current to the DC negative circuit in the power supply box 9. The reason why it is designed to straighten the power box 9 The flow output is directly applied to the corresponding separator circuit 32 on the separator 3 because the contact area is large and the adhesion is tight, and a large current can be stably passed. Moreover, the power supply box 9 is in close contact with the partition plate 3 or the inner wall of the metal casing of the casing, and not only the DC negative electrode/ground in the power supply box 9 is smoothly connected to the partition plate 3, but also the smart and efficient solution is solved. The power supply box 9 has a problem of heat dissipation.

The power box 9 is generally in the shape of a flat hexahedron. The maximum thickness of the power box 9 is ≤31 mm, wherein the length ≤150 mm, the width ≤110 mm; or the length ≤260 mm, the width ≤120 mm, the input port of the power supply box 9 is the input DC 12V or VC 220V, the output port 92 of the power box 9 is output DC 12V or VC 220V.

The overall outline of the power box 9 is a flat square body, and the specific size and shape depend on the design requirements and the power level.

The heat dissipation mode of the power supply box 9: The ultra-thin power supply box 9 has a compact internal structure and a concentrated heat source. The outer casing of the power box 9 is made of aluminum alloy. The heat element in the power box 9 is directly attached to the aluminum alloy case, or the vacuum heat pipe is connected to the aluminum alloy case, and most of the heat is quickly transferred to the power box. 9 metal casings. Because the power box 9 is closely parallel to the partition 3 or a part of the inner wall of the metal casing of the chassis, the partition 3 or the metal casing of the chassis, together with the ventilation inside the chassis, achieves large-area efficient heat dissipation.

12) Power distribution module 10

The side of the power distribution module 10 that is in contact with the back surface of the partition 3 is a bottom surface 102. The bottom surface is provided with a "DC input port 102" and a "DC output port 103", a "DC input port 102" and a "DC output. A plurality of contact copper pieces 93 protruding from the bottom surface by 0.5 to 3 mm are arranged neatly and orderly in the port 103". The front faces of the contact copper strips 93 are smooth, bare and electrically conductive. The inwardly facing back faces of the copper strips 93 are fixed on an elastic material member insulated from other circuits, and the elastic material members are fixed to the power distribution. Within module 10.

A plurality of raised positioning pins 94 are disposed on the bottom surface of the power distribution module 10 except for the "DC input port 102" and the "DC output port 103", and the area of the power distribution module 10 is mounted on the partition plate 3 respectively. The "DC input port 102", the "DC output port 103" and the positioning pin 94 on the bottom surface of the electric module 10 are completely correctly matched to the concave circuit contact point and the positioning hole 36 in the size specification, the position direction, and the circuit definition. The surface of the contact point of the concave circuit is barely conductive, but is insulated from the spacer 3, and the contact points of the concave circuit are respectively connected to the corresponding spacer circuit 32.

The power distribution module 10 also integrates a temperature control module, and the power distribution module 10 provides power supply and installation location space and/or circuit routing structure for the temperature control module.

Structure circuit definition: contact copper piece in the "DC input port 102" on the bottom surface of the power distribution module 10 93 is connected to the DC input circuit in the power distribution module 10; the contact copper pieces 93 in the "DC output port 103" on the bottom surface of the power distribution module 10 are respectively connected to the DC output power supply of different output voltage values in the power distribution module 10. . The contact copper pieces 93 defined by different circuits are independent and insulated from each other, and the contact copper piece 93 is also insulated from the bottom surface of the power distribution module 10.

The contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is matched with the corresponding concave circuit contact point on the partition plate 3, and then the power supply box 9 is outputted to the above-mentioned partition circuit 32. The DC is introduced into the power distribution module 10 and converted into DC power supplies of different voltage values required by the hardware devices, and the DC power supplies of the different voltage values are respectively contacted through the contacts in the "DC output port 103" on the bottom surface of the power distribution module 10. After the copper pieces 93 are mated with the corresponding concave circuit contact points on the partition 3, the DC power supplies of the different voltage values are respectively transmitted to the corresponding partition circuit 32.

