TWM550838U - Heat dissipating structure of independent graphics card of computer and assembling structure thereof - Google Patents

Description

Heat dissipation structure of computer independent display card and installation structure thereof

The novel creation is related to a technical field of computer hardware devices, and in particular to a technology for installing and dissipating a computer independent display card.

The mainstream of the existing conventional desktop mainframe is the tower mainframe, and its overall shape is a rectangular parallelepiped. The mainframe of the desktop computer is divided into horizontal and vertical, and is usually the most common in vertical. All physical components in the main chassis are generally referred to as computer hardware, including motherboards, hard drives, CPUs, memory sticks, stand-alone display cards, CD players, and power supplies, as well as heat sinks. The existing tower mainframe is a non-slim mainframe, which is large in size and heavy in weight.

1) Hardware configuration and routing: At present, the hardware configuration in the traditional desktop mainframe is designed to be able to install almost one type of computer hardware in one location space, so in order to support more hardware, the main chassis Set a lot of hardware installation space location, when some hardware installation location is not used, it can only be idle there, greatly wasting the space volume inside the mainframe, making the space utilization in the mainframe low .

Most of the data or power connections between the hardware in the mainframe of a conventional desktop computer are mostly RVV wires, and the associated hardware is connected by wires. However, due to the backward layout and routing in the traditional mainframe, and the various hardware, the connecting wires are also criss-crossed, complicated and complicated. The user needs to have certain professional basic knowledge and serious influence. The interior of the main box is beautiful, and the various lines also occupy the space volume in the main box. In the traditional mainframe, due to the unreasonable reason of the hardware configuration, and the connection of the common wires, and the connection distance between the hardware is not the shortest, the shortest connection cannot be achieved because it is too short. Ordinary wires become thick and hard, so it is very inconvenient for users to install and use.

2) Structure of the CPU heat sink and its installation: The traditional CPU heat sink uses 4 screws/expansion bayonet pins to fix the CPU heat sink through the CPU mounting holes on the motherboard, rigid or nearly rigid material and structure. On the motherboard. The following five problems often occur: First, because the screw/expansion pin is tightened too much, the force between the heat sink and the motherboard is too large, causing the motherboard to deform and bend to varying degrees. Second, sometimes the four screws are unbalanced when they are tightened, resulting in partial tilting between the surface of the CPU chip and the heat-conducting base of the heat sink, resulting in fine gaps, which greatly increases the thermal conductivity of the CPU chip and the heat sink. The thermal conductivity between the two blocks the heat transfer between the CPU chip and the heat sink. Third, the traditional CPU heatsink and the matching buckles and parts are numerous and complicated to install. Most of them take several minutes to ten minutes. Fourth, when some conventional CPU heat sinks are mounted on the motherboard, they cannot move or can only move in one direction. As a result, sometimes the CPU heatsink conflicts with the position of some components on the motherboard, and the drawbacks of normal installation cannot occur. Fifth, most traditional high-end CPU heat sinks can only increase the size of the heat sink in order to achieve better heat dissipation. This greatly reduces the compatibility of the large CPU heat sink with the main chassis and the motherboard, and the cost of the user purchase is also significantly increased.

In addition, most of the CPUs used by ordinary users consume less than 100W of TDP power. However, considering the demanding requirements of top CPUs and overclocking users, the CPU heatsink can carry more than 180W. Therefore, higher requirements are placed on the performance of the heat sink.

3) Installation and heat dissipation of the independent display card: The independent display card in the traditional desktop mainframe, if it is a low-end display card, generally uses the original heat sink of the display card for heat dissipation. In the case of high-power, high-end graphics cards, either use expensive, cumbersome water-cooling solutions or reinstall better air-cooled heat sinks. However, most of the independent display card air-cooled radiators on the market have a certain compatibility range, or there are many matching parts and the installation process is cumbersome. And users who don't have a certain amount of expertise don't even know what kind of radiator should be chosen.

Traditional desktop mainframes and independent display cards have the following problems in terms of heat dissipation:

First, if the independent display card is air-cooled, the size of the heat sink can hardly exceed the size range of the display card itself due to the limitation of the mounting method and size specifications. And the matching fan also occupies a part of the volume of the heat sink, so the actual heat dissipation area of the heat sink is limited.

Second, if water cooling is used, the high cost will not be said. Water tanks, pumps, radiators, fans, water pipes, etc., which are compatible with water cooling, need to increase the volume and weight of the main box. And the installation is cumbersome, and the user needs to have a certain professional ability when installing water cooling.

Third, the independent display card is perpendicular to the air inlet of the main panel side panel. If air cooling is adopted, the cold air flowing in from the air inlet is interfered by the CPU cooling fan and the display card cooling fan, and the cold air outside the main box cannot flow completely and unidirectionally through the independent display card. Efficient heat dissipation in the radiator, because the unscientific and tight air duct in the main box, the cold air flowing into the independent display card and the CPU radiator is caught with the returning hot air, which affects the heat exchange effect of the radiator.

Fourth, the independent display card heat sinks are placed horizontally in parallel, which is very unfavorable for the natural upward movement of the air heat flow.

In the traditional desktop mainframe, the independent display card is directly inserted vertically into the display card slot of the motherboard. Since the motherboard and the independent display card are both large-sized hardware in the main chassis, the space occupied by the two perpendicularly is large. But this way is very compatible with the hardware.

4) Cooling air duct: The design of the heat dissipating air duct in the traditional desktop main box is unscientific and disorderly, and almost all of them have the phenomenon of returning hot air. In order to increase the heat dissipation effect of the CPU or the independent display card, it is solved by increasing the size of the heat sink. There is no simple and effective way to transfer and diffuse a part of the heat source by means of the metal casing of the main box itself.

In addition, the fan speed and the noise generated by it have always been a major contradiction between air cooling and heat dissipation. The fan speed in a conventional desktop mainframe usually has two forms: one is a fixed speed, and the other is a temperature-controlled speed by connecting a motherboard PWM jack. The former, regardless of the temperature inside the main box is always a speed, unscientific; the latter, the fan must first have a PWM function, and then enter the motherboard BISS to open, set, the user needs to have certain professional knowledge. Moreover, there are many types of fans, and if the fan in the PWM speed control mode is too noisy or the wind speed is too small, there is almost no way for the user to effectively adjust.

5) Power supply: The power supply box in the traditional desktop mainframe is large in size. Its function is to directly convert the input AC power into DC output of different voltage values required by each hardware, and connect with each hardware by using many RVV wires. In addition, the design configuration in the traditional mainframe is backward, which causes the various wires of the inner box of the mainframe to be densely packed and criss-crossed. The huge occupation wastes the space volume in the mainframe and affects the appearance of the mainframe, and also hinders the convenience of the user. .

In order to overcome the defects of the design and technology of the existing products, the present invention aims to provide a heat dissipation structure capable of improving the heat dissipation performance of the independent display card.

A further objective is to reduce the volume of space occupied by the independent display card in the mainframe, and to increase the aesthetics of the configuration of the independent display card in the mainframe.

The purpose of the novel creation is also to provide a computer independent display card installation structure that is compatible with various independent display cards in an ultra-thin mainframe, and increases the actual heat dissipation area and heat dissipation effect of the independent display card.

This new creation is achieved by the following technical solutions:

The heat dissipation structure of the computer independent display card comprises a heat sink mounted on the independent display card, wherein: the heat sink is provided with a front side and a back surface and is generally flat, and the front surface of the heat sink is provided with a heat conductive base, and the heat sink is The main body portion is composed of heat dissipating fins arranged in parallel with each other. The outwardly flat side of the heat conducting base is flatly attached to the GPU chip of the independent display card, and the back surface of the heat sink is in parallel with the partition surface of the mainframe of the computer. The partition divides the space of the mainframe of the computer into two, and installs a computer hardware including a motherboard, a hard disk, a power supply box, a fan, and a separate display card in parallel or parallel on one or both sides of the partition. Set in parallel with the partition.

The heat sink further includes an array of vacuum heat pipes, each of which has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded in the heat transfer base in an orderly manner, the vacuum The condensation end of the heat pipe is extruded through a die into a semi-arc or flat shape in cross section, closely adhering to the heat dissipation fins, and some or all of the condensation ends of the vacuum heat pipes are distributed on the back surface of the flat heat sink and Parallel contact on the surface of the separator for heat conduction.

A condensation end of a portion of the vacuum heat pipe on the heat conducting base of the heat sink extends to the inner wall of the metal shell of the main body, and is closely attached to the inner wall of the metal shell of the main body in parallel.

The GPU chip of the foregoing independent display card is vertically projected to the center of the back area of the PCB of the display card, and the insulating silicone is pasted or disposed, and the pressure generated by the insulating silicone is pressed by the side panel of the mainframe of the computer to fix the heat sink. The flat side of the condensing end of the heat-conducting base and the GPU wafer surface of the independent display card or the back surface of the heat sink is in close contact with the surface of the partition plate to complete the conduction heat energy.

All fins are arranged in a direction parallel to the I/O interface of the independent display card or at an angle of ≤ 45°, and all the fins are perpendicular to the partition surface.

The following is the technical solution for the installation structure of the computer independent display card:

A computer independent display card installation structure, comprising a separate display card, a motherboard, an I/O interface group of a separate display card, and an I/O interface group on the motherboard, the I/O interface group and the host of the independent display card The I/O interface group on the board refers to the independent display card and the input/output interface on the motherboard for connecting with the device outside the mainframe of the computer, wherein: the PCB surface of the independent display card is parallel to the PCB of the motherboard The surface of the I/O interface group on the independent display card is oriented in the same direction as the socket of the I/O interface group on the motherboard, and the heat sink is mounted on one side of the PCB of the independent display card. There is a parallel heat-conducting material partition between the independent display card and the motherboard, and the partition divides the space of the mainframe of the computer into two, and the parallel or parallel contact on one or both sides of the partition includes the motherboard. a computer hardware such as a hard disk, a power supply box, and a fan. The heat sink is provided with a front surface and a back surface and is generally flat. The front surface of the heat sink is provided with a heat conductive base, and the main body portions of the heat sink are spaced apart from each other. Arranged fins The flat surface of the heat-conducting base is flat on the GPU chip of the independent display card, and the back surface of the heat sink is in parallel with the surface of the partition plate, and the side of the independent display card with the heat sink is The partition plates are opposite, and the other side of the PCB on which the card of the independent display card is not mounted is opposite to the back of the motherboard and is adjacent to the side panel of the casing of the mainframe.

The edge of the PCB board on which the I/O interface group on the independent display card is located is oriented in the direction in which the I/O interface group socket is oriented, and the edge of the PCB board where the I/O interface group on the motherboard is located is 15 to 40 mm. the distance.

The foregoing independent display card is connected to the corresponding independent display card slot on the motherboard through the interface matching partition socket or the display card adapter card and the extension cable, and the gold finger interface on the independent display card.

The heat sink further includes an array of vacuum heat pipes, each of which has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded in the heat transfer base in an orderly manner, the vacuum The condensation end of the heat pipe is extruded through a die into a semi-arc or flat shape in cross section, closely adhering to the heat dissipation fins, and some or all of the condensation ends of the vacuum heat pipes are distributed on the back surface of the flat heat sink and Parallel contact on the surface of the separator for heat conduction.

