CN205880769U - Baffle among computer - Google PatentsBaffle among computer Download PDF
- Publication number
- CN205880769U CN205880769U CN201620485730.XU CN201620485730U CN205880769U CN 205880769 U CN205880769 U CN 205880769U CN 201620485730 U CN201620485730 U CN 201620485730U CN 205880769 U CN205880769 U CN 205880769U
- Prior art keywords
- dividing plate
- Prior art date
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- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
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- G06F1/18—Packaging or power distribution
The utility model discloses a baffle among computer, the baffle is divided into two the computer space, is equipped with the front and the back on the baffle, inseparable laminating / the embedded circuit that has flat form constitutes the baffle circuit in the baffle front and/or the back or the baffle, and the thickness <= 0.5mm of conductor in the baffle circuit is equipped with the baffle socket that corresponds the intercommunication with the baffle circuit on the baffle, computer hardware including mainboard, hard disk, power pack, independent display card, fan passes through baffle socket phase -match and correctly feeds through each other the carried forward, or direct touch its interface subsides to install switch on after correctly mating, contact on the exposed electrically conductive circuit contact point that corresponds on the baffle. The utility model is suitable for an in the ultra -thin host computer of repopulation computer hardware, reduce quick -witted case thickness greatly, make that quick -witted case is small, light in weight, succinct pleasing to the eye, and the line of walking between each hardware concentrates, has hidden effect, provide advantage support, dismouting computer hardware convenient and fast in addition for designing ultra -thin host computer.
This utility model relates to the technical field of computer hardware equipment, the skill of the dividing plate in a kind of host computer Art.
The main flow of existing conventional desktop computer mainframe box is tower mainframe box, and its overall build is cuboid.Desktop computer Mainframe box have horizontal and vertical point, typically with vertical most commonly seen.In mainframe box, all of physics parts are commonly referred to as Computer hardware, including mainboard, hard disk, CPU, memory bar, display card, CD-ROM drive and power supply, and each radiator.Existing tower Mainframe box is non-ultra-thin case, and build is big, Heavy Weight.
1) hardware arrangement and cabling: the hardware arrangement in conventional desktop mainframe box at present is designed as, and a locational space is several A kind of computer hardware can only be installed and used, so in order to meet the more hardware of support, be provided with in mainframe box a lot of each firmly The installing space position of part, when some hardware installation position uses less than, just can only be idle at that, waste mainframe box greatly Interior spatial volume, makes the space availability ratio in mainframe box the lowest.
Data between each hardware or confession electrical connection in the mainframe box of conventional desktop, the overwhelming majority uses RVV and leads Line, couples together by between each hardware that wire will be associated.But owing to the layout in legacy hosts case and cabling mode fall After, adding that various hardware is numerous, the connection wire formed is also crisscross, complicated the most various, and using not only user needs Possess certain professional knowledge background, and had a strong impact within mainframe box attractive in appearance, various cablings occupy the most significantly Spatial volume in cabinet.In traditional mainframe box, owing to the arrangement of each hardware exists irrational reason, add that employing is commonly led Line is connected, and the distance that connects between hardware is not the shortest, also cannot accomplish the connection of minimal path, because the shortest, commonly Wire becomes the thickest but also hard, uses so being not easy to very much user installation.
2) structure of cpu heat and installation thereof: traditional cpu heat is with 4 screws/expansion bayonet lock, by master Cpu heat is fixed on mainboard by the CPU installing hole on plate, rigidity or material, frame mode close to rigidity.Usually occur Five kinds of problems below: first, the tension twisted due to screw/expansion bayonet lock, the stress between radiator and mainboard is excessive, causes mainboard Bending in various degree.Second, sometimes due to each stress degree is unbalanced during this 4 fastened by screws, cause cpu chip Between the heat-conducting base of surface and radiator, local tilts, and produces microscopic spaces, considerably increases at the bottom of cpu chip and radiator heat conduction Heat conductivity between Zuo, hinders cpu chip heat transfer between radiator.3rd, traditional cpu heat and supporting Fastener, part are various, install cumbersome, mostly need a few minutes to ten a few minutes.4th, parts of traditional CPU dissipate When hot device is arranged on mainboard, it is impossible to mobile or can only single-way moving.Cause and sometimes occur on cpu heat and some mainboard Conflicting mutually in component position, and can not the drawback of normal mounting.5th, the cpu heat of most of traditional high-side is in order to reach Preferably radiating effect, can only the size build increasing radiator simply.So make large-scale cpu heat to mainframe box and The compatibility of mainboard is substantially reduced, and the cost that user buys the most substantially increases.
It addition, the CPU overwhelming majority TDP power consumption that domestic consumer uses is all within 100W, but in view of top CPU with super Frequently the challenging needs of user, power consumption more than the 180W to be reached that cpu heat can carry.Therefore to the performance of radiator it is also proposed that Higher requirement.
3) installation of display card and heat radiation: the display card in conventional desktop mainframe box, if low and middle-end video card, one As be use video card first wife radiator dispel the heat.If high-power high-end video card, or use high, loaded down with trivial details water-cooled Scheme, or reinstall more preferable air-cooled radiator.But major part display card air-cooled radiator or have on the market Fixed compatible scope, otherwise kit is many, complex installation process.And do not possess the user of certain Professional knowledge not Know and select which type of radiator most suitable.
Traditional host desktop case, display card exist in terms of heat radiation below some problem:
First, if display card uses air-cooled, due to mounting means and the restriction of dimensions, heat sink size is almost Not can exceed that the size range of video card itself.And a part of volume of the fan radiator to be occupied of its coupling, so heat radiation The actual area of dissipation of device is limited.
Second, if using water-cooled, its high expense of light is not said.The water tank supporting with water-cooled, water pump, radiator, wind Fan, water pipe etc. are required for additionally increasing the volume and weight of cabinet.And install loaded down with trivial details, also need to possess certain during user installation water-cooled Professional manipulative ability.
3rd, display card is perpendicular with cabinet side board air inlet.If using air-cooled, air inlet flow into Cold air is by the CPU radiator fan on mainboard and the common unordered interference of VGA COOLER, and the cold air outside cabinet can not Completely, flowing through of one-dimensional order display card radiator carries out high efficiency and heat radiation because not science, tight air channel in cabinet, Make in the cold air of inflow display card, cpu heat entrainment of reflux heat air, have impact on the heat exchange effect of radiator.
4th, display card radiator is to place in horizontal parallel, is highly detrimental to air hot-fluid lift the most upwards.
Traditional host desktop case, display card is directly vertically to be inserted in use in the card slot of mainboard.Due to mainboard In cabinet, broadly fall into large-sized hardware with display card, be mutually perpendicular spatial volume that the mode of installation takies very Greatly.But this mode is fine to the compatibility of hardware.
4) heat dissipation wind channel: the heat dissipation wind channel in conventional desktop mainframe box designs not science, unordered, nearly all there is reflux heat The phenomenon of wind.And in order to increase CPU or display card heat radiation effect, simply by increase heat sink size volume solve. Metal shell by means of cabinet itself the simplest, effective transmits, spreads a part of thermal source.
It addition, the noise that rotation speed of the fan produces with it always is a big contradiction of wind-cooling heat dissipating.Conventional desktop machine host Rotation speed of the fan in case generally has two kinds of forms: one is fixed rotating speed, and one is to carry out temperature control by connection mainboard PWM socket Rotating speed.The former, no matter temperature in chassis height is the most all rotating speed, not a science；The latter, fan first has to possess PWM merit Can, carrying out under mainboard BISS to be entered opening, arranging, user needs possess certain Professional knowledge.And fan model is numerous Many, if the fan noise being under PWM rate controlling pattern is excessive or wind speed is less than normal, user effectively adjusts almost without way Joint.
5) power supply: the power pack volume in conventional desktop mainframe box is relatively big, its function is by the municipal alternating current direct of input Switch through the direct current output of different magnitudes of voltage needed for changing each hardware into, use numerous RVV wire to dock with each hardware respectively, add and upload Design arrangement in system mainframe box falls behind, and causes the various wires of case in main frame close and numerous, crisscross, takies wave greatly Take the spatial volume in mainframe box and have impact on the attractive in appearance of main frame, also having hindered the convenience that user uses.
Summary of the invention
For overcoming the defect of existing product technology, this utility model purpose is to provide one can be hard with rearrangement computer Part, makes connection cabling required between hardware be concentrated into ultra-thin circuit and have concealment effect, can significantly reduce main frame volume and weight Dividing plate in the host computer of amount, provides advantage support for designing ultra-thin main frame.
Further objective is that installation computer hardware is precisely, fast.
This utility model is realized by following technical proposals:
Dividing plate in a kind of host computer, dividing plate is provided with front and the back side, also includes mainboard, hard disk, electricity in main frame The computer hardware such as source capsule, display card, fan.It is characterized in that: host computer space is divided into two by described dividing plate, described every Fit tightly/be embedded with the circuit of Ultrathin tabular form in plate front and/or the back side or dividing plate, the thickness of conductor in circuit≤ 0.5mm.Matched by the dividing plate socket of the corresponding connection of circuit ultra-thin with on dividing plate between each computer hardware the most correct after docking Connection, or directly just will carry out on the circuitry contacts of the tactile exposed conduction being arranged on dividing plate correspondence of tailored interfaces patch of hardware Really turn on after coupling, contact.
/ the circuit of embedded Ultrathin tabular form, hereinafter referred to as " dividing plate is fitted tightly on/within described main frame median septum Circuit ".These are connected with corresponding dividing plate circuit by dividing plate socket, wire and are arranged on, directly against touching, match exposed Computer hardware on the dividing plate circuit of conduction, parallel or parallel patch is touched and is arranged on the one side of dividing plate or two-sided by these above-mentioned hardware On.
Mutually insulated between described dividing plate circuit and described dividing plate, flat conductor circuit apparent height not higher than the most about every The height on plate surface.Whole dividing plate circuit surface have insulation and wearing layer close over.
Described dividing plate is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit, metal base printed circuit board, FPC Flexible cord arranges embedded dividing plate, the embedded dividing plate of ultrathin insulating copper sheet or Metal Substrate conductive coating circuit dividing plate.
Described dividing plate is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit, by glass fibre/half glass fibre Base PCB is fabricated to wired circuit and the physical appearance size of design, and dividing plate is that aluminium alloy or copper metal are put down Plate, on dividing plate, one side or the position of double-sided design, process the groove matched with above-mentioned PCB shape and thickness, Above-mentioned PCB is closely covered on dividing plate in the groove of correspondence, makes at PCB surface and its place baffle surface In same plane height.Have on whole of the dividing plate of above-mentioned embedded PCB insulation, wearing layer close over.
Described dividing plate is identical material with metal shell or the skeleton of host computer and is integrally formed, by mould by material Dividing plate is made to be made of one piece with metal shell or the skeleton of computer housing after material hot melt or extruding.
Described dividing plate and the metallic framework of host computer or shell are that separation is independent, dividing plate and cabinet metallic framework or outer It is welded and fixed between shell inwall.
Described dividing plate socket directly welds or pastes and touches on the dividing plate circuit being connected to correspondence.The hardware interface class of dividing plate socket Type include SATA 2.0 data-interface, SATA 3.0 data-interface, SATA Express hard-disk interface, SAS hard-disk interface, SATA 7+15pin data+power supply hard-disk interface, SATA 7+6pin data+power supply CD-ROM driver interface, the starting up of mainboard insert Pin POWER SW, mainboard restart contact pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin insert Mouth, mainboard audio frequency contact pin HD AUDIO, display card PCI-E 16X slot, mainboard main power supply 24pin slot, mainboard auxiliary Power supply 4/8pin slot and display card auxiliary power supply 6/8pin slot, or the combination in any of above-mentioned hardware interface.
The bottom ordered arrangement of described dividing plate socket the pin that this socket is corresponding, in the corresponding installation site of dividing plate circuit On have pad, the pin bottom described dividing plate socket be directly weldingly fixed on correspondence dividing plate circuit position on.
