CN105975017A - Computer host case - Google Patents
Computer host case Download PDFInfo
- Publication number
- CN105975017A CN105975017A CN201610353261.0A CN201610353261A CN105975017A CN 105975017 A CN105975017 A CN 105975017A CN 201610353261 A CN201610353261 A CN 201610353261A CN 105975017 A CN105975017 A CN 105975017A
- Authority
- CN
- China
- Prior art keywords
- dividing plate
- mainboard
- cabinet
- circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims description 134
- 239000002184 metal Substances 0.000 claims description 134
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 53
- 238000013461 design Methods 0.000 claims description 32
- 230000000694 effects Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 25
- 239000003365 glass fiber Substances 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 17
- 239000012528 membrane Substances 0.000 claims description 17
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 239000011152 fibreglass Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 238000003032 molecular docking Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000012943 hotmelt Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000523 sample Substances 0.000 description 43
- 238000009434 installation Methods 0.000 description 41
- 238000009833 condensation Methods 0.000 description 32
- 230000005494 condensation Effects 0.000 description 32
- 230000005855 radiation Effects 0.000 description 23
- 230000005611 electricity Effects 0.000 description 21
- 239000012530 fluid Substances 0.000 description 19
- 238000001704 evaporation Methods 0.000 description 18
- 230000008020 evaporation Effects 0.000 description 16
- 239000012634 fragment Substances 0.000 description 13
- 238000010276 construction Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- 239000013013 elastic material Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 229920002379 silicone rubber Polymers 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000012141 concentrate Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000013519 translation Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008707 rearrangement Effects 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 229960001866 silicon dioxide Drugs 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000013507 mapping Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005493 welding type Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 206010004966 Bite Diseases 0.000 description 2
- 206010010904 Convulsion Diseases 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000036461 convulsion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical group O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/188—Mounting of power supply units
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
- G06F2200/163—Indexing scheme relating to constructional details of the computer
- G06F2200/1638—Computer housing designed to operate in both desktop and tower orientation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a computer host case which comprises a computer host case shell and computer hardware. The computer hardware comprises a main board, a hard disk or power supply box and a corresponding cooler. The computer host case is characterized in that a partition plate is arranged in the computer host case shell and divides the cavity of the computer host case shell into two parts, the main board is fixed to the plate face on one side of the partition plate, the plate face on the side is the front face of the partition plate, the hard disk or power supply box is arranged on the plate face on the other side of the partition plate, the plate face on the side is the back face of the partition plate, the main board and the front face of the partition plate are parallel or are attached in parallel, the hard disk or power supply box and the back face of the partition plate are parallel or are attached in parallel, the front face or back face of the partition plate or the interior of the partition plate is provided with a circuit, and a partition plate socket for being matched and connected with the computer hardware is arranged on the partition plate and connected with the circuit on the partition plate. The thickness of the case can be effectively reduced, and the computer host case is small in size, light in weight, suitable for designing an ultra-thin case and beneficial to re-layout of the computer hardware.
Description
Technical field
The present invention relates to the technical field of computer hardware equipment, the technology of a kind of ultra-thin computer host box.
Background technology
The main flow of existing conventional desktop computer mainframe box is tower mainframe box, and its overall build is cuboid.Desktop computer
Mainframe box have horizontal and vertical point, typically with vertical most commonly seen.In mainframe box, all of physics parts are commonly referred to as
Computer hardware, including mainboard, hard disk, CPU, memory bar, display card, CD-ROM drive and power supply, and each radiator.Existing tower
Mainframe box is non-ultra-thin case, and build is big, Heavy Weight.
1) hardware arrangement and cabling: the hardware arrangement in conventional desktop mainframe box at present is designed as, and a locational space is several
A kind of computer hardware can only be installed and used, so in order to meet the more hardware of support, be provided with in mainframe box a lot of each firmly
The installing space position of part, when some hardware installation position uses less than, just can only be idle at that, waste mainframe box greatly
Interior spatial volume, makes the space availability ratio in mainframe box the lowest.
Data between each hardware or confession electrical connection in the mainframe box of conventional desktop, the overwhelming majority uses RVV and leads
Line, couples together by between each hardware that wire will be associated.But owing to the layout in legacy hosts case and cabling mode fall
After, adding that various hardware is numerous, the connection wire formed is also crisscross, complicated the most various, and using not only user needs
Possess certain professional knowledge background, and had a strong impact within mainframe box attractive in appearance, various cablings occupy the most significantly
Spatial volume in cabinet.In traditional mainframe box, owing to the arrangement of each hardware exists irrational reason, add that employing is commonly led
Line is connected, and the distance that connects between hardware is not the shortest, also cannot accomplish the connection of minimal path, because the shortest, commonly
Wire becomes the thickest but also hard, uses so being not easy to very much user installation.
2) structure of cpu heat and installation thereof: traditional cpu heat is with 4 screws/expansion bayonet lock, by master
Cpu heat is fixed on mainboard by the CPU installing hole on plate, rigidity or material, frame mode close to rigidity.Usually occur
Five kinds of problems below: first, the tension twisted due to screw/expansion bayonet lock, the stress between radiator and mainboard is excessive, causes mainboard
Bending in various degree.Second, sometimes due to each stress degree is unbalanced during this 4 fastened by screws, cause cpu chip
Between the heat-conducting base of surface and radiator, local tilts, and produces microscopic spaces, considerably increases at the bottom of cpu chip and radiator heat conduction
Heat conductivity between Zuo, hinders cpu chip heat transfer between radiator.3rd, traditional cpu heat and supporting
Fastener, part are various, install cumbersome, mostly need a few minutes to ten a few minutes.4th, parts of traditional CPU dissipate
When hot device is arranged on mainboard, it is impossible to mobile or can only single-way moving.Cause and sometimes occur on cpu heat and some mainboard
Conflicting mutually in component position, and can not the drawback of normal mounting.5th, the cpu heat of most of traditional high-side is in order to reach
Preferably radiating effect, can only the size build increasing radiator simply.So make large-scale cpu heat to mainframe box and
The compatibility of mainboard is substantially reduced, and the cost that user buys the most substantially increases.
It addition, the CPU overwhelming majority TDP power consumption that domestic consumer uses is all within 100W, but in view of top CPU with super
Frequently the challenging needs of user, power consumption more than the 180W to be reached that cpu heat can carry.Therefore to the performance of radiator it is also proposed that
Higher requirement.
3) installation of display card and heat radiation: the display card in conventional desktop mainframe box, if low and middle-end video card, one
As be use video card first wife radiator dispel the heat.If high-power high-end video card, or use high, loaded down with trivial details water-cooled
Scheme, or reinstall more preferable air-cooled radiator.But major part display card air-cooled radiator or have on the market
Fixed compatible scope, otherwise kit is many, complex installation process.And do not possess the user of certain Professional knowledge not
Know and select which type of radiator most suitable.
Traditional host desktop case, display card exist in terms of heat radiation below some problem:
First, if display card uses air-cooled, due to mounting means and the restriction of dimensions, heat sink size is little to
Exceed the size range of video card itself.And a part of volume of the fan radiator to be occupied of its coupling, so radiator
Actual area of dissipation is limited.
Second, if using water-cooled, its high expense of light is not said.The water tank supporting with water-cooled, water pump, radiator, wind
Fan, water pipe etc. are required for additionally increasing the volume and weight of cabinet.And install loaded down with trivial details, also need to possess certain during user installation water-cooled
Professional manipulative ability.
3rd, display card is perpendicular with cabinet side board air inlet.If using air-cooled, air inlet flow into
Cold air is by the CPU radiator fan on mainboard and the common unordered interference of VGA COOLER, and the cold air outside cabinet can not
Completely, flowing through of one-dimensional order display card radiator carries out high efficiency and heat radiation because not science, tight air channel in cabinet,
Make in the cold air of inflow display card, cpu heat entrainment of reflux heat air, have impact on the heat exchange effect of radiator.
4th, display card radiator is to place in horizontal parallel, is highly detrimental to air hot-fluid lift the most upwards.
Traditional host desktop case, display card is directly vertically to be inserted in use in the card slot of mainboard.Due to mainboard
In cabinet, broadly fall into large-sized hardware with display card, be mutually perpendicular spatial volume that the mode of installation takies very
Greatly.But this mode is fine to the compatibility of hardware.
4) heat dissipation wind channel: the heat dissipation wind channel in conventional desktop mainframe box designs not science, unordered, nearly all there is reflux heat
The phenomenon of wind.And in order to increase CPU or display card heat radiation effect, simply by increase heat sink size volume solve.
Metal shell by means of cabinet itself the simplest, effective transmits, spreads a part of thermal source.
It addition, the noise that rotation speed of the fan produces with it always is a big contradiction of wind-cooling heat dissipating.Conventional desktop machine host
Rotation speed of the fan in case generally has two kinds of forms: one is fixed rotating speed, and one is to carry out temperature control by connection mainboard PWM socket
Rotating speed.The former, no matter temperature in chassis height is the most all rotating speed, not a science；The latter, fan first has to possess PWM merit
Can, carrying out under mainboard BISS to be entered opening, arranging, user needs possess certain Professional knowledge.And fan model is numerous
Many, if the fan noise being under PWM rate controlling pattern is excessive or wind speed is less than normal, user effectively adjusts almost without way
Joint.
5) power supply: the power pack volume in conventional desktop mainframe box is relatively big, its function is by the municipal alternating current direct of input
Switch through the direct current output of different magnitudes of voltage needed for changing each hardware into, use numerous RVV wire to dock with each hardware respectively, add and upload
Design arrangement in system mainframe box falls behind, and causes the various wires of case in main frame close and numerous, crisscross, takies wave greatly
Take the spatial volume in mainframe box and have impact on the attractive in appearance of main frame, also having hindered the convenience that user uses.
Summary of the invention
For overcoming the defect of prior art, it is an object of the present invention to provide one and effectively reduce cabinet thickness, volume is little, weight
Light computer host box.
Further objective is that the design being suitable for ultra-thin case structure, be conducive to again the computer master of layout computer hardware
Casing structure.
The present invention is realized by following technical proposals:
A kind of computer host box, including casing of computer cabinet and computer hardware, computer hardware includes mainboard, hard disk or power pack
And corresponding radiator, it is characterised in that: being provided with metal partion (metp) in described casing of computer cabinet, metal partion (metp) is by computer master
The cavity that casing is constituted is divided into two, and mainboard is fixed on a side of metal partion (metp), and this side is metal partion (metp)
Front, hard disk or power pack are located on another side of metal partion (metp), and this side is the back side of metal partion (metp).Mainboard, hard disk
Or power pack is all parallel with the side of metal partion (metp), is provided with circuit in described membrane front face or the back side or dividing plate, upper at dividing plate
State circuit to be provided with for mating, with computer hardware, the dividing plate socket being connected.
Described computer hardware also includes that display card, display card be arranged in parallel with the side of metal partion (metp), and hard disk includes
3.5 cun of hard disks and 2.5 cun of hard disks.
Parallel on described metal partion (metp) CD-ROM drive is installed.
The integral type matched " U " font slide lid housing, described slip lid is had in the enclosure location of described computer host box
Shell is transparent or semitransparent or transparent materials is made.
Fit tightly or be embedded with the circuit of Ultrathin tabular form, electricity in described cabinet internal partition front and/or the back side or dividing plate
Thickness≤the 0.5mm of conductor in road.Matched docking by the dividing plate socket of connection corresponding with foregoing circuit between each computer hardware
After the most correctly connect, or directly the tailored interfaces of hardware is pasted and touches the electrical contact being arranged on dividing plate described exposed conduction
Correctly mate on Dian, contact after turn on.
On described cabinet internal partition or in fit tightly or the circuit of embedded Ultrathin tabular form, hereinafter referred to as " every
Plate circuit ".These are connected with corresponding dividing plate circuit by dividing plate socket, wire and are arranged on, directly against touching, match naked
Computer hardware on the dividing plate circuit of dew conduction, parallel or parallel patch is touched and is arranged on the one side of dividing plate or double by these above-mentioned hardware
On face.
Mutually insulated between described dividing plate circuit and described dividing plate, flat conductor circuit apparent height not higher than the most about every
The height on plate surface.Whole dividing plate circuit surface have insulation and wearing layer close over.
Described dividing plate is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit, metal base printed circuit board, FPC
Flexible cord arranges embedded dividing plate, the embedded dividing plate of ultrathin insulating copper sheet or Metal Substrate conductive coating circuit dividing plate.
Described dividing plate is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit, by glass fibre/half glass fibre
Base PCB is fabricated to wired circuit and the physical appearance size of design, and dividing plate is that aluminium alloy or copper metal are put down
Plate, on dividing plate, one side or the position of double-sided design, process the groove matched with above-mentioned PCB shape and thickness,
Above-mentioned PCB is closely covered on dividing plate in the groove of correspondence, makes at PCB surface and its place baffle surface
In same plane height.Have on whole of the dividing plate of above-mentioned embedded PCB insulation, wearing layer close over.
Described dividing plate is identical material with metal shell or the skeleton of computer host box and is integrally formed, will by mould
Dividing plate is made to be made of one piece with metal shell or the skeleton of computer host box after material hot melt or extruding.
Described dividing plate and the metallic framework of computer host box or shell be separate independent, dividing plate and cabinet metallic framework or
It is welded and fixed between outer casing inner wall.
Described dividing plate socket directly welds or pastes and touches on the dividing plate circuit being connected to correspondence.The hardware interface class of dividing plate socket
Type includes 7pin SATA 2.0 data-interface, 7pin SATA 3.0 data-interface, SATA Express hard-disk interface, SAS
Hard-disk interface, SATA 7+15pin data+power supply hard-disk interface, SATA 7+6pin data+power supply CD-ROM driver interface, mainboard
Starting up contact pin POWER SW, mainboard restart contact pin RESET SW, USB 3.0 19/20pin socket, USB
2.0 9pin sockets, mainboard audio frequency contact pin HD AUDIO, display card PCI-E slot, mainboard are main supplies electrical slot, mainboard auxiliary
Help for electrical slot and display card auxiliary power supply slot, or the combination in any of above-mentioned hardware interface.
The bottom ordered arrangement of described dividing plate socket the pin that this socket is corresponding, in the corresponding installation site of dividing plate circuit
On have pad, the pin bottom described dividing plate socket be directly weldingly fixed on correspondence dividing plate circuit position on.
Or the bottom ordered arrangement of described dividing plate socket the pin that this socket is corresponding, and these pins are led with exposed
Presented in electric metal shell fragment, the periphery of the described shell fragment bottom dividing plate socket is provided with the alignment pin of projection, on dividing plate
There is the installation region of structure in concave shaped corresponding installation position, and in concave shaped region, ordered arrangement the electrical contact of exposed conduction
Point, is provided with on the dividing plate of neighboring, concave shaped region and positions hole accordingly, and dividing plate socket is existed by screw/expansion bayonet fastenings
Electricity behind installation position corresponding on dividing plate, in the concave shaped region that conducting metal shell fragment bottom dividing plate socket is corresponding with on dividing plate
Contact point patch the most one by one in road touches conducting, the location on installation position that the alignment pin of dividing plate socket bottom protrusion is also corresponding with on dividing plate
Coupling is inserted mutually one by one in hole.
Being distributed in the one side of described dividing plate, be fixed with several mainboard support columns, this face is set to the front of dividing plate, support column
The height protruding from plate face is 4～7mm, and the installation on the mainboard of the distributing position of described mainboard support column and corresponding support
Kong Weixiang mates one by one, and described mainboard support column is conducting metal material.
The internal thread hole being perpendicular to dividing plate plate face or the pin hole matched with expansion bayonet lock is had in described mainboard support column,
Described mainboard support column is by parallel for mainboard hanging in membrane front face, and the mainboard back side is relative with membrane front face, by screw or
Expand in the mainboard support column that mainboard is fixed on dividing plate by bayonet lock.
Described dummy substrate is the metal plate of conduction, and its direct current negative pole/ground connection being designed as computer host box complete machine is transmitted
Mainly carrying conductor, each computer hardware by dividing plate socket or directly with conducting metal dividing plate is affixed to touch and is born by the direct current in hardware
Polar circuit/ground connection is conducted with metal partion (metp).
Described mainboard is to lean against membrane front face, near the mainboard the North limit of CPU position on geographic orientation down, and the western end of mainboard
The end edge afterbody towards cabinet of I/O interface group is had on limit i.e. mainboard.
The region in membrane front face is projected to, the dividing plate of the auxiliary power supply socket on mainboard on described mainboard the North limit
A dividing plate socket, the bottom stitch of described dividing plate socket and corresponding dividing plate circuit communication is had on front position.By wire one
End inserts with the mainboard auxiliary power supply slot on mainboard and connect, and the other end of wire inserts that described dividing plate socket is interior to be connected, make every
Power supply circuits corresponding on plate are connected with the mainboard auxiliary power supply slot on mainboard.
The radiator of the CPU in described computer host box includes CPU attached heat sinks and cpu heat, and described CPU dispels the heat
Device is fixed by a H type bridge clinching tool support, and H type bridge clinching tool support includes two sliding bars, two sliding bar centre portions
In the state being parallel to each other, two sliding bar both ends all bend, and are respectively arranged with on the section of the bending at two sliding bar both ends
One can on this section the support column of movement, there is an expansion clamp support column bottom, this expansion clamp size, size be with
Cpu heat installing hole on mainboard matches, and being provided with one on the section that described two sliding bar mesophases are parallel can
The bridge depression bar moved freely on the bar direction of principal axis of two sliding bars, described bridge depression bar centre portion is inner groovy structure, wherein
Described two sliding bars are resilience material member or bridge depression bar is resilience material member, described two sliding bars and described bridge pressure
Bar combination constitutes described " H " type structure together.
One of described CPU attached heat sinks is flat straight vacuum thermal pipe evaporation ends, and other end is to be welded with heat radiating fin
The vacuum thermal pipe condensation end of sheet.Section between described these two ends of CPU attached heat sinks is processed into corrugated tube shape, and CPU adds
The bottom of the condensation end of radiator is smooth, is touched be fixed on the cabinet metal near CPU position by screw or buckle patch
On outer casing inner wall, thus the partial heat of CPU heat-conducting base is delivered on cabinet metal shell and the condensation of CPU attached heat sinks
On the radiating fin of end.
Described cpu heat is vacuum thermal pipe formula radiator, and there is a heat-conducting base bottom of cpu heat, is arranged on
On cpu chip.On the heat-conducting base edge of cpu heat, one is had to move towards with the vacuum thermal pipe of arrangement on heat-conducting base
Perpendicular groove, and the shape size of this groove just evaporation ends with CPU attached heat sinks matches, CPU additional heat
After the evaporation ends of device coordinates in the groove snapping in heat-conducting base edge, with cover plate and fastened by screw on heat-conducting base edge.Lead
The front of hot base is that direct parallel patch is touched on cpu chip surface.And the approximate centre position at the back side of heat-conducting base has
One bulge-structure, the indent sliding-rail groove of bridge depression bar centre portion can just clasp this bulge-structure, and bridge depression bar is positioned at the bottom of heat conduction
On the seat back side.