A condensation end of a portion of the vacuum heat pipe on the heat conducting base of the heat sink extends to the inner wall of the metal shell of the main body, and is closely attached to the inner wall of the metal shell of the main body in parallel.

The GPU chip of the foregoing independent display card is vertically projected to the center of the back area of the PCB of the display card, and the insulating silicone is pasted or disposed, and the pressure generated by the insulating silicone is pressed by the side panel of the mainframe of the computer to fix the heat sink. The flat side of the condensing end of the heat-conducting base and the GPU wafer surface of the independent display card or the back surface of the heat sink is in close contact with the surface of the partition plate to complete the conduction heat energy.

The beneficial effects of this new creation are:

The new creation is mainly used for the ultra-thin vertical mainframe, which is about 1/6 of the size of the traditional desktop mainframe. When the hardware is fully loaded, the mainframe is half the weight of the traditional desktop mainframe. about. This ultra-thin vertical mainframe can meet almost all common motherboard models (such as ATX, M-ATX, ITX, etc.) on the market. It can be installed and supported with all 3.5-inch hard drives and 2.5-inch hard drives. Supports all full-height, half-height, ultra-long, high-power independent display cards that can be mounted to support thin optical drives up to 14mm thick. The hardware in the main chassis has been reconfigured and the connection form is defined. There is a metal plate in the box, and the hardware is arranged in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately; the main box has a matching integrated type. The U-shaped slider housing (this slider housing is available in a transparent, translucent material) provides an extremely simple operating mode for the user to open/close the main unit. The overall one has excellent heat dissipation performance and humanized one-button intelligent temperature control system. The CPU heatsink, stand-alone display card heatsink, power supply box, and exhaust fan in this ultra-thin mainframe are all custom-sized models that match this mainframe.

The novel creation is arranged on the back side of a partition plate (the side on which the main board is mounted on the partition plate is set as the front surface of the partition plate), and in view of the fact that a plurality of hard bodies mounted on the back surface of the partition plate have a certain requirement for heat dissipation, the partition plate is required. In addition to the concave-shaped baffle circuit contact points matching the power supply box, the power distribution module, and the bulkhead socket mounting, the surface of the other areas on the back side of the partition is represented by a flat, thermally conductive metal flat plate.

The novel creation independent display card adopts a back-mounted installation structure:

1 Internal dispersion type: Its function is first, and the parallel connection and close-range placement between the motherboard and the independent display card greatly reduce the occupied space volume. Second, since the I/O interface of the middle and high-end independent display cards is mostly double-layered, it is ingenious to separate the display cards in consideration of being fully compatible with all the display cards and minimizing the space occupied by them. The upper I/O interface area is partially translated out of the west end of the motherboard. In addition, there is no barrier between the I/O interface area of the independent display card and the motherboard, so that the I/O interface of the independent display card is single-layer or double-layer, which does not affect its installation in the main chassis. Use, to achieve the same good compatibility with the traditional mainframe.

2 external dispersion type: its role is first, the motherboard and the independent display card are used in parallel and close-range placement, which greatly reduces the occupied space volume. Second, the biggest advantage of this method is that you don't need to modify the heatsink and fan of the independent display card, you can use the original radiator and fan of the independent display card. And this way is very compatible. The disadvantage is that the required mainframe space is larger than the "internal dispersion".

Internally-distributed independent display card heatsink: Its function is first, and the internal-scattering independent display card heatsink is thin and flat, occupying a small volume. Second, since the heat sink is intimately contacted with the inner wall of the metal partition or the metal casing of the main box through the condensation section of the vacuum heat pipe, and the display card heat sink fan is not mounted on the heat sink, there is no additional heat dissipation. The volume of the device greatly increases the actual heat dissipation area of the individual display card. Third, due to the heat dissipation of the metal separator and the metal shell of the main box itself, the material cost and the quality of the display card heat sink are greatly saved. Fourth, because the strip-shaped fins of the display card heat sink have a certain angle of inclination with the geographical vertical direction, it is beneficial to the natural upward lift of the air heat flow.

The new type of internal independent display card heatsink and the independent display card are fixed: the traditional desktop mainframe, the independent display card is directly inserted vertically into the display card slot of the motherboard. Since the motherboard and the independent display card are both large-sized hardware in the main chassis, the space occupied by the two perpendicularly is large. But this way is very compatible with the hardware.

It has the following functions: First, the fixed heat sink achieves a historic speed in the ease of installation with a separate display card, and is installed in almost one second. Secondly, the fixed heat sink is pressed by the elastic silicone pad to vertically project the GPU wafer to the center of the back surface of the display card PCB, so that the surface of the GPU wafer is flat on the front surface of the heat conductive base. Because of the central force, the force between the GPU chip and the thermal base is naturally balanced. Third, the user no longer has to worry about the heat transfer effect caused by the uneven force of the four screws when installing the conventional heat sink. Fourth, because some computer mainframes use centralized display or nuclear display, there is no independent display card in the host. At this time, the position of the independent display card installed on the partition is idle. Other computer hardware such as a hard disk, a power supply box, a CD player, etc., may be installed in parallel with the position of the partition surface according to the needs of the user.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

The computer mainframe is referred to as the computer case.

As shown in FIG. 1 to FIG. 14, a computer mainframe includes a main casing 1 frame and a computer hardware, wherein the computer hardware includes a motherboard 4, a hard disk 203/power box 9 and a corresponding heat sink, and the main casing 1 / The skeleton is provided with a partition 3 which divides the cavity formed by the main casing 1 / skeleton into two, and the main plate 4 is fixed on one side of the partition 3 which is the front of the partition 3 . A hard disk 203/power supply box 9 is provided on the other side of the partition 3, which is the back surface of the partition 3. The motherboard 4, the hard disk 203/the power supply box 9 are all parallel to the side of the partition 3, and the circuit is provided on the front or/and the back of the partition 3 or the partition 3, and the circuit is provided on the partition 3 for the computer hardware. Connected bulkhead socket. When the separator 3 is made of a metal material, it is called a metal separator.

The mainframe of the computer is a vertical ultra-thin computer mainframe, and the overall outline is a flat square body, but the partial corners and planes have different angles or structures, and the volume is about 1/6 of the traditional PC main box, full load hard. In the case of the body, this ultra-thin host is about half the weight of a conventional PC mainframe. At the same time, you can install motherboard 4 models (such as ATX, M-ATX, ITX, etc.) that support almost all PCs currently on the market. The optical disk drive 204 is attached to the partition plate 3, and the thin optical disk drive 204 supporting the thickness of 14 mm is preferentially mounted. The hardware in this ultra-thin host has been reconfigured and the connection form is defined. There is a metal plate in the box, and the hardware is arranged in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately; the ultra-thin host has a matching integrated body. The U-shaped slider 2 housing (this slider 2 housing can be a transparent, translucent material) provides an extremely simple mode of operation for the user to open/close the unit. The front side of the partition plate 3 is further provided with a main board support column 31 (the main board 4 is mounted thereon), the partition 3 stealth circuit, the partition socket, the CPU heat sink 6 buckle 5, the CUP additional heat sink, the inner wall expansion socket 205. The motherboard I/O baffle partition slot 16 is provided.

The specific structure is as follows:

01) Motherboard support column 31

The front surface of the partition plate 3 is provided with a main board support column 31, and the main board 4 is fixed on the surface of the partition plate 3 through the main board support column 31. The main board support column 31 has an internal threaded hole perpendicular to the plate surface of the partition 3 or a bayonet hole matched with the expansion bayonet, and the main board support column 31 suspends the main board 4 in parallel on the front surface of the partition 3. And the back surface of the motherboard 4 is opposite to the front surface of the partition plate 3, and the main board 4 is fixed in the main board support column 31 on the partition plate 3 by screws or expansion bayonet pins. The motherboard 4 and the partition 3 are suspended so that the protruding pins on the circuit board on the back of the motherboard 4 do not come into contact with the surface of the partition 3 to cause a short circuit.

A plurality of main board support columns 31 are disposed on the front surface of the partition plate 3, and the height of the board surface of the partition plate 3 is 4-7 mm, and the distribution positions of the main board support columns 31 and the corresponding supporting main board 4 are provided. The mounting holes are matched one by one. The main board support column 31 is made of a conductive metal material and is fastened and electrically connected to the partition plate 3.

The motherboard support column 31 in the present application not only has the function of the main board support column 31 in the conventional main box, but also because the ultra-thin PC main box is designed as the main body of the DC negative/ground bearing of the whole machine. The mounting hole of the common motherboard is connected to the output DC negative pole and the ground of the motherboard 4, and the conductive screw or the bayonet is fixed to the motherboard support column 31 on the partition 3 through the motherboard mounting hole 47, thereby realizing The output DC negative/ground of the motherboard 4 is in direct communication with the bulkhead 3.

02) Separator 3 with stealth circuit

The above circuit is a flat conductor circuit and the maximum thickness of the conductor is ≤0.5 mm, and the flat conductor circuit and the separator 3 are insulated from each other, and the surface height of the flat conductor circuit is not higher than the height of the surface of the partition plate 3 around it, except for the socket. The entire surface of the circuit outside the area is covered by an insulating and wear-resistant layer. A plurality of hard bodies are mounted on both sides of the partition plate 3 in parallel, and most of the wires connecting the respective hard bodies are covered on the surface of the partition plate 3 or embedded in the partition plate 3 by using the above-mentioned very flat conductor circuit. Intensive configuration, centralized routing, efficient resolution of the signal between the hardware, power transmission, re-configuration of each hardware, greatly reducing the size of the main chassis.

The partition plate 3 is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate 3, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate 3, an ultra-thin insulating copper plate embedded partition plate 3 or a metal-based conductive Coating circuit separator 3. A platform for mounting fixed supports can be provided for each hardware.

Preferably, the separator 3 is a glass fiber/semi-glass fiber-based printed circuit-embedded separator 3, wherein the glass fiber/semi-glass fiber is a substrate, and the glass fiber/semi-glass is formed to meet the design requirements of the circuit wiring and the physical shape. The fiber-based PCB circuit board, the partition plate 3 is a metal plate made of aluminum alloy or copper, and a groove which is opposite to the shape and size of the corresponding PCB circuit board is processed at a position of one or both sides of the partition plate 3, The PCB circuit board is closely attached to the corresponding recess in the partition 3, so that the surface of the PCB circuit board is at the same plane height as the surface of the partition 3 on which it is placed. Since the flat conductor circuit on the separator 3 is closely integrated with the separator 3, the entire circuit surface is covered with the insulating layer and the wear layer except for the solder joints and the contact points of the circuit, so that almost no visible is observed. The circuit on the spacer 3 is referred to as "invisible circuit spacer 3". The flat conductor circuit on the hidden circuit board 3 is hereinafter referred to as "separator circuit 32". The partition 3 of the embedded PCB circuit board is covered with an insulating layer and a wear layer.

The specific operation process is to process a groove having a depth of 0.1 to 1 mm on the partition plate 3. The position, shape and size of the groove are determined according to the specific requirements of the wire, and then the ultra-thin printed integrated PCB circuit board is filled to the concave surface. In the groove, the groove of the separator 3 and the surface of the PCB circuit board are subjected to an insulating coating treatment, and the PCB circuit board is seamlessly fastened in the groove of the corresponding partition plate 3 by an adhesive. After tightening, the surface height of the PCB circuit board is basically the same as the height of the board surface of the partition plate 3, and finally the insulating and wear-resistant coating is applied on the entire surface of the partition plate 3 in which the PCB circuit board is fastened. Therefore, the partition 3 is integrated with the surface of the PCB circuit board, and the circuit inside is hardly seen.

