CN105807869A - Radiating structure and mounting structure for independent graphics card of computer - Google Patents
Radiating structure and mounting structure for independent graphics card of computer Download PDFInfo
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- CN105807869A CN105807869A CN201610353265.9A CN201610353265A CN105807869A CN 105807869 A CN105807869 A CN 105807869A CN 201610353265 A CN201610353265 A CN 201610353265A CN 105807869 A CN105807869 A CN 105807869A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Computer Hardware Design (AREA)
Abstract
The invention discloses a radiating structure for an independent graphics card of a computer. The radiating structure comprises a mounting structure for the independent graphics card and a radiator. The radiator which is flat integrally is matched with the independent graphics card and is provided with a front surface and a back surface, a heat conduction base is arranged on the front surface of the integrally flat radiator, a main body of the radiator comprises radiating fins, and the radiating fins are parallelly arrayed at intervals. An outward smooth surface of the heat conduction base flatly clings to a GPU (graphics processing unit) chip of the independent graphics card, the back surface of the radiator is in contact with a partition plate surface in a host case of the computer in a parallelly clinging manner, a space of a host of the computer is halved by a partition plate, computer hardware including a mainboard, hard disks, power boxes and a fan are parallelly mounted on a surface or two surfaces of the partition plate or are mounted on the single surface or the two surfaces of the partition plate in a parallelly clinging contact manner, and the independent graphics card is parallel to the partition plate. The invention further discloses the mounting fixing structure for the independent graphics card of the computer. The radiating structure and the mounting fixing structure have the advantages that various independent graphics cards can be compatibly arranged in the ultrathin case, the effective radiating area of the independent graphics card can be enlarged, and the radiating efficiency of the independent graphics card can be enhanced.
Description
Technical field
The present invention relates to the technical field of computer hardware equipment, the installation of especially a kind of computer display card and the technology of radiator structure.
Background technology
The main flow of existing conventional desktop computer mainframe box is tower mainframe box, and its overall build is cuboid.The mainframe box of desktop computer has horizontal and vertical dividing, generally with vertical most commonly seen.In mainframe box, all of physics parts are commonly referred to as computer hardware, including mainboard, hard disk, CPU, memory bar, display card, CD-ROM drive and power supply, and each radiator.Existing tower mainframe box is non-ultra-thin case, and build is big, Heavy Weight.
1) hardware arrangement and cabling: the hardware arrangement in conventional desktop mainframe box at present is designed as, one locational space almost can only install and use a kind of computer hardware, so in order to meet the more hardware of support, the installing space position of a lot of each hardware it is provided with in mainframe box, when some hardware installation position uses less than, just can only be idle in that, waste the spatial volume in mainframe box greatly, make the space availability ratio in mainframe box very low.
Data between each hardware or for electrical connection, what the overwhelming majority adopted is RVV wire, is coupled together between each hardware being associated by wire in the mainframe box of conventional desktop.But owing to the layout in legacy hosts case and cabling mode fall behind, numerous plus various hardware, the connection wire formed is also just crisscross, complicated various, use not only user and need possess certain professional knowledge background, and had a strong impact within mainframe box attractive in appearance, various cablings also occupy the spatial volume in cabinet significantly.In traditional mainframe box, owing to the arrangement of each hardware exists irrational reason, add that employing plain conductor is connected, and the distance that connects between hardware is not the shortest, the connection of minimal path also cannot be accomplished, because too short, plain conductor becomes not only thick but also hard, uses so being not easy to very much user installation.
2) structure of cpu heat and installation thereof: traditional cpu heat is with 4 screws/expansion bayonet lock, by the CPU installing hole on mainboard, rigidity or cpu heat is fixed on mainboard close to the material of rigidity, frame mode.Following five kinds of problems usually occur: first, due to the tension that screw/expansion bayonet lock is twisted, the stress between radiator and mainboard is excessive, causes mainboard bending in various degree.Second, sometimes due to during this 4 fastened by screws, each stress degree is unbalanced, cause that between the heat-conducting base of cpu chip surface and radiator, local tilts, produce microscopic spaces, considerably increase the heat conductivity between cpu chip and radiator heat-conducting base, hinder cpu chip and transmit to the heat between radiator.3rd, traditional cpu heat and supporting fastener, part are various, install cumbersome, mostly need a few minutes to tens minutes not.4th, when parts of traditional cpu heat is arranged on mainboard, it is impossible to mobile or can only single-way moving.Cause and sometimes occur that cpu heat conflicts mutually with component position on some mainboard, and can not the drawback of normal mounting.5th, the cpu heat of most of traditional high-side in order to reach better radiating effect, can only simply increase radiator size build.So making large-scale cpu heat that the compatibility of mainframe box and mainboard is substantially reduced, the cost that user buys also substantially increases.
It addition, the CPU overwhelming majority TDP power consumption that domestic consumer uses is all within 100W, but considering top CPU and the challenging needs of overclocking user, the power consumption that cpu heat can carry to reach more than 180W.Therefore the performance of radiator be it is also proposed higher requirement.
3) installation of display card and heat radiation: the display card in conventional desktop mainframe box, if low and middle-end video card, is usually and uses the radiator of video card first wife to dispel the heat.If high-power high-end video card, or use high, loaded down with trivial details water-cooling project, or reinstall better air-cooled radiator.But major part display card air-cooled radiator or have certain compatible scope on the market, or kit is many, complex installation process.And the user not possessing certain Professional knowledge does not know and select which type of radiator most suitable.
Traditional host desktop case, display card exist in heat radiation below some problem:
First, if display card adopts air-cooled, due to the restriction of mounting means and dimensions, heat sink size is little to exceed the size range of video card itself.And the fan of its coupling also to occupy a part of volume of radiator, so the actual area of dissipation of radiator is limited.
Second, if adopting water-cooled, its high expense of light is not said.The water tank supporting with water-cooled, water pump, radiator, fan, water pipe etc. are required for additionally increasing the volume and weight of cabinet.And install loaded down with trivial details, also need possess certain professional manipulative ability during user installation water-cooled.
3rd, display card is perpendicular with cabinet side board air inlet.If adopting air-cooled, the cold air flowed into by air inlet is subject to the common unordered interference of the CPU radiator fan on mainboard and VGA COOLER, cold air outside cabinet can not completely, flowing through of one-dimensional order display card radiator carries out high efficiency and heat radiation, because in cabinet not science, tight air channel, make in the cold air of inflow display card, cpu heat entrainment of reflux heat air, have impact on the heat exchange effect of radiator.
4th, display card radiator is to place in horizontal parallel, is highly detrimental to air hot-fluid lift upwards naturally.
Traditional host desktop case, display card is directly vertically to be inserted in the card slot of mainboard to use.Owing to mainboard and display card broadly fall into large-sized hardware in cabinet, it is mutually perpendicular the spatial volume that the mode of installation takies very big.But this mode is fine to the compatibility of hardware.
4), nearly all there is the phenomenon of backflow hot blast in heat dissipation wind channel: the heat dissipation wind channel in conventional desktop mainframe box designs not science, unordered.And in order to increase CPU or display card heat radiation effect, simply by increase heat sink size volume solve.Metal shell by means of cabinet itself not simple, effective transmits, spreads a part of thermal source.
It addition, the noise that rotation speed of the fan produces with it always is a big contradiction of wind-cooling heat dissipating.Rotation speed of the fan in conventional desktop mainframe box generally has two kinds of forms: one is fixed rotating speed, and one is to carry out temperature control rotating speed by connection mainboard PWM socket.The former, no matter temperature in chassis height is all rotating speed, not a science all the time；The latter, fan first has to possess PWM function, then to enter and carry out under mainboard BISS opening, arranging, and user needs possess certain Professional knowledge.And fan model is various, if the fan noise being under PWM rate controlling pattern is excessive or wind speed is less than normal, user effectively regulates almost without way.
5) power supply: the power pack volume in conventional desktop mainframe box is bigger, its function is that the municipal alternating current of input is directly changed into the direct current output of different magnitudes of voltage needed for each hardware, numerous RVV wire is used to dock with each hardware respectively, arrange plus the design in legacy hosts case and fall behind, cause the various wires of case in main frame close and numerous, crisscross, take the spatial volume wasting in mainframe box greatly and have impact on the attractive in appearance of main frame, also hindering the convenience that user uses.
Summary of the invention
The defect of design and technology for overcoming existing product, it is an object of the present invention to provide a kind of heat dispersion radiator structure that can promote display card.
Further objective is that and reduce the spatial volume that display card takies in mainframe box, increase the aesthetic property that display card is arranged in mainframe box.
The present invention also aims to provide a kind of compatible various display cards in ultra-thin case, increase the actual area of dissipation of display card and the mounting structure of the computer display card of radiating effect.
The present invention is realized by following technical proposals:
The radiator structure of computer display card, including the radiator being arranged on display card, it is characterized in that: it is flat that described radiator is provided with front with the back side and entirety, the front of radiator is provided with heat-conducting base, the main part of described radiator is made up of the spaced radiating fin that is parallel to each other, the outwards smooth one side of described heat-conducting base is flattened on the GPU chip of display card, the parallel patch in the back side of radiator is touched in the separator face in host computer, host computer space is divided into two by described dividing plate, on the one or both sides of dividing plate, the tactile installation of parallel or parallel patch includes mainboard, hard disk, power pack, fan is at interior computer hardware, display card and dividing plate be arranged in parallel.
Described radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends and condensation end, the evaporation ends of all vacuum thermal pipes fits tightly all in an orderly manner or is embedded on described heat-conducting base, it is semiarc shape or flat that the condensation end of vacuum thermal pipe is squeezed into cross section by mould, being fitted tightly over radiating fin, the condensation end of part or all of described vacuum thermal pipe is distributed in the back side of described flat radiator and parallel patch is touched and carried out heat conduction in separator face.
The condensation end of a part of vacuum thermal pipe on the heat-conducting base of described radiator extends on main frame metal shell inwall, and parallel fits tightly on main frame metal shell inwall.
The GPU Chip Vertical of described display card projects to the center of this video card pcb board rear surface regions and pastes or be mounted with insulation silica gel, by the side panel of host computer put in place fixing after extrude this insulation silica gel and the pressure that produces makes one side that the heat-conducting base of radiator is flat with the vacuum thermal pipe condensation end of display card GPU chip surface or described radiator back EDS maps parallel with separator face to carry out closely patch and touch, complete to conduct heat energy.
The arragement direction of all fins all with the I/O interface of display card 7 towards parallel or in≤45 ° of angles, and all radiating fins are each perpendicular to separator face.
The technical scheme of the mounting structure of computer display card is presented herein below:
nullA kind of mounting structure of computer display card，Including display card、Mainboard、I/O interface group in the I/O interface group of display card and mainboard，The I/O interface group of described display card refers to display card and input/output interface for being connected on mainboard with the equipment outside host computer with the I/O interface group on mainboard，It is characterized in that: the pcb board face of described display card is parallel to mainboard pcb board face and is arranged at the mainboard back side，On display card the socket of I/O interface group towards with the socket of I/O interface group on mainboard towards identical，The one side of the pcb board of described display card is provided with radiator，The dividing plate of heat-conducting one piece parallel is had between described display card and mainboard，Host computer space is divided into two by described dividing plate，On the one or both sides of dividing plate, the tactile installation of parallel or parallel patch includes mainboard、Hard disk、Power pack、Fan is at interior computer hardware，It is flat that described radiator is provided with front with the back side and entirety，The front of radiator is provided with heat-conducting base，The main part of described radiator is made up of the spaced radiating fin that is parallel to each other，The outwards smooth one side of described heat-conducting base is flattened on the GPU chip of described display card，The parallel patch in the back side of radiator is touched in described separator face，On display card relative with dividing plate plate face equipped with the one side of radiator，And the another side that is fitted without radiator on the pcb board of display card is relative with the described mainboard back side and shell side panel parallel and near to host computer.