Or the bottom ordered arrangement of described dividing plate socket the pin that this socket is corresponding, and these pins are led with exposed Presented in electric metal shell fragment, the periphery of the described shell fragment bottom dividing plate socket is provided with the alignment pin of projection, on dividing plate There is the installation region of structure in concave shaped corresponding installation position, and in concave shaped region, ordered arrangement the electrical contact of exposed conduction Point, is provided with on the dividing plate of neighboring, concave shaped region and positions hole accordingly, and dividing plate socket is existed by screw/expansion bayonet fastenings Electricity behind installation position corresponding on dividing plate, in the concave shaped region that conducting metal shell fragment bottom dividing plate socket is corresponding with on dividing plate Contact point patch the most one by one in road touches conducting, the location on installation position that the alignment pin of dividing plate socket bottom protrusion is also corresponding with on dividing plate Coupling is inserted mutually one by one in hole.
It is distributed in the one side of described dividing plate, is fixed with several mainboard support columns front of dividing plate (this face be set to), support It is 4～7mm that post protrudes from the height in plate face, and the peace on the mainboard of the distributing position of described mainboard support column and corresponding support Dress Kong Weixiang mates one by one, and described mainboard support column is conducting metal material.
The internal thread hole being perpendicular to dividing plate plate face or the pin hole matched with expansion bayonet lock is had in described mainboard support column, Described mainboard support column is by parallel for mainboard hanging in membrane front face, and the mainboard back side is relative with membrane front face, by screw or Expand in the mainboard support column that mainboard is fixed on dividing plate by bayonet lock.
A kind of dividing plate in host computer, it is characterised in that: host computer space is divided into two by described dividing plate, on dividing plate Being provided with front and the back side, described dummy substrate is the metal plate of conduction, and dividing plate is provided with dividing plate socket, and it is designed as computer master The main carrying conductor of the direct current negative pole of machine complete machine/ground connection transmission, exists including mainboard, hard disk, power pack, display card, fan The interior parallel or parallel patch of computer hardware is touched on the one or both sides being arranged on dividing plate, including mainboard, hard disk, power pack, independence Video card, fan by dividing plate socket or directly with conducting metal dividing plate are affixed to touch at interior computer hardware and are born by the direct current in hardware Polar circuit/ground connection is conducted with metal partion (metp).
The beneficial effects of the utility model are:
This utility model can major part hardware in layout host computer again, hence it is evident that reduction host computer volume and weight Amount, makes connection cabling required between hardware be concentrated into ultra-thin circuit and have concealment effect, provides strong for design ultra-thin case Support.This ultra-thin main frame volume is about the 1/6 of the full tower crane case of tradition, and in the case of fully loaded hardware, ultra-thin main frame is the full tower of tradition About the half of cabinet weight.This ultra-thin main frame can meet installs the mainboard model supporting the most nearly all routine (such as: ATX, M-ATX, ITX etc.), can install support all 3.5 cun of hard disks, 2.5 cun of hard disks, can install and support all overall heights, partly Height, overlength, powerful display card, can install the notebook CD-ROM drive within support 14mm thickness.Each hardware in mainframe box Rearrangement, type of attachment definition are carried out.Having a metal plate in case, what each hardware was orderly is installed in parallel in this metal plate Two sides on, user can the most fast, dismount accurately, assemble required hardware；This mainframe box has an integral type matched "U" shaped slide lid housing (this slide lid housing can be material transparent, translucent), opens/closes mainframe box for user and provide Extremely easy operator scheme.Complete machine is also equipped with heat dispersion and a key intelligent temperature control system of hommization of excellence.This is ultra-thin Cpu heat, display card radiator, power pack and air ejector fan in main frame are the customization matched with this ultra-thin main frame Size model.
The setting of particularly relevant parts has the advantage that
1) the mainboard support column on dividing plate is the same effect with tradition cabinet, but here more than purposes.Because mainboard Support column is conduction, and is connected with dividing plate.Because this ultra-thin case metal partion (metp) is designed as complete machine direct current negative pole and The carrying leading body of ground connection.The installing hole of PC class mainboard be with mainboard output direct current negative pole and ground connection position be connected, pass through In the mainboard support column that conduction screw or bayonet lock are fixed on dividing plate by mainboard installing hole, i.e. achieve the part that mainboard exports Direct current negative pole/ground connection directly connects with metal partion (metp), and the Partial DC negative pole/ground connection of mainboard output first passes through mainboard support column It is transferred on metal partion (metp), then is returned to power pack by touching with metal partion (metp) plate surface large area patch bottom power pack.And tradition PC It is to use a large amount of wires to be connected with the confession electrical slot of mainboard in mainframe box, direct current negative pole output whole for mainboard is directly returned to Power pack, it would be desirable to a large amount of wires and take more spatial volume.
2) on dividing plate hidden embedded/cover Ultrathin tabular circuit, described dividing plate can be described as " stealthy circuit dividing plate ".Electricity By redefining arrangement in brain server, hardware compatibility fabulous (custom hardware of on the market more than 99% can be supported).The most ingenious Achieve same position space and according to the different demand of user, different hardware, locus in improve cabinet can be installed Utilization rate and freely collocation property time, cabinet volume is tapered to minimum: first, stealth circuit dividing plate efficiently solve each hardware Between signal, electrical transfer, each hardware of rearrangement, be greatly reduced the volume of cabinet；Second, provide for each hardware and install admittedly The fixed platform supported；3rd, because the dividing plate of metal matrix is connected with cabinet metal shell, touches for parallel patch and be arranged on the dividing plate back of the body The hardware in face provides good heat conduction, support of dispelling the heat.
3) dividing plate socket is that the interface type according to different hardware is by direct with corresponding dividing plate circuit for the hardware in cabinet Or dock mutually；The advantage of FFC line row be ultra-thin flexible, precisely, can mistake larger current, it is adaptable to dividing plate socket and hardware Between the docking of relatively short distance.Dividing plate socket directly welds or pastes and touches on the dividing plate circuit being connected to correspondence.
First, in cabinet, some hardware can be inserted directly in the dividing plate socket matched use.As 3.5 cun, 2.5 cun hard Dish, because it is relatively often to substitute the hardware used, so can the design that uses of straight cutting, very quick hommization.Those cannot be direct Insert the hardware used in dividing plate socket, then use the connection theory of line of shortest length journey, with flexible cord row by these hardware with mate Dividing plate socket docks mutually.Also cabling between hardware is greatly reduced, succinct in making complete machine, attractive in appearance.
Second, movable dividing plate socket, it is generally used for same partition position and the design of different hardware can be installed.I.e. not In the case of increasing cabinet volume, hardware quantity and the type of extension in increasing cabinet, can be supported.
3rd, owing to movable mode clapboard socket installation position on dividing plate circuit is one piece of concave shaped region, recessed area In have the circuitry contacts of nuditing wire.Exposed electrical contact when same position is mounted with other hardware, in recessed area The apparent height of point is less than the height on perimeter walls surface, so short circuit will not be produced because touching other hardware.Not When using this recessed area, this recessed area is filled and led up by available supporting insulating pad, plays isolated insulation and dust-proof effect.
Accompanying drawing explanation
Fig. 1-8 is the computer casing structure schematic diagram in this utility model use；
Fig. 9-12 is the structural representation in the dividing plate use of computer housing；
Figure 13 is provided with the computer casing structure schematic diagram of slip lid；
Figure 14 sliding lid construction schematic diagram；
Equipped with mounting structure schematic diagram during video card on Figure 15 this utility model dividing plate；
The structural representation of video card is installed on Figure 16 this utility model dividing plate；
The structural representation of Figure 17 display card radiator；
The structural representation of Figure 18 power pack；
The structural representation of Figure 19 Power entry module；
The structural representation of Figure 20 movable mode clapboard socket；
Figure 21 is structural representation during cpu heat installation；
Figure 22 is the structural representation of the fixing device for installing of cpu heat.
Identifier declaration in each accompanying drawing be presented herein below:
1, mainframe box shell；11, the top of mainframe box shell；12, the bottom of mainframe box shell；13, mainframe box shell Afterbody；14, side jacking air port；15, bottom air inlet；16, mainboard I/O baffle plate dividing plate draw-in groove；17, air draft perforate；18, manually adjust Joint switch；
2, slip lid；21, slip lid front panel (casing is anterior)；22, CPU air inlet；23, video card air inlet；24, dish is entered Perforate；25, Air Filter；
3, dividing plate；31, mainboard support column；32, dividing plate circuit；33, concave shaped contact point；34, fixed dividing plate socket； 35, movable mode clapboard socket；36, hole, location；37, temperature probe；38, air vent；39, video card windscreen；
4, mainboard；41, mainboard I/O interface group；42, cpu chip；43, PCI-E/ card slot；44, memory bar slot； 45, mainboard is main for electrical slot；46, mainboard auxiliary power supply slot；47, mainboard installing hole；
5, fastener；51, support column, also referred to as fastener support column；52, sliding bar；53, bridge depression bar；54, expansion anchor；
6, cpu heat；61, (CPU) heat-conducting base；62, (CPU) vacuum thermal pipe；63, (CPU) radiating fin；64、 CPU attached heat sinks；
7, display card；70, display card pcb board；71, display card I/O interface group；72, GPU chip；73, independent aobvious Card auxiliary power supply slot；74, (display card) golden finger；
8, display card radiator；81, (display card radiator) heat-conducting base；82, (display card radiator) Vacuum thermal pipe；83, (display card radiator) radiating fin；
9, power pack；91, bottom surface；92, output port；93, contact copper sheet；94, alignment pin；
10, Power entry module；101, (Power entry module) bottom surface；102, direct current input port；103, direct current delivery outlet；104, bullet Sheet；
201, fan；202,2.5 cun of hard disks；203, hard disk；204, CD-ROM drive；205, extension socket；206, silicagel pad；208、 Mainboard I/O baffle plate.
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is further described:
Such as Fig. 1-Figure 14, a kind of computer housing, including computer host housing 1/ skeleton and computer hardware, wherein computer hardware Including mainboard 4, hard disk 203/ power pack 9 and corresponding radiator, in computer host housing 1/ skeleton, it is provided with dividing plate 3, dividing plate 3 Being divided into two by the cavity that computer host housing 1/ skeleton is constituted, mainboard 4 is fixed on a side of dividing plate 3, this side Front for dividing plate 3.Hard disk 203/ power pack 9 is located on another side of dividing plate 3, and this side is the back side of dividing plate 3.Mainboard 4, hard disk 203/ power pack 9 is all parallel with the side of dividing plate 3, described dividing plate 3 front or/and be provided with circuit in the back side or dividing plate 3, Dividing plate 3 is provided with the dividing plate socket carrying out circuit connection for computer hardware.When dividing plate 3 is metal material manufacture, it is referred to as gold Belong to dividing plate.
This host computer is vertical super-thin host computer, and general outline build is flat cube, but the corner of local, flat There are different angles or structure in face, and volume is about the 1/6 of tradition PC mainframe box, and in the case of fully loaded hardware, this ultra-thin main frame is About the half of tradition PC mainframe box weight.Meanwhile, can install and support mainboard 4 model of the most nearly all PC class (such as: ATX, M-ATX, ITX etc.).Being provided with CD-ROM drive 204 on dividing plate 3, the notebook light within 14mm thickness is supported in preferential installation Drive 204.Each hardware in this ultra-thin main frame has carried out rearrangement, type of attachment definition.A metal plate, each hardware is had in case On the orderly two sides being installed in parallel in this metal plate, user can the most fast, dismount accurately, assemble required hardware； This ultra-thin main frame has integral type "U" shaped slip lid 2 shell matched, and (this slip lid 2 shell can be material transparent, translucent Matter), open/close this main frame for user and provide extremely easy operator scheme.It is additionally provided with mainboard on the front of dividing plate 3 to prop up Dagger 31(mainboard 4 is installed on it), the stealthy circuit of dividing plate 3, dividing plate socket, cpu heat 6 fastener 5, CUP attached heat sinks, interior Wall extension socket 205, mainboard I/O baffle plate dividing plate draw-in groove 16.