Described heat-conducting base is to clasp the bulge-structure at its back side by bridge depression bar to be close on cpu chip, and bridge
Depression bar is to be movably fixed on two sliding bars, and two sliding bars are to be respectively clamped into mainboard by the dop on movable support column
In upper 4 cpu heat installing holes, finally expansion anchor is inserted in the pin-and-hole in supporting, thus by whole fastener support
It is fastened on mainboard together with cpu heat.
Described computer host box is vertical, and mainboard is placed downwards on i.e. mainboard the North limit near one end of CPU, limit, the mainboard south
Upwards, the casing inwall near limit, the mainboard south is the top inner wall of cabinet, is vertically above mainboard front on this inwall
In the strip region of 15～45mm, activity is mounted with the socket of a strip, constitutes cabinet inwall extension socket, described inwall
Three kinds of interfaces, DC+5V and the power supply interface of direct current negative pole, 7+6pin SATA CD-ROM driver interface and 7+ is included on extension socket
15pin SATA hard disc interface.
Described inwall extension socket uses strip PCB to concentrate cabling, and strip PCB fits tightly machine
Chamber interior wall, circuit board section extends to the circuit on the edge in dividing plate plate face, and strip PCB extension and dividing plate
The circuit of upper correspondence docks mutually one by one, fixing by welding connection.Pin bottom the most above-mentioned extension socket is by being welded and fixed
Or patch touches on the circuit that the fixing connection of activity is corresponding in described strip PCB, by the circuit of its extension with
Corresponding dividing plate circuit communication.The interface of described inwall extension socket is paralleled towards with separator face.
In the western end edge of mainboard, the board edges section of I/O interface group projects to the position on dividing plate and is provided with mainboard I/O gear
Plate dividing plate draw-in groove, described draw-in groove be have one stitch wide about 1mm, stitch deep 2～3mm straight groove/slit, fluting/perforate
The overall dimensions of overall dimensions >=mainboard I/O baffle plate (mainboard backboard).Before mainboard is loaded mainframe box, first by mainboard I/
One long limit of O baffle plate (mainboard backboard) snaps onto in this partition groove/slit, then by whole mainboard I/O baffle plate (mainboard backstop
Plate) fixing in the perforate that matches of the mainboard I/O baffle plate (mainboard backboard) that snaps in cabinet afterbody.
Display card that the hardware installed in the space at the described dividing plate back side includes comprising radiator, hard disk, turbofan,
Power pack, Power entry module, temperature control module, and be all parallel patch touch be arranged on dividing plate.The described dividing plate back side except with power pack,
Dividing plate socket and Power entry module are installed outside the concave shaped dividing plate circuitry contacts matched, the surface in other regions, the dividing plate back side
It is to present with metal plate form smooth, heat conduction.
The pcb board face of described display card is parallel to mainboard pcb board face and is arranged at the mainboard back side, and on display card, I/O connects
Mouthful group socket towards with the socket of I/O interface group on mainboard towards identical.
Radiator is installed in the one side of the pcb board of described display card, display card pcb board is fitted without radiator
Another side relative with the described mainboard back side.
The dividing plate of one piece of parallel heat-conducting is had, equipped with radiator on display card between described display card and mainboard
One side relative with dividing plate plate face, and be fitted without the another side of radiator on the pcb board of display card parallel and near to computer master
The shell side panel of machine.
On described display card the edge of pcb board residing for I/O interface group its I/O interface group socket towards direction on
The distance at pcb board edge 15～40mm residing for I/O interface group on mainboard to be protruded from.
The radiator installed on described display card is provided with several vacuum thermal pipes and heat-conducting base, numerous equal in the ranks
Radiating fin every arrangement forms the main part of described radiator, described radiator generally flat, and there is concavo-convex structure local
Make and the bending extension of partial vacuum heat pipe.Described heat-conducting base is located in the one side of described flat radiator, and this face is
The front of described radiator, the parallel patch in the back side of described radiator is touched in described separator face.
Described vacuum thermal pipe contains evaporation ends and condensation end, and on described radiator, the evaporation ends of all vacuum thermal pipes is all
Fitting tightly in an orderly manner or be embedded on described heat-conducting base, the most smooth one side of heat-conducting base is flattened on display card
On GPU chip；The condensation end of part or all of described vacuum thermal pipe is distributed in the back side of described flat radiator.
The condensation end of a part of vacuum thermal pipe on the heat-conducting base of described radiator extends in main frame metal shell
On wall, and parallel fit tightly on main frame metal shell inwall.
The condensation end of the vacuum thermal pipe of described radiator back EDS maps is paralleled with separator face, and described vacuum thermal pipe
Condensation end parallel to being processed into flat to the side of separator face, parallel patch is touched in separator face；Described vacuum thermal pipe
The opposite side of condensation end fits tightly or is welded on part or all of described radiating fin.Above-mentioned radiating fin is perpendicular to dividing plate
On face, and the air channel trend that its arrangement is formed is paralleled or in≤45 ° with the socket direction of I/O interface group on display card
Angle.
Described display card GPU Chip Vertical projects to the center of this video card pcb board rear surface regions and pastes or dispose
Having insulation silica gel, the pressure extruding this insulation silica gel after fixing and produce that put in place by the side panel of mainframe box slip lid makes radiator
Heat-conducting base and display card GPU chip surface or the vacuum thermal pipe condensation end of described radiator back EDS maps flat one
Face parallel with dividing plate plate face tight patch touch, conduct heat energy.
Described display card passes through dividing plate socket or the video card adapter of Interface Matching and extends winding displacement, independently shows described
Golden finger interface on the card display card slot corresponding with on mainboard is docked and connected mutually.
Install when display card and radiator not being installed on the band of position of display card on described dividing plate, aforementioned barriers position
Put on region can parallel installation power pack or/and hard disk.And described hard disk is or/and the power pack dividing plate socket by coupling
Or/and directly dock mutually with corresponding dividing plate circuit.
The described dividing plate back side or/and cabinet metal shell top or bottom inwall on parallel patch touch be mounted with quasiconductor system
The cold end face of cold, smooth on the face, hot junction of semiconductor chilling plate have one piece of thermal conductive metal plate, on described thermal conductive metal plate closely
Being fitted with the evaporation ends of vacuum thermal pipe, the condensation end of described vacuum thermal pipe fits tightly in cabinet metal shell afterbody
On wall, the heating of semiconductor chilling plate is conducted and dispels the heat to cabinet afterbody shell.
The dividing plate socket power supply corresponding with on dividing plate by coupling of the positive and negative electrode power supply circuits of described semiconductor chilling plate
Circuit docks mutually.
Power supply box in described computer host box is provided with input port and the output port of power supply, and power pack exports
The one side at port place and separator face are affixed touches installation.Be provided with in the output port of described power pack can directly and in cabinet every
Circuit corresponding on plate is by overlaying the transmission structure being conducted after touch.In the output port of described power pack and computer host box
There is not third-party socket between circuit corresponding on dividing plate, plug wire is attached.
The plane that during the one side at output port place is its case surface on described power pack, area is maximum, this face sets
Bottom surface for power pack.And power pack bottom surface is to the separator face in cabinet, patch of paralleling with separator face is touched and is installed.
In good order in output port of power source on described power pack bottom surface arrange that some protrude from power pack bottom surface 0.5
～the contact copper sheet that 3mm is high.These fronts contacting copper sheets outside are all conductions smooth, exposed, and these contact copper sheet
The inside back side is fixed on the elastic material part insulated mutually with other circuit, and described elastic material part is fixed on again power pack
In.
Contact copper sheet in the output port of described power pack bottom surface according to circuit design demand, can with in power pack
Direct-flow positive pole output circuit, direct current negative pole output circuit, access one or more circuit of municipal alternating current circuit relative
Should connect.And be separate and insulation between the contact copper sheet of difference circuit definitions, contact copper sheet is with power pack bottom surface also
Insulate mutually.
There is the alignment pin of several projections on bottom surface outside the output port of described power pack, cabinet internal partition is pacified
The output port with power pack bottom surface and alignment pin is had respectively at dimensions, locality, circuit in the region of dress power pack
The concave shaped circuitry contacts the most correctly mated mutually in definition and hole, location.Concave shaped circuitry contacts surface is exposed conduction
, but insulate mutually with between dividing plate, the circuit on dividing plate that concave shaped circuitry contacts is the most corresponding is connected.
The bottom surface of described power pack is smooth metal conductive materials in addition to output port, the output direct current in power pack
Negative pole/grounded circuit is connected with the power pack bottom surface of conduction.Power pack is touched be fastened on by screw or the expansion parallel patch of bayonet lock
On metal partion (metp) face in cabinet, and between metal partion (metp) surface, carry out bump contact conducting.
The shell of described power pack uses large area thermal conductive metallic material, and its internal heating element is directly against touching at power pack
On metal shell inwall, or by vacuum thermal pipe, heater element is connected with power pack metal shell inwall.Power pack passes through
Screw or the expansion parallel patch of bayonet lock are touched and are carried out heat conduction, heat radiation on the metal partion (metp) face being fastened in cabinet.
Described power pack global shape is flat square body, the maximum gauge≤31mm of power pack, wherein long≤150mm,
Width≤110mm, or length≤260mm, wide≤120mm.
The power input port circuit definitions of described power pack is, municipal administration alternating current accesses and the direct current of required voltage value supplies
It is electrically accessed；The output port of power source circuit definitions of power pack is, the direct current output of required voltage value and municipal administration alternating current output.
Described Power entry module patch is touched the side on the dividing plate back side and is set to bottom surface, and described bottom surface is provided with " direct current input
Mouthful " and " direct current delivery outlet ", the most in good order in " direct current input port " and " direct current delivery outlet " arrange described in some protrude from
The contact copper sheet that bottom surface 0.5～3mm is high.These fronts contacting copper sheets outside are all conductions smooth, exposed, and these connect
The back side touching copper sheet inside is fixed on the elastic material part insulated mutually with other circuit, and described elastic material part is fixed on again joins
In electricity module.
Contact copper sheet in " the direct current input port " of described Power entry module bottom surface and the direct-flow input circuit in Power entry module
It is connected；In " the direct current delivery outlet " of Power entry module bottom surface contact copper sheet respectively from the different output voltage values in Power entry module
Direct current output power supply be connected.And be separate and insulation between the contact copper sheet of difference circuit definitions, contact copper sheet
Insulate mutually with Power entry module bottom surface.
That removes " direct current input port " and " direct current delivery outlet " on described Power entry module bottom surface is externally provided with determining of several projections
Position pin, has " the direct current input port " with Power entry module bottom surface, " direct current output on dividing plate respectively in installing the region of Power entry module
Mouthful " and alignment pin concave shaped circuitry contacts of completely correct coupling and determining mutually on dimensions, locality, circuit definitions
Hole, position.Concave shaped circuitry contacts surface is exposed conduction, but insulate mutually with between dividing plate, and concave shaped circuitry contacts divides
Not corresponding dividing plate circuit is connected.
The bottom surface of described Power entry module is smooth metallic conduction material in addition to " direct current input port " and " direct current delivery outlet "
Matter, the direct current output negative pole/grounded circuit in Power entry module is connected with the metal bottom surface of Power entry module.Power entry module passes through spiral shell
Silk or expand the parallel patch of bayonet lock and touch and be fastened in cabinet in metal separator face, and carry out bump contact between metal partion (metp) surface and lead
Logical.
Contact copper sheet in " the direct current input port " of described Power entry module bottom surface is by the concave shaped electricity corresponding with on dividing plate
Road contact point matches after docking, power pack exports the direct current in aforementioned barriers circuit and imports to reconvert in Power entry module
Become the direct current supply of different magnitudes of voltage needed for each hardware device, then by the direct current supply of above-mentioned different magnitudes of voltage through Power entry module
Each contact copper sheet in " the direct current delivery outlet " of bottom surface is matched docking by the concave shaped circuitry contacts corresponding with on dividing plate
After, the direct current supply of above-mentioned different magnitudes of voltage is transmitted separately in the dividing plate circuit of correspondence.
At the centre portion at the described cabinet internal partition back side, on the dividing plate dorsal edge position of casing front panel
Be provided with on Power entry module, and described Power entry module incorporate one or more with what one or more of class interface matched
Socket, dividing plate socket: 6/8pin display card auxiliary power supply slot, 24pin mainboard are main powers connect for electrical slot, turbofan
Mouth, 7+15pin SATA hard disc interface, SATA Express hard-disk interface, SAS hard-disk interface, USB 3.0 19/20pin insert
Mouth, USB 2.0 9pin socket, 7+6pin SATA CD-ROM driver interface.
Also incorporating temperature control module in described Power entry module, Power entry module provides power supply and installation position to be empty for temperature control module
Between and/or circuit trace structure.
It is provided with intelligent temperature control system, including manually regulating switch, temperature control module, fan, temperature in described computer host box
Probe, manually regulation switch is placed on casing, it is simple to user operation uses, and temperature control module, fan are positioned at cabinet institute
The position needed, temperature probe is positioned towards the side of cpu heat or graphic card radiator, and is in the leeward of radiator air-flow
In air channel, temperature control module simultaneously with manually regulate switch, fan, temperature probe are connected.
PCI-E slot on mainboard on dividing plate corresponding that corresponding with there being individual mainboard installing hole between memory bar slot
Being connected and installed with temperature probe described on individual mainboard support column, this temperature probe includes following 2 kinds of forms:
1) fixed, temperature probe is overall, and in column, upper end is temperature probe element, and size can be just passed through the mainboard peace of correspondence
Dress hole；Lower end is the stitch of this temperature probe element, is fixed by welding on the dividing plate circuit of correspondence, and temperature probe is overall
It is perpendicular in membrane front face, is positioned at the mainboard installing hole phase in membrane front face between PCI-E slot with memory bar slot on mainboard
The position that mapping pair is answered；
2) movable, the mainboard installing hole mapping pair between mainboard PCI-E slot and memory bar slot should be in the position of membrane front face
Put, have the socket of a temperature probe.This temperature probe socket is weldingly fixed on the dividing plate circuit of correspondence, and it is the highest
In the height of other mainboard support columns, after mainboard is properly attached on cabinet internal partition, there are a shaft-like temperature probe, upper end
For temperature probe element, lower end is for connecting plug.By the lower end of this shaft-like temperature probe through PCI-E slot and internal memory on mainboard
Mainboard installing hole between bar slot, in the temperature probe socket being inserted on dividing plate, now temperature probe is corresponding with on dividing plate
Circuit the most correctly connects, and the temperature probe element of its upper end is on mainboard front, for reading the gas flow temperature of this position.
Being provided with air draught type heat dissipation wind channel in described computer host box, radiating mode uses air-exhaust type wind-cooling heat dissipating, Qi Zhongyong
Turbofan in air draft outside cabinet is installed on the afterbody of cabinet, and complete machine has two big main air inlets and two little auxiliary
Air inlet, two big main air inlets are CPU air inlet, video card air inlet, two little auxiliary air inlet mouths be bottom air inlet,
Jacking air port, side.
CPU air inlet is positioned on casing side just to there being a relatively large opening on the position of cpu heat；Video card air intake
It is anterior that mouth is positioned at casing, the position corresponding with the region installing display card in cabinet has a bigger strip open
Hole；Bottom air inlet is positioned in cabinet bottom enclosure, and the dividing plate in cabinet and mainboard extend vertically up to 2 on chassis backplane
One section of elongated perforate is had between intersecting lens；Jacking air port, side is positioned at casing left plate near enclosure top and front portion
A less strip perforate is had on position.
It is fitted with turbofan in described membrane front face space and dividing plate backside space.
Membrane front face space, having on a fragment position region in the western end edge of mainboard is the I/O interface group of mainboard, and at mainboard I/
The remaining mainboard in O Interface group side western end edge part, the element heights on its mainboard is all within 18mm, so its mainboard overhead
Space more open, and the western end edge of mainboard is proximate to cabinet afterbody shell.Therefore at the cabinet afterbody in this overhead, position of mainboard
Being provided with turbofan on outer casing inner wall, the air outlet of turbofan is connected with the perforate of cabinet afterbody shell, by air-flow row to
Outside casing.
Having air vent on dividing plate, the one side of turbofan is close to this air vent and is arranged on the dividing plate back side.This whirlpool
The one side of wheel fan is through the air vent extraction dividing plate on dividing plate and the air in main inter-plate gap；The another side of turbofan is taken out
Take the air in dividing plate backside space.The air outlet of this turbofan is connected with the perforate of cabinet afterbody shell, by all extractions
Air discharge outside casing；
The described turbofan being arranged on cabinet afterbody outer casing inner wall, comprises following 2 kinds of forms and exists:
1) fixed, i.e. turbofan is fixed on the inwall of cabinet afterbody shell by screw or installation draw-in groove；
2) movable, two frames perpendicular with turbofan air outlet are provided with guide rail, install at cabinet afterbody shell
There is perforate on position of fan, and the shape of this perforate, size the most just air outlet cross section with turbofan place matches.
A guide rail sliding chute is had just vertically just this perforate to be arranged on the inwall of cabinet afterbody shell.
Turbofan with guide rail matches with the guide rail sliding chute on cabinet afterbody outer casing inner wall, and turbofan passes through machine
Perforate on case afterbody shell can freely be moved inside and outside cabinet bulk.
When this turbofan installed hinders the dismounting of hardware in cabinet, this turbofan can be moved to cabinet bulk
Outward.After the hardware in cabinet has dismounted, then this turbofan is moved back on the inwall in cabinet bulk.
In described air draught type heat dissipation wind channel, whole cabinet is in addition at above-mentioned 4, air intake perforate and light drive in dish perforate, then nothing
Other air intake holes, the air in case is ceaselessly pumped to outside casing by the fan in cabinet afterbody, causes the air pressure in casing low
Atmospheric pressure outside casing, forces the air outside casing to be flowed in casing by each air inlet.
The cold wind that CPU air inlet flows into flows through the cpu heat of correspondence, and after absorbing its heat, cold wind becomes hot-fluid.By
Being vertical in mainframe box, cpu heat is in lower half, and turbofan is at the first half.The hot-fluid that temperature is higher rises naturally due to it
Power and the suction of turbofan, flow to enclosure top, and the relatively low part hot-fluid of temperature is by the suction of dividing plate back side turbofan, warp
Gap between separator edge and cabinet front outer casing inner wall flows to the space, lower half at the dividing plate back side.Owing to metal partion (metp) is carried on the back
The latter half in face is power pack or the hard disk that parallel patch touches installation, therefore flows into the hot-fluid that temperature herein is relatively low, can be with absorption band
Walk power pack, the caloric value of a hard disk part.