Since the heat dissipation and heat dissipation of the back surface of the separator 3 is required, and the simplified design and process are integrated, the PCB circuit board is uniformly embedded in the front surface of the separator 3.

Preferably, the partition plate 3 is an ultra-thin insulating copper plate embedded with the partition plate 3, that is, a process of etching, CNC milling or die-molding, and processing the position of the metal plate (separator 3) where the wire is required to be processed into a place. The desired shape and size of the groove. The copper sheet with a thickness of 0.05-0.5 mm is made into various traces required for design by etching or die stamping and cutting process, and the outermost contour specifications of these copper traces are densely arranged with the metal plate ( The shape and size of the grooves on the partition 3) match. The groove on the metal plate (separator 3) and the processed ultra-thin copper piece are routed, the surface is insulated, and finally the ultra-thin insulating copper piece is closely embedded in the metal plate (separator 3) by an adhesive. In the corresponding groove position, the surface height of the ultra-thin copper wire is not higher than the surface height of the surrounding metal plate (separator 3). This process scheme is suitable for designing circuit traces that are arranged with excessive current on a metal plate (separator 3).

Preferably, the partition 3 is an FPC flexible wire interposer 3, except that the embedded circuit material is an FPC flexible wire, the other processes embedded in the separator 3 and the above-mentioned "glass fiber/semi-glass fiber-based printed circuit" The embedded partitions 3" are substantially identical.

Preferably, the separator 3 is a metal-based conductive coating circuit separator 3, that is, the metal surface is covered with an insulating layer, and then the liquid/colloidal/powder conductive coating is used to paint the desired trace circuit on the insulating layer. After curing by air drying or high temperature, a stable conductive circuit coating is formed, and finally the insulation and wear layer are covered on the entire circuit board 3 (except for the partial area connected to the bulkhead socket). The coatings and processes used in this solution are relatively expensive.

The partition plate 3 is made of the same material as the metal casing or the skeleton of the mainframe of the computer, and is integrally formed by heat-melting or extruding the material through a mold. The metal frame or the outer casing of the partition 3 and the mainframe of the computer may also be separated and separated, and the partition 3 is welded and fixed to the metal frame of the main box or the inner wall of the outer casing. Because the partition 3 is connected to the metal casing of the main box, it provides good heat conduction and heat dissipation support for the hardware attached to the surface of the partition 3 in parallel. The above-mentioned "metal case of the main chassis" is the "main case 1" in the figure.

The manufacturing method of the partition 3 with the metal invisible circuit and the metal shell or the skeleton of the main box is fixed: the integral type, that is, the partition 3 and the metal shell or the skeleton of the main box are of the same material, and the material is thermally melted by the mold. Or integrally formed after extrusion. Then, the process is processed on the partition 3 in the formed main box, so that the ultra-thin circuit traces required for the design are arranged on/in the partition 3; the reflow soldering, the partition 3 and the metal frame or the outer casing of the main box are Separate and independent, the ultra-thin circuit traces required for the design have been processed on/in the separator 3, and then the solder joint is applied to the metal frame of the main frame or the inner wall of the outer casing. After the combination is matched, it is placed in a reflow device for reflow soldering. After cooling out, the partition 3 is tightly fixed to the metal frame or outer casing of the main box.

03) partition socket

The bulkhead socket is soldered or touched directly to the corresponding circuit of the bulkhead 3. The hard interface type of the bulkhead socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk 203 interface, SAS hard disk 203 Interface, SATA 7+15pin data + power hard disk 203 interface, SATA 7+6pin data + power supply CD player 204 interface, motherboard 4 boot pin POWER SW, motherboard 4 restart pin RESET SW, USB 3.0 19/20pin jack, USB 2.0 9pin jack, audio pin HD AUDIO for motherboard 4, PCI-E 16X slot for standalone graphics card 7, main power supply 24pin slot for motherboard 4, auxiliary power supply for motherboard 4/ The 8pin slot and the auxiliary power supply 6/8pin slot of the standalone graphics card 7, or any combination of the above hardware interfaces. Some hardware in the main chassis can be directly inserted into the bulkhead socket, and some need to be connected to the corresponding bulkhead socket through the FFC wire, so the bulkhead socket is matched with the hardware. , with different interface category types and shape sizes. The bulkhead sockets interface the hardware in the main chassis with the corresponding bulkhead circuit 32 according to the interface type of the different hardware. The advantage of the FFC line is that it is ultra-thin, soft, accurate, and capable of passing a large current. It is suitable for short-distance docking between the partition socket and the hardware.

The "separator socket" described above is a general term for the following "welded/fixed bulkhead socket" and "movable bulkhead socket".

The bulkhead sockets are divided into welded and movable types according to the configuration and design requirements in the main chassis. The bottom of the "separator socket" is arranged with the corresponding pins (pins) of the socket. The corresponding mounting position of the spacer circuit 32 has solder joints, and the pins (pins) at the bottom of the "separator socket" are arranged. Direct soldering is fixed to the solder joint location of the corresponding spacer circuit 32. The welded bulkhead socket is also referred to as a fixed bulkhead receptacle 34.

In the movable type, the bottom of the "baffle socket" is arranged with the corresponding pins (pins) of the socket, and these pins (pins) are in the form of exposed conductive metal domes 104, and the metal at the bottom of the "separator socket" There are a plurality of positioning pins 94 around the shrapnel 104. The movable partition socket 35 is generally used for the design of different hardware in the same partition 3 position, that is, the number and type of hardware capable of supporting expansion in the main box can be increased without increasing the volume of the main box.

The area of the baffle circuit 32 for mounting the "moving baffle receptacle 35" has a concave configuration 33 in which the exposed conductive, flat circuit contacts are arranged in an orderly manner. The "circuit contact point" is "Inner concave contact point 33" in the figure. There are a plurality of positioning holes 36 in the partition 3 on the outer periphery of the concave area, and the size, the number, and the hole distance of the positioning holes 36 are completely identical with the matching positioning pins 94 at the bottom of the "moving bulkhead socket 35". .

When the bottom of the movable bulkhead receptacle 35 faces the mounting area on the bulkhead circuit 32, only the circuit contact point configuration specifications in the recessed area of the movable partition receptacle 35 of the interface type and the spacer circuit 32 are specified. When the circuit definition and the socket direction are completely matched, the positioning pin 94 at the bottom of the movable partition socket 35 can be inserted into the positioning hole 36 of the concave portion of the partition circuit 32, and finally the movable type by the screw/expansion bayonet The spacer socket 35 is fixed on the partition plate 3. At this time, the conductive metal dome 104 at the bottom of the movable spacer socket 35 and the circuit contact points in the concave portion of the spacer circuit 32 are completely and accurately connected to each other. . Since the mounting position of the movable partition socket 35 on the partition circuit 32 is an inner concave portion, there is a bare circuit contact point in the concave portion, and when the other hardware is installed at the same position, the bare portion is exposed. The surface height of the circuit contact point is lower than the height of the surface of the surrounding spacer 3, so that a short circuit is not caused by touching other hardware. When the recessed area is not used, the recessed area can be filled with a matching insulating patch to provide isolation insulation and dustproof.

Briefly, the bottom of the spacer socket is arranged with the corresponding pins of the socket, and the corresponding mounting position of the spacer circuit 32 has soldering points, and the pins at the bottom of the spacer socket are directly soldered and fixed to the corresponding spacers. The board circuit 32 is positioned; or the bottom of the bulkhead socket is arranged with the corresponding pins of the socket, and the pins are present in the form of bare conductive metal domes 104 around the shrapnel 104 at the bottom of the bulkhead socket. The positioning pin 94 is disposed, and the area for mounting the partition socket on the partition 3 has a concave structure, and the exposed conductive and flat circuit contact points are arranged in the concave area, and the outer periphery of the concave area The partition plate 3 is provided with a corresponding positioning hole 36. The partition hole is fixed to the partition plate 3 by a screw/expansion bayonet. The conductive metal dome 104 at the bottom of the partition plate is in contact with the circuit in the concave area on the partition plate 3. Point one by one to accurately touch the conduction.

Some hardware in the main chassis can be directly inserted into the "separator socket", such as 3.5-inch, 2.5-inch hard disk 202, because it is a more commonly used hardware, so that the design can be used directly, very fast and user-friendly . Hardware that can't be directly plugged into the “Baffle Socket” uses the concept of the shortest thread connection. The cable is used to connect these hardware to the matching “separator socket”, which greatly reduces the hardware. The wiring is made to make the whole machine simple and beautiful.

04) Motherboard 4 orientation

As described above, the main board 4 is abutted against the front surface of the partition 3, and is fixed in parallel to the main board support column 31 on the front side of the partition 3. Because the mainframe is of vertical design, on the one hand, the center of gravity of the whole machine should be moved down as much as possible, and the end of the motherboard 4 close to the CPU is obviously biased, and the downward placement can lower the overall center of gravity of the mainframe, so that the host The box is more stable in the vertical mode; on the other hand, the main box is vertical, and the air heat flow inside is continuously rising, and is concentrated in the upper space of the main box, and the temperature of the lower airflow of the main box relative to the upper air flow. To be low, the north end of the motherboard 4 near the CPU is placed downward, which is more conducive to the heat dissipation effect of the CPU heat sink 6 in the airflow.

Therefore, the north end side of the motherboard 4 near the CPU position is downward (can be vertical, or the angle between the downward direction and the vertical direction is ≤ 5°), and the west end of the motherboard 4 (ie, the motherboard I/O interface group 41) One end) faces the tail portion 13 of the main box, and the back surface of the main board 4 faces the front surface of the partition plate 3, and is fixed to the main board support column 31 parallel to the partition plate 3. Due to the angular position between the north end side and the west end side of the main board 4, there is a main board auxiliary power supply slot 46, which is projected on the front side of the partition 3 on the north end side of the main board 4 on the principle of the near-line connection. There is a bulkhead socket on the front side of the partition 3 adjacent to the motherboard auxiliary power supply slot 46. The bottom pin (pin) of the baffle socket is sequentially connected to the output +12V DC and the DC negative (ground) in the baffle circuit 32, respectively, through one end of the wire and the main board auxiliary power supply slot 46 on the main board 4. In communication, the other end of the wire is inserted into the bulkhead socket to communicate with the corresponding power supply circuit of the partition 3 and the motherboard auxiliary power supply slot 46 on the motherboard 4.

That is, the motherboard 4 is opposite to the front surface of the partition 3, and the north end side of the motherboard 4 near the CPU position faces downward, and the west end of the motherboard 4, that is, one end of the motherboard I/O interface group 41 faces the tail of the main chassis.

Projected on the north end of the motherboard 4 to the area on the front side of the partition 3, a partition receptacle is disposed on the front side of the partition 3 adjacent to the auxiliary power supply slot of the motherboard 4, and the bottom pin and partition circuit 32 of the bulkhead socket The connection is connected to the motherboard auxiliary power supply slot 46 on the motherboard 4 through a wire, and the other end of the wire is inserted into the bulkhead socket to connect the corresponding power supply circuit on the partition 3 with the motherboard on the motherboard 4. The power supply slots 46 are in communication.