Concrete structure is as follows:
01) mainboard support column 31
The front of dividing plate 3 is provided with mainboard support column 31, and mainboard 4 is fixed on 3, dividing plate by mainboard support column 31.Mainboard Having the internal thread hole being perpendicular to dividing plate 3 plate face or the pin hole matched with expansion bayonet lock in support column 31, described mainboard supports Post 31 is by parallel for mainboard 4 hanging on dividing plate 3 front, and mainboard 4 back side and dividing plate 3 vis-a-vis, by screw or inflating clip Mainboard 4 is fixed in the mainboard support column 31 on dividing plate 3 by pin.Mainboard 4 and dividing plate 3 hanging so that on mainboard 4 back-side circuit plate The stitch protruded will not touch with dividing plate 3 plate face and cause the probability of short circuit.
Arranging several mainboard support columns 31 on the front of dividing plate 3, the height protruding from dividing plate 3 plate face is 4～7mm, And the distributing position of these mainboard support columns 31 mates mutually one by one with the mounting hole site of the mainboard 4 of corresponding support.Mainboard supports Post 31 is conducting metal material, and fastens with dividing plate 3, conducts electricity and be connected.
Mainboard support column 31 in present specification not only possesses in traditional cabinet outside the function of mainboard support column 31, and also because of For this ultra-thin PC mainframe box dividing plate 3 is designed as the leading body of complete machine direct current negative pole/ground connection carrying, and the installation of conventional mainboard 4 Hole be with mainboard 4 output direct current negative pole and Earth Phase connect, conduction screw or bayonet lock pass through mainboard installing hole 47 be fixed on In mainboard support column 31 on dividing plate 3, i.e. achieve the output direct current negative pole/ground connection of mainboard 4 and directly connecting of dividing plate 3.
02) there is the dividing plate 3 of stealthy circuit,
Foregoing circuit is the maximum gauge≤0.5mm of flat conductor circuit and conductor, flat conductor circuit and dividing plate 3 Between mutually insulated, the height on flat conductor circuit apparent height dividing plate 3 surface not higher than the most about, except the region of mounting receptacle Other whole circuit surfaces outer have the covering of insulation and wearing layer.The most parallel on the two sides of dividing plate 3 it is mounted with much hardware, will be each The most of cabling being connected between hardware, uses the most flat above-mentioned conductor circuit be covered on dividing plate 3 surface or be embedded in In dividing plate 3, carrying out densely arranged, concentration cabling, efficiently solve the signal between each hardware, electrical transfer, rearrangement is each firmly Part, is greatly reduced the volume of cabinet.
Dividing plate 3 is that the glass fibre/half embedded dividing plate of fiberglass-based printed circuit 3, metal base printed circuit board, FPC are soft Line arranges embedded dividing plate 3, the embedded dividing plate of ultrathin insulating copper sheet 3 or Metal Substrate conductive coating circuit dividing plate 3.Can be that each hardware provides peace The fixing platform supported of dress.
Preferably, dividing plate 3 is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit 3, wherein glass fibre/half Glass fibre is substrate, and glass fibre/half being fabricated to meet the wiring of design requirement and physical form is fiberglass-based PCB, dividing plate 3 is the metal plate of aluminium alloy or copper material, one side or the position of double-sided design on dividing plate 3, processing Go out and the groove of corresponding PCB shape and size thickness equity mutually, PCB is closely covered on dividing plate 3 correspondence Groove in, make PCB surface and its place dividing plate 3 surface be in same plane height.Owing to flat on dividing plate 3 is led Body circuit and dividing plate 3 fit tightly one, and outside the pad of this circuit, contact point, whole circuit surface has been carried out absolutely Edge layer and the covering treatment of wearing layer, so the circuit being hardly visible on dividing plate 3, Gu be referred to as " stealthy circuit dividing plate 3 ".Stealthy Strap circuit on circuit dividing plate 3, hereinafter referred to as " dividing plate circuit 32 ".Whole of the dividing plate 3 of embedded PCB is enterprising Row insulation, the covering of wearing layer.
Concrete operating process is, processes the groove of deep 0.1～1mm on dividing plate 3, the position of groove, shape, size Depending on the real needs of cabling, more integrated for ultra-thin printing PCB is filled so far in groove, dividing plate 3 groove and PCB electricity Plate surface, road all carries out insulation and paints process, by binding agent by seamless for PCB dividing plate 3 groove being fastened on correspondence. After fastening is good, PCB apparent height is the most highly consistent with the dividing plate 3 plate face at place, is fastening the most again, embedded Carry out on whole of the dividing plate 3 of PCB insulating, wear-resisting coating, such dividing plate 3 is just combined into one on PCB surface Body, is also hardly visible the circuit of the inside.
It is contemplated that dividing plate 3 back side is with greater need for heat conduction and heat radiation, add simplification design, technique, unified by PCB It is embedded in the front of dividing plate 3.
Preferably, dividing plate 3 is the embedded dividing plate of ultrathin insulating copper sheet 3, i.e. becomes with etching, CNC mill processing or mould one The technique of type, is processed into required shape, the groove of size by needing the band of position of cabling on metal plate (dividing plate 3).With Etching or mould punching shear technique again the copper sheet that thickness is 0.05～0.5mm thickness is fabricated to design various walk Line, and these copper cablings densely arranged after outermost profile specification and this metal plate (dividing plate 3) shape of upper groove, chi Very little match.By the ultra-thin copper sheet cabling after the groove on metal plate (dividing plate 3) and processing, surface carries out insulation processing, Ultrathin insulating copper sheet cabling is closely embedded in the upper corresponding groove location of metal plate (dividing plate 3) by binding agent afterwards, and The apparent height of the apparent height of ultra-thin copper sheet cabling metal plate (dividing plate 3) the most about.This process program is suitable for The circuit trace of metal plate (dividing plate 3) upper design arrangement super-high-current.
Preferably, dividing plate 3 arranges embedded dividing plate 3 for FPC flexible cord, and the circuit material except embedding is in addition to FPC flexible cord row, its The technique that he is embedded in dividing plate 3 is basically identical with above-mentioned " the embedded dividing plate of the fiberglass-based printed circuit of glass fibre/half 3 ".
Preferably, dividing plate 3 is Metal Substrate conductive coating circuit dividing plate 3, is i.e. coated with insulating barrier in metal surface, then absolutely It is coated with the electrically-conducting paint of liquid/colloidal state/powder in edge layer and is drawn as required cabling circuit, then through air-drying or high temperature post cure, shape Become firm conducting channel coating, carry out the most again insulating on whole circuit dividing plate 3, (connecting partition is inserted in the covering of wearing layer Except the regional area of seat).Coating and technique used by this scheme all compare the most expensive.
Dividing plate 3 is identical material with metal shell or the skeleton of computer housing and is integrally formed, by mould by material It is made of one piece after hot melt or extruding.Dividing plate 3 and the metallic framework of computer housing or shell can also be that separation is independent, every It is welded and fixed between plate 3 and cabinet metallic framework or outer casing inner wall.Because dividing plate 3 is connected with cabinet metal shell, for parallel patch The tactile hardware being arranged on dividing plate 3 surface provides good heat conduction, support of dispelling the heat." master in above-mentioned " metal shell of cabinet " i.e. figure Casing 1 ".
Having the technology mode that the dividing plate 3 of metal hidden circuit and mainframe box metal shell or skeleton be fixedly linked is: one Body formula, i.e. dividing plate 3 and mainframe box metal shell or skeleton are identical material, one, with mould by material hot melt or extruding The most integrally formed.Carry out processes on dividing plate 3 in mainframe box the most after shaping, make to be placed with design on/within dividing plate 3 Required ultra-thin circuit trace；Reflow Soldering, dividing plate 3 and cabinet metallic framework or shell are that separation independent, on/within dividing plate 3 Through first having processed the ultra-thin circuit trace of design, afterwards dividing plate 3 to be connected with cabinet metallic framework or outer casing inner wall Connect fixing position, be first coated with and wipe solder, after combinations matches is good, places into and refluxing unit carries out reflow soldering.Out cool down After, dividing plate 3 is just tightly fastened mutually with cabinet metallic framework or shell.
03) dividing plate socket
Dividing plate socket directly welds or pastes on the circuit touching the dividing plate 3 being connected to correspondence, the hardware interface class of dividing plate socket Type includes SATA 2.0 data-interface, SATA 3.0 data-interface, SATA Express hard disk 203 interface, SAS hard disk 203 interfaces, SATA 7+15pin data+power supply hard disk 203 interface, SATA 7+6pin data+power supply CD-ROM drive 204 interface, master The starting up contact pin POWER SW of plate 4, mainboard 4 restart contact pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin socket, the audio frequency contact pin HD AUDIO of mainboard 4, the PCI-E 16X slot of display card 7, mainboard 4 Main power supply 24pin slot, the auxiliary power supply 4/8pin slot of mainboard 4 and the auxiliary power supply 6/8pin slot of display card 7, or Person is the combination in any of above-mentioned hardware interface.Some hardware in mainframe box can be inserted directly in dividing plate socket use, has then By FFC line row, hardware need to be connected with corresponding dividing plate socket, so, dividing plate socket is in order to match even with many hardware Connect, there is different interface types and geomery.Dividing plate socket is according to hard by mainframe box of the interface type of different hardware Part docks with corresponding dividing plate circuit 32 phase.The advantage of FFC line row be ultra-thin flexible, precisely, can mistake larger current, it is adaptable to every Plate socket is short-range with between hardware to be docked.
" dividing plate socket " in above-mentioned literary composition is following " welding type/fixed dividing plate socket " and " movable mode clapboard socket " It is referred to as.
According to the arrangement in cabinet and design requirement, dividing plate socket is divided into welding type and movable.Welding type, " dividing plate is inserted Seat " bottom ordered arrangement stitch corresponding to this socket (pin), the corresponding installation site of dividing plate circuit 32 has pad, In the weld locations of the dividing plate circuit 32 that the stitch (pin) of " dividing plate socket " bottom is directly fixedly welded on correspondence.Welding Formula dividing plate socket is also referred to as fixed dividing plate socket 34.
Movable, the bottom ordered arrangement of " dividing plate socket " stitch corresponding to this socket (pin), and these stitch (draw Foot) presented in exposed conducting metal shell fragment 104, the periphery at " dividing plate socket " bottom metal shell fragment 104 has some Individual alignment pin 94.Movable mode clapboard socket 35 is generally used for same dividing plate 3 position can install the design of different hardware, is not i.e. increasing In the case of adding cabinet volume, hardware quantity and the type of extension in increasing cabinet, can be supported.
The region being used for installing " movable mode clapboard socket 35 " on dividing plate circuit 32 is concave shaped structure 33, in recessed area Ordered arrangement exposed conduction, smooth circuitry contacts, and described " circuitry contacts " is " concave shaped contact point 33 " in figure. The dividing plate 3 of neighboring, recessed area has several position hole 36, and these location the sizes in hole 36, quantity, pitch-row with Coupling " movable mode clapboard socket 35 " bottom alignment pin 94 completely the same.
When the bottom of movable mode clapboard socket 35 is to installation region on dividing plate circuit 32, only when this interface type Movable mode clapboard socket 35 and circuitry contacts arrangement specification, circuit definitions, the socket in recessed area on dividing plate circuit 32 When direction matches completely, the alignment pin 94 bottom movable mode clapboard socket 35 just can be inserted into this dividing plate circuit 32 recessed area In the hole, location 36 on limit, finally by screw/expansion bayonet lock, movable mode clapboard socket 35 is fixed on dividing plate 3, now " movable Formula dividing plate socket 35 " bottom conducting metal shell fragment 104 complete, smart with the circuitry contacts in recessed area on dividing plate circuit 32 Accurate patch the most one by one touches connection.Owing to the movable mode clapboard socket 35 installation position on dividing plate circuit 32 is one piece of concave shaped region, Recessed area has exposed circuitry contacts, the exposed circuit when same position is mounted with other hardware, in recessed area The apparent height of contact point is less than the height on perimeter walls 3 surface, so short circuit will not be produced because touching other hardware. When not using this recessed area, this recessed area is filled and led up by available supporting insulating pad, plays isolated insulation and dust-proof Effect.