On described display card the edge of pcb board residing for I/O interface group its I/O interface group socket towards direction on to protrude from mainboard the distance of pcb board edge 15～40mm residing for I/O interface group.
Described display card passes through dividing plate socket or the video card adapter of Interface Matching and extends winding displacement, is docked and connected mutually by display card slot corresponding with on mainboard for the golden finger interface on described display card.
Described radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends and condensation end, the evaporation ends of all vacuum thermal pipes fits tightly all in an orderly manner or is embedded on described heat-conducting base, it is semiarc shape or flat that the condensation end of vacuum thermal pipe is squeezed into cross section by mould, being fitted tightly over radiating fin, the condensation end of part or all of described vacuum thermal pipe is distributed in the back side of described flat radiator and parallel patch is touched and carried out heat conduction in separator face.
The condensation end of a part of vacuum thermal pipe on the heat-conducting base of described radiator extends on main frame metal shell inwall, and parallel fits tightly on main frame metal shell inwall.
The GPU Chip Vertical of described display card projects to the center of this video card pcb board rear surface regions and pastes or be mounted with insulation silica gel, by the side panel of host computer put in place fixing after extrude this insulation silica gel and the pressure that produces makes one side that the heat-conducting base of radiator is flat with the vacuum thermal pipe condensation end of display card GPU chip surface or described radiator back EDS maps parallel with separator face to carry out closely patch and touch, complete to conduct heat energy.
The invention has the beneficial effects as follows:
Present invention is mainly used for ultra-thin vertical mainframe box, this mainframe box volume is about the 1/6 of conventional desktop mainframe box, and when fully loaded hardware, this mainframe box is about the half of conventional desktop mainframe box weight.This ultra-thin vertical mainframe box can meet installs the mainboard model (such as ATX, M-ATX, ITX etc.) supporting nearly all routine in the market, can install and support all 3.5 cun of hard disks, 2.5 cun of hard disks, can install and support all overall heights, half height, overlength, powerful display card, the notebook CD-ROM drive within support 14mm thickness can be installed.Each hardware in mainframe box has carried out arrangement again, type of attachment definition.Have a metal plate in case, on the two sides being installed in parallel in this metal plate that each hardware is orderly, user can extremely fast, accurately dismounting, group join required hardware；This mainframe box has an integral type "U" shaped slide lid housing matched (this slide lid housing can be material transparent, translucent), opens/closes mainframe box for user and provide extremely easy operator scheme.Entirety possesses the heat dispersion of excellence and a key intelligent temperature control system of hommization.Cpu heat in this ultra-thin case, display card radiator, power pack and air ejector fan are the customization size model mated with this cabinet.
The present invention is arranged on a dividing plate back side (one side being provided with mainboard on dividing plate is set to membrane front face), consider that parallel patch is touched the multiple hardwares being arranged on the dividing plate back side and heat radiation is had certain demand, so the dividing plate back side is except installing, with power pack, Power entry module, dividing plate socket, the concave shaped dividing plate circuitry contacts matched, the surface in other regions, the dividing plate back side is to present with metal plate smooth, heat conduction.
Display card of the present invention have employed the wrong formula mounting structure of the back of the body:
1. formula is dissipated in: its effect has first, adopts the mode paralleled, closely dispose, greatly reduce the spatial volume taken between mainboard with display card.Second, owing to the I/O interface of middle and high end display card is double-deck mostly, consider should completely compatible all video cards, the spatial volume taken again is minimized, therefore cleverly by outside the I/O interface area part translation on display card to the western end edge of mainboard.Plus the obstruct not having dividing plate between display card I/O interface area part and mainboard, so no matter the I/O interface of display card is monolayer or bilayer, does not affect its installing and using in cabinet, has reached the compatibility equally good with tradition cabinet.
2. outer scattered formula: its effect has first, adopts the mode paralleled, closely dispose, greatly reduce the spatial volume taken between mainboard with display card.Second, the maximum advantage of this mode is to reequip radiator and the fan of display card, uses radiator and the fan of display card first wife.And this mode compatibility is fine.The chassis space ratio " interior scattered formula " that shortcoming takies needed for being is bigger.
Interior scattered formula display card radiator: its effect has first, and interior scattered formula display card radiator is thin flat, takies volume only small.Second, owing to this radiator closely pastes tactile with metal partion (metp) or cabinet metal shell inwall by the condensation section of vacuum thermal pipe cleverly mutually, and display card radiator fan is not mounted within radiator, additionally do not take the volume of radiator, so considerably increasing the actual area of dissipation of display card.3rd, the metal partion (metp) and the cabinet metal shell that utilize due to its heat radiation inherently exist, and are also greatly saved the quality of material cost and graphic card radiator.4th, due between the strip radiating fin of graphic card radiator and geographical vertical direction in certain slanted angle, be conducive to air hot-fluid lift upwards naturally.
Dissipating the fixed form between formula display card radiator and display card in the present invention: traditional host desktop case, display card is directly vertically to be inserted in the card slot of mainboard to use.Owing to mainboard and display card broadly fall into large-sized hardware in cabinet, it is mutually perpendicular the spatial volume that the mode of installation takies very big.But this mode is fine to the compatibility of hardware.
Have the effect that first, fixed radiator reached on the ease installed with display card historical fast, almost within one second, install.Second, add that fixed radiator is to be squeezed in GPU Chip Vertical by flexible silicon rubber cushion to project the center stress at the so far video card pcb board back side and make GPU chip surface smooth in heat-conducting base front.Owing to being center stressed, GPU chip is made to reach nature with the active force between heat-conducting base balanced.3rd, user does not again worry affecting its heat-conducting effect as when installing traditional heat sinks because of 4 screw discontinuity equalizations.4th, because some host computer is that the collection used is aobvious or core is aobvious, in main frame, there is no display card, it is idle for now installing on dividing plate on the position of display card.According to the demand of user, can be parallel on this position of separator face and other computer hardware be installed, such as hard disk, power pack, CD-ROM drive etc..
Accompanying drawing explanation
Fig. 1-8 is the computer casing structure schematic diagram in present invention use；
Fig. 9-12 is the structural representation in the dividing plate use of computer housing；
Figure 13 is provided with the computer casing structure schematic diagram of slip lid；
Figure 14 sliding lid construction schematic diagram；
Mounting structure schematic diagram time on Figure 15 dividing plate equipped with video card of the present invention；
The structural representation of the video card of the present invention installed on Figure 16 dividing plate；
The structural representation of Figure 17 display card radiator of the present invention；
The structural representation of Figure 18 power pack；
The structural representation of Figure 19 Power entry module；
The structural representation of Figure 20 movable mode clapboard socket；
Figure 21 is structural representation during cpu heat installation；
Figure 22 is the structural representation of the fixing device for installing of cpu heat.
Identifier declaration in each accompanying drawing is presented herein below:
1, mainframe box shell；11, the top of mainframe box shell；12, the bottom of mainframe box shell；13, the afterbody of mainframe box shell；14, side jacking air port；15, bottom air inlet；16, mainboard I/O baffle plate dividing plate draw-in groove；17, air draft perforate；18, manual adjustments switch；
2, slip lid；21, slip lid front panel (casing is anterior)；22, CPU air inlet；23, video card air inlet；24, dish perforate is entered；25, Air Filter；
3, dividing plate；31, mainboard support column；32, dividing plate circuit；33, concave shaped contact point；34, fixed dividing plate socket；35, movable mode clapboard socket；36, hole, location；37, temperature probe；38, air vent；39, video card windscreen；
4, mainboard；41, mainboard I/O interface group；42, cpu chip；43, PCI-E/ card slot；44, memory bar slot；45, mainboard is main for electrical slot；46, mainboard auxiliary power supply slot；47, mainboard installing hole；
5, fastener；51, support column, also referred to as fastener support column；52, sliding bar；53, bridge depression bar；54, expansion anchor；
6, cpu heat；61, (CPU) heat-conducting base；62, (CPU) vacuum thermal pipe；63, (CPU) radiating fin；64, CPU attached heat sinks；
7, display card；70, display card pcb board；71, display card I/O interface group；72, GPU chip；73, display card auxiliary power supply slot；74, (display card) golden finger；
8, display card radiator；81, (display card radiator) heat-conducting base；82, (display card radiator) vacuum thermal pipe；83, (display card radiator) radiating fin；
9, power pack；91, bottom surface；92, output port；93, contact copper sheet；94, alignment pin；
10, Power entry module；101, (Power entry module) bottom surface；102, direct current input port；103, direct current delivery outlet；104, shell fragment；
201, fan；202,2.5 cun of hard disks；203, hard disk；204, CD-ROM drive；205, extension socket；206, silicagel pad；208, mainboard I/O baffle plate.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described:
Such as Fig. 1-Figure 14, a kind of computer housing, including computer host housing 1/ skeleton and computer hardware, wherein computer hardware includes mainboard 4, hard disk 203/ power pack 9 and corresponding radiator, it is provided with dividing plate 3 in computer host housing 1/ skeleton, the cavity that computer host housing 1/ skeleton is constituted is divided into two by dividing plate 3, and mainboard 4 is fixed on a side of dividing plate 3, and this side is the front of dividing plate 3.Hard disk 203/ power pack 9 is located on another side of dividing plate 3, and this side is the back side of dividing plate 3.Mainboard 4, hard disk 203/ power pack 9 are all parallel with the side of dividing plate 3, and described dividing plate 3 front, or/and be provided with circuit in the back side or dividing plate 3, is provided with the dividing plate socket carrying out circuit connection for computer hardware on dividing plate 3.When dividing plate 3 is metal material manufacture, it is called metal partion (metp).
This host computer is vertical super-thin host computer, general outline build is flat cube, but local corner, plane have different angles or structure, volume be tradition PC mainframe box about 1/6, when fully loaded hardware, this ultra-thin main frame is about the half of tradition PC mainframe box weight.Simultaneously, it is possible to mainboard 4 model (such as ATX, M-ATX, ITX etc.) supporting nearly all PC class in the market is installed.Being provided with CD-ROM drive 204 on dividing plate 3, the notebook CD-ROM drive 204 within 14mm thickness is supported in preferential installation.Each hardware in this ultra-thin main frame has carried out arrangement again, type of attachment definition.Have a metal plate in case, on the two sides being installed in parallel in this metal plate that each hardware is orderly, user can extremely fast, accurately dismounting, group join required hardware；This ultra-thin main frame has integral type "U" shaped slip lid 2 shell matched (this slip lid 2 shell can be material transparent, translucent), opens/closes this main frame for user and provide extremely easy operator scheme.The front of dividing plate 3 is additionally provided with mainboard support column 31(mainboard 4 be installed on it), dividing plate 3 stealthy circuit, dividing plate socket, cpu heat 6 fastener 5, CUP attached heat sinks, inwall extension socket 205, mainboard I/O baffle plate dividing plate draw-in groove 16.