05) CPU heat sink and CPU heat sink mounting fixture

The heat sink of the computer CPU includes a CPU additional heat sink 64 and a CPU heat sink 6. The CPU heat sink 6 is fixed by an H-bridge clamp device, that is, the mounting and fixing device of the CPU heat sink, the H-bridge press buckle The bracket comprises two sliding rods 52. The middle sections of the two sliding rods 52 are in parallel with each other. Both ends of the two sliding rods 52 are bent at an angle of 45° outward, at the two ends of the two sliding rods 52. Each of the bent sections has a support post 51 movable on the section. The bottom of the support post 51 has an expansion chuck. The size and shape of the expansion chuck are the same as the CPU heat sink 6 on the motherboard 4. The mounting holes are matched. Then, there are four movable support columns 51 at the two ends of the two sliding rods 52. Because of different types of the motherboard 4, the hole spacing between the mounting holes of the four CPU heat sinks 6 is different, so the sliding rod The support columns 51 at both ends of the 52 are designed to be movable, and can meet the hole spacing requirements of various mounting holes of the CPU heatsink 6, and are matched and fixed. The H-type bridge buckle bracket is the aforementioned buckle 5. The support post 51 is also referred to as a clip support post.

A bridge bar 53 which is freely movable in the direction of the axis of the two slide bars 52 is provided in a section parallel to the middle of the two slide bars 52, and the intermediate section of the bridge bar 53 has an inner groove structure. The two sliding rods 52 are resilient material members or the bridge pressing rods 53 are resilient material members. Since the sliding rod 52 of the buckle 5, the bridge bar 53 and even the convex structure on the back surface of the heat-conducting base are of a resilient characteristic material, the heat-conducting base and the CPU chip 42 are not caused by excessive force or imbalance during manual fastening. The thermal conductivity of the contact between the surfaces is excessively changed, and it is also difficult to deform and bend the main board 4. The two sliding rods 52 and the bridge pressing rods 53 are combined to form the "H" type structure, so the fastener 5 of the CPU is referred to as an "H-shaped bridge fastener bracket".

One end of the CPU additional heat sink 64 is a flat vacuum heat pipe evaporation end, and the other end is a vacuum heat pipe condensation end to which the (CPU) heat sink fin 63 is welded, and the CPU is attached to the heat sink 64. The corrugated tube greatly enhances the flexibility of the (CPU) vacuum heat pipe 62, making it easier for the user to operate and adapt to different types of motherboards 4. The bottom of the condensation end of the CPU additional heat sink 64 is flat, and is fixed on the inner wall of the metal shell of the main box closest to the CPU by screws or snaps, thereby transferring part of the heat of the CPU heat-conducting base 61 to the metal shell of the main box. The heat is dissipated from the heat sink fins on the condensation end of the CPU attached heat sink 64.

The CPU heat sink 6 is a vacuum heat pipe type heat sink, and the bottom of the CPU heat sink 6 has a heat conducting base mounted on the CPU chip 42. On the edge of the heat-conducting base of the CPU heat sink 6, there is a groove perpendicular to the direction of the vacuum heat pipe arranged on the heat-conducting base, and the shape of the groove is just matched with the evaporation end of the CPU additional heat sink 64, and the CPU is attached. After the evaporation end of the heat sink 64 is fitted into the groove of the edge of the heat-conducting base, the cover plate and the screw are fastened to the edge of the heat-conducting base. The front side of the thermally conductive base is directly parallel to the surface of the CPU wafer 42. The substantially central position of the back surface of the heat-conducting base has a convex structure, and the concave sliding groove of the middle portion of the bridge pressing rod 53 can just buckle the protruding structure, and the bridge pressing rod 53 is placed on the back surface of the heat-conductive base. Since the bridge pressing rod 53 of the buckle 5 passes through the convex structure at the center position of the back surface of the heat-conducting base, the downward pressure generated when the buckle 5 is tightened is concentrated on the central area of the heat-conductive base, so that the heat-conductive base and the CPU chip 42 are interposed. The contact surfaces are evenly stressed, making the thermal conductivity between them stable.

The heat conducting base is a convex structure that is fastened to the back surface of the CPU wafer 42 by the bridge pressing rod 53, and the bridge pressing rod 53 is movably fixed to the two sliding rods 52, and the two sliding rods 52 are movable. The chucks on the support columns 51 are respectively inserted into the mounting holes of the four CPU heat sinks 6 on the motherboard 4, and finally the expansion pins 54 are inserted into the pin holes in the support, thereby connecting the entire buckle 5 brackets together with the CPU heat sink. 6 is fastened together on the motherboard 4. Since the convex structure on the back surface of the heat conducting base can move in the concave sliding rail groove in the bridge pressing rod 53, the bridge pressing rod 53 can move on the sliding rod 52, so that the entire CPU heat sink 6 can be in any direction in the plane of the motherboard 4. The small-scale translation greatly reduces the probability that the edge of the CPU heat sink 6 cannot be properly installed due to the conflict with the position of the component on the motherboard 4.

The CPU additional heat sink 64 adopts a movable installation mode, and the user can freely select whether to install according to the demand, without replacing the entire CPU heat sink 6, which greatly saves the user's economic expenses. Although the main chassis is small in size, it uses the metal casing of the main box to transfer the heat of the CPU to the casing for heat dissipation, which greatly increases the effective area of heat dissipation.

Since the buckle 5 bracket adopts the movable fixed design in many places, it is almost compatible with all common motherboard models, the buckle 5 has few accessories and light weight, and the disassembly and assembly operation is extremely convenient, and the disassembly and assembly can be completed in 10 seconds.

Moreover, the bottom 12 of the ultra-thin PC main box casing has an elongated strip-shaped air inlet opening, which increases the airflow exchange around the bottom of the main box; and because of this long opening, the front of the partition 3 is greatly hindered. The heat on the floor area of the main box in the space is transferred to the main board floor area of the back space of the partition 3 and the partition 3 itself, so that the CPU attached to the main board bottom plate installed in the front space of the partition 3 is additionally cooled. The heat transferred by the device 64 can be taken away by the airflow more quickly, and is not transmitted to other parts of the mainframe to affect the heat dissipation of other hardware.

06) inner wall expansion socket 205

The mainframe of the computer is vertical, and one end of the motherboard 4 is placed near the north end of the motherboard 4, and the north end of the motherboard 4 is upward. The inner wall of the main casing of the motherboard near the south end of the motherboard 4 is the top inner wall of the main chassis. In the long strip-shaped area on the inner wall that is vertically 15 to 45 mm higher than the front surface of the main board 4, a long strip-shaped socket is movably mounted to form an inner wall expansion socket 205 of the main box, and the inner wall expansion socket 205 is It includes three interfaces, DC +5V, DC negative power supply interface, 7+6pin SATA optical drive 204 interface and 7+15pin SATA hard drive interface.

The inner wall expansion socket 205 adopts a long strip PCB circuit board to concentrate the wires, the long strip PCB circuit board closely fits the inner wall of the main box, the circuit board portion extends to the edge of the front surface of the partition plate 3, and the long strip PCB circuit board extends The circuit on the part is connected to the corresponding circuit on the partition 3, and is fixed by welding. The pins on the bottom of the interface socket are fixed on the corresponding circuit of the long PCB circuit board by soldering or contact action, and the orientation of the socket interface is parallel to the surface of the partition 3.

Considering the computer hardware of the optical disk drive 204, most users use the frequency very low, so the user-friendly "inner wall expansion socket 205" is designed to be movable and installed, and the user can select whether to install according to his own use requirements. .

When the thin optical disc drive 204 or the 2.5-inch hard disc 202 is inserted into the inner wall expansion socket 205, the thin optical disc drive 204 or the 2.5-inch hard disc 202 is parallel to the main board 4 and is located above the south end side of the main board 4. In view of practicality, the inlet port of the thin optical disk drive 204 faces the front of the main chassis. Cleverly and efficiently utilizes the free space above the south end of the motherboard 4, since the thin optical disc drive 204 and the 2.5-inch hard disc 202 are very light and low in heat generation, the influence on the center of gravity and heat dissipation of the entire main chassis is almost negligible. . In addition, since the motherboard 4 has a plurality of pins, slots and wires on the south end side, which affects the appearance, the thin optical disk drive 204 and the 2.5-inch hard disk 202 which are installed in parallel at the position of the motherboard 4 can be subtly blocked. To make the overall configuration of the mainframe more beautiful.

07) Motherboard I/O bezel partition card slot 16

A board I/O baffle partition card slot 16 is disposed at a position where an edge portion of the motherboard 4 on which the I/O interface group is located on the west end of the motherboard 4 is projected onto the partition 3, and the card slot is opened. A straight groove/hole slit with a slit width of about 1 mm and a seam depth of 2 to 3 mm. The total length of the slot/opening ≥ the total length of the motherboard I/O bezel 208 (the motherboard 4 tailgate) will be Before the motherboard 4 is loaded into the main chassis, a long side of the motherboard I/O shutter 208 (the rear panel of the motherboard 4) is first inserted into the groove/hole of the partition 3, and then the entire motherboard is The I/O shutter 208 (the motherboard 4 tailgate) is snapped into the matching opening of the motherboard I/O shutter 208 (the motherboard 4 tailgate) at the rear of the main chassis. Since the main box adopts the ultra-thin design concept, in order to minimize the space required for the main board 4 in the main box, the main board I/O baffle 208 (the main board 4 tailgate) The side near the back of the motherboard 4 is snapped into the slot of the partition 3 and is mounted in a manner as simple as a conventional mainframe.

The hardware installed in the space on the back side of the partition 3 includes a separate display card 7 including a heat sink, a power supply box 9, a turbo fan 201, a hard disk 203, and a power distribution module 10, and are all mounted in parallel on the partition 3, Since the plurality of hard bodies mounted on the back surface of the partition plate 3 have a certain requirement for heat dissipation, the back surface of the partition plate 3 is not only matched with the power supply box 9, the bulkhead socket, and the power distribution module 10, and the concave partition circuit is matched. In addition to the 32 contact points, the surface of the other areas on the back side of the separator 3 is presented as a flat, thermally conductive metal plate. The specific structure is as follows:

08) Independent display card 7

The independent display card 7 is disposed in parallel with the back surface of the partition 3. This ultra-thin computer mainframe can be installed to support all full-height, half-height, ultra-long, high-power independent display cards7. The I/O interface on the independent display card 7 is oriented in the same direction as the I/O interface on the motherboard 4, and the I/O interface area on the independent display card 7 is offset from the edge portion of the motherboard 4 PCB, and the motherboard 4 PCB board The edge is the edge portion of the PCB that is provided with the I/O interface, that is, the west end edge of the motherboard 4. The above-mentioned "I/O interface on the independent display card 7" is the "independent display card I/O interface group 71" in the figure, and the above "I/O interface on the motherboard 4" is the "main board I/" in the figure. O interface group 41".

The parallel display of the independent display card 7 on the back of the motherboard 4 includes the following two forms:

1 Internal dispersion type: There is a parallel heat-conducting material partition plate 3 between the independent display card 7 and the motherboard 4, and the side of the independent display card 7 with the heat sink is opposite to the surface of the partition plate 3, and the independent display card 7 The PCB surface is close to the side panel of the outer casing of the mainframe, that is, one side of the sliding cover 2 in FIG. The "PCB board of the independent display card 7" is the "independent display card PCB board 70" in the figure. The end side of the PCB board on which the I/O interface group 71 on the independent display card 7 is located is oriented in the direction in which the I/O interface faces, and the end of the PCB board where the I/O interface group on the motherboard 4 is located The distance is 15 to 40 mm. The motherboard board 4 and the PCB board of the independent display card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space volume.