In brief, the bottom ordered arrangement of dividing plate socket the pin that this socket is corresponding, and dividing plate circuit 32 is pacified accordingly Pad, the pin bottom described dividing plate socket is had directly to be fixedly welded on dividing plate circuit 32 position of correspondence on holding position； Or the bottom ordered arrangement of dividing plate socket the pin that this socket is corresponding, and these pins are with exposed conducting metal shell fragment Presented in 104, the periphery of the described shell fragment 104 bottom dividing plate socket is provided with alignment pin 94, is used for installing on dividing plate 3 The region of described dividing plate socket is concave shaped structure, and in recessed area, ordered arrangement exposed conduction, smooth circuitry contacts, The dividing plate 3 of neighboring, recessed area is provided with hole 36, corresponding location, dividing plate socket by screw/expansion bayonet lock be fixed on every On plate 3, the conducting metal shell fragment 104 bottom dividing plate socket the most precisely pastes with the circuitry contacts in recessed area on dividing plate 3 Touch conducting.
Use during some hardware can be inserted directly into " dividing plate socket " in mainframe box, such as 3.5 cun, 2.5 cun of hard disks 202, because of it For relatively often substituting the hardware used, so can the design that uses of straight cutting, very quick hommization.Those cannot be inserted directly into " every Plate socket " the middle hardware used, then the theory using line of shortest length journey to connect, arrange these hardware and the " dividing plate mated with flexible cord Socket " dock mutually, the cabling being also greatly reduced between hardware, succinct in making complete machine, attractive in appearance.
04) mainboard 4 towards
From the above mentioned, mainboard 4 is to lean against dividing plate 3 front, on the parallel mainboard support column 31 being fixed on dividing plate 3 front.Cause Being upright type of design for mainframe box, on the one hand the center of gravity in view of complete machine to move down as far as possible, and mainboard 4 near one end of CPU position is Substantially lay particular stress on, place the overall decentralization that can make mainframe box down, make mainframe box more steady vertical when；Separately On the one hand, mainframe box is vertical, and its interior air hot-fluid is constantly upwards ascension, converges in upper strata, space in mainframe box, Relative to upper strata air-flow, the temperature of mainframe box inferior airflow is on the low side, so placing down, more near the mainboard 4 the North limit of CPU Add beneficially cpu heat 6 radiating effect in the gas flow.
Therefore, will be close to the mainboard 4 the North limit of CPU position down (can be vertical, it is possible to downwardly direction with vertical between angle ≤ 5 °), the western end edge of mainboard 4 (i.e. one end of mainboard I/O interface group 41) is towards the afterbody 13 of cabinet, and mainboard 4 back side is to dividing plate 3 Front, is parallel to dividing plate 3 and is fixed on mainboard support column 31.Due to the arm of angle position between the North limit and western end edge of mainboard 4, There is a mainboard auxiliary power supply slot 46, the principle connected with cabling nearby, project on dividing plate 3 front on mainboard 4 the North limit Region, near this mainboard auxiliary power supply slot 46 dividing plate 3 front position on have a dividing plate socket.The bottom of this dividing plate socket Stitch (pin) is connected, by wire one respectively in order with the output+12V DC in dividing plate circuit 32 and direct current negative pole (ground connection) Head inserts with the mainboard auxiliary power supply slot 46 on mainboard 4 and connects, and the other end of wire inserts the connection of this dividing plate socket, makes dividing plate Power supply circuits corresponding on 3 are connected with the mainboard auxiliary power supply slot 46 on mainboard 4.
That is, mainboard 4 is to lean against dividing plate 3 front, near CPU position mainboard 4 the North limit down, the mainboard 4 i.e. mainboard of western end edge One end of I/O interface group 41 towards the afterbody of cabinet,
Projecting to the region on dividing plate 3 front on mainboard 4 the North limit, the dividing plate 3 of the auxiliary power supply slot of close mainboard 4 is just A dividing plate socket, the bottom stitch of described dividing plate socket is had to be connected with dividing plate circuit 32 on position, face, by one, wire with main Mainboard auxiliary power supply slot 46 on plate 4 inserts connection, and the other end of wire inserts the connection of this dividing plate socket, and it is right to make on dividing plate 3 The power supply circuits answered are connected with the mainboard auxiliary power supply slot 46 on mainboard 4.
05) radiator of CPU and the fixing device for installing of cpu heat
The radiator of this computer CPU includes CPU attached heat sinks 64 and cpu heat 6, and cpu heat 6 is by a H type Bridge clinching tool support is fixed, that is the fixing device for installing of this cpu heat, and H type bridge clinching tool support includes two sliding bars 52, two sliding bar 52 centre portions are in the state being parallel to each other, and two sliding bar 52 both ends all bend, outward in 45 ° of folders Angle, being respectively arranged with one on the section of the bending at two sliding bar 52 both ends can the support column 51 of movement, support on this section There is an expansion clamp post 51 bottom, and this expansion clamp size, shape are to match with cpu heat 6 installing hole on mainboard 4 's.So, the two ends of two sliding bar 52 bendings have 4 moveable support columns 51, and due to the mainboard 4 of different model, they are 4 years old Pitch-row between individual cpu heat 6 installing hole is the most different, so the support column 51 at sliding bar 52 two ends is designed to movably, Just can meet the pitch-row demand between various different cpu heat 6 installing hole, the installation that matches is fixing.H type bridge clinching tool Frame is exactly aforementioned fastener 5.Support column 51 also referred to as fastener support column.
Being provided with one on the section that two sliding bar 52 mesophases are parallel can be on the bar direction of principal axis of two sliding bars 52 The bridge depression bar 53 moved freely, described bridge depression bar 53 centre portion is inner groovy structure, and wherein said two sliding bars 52 are back Elastic material part or bridge depression bar 53 are resilience material member.Due to the sliding bar 52 in this fastener 5, bridge depression bar 53 even heat conduction The bulge-structure of base back surface is rebound characteristics material, will not cause heat conduction because stress during artificial fastening is excessive or unbalanced Base is excessive with the change of the heat conductivity of cpu chip 42 interfacial contact, is not easy to make mainboard 4 bending.Described two cunnings Lever 52 constitutes described " H " type structure together with combining with bridge depression bar 53, so the fastener 5 of CPU is referred to as " H type bridge clinching tool Frame ".
One of CPU attached heat sinks 64 is flat straight vacuum thermal pipe evaporation ends, and other end is to be welded with (CPU) heat radiation The vacuum thermal pipe condensation end of fin 63, the section between these two ends of CPU attached heat sinks 64 is processed into corrugated tube shape, significantly carries Having risen the bendability of (CPU) vacuum thermal pipe 62, user installation gets up to be more prone to operation and adapts to different types of mainboard 4. The bottom of the condensation end of CPU attached heat sinks 64 is smooth, is touched and is fixed on, by screw or buckle patch, the machine that distance CPU is nearest On case metal shell inwall, thus the partial heat of CPU heat-conducting base 61 is delivered on cabinet metal shell dissipate additional with CPU Dispel the heat on the radiating fin of hot device 64 condensation end.
Cpu heat 6 is vacuum thermal pipe formula radiator, and there is a heat-conducting base bottom of cpu heat 6, is arranged on CPU On chip 42.On the heat-conducting base edge of cpu heat 6, one is had to move towards with the vacuum thermal pipe of arrangement on heat-conducting base Perpendicular groove, and the shape size of this groove just evaporation ends with CPU attached heat sinks 64 matches, CPU is additional to be dissipated After the evaporation ends of hot device 64 coordinates in the groove snapping in heat-conducting base edge, with cover plate and fastened by screw at heat-conducting base edge On.The front of heat-conducting base is that direct parallel patch is touched on cpu chip 42 surface.And the approximate centre at the back side of heat-conducting base Position has a bulge-structure, the indent sliding-rail groove of bridge depression bar 53 centre portion can just clasp this bulge-structure, and bridge depression bar 53 is put It is placed on the heat-conducting base back side.Due to the bulge-structure by center, the heat-conducting base back side of the bridge depression bar 53 in fastener 5, The downforce produced when being fastened by fastener 5 concentrates the central area acting on heat-conducting base, so makes heat-conducting base and cpu chip The stress of 42 contact surfaces is very uniform, makes the heat conductivity between them stable.
Heat-conducting base is to clasp the bulge-structure at its back side by bridge depression bar 53 to be close on cpu chip 42, and bridge Depression bar 53 is to be movably fixed on two sliding bars 52, and two sliding bars 52 are by the dop on movable support column 51 respectively Snap on mainboard 4 in 4 cpu heat 6 installing holes, finally expansion anchor 54 is inserted in the pin-and-hole in supporting, thus will Whole fastener 5 support is fastened on mainboard 4 together with cpu heat 6.Owing to heat-conducting base back side bulge-structure can be in bridge pressure Moving in bar 53 indent sliding-rail groove, bridge depression bar 53 can move again on sliding bar 52, so whole cpu heat 6 can be at mainboard 4 The translation of little scope on any direction in plane, greatly reduces because of cpu heat 6 edge and unit accessory position on mainboard 4 Put conflict mutually and can not the probability of normal mounting.
CPU attached heat sinks 64 uses movably arranged mode, and whether user can install by unrestricted choice according to demand, Without changing whole cpu heat 6, it is greatly saved the financial expenditure of user.Although mainframe box volume is little, but cleverly Make use of the metal shell of cabinet, be quickly delivered to dispel the heat on shell by part CPU heat, considerably increase heat radiation has Effect area.
Owing to fastener 5 support many places use movable Fixed Design, the most compatible all conventional mainboard 4 models, fastener 5 is joined Part is few, lightweight, and disassembling operations is the most convenient, within free-hand 10 seconds, just can complete dismounting.
Further, the bottom 12 of this ultra-thin PC mainframe box shell has the air intake opening of an elongated strip shaped, had both added cabinet Air-flow exchange around base plate；Again because this long opening, hinder greatly at the bottom of the cabinet in the positive space of planes of dividing plate 3 Heat on plate region be delivered to the chassis backplane region of dividing plate 3 backside space and dividing plate 3 from be arranged on so that patch is touched The heat that the CPU attached heat sinks 64 on chassis backplane in the positive space of planes of dividing plate 3 passes over can be more quickly by gas Stream is taken away, and is not transferred to again other positions of cabinet and affects the heat radiation of other hardware.
06) inwall extension socket 205
Described computer housing is vertical, and mainboard 4 is placed downwards on i.e. mainboard 4 the North limit near one end of CPU, mainboard 4 south Upwards, the casing inwall near limit, mainboard 4 south is the top inner wall of cabinet, is vertically above mainboard 4 on this inwall on limit In the strip region in front 15～45mm, activity is mounted with the socket of a strip, constitutes cabinet inwall extension socket 205, Three kinds of interfaces, DC+5V, the power supply interface of direct current negative pole, 7+6pin SATA CD-ROM drive is included on described inwall extension socket 205 204 interfaces and 7+15pin SATA hard disc interface.
Described inwall extension socket 205 uses strip PCB to concentrate cabling, and strip PCB is closely pasted Closing cabinet inwall, circuit board section extends to the circuit on the edge in dividing plate 3 front, and strip PCB extension The circuit corresponding with on dividing plate 3 docks mutually one by one, fixing by welding connection.Pin bottom above-mentioned interface socket is by welding Fixing or patch is touched on the circuit being movably fixed in strip PCB correspondence, its jack interface towards with 3 phases of dividing plate Parallel.
In view of this computer hardware of CD-ROM drive 204, major part user uses frequency the lowest, thus hommization by " inwall Extension socket 205 " it is designed to movable mounted, user can choose whether to install according to the use demand of oneself.