Concrete structure is as follows:
01) mainboard support column 31
The front of dividing plate 3 is provided with mainboard support column 31, and mainboard 4 is fixed on 3, dividing plate by mainboard support column 31.The internal thread hole being perpendicular to dividing plate 3 plate face or the pin hole matched with expansion bayonet lock is had in mainboard support column 31, described mainboard support column 31 by parallel for mainboard 4 hanging on dividing plate 3 front, and mainboard 4 back side and dividing plate 3 vis-a-vis, by screw or expand bayonet lock mainboard 4 is fixed in the mainboard support column 31 on dividing plate 3.Mainboard 4 and dividing plate 3 hanging so that the stitch that mainboard 4 back-side circuit plate protrudes above will not touch with dividing plate 3 plate face and cause short-circuit probability.
Arranging several mainboard support columns 31 on the front of dividing plate 3, the height protruding from dividing plate 3 plate face is 4～7mm, and the distributing position of these mainboard support columns 31 mates mutually one by one with the mounting hole site of the mainboard 4 of corresponding support.Mainboard support column 31 is conducting metal material, and fastens with dividing plate 3, conducts electricity and be connected.
Mainboard support column 31 in present specification not only possesses in traditional cabinet outside the function of mainboard support column 31, also as dividing plate 3 is designed as the leading body of complete machine direct current negative pole/ground connection carrying by this ultra-thin PC mainframe box, and the installing hole of conventional mainboard 4 is the output direct current negative pole with mainboard 4 and Earth Phase connects, conduction screw or bayonet lock are fixed in the mainboard support column 31 on dividing plate 3 by mainboard installing hole 47, namely achieve the output direct current negative pole/ground connection of mainboard 4 and directly connecting of dividing plate 3.
02) there is the dividing plate 3 of stealthy circuit
Foregoing circuit is the maximum gauge≤0.5mm of flat conductor circuit and conductor, mutually insulated between flat conductor circuit and dividing plate 3, flat conductor circuit apparent height is not higher than the height on dividing plate 3 surface about, and except the region of mounting receptacle, other whole circuit surfaces have the covering of insulation and wearing layer.All parallel on the two sides of dividing plate 3 it is mounted with much hardware, the most of cabling being connected between each hardware, adopt above-mentioned very flat conductor circuit to be covered on dividing plate 3 surface or be embedded in dividing plate 3, carry out densely arranged, concentration cabling, efficiently solve the signal between each hardware, electrical transfer, again arrange each hardware, be greatly reduced the volume of cabinet.
Dividing plate 3 is the glass fibre/half embedded dividing plate of fiberglass-based printed circuit 3, metal base printed circuit board, the FPC flexible cord embedded dividing plate 3 of row, the embedded dividing plate 3 of ultrathin insulating copper sheet or Metal Substrate conductive coating circuit dividing plate 3.Can provide for each hardware and the fixing platform supported is installed.
Preferably, dividing plate 3 is the embedded dividing plate 3 of the fiberglass-based printed circuit of glass fibre/half, wherein glass fibre/half glass fibre is substrate, it is fabricated to meet the fiberglass-based PCB of glass fibre/half of the wiring of designing requirement and physical form, dividing plate 3 is the metal plate of aluminium alloy or copper material, the position of one side or double-sided design on dividing plate 3, process and the groove of corresponding PCB shape and size thickness equity mutually, PCB is closely covered in groove corresponding on dividing plate 3, PCB surface and its place dividing plate 3 surface is made to be in same plane height.Owing to the strap circuit on dividing plate 3 and dividing plate 3 fit tightly one, outside the pad of this circuit, contact point, whole circuit surface has carried out the covering treatment of insulating barrier and wearing layer, so the circuit being hardly visible on dividing plate 3, admittedly be called " stealthy circuit dividing plate 3 ".Strap circuit on stealthy circuit dividing plate 3, hereinafter referred to as " dividing plate circuit 32 ".Whole of the dividing plate 3 of embedded PCB carries out insulate, the covering of wearing layer.
Concrete operating process is, dividing plate 3 processes the groove of deep 0.1～1mm, the position of groove, shape, size are determined according to the real needs of cabling, again ultra-thin printing integrated PCB circuit board is filled so far in groove, dividing plate 3 groove and PCB surface all carry out insulation and paint process, by binding agent by seamless for PCB dividing plate 3 groove being fastened on correspondence.After fastening is good, basic and place the dividing plate 3 plate face of PCB apparent height is highly consistent, finally again what fastened, whole of the dividing plate 3 of embedded PCB carries out insulate, wear-resisting coating, such dividing plate 3 and PCB surface are just integrated, are also hardly visible the circuit of the inside.
It is contemplated that dividing plate 3 back side is with greater need for heat conduction and heat radiation, adding simplification design, technique, PCB is embedded in the front of dividing plate 3 by unification.
Preferably, dividing plate 3 is the embedded dividing plate 3 of ultrathin insulating copper sheet, namely with etching, CNC mill processing or the integrated technique of mould, the groove that the band of position of cabling will be needed on metal plate (dividing plate 3) to be processed into required shape, size.Shear technique with etching or mould punching and the copper sheet that thickness is 0.05～0.5mm thickness be fabricated to the various cablings of design again, and these copper cablings densely arranged after outermost profile specification match with this metal plate (dividing plate 3) shape of upper groove, size.By the ultra-thin copper sheet cabling after the groove on metal plate (dividing plate 3) and processing, surface carries out insulation processing, finally by binding agent, ultrathin insulating copper sheet cabling is closely embedded in the upper corresponding groove location of metal plate (dividing plate 3), and the apparent height of ultra-thin copper sheet cabling is not higher than the apparent height of metal plate about (dividing plate 3).This process program is adapted at the circuit trace of the upper design arrangement super-high-current of metal plate (dividing plate 3).
Preferably, dividing plate 3 arranges embedded dividing plate 3 for FPC flexible cord, and the circuit material except embedding is except FPC flexible cord row, and other techniques being embedded in dividing plate 3 are basically identical with above-mentioned " the embedded dividing plate of the fiberglass-based printed circuit of glass fibre/half 3 ".
Preferably, dividing plate 3 is Metal Substrate conductive coating circuit dividing plate 3, namely it is coated with insulating barrier in metal surface, it is coated with the electrically-conducting paint of liquid/colloidal state/powder on the insulating layer again and is drawn as required cabling circuit, then through air-dry or high temperature post cure, form firm conducting channel coating, finally carry out again insulating on whole circuit dividing plate 3, the covering (except the regional area of connecting partition socket) of wearing layer.Coating and technique used by this scheme all compare partially expensive.
Dividing plate 3 is identical material with metal shell or the skeleton of computer housing and is integrally formed, and is made of one piece after material hot melt or extruding by mould.The metallic framework of dividing plate 3 and computer housing or shell can also be that separation is independent, are welded and fixed between dividing plate 3 and cabinet metallic framework or outer casing inner wall.Because dividing plate 3 is connected with cabinet metal shell, touch heat conduction, heat radiation support that the hardware being arranged on dividing plate 3 surface provides good for parallel patch.In above-mentioned " metal shell of cabinet " i.e. figure " mainframe box shell 1 ".
Having the technology mode that the dividing plate 3 of metal hidden circuit and mainframe box metal shell or skeleton be fixedly linked is: integral type, namely dividing plate 3 and mainframe box metal shell or skeleton are identical material, one, with mould by integrally formed after material hot melt or extruding.Again the dividing plate 3 in mainframe box after shaping carries out processes, make on dividing plate 3/in be placed with the ultra-thin circuit trace of design；Reflow Soldering, dividing plate 3 and cabinet metallic framework or shell are that separation is independent, on dividing plate 3/the interior ultra-thin circuit trace first having processed design, afterwards dividing plate 3 to be connected fixing position with cabinet metallic framework or outer casing inner wall, first it is coated with and wipes solder, after combinations matches is good, places into and refluxing unit carries out reflow soldering.Out after cooling, dividing plate 3 is just tightly fastened mutually with cabinet metallic framework or shell.
03) dividing plate socket
nullDividing plate socket directly welds or pastes on the circuit touching the dividing plate 3 being connected to correspondence，The hardware interface type of dividing plate socket includes SATA2.0 data-interface、SATA3.0 data-interface、SATAExpress hard disk 203 interface、SAS hard disk 203 interface、SATA7+15pin data+power supply hard disk 203 interface、SATA7+6pin data+power supply CD-ROM drive 204 interface、The starting up contact pin POWERSW of mainboard 4、Mainboard 4 restart contact pin RESETSW、USB3.019/20pin socket、USB2.09pin socket、The audio frequency contact pin HDAUDIO of mainboard 4、The PCI-E16X slot of display card 7、The main power supply 24pin slot of mainboard 4、The auxiliary power supply 4/8pin slot of mainboard 4 and the auxiliary power supply 6/8pin slot of display card 7,Or the combination in any of above-mentioned hardware interface.Some hardware in mainframe box can be inserted directly in dividing plate socket and use, and hardware is connected with corresponding dividing plate socket by then needing of having by FFC line row, so, dividing plate socket, in order to match be connected with crowd's hardware, has different interface types and geomery.Hardware in mainframe box is docked with corresponding dividing plate circuit 32 phase by dividing plate socket according to the interface type of different hardware.The advantage of FFC line row be ultra-thin flexible, precisely, can mistake larger current, it is adaptable to dividing plate socket is short-range with between hardware to be docked.
" dividing plate socket " in above-mentioned literary composition is the general designation of following " welding type/fixed dividing plate socket " and " movable mode clapboard socket ".
According to the arrangement in cabinet and design requirement, dividing plate socket is divided into welding type and movable.Welding type, the bottom ordered arrangement of " dividing plate socket " stitch corresponding to this socket (pin), the corresponding installation site of dividing plate circuit 32 there is pad, the stitch (pin) of " dividing plate socket " bottom is directly fixedly welded in the weld locations of dividing plate circuit 32 of correspondence.Welding type dividing plate socket is also referred to as fixed dividing plate socket 34.
Movable, the bottom ordered arrangement of " dividing plate socket " stitch corresponding to this socket (pin), and these stitch (pin) exist with the form of exposed conducting metal shell fragment 104, the periphery at " dividing plate socket " bottom metal shell fragment 104 has several alignment pins 94.Movable mode clapboard socket 35 is generally used for same dividing plate 3 position can install the design of different hardware, namely when not increasing cabinet volume, increases the hardware quantity and type that can support extension in cabinet.
The region being used for installing " movable mode clapboard socket 35 " on dividing plate circuit 32 is concave shaped structure 33, and in recessed area, ordered arrangement exposed conduction, smooth circuitry contacts, and described " circuitry contacts " is " the concave shaped contact point 33 " in figure.The dividing plate 3 of neighboring, recessed area has several holes 36, location, and these location sizes in hole 36, quantity, pitch-row are completely the same with the alignment pin 94 of " the movable mode clapboard socket 35 " bottom matched.
When the bottom of movable mode clapboard socket 35 is to during to installation region on dividing plate circuit 32, only when the movable mode clapboard socket 35 of this interface type and the circuitry contacts arrangement specification in recessed area on dividing plate circuit 32, circuit definitions, when socket direction matches completely, alignment pin 94 bottom movable mode clapboard socket 35 just can be inserted in the hole, location 36 on this limit, dividing plate circuit 32 recessed area, finally by screw/expansion bayonet lock, movable mode clapboard socket 35 is fixed on dividing plate 3, now the conducting metal shell fragment 104 of " movable mode clapboard socket 35 " bottom is complete with the circuitry contacts in recessed area on dividing plate circuit 32, precisely patch touches connection one by one mutually.Owing to the movable mode clapboard socket 35 installation position on dividing plate circuit 32 is one piece of concave shaped region, recessed area has exposed circuitry contacts, when same position is mounted with other hardware, the apparent height of the exposed circuitry contacts in recessed area is lower than the height on perimeter walls 3 surface, so short circuit will not be produced because touching other hardware.When not using this recessed area, this recessed area is filled and led up by available supporting insulating pad, plays isolated insulation and dust-proof effect.