Specifically, there is a metal plate between the independent display card 7 and the motherboard 4, that is, the one side of the metal plate is mounted in parallel with the main board 4, the back side of the main board 4 is opposite to the metal flat plate, and the other side of the metal flat plate is installed in parallel. The independent display card 7 has a facing metal plate of the GPU chip 72 on the independent display card 7, and the independent display card 7 is placed in parallel on the back side of the motherboard 4 near the south end region.

As described above, the 7I/O interface of the independent display card is aligned with the interface of the motherboard 4I/O, and the edge of the PCB board where the independent display card 7I/O interface is located protrudes in the direction in which their I/O interfaces are oriented. The distance between the edge of the PCB board where the motherboard 4I/O interface is located is 15-40 mm, that is, the I/O interface area on the independent display card 7 is translated to the outside of the west end of the motherboard 4. Moreover, there is no partition 3 between the portion of the independent display card 7I/O interface area protruding from the west end of the motherboard 4 and the motherboard 4. Since the I/O interface of the high-end independent display card 7 is mostly double-layered, it is ingenious to separate the display card 7 in consideration of being fully compatible with all the display cards and minimizing the space occupied by the display card. The I/O interface area is partially translated out of the west end of the motherboard 4. In addition, there is no barrier between the 7I/O interface area of the independent display card and the motherboard 4, so that the I/O interface of the independent display card 7 is single-layer or double-layer, which does not affect the main chassis. The internal installation is as good as the traditional mainframe. The independent display card 7 communicates with the corresponding display card slot 43 on the motherboard 4 via a riser card or extension cable.

2 External type: The side (back side) on which the heat sink cannot be mounted on the independent display card PCB board 70 faces the back of the motherboard 4, and the partition board 3 does not necessarily exist between the motherboard 4 and the independent display card 7, and the independent display card 7I/O The edge of the PCB where the interface is located does not have to protrude from the edge of the PCB where the 4I/O interface of the motherboard is located. The independent display card 7 communicates with a corresponding display card slot on the motherboard 4 through a riser card or an extension cable. The motherboard 4 and the independent display card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space volume. The biggest advantage of this method is that the heat sink and the fan 201 of the independent display card 7 need not be modified, and the original heat sink and the fan 201 of the independent display card 7 can be used, and the compatibility is good in this manner. The disadvantage is that the required mainframe space is larger than the "internal dispersion".

09) Internal scattered independent display card cooler 8

The heat sink mounted on the independent display card 7 is provided with a vacuum heat pipe 82 and a heat conducting base 81. The vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes on the heat sink are directly or indirectly and independently displayed. The GPU chip 72 of the card 7 is in contact with each other, and the condensation end of some or all of the vacuum heat pipes is in direct or indirect contact with the partition 3 or the inner wall of the metal casing of the main box. The "host box metal casing" is the "main box casing 1" in the figure.

The independent display card heat sink 8 is a flat heat sink as a whole, and has a small footprint. It comprises aluminum or copper fins 83 arranged in parallel spaced, 2-8 vacuum heat pipes and 1 or 2 of said heat conducting bases. The aluminum or copper heat sink fins form a main portion of the flat heat sink, and the flat heat sink is mounted in parallel on the independent display card 7 or on the back surface of the partition plate 3. The heat conductive base is disposed on the front surface of the heat sink, and the back surface of the heat sink The flattened condensation end of the vacuum heat pipe is arranged on the surface, and the evaporation end of the vacuum heat pipe is in close contact with the copper or aluminum heat conductive base. The condensing end of the vacuum heat pipe is extruded through a die into a semi-arc or flat shape in cross section, and is closely attached to the fin, and the condensing end of the semi-arc/flat vacuum heat pipe on the back surface of the heat sink is also in parallel Conductive heat is applied to the back of the board 3.

The flat heat sink further includes an array of vacuum heat pipes, each of which has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded on the heat transfer base. The condensation end of the vacuum heat pipe is extruded through the die into a "D" shape in cross section, that is, a flat side is formed at the condensation end of the vacuum heat pipe, and the flat side is parallel to the back surface of the heat sink, and A portion of the non-flat side formed by the condensation end of the "D" shaped vacuum heat pipe is fixed to the back surface of the heat sink in combination with the heat sink fin of the heat sink. When the back surface of the flat heat sink is mounted in parallel or in contact with the surface of the partition plate, the flat side of the condensing end of the "D" shaped vacuum heat pipe will be in parallel with the surface of the partition plate for heat conduction.

Since the heat sink is intimately in contact with the inner wall of the partition 3 or the metal casing of the main casing through the condensation section of the vacuum heat pipe, and the display card radiator fan 201 is not mounted on the radiator, there is no additional heat sink. The volume, so greatly increases the actual heat dissipation area of the independent display card 7. Moreover, the separator 3 for heat dissipation and the metal casing of the main box itself exist, and the material cost and the quality of the display card radiator are also greatly saved.

The heat sink is a mounting position area of the independent display card 7 fixed on the back of the partition plate 3. The heat sink is provided with one or more heat conducting bases, and the heat conducting base is closely fitted with the evaporation end of the vacuum heat pipe. The condensation end of the vacuum heat pipe is processed into a flat shape, and is closely attached to the back surface of the separator 3 or the inner wall of the metal shell of the main box, and the heat radiating fins arranged in parallel are arranged in a flat vacuum heat pipe. The back of the partition 3 or the inner wall of the metal casing of the main box.

Specifically, since the independent display card 7 has one side of the GPU chip 72 facing the partition plate 3, the side of the independent display card 7 facing the partition plate 3 and the partition plate 3 have a space, and the space is installed with a separate display card for heat dissipation. 8. The heat dissipating fins in the heat sink are arranged in parallel and spaced apart, and the strip fins perpendicular to the partition 3 have a certain oblique angle with the geographical vertical direction. The heat conducting base of the heat sink is in close contact with the surface of the GPU chip 72 of the independent display card 7, and the "evaporation section" in the vacuum heat pipe is tightly embedded in the heat conducting base; the "condensing section" of the other part of the vacuum heat pipe is distributed. The back surface of the separator 3 and the heat dissipation fins are closely adhered to the separator 3 and the heat dissipation fins. Or distributed on the inner wall of the metal shell of the main box near the display card, and closely fits the inner wall of the outer casing.

That is, the heat in the independent display card 7GPU wafer 72 is conducted by the "evaporation section" of the vacuum heat pipe which is conducted by the heat-conducting base close to the surface, and is quickly transferred to the "condensation section" by the "evaporation section". The heat-dissipating fins, the partitions 3 or the metal casing of the main box, which are in close contact with the "condensing section", exchange heat with the air for a large area to achieve the purpose of heat dissipation.

10) Fixing manner between the internal discrete type display card heat sink 8 and the independent display card 7

Due to the "internal discrete type display card heat sink 8", hereinafter referred to as "display card heat sink". The "display card" in the following is the "independent display card 7" in the figure, and the "main case cover/cover" in the following is the "slider 2" in the figure, "the PCB of the independent display card 7" That is, the "independent display card PCB board 70" in the figure. According to the design of the main box and user requirements, it is divided into two forms:

Active: After the display card heat sink is correctly installed and fixed with the independent display card PCB board 70, the gold finger socket of the display card is inserted into the display card slot of the back space of the main box, and the display card heat sink has been fixed. The backs of the partitions 3 are in parallel contact. Then, the GPU chip 72 of the independent display card 7 is vertically projected to the center of the back surface of the PCB of the display card, and the matching insulating elastic rubber pad 206 is pasted/mounted. When the main box cover is pushed through the chute in the main box, the The spacing between the cover plate and the PCB board of the independent display card 7 is smaller than the size of the elastic silicone pad 206. After the elastic silicone pad 206 is squeezed, a rebound pressure is generated to vertically act on the back surface of the independent display card PCB board 70. Also, since the display card heat sink and the individual display card PCB board 70 are fixed, this generated pressure finally causes the display card heat sink to be in close contact with the surface of the spacer 3. A part of the heat reaching the display card heat sink is efficiently conducted to the partition 3 for heat dissipation.

Fixed type: the display card heat sink is firstly mounted in parallel on the corresponding partition 3 position of the back space of the main box, at this time, the "condensing section" of the vacuum heat pipe 82 in the heat sink and the surface of the partition 3 or the metal shell of the main box The inner walls are in close contact. Then, a matching insulating elastic silicone pad 206 is pasted/mounted on the vacant independent display card 7 GPU wafer 72 vertically projected to the center of the back surface of the display card PCB.

The vacant independent display card 7 has a facing display card heat sink of the GPU chip 72, and the gold finger interface on the independent display card 7 is correctly inserted into the matching display card slot, and the independent display card 7 is The GPU chip 72 is in close proximity to the thermally conductive base 81 of the display card heat sink. After the main box cover is pushed through the sliding slot in the main box, the spacing between the cover and the PCB of the independent display card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed. The rebound pressure acts vertically on the back of the individual display card PCB board 70. After the center of the back surface of the GPU chip 72 on the independent display card 7 is pressed perpendicularly to the direction of the spacer 3, the surface of the GPU chip 72 is in parallel with the front surface of the display card heatsink base 81.

The stand-alone display card 7 is historically quick and easy to install with a fixed display card heatsink, and is installed in almost one second. Since the GPU chip 72 is subjected to the center position of the back, the surface of the GPU chip 72 can be smoothly attached to the surface of the heat-conducting base 81 of the display card heat sink, so that the force between the GPU chip 72 and the heat-conductive base 81 is naturally balanced. No longer have to worry about the heat transfer effect caused by the uneven force of the four screws when installing the traditional radiator.

11) Power supply box 9

The power box 9 is an ultra-thin contact type power supply box 9, which is provided with a bottom surface 91, a top surface and a side surface, and is provided with an input port of a power source and an output port 92 of a power source, and the output port 92 of the power box 9 is directly provided. A transmission structure that is electrically connected to the corresponding circuit on the partition 3 in the mainframe, and the output port 92 of the power box 9 does not exist between the corresponding circuit on the partition 3 in the mainframe of the computer. Connect the plugs and sockets of the third manufacturer.

The side of the power supply box 9 which is in parallel with the surface of the partition plate 3 is set as the bottom surface of the power supply box 9. On the bottom surface of the power supply box 9, there are two sets of contact copper pieces 93 having protrusions of 0.5 to 3 mm, and the first group is arranged in an orderly manner. The independent contact copper piece 93 has a front surface which is very smooth and bare and electrically conductive, and the front surface of each contact copper piece 93 is parallel to the bottom surface of the power supply box 9, and the back surface of the contact copper piece 93 is fixed at On one layer of insulating elastic rubber, the insulating elastic rubber is fixed in the power supply box 9, and the back surface of each contact copper piece 93 is only in communication with the positive DC 12V output circuit in the power supply box 9. Each of the contact copper sheets 93 has a positive area of 0.2 to 1 cm 2 ; the second group of copper sheets is a contact spring piece 104 that communicates with the VC 220 V circuit in the power supply box 9. And the two sets of contact copper sheets 93 and the bottom surface of the power supply box 9 are insulated from each other. a concave contact contact on the back surface of the partition 3 and matching the power supply installation area, and the bare contact circuit in the concave contact is in one-to-one correspondence with the contact copper piece 93 on the bottom surface of the power supply. There are a plurality of positioning holes 36 in the power supply installation area. The bottom surface of the power supply box 9 is flat and smooth except for the positioning pins 94 and the conductive contact copper pieces 93 which are protruded by 0.5 to 3 mm, and the bottom surface of the power supply box 9 is provided. It is connected to the negative DC 12V output circuit and the ground in the power supply box 9, and the power supply box 9 is fixed to the partition 3 by the fastening of the power supply box 9 by fastening screws.