But notebook CD-ROM drive 204 or 2.5 cun of hard disks 202 insert when being arranged in inwall extension socket 205, notebook CD-ROM drive 204 or 2.5 cun of hard disks 202 are parallel to mainboard 4, and are positioned at empty position on the near zone of limit, mainboard 4 south.In view of practicality, Notebook CD-ROM drive 204 enter dish mouth towards before mainframe box.The most efficiently make use of the sky in overhead near limit, mainboard 4 south Free space, owing to notebook CD-ROM drive 204 and 2.5 cun of hard disks 2,020 points are light little, caloric value is the lowest, so the weight to whole cabinet The impact of the heart and heat radiation almost can be ignored.Additionally, due to mainboard 4 has a lot of contact pin, slot and cabling, impact U.S. on limit, the south See, be just installed in parallel in 204,2.5 cun of hard disks 202 of notebook CD-ROM drive in this overhead, position of mainboard 4, can block dexterously Live, make the arrangement of cabinet entirety more attractive in appearance.
07) mainboard I/O baffle plate dividing plate draw-in groove 16
The position that mainboard 4 edge section at I/O interface group place projects on dividing plate 3 in the western end edge of mainboard 4 is provided with master Plate I/O baffle plate dividing plate draw-in groove 16, described draw-in groove be have one stitch wide about 1mm, stitch deep 2～3mm straight groove/slit, open The overall dimensions of groove/perforate >=mainboard I/O baffle plate 208(mainboard 4 backboard) overall dimensions, mainboard 4 is being loaded mainframe box Before, first by mainboard I/O baffle plate 208(mainboard 4 backboard) a long limit snap onto in this dividing plate 3 grooves/slit, then by whole Mainboard I/O baffle plate 208(mainboard 4 backboard) snap in mainboard I/O baffle plate 208(mainboard 4 backboard to cabinet afterbody) match Perforate in fixing.Owing to this mainframe box uses limit ultrathin design concept, in order to by mainboard 4 in the chassis needed for take Height space be preferably minimized, therefore by mainboard I/O baffle plate 208(mainboard 4 backboard) near mainboard 4 back side snap onto every In the fluting of plate 3, and mounting means is simple and direct as tradition cabinet.
Display card 7 that the hardware installed in the space at dividing plate 3 back side includes comprising radiator, power pack 9, turbofan 201, hard disk 203, Power entry module 10 and be all parallel patch touch be arranged on dividing plate 3, due to parallel patch touch be arranged on dividing plate 3 back side Multiple hardwares to heat radiation have certain demand, so dividing plate 3 back side is except pacifying with power pack 9, dividing plate socket, Power entry module 10 Pretending outside concave shaped dividing plate circuit 32 contact point of coupling, the surface in other regions, dividing plate 3 back side is with smooth, the gold of heat conduction Belong to flat board to present.Concrete structure is as follows:
08) display card 7
Display card 7 parallels setting with dividing plate 3 back side.This ultra-thin computer housing can install all overall heights of support, half Height, overlength, powerful display card 7.I/O interface on described display card 7 and the I/O interface on mainboard 4 towards identical, Staggering along portion with mainboard 4PCB edges of boards in I/O interface area position on display card 7, mainboard 4PCB edges of boards are along for being provided with I/O The pcb board edge portion of interface, i.e. the western end edge of mainboard 4 is along portion.Above-mentioned " the I/O interface on display card 7 " is in figure " independent Video card I/O interface group 71 ", above-mentioned " the I/O interface on mainboard 4 " is in figure " mainboard I/O interface group 41 ".
Display card 7 is installed in parallel in mainboard 4 back side and includes following 2 kinds of forms:
1. formula is dissipated in: have the dividing plate 3 of one piece of parallel heat-conducting between display card 7 with mainboard 4, on display card 7 One side equipped with radiator is relative with dividing plate 3 plate face, and the pcb board face of display card 7 is near the shell side panel of computer housing, The one side of slip lid 2 in i.e. Figure 13.In described " pcb board of display card 7 " i.e. figure " display card pcb board 70 ".Display card 7 On the pcb board residing for I/O interface group 71 end edge I/O interface towards direction on I/O interface on mainboard 4 to be protruded from The distance of the pcb board place end edge 15～40mm residing for group.Use between mainboard 4 with the pcb board card of display card 7 parallel, near The mode that distance disposes, greatly reduces the spatial volume taken.
Specifically, with the presence of one piece of metal plate between display card 7 and mainboard 4, i.e. the parallel peace of the one side of metal plate Dress is mainboard 4, and mainboard 4 back side is to metal plate, and the parallel installation of another side of metal plate is display card 7, independent Have on video card 7 faced by the one of GPU chip 72 to metal plate, and display card 7 is to be placed in parallel in mainboard 4 near border area, the south The back side in territory.
From the above mentioned, display card 7I/O interface with mainboard 4I/O interface towards consistent, and they I/O interfaces towards On direction, the pcb board edge 15 at mainboard the to be protruded from 4I/O interface place, pcb board edge at display card 7I/O interface place～ The distance of 40mm, will I/O interface area part translation on display card 7 to outside the western end edge of mainboard 4.And above-mentioned protrude from Dividing plate 3 is not had between display card 7I/O interface area part outside the western end edge of mainboard 4 and mainboard 4.Owing to middle and high end is only The I/O interface of vertical video card 7 is double-deck mostly, it is contemplated that should completely compatible all video cards, the space body taken again Amass and be down to minimum, therefore cleverly by outside the I/O interface area part translation on display card 7 to the western end edge of mainboard 4.Plus solely The vertical obstruct not having dividing plate 3 between video card 7I/O interface area part and mainboard 4, so no matter the I/O interface of display card 7 is single Layer or double-deck, do not affect its installing and using in cabinet, reach compatibility good as tradition cabinet.Solely Vertical video card 7 is connected by the card slot 43 that adapter or prolongation winding displacement are corresponding with on mainboard 4.
2. the outer formula that dissipates: the one side (back side) of radiator can not be installed on display card pcb board 70 towards mainboard 4 back side, main Not necessarily having dividing plate 3 to exist between plate 4 and display card 7, the pcb board edge at display card 7I/O interface place is also not necessarily intended to convex Pcb board edge for mainboard 4I/O interface place.Display card 7 is corresponding with on mainboard 4 by adapter or prolongation winding displacement Card slot is connected.Use the mode paralleled, closely dispose between mainboard 4 with display card 7, greatly reduce and take Spatial volume.The advantage of this mode maximum is to reequip radiator and the fan 201 of display card 7, uses independent aobvious Block radiator and the fan 201 of 7 first wifves, and this mode compatibility is fine.The chassis space ratio that shortcoming takies needed for being is " interior Dissipate formula " bigger.
09) formula display card radiator 8 is dissipated in
The radiator installed on display card 7 is provided with vacuum heat conduction pipe 82 and heat-conducting base 81, and vacuum heat conduction pipe has steaming Making a start and condensation end, the evaporation ends of all vacuum thermal pipes on described radiator is directly or indirectly and the GPU core of display card 7 Sheet 72 is affixed tactile, and the condensation end of part or all of vacuum thermal pipe is direct or indirect with dividing plate 3 or cabinet metal shell inwall Patch is touched.In described " cabinet metal shell " i.e. figure " mainframe box shell 1 ".
Described display card radiator 8 generally flat radiator, takies volume the least.It includes parallel interval The aluminum matter of arrangement or 83,2～8 described vacuum thermal pipes of copper radiating fin and 1～2 described heat-conducting base.Aluminum matter or copper The main part of matter radiating fin composition flat radiator, flat radiator is installed in parallel on display card 7 or dividing plate 3 On the back side, heat-conducting base is located at the front of radiator, flat described vacuum thermal conductance of arranging in the surface at the back side of radiator The condensation end of pipe, the evaporation ends of described vacuum thermal pipe fits tightly mutually with copper or aluminum matter heat-conducting base.Vacuum thermal pipe Condensation end to be squeezed into cross section by mould be semiarc shape or flat, be fitted tightly on fin, the described radiator back side Upper half arc/flat the most parallel patch of vacuum thermal pipe condensation end is touched and is carried out heat conduction on dividing plate 3 back side.
Or described flat radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends And condensation end, the evaporation ends of all vacuum thermal pipes fits tightly the most in an orderly manner or is embedded on described heat-conducting base, Vacuum Heat It is " D " shape that the condensation end of conduit is squeezed into cross section by mould, is i.e. formed flat at described vacuum thermal pipe condensation end Simultaneously, and this flat one side is paralleled with the back side of described radiator, and the vacuum thermal pipe condensation end institute of described " D " shape The part of the non-flat one side formed combines with the radiating fin of described radiator and is fixed on the back side of described radiator.Work as institute State the parallel installation in the back side of flat radiator or time patch touches in separator face, the vacuum thermal pipe condensation end of described " D " shape Form flat one side parallel patch to be touched in separator face, carry out heat conduction.
Due to this radiator by the condensation section of vacuum thermal pipe cleverly with dividing plate 3 or cabinet metal shell inwall phase Closely patch is touched, and display card radiator fan 201 is not mounted within radiator, the most additionally takies the volume of radiator, so Considerably increase the actual area of dissipation of display card 7.Further, its heat radiation utilize dividing plate 3 and cabinet metal shell inherently Exist, be also greatly saved the quality of material cost and graphic card radiator.
Radiator is integrally fixed at the display card 7 installation site region at described dividing plate 3 back side, and described radiator is provided with one Or more than one heat-conducting base, the evaporation ends of described heat-conducting base and vacuum thermal pipe closely cooperates installation mutually, vacuum thermal conductance The condensation end of pipe is processed into flat, is fitted in closely on dividing plate 3 back side or on the inwall of cabinet metal shell, the most equal The radiating fin of between-line spacing arrangement is fitted on dividing plate 3 back side or the cabinet metal shell inwall of flat vacuum thermal pipe.
Particularly as follows: because display card 7 has the one side of GPU chip 72 parallel to dividing plate 3, display card 7 is towards dividing plate 3 One side and dividing plate 3 between there is a segment distance space, display card radiator 8 is installed in this space.Heat radiation in radiator Fin is parallel spaced-apart every arrangement, and inclines in certain between the strip radiating fin that is perpendicular on dividing plate 3 and geographical vertical direction Tiltedly angle.The heat-conducting base of radiator the most closely pastes tactile with GPU chip 72 surface of display card 7, " steaming in vacuum thermal pipe Send out section " closely it is embedded in heat-conducting base；" the condensation section " of vacuum thermal pipe another part is distributed in dividing plate 3 back side and dissipates Between hot fin, and fit tightly mutually with dividing plate 3, radiating fin.Or be distributed on video card cabinet metal shell inwall nearby, with Outer casing inner wall fits tightly mutually.
I.e. heat in display card 7GPU chip 72, is conducted to vacuum thermal pipe by the heat-conducting base being close to its surface " evaporating region " absorbs heat, then is transferred to rapidly " condensation section " by " evaporating region ", by mutually tight with " condensation section " Radiating fin, dividing plate 3 or cabinet metal shell that patch is touched are large-area and air carries out heat exchange, reach cooling purpose.
10) fixed form between formula display card radiator 8 and display card 7 is dissipated in
Due to " interior scattered formula display card radiator 8 ", hereinafter referred to as " graphic card radiator "." video card " in following is figure In " display card 7 ", " cabinet cover plate/cover plate " hereinafter is in figure " slip lid 2 ", and " pcb board of display card 7 " is figure In " display card pcb board 70 ".Design according to mainframe box and user's request, be divided into 2 kinds of forms:
Movable: graphic card radiator is first correctly installed with display card pcb board 70 after fixing, then is inserted by the golden finger of video card Being relatively fixed in the card slot of mouth insertion cabinet backside space, now graphic card radiator is parallel with dividing plate 3 back side touches. The exhausted of coupling is pasted/installed in center at the GPU chip 72 upright projection so far video card pcb board back side of display card 7 again Edge flexible silicon rubber cushion 206, after the chute in cabinet cover plate is by cabinet advances casing, due to the PCB of cover plate Yu display card 7 The size being smaller than flexible silicon rubber cushion 206 between plate, flexible silicon rubber cushion 206 produces resilient pressure perpendicular acting after being squeezed In display card pcb board 70 back side.Again owing to being fixing between graphic card radiator and display card pcb board 70, so this produces Raw pressure finally makes graphic card radiator be close on dividing plate 3 surface.The a part of heat reached in graphic card radiator efficiently passes It is directed on dividing plate 3 and dispels the heat.