The cold wind that video card air inlet flows into directly through corresponding graphic card radiator, the top half at the metal partion (metp) back side and
Top in cabinet in dividing plate backside space.Owing to having air vent in dividing plate central region, and just to this air vent at dividing plate
It is close on the back side turbofan is installed.The cold wind that bottom air inlet flows into, flows through lower half and the mainboard back of the body of membrane front face
Lower half, face.Owing to the latter half at the metal partion (metp) back side is power pack or the hard disk that parallel patch touches installation, so its caloric value
A part be delivered to metal partion (metp) the latter half, the heat absorption of the cold wind that flowed into by bottom air inlet is taken away；Another part heat
Dispel the heat in the afterbody and the bottom that are mainly transferred to cabinet metal shell；Some heat is by above-mentioned described CPU air intake
After mouth flows through, the relatively low hot-fluid of remaining portion temperature is absorbed and is taken away.
It is contemplated that high-power display card caloric value is very big, and video card air inlet air quantity is limited, also increases a side
Jacking air port, its cold wind flowed into withstands on region and the upper end, the fraction dividing plate back side of dividing plate backside space in mainly absorbing cabinet
The heat in region.
The cold wind that described four kinds of air inlets flow into, with each radiator, metal partion (metp), heating hardware, part cabinet metal outside
Shell inwall becomes air hot-fluid after carrying out heat exchange, be installed in several turbofan discharge case of the cabinet first half, afterbody
External.
The invention has the beneficial effects as follows:
The present invention is applicable to ultra-thin computer host box, and this ultra-thin mainframe box volume is about the 1/6 of the full tower crane case of tradition, fully loaded hardware
In the case of, ultra-thin mainframe box is about the half of the full tower crane case weight of tradition.This ultra-thin mainframe box can meet installation and support mesh
The mainboard model (such as: ATX, M-ATX, ITX etc.) of nearly all routine on front market, can install support all 3.5 cun of hard disks,
2.5 cun of hard disks, can install all overall heights of support, half height, overlength, powerful display card, can install support 14mm thickness with
Interior notebook CD-ROM drive.Each hardware in mainframe box has carried out rearrangement, type of attachment definition.A metal plate is had in case,
On the two sides being installed in parallel in this metal plate that each hardware is orderly, user can the most fast, dismount accurately, assemble required
Hardware；This mainframe box has an integral type "U" shaped slide lid housing matched, and (this slide lid housing can be material transparent, translucent
Matter), open/close mainframe box for user and provide extremely easy operator scheme.Entirety possesses heat dispersion and the people of excellence
One key intelligent temperature control system of property.Cpu heat, display card radiator, power pack and air draft in this ultra-thin mainframe box
Fan is the customization size model mated with this cabinet.
The setting of particularly relevant parts has the advantage that
1) the mainboard support column on dividing plate is the same effect with tradition cabinet, but here more than purposes.Because mainboard supports
Post is conduction, and is connected with dividing plate.Because metal partion (metp) is designed as direct current negative pole and the ground connection of complete machine by this ultra-thin case
Carrying leading body.The installing hole of PC class mainboard be with mainboard output direct current negative pole and ground connection position be connected, by conduction
In the mainboard support column that screw or bayonet lock are fixed on dividing plate by mainboard installing hole, i.e. achieve the Partial DC of mainboard output
Negative pole/ground connection directly connects with metal partion (metp), and the Partial DC negative pole/ground connection of mainboard output first passes through the transmission of mainboard support column
On metal partion (metp), then it is returned to power pack by touching with metal partion (metp) plate surface large area patch bottom power pack.And tradition PC main frame
It is to use a large amount of wires to be connected with the confession electrical slot of mainboard in case, direct current negative pole output whole for mainboard is directly returned to power supply
Box, it would be desirable to a large amount of wires and take more spatial volume.
2) on dividing plate hidden embedded/cover Ultrathin tabular circuit, described dividing plate can be described as " stealthy circuit dividing plate ".Electricity
By redefining arrangement in brain server, hardware compatibility fabulous (custom hardware of on the market more than 99% can be supported).The most ingenious
Achieve same position space and according to the different demand of user, different hardware, locus in improve cabinet can be installed
Utilization rate and freely collocation property time, cabinet volume is tapered to minimum: first, stealth circuit dividing plate efficiently solve each hardware
Between signal, electrical transfer, each hardware of rearrangement, be greatly reduced the volume of cabinet；Second, provide for each hardware and install admittedly
The fixed platform supported；3rd, because the dividing plate of metal matrix is connected with cabinet metal shell, touches for parallel patch and be arranged on the dividing plate back of the body
The hardware in face provides good heat conduction, support of dispelling the heat.
3) dividing plate socket is that the interface type according to different hardware is by direct with corresponding dividing plate circuit for the hardware in cabinet
Or dock mutually；The advantage of FFC line row be ultra-thin flexible, precisely, can mistake larger current, it is adaptable to dividing plate socket and hardware
Between the docking of relatively short distance.Dividing plate socket directly welds or pastes and touches on the dividing plate circuit being connected to correspondence.
First, in cabinet, some hardware can be inserted directly in the dividing plate socket matched use.As 3.5 cun, 2.5 cun hard
Dish, because it is relatively often to substitute the hardware used, so can the design that uses of straight cutting, very quick hommization.Those cannot be direct
Insert the hardware used in dividing plate socket, then use the connection theory of line of shortest length journey, with flexible cord row by these hardware with mate
Dividing plate socket docks mutually.Also cabling between hardware is greatly reduced, succinct in making complete machine, attractive in appearance.
Second, movable dividing plate socket, it is generally used for same partition position and the design of different hardware can be installed.I.e. not
In the case of increasing cabinet volume, hardware quantity and the type of extension in increasing cabinet, can be supported.
3rd, owing to movable mode clapboard socket installation position on dividing plate circuit is one piece of concave shaped region, recessed area
In have the circuitry contacts of nuditing wire.Exposed electrical contact when same position is mounted with other hardware, in recessed area
The apparent height of point is less than the height on perimeter walls surface, so short circuit will not be produced because touching other hardware.Not
When using this recessed area, this recessed area is filled and led up by available supporting insulating pad, plays isolated insulation and dust-proof effect.
4) mainboard towards: mainboard is to lean against membrane front face, on the parallel mainboard support column being fixed on membrane front face.Because it is main
Cabinet is upright type of design, and on the one hand the center of gravity in view of complete machine to move down as far as possible, and mainboard is the most partially near one end of CPU position
Weight；On the other hand the air hot-fluid in cabinet is constantly to flow up, and converges in upper strata, space in cabinet.Therefore have as
Lower effect: first, mainboard is placed one end of CPU and is substantially laid particular stress on, and places the overall decentralization that can make cabinet down, makes cabinet
Vertical when more steady.Second, owing to cabinet is vertical, air hot-fluid is upwards ascension, relative to cabinet upper strata
Air-flow, the temperature of cabinet inferior airflow is on the low side.So placing down near the mainboard the North limit of CPU, advantageously dissipate in CPU
Hot device radiating effect in the gas flow.
5) cpu heat is connected with heat-conducting base and fixes, and heat-conducting base clasps its back side by bridge depression bar
Bulge-structure is close on cpu chip, and bridge depression bar is to be movably fixed on two sliding bars, and two sliding bars are to pass through
Dop on movable support column is respectively clamped on mainboard in 4 cpu heat installing holes, is finally inserted by expansion anchor and supports
In pin-and-hole in Zhuing, thus whole fastener support is fastened on mainboard together with cpu heat.Its effect is as follows:
First, due to the bulge-structure by center, the heat-conducting base back side of the bridge depression bar in fastener, by the downforce of fastener
Concentrate the central area acting on heat-conducting base, so make the stress of contact surface between heat-conducting base and cpu chip very uniform, make it
Heat conductivity between is stable.
Second, owing to the sliding bar in this fastener, bridge the depression bar even bulge-structure at the heat-conducting base back side are rebound characteristics
Material, will not cause leading of heat-conducting base and cpu chip interfacial contact because stress during artificial fastening is excessive or unbalanced
Hot index variation is excessive, is not easy to make mainboard bending.
3rd, owing to fastener support many places use movable Fixed Design, the most compatible all conventional mainboard models, fastener
Accessory is few, lightweight, and disassembling operations is the most convenient, within free-hand 10 seconds, just can complete dismounting.
4th, owing to heat-conducting base back side bulge-structure can move in bridge depression bar indent sliding-rail groove, bridge depression bar again can be
Move on sliding bar, thus whole cpu heat can the translation of little scope on any direction in mainboard plane, be substantially reduced
Can not the probability of normal mounting because conflict mutually in accessory position first with on mainboard, cpu heat edge.
6) CPU attached heat sinks: generate heat for high-power CPU, is not using water-cooled, is not increasing cabinet volume and sacrifice
On the premise of cpu heat compatibility, best solution is exactly to use vacuum thermal pipe by fast for the partial heat on cpu chip
Speed is delivered on the metal shell of cabinet dispel the heat.Its effect: first, owing to CPU attached heat sinks uses movable
Mounting means, whether user can install by unrestricted choice according to demand, without with changing whole cpu heat.It is greatly saved
The financial expenditure of user.Second, although cabinet volume is little, but make use of the metal shell of cabinet cleverly, by part CPU heat
Quickly it is delivered to dispel the heat on shell, considerably increases the effective area of heat radiation.3rd, due to this ultra-thin case base plate (end
Portion's shell) in have the particular design of a fresh air inlet, make the heat that CPU attached heat sinks passes over can more quick quilt
Air-flow is taken away, and hinders again its heat to be delivered to other positions of cabinet and affect the heat radiation of other hardware.4th, owing to CPU adds
It is processed into corrugated tube shape between evaporation ends and the condensation end of radiator, is greatly improved the bendability of vacuum thermal pipe, Yong Huan
Load and be more prone to operation and adapt to different types of mainboard.
7) inwall extension socket: first, the most efficiently make use of the free space in overhead near limit, the mainboard south, due to
Notebook CD-ROM drive and 2.5 cun of hard disks are the least, and caloric value is the lowest, so on the impact of the center of gravity of whole cabinet and heat radiation almost
Can ignore.Second, owing to mainboard has a lot of contact pin, slot and cabling on limit, the south, affect attractive in appearance.Just it is installed in parallel in master
The notebook CD-ROM drive in this overhead, position of plate, 2.5 cun of hard disks, can shelter from dexterously, makes the arrangement of cabinet entirety more attractive in appearance.The
Three, it is contemplated that this computer hardware of CD-ROM drive, major part user uses frequency the lowest, so hommization inwall extension socket is set
Counting into movable mounted, user can choose whether to install according to the use demand of oneself.
8) mainboard I/O baffle plate dividing plate draw-in groove: owing to this mainframe box uses limit ultrathin design concept, in order to by mainboard
The thickness space taken needed in the chassis is preferably minimized, therefore by mainboard I/O baffle plate (mainboard backboard) near the mainboard back side
While snapping onto in the fluting of dividing plate.This solution is when using I/O baffle plate (the mainboard backboard) of mainboard first wife, by mainboard
The thickness space size taken needed in mainframe box is down to historical low, and mounting means is simple and direct as tradition cabinet.
9) dividing plate backside space: touch the multiple hardwares being arranged on the dividing plate back side has certain need to heat radiation in view of parallel patch
Ask, so the dividing plate back side is except installing, with power pack, Power entry module, dividing plate socket, the concave shaped dividing plate circuitry contacts matched
Outside, the surface in other regions, the dividing plate back side is to present with metal plate smooth, heat conduction.
The wrong formula mounting structure of the display card back of the body:
1. formula is dissipated in: its effect has first, uses the mode paralleled, closely dispose, greatly between mainboard with display card
Decrease the spatial volume taken.Second, owing to the I/O interface of middle and high end display card is double-deck mostly, it is contemplated that should
Completely compatible all video cards, the spatial volume taken again is down to minimum, therefore cleverly by the I/O interface on display card
Region part translation is to outside the western end edge of mainboard.Plus the resistance not having dividing plate between display card I/O interface area part and mainboard
Every, so no matter the I/O interface of display card is monolayer or bilayer, does not affects its installing and using in cabinet,
Reach compatibility good as tradition cabinet.
2. outer scattered formula: its effect has first, uses the mode paralleled, closely dispose, pole between mainboard with display card
Big decreases the spatial volume taken.Second, the maximum advantage of this mode be need not reequip display card radiator and
Fan, uses radiator and the fan of display card first wife.And this mode compatibility is fine.The machine that shortcoming takies needed for being
Case space ratio " interior scattered formula " is bigger.
10) formula display card radiator is dissipated in: its effect has first, and interior scattered formula display card radiator is thin flat, accounts for
The least with volume.Second, owing to this radiator is golden with metal partion (metp) or cabinet cleverly by the condensation section of vacuum thermal pipe
Belong to outer casing inner wall and the most closely paste tactile, and display card radiator fan is not mounted within radiator, the most additionally takies radiator
Volume, so considerably increasing the actual area of dissipation of display card.3rd, the metal partion (metp) utilized due to its heat radiation and cabinet
Metal shell inherently exists, and is also greatly saved the quality of material cost and graphic card radiator.4th, due to graphic card radiator
Strip radiating fin and geographical vertical direction between in certain slanted angle, beneficially air hot-fluid lift the most upwards.
11) fixed form between formula display card radiator and display card is dissipated in
Traditional host desktop case, display card is directly vertically to be inserted in use in the card slot of mainboard.Owing to mainboard is with only
Vertical video card broadly falls into large-sized hardware in cabinet, is mutually perpendicular the spatial volume that the mode of installation takies very big, but
This mode is fine to the compatibility of hardware.
Having the effect that first, fixed radiator has reached history on the ease installed with display card
Property quick, almost one second install.Second, add that fixed radiator is to be squeezed in GPU chip by flexible silicon rubber cushion to hang down
The center stress delivering directly the shadow so far video card pcb board back side makes GPU chip surface smooth in heat-conducting base front.In being
Heart stress, makes GPU chip reach nature with the active force between heat-conducting base Jun Heng.3rd, user does not again worry as installing
Its heat-conducting effect is affected because of 4 screw discontinuity equalizations during traditional heat sinks.4th, because some host computer is to use
Collection is aobvious or core shows, and does not has display card in mainframe box, and it is idle for now installing on dividing plate on the position of display card.Can root
According to the demand of user, on this position at the dividing plate back side, parallel patch is touched and is installed hard disk or/and power pack.Make full use of spare bits
Put, make the space multifunction at the dividing plate back side.
12) ultra-thin patch touch power pack: volume is little, by the power supply output of its bottom surface directly dock patch touch be arranged on every
On plate circuit, owing to the patch contacting surface of its interface circuit is long-pending very big, big electric current transmission can be carried out.This power pack is also by input AC
It is converted into stable direct current, but during only conversion exports each hardware, the peak unidirectional current of required voltage is (required in current mainframe box
High Level DC Voltage be+12V).The ceiling voltage direct current of output " Power entry module " on dividing plate circuit is converted into each hardware
Required voltage DC, then in " dividing plate socket " is connected to the hardware of correspondence.If single power pack electricity shortage, can be at machine
It is installed in parallel 2～3 power packs in case simultaneously, makes output power double.This ultra-thin power pack is compact due to internal structure, thermal source
Relatively concentrate.Power pack shell large area uses aluminum alloy material, by being closed directly against contacting aluminum by the heater element in power pack
On gold shell, or it is connected on aluminum alloy casing with vacuum thermal pipe, major part heat is quickly transferred on power pack shell.
Touch on metal partion (metp) or part patch is touched on the inwall of cabinet metal shell, by gold because power pack is close parallel patch
Belong to dividing plate or cabinet metal shell, add the ventilation in upper case and realize large area high efficiency and heat radiation.
Effect: first, why be designed to export the direct current of power pack directly against touch be delivered on dividing plate correspondence every
In plate circuit, patch contacting surface is long-pending greatly, it is tight to fit to be because it, can realize stablizing of big electric current and pass through.
Second, due to extremely compact structure in power pack, add that employing is directly affixed with dividing plate circuit and touch transmission and power,
Without wire.Spatial volume that power pack cabinet in shared is greatly reduced.3rd, power pack by with dividing plate or cabinet
The large area of outer casing inner wall, closely patch are touched, and not only the direct current negative pole/ground connection in power pack are communicated to metal partion (metp) smoothly
On, the most ingenious, to solve power pack heat radiation efficiently problem.4th, due to power pack be by dividing plate concave shaped every
Plate circuitry contacts is connected, when not installing power pack, after filling and leading up this recessed area with insulating trip, and can be empty in this position
Between other hardware is installed.The multiple-effect collocation realizing same position space in cabinet utilizes.
13) structure of Power entry module and installation site:
First, owing to Power entry module bottom surface employs the large area press-contacting type conducting transmission identical with power pack bottom surface structure principle
Structure so that the stable transmission of big electric current can be carried out between Power entry module and dividing plate circuit.
Second, at the centre portion at the cabinet internal partition back side, near the dividing plate dorsal edge position of casing front panel
On Power entry module is installed.Above-mentioned position is simultaneously very close to the turbine wind on display card auxiliary power supply slot, the dividing plate back side
Hard disk position on fan, the dividing plate back side or power pack position, also the mainboard on the mainboard of membrane front face is main for electrical slot, and distribution mould
Socket/dividing plate the socket matched with these hardware interfaces above-mentioned is incorporated on block.Make the power supply base on Power entry module/every
Plate socket can dock with these hardware mutually with the shortest connection thread.Shared spatial volume is greatly reduced between computer hardware
With the structure in cabinet succinct, attractive in appearance.
3rd, owing to power supply cabling is the shortest, the wire circuit resistance that cabling connects is little, leading needed for wire by contrast
Body cross-sectional area is less.FFC line can be used to drain line connect, make cabling wire more frivolous, convenient.
4th, owing to Power entry module also incorporating temperature control module so that it is structure space more high-efficiency compact, make distribution mould
Block and temperature control module become integral type, it is simple to the dismounting of user and use.
14) a key intelligent temperature control system: this ultra-thin case is as desktop level mainframe box, in order to meet each level user to dissipating
Hot and quiet dual challenging needs, uses a foolproof key intelligent temperature control.I.e. by a control handle on casing,
Manually the rotating speed of regulation cabinet internal fan is interval (i.e. allowing the peak section to minimum of rotation speed of the fan), then in cabinet
Temperature control module monitor temperature in real time according to what temperature probe fed back, the concrete rotating speed of intelligent control now fan, and fan turns
The numerical value of speed is forever in this rotating speed interval.
The Balancing selection controlling main frame heat radiation and noise so allowing various user the simplest and the most direct is weighed.This key temperature control system
System may be equally applicable in notebook, all-in-one.