In the middle section of the back of the partition 3 in the chassis, the power distribution module 10 is mounted on the back edge of the partition 3 adjacent to the front panel of the chassis, and the power distribution module 10 is integrated with one or more of the following One or more sockets and partition sockets matching the type interface: 6/8pin discrete graphics auxiliary power supply slot 73, 24pin motherboard main power supply slot 45, turbo fan 201 power supply interface, 7+15pin SATA hard disk 203 interface, SATA Express Hard disk 203 interface, SAS hard disk 203 interface, USB 3.0 19/20pin socket, USB 2.0 9pin socket, 7+6pin SATA optical drive interface.

The bottom surface of the power distribution module 10 is a flat metal conductive material except for the "DC input port 102" and the "DC output port 103", and the DC output negative/ground circuit in the power distribution module 10 is connected to the metal bottom surface of the power distribution module 10. through. The power distribution module 10 is fastened to the surface of the inner partition 3 of the chassis by screws or expansion pins in parallel, and is in contact with the surface of the partition 3 for large-area contact. In addition, one or more hardware-matched sockets or bulkhead sockets are integrated on the power distribution module 10, and are directly inserted into the matching socket/separator sockets of the power distribution module 10 through wires or the hardware self-contained interfaces. Connected. Therefore, the DC negative/ground of the hardware in communication with the socket/separator socket integrated on the power distribution module 10 is conducted to the partition 3 through the metal conductive bottom surface of the power distribution module 10. As can be seen from the above, the partition 3 is in contact with the conductive bottom surface of the power supply box 9, so that the bottom surface of the power distribution module 10 is connected to the bottom surface of the power supply box 9, that is, the DC negative/ground circuits of the two are in communication.

As known from the above, because the power distribution module 10 is a DC power supply that converts the DC voltage of a single voltage value transmitted from the power box 9 into different voltage values required by each hardware, and the power distribution module 10 integrates one or A variety of socket/separator sockets that match the hardware interface. That is, the DC power supply of each voltage value converted and outputted in the power distribution module 10 is partially connected to the integrated socket/separator socket, and the corresponding power supply is transmitted to the matching by wire or hardware in-line. In the hardware; another part of the output of the DC voltage of each voltage value, through the "DC output port 103" on the bottom of the power distribution module 10 through the partition The contact points of the upper matching concave-shaped baffle circuit 32 are respectively electrically connected to the corresponding baffle circuit 32, and the baffle sockets corresponding to the baffle circuit 32 are respectively connected with the computer hardware required for power supply. The interface/slot is opposite.

Since the bottom surface of the power distribution module 10 uses the same large-area pressure-contact conductive transmission structure as that of the power supply box 9, the large-current stable transmission can be performed between the power distribution module 10 and the bulkhead circuit 32. Moreover, a plurality of hardware interface sockets and/or temperature control modules are integrated in the power distribution module 10, so that the structural design is more efficient and compact, and the integrated power distribution module 10 has a multifunctional integrated structure, which is convenient for the user to disassemble and assemble. use.

13) Intelligent temperature control system

The intelligent main control system is provided in the mainframe of the computer, including a manual adjustment switch 18, a temperature control module, a fan 201, and a temperature probe 37. The manual adjustment switch 18 is disposed on the casing of the casing for convenient operation by the user, and the temperature control module and the fan 201 are located. The required position in the chassis, the temperature probe 37 is placed beside the CPU heatsink 6 or the graphics card heatsink, and is in the downwind duct of the radiator airflow, the temperature control module is simultaneously with the manual adjustment switch 18, the fan 201, the temperature probe 37 Connected. Firstly, manually adjusting the gear position of the switch 18 has limited the highest value and the lowest value segment of the voltage output from the temperature control module to the fan 201; secondly, the temperature probe 37 belongs to a thermistor, and the ambient temperature of the temperature probe 37 is high. Will change its own resistance value, the temperature control module connected with the temperature probe 37, according to the value fed back by the temperature probe 37, accurately output the corresponding supply voltage to the fan 201 in the voltage section, thereby realizing the real-time through the temperature probe 37 The purpose of automatically changing the speed of the fan 201 by monitoring the ambient temperature.

The main board support column 31 type temperature probe 37, because the desktop machine does not necessarily have a separate graphics card 7, and the temperature of the CPU can more objectively reflect the change of the temperature of the whole machine, so it is necessary to be near the CPU heat sink 6 Place a temperature probe 37.