Fixed: graphic card radiator is the most parallel to be mounted on cabinet backside space corresponding dividing plate 3 position, now dissipates " the condensation section " of the vacuum thermal pipe 82 in hot device fits tightly mutually with dividing plate 3 surface or cabinet metal shell inwall.Exist again The exhausted of coupling is pasted/installed in the center at the vacant display card 7GPU chip 72 upright projection so far video card pcb board back side Edge flexible silicon rubber cushion 206.
Vacant display card 7 is had faced by the one of GPU chip 72 to graphic card radiator, by the golden hands on display card 7 Finger mouth is correctly inserted in the card slot of coupling and is relatively fixed, now the GPU chip 72 of display card 7 and graphic card radiator Heat-conducting base 81 phase is pressed close to.After only cabinet cover plate need to being advanced casing by the chute in cabinet, due to cover plate and display card 7 Pcb board between the size being smaller than flexible silicon rubber cushion 206, flexible silicon rubber cushion 206 be squeezed after produce resilient pressure hang down Directly act on display card pcb board 70 back side.Center, GPU chip 72 back side on display card 7 is subject to vertical to dividing plate 3 side To actuating pressure after, GPU chip 72 surface is paralleled with graphic card radiator heat-conducting base 81 front, is fitted tightly.
Display card 7 reached on the ease installed with fixed graphic card radiator historical fast, almost Within one second, install.Owing to GPU chip 72 is its center back position stress, GPU chip 72 surface can be fitted in video card smoothly On heat-conducting base 81 surface of radiator, GPU chip 72 is made to reach nature with the active force of 81 between heat-conducting base Jun Heng, Yong Huzai Without worrying as affecting its heat-conducting effect because of 4 screw discontinuity equalizations when installing traditional heat sinks.
11) power pack 9
Power pack 9 is ultra-thin patch touch power pack 9, and it is provided with bottom surface 91, end face and side, is additionally provided with the input of power supply Mouth and the output port 92 of power supply, the output port 92 of described power pack 9 is provided with directly right with institute on the dividing plate 3 in computer housing The transmission structure being conducted after the circuit pressurized answered, the output port 92 of described power pack 9 and institute on the dividing plate 3 in computer housing There is not third-party plug between corresponding circuit, socket is attached.
The one side that power pack 9 touches with the parallel patch in dividing plate 3 surface is set to the bottom surface of power pack 9, and the bottom surface of power pack 9 has two The contact copper sheet 93 of group protruding 0.5～3mm, the independent contact copper sheet 93 that on first group, ordered arrangement, its outside front It is all very flat smooth, exposed conduction, and parallels with power pack 9 bottom surface in each contact copper sheet 93 front, contact The back side of copper sheet 93 is all integrally fixed on one layer of dielectric resilience rubber, and dielectric resilience rubber is fixed on again in power pack 9, and each Contact copper sheet 93 back side is only connected with the positive pole DC 12V output circuit in power pack 9.The positive area of each contact copper sheet 93 At 0.2～1 c；Second group of copper sheet is contact flat spring 104, is connected with VC 220V circuit in power pack 9.And these two groups connect Touching copper sheet 93 with power pack 9 bottom surface is mutually insulated.Match on described dividing plate 3 back side and in power supply resettlement area Indent pressure contact, copper sheet 93 groups phase that what exposed contact circuit and power supply bottom surface in indent pressure contact were protruding contact one a pair Should, there are several to position hole 36 in power supply resettlement area, described power pack 9 bottom surface is except the alignment pin 94 of projection 0.5～3mm Outside conductive contact copper sheet 93, whole face is all flat smooth, and the negative pole DC 12V in power pack 9 bottom surface and power pack 9 Output circuit connects with Earth Phase, described power pack 9 by fastening screw make the parallel patch of power pack 9 touch be fixed on dividing plate 3.
The existence form of the another kind of electrical transfer port of described power pack: the power input port of described power pack and electricity Source output terminal mouth merges into an integrated port on the bottom surface of described power pack, and being provided with in described integrated port can directly and institute The circuit stating exposed conduction corresponding on dividing plate is mated the contact copper sheet group turned on, described contact copper after touch mutually one by one by overlaying Each contact copper sheet in sheet group can have different circuit definitions and circuit corresponding with in power pack respectively is connected.Described electricity The parallel patch in bottom surface of source capsule touches the circuit region being installed in described separator face correspondence.
Be below power pack 9 bottom surface output port 92 be the scheme presented in metal clips 104.
Power pack 9 is that parallel patch is tactile to be arranged on cabinet internal partition 3.The one side of power pack 9 area maximum is its bottom surface, It is conducting metal material, and direct patch of paralleling with dividing plate 3 surface is touched.There is one " output port 92 " power pack 9 bottom surface." output Port 92 " in row smooth, orderly arrange the metal clips 104 of some exposed conductions, these metal clips 104 and power packs 9 The bottom surface of metal material is mutually insulated, and the surface of apparent height power pack to be protruded from 9 bottom surface of metal clips 104 0.5～3mm.
Metal clips 104 in " output port 92 " be divided into area relatively big and area is less two groups.One is had on power pack 9 " input port ", by inserting line trap, by the DC supply input power pack 9 of the municipal alternating current outside cabinet or coupling. A portion municipal administration alternating current is converted into stable direct current by power pack 9 and exports, wherein direct-flow positive pole and " output port 92 " One group of metal clips 104 that inner area is bigger is connected, and direct current negative pole/ground connection is connected with the conducting metal bottom surface of power pack 9； Another part municipal administration alternating current is connected on one group of metal clips 104 that area in " output port 92 " is less.
There are several alignment pins 94 protruded in power pack 9 bottom surface, and install on dividing plate 3 and have one on the region of power pack 9 The dividing plate circuit 32 of individual concave shaped and several position hole 36, the dividing plate circuit 32 of concave shaped has exposed conduction, smooth Circuitry contacts.And described concave shaped dividing plate circuit 32 contact point and hole, location 36 and power pack 9 bottom surface on dividing plate 3 Metal clips in " output port 92 " 104 groups and the alignment pin 94 of protrusion, on dimensions, arrangement position, circuit definitions Mate the most completely.By power pack 9 bottom surface to it on the installation region of dividing plate 3, the alignment pin 94 by power pack 9 bottom surface is complete Hole, location 36 on complete and dividing plate 3 matches, insert after, with screw/expansion bayonet lock, power pack 9 is fastened on dividing plate 3.Now Each dividing plate electricity organizing conducting metal shell fragment 104 concave shaped corresponding with on dividing plate 3 in " output port 92 " bottom power pack 9 The most precisely coupling, one by one pressure touch connection to road 32 contact point mutually.Owing to power pack 9 is by the dividing plate electricity of concave shaped on dividing plate 3 Road 32 contact point is connected, when not installing power pack 9, after filling and leading up this recessed area with the insulating trip of coupling, and can be at this Other hardware installed by locational space.The multiple-effect collocation realizing same position space in cabinet utilizes.Simultaneously as in power pack 9 Extremely compact structure, adds that employing is directly affixed touches transmission power supply with dividing plate circuit 32, without wire, power supply is greatly reduced The spatial volume that box 9 is shared in cabinet.
Circuit definitions: different to the power demands of mainframe box in view of different user, devises power pack 9 at two in cabinet Installation site, two power packs 9 can be installed simultaneously, used in parallel.Also two corresponding concave shaped dividing plate electricity are had on dividing plate 3 Road 32 contact point.Wherein with line trap, municipal administration alternating current is connected to " input port " of first power pack 9, by its bottom surface One group of metal clips 104 that " output port 92 " inner area is less transmits to dividing plate 3 second indent by dividing plate circuit 32 On the contact point of shape dividing plate circuit 32 correspondence, and second power supply box 9 is to be properly attached to second concave shaped dividing plate circuit 32 On contact point.I.e. municipal administration alternating current is input to second power supply by the contact point of second concave shaped dividing plate circuit 32 correspondence Box 9 is converted into required stable direct current.Direct-flow positive pole after conversion and " output port 92 " inner area in second power supply box 9 One group of bigger metal clips 104 is connected, through contact point and the dividing plate circuit of second concave shaped dividing plate circuit 32 correspondence Direct-flow positive pole is transferred to " Power entry module 10 " by 32.
Direct current negative pole after power pack 9 internal conversion is to turn on to the conducting metal bottom surface of power pack 9.By upper known, electricity The bottom surface of source capsule 9 is that parallel patch is tactile to be arranged on dividing plate 3, and the dividing plate 3 in cabinet is as complete machine direct current negative pole/ground connection carrying Leading body.Therefore fit tightly between the metal bottom surface of power pack 9 and dividing plate 3 plate face, conduct electricity.Direct current negative pole on dividing plate 3 leads to Cross in the direct current cathode traces being transmitted back in power pack 9 that the conducting metal bottom surface of power pack 9 can realize large area, big electric current. Why it is designed to export directly against touching in the dividing plate circuit 32 being delivered on dividing plate 3 correspondence the direct current of power pack 9, is because Its patch contacting surface is long-pending greatly, laminating is tight, can realize stablizing of big electric current and pass through.And, power pack 9 is by golden with dividing plate 3 or cabinet Belong to the large area of outer casing inner wall, closely patch to touch, not only the direct current negative pole/ground connection in power pack 9 is communicated to dividing plate 3 smoothly On, the most ingenious, to solve power pack 9 heat radiation efficiently problem.
Power pack 9 global shape is flat hexahedron, the maximum gauge≤31mm of power pack 9, wherein long≤150mm, Width≤110mm；Or length≤260mm, wide≤120mm, the input port of the power supply of described power pack 9 for input DC 12 V or VC 220 V, the output port 92 of power pack 9 is output DC 12 V or VC 220 V.
Power pack 9 overall profile is flat cube, and concrete size, profile are depending on design requirement and watt level.
The radiating mode of power pack 9: this ultra-thin power pack 9 is compact due to internal structure, and thermal source is relatively concentrated.Outside power pack 9 Shell large area uses aluminum alloy material, by by the heater element in power pack 9 directly against contacting on aluminum alloy casing, or with very Empty heat pipe is connected on aluminum alloy casing, is quickly transferred to by major part heat on power pack 9 metal shell.Because power pack 9 is that close parallel patch is touched on dividing plate 3 or part patch is touched on the inwall of cabinet metal shell, by dividing plate 3 or cabinet gold Belong to shell, add the ventilation in upper case and realize large area high efficiency and heat radiation.
12) Power entry module 10
Power entry module 10 patch is touched the side on dividing plate 3 back side and is set to bottom surface 102, and described bottom surface is provided with that " direct current is defeated Entrance 102 " and " direct current delivery outlet 103 ", the most in good order in " direct current input port 102 " and " direct current delivery outlet 103 " arrange Some protrude from the contact copper sheet 93 that described bottom surface 0.5～3mm is high.These contact the outside front of copper sheets 93 is all smooth flat Conduction whole, exposed, these back sides contacting copper sheets 93 inside are fixed on the elastic material part insulated mutually with other circuit, institute State elastic material part to be fixed on again in Power entry module 10.
That removes " direct current input port 102 " and " direct current delivery outlet 103 " on Power entry module 10 bottom surface is externally provided with several projections Alignment pin 94, on dividing plate 3 install Power entry module 10 region in have respectively and " the direct current input port of Power entry module 10 bottom surface 102 ", " direct current delivery outlet 103 " the most correctly mates on dimensions, locality, circuit definitions mutually with alignment pin 94 Concave shaped circuitry contacts and hole 36, location.Concave shaped circuitry contacts surface is exposed conduction, but with dividing plate 3 between be mutually exhausted Edge, the most corresponding dividing plate circuit 32 of concave shaped circuitry contacts is connected.
Also incorporating temperature control module in described Power entry module 10, Power entry module 10 provides power supply and installation position for temperature control module Between being empty and/or circuit trace structure.