A foolproof key intelligent temperature control system of the present invention: first has fabulous user operation, very hommization.Second
Again need not consider whether fan has PWM function, without opening under entrance mainboard BISS, arranging.3rd heat radiation and noise
Obtain perfect dynamic equilibrium.
15) air draught type heat dissipation wind channel: owing to whole cabinet is in addition to air intake perforate and light drive in dish perforate at above-mentioned 4, then
Without other air intake holes.Owing to the air in case is ceaselessly pumped to outside casing by the fan in cabinet afterbody, in causing casing
Air pressure, less than the atmospheric pressure outside casing, forces the air outside casing to be flowed in casing by each air inlet.Therefore have the effect that
First, the sealed design used in addition to several air inlets due to complete machine.Add each hardware arrangement section in upper case
Learn, succinct, produced windage is less.Owing to cabinet volume is little, when using convulsion form, produced draught head in its casing
Becoming apparent from than big cabinet, the air channel flow formed in cabinet is big, wind speed is fast.
Second, owing to being the air channel that formed of low pressure that produces of air draught in cabinet, add hardware arrangement science, succinct, wind
Hinder little, the air olderly flowage in air channel, the phenomenon of backflow hot blast will not be produced.As the highest in the video card windscreen on the dividing plate back side
The cold wind by video card air inlet of effect all flows through the radiator of display card, and is not done by the hot-fluid in other spaces in cabinet
Disturb.
3rd, due to the form of blowing, when air-flow runs into material object, the air pressure on surface in kind (be " air pressure " be not " air pressure
Difference ", the clerical mistake before me！) can rise, air pressure raises air can tend to heat release state on the contrary, is unfavorable for surface in kind and air-flow
Heat exchange between air；And if use air-draft-type, in air channel, the air pressure on surface in kind slightly declines, and low pressure air can be more
Tend to heat absorption state and expand own vol, be conducive to the heat exchange between surface in kind and stream air.
4th, it is arranged on the turbofan in mainboard western end edge clear position overhead, the most efficiently make use of this spare bits
Put and carry out air discharging and radiating.The most additionally increase the volume of cabinet, and movable mounting structure does not the most affect tearing open of hardware
Dress uses.
5th, aforementioned four air intake perforate is fitted with Air Filter to filter the dust entered in case in air, makes main
Cleaning and permanent good ventilation, heat dispersion is kept in cabinet.
16) semiconductor refrigeration radiating: due to traditional water-cooled or air-cooled, is designed to much regardless of its volume, area of dissipation,
Euthermic chip or the temperature of component in computer host box all the time will be apparently higher than the use ambient temperatures of mainframe box, especially
In the case of hot environment and use high-power CPU, display card.If outside the metal partion (metp) in cabinet, cabinet metal
The smooth semiconductor chilling plate that is provided with carries out refrigeration heat absorption bottom shell or on the inwall at top, is led to by the partial heat energy in mainframe box
Cross vacuum thermal pipe to be quickly transferred on cabinet metal shell afterbody dispel the heat, be possible not only to substantially reach in mainframe box
Cooling-down effect, and do not increase the additional volumes of mainframe box.
Accompanying drawing explanation
Fig. 1 is computer host box construction schematic diagram () of the present invention；
Fig. 2 is computer host box construction schematic diagram (two) of the present invention；
Fig. 3 is computer host box construction schematic diagram (three) of the present invention；
Fig. 4 is computer host box construction schematic diagram (four) of the present invention；
Fig. 5 is computer host box construction schematic diagram (five) of the present invention；
Fig. 6 is computer host box construction schematic diagram (six) of the present invention；
Fig. 7 is computer host box construction schematic diagram (seven) of the present invention；
Fig. 8 is computer host box construction schematic diagram (eight) of the present invention；
Fig. 9 is the structural representation () in the dividing plate use of computer host box of the present invention；
Structural representation (two) in the dividing plate use of Figure 10 computer host box of the present invention；
Structural representation (three) in the dividing plate use of Figure 11 computer host box of the present invention；
Structural representation (four) in the dividing plate use of Figure 12 computer host box of the present invention；
Figure 13 present invention is provided with the computer host box construction schematic diagram of slip lid；
Figure 14 sliding lid construction of the present invention schematic diagram；
Equipped with structural representation during video card on Figure 15 dividing plate of the present invention；
The structural representation of the video card installed on Figure 16 dividing plate of the present invention；
The structural representation of Figure 17 display card of the present invention radiator；
The structural representation of Figure 18 power pack of the present invention；
The structural representation of Figure 19 Power entry module of the present invention；
The structural representation of Figure 20 movable mode clapboard of the present invention socket；
Structural representation when Figure 21 cpu heat of the present invention is installed；
The structural representation of the fixing device for installing of Figure 22 cpu heat of the present invention.
Identifier declaration in each accompanying drawing be presented herein below:
1, mainframe box shell；11, the top of mainframe box shell；12, the bottom of mainframe box shell；13, the afterbody of mainframe box shell；
14, side jacking air port；15, bottom air inlet；16, mainboard I/O baffle plate dividing plate draw-in groove；17, air draft perforate；18, manually regulation is opened
Close；
2, slip lid；21, slip lid front panel (casing is anterior)；22, CPU air inlet；23, video card air inlet；24, enter dish to open
Hole；25, Air Filter；
3, dividing plate；31, mainboard support column；32, dividing plate circuit；33, concave shaped contact point；34, fixed dividing plate socket；35, live
Dynamic formula dividing plate socket；36, hole, location；37, temperature probe；38, air vent；39, video card windscreen；
4, mainboard；41, mainboard I/O interface group；42, cpu chip；43, PCI-E/ card slot；44, memory bar slot；45, main
Plate is main for electrical slot；46, mainboard auxiliary power supply slot；47, mainboard installing hole；
5, fastener；51, support column, also referred to as fastener support column；52, sliding bar；53, bridge depression bar；54, expansion anchor；
6, cpu heat；61, (CPU) heat-conducting base；62, (CPU) vacuum thermal pipe；63, (CPU) radiating fin；64、CPU
Attached heat sinks；
7, display card；70, display card pcb board；71, display card I/O interface group；72, GPU chip；73, display card is auxiliary
Help for electrical slot；74, (display card) golden finger；
8, display card radiator；81, (display card radiator) heat-conducting base；82, (display card radiator) vacuum
Heat pipe；83, (display card radiator) radiating fin；
9, power pack；91, bottom surface；92, output port；93, contact copper sheet；94, alignment pin；
10, Power entry module；101, (Power entry module) bottom surface；102, direct current input port；103, direct current delivery outlet；104, shell fragment；
201, fan；202,2.5 cun of hard disks；203, hard disk；204, CD-ROM drive；205, extension socket；206, silicagel pad；208, mainboard
I/O baffle plate.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described:
Such as Fig. 1-Figure 14, a kind of computer housing, including computer host housing 1/ skeleton and computer hardware, wherein computer hardware includes
Mainboard 4, hard disk 203/ power pack 9 and corresponding radiator, be provided with dividing plate 3 in computer host housing 1/ skeleton, dividing plate 3 is by electricity
The cavity that brain server shell 1/ skeleton is constituted is divided into two, and mainboard 4 is fixed on a side of dividing plate 3, this side be every
The front of plate 3.Hard disk 203/ power pack 9 is located on another side of dividing plate 3, and this side is the back side of dividing plate 3.Mainboard 4, hard
Dish 203/ power pack 9 is all parallel with the side of dividing plate 3, described dividing plate 3 front or/and be provided with circuit in the back side or dividing plate 3, every
Plate 3 is provided with the dividing plate socket carrying out circuit connection for computer hardware.Dividing plate 3 be metal material manufacture time, referred to as metal every
Plate.
This host computer is vertical super-thin host computer, and general outline build is flat cube, but the corner of local, flat
There are different angles or structure in face, and volume is about the 1/6 of tradition PC mainframe box, and in the case of fully loaded hardware, this ultra-thin main frame is
About the half of tradition PC mainframe box weight.Meanwhile, can install and support mainboard 4 model of the most nearly all PC class
(such as: ATX, M-ATX, ITX etc.).Being provided with CD-ROM drive 204 on dividing plate 3, the notebook light within 14mm thickness is supported in preferential installation
Drive 204.Each hardware in this ultra-thin main frame has carried out rearrangement, type of attachment definition.A metal plate, each hardware is had in case
On the orderly two sides being installed in parallel in this metal plate, user can the most fast, dismount accurately, assemble required hardware；
This ultra-thin main frame has integral type "U" shaped slip lid 2 shell matched, and (this slip lid 2 shell can be material transparent, translucent
Matter), open/close this main frame for user and provide extremely easy operator scheme.It is additionally provided with mainboard on the front of dividing plate 3 to prop up
Dagger 31(mainboard 4 is installed on it), the stealthy circuit of dividing plate 3, dividing plate socket, cpu heat 6 fastener 5, CUP attached heat sinks, interior
Wall extension socket 205, mainboard I/O baffle plate dividing plate draw-in groove 16.
Concrete structure is as follows:
01) mainboard support column 31
The front of dividing plate 3 is provided with mainboard support column 31, and mainboard 4 is fixed on 3, dividing plate by mainboard support column 31.Mainboard supports
The internal thread hole being perpendicular to dividing plate 3 plate face or the pin hole matched with expansion bayonet lock, described mainboard support column 31 is had in post 31
By parallel for mainboard 4 hanging on dividing plate 3 front, and mainboard 4 back side and dividing plate 3 vis-a-vis, by screw or expand bayonet lock will
Mainboard 4 is fixed in the mainboard support column 31 on dividing plate 3.Mainboard 4 and dividing plate 3 hanging so that mainboard 4 back-side circuit plate protrudes above
Stitch will not touch with dividing plate 3 plate face and cause short circuit probability.
Arranging several mainboard support columns 31 on the front of dividing plate 3, the height protruding from dividing plate 3 plate face is 4～7mm,
And the distributing position of these mainboard support columns 31 mates mutually one by one with the mounting hole site of the mainboard 4 of corresponding support.Mainboard supports
Post 31 is conducting metal material, and fastens with dividing plate 3, conducts electricity and be connected.
Mainboard support column 31 in present specification not only possesses in traditional cabinet outside the function of mainboard support column 31, and also because of
For this ultra-thin PC mainframe box dividing plate 3 is designed as the leading body of complete machine direct current negative pole/ground connection carrying, and the installation of conventional mainboard 4
Hole be with mainboard 4 output direct current negative pole and Earth Phase connect, conduction screw or bayonet lock pass through mainboard installing hole 47 be fixed on
In mainboard support column 31 on dividing plate 3, i.e. achieve the output direct current negative pole/ground connection of mainboard 4 and directly connecting of dividing plate 3.
02) there is the dividing plate 3 of stealthy circuit
Foregoing circuit is the maximum gauge≤0.5mm of flat conductor circuit and conductor, 3 phases of flat conductor circuit and dividing plate
Mutually insulation, the height on flat conductor circuit apparent height dividing plate 3 surface the most about, in addition to the region of mounting receptacle its
His whole circuit surface has the covering of insulation and wearing layer.The most parallel on the two sides of dividing plate 3 it is mounted with much hardware, by each hardware
Between most of cabling of being connected, use the most flat above-mentioned conductor circuit be covered on dividing plate 3 surface or be embedded in dividing plate 3
In, carry out densely arranged, concentration cabling, efficiently solve the signal between each hardware, electrical transfer, each hardware of rearrangement, greatly
Reduce greatly the volume of cabinet.
Dividing plate 3 is that the glass fibre/half embedded dividing plate of fiberglass-based printed circuit 3, metal base printed circuit board, FPC are soft
Line arranges embedded dividing plate 3, the embedded dividing plate of ultrathin insulating copper sheet 3 or Metal Substrate conductive coating circuit dividing plate 3.Can be that each hardware provides peace
The fixing platform supported of dress.
Preferably, dividing plate 3 is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit 3, wherein glass fibre/half
Glass fibre is substrate, and glass fibre/half being fabricated to meet the wiring of design requirement and physical form is fiberglass-based
PCB, dividing plate 3 is the metal plate of aluminium alloy or copper material, one side or the position of double-sided design on dividing plate 3, processing
Go out and the groove of corresponding PCB shape and size thickness equity mutually, PCB is closely covered on dividing plate 3 correspondence
Groove in, make PCB surface and its place dividing plate 3 surface be in same plane height.Owing to flat on dividing plate 3 is led
Body circuit and dividing plate 3 fit tightly one, and outside the pad of this circuit, contact point, whole circuit surface has been carried out absolutely
Edge layer and the covering treatment of wearing layer, so the circuit being hardly visible on dividing plate 3, Gu be referred to as " stealthy circuit dividing plate 3 ".Stealthy
Strap circuit on circuit dividing plate 3, hereinafter referred to as " dividing plate circuit 32 ".Whole of the dividing plate 3 of embedded PCB is enterprising
Row insulation, the covering of wearing layer.
Concrete operating process is, processes the groove of deep 0.1～1mm on dividing plate 3, the position of groove, shape, size
Depending on the real needs of cabling, more integrated for ultra-thin printing PCB is filled so far in groove, dividing plate 3 groove and PCB electricity
Plate surface, road all carries out insulation and paints process, by binding agent by seamless for PCB dividing plate 3 groove being fastened on correspondence.
After fastening is good, PCB apparent height is the most highly consistent with the dividing plate 3 plate face at place, is fastening the most again, embedded
Carry out on whole of the dividing plate 3 of PCB insulating, wear-resisting coating, such dividing plate 3 is just combined into one on PCB surface
Body, is also hardly visible the circuit of the inside.
It is contemplated that dividing plate 3 back side is with greater need for heat conduction and heat radiation, add simplification design, technique, unified by PCB
It is embedded in the front of dividing plate 3.
Preferably, dividing plate 3 is the embedded dividing plate of ultrathin insulating copper sheet 3, i.e. becomes with etching, CNC mill processing or mould one
The technique of type, is processed into required shape, the groove of size by needing the band of position of cabling on metal plate (dividing plate 3).With
Etching or mould punching shear technique again the copper sheet that thickness is 0.05～0.5mm thickness is fabricated to design various walk
Line, and these copper cablings densely arranged after outermost profile specification and this metal plate (dividing plate 3) shape of upper groove, chi
Very little match.By the ultra-thin copper sheet cabling after the groove on metal plate (dividing plate 3) and processing, surface carries out insulation processing,
Ultrathin insulating copper sheet cabling is closely embedded in the upper corresponding groove location of metal plate (dividing plate 3) by binding agent afterwards, and
The apparent height of the apparent height of ultra-thin copper sheet cabling metal plate (dividing plate 3) the most about.This process program is suitable for
The circuit trace of metal plate (dividing plate 3) upper design arrangement super-high-current.
Preferably, dividing plate 3 arranges embedded dividing plate 3 for FPC flexible cord, and the circuit material except embedding is in addition to FPC flexible cord row, its
The technique that he is embedded in dividing plate 3 is basically identical with above-mentioned " the embedded dividing plate of the fiberglass-based printed circuit of glass fibre/half 3 ".
Preferably, dividing plate 3 is Metal Substrate conductive coating circuit dividing plate 3, is i.e. coated with insulating barrier in metal surface, then absolutely
It is coated with the electrically-conducting paint of liquid/colloidal state/powder in edge layer and is drawn as required cabling circuit, then through air-drying or high temperature post cure, shape
Become firm conducting channel coating, carry out the most again insulating on whole circuit dividing plate 3, (connecting partition is inserted in the covering of wearing layer
Except the regional area of seat).Coating and technique used by this scheme all compare the most expensive.
Dividing plate 3 is identical material with metal shell or the skeleton of computer housing and is integrally formed, by mould by material
It is made of one piece after hot melt or extruding.Dividing plate 3 and the metallic framework of computer housing or shell can also be that separation is independent, every
It is welded and fixed between plate 3 and cabinet metallic framework or outer casing inner wall.Because dividing plate 3 is connected with cabinet metal shell, for parallel patch
The tactile hardware being arranged on dividing plate 3 surface provides good heat conduction, support of dispelling the heat." master in above-mentioned " metal shell of cabinet " i.e. figure
Casing 1 ".
Having the technology mode that the dividing plate 3 of metal hidden circuit and mainframe box metal shell or skeleton be fixedly linked is: one
Body formula, i.e. dividing plate 3 and mainframe box metal shell or skeleton are identical material, one, with mould by material hot melt or extruding
The most integrally formed.Carry out processes on dividing plate 3 in mainframe box the most after shaping, make to be placed with design on/within dividing plate 3
Required ultra-thin circuit trace；Reflow Soldering, dividing plate 3 and cabinet metallic framework or shell are that separation independent, on/within dividing plate 3
Through first having processed the ultra-thin circuit trace of design, afterwards dividing plate 3 to be connected with cabinet metallic framework or outer casing inner wall
Connect fixing position, be first coated with and wipe solder, after combinations matches is good, places into and refluxing unit carries out reflow soldering.Out cool down
After, dividing plate 3 is just tightly fastened mutually with cabinet metallic framework or shell.
03) dividing plate socket
Dividing plate socket directly welds or pastes on the circuit touching the dividing plate 3 being connected to correspondence, the hardware interface type bag of dividing plate socket
Include SATA 2.0 data-interface, SATA 3.0 data-interface, SATA Express hard disk 203 interface, SAS hard disk 203 connect
Mouth, SATA 7+15pin data+power supply hard disk 203 interface, SATA 7+6pin data+power supply CD-ROM drive 204 interface, mainboard 4
Starting up contact pin POWER SW, mainboard 4 restart contact pin RESET SW, USB 3.0 19/20pin socket, USB
2.0 9pin sockets, the audio frequency contact pin HD AUDIO of mainboard 4, the PCI-E 16X slot of display card 7, the main confession of mainboard 4
Electricity 24pin slot, the auxiliary power supply 4/8pin slot of mainboard 4 and the auxiliary power supply 6/8pin slot of display card 7, or
The combination in any of above-mentioned hardware interface.Some hardware in mainframe box can be inserted directly in dividing plate socket use, and then needing of having is led to
Cross FFC line row to be connected with corresponding dividing plate socket by hardware, so, dividing plate socket is connected to match with many hardware, tool
There are different interface types and geomery.Dividing plate socket according to the interface type of different hardware by the hardware in mainframe box with right
The dividing plate circuit 32 phase docking answered.The advantage of FFC line row be ultra-thin flexible, precisely, can mistake larger current, it is adaptable to dividing plate socket
Short-range with between hardware dock.
" dividing plate socket " in above-mentioned literary composition is following " welding type/fixed dividing plate socket " and " movable mode clapboard socket "
It is referred to as.
According to the arrangement in cabinet and design requirement, dividing plate socket is divided into welding type and movable.Welding type, " dividing plate is inserted
Seat " bottom ordered arrangement stitch corresponding to this socket (pin), the corresponding installation site of dividing plate circuit 32 has pad,
In the weld locations of the dividing plate circuit 32 that the stitch (pin) of " dividing plate socket " bottom is directly fixedly welded on correspondence.Welding
Formula dividing plate socket is also referred to as fixed dividing plate socket 34.