In brief, the bottom ordered arrangement of dividing plate socket the pin that this socket is corresponding, the corresponding installation site of dividing plate circuit 32 has pad, the pin bottom described dividing plate socket are directly fixedly welded on dividing plate circuit 32 position of correspondence；Or the bottom ordered arrangement of dividing plate socket the pin that this socket is corresponding, and these pins exist with the form of exposed conducting metal shell fragment 104, the periphery of the described shell fragment 104 bottom dividing plate socket is provided with alignment pin 94, the region being used for installing described dividing plate socket on dividing plate 3 is concave shaped structure, in recessed area, ordered arrangement exposed conduction, smooth circuitry contacts, the dividing plate 3 of neighboring, recessed area is provided with hole 36, corresponding location, dividing plate socket is fixed on dividing plate 3 by screw/expansion bayonet lock, conducting metal shell fragment 104 bottom dividing plate socket and the circuitry contacts in recessed area on dividing plate 3 be the precisely tactile conducting of patch one by one.
Some hardware can be inserted directly in " dividing plate socket " and use in mainframe box, such as 3.5 cun, 2.5 cun hard disks 202, because it be relatively often substitute the hardware used, so can the design that uses of straight cutting, very fast hommization.Those cannot be inserted directly in " dividing plate socket " hardware used, then adopt the theory that line of shortest length journey connects, and with flexible cord, these hardware are docked mutually by row with " the dividing plate socket " of coupling, cabling between hardware is also greatly reduced, makes succinct in complete machine, attractive in appearance.
04) mainboard 4 towards
From the above mentioned, mainboard 4 is to lean against dividing plate 3 front, on the parallel mainboard support column 31 being fixed on dividing plate 3 front.Because mainframe box is upright type of design, on the one hand considers that the center of gravity of complete machine to move down as far as possible, and mainboard 4 is substantially laid particular stress near one end of CPU position, place the overall decentralization that can make mainframe box down, make mainframe box more steady in vertical；On the other hand, mainframe box is vertical, its interior air hot-fluid is constantly upwards ascension, converge in upper strata, space in mainframe box, relative to upper strata air-flow, the temperature of mainframe box inferior airflow is on the low side, so placing down near the mainboard 4 the North limit of CPU, advantageously in cpu heat 6 radiating effect in the gas flow.
Therefore, will be close to the mainboard 4 the North limit of CPU position down (can be vertical, also can downwardly direction with vertical between angle≤5 °), the western end edge of mainboard 4 (i.e. one end of mainboard I/O interface group 41) is towards the afterbody 13 of cabinet, mainboard 4 back side is to dividing plate 3 front, being parallel to dividing plate 3 and be fixed on mainboard support column 31.Due to the arm of angle position between the North limit and western end edge of mainboard 4, there is a mainboard auxiliary power supply slot 46, with the principle that cabling nearby connects, project to the region on dividing plate 3 front on mainboard 4 the North limit, on dividing plate 3 front position of this mainboard auxiliary power supply slot 46, have a dividing plate socket.The bottom stitch (pin) of this dividing plate socket is connected respectively in order with the output+12VDC in dividing plate circuit 32 and direct current negative pole (ground connection), connected with mainboard auxiliary power supply slot 46 insertion on mainboard 4 by one, wire, the other end of wire inserts the connection of this dividing plate socket, makes power supply circuits corresponding on dividing plate 3 be connected with the mainboard auxiliary power supply slot 46 on mainboard 4.
That is, mainboard 4 is to lean against dividing plate 3 front, near CPU position mainboard 4 the North limit down, one end of the western end edge of mainboard 4 and mainboard I/O interface group 41 towards the afterbody of cabinet,
The region on dividing plate 3 front is projected on mainboard 4 the North limit, a dividing plate socket is had on dividing plate 3 front position of the auxiliary power supply slot of mainboard 4, the bottom stitch of described dividing plate socket is connected with dividing plate circuit 32, connected with mainboard auxiliary power supply slot 46 insertion on mainboard 4 by one, wire, the other end of wire inserts the connection of this dividing plate socket, makes power supply circuits corresponding on dividing plate 3 be connected with the mainboard auxiliary power supply slot 46 on mainboard 4.
05) fixing device for installing of the radiator of CPU and cpu heat
The radiator of this computer CPU includes CPU attached heat sinks 64 and cpu heat 6, cpu heat 6 has support by a H type bridge clinching to be fixed, that is the fixing device for installing of this cpu heat, H type bridge clinching tool support includes two sliding bars 52, article two, sliding bar 52 centre portion is in the state being parallel to each other, article two, sliding bar 52 both ends all bend, outward in 45 ° of angles, the section of the bending at two sliding bar 52 both ends is respectively arranged with one can on this section the support column 51 of movement, there is an expansion clamp support column 51 bottom, this expansion clamp size, shape is to match with cpu heat 6 installing hole on mainboard 4.So, article two, the two ends of sliding bar 52 bending have 4 moveable support columns 51, mainboard 4 due to different model, pitch-row between its 4 cpu heat 6 installing holes is also different, so the support column 51 at sliding bar 52 two ends is designed to movably, just meeting the pitch-row demand between various different cpu heat 6 installing hole, the installation that matches is fixing.H type bridge clinching tool support is exactly aforementioned fastener 5.Support column 51 is also referred to as fastener support column.
The section that two sliding bar 52 mesophase spherule are parallel is provided with a bridge depression bar 53 that can move freely on the bar direction of principal axis of two sliding bars 52, described bridge depression bar 53 centre portion is inner groovy structure, and wherein said two sliding bars 52 be resilience material member or bridge depression bar 53 is resilience material member.Owing to the sliding bar 52 in this fastener 5, bridge the depression bar 53 even bulge-structure at the heat-conducting base back side are rebound characteristics material, heat-conducting base will be caused excessive with the change of the heat conductivity of cpu chip 42 interfacial contact because stress when artificially fastening is excessive or unbalanced, be not easy to make mainboard 4 bending.Described two sliding bars 52 constitute described " H " type structure together with combining with bridge depression bar 53, so the fastener 5 of CPU is called " H type bridge clinching tool support ".
One of CPU attached heat sinks 64 is flat straight vacuum thermal pipe evaporation ends, other end is the vacuum thermal pipe condensation end being welded with (CPU) radiating fin 63, section between these two ends of CPU attached heat sinks 64 is processed into corrugated tube shape, being greatly improved the bendability of (CPU) vacuum thermal pipe 62, user installation gets up to be more prone to operation and adapts to different types of mainboard 4.The bottom of the condensation end of CPU attached heat sinks 64 is smooth, paste to touch by screw or buckle and be fixed on cabinet metal shell inwall nearest for distance CPU, thus the partial heat of CPU heat-conducting base 61 being delivered on cabinet metal shell and the radiating fin of CPU attached heat sinks 64 condensation end dispelling the heat.
Cpu heat 6 is vacuum thermal pipe formula radiator, and a heat-conducting base is arranged at the bottom of cpu heat 6, is arranged on cpu chip 42.On the heat-conducting base edge of cpu heat 6, one is had to move towards perpendicular groove with the vacuum thermal pipe of arrangement on heat-conducting base, and the shape size of this groove just matches with the evaporation ends of CPU attached heat sinks 64, the evaporation ends of CPU attached heat sinks 64 coordinates after in the groove snapping in heat-conducting base edge, with cover plate and fastened by screw on heat-conducting base edge.The front of heat-conducting base is that direct parallel patch is touched on cpu chip 42 surface.And the approximate centre position at the back side of heat-conducting base has a bulge-structure, the indent sliding-rail groove of bridge depression bar 53 centre portion can just clasp this bulge-structure, bridge depression bar 53 is positioned on the heat-conducting base back side.Owing to the bridge depression bar 53 in fastener 5 passes through the bulge-structure of center, the heat-conducting base back side, the downforce produced when being fastened by fastener 5 concentrates the central area acting on heat-conducting base, so make the stress of contact surface between heat-conducting base and cpu chip 42 very uniform, make the heat conductivity between them stable.
Heat-conducting base is to clasp the bulge-structure at its back side by bridge depression bar 53 to be close on cpu chip 42, and bridge depression bar 53 is to be movably fixed on two sliding bars 52, article two, sliding bar 52 is to be respectively clamped on mainboard 4 in 4 cpu heat 6 installing holes by the dop on movable support column 51, finally expansion anchor 54 is inserted in the pin-and-hole in supporting, thus whole fastener 5 support is fastened on mainboard 4 together with cpu heat 6.Owing to heat-conducting base back side bulge-structure can move in bridge depression bar 53 indent sliding-rail groove, bridge depression bar 53 can move again on sliding bar 52, so whole cpu heat 6 can the translation of little scope on any direction in mainboard 4 plane, greatly reducing because conflict mutually in accessory position first on mainboard 4, cpu heat 6 edge can not the probability of normal mounting.
What CPU attached heat sinks 64 adopted is movably arranged mode, and whether user can install by unrestricted choice according to demand, without changing whole cpu heat 6, is greatly saved the financial expenditure of user.Although mainframe box volume is little, but make use of the metal shell of cabinet cleverly, part CPU heat is quickly delivered on shell and dispels the heat, considerably increase the effective area of heat radiation.
Owing to fastener 5 support many places adopt movable Fixed Design, almost compatible all conventional mainboard 4 models, fastener 5 accessory is few, lightweight, and disassembling operations is extremely convenient, within free-hand 10 seconds, just can complete dismounting.
Further, the bottom 12 of this ultra-thin PC mainframe box shell has the air intake opening of an elongated strip shaped, both added the air-flow exchange around chassis backplane；Again because of this long opening, hinder greatly the heat on the chassis backplane region in the positive space of planes of dividing plate 3 be delivered to the chassis backplane region of dividing plate 3 backside space and dividing plate 3 from, so that patch is touched the heat that the CPU attached heat sinks 64 on the chassis backplane being arranged in the positive space of planes of dividing plate 3 passes over and can be more quickly entrained by the flow of air, it is not transferred to again other positions of cabinet and affects the heat radiation of other hardware.
06) inwall extension socket 205
Described computer housing is vertical, mainboard 4 is placed downwards near one end of CPU and mainboard 4 the North limit, limit, mainboard 4 south is upwards, casing inwall near limit, mainboard 4 south is the top inner wall of cabinet, this inwall is vertically above in the strip region of mainboard 4 front 15～45mm, activity is mounted with the socket of a strip, constitute cabinet inwall extension socket 205, described inwall extension socket 205 includes three kinds of interfaces, DC+5V, the power supply interface of direct current negative pole, 7+6pinSATA CD-ROM drive 204 interface and 7+15pinSATA hard-disk interface.
Described inwall extension socket 205 adopts strip PCB to concentrate cabling, strip PCB fits tightly cabinet inwall, circuit board section extends to the edge in dividing plate 3 front, and the circuit corresponding with on dividing plate 3 of the circuit on strip PCB extension docks mutually one by one, fixing by welding connection.Pin bottom above-mentioned interface socket is movably fixed on circuit corresponding in strip PCB by being welded and fixed or paste to touch, paralleling towards with 3, dividing plate of its jack interface.