Another type of power transmission port of the power box is: the power input port and the power output port of the power box are combined into an integrated port on the bottom surface of the power box, and the integrated unit is directly provided with the Corresponding bare conductive circuits on the spacers are pressed and contacted one after another to form a contact copper strip group, and each contact copper strip in the contact copper strip group may have different circuit definitions and respectively in the power supply box The corresponding circuits are connected. The bottom surface of the power box is mounted in parallel to a corresponding circuit area mounted on the partition surface.

The following is a scheme in which the bottom surface output port 92 of the power supply box 9 is in the form of a metal dome 104.

The power box 9 is mounted in parallel on the surface of the partition 3 in the main box. The largest side of the power box 9 has its bottom surface, which is made of a conductive metal material and directly contacts the surface of the spacer 3 in parallel. The bottom of the power box 9 has an "output port 92". The "output 埠 92" has a flat, ordered array of bare conductive metal domes 104. The metal domes 104 are insulated from the bottom surface of the metal of the power supply box 9, and the surface height of the metal domes 104 is convex. The surface of the bottom surface of the power supply box 9 is 0.5 to 3 mm.

The metal dome 104 in the "output 埠 92" is divided into two groups of larger areas and smaller areas. The power box 9 has an "input port" through which the alternating current or matching direct current outside the main box is input into the power box 9. A part of the alternating current is converted into a stable direct current output by the power box 9, wherein the direct current positive pole is connected with a group of metal shrapnel 104 having a larger area in the "output 埠 92", and the direct current negative pole/ground is connected to the bottom surface of the conductive metal of the power supply box 9. Another portion of the alternating current is connected to a group of metal domes 104 of smaller area in the "output 埠 92".

There are a plurality of protruding positioning pins 94 on the bottom surface of the power box 9, and a region of the partition 3 on which the power supply box 9 is mounted has a concave partition circuit 32 and a plurality of positioning holes 36, and a concave partition. Circuit 32 has exposed conductive, smooth, flat circuit contacts. And the concave-shaped spacer circuit 32 on the partition 3 and the positioning hole 36 and the metal elastic piece 104 in the "output port 92" of the bottom surface of the power supply box 9 and the protruding positioning pin 94 are in the size specification, The arrangement position and the circuit definition are perfectly matched. The bottom surface of the power supply box 9 is opposed to the mounting area of the partition plate 3, and the positioning pin 94 on the bottom surface of the power supply box 9 is completely matched with the positioning hole 36 on the partition plate 3, and then inserted, and then screwed/expanded. The power supply box 9 is fastened to the partition 3. At this time, the set of conductive metal domes 104 in the "output port 92" at the bottom of the power box 9 and the corresponding concave-shaped baffle circuit 32 on the spacer 3 are completely precisely matched and one-touch contact. Since the power supply box 9 is connected through the contact point of the concave partition circuit 32 on the partition 3, when the power supply box 9 is not mounted here, the concave area is filled with a matching insulating sheet, and the position can be at this position. Space to install other hardware. Achieve multi-effect matching of the same location space in the mainframe. At the same time, due to the extremely compact structure in the power box 9, and the direct connection with the diaphragm circuit 32 for transmitting power, without wires, the space occupied by the power box 9 in the main box is greatly reduced.

Circuit definition: Considering the different power supply requirements of different users for the mainframe, two installation positions of the power supply box 9 are designed in the mainframe, and two power supply boxes 9 can be installed at the same time and used in parallel. The partition 3 also has two corresponding recessed diaphragm circuits 32 contact points. Wherein the "input port" of the first power supply box 9 is connected by a wire plug, and a group of metal domes 104 having a smaller area in the bottom surface "output port 92" is transmitted to the partition plate 3 through the spacer circuit 32. The two recessed baffle circuits 32 correspond to the contact points, and the second power supply box 9 is properly mounted at the contact point of the second inner recessed baffle circuit 32. That is, the alternating current is input to the second power supply box 9 through the corresponding contact point of the second inner concave diaphragm circuit 32 to be converted into a desired stable direct current. The converted DC positive electrode in the second power supply box 9 communicates with a group of metal domes 104 having a larger area in the "output port 92", and passes through the contact point and the spacer circuit corresponding to the second inner concave diaphragm circuit 32. 32 transmits the DC positive pole to "Power Distribution Module 10".

The converted DC negative electrode in the power supply box 9 is connected to the bottom surface of the conductive metal of the power supply box 9. As can be seen from the above, the bottom surface of the power box 9 is mounted in parallel on the partition 3, and the partition 3 in the main box serves as the main conductor of the DC negative/ground bearing of the whole machine. Therefore, the metal bottom surface of the power supply box 9 and the surface of the partition plate 3 are in close contact with each other and are electrically conductive. The DC negative electrode on the partition 3 can pass through the conductive metal bottom surface of the power supply box 9 to transmit a large area and a large current to the DC negative circuit in the power supply box 9. The reason why the DC output of the power supply box 9 is directly contacted and transmitted to the corresponding partition circuit 32 of the partition 3 is because the contact area is large and the fit is tight, and a large current can be stably passed. Moreover, the power supply box 9 is in close contact with the partition wall 3 or the inner wall of the metal casing of the main box, and not only the DC negative electrode/ground in the power supply box 9 is smoothly connected to the partition plate 3, but also ingenious and efficient. The problem of heat dissipation of the power box 9 is solved.

The power box 9 is generally in the shape of a flat hexahedron. The maximum thickness of the power box 9 is ≤31 mm, wherein the length ≤150 mm, the width ≤110 mm; or the length ≤260 mm, the width ≤120 mm, the input of the power supply of the power box 9 is Input DC 12 V or VC 220 V, the output 埠 92 of the power box 9 is the output DC 12 V or VC 220 V.

The overall outline of the power box 9 is a flat square body, and the specific size and shape depend on the design requirements and the power level.

The heat dissipation mode of the power supply box 9: The ultra-thin power supply box 9 has a compact internal structure and a concentrated heat source. The outer casing of the power box 9 is made of aluminum alloy. The heat element in the power box 9 is directly attached to the aluminum alloy case, or the vacuum heat pipe is connected to the aluminum alloy case, and most of the heat is quickly transferred to the power box. 9 metal casings. Because the power box 9 is closely parallel to the partition 3 or a part of the inner wall of the metal shell of the main box, through the partition 3 or the metal shell of the main box, plus ventilation in the main box to achieve large-area efficient heat dissipation .

12) Power distribution module 10

The side of the power distribution module 10 that is in contact with the back surface of the partition 3 is a bottom surface 102. The bottom surface is provided with a "DC input port 102" and a "DC output port 103", a "DC input port 102" and a "DC output. Each of the ports 103" is arranged neatly and orderly with a contact copper piece 93 protruding from the bottom surface by 0.5 to 3 mm. The front faces of the contact copper strips 93 are smooth and bare and electrically conductive. The inwardly facing back faces of the copper strips 93 are fixed on elastic material members insulated from other circuits, and the elastic material members are fixed to the distribution mode. Within group 10.

On the bottom surface of the power distribution module 10, a plurality of raised positioning pins 94 are provided in addition to the "DC input port 102" and the "DC output port 103", and the power distribution module 10 is mounted on the partition plate 3 respectively. The "DC input port 102", the "DC output port 103" and the positioning pin 94 on the bottom surface of the module 10 are completely correctly matched to the concave circuit contact point and the positioning hole 36 in the size specification, the position direction, and the circuit definition. The surface of the contact point of the concave circuit is barely conductive, but is insulated from the spacer 3, and the contact points of the concave circuit are respectively connected to the corresponding spacer circuit 32.

The power distribution module 10 also incorporates a temperature control module. The power distribution module 10 provides power supply and installation location space and/or circuit routing structure for the temperature control module.

Structure circuit definition: the contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is connected with the DC input circuit in the power distribution module 10; the contact in the "DC output port 103" on the bottom surface of the power distribution module 10 The copper sheets 93 are respectively in communication with DC output power of different output voltage values within the power distribution module 10. The contact copper pieces 93 defined by different circuits are independent and insulated from each other, and the contact copper piece 93 is also insulated from the bottom surface of the power distribution module 10.

The contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is matched with the corresponding concave circuit contact point on the partition plate 3, and then the power supply box 9 is outputted to the above-mentioned partition circuit 32. DC is introduced into the power distribution module 10 and converted into DC power supply of different voltage values required by each hardware device, and the DC power of the different voltage values is respectively transmitted through the "DC output port 103" on the bottom surface of the power distribution module 10. After the contact copper pieces 93 are mated with the corresponding concave circuit contact points on the partition 3, the DC power supplies of the different voltage values are respectively transmitted to the corresponding partition circuit 32.

In the middle section of the back surface of the partition 3 in the main box, the power distribution module 10 is mounted on the back edge of the partition 3 adjacent to the front panel of the main casing, and the power distribution module 10 is integrated with one or the following One or more sockets and partition sockets with multiple types of interfaces: 6/8pin independent display card auxiliary power supply slot 73, 24pin motherboard main power supply slot 45, turbo fan 201 power supply interface, 7+15pin SATA hard disk 203 Interface, SATA Express hard drive 203 interface, SAS hard drive 203 interface, USB 3.0 19/20pin jack, USB 2.0 9pin jack, 7+6pin SATA disc player interface.

The bottom surface of the power distribution module 10 is a flat metal conductive material except for the "DC input port 102" and the "DC output port 103", and the DC output negative/ground circuit in the power distribution module 10 is connected to the metal bottom surface of the power distribution module 10. . The power distribution module 10 is fastened to the surface of the partition plate 3 in the main casing by screws or expansion pins in parallel, and is in contact with the surface of the partition plate 3 for large-area contact. In addition, one or more hardware-matched sockets or bulkhead sockets are integrated on the power distribution module 10, and are directly inserted into the matched socket/separator sockets of the power distribution module 10 through wires or the hardware self-contained interface. Connected. Therefore, the hard DC negative/ground connected to the socket/separator socket integrated on the power distribution module 10 is conducted to the partition 3 through the metal conductive bottom surface of the power distribution module 10. As can be seen from the above, the partition 3 is in contact with the conductive bottom surface of the power supply box 9, so that the bottom surface of the power distribution module 10 is connected to the bottom surface of the power supply box 9, that is, the DC negative/ground circuits of the two are in communication.