Movable, the bottom ordered arrangement of " dividing plate socket " stitch corresponding to this socket (pin), and these stitch (draw
Foot) presented in exposed conducting metal shell fragment 104, the periphery at " dividing plate socket " bottom metal shell fragment 104 has some
Individual alignment pin 94.Movable mode clapboard socket 35 is generally used for same dividing plate 3 position can install the design of different hardware, is not i.e. increasing
In the case of adding cabinet volume, hardware quantity and the type of extension in increasing cabinet, can be supported.
The region being used for installing " movable mode clapboard socket 35 " on dividing plate circuit 32 is concave shaped structure 33, in recessed area
Ordered arrangement exposed conduction, smooth circuitry contacts, and described " circuitry contacts " is " concave shaped contact point 33 " in figure.
The dividing plate 3 of neighboring, recessed area has several position hole 36, and these location the sizes in hole 36, quantity, pitch-row with
Coupling " movable mode clapboard socket 35 " bottom alignment pin 94 completely the same.
When the bottom of movable mode clapboard socket 35 is to installation region on dividing plate circuit 32, only when this interface type
Movable mode clapboard socket 35 and circuitry contacts arrangement specification, circuit definitions, the socket in recessed area on dividing plate circuit 32
When direction matches completely, the alignment pin 94 bottom movable mode clapboard socket 35 just can be inserted into this dividing plate circuit 32 recessed area
In the hole, location 36 on limit, finally by screw/expansion bayonet lock, movable mode clapboard socket 35 is fixed on dividing plate 3, now " movable
Formula dividing plate socket 35 " bottom conducting metal shell fragment 104 complete, smart with the circuitry contacts in recessed area on dividing plate circuit 32
Accurate patch the most one by one touches connection.Owing to the movable mode clapboard socket 35 installation position on dividing plate circuit 32 is one piece of concave shaped region,
Recessed area has exposed circuitry contacts, the exposed circuit when same position is mounted with other hardware, in recessed area
The apparent height of contact point is less than the height on perimeter walls 3 surface, so short circuit will not be produced because touching other hardware.
When not using this recessed area, this recessed area is filled and led up by available supporting insulating pad, plays isolated insulation and dust-proof
Effect.
In brief, the bottom ordered arrangement of dividing plate socket the pin that this socket is corresponding, and dividing plate circuit 32 is pacified accordingly
Pad, the pin bottom described dividing plate socket is had directly to be fixedly welded on dividing plate circuit 32 position of correspondence on holding position；
Or the bottom ordered arrangement of dividing plate socket the pin that this socket is corresponding, and these pins are with exposed conducting metal shell fragment
Presented in 104, the periphery of the described shell fragment 104 bottom dividing plate socket is provided with alignment pin 94, is used for installing on dividing plate 3
The region of described dividing plate socket is concave shaped structure, and in recessed area, ordered arrangement exposed conduction, smooth circuitry contacts,
The dividing plate 3 of neighboring, recessed area is provided with hole 36, corresponding location, dividing plate socket by screw/expansion bayonet lock be fixed on every
On plate 3, the conducting metal shell fragment 104 bottom dividing plate socket the most precisely pastes with the circuitry contacts in recessed area on dividing plate 3
Touch conducting.
Use during some hardware can be inserted directly into " dividing plate socket " in mainframe box, such as 3.5 cun, 2.5 cun of hard disks 202, because of it
For relatively often substituting the hardware used, so can the design that uses of straight cutting, very quick hommization.Those cannot be inserted directly into " every
Plate socket " the middle hardware used, then the theory using line of shortest length journey to connect, arrange these hardware and the " dividing plate mated with flexible cord
Socket " dock mutually, the cabling being also greatly reduced between hardware, succinct in making complete machine, attractive in appearance.
04) mainboard 4 towards
From the above mentioned, mainboard 4 is to lean against dividing plate 3 front, on the parallel mainboard support column 31 being fixed on dividing plate 3 front.Because it is main
Cabinet is upright type of design, and on the one hand the center of gravity in view of complete machine to move down as far as possible, and mainboard 4 is obvious near one end of CPU position
Lay particular stress on, place the overall decentralization that can make mainframe box down, make mainframe box more steady vertical when；The opposing party
Face, mainframe box is vertical, and its interior air hot-fluid is constantly upwards ascension, converges in upper strata, space in mainframe box, relatively
In upper strata air-flow, the temperature of mainframe box inferior airflow is on the low side, so placing down near the mainboard 4 the North limit of CPU, more added with
It is beneficial to cpu heat 6 radiating effect in the gas flow.
Therefore, will be close to the mainboard 4 the North limit of CPU position down (can be vertical, it is possible to downwardly direction with vertical between angle
≤ 5 °), the western end edge of mainboard 4 (i.e. one end of mainboard I/O interface group 41) is towards the afterbody 13 of cabinet, and mainboard 4 back side is to dividing plate 3
Front, is parallel to dividing plate 3 and is fixed on mainboard support column 31.Due to the arm of angle position between the North limit and western end edge of mainboard 4,
There is a mainboard auxiliary power supply slot 46, the principle connected with cabling nearby, project on dividing plate 3 front on mainboard 4 the North limit
Region, near this mainboard auxiliary power supply slot 46 dividing plate 3 front position on have a dividing plate socket.The bottom of this dividing plate socket
Stitch (pin) is connected, by wire one respectively in order with the output+12V DC in dividing plate circuit 32 and direct current negative pole (ground connection)
Head inserts with the mainboard auxiliary power supply slot 46 on mainboard 4 and connects, and the other end of wire inserts the connection of this dividing plate socket, makes dividing plate
Power supply circuits corresponding on 3 are connected with the mainboard auxiliary power supply slot 46 on mainboard 4.
That is, mainboard 4 is to lean against dividing plate 3 front, near CPU position mainboard 4 the North limit down, the mainboard 4 i.e. mainboard of western end edge
One end of I/O interface group 41 towards the afterbody of cabinet,
The region on dividing plate 3 front is projected to, near the position, dividing plate 3 front of the auxiliary power supply slot of mainboard 4 on mainboard 4 the North limit
Having put a dividing plate socket, the bottom stitch of described dividing plate socket is connected with dividing plate circuit 32, by one, wire and mainboard 4
Mainboard auxiliary power supply slot 46 insert connection, the other end of wire inserts the connection of this dividing plate socket, makes on dividing plate 3 corresponding confession
Electricity circuit is connected with the mainboard auxiliary power supply slot 46 on mainboard 4.
05) radiator of CPU and the fixing device for installing of cpu heat
The radiator of this computer CPU includes CPU attached heat sinks 64 and cpu heat 6, and cpu heat 6 is by a H type bridge pressure
Fastener support is fixed, that is the fixing device for installing of this cpu heat, and H type bridge clinching tool support includes two sliding bars 52, and two
Bar sliding bar 52 centre portion is in the state being parallel to each other, and two sliding bar 52 both ends all bend, outward in 45 ° of angles,
Article two, the section of the bending at sliding bar 52 both ends is respectively arranged with one can on this section the support column 51 of movement, support column 51 end
End has an expansion clamp, and this expansion clamp size, shape are to match with cpu heat 6 installing hole on mainboard 4.That
, the two ends of two sliding bar 52 bendings have 4 moveable support columns 51, due to the mainboard 4 of different model, and its 4 CPU
Pitch-row between radiator 6 installing hole is the most different, so the support column 51 at sliding bar 52 two ends is designed to movably, and just can be full
Pitch-row demand between various different cpu heat 6 installing holes of foot, the installation that matches is fixing.H type bridge clinching tool support is exactly
Aforementioned fastener 5.Support column 51 also referred to as fastener support column.
Being provided with one on the section that two sliding bar 52 mesophases are parallel can be on the bar direction of principal axis of two sliding bars 52
The bridge depression bar 53 moved freely, described bridge depression bar 53 centre portion is inner groovy structure, and wherein said two sliding bars 52 are back
Elastic material part or bridge depression bar 53 are resilience material member.Due to the sliding bar 52 in this fastener 5, bridge depression bar 53 even heat conduction
The bulge-structure of base back surface is rebound characteristics material, will not cause heat conduction because stress during artificial fastening is excessive or unbalanced
Base is excessive with the change of the heat conductivity of cpu chip 42 interfacial contact, is not easy to make mainboard 4 bending.Described two cunnings
Lever 52 constitutes described " H " type structure together with combining with bridge depression bar 53, so the fastener 5 of CPU is referred to as " H type bridge clinching tool
Frame ".
One of CPU attached heat sinks 64 is flat straight vacuum thermal pipe evaporation ends, and other end is to be welded with (CPU) heat radiation
The vacuum thermal pipe condensation end of fin 63, the section between these two ends of CPU attached heat sinks 64 is processed into corrugated tube shape, significantly carries
Having risen the bendability of (CPU) vacuum thermal pipe 62, user installation gets up to be more prone to operation and adapts to different types of mainboard 4.
The bottom of the condensation end of CPU attached heat sinks 64 is smooth, is touched and is fixed on, by screw or buckle patch, the machine that distance CPU is nearest
On case metal shell inwall, thus the partial heat of CPU heat-conducting base 61 is delivered on cabinet metal shell dissipate additional with CPU
Dispel the heat on the radiating fin of hot device 64 condensation end.
Cpu heat 6 is vacuum thermal pipe formula radiator, and there is a heat-conducting base bottom of cpu heat 6, is arranged on CPU
On chip 42.On the heat-conducting base edge of cpu heat 6, one is had to move towards with the vacuum thermal pipe of arrangement on heat-conducting base
Perpendicular groove, and the shape size of this groove just evaporation ends with CPU attached heat sinks 64 matches, CPU is additional to be dissipated
After the evaporation ends of hot device 64 coordinates in the groove snapping in heat-conducting base edge, with cover plate and fastened by screw at heat-conducting base edge
On.The front of heat-conducting base is that direct parallel patch is touched on cpu chip 42 surface.And the approximate centre at the back side of heat-conducting base
Position has a bulge-structure, the indent sliding-rail groove of bridge depression bar 53 centre portion can just clasp this bulge-structure, and bridge depression bar 53 is put
It is placed on the heat-conducting base back side.Due to the bulge-structure by center, the heat-conducting base back side of the bridge depression bar 53 in fastener 5,
The downforce produced when being fastened by fastener 5 concentrates the central area acting on heat-conducting base, so makes heat-conducting base and cpu chip
The stress of 42 contact surfaces is very uniform, makes the heat conductivity between them stable.
Heat-conducting base is to clasp the bulge-structure at its back side by bridge depression bar 53 to be close on cpu chip 42, and bridge
Depression bar 53 is to be movably fixed on two sliding bars 52, and two sliding bars 52 are by the dop on movable support column 51 respectively
Snap on mainboard 4 in 4 cpu heat 6 installing holes, finally expansion anchor 54 is inserted in the pin-and-hole in supporting, thus will
Whole fastener 5 support is fastened on mainboard 4 together with cpu heat 6.Owing to heat-conducting base back side bulge-structure can be in bridge pressure
Moving in bar 53 indent sliding-rail groove, bridge depression bar 53 can move again on sliding bar 52, so whole cpu heat 6 can be at mainboard 4
The translation of little scope on any direction in plane, greatly reduces because of cpu heat 6 edge and unit accessory position on mainboard 4
Put conflict mutually and can not the probability of normal mounting.
CPU attached heat sinks 64 uses movably arranged mode, and whether user can install by unrestricted choice according to demand,
Without changing whole cpu heat 6, it is greatly saved the financial expenditure of user.Although mainframe box volume is little, but cleverly
Make use of the metal shell of cabinet, be quickly delivered to dispel the heat on shell by part CPU heat, considerably increase heat radiation has
Effect area.
Owing to fastener 5 support many places use movable Fixed Design, the most compatible all conventional mainboard 4 models, fastener 5 is joined
Part is few, lightweight, and disassembling operations is the most convenient, within free-hand 10 seconds, just can complete dismounting.
Further, the bottom 12 of this ultra-thin PC mainframe box shell has the air intake opening of an elongated strip shaped, had both added cabinet
Air-flow exchange around base plate；Again because this long opening, hinder greatly at the bottom of the cabinet in the positive space of planes of dividing plate 3
Heat on plate region be delivered to the chassis backplane region of dividing plate 3 backside space and dividing plate 3 from be arranged on so that patch is touched
The heat that the CPU attached heat sinks 64 on chassis backplane in the positive space of planes of dividing plate 3 passes over can be more quickly by gas
Stream is taken away, and is not transferred to again other positions of cabinet and affects the heat radiation of other hardware.
06) inwall extension socket 205
Described computer housing is vertical, and mainboard 4 is placed downwards on i.e. mainboard 4 the North limit near one end of CPU, limit, mainboard 4 south to
On, the casing inwall near limit, mainboard 4 south is the top inner wall of cabinet, is vertically above mainboard 4 front on this inwall
In the strip region of 15～45mm, activity is mounted with the socket of a strip, constitutes cabinet inwall extension socket 205, described
Three kinds of interfaces, DC+5V, the power supply interface of direct current negative pole, 7+6pin SATA CD-ROM drive 204 is included on inwall extension socket 205
Interface and 7+15pin SATA hard disc interface.
Described inwall extension socket 205 uses strip PCB to concentrate cabling, and strip PCB is closely pasted
Closing cabinet inwall, circuit board section extends to the circuit on the edge in dividing plate 3 front, and strip PCB extension
The circuit corresponding with on dividing plate 3 docks mutually one by one, fixing by welding connection.Pin bottom above-mentioned interface socket is by welding
Fixing or patch is touched on the circuit being movably fixed in strip PCB correspondence, its jack interface towards with 3 phases of dividing plate
Parallel.
In view of this computer hardware of CD-ROM drive 204, major part user uses frequency the lowest, thus hommization by " inwall
Extension socket 205 " it is designed to movable mounted, user can choose whether to install according to the use demand of oneself.
But notebook CD-ROM drive 204 or 2.5 cun of hard disks 202 insert when being arranged in inwall extension socket 205, notebook CD-ROM drive
204 or 2.5 cun of hard disks 202 are parallel to mainboard 4, and are positioned at empty position on the near zone of limit, mainboard 4 south.In view of practicality,
Notebook CD-ROM drive 204 enter dish mouth towards before mainframe box.The most efficiently make use of the sky in overhead near limit, mainboard 4 south
Free space, owing to notebook CD-ROM drive 204 and 2.5 cun of hard disks 2,020 points are light little, caloric value is the lowest, so the weight to whole cabinet
The impact of the heart and heat radiation almost can be ignored.Additionally, due to mainboard 4 has a lot of contact pin, slot and cabling, impact U.S. on limit, the south
See, be just installed in parallel in 204,2.5 cun of hard disks 202 of notebook CD-ROM drive in this overhead, position of mainboard 4, can block dexterously
Live, make the arrangement of cabinet entirety more attractive in appearance.
07) mainboard I/O baffle plate dividing plate draw-in groove 16
In the western end edge of mainboard 4, mainboard 4 edge section at I/O interface group place projects to the position on dividing plate 3 and is provided with mainboard I/O
Baffle plate dividing plate draw-in groove 16, described draw-in groove be have one stitch wide about 1mm, stitch deep 2～3mm straight groove/slit, slot/open
The overall dimensions in hole >=mainboard I/O baffle plate 208(mainboard 4 backboard) overall dimensions, before mainboard 4 is loaded mainframe box,
First by mainboard I/O baffle plate 208(mainboard 4 backboard) a long limit snap onto in this dividing plate 3 grooves/slit, then by whole mainboard
I/O baffle plate 208(mainboard 4 backboard) snap in mainboard I/O baffle plate 208(mainboard 4 backboard to cabinet afterbody) opening of matching
Hole is fixed.Owing to this mainframe box uses limit ultrathin design concept, in order to by mainboard 4 in the chassis needed for the height that takies
Degree space be preferably minimized, therefore by mainboard I/O baffle plate 208(mainboard 4 backboard) near mainboard 4 back side snap onto dividing plate 3
Fluting in, and mounting means with tradition cabinet as simple and direct.
Display card 7 that the hardware installed in the space at dividing plate 3 back side includes comprising radiator, power pack 9, turbofan
201, hard disk 203, Power entry module 10 and be all parallel patch touch be arranged on dividing plate 3, due to parallel patch touch be arranged on dividing plate 3 back side
Multiple hardwares to heat radiation have certain demand, so dividing plate 3 back side is except pacifying with power pack 9, dividing plate socket, Power entry module 10
Pretending outside concave shaped dividing plate circuit 32 contact point of coupling, the surface in other regions, dividing plate 3 back side is with smooth, the gold of heat conduction
Belong to flat board to present.Concrete structure is as follows:
08) display card 7
Display card 7 parallels setting with dividing plate 3 back side.This ultra-thin computer housing can be installed all overall heights of support, half height, surpass
Display card 7 long, powerful.I/O interface on described display card 7 and the I/O interface on mainboard 4 are towards identical, independent
Staggering along portion with mainboard 4PCB edges of boards in I/O interface area position on video card 7, mainboard 4PCB edges of boards are along for being provided with I/O interface
Pcb board edge portion, i.e. the western end edge of mainboard 4 is along portion.Above-mentioned " the I/O interface on display card 7 " is " display card in figure
I/O interface group 71 ", above-mentioned " the I/O interface on mainboard 4 " is in figure " mainboard I/O interface group 41 ".
Display card 7 is installed in parallel in mainboard 4 back side and includes following 2 kinds of forms:
1. in dissipate formula: have the dividing plate 3 of one piece of parallel heat-conducting between display card 7 with mainboard 4, on display card 7 equipped with
The one side of radiator is relative with dividing plate 3 plate face, and the pcb board face of display card 7 is near the shell side panel of computer housing, i.e. schemes
The one side of slip lid 2 in 13.In described " pcb board of display card 7 " i.e. figure " display card pcb board 70 ".On display card 7
The end edge of the pcb board residing for I/O interface group 71 I/O interface towards direction on I/O interface group institute on mainboard 4 to be protruded from
The distance of the pcb board place end edge 15～40mm at place.Use between mainboard 4 with the pcb board card of display card 7 and parallel, closely
The mode disposed, greatly reduces the spatial volume taken.
Specifically, with the presence of one piece of metal plate between display card 7 and mainboard 4, i.e. the parallel peace of the one side of metal plate
Dress is mainboard 4, and mainboard 4 back side is to metal plate, and the parallel installation of another side of metal plate is display card 7, independent
Have on video card 7 faced by the one of GPU chip 72 to metal plate, and display card 7 is to be placed in parallel in mainboard 4 near border area, the south
The back side in territory.