Considering this computer hardware of CD-ROM drive 204, major part user uses frequency very low, so " inwall extension socket 205 " being designed to of hommization is movable mounted, user can choose whether to install according to the user demand of oneself.
But notebook CD-ROM drive 204 or 2.5 cun of hard disks 202 insert when being arranged in inwall extension socket 205, and notebook CD-ROM drive 204 or 2.5 cun of hard disks 202 are parallel to mainboard 4, and are positioned at empty position on the near zone of limit, mainboard 4 south.Consider practicality, notebook CD-ROM drive 204 enter dish mouth before mainframe box.Efficiently make use of the free space in overhead near limit, mainboard 4 south dexterously, owing to notebook CD-ROM drive 204 and 2.5 cun of hard disks 2,020 points are light little, caloric value is very low, so the center of gravity of whole cabinet and the impact of heat radiation almost can be ignored.Additionally, due to mainboard 4 has a lot of contact pin, slot and cabling on limit, the south, affect attractive in appearance, be just installed in parallel in 204,2.5 cun of hard disks 202 of notebook CD-ROM drive in this overhead, position of mainboard 4, it is possible to shelter from dexterously, make the arrangement of cabinet entirety more attractive in appearance.
07) mainboard I/O baffle plate dividing plate draw-in groove 16
In the western end edge of mainboard 4, mainboard 4 edge section at I/O interface group place projects to the position on dividing plate 3 and is provided with mainboard I/O baffle plate dividing plate draw-in groove 16, described draw-in groove is for having a seam width about 1mm, stitch the straight groove/slit of deep 2～3mm, the overall dimensions of fluting/perforate >=mainboard I/O baffle plate 208(mainboard 4 backboard) overall dimensions, before mainboard 4 is loaded mainframe box, first by mainboard I/O baffle plate 208(mainboard 4 backboard) a long limit snap onto in this dividing plate 3 grooves/slit, again by whole mainboard I/O baffle plate 208(mainboard 4 backboard) snap in mainboard I/O baffle plate 208(mainboard 4 backboard to cabinet afterbody) fixing in the perforate that matches.What adopt due to this mainframe box is limit ultrathin design concept, in order to by mainboard 4 in the chassis needed for the height space that takies be preferably minimized, therefore by mainboard I/O baffle plate 208(mainboard 4 backboard) near mainboard 4 back side while snapping onto in the fluting of dividing plate 3, and mounting means is equally simple and direct with traditional cabinet.
Display card 7 that the hardware installed in the space at dividing plate 3 back side includes comprising radiator, power pack 9, turbofan 201, hard disk 203, Power entry module 10 and be all that parallel patch is touched and is arranged on dividing plate 3, touch, due to parallel patch, the multiple hardwares being arranged on dividing plate 3 back side and heat radiation is had certain demand, so dividing plate 3 back side is except installing, with power pack 9, dividing plate socket, Power entry module 10, concave shaped dividing plate circuit 32 contact point matched, the surface in other regions, dividing plate 3 back side is to present with metal plate smooth, heat conduction.Concrete structure is as follows:
08) display card 7
Display card 7 parallels setting with dividing plate 3 back side.This ultra-thin computer housing can install all overall heights of support, half height, overlength, powerful display card 7.I/O interface on described display card 7 and the I/O interface on mainboard 4 are towards identical, I/O interface area position on display card 7 and mainboard 4PCB edges of boards stagger along portion, mainboard 4PCB edges of boards are along the pcb board edge portion for being provided with I/O interface, and namely the western end edge of mainboard 4 is along portion.Above-mentioned " the I/O interface on display card 7 " is in figure " display card I/O interface group 71 ", and above-mentioned " the I/O interface on mainboard 4 " is in figure " mainboard I/O interface group 41 ".
Display card 7 is installed in parallel in mainboard 4 back side and includes following 2 kinds of forms:
1. formula is dissipated in: between display card 7 with mainboard 4, have the dividing plate 3 of heat-conducting one piece parallel, on display card 7 relative with dividing plate 3 plate face equipped with the one side of radiator, and the pcb board face of display card 7 is near the shell side panel of computer housing, i.e. the one side of slip lid 2 in Figure 13.In described " pcb board of display card 7 " i.e. figure " display card pcb board 70 ".The end edge of the pcb board residing for I/O interface group 71 on display card 7 I/O interface towards direction on to protrude from the distance of pcb board place end edge 15～40mm residing for the I/O interface group on mainboard 4.Adopt the mode paralleled, closely dispose between mainboard 4 with the pcb board card of display card 7, greatly reduce the spatial volume taken.
Specifically, one piece of metal plate is had to exist between display card 7 and mainboard 4, namely the parallel installation of the one side of metal plate is mainboard 4, mainboard 4 back side is to metal plate, the parallel installation of another side of metal plate is display card 7, display card 7 has faced by the one of GPU chip 72 to metal plate, and display card 7 is the back side being placed in parallel in mainboard 4 near south edge regions.
From the above mentioned, display card 7I/O interface with mainboard 4I/O interface towards consistent, and they I/O interfaces towards direction on, the pcb board edge at display card 7I/O interface place to protrude from the distance of the pcb board edge 15～40mm at mainboard 4I/O interface place, outside the I/O interface area part translation on display card 7 to the western end edge of mainboard 4.And there is no dividing plate 3 between the above-mentioned display card 7I/O interface area part protruded from outside the western end edge of mainboard 4 and mainboard 4.Owing to the I/O interface of middle and high end display card 7 is double-deck mostly, it is contemplated that should completely compatible all video cards, the spatial volume taken again is minimized, therefore cleverly by outside the I/O interface area part translation on display card 7 to the western end edge of mainboard 4.Plus the obstruct not having dividing plate 3 between display card 7I/O interface area part and mainboard 4, so no matter the I/O interface of display card 7 is monolayer or bilayer, does not affect its installing and using in cabinet, has reached the compatibility equally good with tradition cabinet.Display card 7 is connected by the card slot 43 that adapter or prolongation winding displacement are corresponding with on mainboard 4.
2. outer dissipate formula: on display card pcb board 70 can not the one side (back side) of installation of heat radiator towards mainboard 4 back side, not necessarily having dividing plate 3 to exist between mainboard 4 and display card 7, the pcb board edge at display card 7I/O interface place is also not necessarily intended to the pcb board edge protruding from mainboard 4I/O interface place.Display card 7 is connected by the card slot that adapter or prolongation winding displacement are corresponding with on mainboard 4.Adopt the mode paralleled, closely dispose between mainboard 4 with display card 7, greatly reduce the spatial volume taken.The maximum advantage of this mode is to reequip radiator and the fan 201 of display card 7, uses radiator and the fan 201 of display card 7 first wife, and this mode compatibility is fine.The chassis space ratio " interior scattered formula " that shortcoming takies needed for being is bigger.
09) formula display card radiator 8 is dissipated in
The radiator installed on display card 7 is provided with vacuum heat conduction pipe 82 and heat-conducting base 81, vacuum heat conduction pipe has evaporation ends and condensation end, the evaporation ends of all vacuum thermal pipes on described radiator is directly or indirectly affixed tactile with the GPU chip 72 of display card 7, and the condensation end of the part or all of vacuum thermal pipe patch direct or indirect with dividing plate 3 or cabinet metal shell inwall is tactile.In described " cabinet metal shell " i.e. figure " mainframe box shell 1 ".
Described display card radiator 8 generally flat radiator, takies volume only small.It includes parallel spaced aluminum matter or 83,2～8 described vacuum thermal pipes of copper radiating fin and 1～2 described heat-conducting base.The main part of aluminum matter or copper radiating fin composition flat radiator, flat radiator is installed in parallel on display card 7 or on dividing plate 3 back side, heat-conducting base is located at the front of radiator, arranging on the surface at the back side of radiator the condensation end of flat described vacuum thermal pipe, the evaporation ends of described vacuum thermal pipe fits tightly mutually with copper or aluminum matter heat-conducting base.It is semiarc shape or flat that the condensation end of vacuum thermal pipe is squeezed into cross section by mould, is fitted tightly on fin, and described radiator back side upper half arc/flat vacuum thermal pipe condensation end also parallel patch is touched and carried out heat conduction on dividing plate 3 back side.
Or described flat radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends and condensation end, the evaporation ends of all vacuum thermal pipes fits tightly all in an orderly manner or is embedded on described heat-conducting base, the condensation end of vacuum thermal pipe is squeezed into cross section for " D " shape by mould, namely flat one side is formed at described vacuum thermal pipe condensation end, and this flat one side parallels with the back side of described radiator, and the part of the non-flat one side that the vacuum thermal pipe condensation end of described " D " shape is formed combines with the radiating fin of described radiator and is fixed on the back side of described radiator.When the parallel installation in the back side of described flat radiator or patch are touched in separator face, the vacuum thermal pipe condensation end of described " D " shape forms flat one side and parallel patch is touched and carry out heat conduction in separator face.
Owing to this radiator closely pastes tactile with dividing plate 3 or cabinet metal shell inwall by the condensation section of vacuum thermal pipe cleverly mutually, and display card radiator fan 201 is not mounted within radiator, additionally do not take the volume of radiator, so considerably increasing the actual area of dissipation of display card 7.Further, dividing plate 3 and cabinet metal shell that its heat radiation utilizes inherently exist, and are also greatly saved the quality of material cost and graphic card radiator.
Radiator is integrally fixed at the display card 7 installation site region at described dividing plate 3 back side, described radiator is provided with one or more heat-conducting base, the evaporation ends of described heat-conducting base and vacuum thermal pipe closely cooperates installation mutually, the condensation end of vacuum thermal pipe is processed into flat, being fitted on dividing plate 3 back side closely or on the inwall of cabinet metal shell, neat parallel spaced radiating fin is fitted on dividing plate 3 back side or the cabinet metal shell inwall of flat vacuum thermal pipe.
Particularly as follows: because display card 7 has the one side of GPU chip 72 parallel to dividing plate 3, there is a segment distance space towards between the one side and dividing plate 3 of dividing plate 3 in display card 7, is provided with display card radiator 8 in this space.Radiating fin in radiator is parallel spaced-apart every arrangement, and is perpendicular to the strip radiating fin on dividing plate 3 and between geographical vertical direction in certain slanted angle.Closely patch is tactile mutually for the heat-conducting base of radiator and GPU chip 72 surface of display card 7, and " evaporating region " in vacuum thermal pipe is closely embedded in heat-conducting base；" the condensation section " of vacuum thermal pipe another part is distributed between dividing plate 3 back side and radiating fin, and fits tightly mutually with dividing plate 3, radiating fin.Or be distributed on video card cabinet metal shell inwall nearby, fit tightly mutually with outer casing inner wall.
I.e. heat in display card 7GPU chip 72, absorbed heat by " evaporating region " of the heat-conducting base conduction to vacuum thermal pipe of being close to its surface, it is transferred to rapidly " condensation section " by " evaporating region " again, by closely patch is touched mutually with " condensation section " radiating fin, dividing plate 3 or cabinet metal shell is large-area carries out heat exchange with air, reach cooling purpose.