A motherboard mounting hole 47 is defined between the PCI-E slot on the motherboard 4 and the memory module slot 44. The mounting hole is correspondingly connected to the corresponding motherboard support post 31 of the partition 3 to mount the temperature probe 37. This temperature probe 37 includes the following two forms:

1 fixed type, the temperature probe 37 is generally columnar, the upper end is a temperature probe 37 element, the size can just pass through the corresponding motherboard mounting hole 47; the lower end is the pin of the temperature probe 37 component, fixed to the corresponding partition circuit 32 by welding And the temperature probe 37 is substantially perpendicular to the front surface of the partition plate 3, and the main board mounting hole 47 located between the PCI-E slot and the memory module slot 44 on the main board 4 is mapped on the front surface of the partition plate 3;

In the movable type, the main board mounting hole 47 between the main board 4PCI-E slot and the memory stick slot 44 is mapped to a position corresponding to the front surface of the partition 3, and has a socket of the temperature probe 37. This temperature probe 37 socket is welded It is fixed on the corresponding baffle circuit 32, and its height is not higher than the height of the other main board support columns 31. When the main board 4 is correctly mounted on the inner partition 3 of the chassis, there is a rod-shaped temperature probe 37, and the upper end is a temperature probe. 37 components, the lower end is the connection plug. The lower end of the rod-shaped temperature probe 37 is inserted into the motherboard mounting hole 47 between the PCI-E slot and the memory module slot 44 of the main board 4, and inserted into the temperature probe 37 socket on the partition 3, at this time, the temperature probe 37 It is in proper communication with the corresponding circuit on the partition 3, and the upper temperature probe 37 element is located above the front surface of the main board 4 for reading the temperature of the air flow at the position.

The computer chassis adopts the above intelligent temperature control system, which has excellent user operation and is very user-friendly. It is no longer necessary to consider whether the fan 201 has a PWM function, and does not need to enter the motherboard 4BISS to open and set, and the heat dissipation and noise can be perfectly dynamic. balance.

14) Cooling air duct

The air-cooling air duct is arranged in the computer case, and the air-dissipating air-cooling heat-dissipating method is adopted. The turbo fan 201 for exhausting the air outside the chassis is installed at the tail portion 13 of the chassis, and the whole machine has two large mains. The tuyere and two small auxiliary air inlets, the two large main air inlets are the CPU air inlet 22 and the video card air inlet 23, and the two small auxiliary air inlets are the box bottom air inlet 15 and the side top air inlet 14.

The CPU air inlet 22 is located on the right side panel of the chassis shell, and has a large opening near the CPU heat sink 6; the video card air inlet 23 is located at the front of the chassis shell, and has a position corresponding to the area of the chassis in which the discrete graphics card 7 is mounted. a large elongated opening; the bottom air inlet 15 is located on the bottom casing of the chassis, and an elongated opening is formed between the partition 3 in the chassis and the two intersecting lines extending perpendicularly from the main board 4 to the bottom plate of the chassis. The side air inlet 14 has a small elongated opening at a position on the left side panel of the cabinet casing near the top portion 11 and the front portion of the cabinet.

In the air-suction type air-dissipating air passage, except for the above-mentioned four air inlet openings and the optical drive 204 into the dish opening 24, there is no other air inlet hole, and the fan 201 in the tail of the chassis continuously pulls the air in the box. Outside the box, the air pressure inside the box is lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets to the box. Usually, when the rapid airflow generated by the air blowing form encounters the real object, the air pressure on the surface of the object will rise, and the air pressure will increase to the heat state, which is not conducive to the heat exchange between the surface of the object and the air of the airflow; The air pressure on the surface of the air passage slightly decreases, and the low-pressure air will more absorb the heat and expand its own volume, which is beneficial to the heat exchange between the surface of the object and the air of the air.

The cold air flowing in from the CPU inlet 22 flows through the corresponding CPU radiator 6, and the cold air becomes a heat flow after absorbing the heat. Since the main chassis is vertical, the CPU heat sink 6 is in the lower half and the turbo fan 201 is in the upper half. The higher temperature heat flow flows to the top of the chassis due to its natural lift and the suction of the turbo fan 201, and the lower temperature part of the heat flow is absorbed by the turbo fan 201 on the back side of the partition 3, between the edge of the partition 3 and the inner wall of the front panel 21 of the sliding cover. The gap flows into the lower half of the space on the back of the partition 3. Due to the back of the partition 3 The lower half is a power supply box 9 or a hard disk 203 which is mounted in parallel with each other, so that a heat flow having a lower temperature flows therein, and the heat amount of a part of the power supply box 9 and the hard disk 203 can be absorbed.