From the above mentioned, display card 7I/O interface with mainboard 4I/O interface towards consistent, and they I/O interfaces towards
On direction, the pcb board edge 15 at mainboard the to be protruded from 4I/O interface place, pcb board edge at display card 7I/O interface place～
The distance of 40mm, will I/O interface area part translation on display card 7 to outside the western end edge of mainboard 4.And above-mentioned protrude from
Dividing plate 3 is not had between display card 7I/O interface area part outside the western end edge of mainboard 4 and mainboard 4.Owing to middle and high end is only
The I/O interface of vertical video card 7 is double-deck mostly, it is contemplated that should completely compatible all video cards, the space body taken again
Amass and be down to minimum, therefore cleverly by outside the I/O interface area part translation on display card 7 to the western end edge of mainboard 4.Plus solely
The vertical obstruct not having dividing plate 3 between video card 7I/O interface area part and mainboard 4, so no matter the I/O interface of display card 7 is single
Layer or double-deck, do not affect its installing and using in cabinet, reach compatibility good as tradition cabinet.Solely
Vertical video card 7 is connected by the card slot 43 that adapter or prolongation winding displacement are corresponding with on mainboard 4.
2. the outer formula that dissipates: the one side (back side) of radiator can not be installed on display card pcb board 70 towards mainboard 4 back side, main
Not necessarily having dividing plate 3 to exist between plate 4 and display card 7, the pcb board edge at display card 7I/O interface place is also not necessarily intended to convex
Pcb board edge for mainboard 4I/O interface place.Display card 7 is corresponding with on mainboard 4 by adapter or prolongation winding displacement
Card slot is connected.Use the mode paralleled, closely dispose between mainboard 4 with display card 7, greatly reduce and take
Spatial volume.The advantage of this mode maximum is to reequip radiator and the fan 201 of display card 7, uses independent aobvious
Block radiator and the fan 201 of 7 first wifves, and this mode compatibility is fine.The chassis space ratio that shortcoming takies needed for being is " interior
Dissipate formula " bigger.
09) formula display card radiator 8 is dissipated in
The radiator installed on display card 7 is provided with vacuum heat conduction pipe 82 and heat-conducting base 81, and vacuum heat conduction pipe has evaporation ends
With condensation end, the evaporation ends of all vacuum thermal pipes on described radiator is directly or indirectly and the GPU chip 72 of display card 7
Being affixed tactile, the condensation end of the part or all of vacuum thermal pipe patch direct or indirect with dividing plate 3 or cabinet metal shell inwall is touched.
In described " cabinet metal shell " i.e. figure " mainframe box shell 1 ".
Described display card radiator 8 generally flat radiator, takies volume the least.It includes parallel interval
The aluminum matter of arrangement or 83,2～8 described vacuum thermal pipes of copper radiating fin and 1～2 described heat-conducting base.Aluminum matter or copper
The main part of matter radiating fin composition flat radiator, flat radiator is installed in parallel on display card 7 or dividing plate 3
On the back side, heat-conducting base is located at the front of radiator, flat described vacuum thermal conductance of arranging in the surface at the back side of radiator
The condensation end of pipe, the evaporation ends of described vacuum thermal pipe fits tightly mutually with copper or aluminum matter heat-conducting base.Vacuum thermal pipe
Condensation end to be squeezed into cross section by mould be semiarc shape or flat, be fitted tightly on fin, the described radiator back side
Upper half arc/flat the most parallel patch of vacuum thermal pipe condensation end is touched and is carried out heat conduction on dividing plate 3 back side.
Or described flat radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends
And condensation end, the evaporation ends of all vacuum thermal pipes fits tightly the most in an orderly manner or is embedded on described heat-conducting base, Vacuum Heat
It is " D " shape that the condensation end of conduit is squeezed into cross section by mould, is i.e. formed flat at described vacuum thermal pipe condensation end
Simultaneously, and this flat one side is paralleled with the back side of described radiator, and the vacuum thermal pipe condensation end institute of described " D " shape
The part of the non-flat one side formed combines with the radiating fin of described radiator and is fixed on the back side of described radiator.Work as institute
State the parallel installation in the back side of flat radiator or time patch touches in separator face, the vacuum thermal pipe condensation end of described " D " shape
Form flat one side parallel patch to be touched in separator face, carry out heat conduction.
Due to this radiator by the condensation section of vacuum thermal pipe cleverly with dividing plate 3 or cabinet metal shell inwall phase
Closely patch is touched, and display card radiator fan 201 is not mounted within radiator, the most additionally takies the volume of radiator, so
Considerably increase the actual area of dissipation of display card 7.Further, its heat radiation utilize dividing plate 3 and cabinet metal shell inherently
Exist, be also greatly saved the quality of material cost and graphic card radiator.
Radiator is integrally fixed at the display card 7 installation site region at described dividing plate 3 back side, and described radiator is provided with one
Or more than one heat-conducting base, the evaporation ends of described heat-conducting base and vacuum thermal pipe closely cooperates installation mutually, vacuum thermal conductance
The condensation end of pipe is processed into flat, is fitted in closely on dividing plate 3 back side or on the inwall of cabinet metal shell, the most equal
The radiating fin of between-line spacing arrangement is fitted on dividing plate 3 back side or the cabinet metal shell inwall of flat vacuum thermal pipe.
Particularly as follows: because display card 7 has the one side of GPU chip 72 parallel to dividing plate 3, display card 7 is towards dividing plate 3
One side and dividing plate 3 between there is a segment distance space, display card radiator 8 is installed in this space.Heat radiation in radiator
Fin is parallel spaced-apart every arrangement, and inclines in certain between the strip radiating fin that is perpendicular on dividing plate 3 and geographical vertical direction
Tiltedly angle.The heat-conducting base of radiator the most closely pastes tactile with GPU chip 72 surface of display card 7, " steaming in vacuum thermal pipe
Send out section " closely it is embedded in heat-conducting base；" the condensation section " of vacuum thermal pipe another part is distributed in dividing plate 3 back side and dissipates
Between hot fin, and fit tightly mutually with dividing plate 3, radiating fin.Or be distributed on video card cabinet metal shell inwall nearby, with
Outer casing inner wall fits tightly mutually.
I.e. heat in display card 7GPU chip 72, is conducted to vacuum thermal pipe by the heat-conducting base being close to its surface
" evaporating region " absorbs heat, then is transferred to rapidly " condensation section " by " evaporating region ", by mutually tight with " condensation section "
Radiating fin, dividing plate 3 or cabinet metal shell that patch is touched are large-area and air carries out heat exchange, reach cooling purpose.
10) fixed form between formula display card radiator 8 and display card 7 is dissipated in
Due to " interior scattered formula display card radiator 8 ", hereinafter referred to as " graphic card radiator "." video card " in following is in figure
" display card 7 ", " cabinet cover plate/cover plate " hereinafter is in figure " slip lid 2 ", and " pcb board of display card 7 " is in figure
" display card pcb board 70 ".Design according to mainframe box and user's request, be divided into 2 kinds of forms:
Movable: graphic card radiator is first correctly installed with display card pcb board 70 after fixing, then is inserted by the golden finger socket of video card
Being relatively fixed in entering the card slot of cabinet backside space, now graphic card radiator is parallel with dividing plate 3 back side touches.Exist again
The insulation bullet of coupling is pasted/installed in the center at the GPU chip 72 upright projection so far video card pcb board back side of display card 7
Property silicagel pad 206, after cabinet cover plate advances casing by the chute in cabinet, due between the pcb board of cover plate and display card 7
The size being smaller than flexible silicon rubber cushion 206, flexible silicon rubber cushion 206 be squeezed after produce resilient pressure act perpendicularly to solely
Vertical video card pcb board 70 back side.Again owing to being fixing between graphic card radiator and display card pcb board 70, so what this produced
Pressure finally makes graphic card radiator be close on dividing plate 3 surface.Reach a part of heat in graphic card radiator efficiently conduct to
Dispel the heat on dividing plate 3.
Fixed: graphic card radiator is the most parallel to be mounted on cabinet backside space corresponding dividing plate 3 position, now dissipates
" the condensation section " of the vacuum thermal pipe 82 in hot device fits tightly mutually with dividing plate 3 surface or cabinet metal shell inwall.Exist again
The exhausted of coupling is pasted/installed in the center at the vacant display card 7GPU chip 72 upright projection so far video card pcb board back side
Edge flexible silicon rubber cushion 206.
Vacant display card 7 is had faced by the one of GPU chip 72 to graphic card radiator, by the golden hands on display card 7
Finger mouth is correctly inserted in the card slot of coupling and is relatively fixed, now the GPU chip 72 of display card 7 and graphic card radiator
Heat-conducting base 81 phase is pressed close to.After only cabinet cover plate need to being advanced casing by the chute in cabinet, due to cover plate and display card 7
Pcb board between the size being smaller than flexible silicon rubber cushion 206, flexible silicon rubber cushion 206 be squeezed after produce resilient pressure hang down
Directly act on display card pcb board 70 back side.Center, GPU chip 72 back side on display card 7 is subject to vertical to dividing plate 3 side
To actuating pressure after, GPU chip 72 surface is paralleled with graphic card radiator heat-conducting base 81 front, is fitted tightly.
Display card 7 reached on the ease installed with fixed graphic card radiator historical fast, almost
Within one second, install.Owing to GPU chip 72 is its center back position stress, GPU chip 72 surface can be fitted in video card smoothly
On heat-conducting base 81 surface of radiator, GPU chip 72 is made to reach nature with the active force of 81 between heat-conducting base Jun Heng, Yong Huzai
Without worrying as affecting its heat-conducting effect because of 4 screw discontinuity equalizations when installing traditional heat sinks.
11) power pack 9 of the present invention
Power pack 9 is ultra-thin patch touch power pack 9, and it is provided with bottom surface 91, end face and side, be additionally provided with power supply input port and
The output port 92 of power supply, the output port 92 of described power pack 9 is provided with on the dividing plate 3 directly and in computer housing corresponding
The transmission structure being conducted after circuit pressurized, the output port 92 of described power pack 9 is corresponding with on the dividing plate 3 in computer housing
Circuit between there is not third-party plug, socket is attached.
The one side that power pack 9 touches with the parallel patch in dividing plate 3 surface is set to the bottom surface of power pack 9, and the bottom surface of power pack 9 has two
The contact copper sheet 93 of group protruding 0.5～3mm, the independent contact copper sheet 93 that on first group, ordered arrangement, its outside front
It is all very flat smooth, exposed conduction, and parallels with power pack 9 bottom surface in each contact copper sheet 93 front, contact
The back side of copper sheet 93 is all integrally fixed on one layer of dielectric resilience rubber, and dielectric resilience rubber is fixed on again in power pack 9, and each
Contact copper sheet 93 back side is only connected with the positive pole DC 12V output circuit in power pack 9.The positive area of each contact copper sheet 93
At 0.2～1 c；Second group of copper sheet is contact flat spring 104, is connected with VC 220V circuit in power pack 9.And these two groups connect
Touching copper sheet 93 with power pack 9 bottom surface is mutually insulated.Match on described dividing plate 3 back side and in power supply resettlement area
Indent pressure contact, copper sheet 93 groups phase that what exposed contact circuit and power supply bottom surface in indent pressure contact were protruding contact one a pair
Should, there are several to position hole 36 in power supply resettlement area, described power pack 9 bottom surface is except the alignment pin 94 of projection 0.5～3mm
Outside conductive contact copper sheet 93, whole face is all flat smooth, and the negative pole DC 12V in power pack 9 bottom surface and power pack 9
Output circuit connects with Earth Phase, described power pack 9 by fastening screw make the parallel patch of power pack 9 touch be fixed on dividing plate 3.
The existence form of the another kind of electrical transfer port of described power pack: the power input port of described power pack and electricity
Source output terminal mouth merges into an integrated port on the bottom surface of described power pack, and being provided with in described integrated port can directly and institute
The circuit stating exposed conduction corresponding on dividing plate is mated the contact copper sheet group turned on, described contact copper after touch mutually one by one by overlaying
Each contact copper sheet in sheet group can have different circuit definitions and circuit corresponding with in power pack respectively is connected.Described electricity
The parallel patch in bottom surface of source capsule touches the circuit region being installed in described separator face correspondence.
Be below power pack 9 bottom surface output port 92 be the scheme presented in metal clips 104.
Power pack 9 is that parallel patch is tactile to be arranged on cabinet internal partition 3.The one side of power pack 9 area maximum is its bottom surface,
It is conducting metal material, and direct patch of paralleling with dividing plate 3 surface is touched.There is one " output port 92 " power pack 9 bottom surface." output
Port 92 " in row smooth, orderly arrange the metal clips 104 of some exposed conductions, these metal clips 104 and power packs 9
The bottom surface of metal material is mutually insulated, and the surface of apparent height power pack to be protruded from 9 bottom surface of metal clips 104
0.5～3mm.
Metal clips 104 in " output port 92 " be divided into area relatively big and area is less two groups.One is had on power pack 9
" input port ", by inserting line trap, by the DC supply input power pack 9 of the municipal alternating current outside cabinet or coupling.
A portion municipal administration alternating current is converted into stable direct current by power pack 9 and exports, wherein direct-flow positive pole and " output port 92 "
One group of metal clips 104 that inner area is bigger is connected, and direct current negative pole/ground connection is connected with the conducting metal bottom surface of power pack 9；
Another part municipal administration alternating current is connected on one group of metal clips 104 that area in " output port 92 " is less.
There are several alignment pins 94 protruded in power pack 9 bottom surface, and install on dividing plate 3 and have one on the region of power pack 9
The dividing plate circuit 32 of individual concave shaped and several position hole 36, the dividing plate circuit 32 of concave shaped has exposed conduction, smooth
Circuitry contacts.And described concave shaped dividing plate circuit 32 contact point and hole, location 36 and power pack 9 bottom surface on dividing plate 3
Metal clips in " output port 92 " 104 groups and the alignment pin 94 of protrusion, on dimensions, arrangement position, circuit definitions
Mate the most completely.By power pack 9 bottom surface to it on the installation region of dividing plate 3, the alignment pin 94 by power pack 9 bottom surface is complete
Hole, location 36 on complete and dividing plate 3 matches, insert after, with screw/expansion bayonet lock, power pack 9 is fastened on dividing plate 3.Now
Each dividing plate electricity organizing conducting metal shell fragment 104 concave shaped corresponding with on dividing plate 3 in " output port 92 " bottom power pack 9
The most precisely coupling, one by one pressure touch connection to road 32 contact point mutually.Owing to power pack 9 is by the dividing plate electricity of concave shaped on dividing plate 3
Road 32 contact point is connected, when not installing power pack 9, after filling and leading up this recessed area with the insulating trip of coupling, and can be at this
Other hardware installed by locational space.The multiple-effect collocation realizing same position space in cabinet utilizes.Simultaneously as in power pack 9
Extremely compact structure, adds that employing is directly affixed touches transmission power supply with dividing plate circuit 32, without wire, power supply is greatly reduced
The spatial volume that box 9 is shared in cabinet.
Circuit definitions: different to the power demands of mainframe box in view of different user, devises power pack 9 at two in cabinet
Installation site, two power packs 9 can be installed simultaneously, used in parallel.Also two corresponding concave shaped dividing plate electricity are had on dividing plate 3
Road 32 contact point.Wherein with line trap, municipal administration alternating current is connected to " input port " of first power pack 9, by its bottom surface
One group of metal clips 104 that " output port 92 " inner area is less transmits to dividing plate 3 second indent by dividing plate circuit 32
On the contact point of shape dividing plate circuit 32 correspondence, and second power supply box 9 is to be properly attached to second concave shaped dividing plate circuit 32
On contact point.I.e. municipal administration alternating current is input to second power supply by the contact point of second concave shaped dividing plate circuit 32 correspondence
Box 9 is converted into required stable direct current.Direct-flow positive pole after conversion and " output port 92 " inner area in second power supply box 9
One group of bigger metal clips 104 is connected, through contact point and the dividing plate circuit of second concave shaped dividing plate circuit 32 correspondence
Direct-flow positive pole is transferred to " Power entry module 10 " by 32.
Direct current negative pole after power pack 9 internal conversion is to turn on to the conducting metal bottom surface of power pack 9.By upper known, electricity
The bottom surface of source capsule 9 is that parallel patch is tactile to be arranged on dividing plate 3, and the dividing plate 3 in cabinet is as complete machine direct current negative pole/ground connection carrying
Leading body.Therefore fit tightly between the metal bottom surface of power pack 9 and dividing plate 3 plate face, conduct electricity.Direct current negative pole on dividing plate 3 leads to
Cross in the direct current cathode traces being transmitted back in power pack 9 that the conducting metal bottom surface of power pack 9 can realize large area, big electric current.
Why it is designed to export directly against touching in the dividing plate circuit 32 being delivered on dividing plate 3 correspondence the direct current of power pack 9, is because
Its patch contacting surface is long-pending greatly, laminating is tight, can realize stablizing of big electric current and pass through.And, power pack 9 is by golden with dividing plate 3 or cabinet
Belong to the large area of outer casing inner wall, closely patch to touch, not only the direct current negative pole/ground connection in power pack 9 is communicated to dividing plate 3 smoothly
On, the most ingenious, to solve power pack 9 heat radiation efficiently problem.
Power pack 9 global shape is flat hexahedron, the maximum gauge≤31mm of power pack 9, wherein long≤150mm,
Width≤110mm；Or length≤260mm, wide≤120mm, the input port of the power supply of described power pack 9 for input DC 12 V or
VC 220 V, the output port 92 of power pack 9 is output DC 12 V or VC 220 V.
Power pack 9 overall profile is flat cube, and concrete size, profile are depending on design requirement and watt level.
The radiating mode of power pack 9: this ultra-thin power pack 9 is compact due to internal structure, and thermal source is relatively concentrated.Outside power pack 9
Shell large area uses aluminum alloy material, by by the heater element in power pack 9 directly against contacting on aluminum alloy casing, or with very
Empty heat pipe is connected on aluminum alloy casing, is quickly transferred to by major part heat on power pack 9 metal shell.Because power pack
9 is that close parallel patch is touched on dividing plate 3 or part patch is touched on the inwall of cabinet metal shell, by dividing plate 3 or cabinet gold
Belong to shell, add the ventilation in upper case and realize large area high efficiency and heat radiation.
12) Power entry module 10
Power entry module 10 patch is touched the side on dividing plate 3 back side and is set to bottom surface 102, and described bottom surface is provided with " direct current input port
102 " and " direct current delivery outlet 103 ", the most in good order in " direct current input port 102 " and " direct current delivery outlet 103 " some are arranged
Protrude from the contact copper sheet 93 that described bottom surface 0.5～3mm is high.These fronts contacting copper sheets 93 outside are all smooth, naked
Dew conduction, these back sides contacting copper sheets 93 inside are fixed on the elastic material part insulated mutually with other circuit, described bullet
Property material member is fixed on again in Power entry module 10.