10) fixed form between formula display card radiator 8 and display card 7 is dissipated in
Due to " interior scattered formula display card radiator 8 ", hereinafter referred to as " graphic card radiator "." video card " in following is in figure " display card 7 ", and " cabinet cover plate/cover plate " hereinafter is in figure " slip lid 2 ", and " pcb board of display card 7 " is in figure " display card pcb board 70 ".Design according to mainframe box and user's request, be divided into 2 kinds of forms:
Movable: graphic card radiator is first correctly installed with display card pcb board 70 after fixing, then is relatively fixed in the card slot of the golden finger socket insertion cabinet backside space of video card, and now graphic card radiator is parallel with dividing plate 3 back side touches.Paste/install the dielectric resilience silicagel pad 206 of coupling again in the center at the GPU chip 72 upright projection so far video card pcb board back side of display card 7, after cabinet cover plate advances casing by the chute in cabinet, due to the size being smaller than flexible silicon rubber cushion 206 between the pcb board of cover plate and display card 7, flexible silicon rubber cushion 206 produces resilient pressure after being squeezed and acts perpendicularly to display card pcb board 70 back side.Again owing to being fixing between graphic card radiator and display card pcb board 70, so the pressure of this generation finally makes graphic card radiator be close on dividing plate 3 surface.Reach a part of heat in graphic card radiator efficiently to conduct and dispel the heat to dividing plate 3.
Fixed: graphic card radiator is first parallel to be mounted on cabinet backside space corresponding dividing plate 3 position, and now " the condensation section " of the vacuum thermal pipe 82 in radiator fits tightly mutually with dividing plate 3 surface or cabinet metal shell inwall.Paste/install the dielectric resilience silicagel pad 206 of coupling again in the center at the vacant display card 7GPU chip 72 upright projection so far video card pcb board back side.
Vacant display card 7 is had faced by the one of GPU chip 72 to graphic card radiator, golden finger interface on display card 7 being correctly inserted in the card slot of coupling and be relatively fixed, now the GPU chip 72 of display card 7 is pressed close to heat-conducting base 81 phase of graphic card radiator.After only cabinet cover plate need to being advanced casing by the chute in cabinet, due to the size being smaller than flexible silicon rubber cushion 206 between the pcb board of cover plate and display card 7, flexible silicon rubber cushion 206 produces resilient pressure after being squeezed and acts perpendicularly to display card pcb board 70 back side.Center, GPU chip 72 back side on display card 7 is subject to vertical after the actuating pressure in dividing plate 3 direction, and GPU chip 72 surface is paralleled with graphic card radiator heat-conducting base 81 front, fitted tightly.
Display card 7 reached on the ease installed with fixed graphic card radiator historical fast, almost within one second, install.Owing to GPU chip 72 is its center back position stress, GPU chip 72 surface can be fitted on heat-conducting base 81 surface of graphic card radiator smoothly, making GPU chip 72 reach nature with the active force of 81 between heat-conducting base balanced, user does not again worry affecting its heat-conducting effect as when installing traditional heat sinks because of 4 screw discontinuity equalizations.
11) power pack 9
Power pack 9 is ultra-thin patch touch power pack 9, it is provided with bottom surface 91, end face and side, it is additionally provided with the input port of power supply and the output port 92 of power supply, the transmission structure that the output port 92 of described power pack 9 is conducted after being provided with directly corresponding with on the dividing plate 3 in computer housing circuit pressurized, is absent from third-party plug between the circuit corresponding on the dividing plate 3 in the output port 92 of described power pack 9 and computer housing, socket is attached.
The one side that power pack 9 patch parallel with dividing plate 3 surface is touched is set to the bottom surface of power pack 9, the bottom surface of power pack 9 has the contact copper sheet 93 of two groups of projection 0.5～3mm, the independent contact copper sheet 93 that on first group, ordered arrangement, its outside front is all unusual flat smooth, exposed conduction, and each contact copper sheet 93 front parallels with power pack 9 bottom surface, the back side of contact copper sheet 93 is all integrally fixed on one layer of dielectric resilience rubber, dielectric resilience rubber is fixed on again in power pack 9, and each contact copper sheet 93 back side is only connected with the positive pole DC12V output circuit in power pack 9.The positive area of each contact copper sheet 93 is at 0.2～1c；Second group of copper sheet is contact flat spring 104, is connected with VC220V circuit in power pack 9.And these two groups contact copper sheets 93 and power pack 9 bottom surface are mutually insulateds.The indent pressure contact matched is had on described dividing plate 3 back side and in power supply resettlement area, exposed contact circuit in indent pressure contact contacts 93 groups of phase one_to_one corresponding of copper sheet with power supply bottom surface projection, several holes 36, location are had in power supply resettlement area, described power pack 9 bottom surface is except the alignment pin 94 and conductive contact copper sheet 93 of protruding 0.5～3mm, whole face is all flat smooth, and power pack 9 bottom surface connects with the negative pole DC12V output circuit in power pack 9 and Earth Phase, described power pack 9 by fasten screw make the parallel patch of power pack 9 touch be fixed on dividing plate 3.
The existence form of the another kind of electrical transfer port of described power pack: the power input port of described power pack and output port of power source merge into an integrated port on the bottom surface of described power pack, being provided with the circuit of exposed conduction that can be directly corresponding with on described dividing plate in described integrated port by overlaying the contact copper sheet group mating conducting after touch mutually one by one, each contact copper sheet in described contact copper sheet group can have different circuit definitions and circuit corresponding with in power pack respectively is connected.The parallel patch in bottom surface of described power pack is touched and is installed to circuit region corresponding in described separator face.
The scheme that the form of to be below power pack 9 bottom surface output port 92 be metal clips 104 exists.
Power pack 9 is that parallel patch is tactile to be arranged on cabinet internal partition 3.The maximum one side of power pack 9 area is its bottom surface, is conducting metal material, and directly parallel patch with dividing plate 3 surface tactile.There is one " output port 92 " power pack 9 bottom surface.The metal clips 104 of some exposed conductions is arranged to row smooth, orderly in " output port 92 ", the bottom surface of these metal clips 104 and power pack 9 metal material is mutually insulated, and the apparent height of metal clips 104 to protrude from the surface 0.5～3mm of power pack 9 bottom surface.
Metal clips 104 in " output port 92 " be divided into area relatively big and area is less two groups.Power pack 9 has one " input port ", by inserting line trap, by the DC supply input power pack 9 of the municipal alternating current outside cabinet or coupling.A portion municipal administration alternating current is converted to stable direct current by power pack 9 and exports, and one group of metal clips 104 that wherein direct-flow positive pole is bigger with " output port 92 " inner area is connected, and direct current negative pole/ground connection is connected with the conducting metal bottom surface of power pack 9；On another part municipal administration alternating current one group of metal clips 104 that to be connected in " output port 92 " area less.
There is the alignment pin 94 of several protrusions in power pack 9 bottom surface, and dividing plate 3 is installed the dividing plate circuit 32 having a concave shaped on the region of power pack 9 and several holes 36, location, the dividing plate circuit 32 of concave shaped has exposed conduction, smooth circuitry contacts.And the alignment pin 94 of the metal clips 104 groups in " output port 92 " of described concave shaped dividing plate circuit 32 contact point and hole, location 36 and power pack 9 bottom surface and protrusion on dividing plate 3, dimensions, arrangement position, circuit definitions mate mutually completely.By power pack 9 bottom surface to it on the installation region of dividing plate 3, after matching by the alignment pin of power pack 9 bottom surface 94 hole, location 36 completely and on dividing plate 3, insert, with screw/expansion bayonet lock, power pack 9 is fastened on dividing plate 3.Now completely precisely coupling, one by one pressure touch connection to dividing plate circuit 32 contact point of the concave shaped that each group conducting metal shell fragment 104 in " output port 92 " bottom power pack 9 is corresponding with on dividing plate 3 mutually.Owing to power pack 9 is to be connected by dividing plate circuit 32 contact point of concave shaped on dividing plate 3, when not installing power pack 9 herein, after filling and leading up this recessed area with the insulating trip of coupling, at this locational space, other hardware can be installed.The multiple-effect collocation realizing same position space in cabinet utilizes.Simultaneously as extremely compact structure in power pack 9, add that employing is directly affixed with dividing plate circuit 32 and touch transmission power supply, without wire, power pack 9 spatial volume cabinet in shared by is greatly reduced.
Circuit definitions: consider that different user is different to the power demands of mainframe box, devise the installation site of two place's power packs 9 in cabinet, two power packs 9 can be installed simultaneously, used in parallel.Dividing plate 3 also has two corresponding concave shaped dividing plate circuit 32 contact points.Wherein with line trap, municipal administration alternating current is connected to " input port " of first power pack 9, the one group metal clips 104 less by its bottom surface " output port 92 " inner area is transmitted to dividing plate 3 on the contact point of second concave shaped dividing plate circuit 32 correspondence by dividing plate circuit 32, and second power supply box 9 is properly attached on second concave shaped dividing plate circuit 32 contact point.Namely municipal administration alternating current is input in second power supply box 9 by the contact point of second concave shaped dividing plate circuit 32 correspondence and converts required stable direct current to.In second power supply box 9, the direct-flow positive pole one group metal clips 104 bigger with " output port 92 " inner area after conversion is connected, and direct-flow positive pole is transferred to " Power entry module 10 " by contact point and dividing plate circuit 32 through second concave shaped dividing plate circuit 32 correspondence.
Direct current negative pole after power pack 9 internal conversion is to turn on to the conducting metal bottom surface of power pack 9.Known to upper, the bottom surface of power pack 9 is that parallel patch is tactile to be arranged on dividing plate 3, and the dividing plate 3 in cabinet is as the leading body of complete machine direct current negative pole/ground connection carrying.Therefore fit tightly between the metal bottom surface of power pack 9 and dividing plate 3 plate face, conduct electricity.Direct current negative pole on dividing plate 3 can be realized in the direct current cathode traces being transmitted back in power pack 9 of large area, big electric current by the conducting metal bottom surface of power pack 9.Why being designed to be delivered in dividing plate circuit 32 corresponding on dividing plate 3 the direct current output of power pack 9 directly against tactile, patch contacting surface is long-pending greatly, fit closely to be because it, it may be achieved big stablizing of electric current passes through.And, the direct current negative pole/ground connection in power pack 9, by touching with the large area of dividing plate 3 or cabinet metal shell inwall, closely patch, is not only communicated on dividing plate 3 by power pack 9 smoothly, also ingenious, solve the problem that power pack 9 dispels the heat efficiently.
Power pack 9 global shape is flat hexahedron, the maximum gauge≤31mm of power pack 9, wherein long≤150mm, wide≤110mm；Or length≤260mm, wide≤120mm, the input port of the power supply of described power pack 9 is input DC12V or VC220V, and the output port 92 of power pack 9 is output DC12V or VC220V.
Power pack 9 overall profile is flat cube, and concrete size, profile are depending on design requirement and watt level.
The radiating mode of power pack 9: this ultra-thin power pack 9 is compact due to internal structure, and thermal source is relatively concentrated.Power pack 9 shell large area adopts aluminum alloy material, by by the heater element in power pack 9 directly against contacting on aluminum alloy casing, or be connected on aluminum alloy casing with vacuum thermal pipe, major part heat be quickly transferred on power pack 9 metal shell.Touch on dividing plate 3 or part patch is touched on the inwall of cabinet metal shell because power pack 9 is close parallel patch, by dividing plate 3 or cabinet metal shell, add the ventilation in upper case and realize large area high efficiency and heat radiation.
12) Power entry module 10
The side that Power entry module 10 patch is touched on dividing plate 3 back side is set to bottom surface 102, described bottom surface is provided with " direct current input port 102 " and " direct current delivery outlet 103 ", " direct current input port 102 " and all in good order in " direct current delivery outlet 103 " arrange that some protrude from described contact copper sheet 93 high for bottom surface 0.5～3mm.These fronts contacting copper sheets 93 outside are all conductions smooth, exposed, and these back sides contacting copper sheets 93 inside are fixed on the elastic material part insulated mutually with other circuit, and described elastic material part is fixed on again in Power entry module 10.