As described above, the power distribution module 10 is a DC power supply that converts a single voltage value of the DC power transmitted from the power supply box 9 into a different voltage value required for each hardware, and integrates one or A variety of socket/separator sockets that match the hardware interface. That is, the DC power supply of each voltage value converted and outputted in the power distribution module 10 is partially connected to the integrated socket/separator socket, and the corresponding power supply is transmitted to the matching by wire or hardware in-line. The DC power supply of the other voltage values outputted by the other part is respectively turned on to the corresponding contact point of the matching concave partition circuit 32 on the partition plate 3 through the "DC output port 103" on the bottom surface of the power distribution module 10, respectively. In the baffle circuit 32, the baffle sockets corresponding to the baffle circuit 32 are respectively connected to the interface/slot of the computer hardware to be supplied.

Since the bottom surface of the power distribution module 10 uses the same large-area pressure-contact conductive transmission structure as that of the power supply box 9, the large-current stable transmission can be performed between the power distribution module 10 and the partition circuit 32. Moreover, a plurality of hardware interface sockets and/or temperature control modules are integrated in the power distribution module 10, so that the structural design is more efficient and compact, and the integrated power distribution module 10 has a multifunctional integrated structure, which is convenient for the user to disassemble and assemble. and use.

13) Intelligent temperature control system

The intelligent main control system is provided in the mainframe of the computer, including a manual adjustment switch 18, a temperature control module, a fan 201, and a temperature probe 37. The manual adjustment switch 18 is disposed on the main casing of the mainframe, which is convenient for the user to operate, the temperature control module, The fan 201 is located at a desired position in the main box, and the temperature probe 37 is placed beside the CPU heat sink 6 or the display card radiator, and is in the downwind duct of the radiator airflow, and the temperature control module simultaneously and the manual adjustment switch 18 The fan 201 and the temperature probe 37 are connected. Firstly, manually adjusting the gear position of the switch 18 has limited the highest value and the lowest value segment of the voltage output from the temperature control module to the fan 201; secondly, the temperature probe 37 belongs to a thermistor, and the ambient temperature of the temperature probe 37 is high. The temperature control module connected to the temperature probe 37 is changed according to the value fed back by the temperature probe 37, and the corresponding supply voltage is accurately output to the fan 201 in the voltage section, thereby reaching the temperature probe 37. The purpose of automatically changing the speed of the fan 201 is to monitor the ambient temperature in real time.

The main board support column 31 type temperature probe 37, since the desktop computer does not necessarily have a separate display card 7, and the temperature of the CPU can more objectively reflect the change of the whole machine temperature, so it is necessary to be in the CPU A temperature probe 37 is placed near the radiator 6.

There is a motherboard mounting hole 47 between the PCI-E slot on the motherboard 4 and the memory strip slot 44. The mounting hole is correspondingly connected to the corresponding motherboard support post 31 on the partition 3. The temperature probe 37 includes the following two forms:

1 fixed type, the temperature probe 37 is generally columnar, the upper end is a temperature probe 37 element, the size can just pass through the corresponding motherboard mounting hole 47; the lower end is the pin of the temperature probe 37 component, fixed to the corresponding partition by welding On the circuit 32, the temperature probe 37 is entirely perpendicular to the front surface of the partition 3, and the motherboard mounting holes 47 between the PCI-E slot and the memory strip slot 44 on the motherboard 4 are mapped on the front surface of the partition 3. s position;

In the movable type, the motherboard mounting hole 47 between the motherboard 4 PCI-E slot and the memory strip slot 44 is mapped to a socket corresponding to the front surface of the partition 3 with a temperature probe 37. The temperature probe 37 socket is soldered and fixed on the corresponding partition circuit 32, and its height is not higher than the height of the other main board support columns 31. When the main board 4 is correctly mounted on the main box 3, there is a rod shape. The temperature probe 37 has a temperature probe 37 component at the upper end and a connection plug at the lower end. The lower end of the rod-shaped temperature probe 37 is inserted into the motherboard mounting hole 47 between the PCI-E slot and the memory strip slot 44 of the motherboard 4, and inserted into the temperature probe 37 socket of the partition 3, at this time. The temperature probe 37 is in proper communication with the corresponding circuit on the bulkhead 3, and the upper temperature probe 37 element is above the front surface of the motherboard 4 for reading the temperature of the airflow at that location.

The computer mainframe adopts the above intelligent temperature control system, which has excellent user operation and is very user-friendly. It is no longer necessary to consider whether the fan 201 has a PWM function, nor does it need to enter the motherboard 4BISS to open and set, and the heat dissipation and noise can be obtained. Perfect dynamic balance.

14) Cooling air duct

The mainframe of the computer is provided with a suction-type cooling air duct, and the cooling method adopts an exhaust-type air-cooling heat dissipation, wherein the turbo fan 201 for exhausting air outside the main box is installed at the tail portion 13 of the main box, and the whole machine has two large The main air inlet and two small auxiliary air inlets, the two large main air inlets are the CPU air inlet 22 and the display card air inlet 23, and the two small auxiliary air inlets are the bottom air inlet 15 and the side air inlet 14 .

The CPU air inlet 22 is located on the right side panel of the main unit casing, and has a large opening near the CPU heat sink 6; the display card air inlet 23 is located at the front of the main unit casing, corresponding to the area of the main box in which the independent display card 7 is mounted. There is a large elongated opening in the position; the bottom air inlet 15 is located on the bottom casing of the main box, and the partition 3 in the main box and the main board 4 extend perpendicularly to the two intersecting lines on the bottom plate of the main box. There is a slender opening; the side top air inlet 14 has a small elongated opening at a position on the left side panel of the main casing casing near the top 11 and the front of the main casing.

In the air suction type air duct, except for the above four air inlet openings and the optical disc machine 204 into the disc opening 24, there is no other air inlet hole, and the fan 201 in the tail of the main unit box keeps the inside of the box. The air is pumped to the outside of the box, causing the air pressure in the box to be lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets into the box. Usually, when the rapid airflow generated by the air blowing form encounters the real object, the air pressure on the surface of the object will rise, and the air pressure will increase to the heat state, which is not conducive to the heat exchange between the surface of the object and the air of the airflow; The air pressure on the surface of the air duct slightly decreases, and the low-pressure air will more absorb the heat and expand its volume, which is beneficial to the heat exchange between the surface of the object and the air of the air.

The cold air flowing in from the CPU inlet 22 flows through the corresponding CPU radiator 6, and the cold air becomes a heat flow after absorbing the heat. Since the main chassis is vertical, the CPU heat sink 6 is in the lower half and the turbo fan 201 is in the upper half. The higher temperature heat flow flows to the top of the main box due to its natural lift and the suction of the turbo fan 201, and the lower temperature part of the heat flow is absorbed by the turbo fan 201 on the back side of the partition 3, through the edge of the partition 3 and the front panel 21 of the sliding cover. The gap between the walls flows into the lower half of the space on the back of the partition 3. Since the lower half of the back surface of the partition 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, the heat flow flowing therethrough can absorb the heat generated by the power supply box 9 and the hard disk 203.

The cold air flowing in the air inlet 23 of the display card directly flows through the corresponding independent display card heat sink 8, the upper half of the back surface of the partition 3, and the inner top of the main box in the back space of the partition 3. In the middle position on the back side of the partition 3, that is, below the mounting area of the independent display card 7, a display card windshield 39 is disposed between the position of the display card air inlet 23 and the turbo fan 201 on the back of the partition 3, and the display card windshield 39 At the same time, the back surface of the partition plate 3 and the inner wall of the sliding cover 2 are sealed. The cold air of the air inlet 23 of the display card is simply and efficiently drained through the heat sink of the independent display card 7 to absorb heat, and finally extracted by the turbo fan 201, and the air passage is not interfered with by the heat flow in other spaces in the main box.

Since the vent hole 38 is opened in the central portion of the partition 3, the turbo fan 201 is attached to the vent hole 38 on the back surface of the partition 3. The cold air flowing in the bottom air inlet 15 flows through the lower half of the front surface of the partition 3 and the lower half of the back surface of the main board 4. Since the lower half of the back surface of the partition plate 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, a part of the heat generation is transmitted to the lower half of the partition plate 3, and the cold air which flows in from the air inlet 15 of the tank bottom is taken away by the cold air; The other part of the heat is mainly transferred to the tail and the bottom of the metal casing of the main box for heat dissipation; and a part of the heat is absorbed by the lower temperature heat flow remaining after the CPU air inlet 22 flows as described above.

Considering that the high-power independent display card 7 generates a large amount of heat, and the air volume of the air inlet 23 of the display card is limited, a side air inlet 14 is also added, and the inflowing cold air mainly absorbs the area in the back space of the partition 3 in the main box. And a small portion of the heat in the upper end region of the back of the partition 3. The cold air flowing in the four air inlets is heat-exchanged with the heat sinks of the radiators, the partitions 3, the heat generating hardware, and the metal casing of the main casing, and then becomes air heat flow, and is installed in the upper half and the tail of the main box. The turbofans 201 are exhausted from the outside of the tank.

In addition to several air inlets, the sealed design of the whole machine, together with the hardware configuration in the main box, is scientific and concise, and the generated wind resistance is small. In addition, the ultra-thin PC mainframe has a small volume. When the air is used, the air pressure difference generated in the box is more obvious than that of the large main box. The air flow formed in the main box has a large air flow and a high wind speed. Moreover, the air passage formed by the low pressure generated by the suction, together with the scientific arrangement of the hardware, is simple, the wind resistance is small, and the air in the air passage flows in an orderly manner, and the phenomenon of returning hot air does not occur.

An air filter 25 is arranged on the four air inlet openings to filter dust entering the air in the box, so that the main box is kept clean and has good ventilation and heat dissipation performance for a long time.

15) Turbofan 201

A turbo fan 201 is mounted in the front space of the partition 3 and the back space of the partition 3,

The front space of the partition 3 has an I/O interface group of the motherboard 4 at a positional area on the west end side of the motherboard 4, and a host side of the left side of the motherboard 4 remaining on the side of the motherboard I/O interface group 41. The height of the components on the board 4 is less than 18 mm, so the space above the motherboard 4 is relatively wide, and the west end of the motherboard 4 is close to the tail casing of the main chassis. Therefore, a turbo fan 201 is installed on the inner wall of the tail casing of the main box at the position of the main board 4, and the air outlet of the turbo fan 201 is connected to the opening 17 of the tail casing of the main casing to discharge the airflow to the outside of the casing. The turbo fan 201 installed in the idle position of the west end of the motherboard 4 utilizes the idle position for exhaust and heat dissipation in an ingenious and efficient manner, without additionally increasing the volume of the main chassis, and the movable mounting structure does not affect the hardware at all. Disassembly and use.

A vent hole 38 is formed in the partition plate 3, and one side of the turbo fan 201 is attached to the back surface of the partition plate 3 against the vent hole 38. One side of the turbo fan 201 draws air in the gap between the partition plate 3 and the main plate 4 through the vent hole 38 in the partition plate 3; the other side of the turbo fan 201 extracts air in the back space of the partition plate 3. The air outlet of the turbo fan 201 is connected to the opening of the tail casing of the main box, and all the extracted air is discharged outside the box;

The turbo fan 201 mounted on the inner wall of the outer casing of the main casing includes the following two forms:

1 fixed type, that is, the turbo fan 201 is fixed to the inner wall of the tail casing of the main box by screws or mounting slots;

2 movable type, the guide rail is installed on the two frames perpendicular to the air outlet of the turbo fan 201, and the opening of the fan 201 is installed at the tail casing of the main box, and the shape and size of the opening are exactly the same as the turbo fan 201. The cross section of the air outlet is matched. A rail chute is vertically mounted on the inner wall of the tail casing of the main casing, and the turbine fan 201 with the rail is matched with the rail chute on the inner wall of the tail casing of the main casing, and the turbo fan 201 passes through the main casing. The opening on the tail casing can be freely moved inside and outside the main box. When the installed turbo fan 201 obstructs the disassembly and assembly of the hardware in the main box, the turbo fan 201 can be moved to the outside of the main box, and the main box is placed in the main box. After the hardware is disassembled, the turbo fan 201 is moved back to the inner wall of the main body casing.