That removes " direct current input port 102 " and " direct current delivery outlet 103 " on Power entry module 10 bottom surface is externally provided with several projections
Alignment pin 94, on dividing plate 3 install Power entry module 10 region in have respectively and " the direct current input port of Power entry module 10 bottom surface
102 ", " direct current delivery outlet 103 " the most correctly mates on dimensions, locality, circuit definitions mutually with alignment pin 94
Concave shaped circuitry contacts and hole 36, location.Concave shaped circuitry contacts surface is exposed conduction, but with dividing plate 3 between be mutually exhausted
Edge, the most corresponding dividing plate circuit 32 of concave shaped circuitry contacts is connected.
Also incorporating temperature control module in described Power entry module 10, Power entry module 10 provides power supply and installation position for temperature control module
Between being empty and/or circuit trace structure.
Structural circuit defines: the contact copper sheet 93 in " the direct current input port 102 " of Power entry module 10 bottom surface and Power entry module
Direct-flow input circuit in 10 is connected；Contact copper sheet 93 in " the direct current delivery outlet 103 " of Power entry module 10 bottom surface respectively with
The direct current output power supply of the different output voltage values in Power entry module 10 is connected.And the contact copper sheet 93 of different circuit definitions it
Between be separate and insulation, contact copper sheet 93 insulate mutually with Power entry module 10 bottom surface.
Contact copper sheet 93 in " the direct current input port 102 " of described Power entry module 10 bottom surface is by corresponding with on dividing plate 3
Concave shaped circuitry contacts matches after docking, and the direct current that power pack 9 exports in aforementioned barriers circuit 32 is imported to distribution
The direct current supply of the different magnitudes of voltage needed for reconvert becomes each hardware device in module 10, then the direct current by above-mentioned different magnitudes of voltage
The power supply each contact copper sheet 93 in " the direct current delivery outlet 103 " of Power entry module 10 bottom surface is by the indent corresponding with on dividing plate 3
Shape circuitry contacts matches after docking, and the direct current supply of above-mentioned different magnitudes of voltage is transmitted separately to the dividing plate circuit 32 of correspondence
In.
At the centre portion at described cabinet internal partition 3 back side, near the dividing plate 3 dorsal edge position of casing front panel
On be provided with on Power entry module 10, and described Power entry module 10 and incorporate matched with one or more of class interface
Or multiple socket, dividing plate socket: 6/8pin display card auxiliary power supply slot 73,24pin mainboard are main for electrical slot 45, turbine wind
Fan 201 power supply interfaces, 7+15pin SATA hard disc 203 interface, SATA Express hard disk 203 interface, SAS hard disk 203 connect
Mouth, USB 3.0 19/20pin socket, USB 2.0 9pin socket, 7+6pin SATA CD-ROM driver interface.
The bottom surface of Power entry module 10 is led for smooth metal in addition to " direct current input port 102 " and " direct current delivery outlet 103 "
Electricity material, the direct current output negative pole/grounded circuit in Power entry module 10 is connected with the metal bottom surface of Power entry module 10.Distribution mould
Block 10 is by screw or expands the parallel patch of bayonet lock and touches and be fastened on cabinet internal partition 3, and carries out large area between dividing plate 3 surface and connect
Touch conducting.Plus also incorporating socket or the dividing plate socket that one or more hardware match on above-mentioned Power entry module 10, pass through
Wire or hardware is carried interface be inserted directly in the socket/dividing plate socket matched on Power entry module 10 connection.Therefore this
Direct current negative pole/the ground connection of the hardware being connected with the socket/dividing plate socket integrated on Power entry module 10 a bit is by Power entry module 10
Metallic conduction bottom surface be conducted on dividing plate 3.From the above mentioned understand, dividing plate 3 again because being affixed tactile with power pack 9 conducting bottom side, institute
Be connected with power pack 9 bottom surface with final Power entry module 10 bottom surface, i.e. both direct current negative pole/grounded circuits are connected to lead to.
By above-mentioned known because Power entry module 10 be the unidirectional current of the single magnitude of voltage that power pack 9 is sent again
It is converted into the direct current supply of different magnitudes of voltage needed for each hardware, adds and on Power entry module 10, incorporate one or more and hardware
The socket that interface matches/dividing plate socket.Power entry module 10 is i.e. changed the direct current supply of each magnitude of voltage of output, a part point
Not with the socket of integration these described/corresponding connection of dividing plate socket, then by the form of wire or hardware straight cutting by correspondence
Electrical transfer is given in the hardware of coupling；The direct current supply of each magnitude of voltage of another part output, by Power entry module 10 bottom surface
Concave shaped dividing plate circuit 32 contact point that " direct current delivery outlet 103 " matches on dividing plate 3 is respectively turned on to corresponding dividing plate electricity
In road 32, with the dividing plate socket of the described corresponding connection of dividing plate circuit 32 the most respectively with the interface of the computer hardware of required power supply/
Slot docks mutually.
Pass owing to Power entry module 10 bottom surface employs the large area press-contacting type conduction identical with power pack 9 bottom surface structure principle
Defeated structure so that the stable transmission of big electric current can be carried out between Power entry module 10 and dividing plate circuit 32.And it is the most whole in Power entry module 10
Close multiple hardwares interface socket and/or temperature control module so that it is structure designs more high-efficiency compact, made the Power entry module after integration
10 have multi-functional integral type, it is simple to the dismounting of user and use.
13) intelligent temperature control system
Intelligent temperature control system it is provided with, including manually regulating switch 18, temperature control module, fan 201, temperature probe in computer host box
37, manually regulation switch 18 is placed on casing, it is simple to user operation uses, and temperature control module, fan 201 are positioned at cabinet
Desired position, temperature probe 37 is positioned towards the side of cpu heat 6 or graphic card radiator, and is in radiator air-flow
Leeward air channel in, temperature control module is connected with manually regulation switch 18, fan 201, temperature probe 37 simultaneously.The most manually adjust
The gear of joint switch 18 has limited temperature control module and has exported the highest numerical value to fan 201 voltage and minimum numerical value section；
Secondly temperature probe 37 belongs to a kind of critesistor, and the ambient temperature height residing for temperature probe 37 will change the electricity of himself
Resistance, the temperature control module being connected with temperature probe 37, according to the numerical value of temperature probe 37 feedback, accurate in voltage section
Export corresponding supply voltage to fan 201, thus reach to monitor ambient temperature in real time by temperature probe 37 and automatically change
The purpose of fan 201 rotating speed.
Mainboard support column 31 formula temperature probe 37, has established a capital display card 7 owing to desktop computer differs, and by contrast
The temperature of CPU more can objectively reflect the situation of change of complete machine temperature, it is therefore necessary to dispose one near cpu heat 6
Individual temperature probe 37.
Having individual mainboard installing hole 47 between PCI-E slot on mainboard 4 and memory bar slot 44, this installing hole exists accordingly
Be connected and installed with temperature probe 37 described on that mainboard support column 31 corresponding on dividing plate 3, this temperature probe 37 include with
Lower 2 kinds of forms:
The most fixed, temperature probe 37 entirety is column, and upper end is temperature probe 37 element, and size can be just passed through the master of correspondence
Plate installing hole 47；Lower end is the stitch of this temperature probe 37 element, is fixed by welding on the dividing plate circuit 32 of correspondence, and temperature
Degree probe 37 entirety are perpendicular on dividing plate 3 front, are positioned at the mainboard installation between PCI-E slot and memory bar slot 44 on mainboard 4
Hole 47 maps the position of correspondence on dividing plate 3 front mutually；
The most movable, mainboard installing hole 47 mapping pair between mainboard 4PCI-E slot and memory bar slot 44 should at dividing plate 3 just
On the position in face, there is the socket of a temperature probe 37.This temperature probe 37 socket is weldingly fixed on the dividing plate circuit 32 of correspondence,
And the height of its height not higher than other mainboard support columns 31, after mainboard 4 is properly attached on cabinet internal partition 3, there is a bar
The temperature probe 37 of shape, upper end is temperature probe 37 element, and lower end is for connecting plug.The lower end of this shaft-like temperature probe 37 is worn
Crossing the mainboard installing hole 47 between PCI-E slot and memory bar slot 44 on mainboard 4, the temperature probe 37 being inserted on dividing plate 3 is inserted
In Zuo, the circuit that now temperature probe 37 is corresponding with on dividing plate 3 the most correctly connects, and temperature probe 37 element of its upper end is in master
On plate 4 front, for reading the gas flow temperature of this position.
Computer housing uses above-mentioned intelligent temperature control system, can have fabulous user operation, very hommization, again need not
Considering whether fan 201 has PWM function, without opening under entrance mainboard 4BISS, arranging, and it is permissible with noise to dispel the heat
Obtain perfect dynamic equilibrium.
14) heat dissipation wind channel
Being provided with air draught type heat dissipation wind channel in computer housing, radiating mode uses air-exhaust type wind-cooling heat dissipating, wherein for outside cabinet
The turbofan 201 of air draft is installed on the afterbody 13 of cabinet, and complete machine has two big main air inlets and two little auxiliary air inlet
Mouthful, two big main air inlets are CPU air inlet 22, video card air inlet 23, and two little auxiliary air inlet mouths are bottom air inlet
15, side jacking air port 14.
CPU air inlet 22 is positioned at casing right plate, has a relatively large opening on the position of cpu heat 6；Video card
It is anterior that air inlet 23 is positioned at casing, the position corresponding with the region installing display card 7 in cabinet has one bigger
Strip perforate；Bottom air inlet 15 is positioned in cabinet bottom enclosure, and the dividing plate 3 in cabinet extends vertically up to machine with mainboard 4
One section of elongated perforate is had between 2 intersecting lenses on box plate；It is close that jacking air port, side 14 is positioned at casing left plate
A less strip perforate is had on enclosure top 11 and anterior position.
In air draught type heat dissipation wind channel, whole cabinet is in addition at above-mentioned 4, air intake perforate and CD-ROM drive 204 enter dish perforate 24, then nothing
Other air intake holes, the air in case is ceaselessly pumped to outside casing by the fan 201 in cabinet afterbody, causes the air pressure in casing
Atmospheric pressure outside less than casing, forces the air outside casing to be flowed in casing by each air inlet.Generally, blowing form is produced
Quick flow when running into material object, the air pressure on surface in kind can rise, and air pressure raises air can tend to heat release state on the contrary, unfavorable
Heat exchange between surface in kind and stream air；And if use air-draft-type, in air channel, the air pressure on surface in kind slightly declines,
Low pressure air can more tend to heat absorption state and expand own vol, is conducive to the heat friendship between surface in kind and stream air
Change.
The cold wind that CPU air inlet 22 flows into flows through the cpu heat 6 of correspondence, and after absorbing its heat, cold wind becomes hot-fluid.
Owing to mainframe box is vertical, cpu heat 6 is in lower half, and turbofan 201 is at the first half.The higher hot-fluid of temperature is due to it
Natural lift and the suction of turbofan 201, flow to enclosure top, and the relatively low part hot-fluid of temperature is by dividing plate 3 back side turbine wind
The suction of fan 201, the gap through between dividing plate 3 edge and slip lid front panel 21 inwall flows to the space, lower half to dividing plate 3 back side
In.Owing to the latter half at dividing plate 3 back side is power pack 9 or the hard disk 203 that parallel patch touches installation, therefore it is relatively low to flow into temperature herein
Hot-fluid, power pack 9, the caloric value of hard disk 203 part can be walked with absorption band.
The cold wind that video card air inlet 23 flows into is directly through corresponding display card radiator 8, the first half at dividing plate 3 back side
Point and dividing plate 3 backside space in cabinet in top.In the centre position at dividing plate 3 back side, i.e. under display card 7 installation region
Side, is provided with one piece of video card windscreen 39, this video card from video card air inlet 23 position between the turbofan 201 at dividing plate 3 back side
Windscreen 39 sealing paste simultaneously touches dividing plate 3 back side and slip lid 2 inwall.Simple efficient by the whole drain of cold wind of video card air inlet 23
Radiator through display card 7 absorbs heat, and is finally extracted out outside casing by turbofan 201, and this midway, air channel is not by machine
Hot-fluid in other spaces interference in case.
Owing to having air vent 38 in dividing plate 3 central region, and just this air vent 38 is close on dividing plate 3 back side
Turbofan 201 is installed.The cold wind that bottom air inlet 15 flows into, flows through lower half and mainboard 4 back side lower half in dividing plate 3 front
Portion.Owing to the latter half at dividing plate 3 back side is power pack 9 or the hard disk 203 that parallel patch touches installation, so the one of its caloric value
Dividing and be delivered to dividing plate 3 the latter half, the cold wind flowed into by bottom air inlet 15 heat absorption is taken away；Another part heat mainly transmits
Dispel the heat in afterbody and bottom to cabinet metal shell；Some heat is flowed through by above-mentioned described CPU air inlet 22
The relatively low hot-fluid of rear remaining portion temperature is absorbed to be taken away.
It is contemplated that high-power display card 7 caloric value is very big, and video card air inlet 23 air quantity is limited, also increases by one
Jacking air port, side 14, its cold wind flowed into withstands on the region of dividing plate 3 backside space in mainly absorbing cabinet and fraction dividing plate 3 is carried on the back
The heat of face upper area.The cold wind that described four kinds of air inlets flow into, with each radiator, dividing plate 3, heating hardware, part cabinet
Metal shell inwall becomes air hot-fluid after carrying out heat exchange, be installed in several turbofan of the cabinet first half, afterbody
201 discharge outside casing.
In addition to several air inlets, the sealed design that complete machine uses, add each hardware arrangement science, the letter in upper case
Clean, produced windage is less.The volume of the most ultra-thin PC mainframe box is little, when using convulsion form, produced in its casing
Draught head becomes apparent from than big cabinet, and the air channel flow formed in cabinet is big, wind speed is fast.And, the low pressure that air draught produces
The air channel formed, adds hardware arrangement science, succinct, and windage is little, the air olderly flowage in air channel, will not produce reflux heat
The phenomenon of wind.
Air Filter 25 all it is movably installed with in aforementioned four air intake perforate, in order to filter the dust entered in case in air,
Cleaning and permanent good ventilation, heat dispersion is kept in making mainframe box.
15) turbofan 201
It is fitted with turbofan 201 in the positive space of planes of dividing plate 3 and dividing plate 3 backside space,
The positive space of planes of dividing plate 3, having on a fragment position region in the western end edge of mainboard 4 is the I/O interface group of mainboard 4, and at mainboard I/O
The western end edge part of the remaining mainboard in interface group 41 side 4, the element heights on its mainboard 4 is all within 18mm, so its mainboard 4
The space in overhead is more open, and the western end edge of mainboard 4 is proximate to cabinet afterbody shell.Therefore at the machine in this overhead, position of mainboard 4
Turbofan 201 is installed, perforate 17 phase of the air outlet of turbofan 201 and cabinet afterbody shell on case afterbody outer casing inner wall
Even, air-flow is arranged outside casing.It is arranged on the turbofan 201 on mainboard 4 western end edge clear position, ingenious, utilize efficiently
This clear position carries out air discharging and radiating, the most additionally increases the volume of cabinet, and movable mounting structure the most not shadow
The dismounting ringing hardware uses.
Having air vent 38 on dividing plate 3, the one side of turbofan 201 is close to this air vent 38 and is arranged on dividing plate 3 and carries on the back
On face.The air that the one side of this turbofan 201 extracts between dividing plate 3 and mainboard 4 in gap through the air vent 38 on dividing plate 3；
Air in another side extraction dividing plate 3 backside space of turbofan 201.The air outlet of this turbofan 201 and cabinet afterbody
The perforate of shell is connected, outside the air of all extractions is discharged casing；
It is arranged on the turbofan 201 on cabinet afterbody outer casing inner wall, comprises following 2 kinds of forms and exist:
The most fixed, i.e. turbofan 201 is fixed on the inwall of cabinet afterbody shell by screw or installation draw-in groove；
The most movable, two frames perpendicular with turbofan 201 air outlet are provided with guide rail, pacify at cabinet afterbody shell
Dress has perforate on fan 201 position, and the shape of this perforate, size are just the most transversal with the air outlet at turbofan 201 place
Face matches.A guide rail sliding chute is had just vertically just this perforate to be arranged on the inwall of cabinet afterbody shell, with guide rail
Turbofan 201 matches with the guide rail sliding chute on cabinet afterbody outer casing inner wall, and turbofan 201 is by cabinet afterbody shell
Perforate can freely move inside and outside cabinet bulk, when this turbofan 201 installed hinders the dismounting of hardware in cabinet, can
This turbofan 201 is moved to outside cabinet bulk, after the hardware in cabinet has dismounted, then this turbofan 201 is retracted
On inwall to cabinet bulk.
The present invention is not limited to above-mentioned detailed description of the invention, and those of ordinary skill in the art is according to entering that the present invention makes
One step is expanded and is each fallen within protection scope of the present invention.
Claims (10)
1. a computer host box, including casing of computer cabinet and computer hardware, computer hardware includes mainboard, hard disk or power supply
Box and corresponding radiator, it is characterised in that: being provided with dividing plate in described casing of computer cabinet, dividing plate is by outside computer host box
The cavity that shell is constituted is divided into two, on the plate face of the side that mainboard is fixed on dividing plate, and the front that plate face is dividing plate of this side,
Hard disk or power pack are located on the plate face of another side of dividing plate, the back side that plate face is dividing plate of this side, mainboard and dividing plate
Parallel or the parallel patch in front is touched, and hard disk or power pack patch parallel or parallel with the back side of dividing plate is touched, described membrane front face or the back side
Or be provided with circuit in dividing plate, described dividing plate is provided with for mating the dividing plate socket that is connected with computer hardware, dividing plate socket and its
On circuit electrical connection.
Computer host box the most according to claim 1, it is characterised in that: described dividing plate is that glass fibre/half is fiberglass-based
The embedded dividing plate of printed circuit；Or be metal base printed circuit board, the FPC flexible cord embedded dividing plate of row；Or be that ultrathin insulating copper sheet is embedded
Dividing plate；Or be Metal Substrate conductive coating circuit dividing plate.
Computer host box the most according to claim 1, it is characterised in that: described cabinet internal partition front and/or the back side or every
Fit tightly or be embedded with the circuit of Ultrathin tabular form in plate, form dividing plate circuit, between described dividing plate circuit and described dividing plate
Mutually insulated, the thickness≤0.5mm of conductor in dividing plate circuit, by the dividing plate of connection corresponding with dividing plate circuit between each computer hardware
Socket matches and the most correctly connects after docking, or directly the tailored interfaces of hardware is pasted and touch be arranged in dividing plate circuit exposed
Conduction circuitry contacts correctly dock after turn on, whole dividing plate circuit surface have insulation and wearing layer close over,
And the height of height baffle surface the most about.