Structural circuit defines: the contact copper sheet 93 in " the direct current input port 102 " of Power entry module 10 bottom surface and Power entry module Direct-flow input circuit in 10 is connected；Contact copper sheet 93 in " the direct current delivery outlet 103 " of Power entry module 10 bottom surface respectively with The direct current output power supply of the different output voltage values in Power entry module 10 is connected.And the contact copper sheet 93 of different circuit definitions it Between be separate and insulation, contact copper sheet 93 insulate mutually with Power entry module 10 bottom surface.
Contact copper sheet 93 in " the direct current input port 102 " of described Power entry module 10 bottom surface is by corresponding with on dividing plate 3 Concave shaped circuitry contacts matches after docking, and the direct current that power pack 9 exports in aforementioned barriers circuit 32 is imported to distribution The direct current supply of the different magnitudes of voltage needed for reconvert becomes each hardware device in module 10, then the direct current by above-mentioned different magnitudes of voltage The power supply each contact copper sheet 93 in " the direct current delivery outlet 103 " of Power entry module 10 bottom surface is by the indent corresponding with on dividing plate 3 Shape circuitry contacts matches after docking, and the direct current supply of above-mentioned different magnitudes of voltage is transmitted separately to the dividing plate circuit 32 of correspondence In.
At the centre portion at described cabinet internal partition 3 back side, near the dividing plate 3 dorsal edge position of casing front panel On be provided with on Power entry module 10, and described Power entry module 10 and incorporate matched with one or more of class interface Or multiple socket, dividing plate socket: 6/8pin display card auxiliary power supply slot 73,24pin mainboard are main for electrical slot 45, turbine wind Fan 201 power supply interfaces, 7+15pin SATA hard disc 203 interface, SATA Express hard disk 203 interface, SAS hard disk 203 connect Mouth, USB 3.0 19/20pin socket, USB 2.0 9pin socket, 7+6pin SATA CD-ROM driver interface.
The bottom surface of Power entry module 10 is led for smooth metal in addition to " direct current input port 102 " and " direct current delivery outlet 103 " Electricity material, the direct current output negative pole/grounded circuit in Power entry module 10 is connected with the metal bottom surface of Power entry module 10.Distribution mould Block 10 is by screw or expands the parallel patch of bayonet lock and touches and be fastened on cabinet internal partition 3, and carries out large area between dividing plate 3 surface and connect Touch conducting.Plus also incorporating socket or the dividing plate socket that one or more hardware match on above-mentioned Power entry module 10, pass through Wire or hardware is carried interface be inserted directly in the socket/dividing plate socket matched on Power entry module 10 connection.Therefore this Direct current negative pole/the ground connection of the hardware being connected with the socket/dividing plate socket integrated on Power entry module 10 a bit is by Power entry module 10 Metallic conduction bottom surface be conducted on dividing plate 3.From the above mentioned understand, dividing plate 3 again because being affixed tactile with power pack 9 conducting bottom side, institute Be connected with power pack 9 bottom surface with final Power entry module 10 bottom surface, i.e. both direct current negative pole/grounded circuits are connected to lead to.
By above-mentioned known because Power entry module 10 be the unidirectional current of the single magnitude of voltage that power pack 9 is sent again It is converted into the direct current supply of different magnitudes of voltage needed for each hardware, adds and on Power entry module 10, incorporate one or more and hardware The socket that interface matches/dividing plate socket.Power entry module 10 is i.e. changed the direct current supply of each magnitude of voltage of output, a part point Not with the socket of integration these described/corresponding connection of dividing plate socket, then by the form of wire or hardware straight cutting by correspondence Electrical transfer is given in the hardware of coupling；The direct current supply of each magnitude of voltage of another part output, by Power entry module 10 bottom surface Concave shaped dividing plate circuit 32 contact point that " direct current delivery outlet 103 " matches on dividing plate 3 is respectively turned on to corresponding dividing plate electricity In road 32, with the dividing plate socket of the described corresponding connection of dividing plate circuit 32 the most respectively with the interface of the computer hardware of required power supply/ Slot docks mutually.
Pass owing to Power entry module 10 bottom surface employs the large area press-contacting type conduction identical with power pack 9 bottom surface structure principle Defeated structure so that the stable transmission of big electric current can be carried out between Power entry module 10 and dividing plate circuit 32.And it is the most whole in Power entry module 10 Close multiple hardwares interface socket and/or temperature control module so that it is structure designs more high-efficiency compact, made the Power entry module after integration 10 have multi-functional integral type, it is simple to the dismounting of user and use.
13) intelligent temperature control system
Intelligent temperature control system it is provided with, including manually regulating switch 18, temperature control module, fan 201, temperature in computer host box Probe 37, manually regulation switch 18 is placed on casing, it is simple to user operation uses, and temperature control module, fan 201 are positioned at machine Desired position in case, temperature probe 37 is positioned towards the side of cpu heat 6 or graphic card radiator, and is in radiator In the leeward air channel of air-flow, temperature control module is connected with manually regulation switch 18, fan 201, temperature probe 37 simultaneously.First hands The gear of dynamic regulation switch 18 has limited temperature control module and has exported the highest numerical value to fan 201 voltage and minimum numerical value district Section；Secondly temperature probe 37 belongs to a kind of critesistor, and the ambient temperature height residing for temperature probe 37 will change himself Resistance value, the temperature control module being connected with temperature probe 37, according to temperature probe 37 feedback numerical value, in voltage section essence True export corresponding supply voltage to fan 201, thus reach to be monitored in real time by temperature probe 37 ambient temperature and automatic Change the purpose of fan 201 rotating speed.
Mainboard support column 31 formula temperature probe 37, has established a capital display card 7 owing to desktop computer differs, and by contrast The temperature of CPU more can objectively reflect the situation of change of complete machine temperature, it is therefore necessary to dispose one near cpu heat 6 Individual temperature probe 37.
Having individual mainboard installing hole 47 between PCI-E slot on mainboard 4 and memory bar slot 44, this installing hole exists accordingly Be connected and installed with temperature probe 37 described on that mainboard support column 31 corresponding on dividing plate 3, this temperature probe 37 include with Lower 2 kinds of forms:
The most fixed, temperature probe 37 entirety is column, and upper end is temperature probe 37 element, and size can be just passed through correspondence Mainboard installing hole 47；Lower end is the stitch of this temperature probe 37 element, is fixed by welding on the dividing plate circuit 32 of correspondence, And temperature probe 37 entirety is perpendicular on dividing plate 3 front, it is positioned at the mainboard between PCI-E slot and memory bar slot 44 on mainboard 4 Installing hole 47 maps the position of correspondence on dividing plate 3 front mutually；
The most movable, mainboard installing hole 47 mapping pair between mainboard 4PCI-E slot and memory bar slot 44 should be at dividing plate On the position in 3 fronts, there is the socket of a temperature probe 37.This temperature probe 37 socket is weldingly fixed on the dividing plate circuit 32 of correspondence On, and the height of its height not higher than other mainboard support columns 31, after mainboard 4 is properly attached on cabinet internal partition 3, have one Shaft-like temperature probe 37, upper end is temperature probe 37 element, and lower end is for connecting plug.Lower end by this shaft-like temperature probe 37 Mainboard installing hole 47 between PCI-E slot and memory bar slot 44 on mainboard 4, the temperature probe 37 being inserted on dividing plate 3 In socket, the circuit that now temperature probe 37 is corresponding with on dividing plate 3 the most correctly connects, and temperature probe 37 element of its upper end is in On mainboard 4 front, for reading the gas flow temperature of this position.
Computer housing uses above-mentioned intelligent temperature control system, can have fabulous user operation, very hommization, again need not Considering whether fan 201 has PWM function, without opening under entrance mainboard 4BISS, arranging, and it is permissible with noise to dispel the heat Obtain perfect dynamic equilibrium.
14) heat dissipation wind channel
Being provided with air draught type heat dissipation wind channel in computer housing, radiating mode uses air-exhaust type wind-cooling heat dissipating, wherein for machine The turbofan 201 of the outer air draft of case is installed on the afterbody 13 of cabinet, and complete machine has two big main air inlets and two little auxiliary Air inlet, two big main air inlets are CPU air inlet 22, video card air inlet 23, and two little auxiliary air inlet mouths are that bottom is entered Air port 15, jacking air port, side 14.
CPU air inlet 22 is positioned at casing right plate, has a relatively large opening on the position of cpu heat 6；Video card It is anterior that air inlet 23 is positioned at casing, the position corresponding with the region installing display card 7 in cabinet has one bigger Strip perforate；Bottom air inlet 15 is positioned in cabinet bottom enclosure, and the dividing plate 3 in cabinet extends vertically up to machine with mainboard 4 One section of elongated perforate is had between 2 intersecting lenses on box plate；It is close that jacking air port, side 14 is positioned at casing left plate A less strip perforate is had on enclosure top 11 and anterior position.
In air draught type heat dissipation wind channel, whole cabinet is in addition at above-mentioned 4, air intake perforate and CD-ROM drive 204 enter dish perforate 24, then nothing Other air intake holes, the air in case is ceaselessly pumped to outside casing by the fan 201 in cabinet afterbody, causes the air pressure in casing Atmospheric pressure outside less than casing, forces the air outside casing to be flowed in casing by each air inlet.Generally, blowing form is produced Quick flow when running into material object, the air pressure on surface in kind can rise, and air pressure raises air can tend to heat release state on the contrary, unfavorable Heat exchange between surface in kind and stream air；And if use air-draft-type, in air channel, the air pressure on surface in kind slightly declines, Low pressure air can more tend to heat absorption state and expand own vol, is conducive to the heat friendship between surface in kind and stream air Change.
The cold wind that CPU air inlet 22 flows into flows through the cpu heat 6 of correspondence, and after absorbing its heat, cold wind becomes hot-fluid. Owing to mainframe box is vertical, cpu heat 6 is in lower half, and turbofan 201 is at the first half.The higher hot-fluid of temperature is due to it Natural lift and the suction of turbofan 201, flow to enclosure top, and the relatively low part hot-fluid of temperature is by dividing plate 3 back side turbine wind The suction of fan 201, the gap through between dividing plate 3 edge and slip lid front panel 21 inwall flows to the space, lower half to dividing plate 3 back side In.Owing to the latter half at dividing plate 3 back side is power pack 9 or the hard disk 203 that parallel patch touches installation, therefore it is relatively low to flow into temperature herein Hot-fluid, power pack 9, the caloric value of hard disk 203 part can be walked with absorption band.
The cold wind that video card air inlet 23 flows into is directly through corresponding display card radiator 8, the first half at dividing plate 3 back side Point and dividing plate 3 backside space in cabinet in top.In the centre position at dividing plate 3 back side, i.e. under display card 7 installation region Side, is provided with one piece of video card windscreen 39, this video card from video card air inlet 23 position between the turbofan 201 at dividing plate 3 back side Windscreen 39 sealing paste simultaneously touches dividing plate 3 back side and slip lid 2 inwall.Simple efficient by the whole drain of cold wind of video card air inlet 23 Radiator through display card 7 absorbs heat, and is finally extracted out outside casing by turbofan 201, and this midway, air channel is not by machine Hot-fluid in other spaces interference in case.
Owing to having air vent 38 in dividing plate 3 central region, and just this air vent 38 is close on dividing plate 3 back side Turbofan 201 is installed.The cold wind that bottom air inlet 15 flows into, flows through lower half and mainboard 4 back side lower half in dividing plate 3 front Portion.Owing to the latter half at dividing plate 3 back side is power pack 9 or the hard disk 203 that parallel patch touches installation, so the one of its caloric value Dividing and be delivered to dividing plate 3 the latter half, the cold wind flowed into by bottom air inlet 15 heat absorption is taken away；Another part heat mainly transmits Dispel the heat in afterbody and bottom to cabinet metal shell；Some heat is flowed through by above-mentioned described CPU air inlet 22 The relatively low hot-fluid of rear remaining portion temperature is absorbed to be taken away.