The cold air flowing in the air inlet 23 of the graphics card directly flows through the corresponding independent graphics card heat sink 8, the upper half of the back surface of the partition 3, and the inner top of the chassis in the back space of the partition 3. In the middle position on the back side of the partition 3, that is, below the mounting area of the discrete graphics card 7, a graphics card windshield 39 is disposed between the position of the video card inlet 23 and the turbo fan 201 on the back of the partition 3. The card windshield 39 is simultaneously sealed and touched. The back of the partition 3 and the inner wall of the slider 2. The cold air of the air inlet 23 of the graphics card is simply and efficiently drained through the heat sink of the independent graphics card 7 to absorb heat, and finally extracted by the turbo fan 201, and the air passage is not disturbed by the heat flow in other spaces in the chassis.

Since the vent hole 38 is opened in the central portion of the partition 3, the turbo fan 201 is attached to the vent hole 38 on the back surface of the partition 3. The cold air flowing in the inlet vent 15 of the tank flows through the lower half of the front surface of the partition 3 and the lower half of the back surface of the main plate 4. Since the lower half of the back surface of the partition plate 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, a part of the heat generation is transmitted to the lower half of the partition plate 3, and the cold air flowing in from the air inlet 15 of the tank bottom is taken away by the cold air; The other part of the heat is mainly transferred to the tail and bottom of the metal casing of the chassis for heat dissipation; and a part of the heat is absorbed by the lower temperature heat flow remaining after the CPU inlet 22 flows as described above.

Considering that the high-power discrete graphics card 7 generates a large amount of heat, and the air intake of the video card inlet 23 is limited, a side air inlet 14 is also added, and the inflowing cold air mainly absorbs the area and a small portion of the chassis in the back space of the partition 3. The heat in the upper end region of the back of the partition 3. The cold air flowing in the four air inlets exchanges heat with each radiator, the partition 3, the heating hardware, and the inner wall of the metal casing of the chassis to become an air heat flow, and is installed in a plurality of turbo fans at the upper half and the tail of the chassis. 201 is discharged outside the box.

In addition to several air inlets, the sealed design of the whole machine, together with the hardware arrangement in the chassis, is scientific and concise, and the generated wind resistance is small. In addition, the ultra-thin PC mainframe has a small volume. When the air is exhausted, the air pressure difference generated in the cabinet is more obvious than that of the large chassis. The airflow formed in the chassis is large and the wind speed is fast. Moreover, the air passage formed by the low pressure generated by the suction, together with the scientific arrangement of the hardware, is simple, the wind resistance is small, the air in the air passage flows in an orderly manner, and the phenomenon of returning hot air does not occur.

An air filter 25 is arranged on the four air inlet openings to filter dust entering the air in the box, so that the main box is kept clean and has good ventilation and heat dissipation performance for a long time.

15) Turbofan 201

A turbo fan 201 is mounted in the front space of the partition 3 and the back space of the partition 3,

The front space of the partition 3 has an I/O interface group of the main board 4 at a positional area on the west end of the main board 4, and a component on the main board 4 of the left side of the main board 4 remaining on the side of the main board I/O interface group 41. Height All are within 18mm, so the space above the main board 4 is relatively wide, and the west end of the main board 4 is close to the outer casing of the chassis. Therefore, a turbo fan 201 is installed on the inner wall of the casing rear casing at the position of the main board 4, and the air outlet of the turbo fan 201 is connected to the opening 17 of the casing rear casing to discharge the airflow to the outside of the casing. The turbo fan 201 installed in the idle position of the west end of the main board 4 utilizes the idle position for exhausting heat efficiently and efficiently, without additionally increasing the volume of the chassis, and the movable mounting structure does not affect the disassembly and assembly of the hardware at all. .