Although the present invention has been disclosed above by way of example, it is not intended to limit the novel creation. In the above introduction, the computer mainframe is customarily referred to as a computer mainframe in Chinese, and the mainframe of the computer is also referred to as a computer chassis. Anyone with ordinary knowledge in the technical field can make some changes and refinements without departing from the spirit and scope of this new creation. Therefore, the scope of protection of this new creation is defined by the scope of the attached patent application. quasi.

1‧‧‧Hosting case
11‧‧‧Top of the main box casing
12‧‧‧Bottom of the main box casing
13‧‧‧The tail of the main box casing
14‧‧‧Side-top air inlet
15‧‧‧ bottom air inlet
16‧‧‧Main board I/O baffle partition card slot
17‧‧‧Exhaust opening
18‧‧‧Manual adjustment switch
2‧‧‧Sliding cover
21‧‧‧Sliding front panel (front part of the main box housing)
22‧‧‧CPU air inlet
23‧‧‧ display card air inlet
24‧‧‧Into the disc opening
25‧‧‧Dust net
3‧‧‧Baffle
31‧‧‧ motherboard support column
32‧‧‧Baffle circuit
33‧‧‧ concave contact points
34‧‧‧Fixed bulkhead socket
35‧‧‧Mobile partition socket
36‧‧‧Positioning holes
37‧‧‧Temperature probe
38‧‧‧ventilation holes
39‧‧‧Display card windshield
4‧‧‧ motherboard
41‧‧‧ motherboard I/O interface group
42‧‧‧CPU chip
43‧‧‧PCI-E/display card slot
44‧‧‧ memory strip slot
45‧‧‧Main board main power supply slot
46‧‧‧ motherboard auxiliary power supply slot
47‧‧‧ motherboard mounting holes
5‧‧‧ buckle
51‧‧‧Support column, also known as the buckle support column
52‧‧‧Sliding rod
53‧‧‧ Bridge bar
54‧‧‧Expansion pin
6‧‧‧CPU cooler
61‧‧‧(CPU) thermal base
62‧‧‧(CPU) vacuum heat pipe
63‧‧‧(CPU) heat sink fins
64‧‧‧CPU additional radiator
7‧‧‧Independent display card
70‧‧‧Independent display card PCB board
71‧‧‧Independent display card I/O interface group
72‧‧‧ GPU chip
73‧‧‧Independent display card auxiliary power supply slot
74‧‧‧ (independent display card) gold finger
8‧‧‧Independent display card cooler
81‧‧‧ (independent display card radiator) thermal base
82‧‧‧ (independent display card radiator) vacuum heat pipe
83‧‧‧ (individual display card heatsink) heat sink fins
9‧‧‧Power box
91‧‧‧ bottom
92‧‧‧ Output埠
93‧‧‧Contact copper
94‧‧‧Locating pin
10‧‧‧Power distribution module
101‧‧‧ (underside of power distribution module)
102‧‧‧DC input port
103‧‧‧DC output
104‧‧‧Shrap
201‧‧‧fan
202‧‧‧2.5 inch hard drive
203‧‧‧ Hard disk
204‧‧‧CD player
205‧‧‧Expansion socket
206‧‧‧矽 pads
208‧‧‧ motherboard I/O bezel.

1-8 is a schematic structural view of a computer mainframe in use in the present invention. Figure 9-12 shows the structure of the partition of the mainframe of the computer. Figure 13 is a schematic view showing the structure of a mainframe of a computer equipped with a slide cover. Figure 14 is a schematic view of the structure of the slider. Fig. 15 is a schematic view showing the mounting structure when the display card of the present invention is mounted on the partition plate. Figure 16 is a schematic view showing the structure of the display card in the creation embodiment of the present invention mounted on the partition. FIG. 17 is a schematic structural view of a stand-alone display card heat sink according to a novel embodiment of the present invention. 18 is a schematic structural view of a power supply box. 19 is a schematic structural view of a power distribution module. Figure 20 is a schematic view showing the structure of a movable partition socket. Figure 21 is a schematic view showing the structure of the CPU heat sink when it is installed. Figure 22 is a schematic view showing the structure of a mounting and fixing device for a CPU heat sink.

201‧‧‧fan

206‧‧‧矽 pads

35‧‧‧Mobile partition socket

4‧‧‧ motherboard

45‧‧‧Main board main power supply slot

7‧‧‧Independent display card

73‧‧‧Independent display card auxiliary power supply slot

8‧‧‧Independent display card cooler

9‧‧‧Power box

10‧‧‧Power distribution module

Claims (10)

A heat dissipation structure of a computer independent display card, comprising: a heat sink matched with a separate display card, wherein: the main body portion of the heat sink is composed of heat dissipation fins arranged in parallel with each other and is generally flat, and the heat sink is provided a front side and a back side, the front surface of the heat sink is provided with a heat conducting base, and the outwardly flat side of the heat conducting base of the heat sink is in close contact with the surface of the GPU chip of the independent display card, the heat sink The back surface is in parallel with the surface of the partition plate in the mainframe of the computer. The partition is divided into two parts of the space of the mainframe of the computer, and is parallel or parallel on one or both sides of the partition. A computer hardware including a motherboard, a hard disk, a power supply box, and a fan is installed, and the independent display card is disposed in parallel with the partition. The heat dissipation structure of the computer independent display card according to claim 1, wherein: the heat sink further comprises an array of vacuum heat pipes, each of the vacuum heat pipes having an evaporation end and a condensation end, all of the vacuum heat The evaporation end of the conduit is closely attached or embedded in the thermally conductive base, and the condensation end of the vacuum heat pipe is extruded through a die into a semi-arc or flat cross section, and is closely attached to the On the heat dissipating fins, some or all of the condensation ends of the vacuum heat pipes are distributed on the back surface of the flat heat sink and are in parallel contact with the separator surface for heat conduction. The heat dissipation structure of the computer independent display card according to claim 1, wherein: the heat sink further comprises an array of vacuum heat pipes, each of the vacuum heat pipes having an evaporation end and a condensation end, all of the vacuum heat The evaporation end of the conduit is closely attached or embedded in the thermally conductive base, and the condensation end of the vacuum heat pipe is extruded through a die into a "D" shape in cross section, that is, condensation in the vacuum heat pipe The end forms a flat side, and the flat side is parallel to the back surface of the heat sink, and the non-flat side portion formed by the condensation end of the "D" shaped vacuum heat pipe is the same as the heat sink The heat dissipating fins are fixedly coupled to the back surface of the heat sink, and when the back surface of the flat heat sink is in parallel to the surface of the partition plate, the condensation end of the vacuum heat pipe of the “D” shape is flat. One side will be placed in parallel on the surface of the separator for heat conduction. The heat dissipation structure of the computer-independent display card of the second or third aspect of the invention, wherein: the other condensation end of the vacuum heat pipe on the heat-conducting base of the heat sink extends to the metal of the computer The inner wall of the outer casing is closely attached to the inner wall of the metal casing of the computer main body in parallel. The heat dissipation structure of the computer independent display card according to the first, second or third aspect of the patent application, wherein: the GPU chip of the independent display card is vertically projected to the center of the back surface area of the PCB of the display card, and the insulating rubber is disposed or placed. An insulating silicone, the pressure generated by pressing the insulating silicone after the side panel of the mainframe of the computer is fixed, and the heat conductive base of the heat sink and the surface of the independent display card GPU or the back of the heat sink The flat side of the condensing end of the distributed vacuum heat pipe is in close contact with the surface of the separator to complete the conduction of thermal energy. A heat dissipation structure of a computer independent display card, comprising: a heat sink matched with a separate display card, wherein: the heat sink comprises a heat conductive base, a vacuum heat pipe and heat dissipation fins arranged in parallel with each other, each of the vacuum heat pipes Having an evaporation section and a condensation section, the thermally conductive base is in close contact with the surface of the GPU chip of the independent display card; the evaporation section in the vacuum heat pipe is in close contact with the thermal base or Embedded in the heat-conducting base; the condensation section of the vacuum heat pipe is closely adhered to the heat-dissipating fins, and is closely adhered to the inner wall of the partition or the metal shell of the main box; The heat in the GPU chip on the independent display card is conducted by the heat conducting base that is in contact with the surface to the evaporation section of the vacuum heat pipe to absorb heat, and then the evaporation section is quickly transferred to the a condensing section that exchanges heat with air over a large area by the heat dissipating fin, the partition or the main casing metal casing in close contact with the condensing section; wherein the partition is a computer The chassis space is divided into two, and a computer hardware including a motherboard, a hard disk, a power supply box, and a fan is mounted in parallel or parallel on one or both sides of the partition, and the independent display card is separated from the partition. The plates are arranged in parallel. The heat dissipation structure of the computer independent display card according to claim 6, wherein: the heat dissipation fin is a strip-shaped heat dissipation fin perpendicular to the partition, and each of the heat dissipation fins and the geographic vertical direction It has a certain angle of inclination. A computer independent display card installation structure, comprising a separate display card, a motherboard, an I/O interface group of the independent display card, and an I/O interface group on the motherboard, the I/O of the independent display card The interface group and the I/O interface group on the motherboard refer to the independent display card and an input/output interface on the motherboard for connecting with a device external to the computer mainframe, wherein: the independent display card The PCB board surface is parallel to the motherboard board surface of the motherboard and is disposed on the back of the motherboard. The socket of the I/O interface group on the independent display card faces the I/O interface group on the motherboard. The socket is oriented in the same direction, and a heat sink is mounted on one side of the PCB of the independent display card, and a parallel conductive material partition is disposed between the independent display card and the motherboard, and the partition is the computer The main chassis space is divided into two, and the computer hardware including the motherboard, the hard disk, the power supply box, and the fan is mounted in parallel or parallel on one or both sides of the partition. The main body portion is composed of heat radiating fins arranged in parallel with each other The heat sink is provided with a front surface and a back surface, and the front surface of the heat sink is provided with a heat conductive base, and the outwardly flat side of the heat conductive base is flatly attached to the GPU chip of the independent display card. The back surface of the heat sink is in parallel with the surface of the partition plate; wherein a side of the independent display card on which the heat sink is mounted is opposite to the surface of the partition plate, and the PCB of the independent display card The other side of the heat sink is not mounted opposite the back of the motherboard and is adjacent to the side panel of the housing of the mainframe. The installation structure of the computer independent display card according to claim 8, wherein: the edge of the PCB board on which the I/O interface group on the independent display card is located is oriented in the direction of the socket of the I/O interface group; It should protrude from the edge of the PCB board where the I/O interface group on the motherboard is located by a distance of 15 to 40 mm. The installation structure of the computer independent display card according to claim 8, wherein: the independent display card passes through an interface matching partition socket or a display card adapter card, and the extension cable is disposed on the independent display card. The gold finger interface is in communication with the corresponding independent display card slot on the motherboard.