Computer host box the most according to claim 1, it is characterised in that: described dividing plate is that glass fibre/half is fiberglass-based
The embedded dividing plate of PCB, the fiberglass-based PCB of described glass fibre/half is fabricated to the wired circuit of design
With physical appearance size, described dividing plate is aluminium alloy or copper metal plate, one side or double-sided design on described dividing plate
Position, processes the shape of PCB fiberglass-based with described glass fibre/half and groove that thickness matches, by institute
State the fiberglass-based PCB of glass fibre/half to be closely covered in described groove, make described glass fibre/half glass fibers
Wiki PCB surface and its place baffle surface are in same plane height, and whole of described dividing plate has insulation, wearing layer
Carry out close over.
Computer host box the most according to claim 1, it is characterised in that: the metal shell of described dividing plate and computer host box or
Skeleton is identical material and is integrally formed, and is made after material hot melt or extruding outside the dividing plate metal with computer host box by mould
Shell or skeleton are made of one piece.
Computer host box the most according to claim 1, it is characterised in that: described dividing plate and the metallic framework of computer host box or
Shell is that separation is independent, is welded and fixed between dividing plate and cabinet metallic framework or outer casing inner wall.
Computer host box the most according to claim 1, it is characterised in that: there is a phase in the enclosure location of described computer host box
Integral type " U " the font slide lid housing of coupling, described slide lid housing is transparent or semitransparent or transparent materials is made.
Computer host box the most according to claim 1, it is characterised in that: described computer host box is vertical, and mainboard is close
One end of CPU i.e. mainboard the North limit is placed downwards, and upwards, the casing inwall near limit, the mainboard south is machine to limit, the mainboard south
The top inner wall of case, is vertically above in the strip region in mainboard front 15～45mm on this inwall, and activity is mounted with that one is long
The socket of bar shaped, constitutes cabinet inwall extension socket, described inwall extension socket includes DC+5V and the confession of direct current negative pole
One or both or three kinds of interfaces in electrical interface, 7+6pin SATA CD-ROM driver interface and 7+15pin SATA hard disc interface.
Computer host box the most according to claim 1, it is characterised in that: described computer host box is vertical, is provided with suction in it
Wind formula heat dissipation wind channel, radiating mode uses air-exhaust type wind-cooling heat dissipating, is wherein installed on for the turbofan of air draft outside cabinet
The afterbody of cabinet, the air outlet of turbofan is connected with the perforate of cabinet afterbody shell, and complete machine has main air inlet and auxiliary air inlet
Mouthful, main air inlet includes that computer CPU air inlet, auxiliary air inlet mouth include bottom air inlet and/or jacking air port, side, and CPU dispels the heat
Device is in lower half, and turbofan is at the first half.
Computer host box the most according to claim 1, it is characterised in that: the positive EDS maps of described dividing plate and be fixed with some
Individual mainboard support column, the distributing position of described mainboard support column and mounting hole site on the mainboard of corresponding support are the most one by one
Joining, described mainboard support column is by parallel for mainboard hanging in membrane front face, and the mainboard back side is relative with membrane front face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/085095 WO2017202248A1 (en) | 2015-05-25 | 2017-05-19 | Computer chassis |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015203417276 | 2015-05-25 | ||
| CN201520341727 | 2015-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105975017A true CN105975017A (en) | 2016-09-28 |
Family
ID=56957166
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610353261.0A Pending CN105975017A (en) | 2015-05-25 | 2016-05-24 | Computer host case |
| CN201620485727.8U Expired - Fee Related CN206162286U (en) | 2015-05-25 | 2016-05-24 | Mainframe box |
| CN201620485729.7U Expired - Fee Related CN205880768U (en) | 2015-05-25 | 2016-05-24 | Mainframe box |
| CN201620485726.3U Expired - Fee Related CN206021160U (en) | 2015-05-25 | 2016-05-24 | A kind of computer host box |
| CN201620485728.2U Expired - Fee Related CN206097019U (en) | 2015-05-25 | 2016-05-24 | Mainframe box |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620485727.8U Expired - Fee Related CN206162286U (en) | 2015-05-25 | 2016-05-24 | Mainframe box |
| CN201620485729.7U Expired - Fee Related CN205880768U (en) | 2015-05-25 | 2016-05-24 | Mainframe box |
| CN201620485726.3U Expired - Fee Related CN206021160U (en) | 2015-05-25 | 2016-05-24 | A kind of computer host box |
| CN201620485728.2U Expired - Fee Related CN206097019U (en) | 2015-05-25 | 2016-05-24 | Mainframe box |
Country Status (2)
| Country | Link |
|---|---|
| CN (5) | CN105975017A (en) |
| WO (4) | WO2017202252A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106506195A (en) * | 2016-10-19 | 2017-03-15 | 广州新蓝网络科技有限公司 | Mobile terminal safety management method and terminal management all-in-one |
| WO2017202251A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer chassis |
| WO2017202249A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Partition in computer system unit |
| WO2017202247A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer system unit power supply unit |
| CN108733150A (en) * | 2018-09-04 | 2018-11-02 | 武涛 | A kind of the integral type cabinet and its manufacture craft of microcomputer |
| CN109725692A (en) * | 2018-12-29 | 2019-05-07 | 联想(北京)有限公司 | Cabinet and electronic equipment |
| CN110906984A (en) * | 2019-12-05 | 2020-03-24 | 山东超越数控电子股份有限公司 | Signal acquisition and network transmission system based on localization platform |
| CN111208882A (en) * | 2020-01-03 | 2020-05-29 | 英业达科技有限公司 | GPU and chassis hardware architecture |
| TWI733455B (en) * | 2020-05-20 | 2021-07-11 | 海韻電子工業股份有限公司 | Power supply structure of desktop computer |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108196634B (en) * | 2017-12-27 | 2019-02-26 | 黄河科技学院 | Based on computer modularized hardware expansion cellular construction |
| CN109992061A (en) * | 2017-12-29 | 2019-07-09 | 鸿富锦精密工业(武汉)有限公司 | Host computer |
| CN108832228A (en) * | 2018-06-20 | 2018-11-16 | 安徽知之信息科技有限公司 | A kind of water circle device of new energy car battery case |
| CN109114369B (en) * | 2018-07-18 | 2020-07-03 | 华东交通大学 | Biomechanics is with host computer rack that installation peripheral hardware of being convenient for has arrangement cable function |
| CN108617151A (en) * | 2018-07-27 | 2018-10-02 | 深圳市誉品智能光电科技有限公司 | Cooling and heat dissipation module |
| CN109379044B (en) * | 2018-10-16 | 2020-06-26 | 山西永晟天承环保科技有限公司 | Portable photovoltaic direct-current power meter, use method and application thereof |
| CN109308919A (en) * | 2018-12-08 | 2019-02-05 | 大连鑫鑫创世科技发展有限公司 | A kind of computer hard disc heat dissipation equipment and method |
| CN109358724A (en) * | 2018-12-08 | 2019-02-19 | 大连景竣科技有限公司 | A kind of mini desktop computer main frame structure and means of defence |
| CN109814515B (en) * | 2019-03-25 | 2024-01-30 | 福建聚实新能源科技有限公司 | Intelligent management system and method for Internet of things of power distribution station house |
| US10645832B1 (en) * | 2019-05-02 | 2020-05-05 | Apple Inc. | Computer tower architecture |
| CN112015245A (en) * | 2019-05-31 | 2020-12-01 | 苹果公司 | Tower architecture for computer |
| CN110456890A (en) * | 2019-07-03 | 2019-11-15 | 黎明职业大学 | A kind of radiator for host computer |
| CN112312722A (en) * | 2019-07-25 | 2021-02-02 | 上海擎感智能科技有限公司 | Host shell, integrated host and vehicle-mounted multimedia |
| TWI711362B (en) * | 2019-08-30 | 2020-11-21 | 瑞利軍工股份有限公司 | Adjustable axial fixed structure |
| CN113093886A (en) * | 2020-01-08 | 2021-07-09 | 苏州溢博伦光电仪器有限公司 | Computer chip heat abstractor with show function |
| CN111427429B (en) * | 2020-04-10 | 2023-04-18 | 广州盛世腾龙电子有限公司 | Computer case with booster-type electrostatic dust removal system |
| CN111488045A (en) * | 2020-04-14 | 2020-08-04 | 殷莉 | Computer cooling assembly working in large range |
| CN111465240B (en) * | 2020-04-30 | 2024-05-14 | 长春工程学院 | Multi-source sensing data acquisition integrated interface of Internet of things |
| CN113703558A (en) * | 2020-05-20 | 2021-11-26 | 海韵电子工业股份有限公司 | Power supply structure of desktop computer |
| CN111880617B (en) * | 2020-07-28 | 2022-04-22 | 苏州浪潮智能科技有限公司 | CPU base protection device and server |
| CN111930104B (en) * | 2020-08-18 | 2023-02-03 | 云南电网有限责任公司德宏供电局 | Portable temperature controller checking system based on oil groove |
| CN112198943A (en) * | 2020-08-28 | 2021-01-08 | 南京驭逡通信科技有限公司 | Efficient heat dissipation type computer and use method thereof |
| CN112130634B (en) * | 2020-09-23 | 2022-04-01 | 无锡科技职业学院 | Computer hardware device |
| CN112578877A (en) * | 2020-11-15 | 2021-03-30 | 上海英众信息科技有限公司 | Heat transmission device for computer |
| CN112462888B (en) * | 2020-12-18 | 2024-07-05 | 广西数广信创信息技术有限公司 | Computer cabinet |
| CN112539977A (en) * | 2020-12-22 | 2021-03-23 | 浙江正安检测技术有限公司 | High-efficient explosion-proof dust sample thief |
| CN112732047B (en) * | 2020-12-22 | 2023-03-21 | 宝鸡文理学院 | Computer network safety processor with heat dissipation function |
| CN112527075B (en) * | 2021-02-01 | 2024-07-30 | 东莞市宏奭五金科技有限公司 | High-efficient heat dissipation computer machine case |
| CN113056165A (en) * | 2021-02-04 | 2021-06-29 | 安徽江淮朗格电气有限公司 | Direct current servo driver mounting structure |
| CN113050773A (en) * | 2021-04-25 | 2021-06-29 | 扬州恒联照明器材有限公司 | Case with good heat dissipation performance |
| CN113660544B (en) * | 2021-08-13 | 2024-08-06 | 深圳市科地通信技术有限公司 | Heat dissipation air duct device applied to switch |
| CN113760059B (en) * | 2021-08-27 | 2023-07-18 | 苏州浪潮智能科技有限公司 | Multifunctional wind scooper bracket module device and server case |
| CN114025521B (en) * | 2021-09-14 | 2023-04-07 | 深圳市格仕乐科技有限公司 | Communication case with automatic temperature energy-saving regulation and control function |
| CN114020114A (en) * | 2021-11-01 | 2022-02-08 | 神州信创(厦门)研究院有限公司 | Desktop computer heat dissipation case |
| WO2023112350A1 (en) * | 2021-12-16 | 2023-06-22 | 古河電気工業株式会社 | Heat sink |
| CN114637379A (en) * | 2022-03-24 | 2022-06-17 | 深圳华大智造科技股份有限公司 | Biological information analysis device |
| CN114721483B (en) * | 2022-04-26 | 2023-07-28 | 湖南汽车工程职业学院 | Self-cooling heat abstractor that computer machine case was used |
| TWI806618B (en) * | 2022-05-20 | 2023-06-21 | 宏碁股份有限公司 | Display card and display card system |
| CN115103176B (en) * | 2022-06-17 | 2023-11-07 | 桃子科技(嘉兴)有限公司 | AR video generator |
| CN114942680B (en) * | 2022-06-22 | 2023-11-24 | 电子科技大学成都学院 | Movable automatic heat-dissipating dust-removing device for desk computer host |
| CN115066159A (en) * | 2022-07-08 | 2022-09-16 | 深圳市天音电子有限公司 | Multifunctional power adapter |
| CN115407845B (en) * | 2022-09-09 | 2023-06-16 | 深圳市智瑞通科技有限公司 | Display card fixing device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202102350U (en) * | 2011-04-11 | 2012-01-04 | 周超 | H-structured computer case |
| CN203287835U (en) * | 2013-04-17 | 2013-11-13 | 李晓龙 | Small high-configuration computer heat-dissipating case |
| CN203643912U (en) * | 2013-11-29 | 2014-06-11 | 卢锋 | Computer mainframe |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6681845B1 (en) * | 2002-10-24 | 2004-01-27 | Chia Ching Yeh | Radiating module |
| JP2009005087A (en) * | 2007-06-21 | 2009-01-08 | Nikon Corp | Image data handling system |
| CN201327827Y (en) * | 2008-11-20 | 2009-10-14 | 北京市九州风神科贸有限责任公司 | Radiator buckling device |
| CN201322898Y (en) * | 2008-12-24 | 2009-10-07 | 张利 | Two-in-one computer host and case of host |
| CN102385417B (en) * | 2010-08-25 | 2013-02-20 | 英业达股份有限公司 | Rack-mounted server |
| CN102478906B (en) * | 2010-11-30 | 2013-08-28 | 英业达股份有限公司 | Rack server |
| CN202230420U (en) * | 2011-10-10 | 2012-05-23 | 浪潮电子信息产业股份有限公司 | Server with no cable therein |
| CN202453788U (en) * | 2012-01-19 | 2012-09-26 | 周奋豪 | Hard disk installation structure of desktop computer |
| CN204102053U (en) * | 2014-11-14 | 2015-01-14 | 郑州航空工业管理学院 | A kind of Novel computer cabinet |
| CN205880794U (en) * | 2015-05-25 | 2017-01-11 | 周奋豪 | Installation fixing device and dedicated CPU radiator of computer CPU radiator |
| CN105975017A (en) * | 2015-05-25 | 2016-09-28 | 周奋豪 | Computer host case |
| CN205880806U (en) * | 2015-05-25 | 2017-01-11 | 周奋豪 | Computer power supply box |
| CN105807869A (en) * | 2015-05-25 | 2016-07-27 | 周奋豪 | Radiating structure and mounting structure for independent graphics card of computer |
| CN105892590A (en) * | 2015-05-25 | 2016-08-24 | 周奋豪 | Partition plate in computer host |
| CN104932634A (en) * | 2015-07-04 | 2015-09-23 | 苏州塔可盛电子科技有限公司 | Case |
-
2016
- 2016-05-24 CN CN201610353261.0A patent/CN105975017A/en active Pending
- 2016-05-24 CN CN201620485727.8U patent/CN206162286U/en not_active Expired - Fee Related
- 2016-05-24 CN CN201620485729.7U patent/CN205880768U/en not_active Expired - Fee Related
- 2016-05-24 CN CN201620485726.3U patent/CN206021160U/en not_active Expired - Fee Related
- 2016-05-24 CN CN201620485728.2U patent/CN206097019U/en not_active Expired - Fee Related
-
2017
- 2017-05-19 WO PCT/CN2017/085118 patent/WO2017202252A1/en active Application Filing
- 2017-05-19 WO PCT/CN2017/085116 patent/WO2017202251A1/en active Application Filing
- 2017-05-19 WO PCT/CN2017/085122 patent/WO2017202253A1/en active Application Filing
- 2017-05-19 WO PCT/CN2017/085095 patent/WO2017202248A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202102350U (en) * | 2011-04-11 | 2012-01-04 | 周超 | H-structured computer case |
| CN203287835U (en) * | 2013-04-17 | 2013-11-13 | 李晓龙 | Small high-configuration computer heat-dissipating case |
| CN203643912U (en) * | 2013-11-29 | 2014-06-11 | 卢锋 | Computer mainframe |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017202251A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer chassis |
| WO2017202248A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer chassis |
| WO2017202249A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Partition in computer system unit |
| WO2017202247A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer system unit power supply unit |
| CN106506195A (en) * | 2016-10-19 | 2017-03-15 | 广州新蓝网络科技有限公司 | Mobile terminal safety management method and terminal management all-in-one |
| CN108733150A (en) * | 2018-09-04 | 2018-11-02 | 武涛 | A kind of the integral type cabinet and its manufacture craft of microcomputer |
| CN109725692A (en) * | 2018-12-29 | 2019-05-07 | 联想(北京)有限公司 | Cabinet and electronic equipment |
| CN110906984A (en) * | 2019-12-05 | 2020-03-24 | 山东超越数控电子股份有限公司 | Signal acquisition and network transmission system based on localization platform |
| CN111208882A (en) * | 2020-01-03 | 2020-05-29 | 英业达科技有限公司 | GPU and chassis hardware architecture |
| TWI733455B (en) * | 2020-05-20 | 2021-07-11 | 海韻電子工業股份有限公司 | Power supply structure of desktop computer |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017202251A1 (en) | 2017-11-30 |
| WO2017202248A1 (en) | 2017-11-30 |
| CN206162286U (en) | 2017-05-10 |
| CN206097019U (en) | 2017-04-12 |
| CN206021160U (en) | 2017-03-15 |
| WO2017202253A1 (en) | 2017-11-30 |
| WO2017202252A1 (en) | 2017-11-30 |
| CN205880768U (en) | 2017-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205880768U (en) | Mainframe box | |
| CN205880770U (en) | Heat radiation structure of independent display card of computer and mounting structure thereof | |
| CN205880794U (en) | Installation fixing device and dedicated CPU radiator of computer CPU radiator | |
| CN205880769U (en) | Baffle among computer | |
| CN205880806U (en) | Computer power supply box | |
| CN209746501U (en) | Auxiliary heat dissipation device for notebook computer | |
| CN206610224U (en) | A kind of mainframe box | |
| CN206833332U (en) | A kind of aluminum shell computer housing | |
| CN206711007U (en) | Notebook PC radiator | |
| CN207780712U (en) | A kind of computer equipment auxiliary radiating device | |
| CN208188779U (en) | A kind of double nip radiator of video card | |
| CN206975959U (en) | A kind of small space distance LED display screen module of high density | |
| CN206610387U (en) | The independent air guiding heat dissipation device of all-in-one | |
| CN206650476U (en) | A kind of portable charger shell | |
| CN217467567U (en) | Heat dissipation backshell of all-in-one computer | |
| CN207115317U (en) | A kind of computer heat-dissipating frame structure | |
| CN110581914A (en) | Water-cooled heat dissipation cell-phone shell | |
| CN2921936Y (en) | Air conducting structure for computer radiating device | |
| CN213930040U (en) | Semiconductor heat dissipation support | |
| CN203838650U (en) | Computer power source structure | |
| CN211506384U (en) | Novel computer-aided heat radiation structure | |
| CN208805575U (en) | A kind of GPS navigation device with multiple mounting modes | |
| CN209294086U (en) | A kind of radiator fan | |
| CN205384568U (en) | Mini computer machine case | |
| CN206805455U (en) | A kind of foldable rechargeable radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160928 |