A vent hole 38 is formed in the partition plate 3, and one side of the turbo fan 201 is attached to the back surface of the partition plate 3 against the vent hole 38. One side of the turbo fan 201 draws air in the gap between the partition plate 3 and the main plate 4 through the vent hole 38 in the partition plate 3; the other side of the turbo fan 201 extracts air in the space behind the partition plate 3. The air outlet of the turbo fan 201 is connected to the opening of the rear casing of the chassis, and all the extracted air is discharged outside the casing;

The turbofan 201 mounted on the inner wall of the rear casing of the chassis contains the following two forms:

1 fixed type, that is, the turbo fan 201 is fixed to the inner wall of the rear casing of the chassis by screws or mounting slots;

2 movable type, a guide rail is mounted on two frames perpendicular to the air outlet of the turbo fan 201, and an opening is provided in the position of the fan 201 installed in the rear casing of the chassis, and the shape and size of the opening are exactly the same as those of the turbo fan 201. The cross section of the air outlet is matched. A rail chute is vertically mounted on the inner wall of the casing rear casing, and the rail-equipped turbofan 201 is matched with the rail chute on the inner wall of the casing tail casing, and the turbo fan 201 is opened through the casing tail casing. The hole can be freely moved inside and outside the chassis. When the installed turbo fan 201 blocks the disassembly and assembly of the hardware in the chassis, the turbo fan 201 can be moved to the outside of the chassis, and the hardware in the standby box is disassembled and then This turbo fan 201 is moved back to the inner wall of the casing.

The present invention is not limited to the above specific embodiments. In the above description, the computer mainframe is customarily referred to as a computer mainframe in Chinese, and the main computer mainframe is also referred to as a computer chassis. Further developments made by those of ordinary skill in the art in accordance with the present invention fall within the scope of the present invention.

Claims

A heat dissipation structure of a computer-independent graphics card, comprising: a heat sink matched with a separate graphics card, wherein: the main portion of the heat sink is composed of heat-dissipating fins arranged in parallel with each other and is generally flat, and the heat sink is provided The front side and the back side are provided with a heat conducting base on the front side of the heat sink, and the outwardly flat side of the heat conducting base of the heat sink is closely attached to the surface of the GPU chip of the independent graphics card.

The back of the heat sink is in parallel with the surface of the partition in the mainframe of the computer. The partition divides the space of the mainframe of the computer into two, and is mounted in parallel or parallel on one or both sides of the partition. Computer hardware such as motherboard, hard disk, power supply box, and fan, and separate graphics cards and partitions are set in parallel.
A heat dissipation structure for a computer-independent graphics card according to claim 1, wherein said heat sink further comprises vacuum heat pipes arranged, each of which has an evaporation end and a condensation end, and all of the vacuum heat pipes are evaporated. The ends are closely attached or embedded in the heat-conducting base in an orderly manner, and the condensation end of the vacuum heat pipe is extruded through a die into a semi-arc or flat shape in cross section, closely adhering to the heat dissipation fins, part or all of the The condensation end of the vacuum heat pipe is distributed on the back surface of the flat heat sink and is in parallel with the separator surface for heat conduction.
A heat dissipation structure for a computer-independent graphics card according to claim 1, wherein said heat sink further comprises vacuum heat pipes arranged, each of which has an evaporation end and a condensation end, and all of the vacuum heat pipes are evaporated. The ends are closely attached or embedded in the thermally conductive base, and the condensation end of the vacuum heat pipe is extruded through the die into a "D" shape in cross section, that is, a flat side is formed at the condensation end of the vacuum heat pipe. And the flat side is parallel to the back surface of the heat sink, and the non-flat side portion formed by the condensation end of the "D" shaped vacuum heat pipe is fixed in combination with the heat sink fin of the heat sink. The back of the heat sink,

When the back surface of the flat heat sink is in parallel on the surface of the partition plate, the flat side of the condensing end of the "D" shaped vacuum heat pipe will be in parallel with the surface of the partition plate for heat conduction.
The heat dissipation structure of the computer-independent graphics card according to claim 2 or 3, wherein a condensation end of a portion of the vacuum heat pipe on the heat-conducting base of the heat sink extends to the inner wall of the metal shell of the main body, and is closely fitted in parallel On the inner wall of the metal shell of the main unit.
The heat dissipation structure of the computer-independent graphics card according to claim 1, 2 or 3, wherein the GPU chip of the discrete graphics card is vertically projected to the center of the back surface area of the PCB of the graphics card, and an insulating silica gel or an insulating silica gel is disposed. The pressure generated by squeezing the insulating silicone after the side panel of the mainframe is fixed in place makes the heat-conducting base of the heat sink and the surface of the discrete graphics GPU chip or the back of the heat sink The flat side of the condensing end of the distributed vacuum heat pipe is in close contact with the face of the separator to complete the conduction of thermal energy.
[Correct according to Rule 26 29.06.2017]