Except the alignment pin 94 being externally provided with several projections of " direct current input port 102 " and " direct current delivery outlet 103 " on Power entry module 10 bottom surface, dividing plate 3 is installed the concave shaped circuitry contacts having " the direct current input port 102 ", " direct current delivery outlet 103 " with Power entry module 10 bottom surface and alignment pin 94 correctly to mate completely mutually on dimensions, locality, circuit definitions in the region of Power entry module 10 respectively and hole 36, location.Concave shaped circuitry contacts surface is exposed conduction, but with dividing plate 3 between insulate mutually, the corresponding respectively dividing plate circuit 32 of concave shaped circuitry contacts is connected.
Also incorporating temperature control module in described Power entry module 10, Power entry module 10 provides power supply and installation site space and/or circuit trace structure for temperature control module.
Structural circuit defines: the contact copper sheet 93 in " the direct current input port 102 " of Power entry module 10 bottom surface is connected with the direct-flow input circuit in Power entry module 10；Contact copper sheet 93 in " the direct current delivery outlet 103 " of Power entry module 10 bottom surface exports power supply from the direct current of the different output voltage values in Power entry module 10 respectively and is connected.And be independent between the contact copper sheet 93 of different circuit definitions and insulate, contact copper sheet 93 also insulate mutually with Power entry module 10 bottom surface.
Contact copper sheet 93 in " the direct current input port 102 " of described Power entry module 10 bottom surface matches after docking by the concave shaped circuitry contacts corresponding with on dividing plate 3, power pack 9 exports the direct current in aforementioned barriers circuit 32 import to reconvert in Power entry module 10 and become the direct current supply of the different magnitudes of voltage needed for each hardware device, again by the direct current supply of above-mentioned different magnitudes of voltage after each contact copper sheet 93 in " the direct current delivery outlet 103 " of Power entry module 10 bottom surface matches docking by the concave shaped circuitry contacts corresponding with on dividing plate 3, the direct current supply of above-mentioned different magnitudes of voltage is transmitted separately in the dividing plate circuit 32 of correspondence.
Centre portion at described cabinet internal partition 3 back side, on the dividing plate 3 dorsal edge position of casing front panel, Power entry module 10 is installed, and described Power entry module 10 incorporates the one or more sockets matched with one or more of class interface, dividing plate socket: 6/8pin display card auxiliary power supply slot 73, 24pin mainboard is main for electrical slot 45, turbofan 201 power supply interface, 7+15pinSATA hard disk 203 interface, SATAExpress hard disk 203 interface, SAS hard disk 203 interface, USB3.019/20pin socket, USB2.09pin socket, 7+6pinSATA CD-ROM driver interface.
The bottom surface of Power entry module 10 is smooth metal conductive materials except " direct current input port 102 " and " direct current delivery outlet 103 ", and the direct current output negative pole/grounded circuit in Power entry module 10 is connected with the metal bottom surface of Power entry module 10.Power entry module 10 is touched be fastened on cabinet internal partition 3 by screw or the expansion parallel patch of bayonet lock, and carries out bump contact conducting between dividing plate 3 surface.Plus above-mentioned Power entry module 10 also incorporates socket or the dividing plate socket that one or more hardware match, by wire or hardware is carried interface be inserted directly in the socket/dividing plate socket matched on Power entry module 10 connect.Therefore the direct current negative pole/ground connection of these hardware being connected with the socket/dividing plate socket integrated on Power entry module 10 is conducted on dividing plate 3 by the metallic conduction bottom surface of Power entry module 10.From the above mentioned it can be seen that dividing plate 3 is again because being affixed tactile with power pack 9 conducting bottom side, so final Power entry module 10 bottom surface is connected with power pack 9 bottom surface, namely both direct current negative pole/grounded circuits are connected to lead to.
Known to above-mentioned, because the unidirectional current that Power entry module 10 is the single magnitude of voltage sent by power pack 9 is again converted into the direct current supply of the different magnitudes of voltage needed for each hardware, adds and Power entry module 10 incorporates one or more socket/dividing plate sockets matched with hardware interface.Namely changing the direct current supply of each magnitude of voltage of output, part connection corresponding with the socket of integration/dividing plate socket these described respectively in Power entry module 10, corresponding electrical transfer is given in the hardware mated by the form again through wire or hardware straight cutting；The direct current supply of each magnitude of voltage of another part output, concave shaped dividing plate circuit 32 contact point matched on dividing plate 3 by " the direct current delivery outlet 103 " of Power entry module 10 bottom surface is respectively turned on to corresponding dividing plate circuit 32, docks mutually with the interface/slot of the computer hardware of required power supply respectively with the dividing plate socket of the described corresponding connection of dividing plate circuit 32 again.
Owing to Power entry module 10 bottom surface employs the large area press-contacting type conducting transmission structure identical with power pack 9 bottom surface structure principle so that the stable transmission of big electric current can be carried out between Power entry module 10 and dividing plate circuit 32.And Power entry module 10 also incorporates multiple hardwares interface socket and/or temperature control module so that it is structural design is high-efficiency compact more, makes the Power entry module after integration 10 have multi-functional integral type, it is simple to the dismounting of user and use.
13) intelligent temperature control system
Intelligent temperature control system it is provided with in computer host box, including manual adjustments switch 18, temperature control module, fan 201, temperature probe 37, manual adjustments switch 18 is placed on casing, it is easy to user operation use, temperature control module, fan 201 are positioned at cabinet desired position, temperature probe 37 is positioned towards the side of cpu heat 6 or graphic card radiator, and is in the leeward air channel of radiator air-flow, and temperature control module is connected with manual adjustments switch 18, fan 201, temperature probe 37 simultaneously.First the gear of manual adjustments switch 18 has just limited temperature control module and has exported the highest numerical value to fan 201 voltage and minimum numerical value section；Secondly temperature probe 37 belongs to a kind of critesistor, ambient temperature height residing for temperature probe 37 will change the resistance value of himself, the temperature control module being connected with temperature probe 37, numerical value according to temperature probe 37 feedback, export corresponding supply voltage to accurately in voltage section fan 201, thus reaching automatically to be changed the purpose of fan 201 rotating speed by temperature probe 37 monitor in real time ambient temperature.
Mainboard support column 31 formula temperature probe 37, has established a capital display card 7 owing to desktop computer differs, and the temperature of CPU more can objectively reflect the situation of change of complete machine temperature by contrast, it is therefore necessary to dispose a temperature probe 37 near cpu heat 6.
PCI-E slot on mainboard 4 and have individual mainboard installing hole 47 between memory bar slot 44, that mainboard support column 31 that this installing hole is corresponding on dividing plate 3 accordingly is connected and installed with temperature probe 37 described in, and this temperature probe 37 includes following 2 kinds of forms:
1. fixed, temperature probe 37 is overall, and in column, upper end is temperature probe 37 element, and size can be just passed through the mainboard installing hole 47 of correspondence；Lower end is the stitch of this temperature probe 37 element, it is fixed by welding on the dividing plate circuit 32 of correspondence, and temperature probe 37 entirety is perpendicular on dividing plate 3 front, the mainboard installing hole 47 being positioned on mainboard 4 between PCI-E slot with memory bar slot 44 maps corresponding position mutually on dividing plate 3 front；
2. movable, mainboard installing hole 47 mapping pair between mainboard 4PCI-E slot and memory bar slot 44 on the position in dividing plate 3 front, should have the socket of a temperature probe 37.This temperature probe 37 socket is weldingly fixed on the dividing plate circuit 32 of correspondence, and its height is not higher than the height of other mainboard support columns 31, after mainboard 4 is properly attached on cabinet internal partition 3, has a shaft-like temperature probe 37, upper end is temperature probe 37 element, and lower end is for connecting plug.The lower end of this shaft-like temperature probe 37 is passed the mainboard installing hole 47 between PCI-E slot and memory bar slot 44 on mainboard 4, it is inserted in temperature probe 37 socket on dividing plate 3, the circuit that now temperature probe 37 is corresponding with on dividing plate 3 correctly connects mutually, temperature probe 37 element of its upper end is on mainboard 4 front, for reading the gas flow temperature of this position.
Computer housing adopts above-mentioned intelligent temperature control system, fabulous user operation can be had, very hommization, again need not consider whether fan 201 has PWM function, without entering unlatching under mainboard 4BISS, arranging, and heat radiation and noise can obtain perfect dynamic equilibrium.
14) heat dissipation wind channel
Air draught type heat dissipation wind channel it is provided with in computer housing, radiating mode adopts air-exhaust type wind-cooling heat dissipating, wherein for being installed on the afterbody 13 of cabinet to the turbofan 201 of air draft outside cabinet, complete machine has two big main air inlets and two little auxiliary air inlet mouths, two big main air inlets are CPU air inlet 22, video card air inlet 23, and two little auxiliary air inlet mouths are bottom air inlet 15, jacking air port, side 14.
CPU air inlet 22 is positioned at casing right plate, has a relatively large opening on the position of cpu heat 6；Video card air inlet 23 is positioned at casing front portion, and there is a bigger strip perforate position corresponding with the region installing display card 7 in cabinet；Bottom air inlet 15 is positioned in cabinet bottom enclosure, and dividing plate 3 and mainboard 4 in cabinet extend vertically up to and have perforate one section elongated between 2 intersecting lenses on chassis backplane；Jacking air port, side 14 is positioned at casing left plate has a less strip perforate on enclosure top 11 and anterior position.
Except in air draught type heat dissipation wind channel, whole cabinet enters dish perforate 24 except above-mentioned 4 places air intake perforate and CD-ROM drive 204, again without other air intake holes, air in case is ceaselessly pumped to outside casing by the fan 201 in cabinet afterbody, cause the atmospheric pressure outside the air pressure in casing is lower than casing, force the air outside casing to be flowed in casing by each air inlet.Generally, when quick flow produced by blowing form runs into material object, the air pressure on surface in kind can rise, and air pressure raises air can tend to heat release state on the contrary, is unfavorable for the heat exchange between surface in kind and stream air；And if adopt air-draft-type, in air channel, the air pressure on surface in kind slightly declines, and low pressure air can more tend to heat absorption state and expand own vol, is conducive to the heat exchange between surface in kind and stream air.
The cold wind that CPU air inlet 22 flows into flows through the cpu heat 6 of correspondence, and after absorbing its heat, cold wind becomes hot-fluid.Owing to mainframe box is vertical, cpu heat 6 is in lower half, and turbofan 201 is at the first half.The higher hot-fluid of temperature is due to the suction of its natural lift and turbofan 201, flow to enclosure top, the relatively low part hot-fluid of temperature is by the suction of dividing plate 3 back side turbofan 201, and the gap through between dividing plate 3 edge and slip lid front panel 21 inwall flows to the space, lower half at dividing plate 3 back side.Owing to the latter half at dividing plate 3 back side is power pack 9 or the hard disk 203 that parallel patch touches installation, therefore flow into the hot-fluid that temperature herein is relatively low, it is possible to absorption band walks the caloric value of power pack 9, hard disk 203 part.