It is contemplated that high-power display card 7 caloric value is very big, and video card air inlet 23 air quantity is limited, also increases by one Jacking air port, side 14, its cold wind flowed into withstands on the region of dividing plate 3 backside space in mainly absorbing cabinet and fraction dividing plate 3 is carried on the back The heat of face upper area.The cold wind that described four kinds of air inlets flow into, with each radiator, dividing plate 3, heating hardware, part cabinet Metal shell inwall becomes air hot-fluid after carrying out heat exchange, be installed in several turbofan of the cabinet first half, afterbody 201 discharge outside casing.
In addition to several air inlets, the sealed design that complete machine uses, add each hardware arrangement science, the letter in upper case Clean, produced windage is less.The volume of the most ultra-thin PC mainframe box is little, when using convulsion form, produced in its casing Draught head becomes apparent from than big cabinet, and the air channel flow formed in cabinet is big, wind speed is fast.And, the low pressure that air draught produces The air channel formed, adds hardware arrangement science, succinct, and windage is little, the air olderly flowage in air channel, will not produce reflux heat The phenomenon of wind.
Air Filter 25 all it is movably installed with in aforementioned four air intake perforate, in order to filter the dust entered in case in air, Cleaning and permanent good ventilation, heat dispersion is kept in making mainframe box.
15) turbofan 201
It is fitted with turbofan 201 in the positive space of planes of dividing plate 3 and dividing plate 3 backside space,
The positive space of planes of dividing plate 3, having on a fragment position region in the western end edge of mainboard 4 is the I/O interface group of mainboard 4, and is leading The western end edge part of the remaining mainboard in plate I/O interface group 41 side 4, the element heights on its mainboard 4 all within 18mm, so its The space in mainboard 4 overhead is more open, and the western end edge of mainboard 4 is proximate to cabinet afterbody shell.Therefore in this overhead, position of mainboard 4 Cabinet afterbody outer casing inner wall on turbofan 201 is installed, the perforate of the air outlet of turbofan 201 and cabinet afterbody shell 17 are connected, and are arranged outside casing by air-flow.It is arranged on the turbofan 201 on mainboard 4 western end edge clear position, ingenious, efficiently Make use of this clear position to carry out air discharging and radiating, the most additionally increase the volume of cabinet, and movable mounting structure is the most complete The dismounting not affecting hardware uses.
Having air vent 38 on dividing plate 3, the one side of turbofan 201 is close to this air vent 38 and is arranged on dividing plate 3 and carries on the back On face.The air that the one side of this turbofan 201 extracts between dividing plate 3 and mainboard 4 in gap through the air vent 38 on dividing plate 3； Air in another side extraction dividing plate 3 backside space of turbofan 201.The air outlet of this turbofan 201 and cabinet afterbody The perforate of shell is connected, outside the air of all extractions is discharged casing；
It is arranged on the turbofan 201 on cabinet afterbody outer casing inner wall, comprises following 2 kinds of forms and exist:
The most fixed, i.e. turbofan 201 is fixed on the inwall of cabinet afterbody shell by screw or installation draw-in groove；
The most movable, two frames perpendicular with turbofan 201 air outlet are provided with guide rail, outside cabinet afterbody Shell is installed perforate on fan 201 position, and the shape of this perforate, size the most just with the air outlet at turbofan 201 place Cross section matches.A guide rail sliding chute is had just vertically just this perforate to be arranged on the inwall of cabinet afterbody shell, with leading The turbofan 201 of rail matches with the guide rail sliding chute on cabinet afterbody outer casing inner wall, and turbofan 201 is by outside cabinet afterbody Perforate on shell can freely be moved inside and outside cabinet bulk, the dismounting of hardware in this turbofan 201 installed hinders cabinet Time, can this turbofan 201 be moved to outside cabinet bulk, after the hardware in cabinet has dismounted, then by this turbofan 201 Move back on the inwall in cabinet bulk.
This utility model is not limited to above-mentioned detailed description of the invention, and those of ordinary skill in the art makes according to the present invention Expand further and each fall within protection domain of the present utility model.
1. the dividing plate in a host computer, it is characterised in that: host computer space is divided into two by described dividing plate, and dividing plate sets Fit tightly/be embedded with the circuit of tabular morphology in having front and the back side, described membrane front face and/or the back side or dividing plate, constitute Dividing plate circuit, the thickness≤0.5mm of conductor in dividing plate circuit, dividing plate is provided with the dividing plate socket of connection corresponding with dividing plate circuit, Computer hardware including mainboard, hard disk, power pack, display card, fan by dividing plate socket match docking after each other Correct connection, or directly the interface of the computer hardware including mainboard, hard disk, power pack, display card, fan is pasted tactile peace Be contained on dividing plate correspondence exposed conduction circuitry contacts on correctly mate, contact after conducting.
Dividing plate in host computer the most according to claim 1, it is characterised in that: include mainboard, hard disk, power pack, independence Video card, fan touch on the one or both sides being arranged on dividing plate in the interior parallel or parallel patch of computer hardware.
Dividing plate in host computer the most according to claim 1, it is characterised in that: between described dividing plate circuit and described dividing plate Mutually insulated, the height of dividing plate circuit surface height baffle surface not higher than the most about, whole dividing plate circuit surface have insulation and Wearing layer is that the glass fibre/half embedded dividing plate of fiberglass-based printed circuit, Metal Substrate print electricity close over, described dividing plate Road plate, FPC flexible cord arrange embedded dividing plate, the embedded dividing plate of ultrathin insulating copper sheet or Metal Substrate conductive coating circuit dividing plate.
Dividing plate in host computer the most according to claim 1, it is characterised in that: described dividing plate circuit is glass fibre/half The PCB of fiberglass-based printing, is fabricated to wired circuit and the physical appearance chi of design by this PCB of glass Very little, described dividing plate is aluminium alloy or copper metal plate, and on dividing plate, one side or the position of double-sided design, process with described The groove that PCB shape and thickness match, is closely covered in described PCB on dividing plate in the groove of correspondence, Make PCB surface and its place baffle surface be in same plane height, be embedded with on whole of the dividing plate of PCB and have Insulation, wearing layer close over.
Dividing plate in host computer the most according to claim 1, it is characterised in that: outside described dividing plate is with the metal of host computer Shell or skeleton are identical material and are integrally formed, and will make the gold of dividing plate and host computer by mould after material hot melt or extruding Belong to shell or skeleton is made of one piece；Or described dividing plate and the metallic framework of host computer or shell are that separation is independent, It is welded and fixed between dividing plate and main frame metallic framework or outer casing inner wall.
Dividing plate in host computer the most according to claim 1, it is characterised in that: described dividing plate socket directly welds or pastes tactile Being connected on the dividing plate circuit of correspondence, the hardware interface type of dividing plate socket includes 7pin SATA 2.0 data-interface, 7pin SATA 3.0 data-interface, SATA Express hard-disk interface, SAS hard-disk interface, SATA 7+15pin data+power supply are firmly Dish interface, SATA 7+6pin data+power supply CD-ROM driver interface, the starting up contact pin POWER SW of mainboard, again the opening of mainboard Dynamic contact pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin socket, mainboard audio frequency contact pin HD AUDIO, Display card PCI-E 16X slot, mainboard main power supply 24pin slot, mainboard auxiliary power supply 4/8pin slot and display card Auxiliary power supply 6/8pin slot, or the combination in any of above-mentioned hardware interface,
The bottom ordered arrangement of described dividing plate socket the pin that this socket is corresponding, has in the corresponding installation site of dividing plate circuit Pad, the pin bottom described dividing plate socket is directly weldingly fixed on the dividing plate circuit position of correspondence；Or described dividing plate The bottom ordered arrangement of socket the pin that this socket is corresponding, and these pins are deposited with the form of exposed conducting metal shell fragment ?.
Dividing plate in host computer the most according to claim 6, it is characterised in that: the described shell fragment bottom dividing plate socket Periphery is provided with the alignment pin of projection, and there are the installation region of structure, concave shaped region in concave shaped in installation position corresponding on dividing plate Middle ordered arrangement the circuitry contacts of exposed conduction, is provided with and positions hole accordingly on the dividing plate of neighboring, concave shaped region, After dividing plate socket passes through the installation position that screw/expansion bayonet fastenings is corresponding on dividing plate, the conducting metal bullet bottom dividing plate socket Circuitry contacts in the concave shaped region that sheet is corresponding with on dividing plate patch the most one by one touches conducting, the location of dividing plate socket bottom protrusion Sell the hole, location on also corresponding with on dividing plate installation position and insert coupling one by one mutually.
Dividing plate in host computer the most according to claim 1, it is characterised in that: it is distributed on the front of described dividing plate, fixes Having several mainboard support columns, it is 4～7mm that support column protrudes from the height in plate face, and the distributing position of described mainboard support column Mating one by one mutually with the mounting hole site on the mainboard of corresponding support, described mainboard support column is conducting metal material.
Dividing plate in host computer the most according to claim 8, it is characterised in that: be perpendicular in described mainboard support column every The internal thread hole in plate plate face or with expand the pin hole that bayonet lock matches, described mainboard support column by parallel for mainboard hanging in dividing plate On front, and the mainboard back side is relative with membrane front face, and the mainboard being fixed on dividing plate by mainboard by screw or expansion bayonet lock is propped up In dagger.
10. the dividing plate in a host computer, it is characterised in that: host computer space is divided into two by described dividing plate, on dividing plate Being provided with front and the back side, described dummy substrate is the metal plate of conduction, and dividing plate is provided with dividing plate socket, and it is designed as computer master The main carrying conductor of the direct current negative pole of machine complete machine/ground connection transmission, exists including mainboard, hard disk, power pack, display card, fan The interior parallel or parallel patch of computer hardware is touched on the one or both sides being arranged on dividing plate, including mainboard, hard disk, power pack, independence Video card, fan by dividing plate socket or directly with conducting metal dividing plate are affixed to touch at interior computer hardware and are born by the direct current in hardware Polar circuit/ground connection is conducted with metal partion (metp).
Priority Applications (2)
|Application Number||Priority Date||Filing Date||Title|
|Publication Number||Publication Date|
|CN205880769U true CN205880769U (en)||2017-01-11|
Family Applications (2)
|Application Number||Title||Priority Date||Filing Date|
|CN201620485730.XU CN205880769U (en)||2015-05-25||2016-05-24||Baffle among computer|
|CN201610353262.5A CN105892590A (en)||2015-05-25||2016-05-24||Partition plate in computer host|
Family Applications After (1)
|Application Number||Title||Priority Date||Filing Date|
|CN201610353262.5A CN105892590A (en)||2015-05-25||2016-05-24||Partition plate in computer host|
Country Status (3)
|CN (2)||CN205880769U (en)|
|TW (1)||TWM550836U (en)|
|WO (1)||WO2017202249A1 (en)|
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Families Citing this family (3)
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Family Cites Families (7)
|Publication number||Priority date||Publication date||Assignee||Title|
|CN201654637U (en) *||2009-11-26||2010-11-24||鸿富锦精密工业（深圳）有限公司||Computer system|
|CN205880806U (en) *||2015-05-25||2017-01-11||周奋豪||Computer power supply box|
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|CN205880794U (en) *||2015-05-25||2017-01-11||周奋豪||Installation fixing device and dedicated CPU radiator of computer CPU radiator|
|CN104991618A (en) *||2015-07-24||2015-10-21||上海航天科工电器研究院有限公司||VPX bus based integration architecture|
Cited By (3)
|Publication number||Priority date||Publication date||Assignee||Title|
|WO2017202251A1 (en) *||2015-05-25||2017-11-30||周奋豪||Computer chassis|
|TWI634414B (en) *||2017-07-13||2018-09-01||技嘉科技股份有限公司||Computer system|
|CN109254629A (en) *||2017-07-13||2019-01-22||技嘉科技股份有限公司||Computer system|
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|CF01||Termination of patent right due to non-payment of annual fee||
Granted publication date: 20170111
Termination date: 20180524
|CF01||Termination of patent right due to non-payment of annual fee|