A heat dissipation structure of a computer-independent graphics card, comprising a heat sink matched with a separate graphics card, wherein the heat sink comprises a heat-conducting base, a vacuum heat pipe and heat-dissipating fins arranged in parallel with each other, each vacuum heat pipe There are "evaporation section" and "condensation section",

The thermal base is closely attached to the surface of the GPU chip of the discrete graphics card;

The "evaporation section" in the vacuum heat pipe is in close contact with the heat conductive base or embedded in the heat conductive base;

The "condensation section" of the vacuum heat pipe is closely attached to the heat dissipation fins, and is also closely adhered to the inner wall of the partition or the metal casing of the casing;

The heat in the GPU chip on the discrete graphics card is conducted by the "evaporation section" of the vacuum heat pipe, which is conducted by the heat-conducting base close to the surface, and then quickly transferred to the "condensation section" by the "evaporation section". Heat-dissipating fins, partitions or metal casings that are in close contact with the "condensation section" exchange heat with air over a large area to achieve heat dissipation and cooling purposes;

The partition is divided into two parts of the mainframe space, and the computer hardware including the main board, the hard disk, the power box, the fan, and the separate graphics card and the partition are installed in parallel or parallel on one or both sides of the partition. Parallel settings.
[Correct according to Rule 26 29.06.2017]
The heat dissipation structure of the computer-independent graphics card according to claim 7, wherein the heat dissipation fins are strip-shaped heat dissipation fins perpendicular to the spacer, and the heat dissipation fins have a certain oblique angle with the geographical vertical direction. It is conducive to the natural upward lift of the air heat flow.
[Correct according to Rule 26 29.06.2017]

A computer independent graphics card installation structure, comprising a separate graphics card, a motherboard, an I/O interface group of a discrete graphics card, and an I/O interface group on the motherboard, an I/O interface group of the discrete graphics card, and an I/O on the motherboard The interface group refers to an independent input card and an input/output interface on the main board for connecting with a device external to the mainframe of the computer, wherein the PCB surface of the discrete graphics card is parallel to the motherboard PCB surface and is disposed on the back of the motherboard, independent. The socket of the I/O interface group on the graphics card is oriented in the same direction as the socket of the I/O interface group on the motherboard, and a heat sink is mounted on one side of the PCB of the independent graphics card, and there is a block between the independent graphics card and the motherboard. Parallel heat-conducting material partition, the partition divides the space of the mainframe of the computer into two, and the computer including the main board, the hard disk, the power box, the fan is mounted in parallel or parallel on one or both sides of the partition hardware,

The main body portion of the heat sink is composed of heat dissipating fins arranged in parallel with each other, and has a flat shape as a whole. The heat sink is provided with a front surface and a back surface, and a front surface of the heat sink is provided with a heat conducting base, and the heat conducting base is flattened to the outside. Attached to the GPU chip of the discrete graphics card, the back surface of the heat sink is in parallel on the surface of the partition plate; wherein one side of the separate graphics card with the heat sink is opposite to the surface of the partition plate, and the PCB on the independent graphics card The other side of the heat sink is not mounted opposite the back of the motherboard and is adjacent to the side panel of the housing of the mainframe.
[Correct according to Rule 26 29.06.2017]
The installation structure of the computer independent graphics card according to claim 9, wherein the edge of the PCB board on which the I/O interface group on the discrete graphics card is located protrudes in the direction in which the I/O interface group socket faces The edge of the PCB board on the I/O interface group on the motherboard is 15 to 40 mm.
[Correct according to Rule 26 29.06.2017]
The installation structure of the computer independent graphics card according to claim 9, wherein the independent graphics card passes through the interface matching pad socket or the graphics card adapter card, and the extension cable is used to connect the gold finger interface on the independent graphics card. The corresponding discrete graphics card slots on the motherboard are connected and connected.