The cold wind that video card air inlet 23 flows into is directly through top in the cabinet in corresponding display card radiator 8, the first half at dividing plate 3 back side and dividing plate 3 backside space.In the centre position at dividing plate 3 back side, i.e. the lower section of display card 7 installation region, between the turbofan 201 at dividing plate 3 back side, it is provided with one piece of video card windscreen 39 from video card air inlet 23 position, this video card windscreen 39 sealing paste simultaneously touches dividing plate 3 back side and slip lid 2 inwall.Simply efficiently the whole drain of cold wind of video card air inlet 23 is absorbed heat through the radiator of display card 7, finally extracted out outside casing by turbofan 201, and this midway, air channel is not disturbed by the hot-fluid in other spaces in cabinet.
Owing to having air vent 38 in dividing plate 3 central region, and just this air vent 38 is being close on dividing plate 3 back side turbofan 201 is being installed.The cold wind that bottom air inlet 15 flows into, flows through lower half and the lower half, mainboard 4 back side in dividing plate 3 front.Owing to the latter half at dividing plate 3 back side is power pack 9 or the hard disk 203 that parallel patch touches installation, so a part for its caloric value has been delivered to dividing plate 3 the latter half, the cold wind flowed into by bottom air inlet 15 heat absorption is taken away；Another part heat is mainly transferred to the afterbody of cabinet metal shell and dispels the heat in bottom；After some heat is flowed through by above-mentioned described CPU air inlet 22, the relatively low hot-fluid of remaining portion temperature absorbs and takes away.
It is contemplated that high-power display card 7 caloric value is very big, and video card air inlet 23 air quantity is limited, also increasing jacking air port, a side 14, the cold wind of its inflow mainly absorbs in cabinet the region withstanding on dividing plate 3 backside space and the heat of fraction dividing plate 3 back side upper area.The cold wind that described four kinds of air inlets flow into, becomes air hot-fluid with each radiator, dividing plate 3, heating hardware, part cabinet metal shell inwall after carrying out heat exchange, is installed in the cabinet first half, several turbofan 201 of afterbody are discharged outside casing.
Except several air inlets, the sealed design that complete machine adopts, add each hardware arrangement science in upper case, succinct, produced windage is less.In addition the volume of ultra-thin PC mainframe box is little, and when adopting convulsion form, in its casing, produced draught head becomes apparent from than big cabinet, and the air channel flow formed in cabinet is big, wind speed is fast.And, the air channel that formed of low pressure that air draught produces, add hardware arrangement science, succinct, windage is little, the air olderly flowage in air channel, will not produce the phenomenon of backflow hot blast.
Aforementioned four air intake perforate is all movably installed with Air Filter 25, in order to filter the dust entered in case in air, makes in mainframe box, to keep cleaning and permanent good ventilation, heat dispersion.
15) turbofan 201
It is fitted with turbofan 201 in the positive space of planes of dividing plate 3 and dividing plate 3 backside space,
The positive space of planes of dividing plate 3, the I/O interface group of mainboard 4 is had on a fragment position region to be in the western end edge of mainboard 4, and in the western end edge part of the remaining mainboard in mainboard I/O interface group 41 side 4, element heights on its mainboard 4 is all within 18mm, so the space in its mainboard 4 overhead is more open, and the western end edge of mainboard 4 is proximate to cabinet afterbody shell.Therefore turbofan 201 is installed on the cabinet afterbody outer casing inner wall in this overhead, position of mainboard 4, the air outlet of turbofan 201 is connected with the perforate 17 of cabinet afterbody shell, by air-flow discharged to casing outside.It is arranged on the turbofan 201 on the western end edge clear position of mainboard 4, ingenious, make use of this clear position to carry out air discharging and radiating efficiently, it does not have the extra volume increasing cabinet, and movable mounting structure do not affect the dismounting of hardware completely yet and uses.
Having air vent 38 on dividing plate 3, the one side of turbofan 201 is close to this air vent 38 and is arranged on dividing plate 3 back side.The air that the one side of this turbofan 201 extracts between dividing plate 3 and mainboard 4 in gap through the air vent 38 on dividing plate 3；The another side of turbofan 201 extracts the air in dividing plate 3 backside space.The air outlet of this turbofan 201 is connected with the perforate of cabinet afterbody shell, outside the air of all extractions is discharged casing；
It is arranged on the turbofan 201 on cabinet afterbody outer casing inner wall, comprises following 2 kinds of forms and exist:
1. fixed, namely turbofan 201 is fixed on the inwall of cabinet afterbody shell by screw or installation draw-in groove；
2. movable, two frames perpendicular with turbofan 201 air outlet are provided with guide rail, installing at cabinet afterbody shell has perforate on fan 201 position, and the shape of this perforate, size all just match with the air outlet cross section at turbofan 201 place.A guide rail sliding chute is had just vertically just to be arranged on the inwall of cabinet afterbody shell to this perforate, turbofan 201 with guide rail matches with the guide rail sliding chute on cabinet afterbody outer casing inner wall, turbofan 201 can freely be moved by the perforate on cabinet afterbody shell inside and outside cabinet bulk, when this turbofan 201 installed hinders the dismounting of hardware in cabinet, can this turbofan 201 be moved to outside cabinet bulk, after the hardware in cabinet has dismounted, then this turbofan 201 is moved back on the inwall in cabinet bulk.
The present invention is not limited to above-mentioned detailed description of the invention, and the expansion further that those of ordinary skill in the art makes according to the present invention each falls within protection scope of the present invention.
Claims (8)
1. the radiator structure of a computer display card, including the radiator matched with display card, it is characterized in that: it is flat that described radiator is provided with front with the back side and entirety, the front of radiator is provided with heat-conducting base, the main part of described radiator is made up of the spaced radiating fin that is parallel to each other, the outwards smooth one side of described heat-conducting base is flattened on the GPU chip of display card, the parallel patch in the back side of radiator is touched in the separator face in host computer, host computer space is divided into two by described dividing plate, on the one or both sides of dividing plate, the tactile installation of parallel or parallel patch includes mainboard, hard disk, power pack, fan is at interior computer hardware, display card and dividing plate be arranged in parallel.
2. the radiator structure of computer display card according to claim 1, it is characterized in that: described radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends and condensation end, the evaporation ends of all vacuum thermal pipes fits tightly all in an orderly manner or is embedded on described heat-conducting base, it is semiarc shape or flat that the condensation end of vacuum thermal pipe is squeezed into cross section by mould, it is fitted tightly over radiating fin, the condensation end of part or all of described vacuum thermal pipe is distributed in the back side of described flat radiator and parallel patch is touched and carried out heat conduction in separator face.
3. the radiator structure of computer display card according to claim 1, it is characterized in that: described radiator also includes the vacuum thermal pipe arranged, every vacuum thermal pipe all contains evaporation ends and condensation end, the evaporation ends of all vacuum thermal pipes fits tightly all in an orderly manner or is embedded on described heat-conducting base, the condensation end of vacuum thermal pipe is squeezed into cross section for " D " shape by mould, namely flat one side is formed at described vacuum thermal pipe condensation end, and this flat one side parallels with the back side of described radiator, and the part of the non-flat one side that the vacuum thermal pipe condensation end of described " D " shape is formed combines with the radiating fin of described radiator and is fixed on the back side of described radiator,
When the parallel patch in the back side of described flat radiator is touched in separator face, the vacuum thermal pipe condensation end of described " D " shape forms flat one side and parallel patch is touched and carry out heat conduction in separator face.
4. the radiator structure of computer display card according to Claims 2 or 3, it is characterized in that: the other end condensation end of a part of vacuum thermal pipe on the heat-conducting base of described radiator extends on main frame metal shell inwall, and parallel fit tightly on main frame metal shell inwall.
5. the radiator structure of computer display card according to claim 1,2 or 3, it is characterized in that: the GPU Chip Vertical of described display card projects to the center of this video card pcb board rear surface regions and pastes or be mounted with insulation silica gel, by the side panel of host computer put in place fixing after extrude this insulation silica gel and the pressure that produces makes one side that the heat-conducting base of radiator is flat with the vacuum thermal pipe condensation end of display card GPU chip surface or described radiator back EDS maps parallel with separator face to carry out closely patch and touch, complete to conduct heat energy.
null6. the mounting structure of a computer display card，Including display card、Mainboard、I/O interface group in the I/O interface group of display card and mainboard，The I/O interface group of described display card refers to display card and input/output interface for being connected on mainboard with the equipment outside host computer with the I/O interface group on mainboard，It is characterized in that: the pcb board face of described display card is parallel to mainboard pcb board face and is arranged at the mainboard back side，On display card the socket of I/O interface group towards with the socket of I/O interface group on mainboard towards identical，The one side of the pcb board of described display card is provided with radiator，The dividing plate of heat-conducting one piece parallel is had between described display card and mainboard，Host computer space is divided into two by described dividing plate，On the one or both sides of dividing plate, the tactile installation of parallel or parallel patch includes mainboard、Hard disk、Power pack、Fan is at interior computer hardware，
It is flat that described radiator is provided with front with the back side and entirety, the front of radiator is provided with heat-conducting base, the main part of described radiator is made up of the spaced radiating fin that is parallel to each other, the outwards smooth one side of described heat-conducting base is flattened on the GPU chip of described display card, the parallel patch in the back side of radiator is touched in described separator face, on display card relative with dividing plate plate face equipped with the one side of radiator, and the another side that is fitted without radiator on the pcb board of display card is relative with the described mainboard back side and shell side panel parallel and near to host computer.
7. the mounting structure of computer display card according to claim 6, it is characterised in that: on described display card the edge of pcb board residing for I/O interface group its I/O interface group socket towards direction on to protrude from mainboard the distance of pcb board edge 15～40mm residing for I/O interface group.
8. the mounting structure of computer display card according to claim 6, it is characterized in that: described display card passes through dividing plate socket or the video card adapter of Interface Matching and extends winding displacement, is docked and connected mutually by display card slot corresponding with on mainboard for the golden finger interface on described display card.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106207201U TWM550838U (en) | 2015-05-25 | 2017-05-19 | Heat dissipating structure of independent graphics card of computer and assembling structure thereof |
| PCT/CN2017/085104 WO2017202250A1 (en) | 2015-05-25 | 2017-05-19 | Cooling structure for discrete computer graphics card and mounting structure therefor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520341704 | 2015-05-25 | ||
| CN2015203417045 | 2015-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105807869A true CN105807869A (en) | 2016-07-27 |
Family
ID=56451958
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620485825.1U Expired - Fee Related CN205880770U (en) | 2015-05-25 | 2016-05-24 | Heat radiation structure of independent display card of computer and mounting structure thereof |
| CN201610353265.9A Pending CN105807869A (en) | 2015-05-25 | 2016-05-24 | Radiating structure and mounting structure for independent graphics card of computer |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620485825.1U Expired - Fee Related CN205880770U (en) | 2015-05-25 | 2016-05-24 | Heat radiation structure of independent display card of computer and mounting structure thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (2) | CN205880770U (en) |
| TW (1) | TWM550838U (en) |
| WO (1) | WO2017202250A1 (en) |
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| WO2017202251A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer chassis |
| WO2017202250A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Cooling structure for discrete computer graphics card and mounting structure therefor |
| WO2017202254A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Apparatus for mounting and fixing computer cpu heat sink and dedicated cpu heat sink |
| WO2017202249A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Partition in computer system unit |
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| CN108347857A (en) * | 2017-01-24 | 2018-07-31 | 晶达光电股份有限公司 | Double-side display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN205880770U (en) | 2017-01-11 |
| TWM550838U (en) | 2017-10-21 |
| WO2017202250A1 (en) | 2017-11-30 |
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Application publication date: 20160727 |