WO2017202253A1

WO2017202253A1 - Computer chassis

Info

Publication number: WO2017202253A1
Application number: PCT/CN2017/085122
Authority: WO
Inventors: 周奋豪
Original assignee: 周奋豪
Priority date: 2015-05-25
Filing date: 2017-05-19
Publication date: 2017-11-30
Also published as: WO2017202248A1; CN205880768U; WO2017202252A1; CN206021160U; CN206097019U; CN105975017A; WO2017202251A1; CN206162286U

Abstract

A computer chassis, comprising a computer chassis housing (1) and computer hardware. The computer hardware comprises a mainboard (4), a hard drive (203), and/or a power supply unit (9), and a corresponding heat sink. The computer chassis is a tower, provided therein is an air intake-type cooling air duct, and exhaust-type air cooling is employed as the means for cooling. A turbo fan (201) used for venting air to the exterior of the chassis is mounted at a tail part (13) of the chassis. An air outlet of the turbo fan (201) is connected to an opening (17) of the housing at the tail part of the chassis. The chassis is provided as a whole with a main air inlet and an auxiliary air inlet. The main air inlet comprises a computer CPU air inlet (22). The auxiliary air inlet comprises a chassis bottom air inlet (15) and/or a lateral-top air inlet (14). A CPU heat sink (6) is arranged at the lower-half part. The turbo fan (201) is arranged at the upper-half part. The chassis has an effectively reduced thickness and is compact and lightweight.

Description

Computer main box

Technical field

The utility model relates to the technical field of computer hardware devices, in particular to a technology of an ultra-thin computer mainframe.

Background technique

The mainstream of the existing conventional desktop mainframe is the tower mainframe, and its overall shape is a rectangular parallelepiped. The main unit of the desktop has horizontal and vertical points, which are generally the most common. All physical components in the main chassis are generally referred to as computer hardware, including motherboards, hard drives, CPUs, memory modules, discrete graphics cards, optical drives and power supplies, and various heat sinks. The existing tower mainframe is a non-thin chassis, which is large in size and heavy in weight.

1) Hardware arrangement and routing: At present, the hardware layout in the traditional desktop mainframe is designed to be able to install almost one type of computer hardware in one location space, so in order to meet more hardware support, a lot of settings are provided in the main chassis. The installation space of each hardware, when some hardware installation bits are not used, can only be idle there, which greatly wastes the space volume in the main chassis, so that the space utilization rate in the main chassis is very low.

Most of the data or power connections between the hardware in the mainframe of a conventional desktop computer are RVV wires, which connect the associated hardware through wires. However, due to the backward layout and routing in the traditional mainframe, and the various hardware, the connecting wires formed are criss-crossed, complicated and complicated. Not only do users need to have certain professional basic knowledge, but also seriously affect the use. The interior of the main chassis is beautiful, and various traces also greatly occupy the space volume inside the chassis. In the traditional mainframe, due to the unreasonable reason of the hardware arrangement, and the connection of ordinary wires, and the connection distance between hardware is not the shortest, the shortest connection cannot be achieved, because it is too short, ordinary The wires become thick and hard, so it is very inconvenient for the user to install and use.

2) Structure of the CPU heat sink and its installation: The traditional CPU heat sink uses 4 screws/expansion bayonet, through the CPU mounting hole on the motherboard, rigid or nearly rigid material, structural way to fix the CPU heat sink on the motherboard on. The following five problems often occur: First, because the screw/expansion pin is tightened too much, the force between the heat sink and the main board is too large, causing the main board to deform and bend to different degrees. Second, sometimes the four screws are unbalanced when they are tightened, causing a partial tilt between the surface of the CPU chip and the heat-conducting base of the heat sink, resulting in a fine gap, which greatly increases the CPU chip and the heat-conductive base of the heat sink. The thermal conductivity hinders heat transfer from the CPU chip to the heat sink. Third, the traditional CPU heatsink and the matching buckles and parts are numerous and complicated to install. Most of them take several minutes to ten minutes. Fourth, when some conventional CPU heat sinks are mounted on the motherboard, they cannot move or can only move in one direction. Cause sometimes There is a drawback that the CPU heatsink conflicts with the position of the components on some motherboards, but cannot be installed properly. Fifth, most traditional high-end CPU heat sinks can only increase the size of the heat sink in order to achieve better heat dissipation. This makes the compatibility of the large CPU heatsink to the mainframe and the motherboard greatly reduced, and the cost of user purchase is also significantly increased.

In addition, most of the CPUs used by ordinary users consume less than 100W of TDP power. However, considering the demanding requirements of top CPUs and overclocking users, the CPU heatsink can carry more than 180W. Therefore, higher requirements are placed on the performance of the heat sink.

3) Installation and heat dissipation of the discrete graphics card: The discrete graphics card in the traditional desktop mainframe, if it is a low-end graphics card, generally uses the original heatsink of the graphics card for heat dissipation. If it is a high-power high-end graphics card, either use a high-cost, cumbersome water cooling solution, or re-install a better air-cooled heat sink. However, most of the independent graphics air-cooled heat sinks on the market have a certain range of compatibility, or there are many matching parts and the installation process is cumbersome. And users who don't have a certain amount of expertise don't even know what kind of radiator should be chosen. In the traditional desktop mainframe, the discrete graphics card has the following problems in terms of heat dissipation:

First, if the discrete graphics card is air-cooled, the size of the heat sink can hardly exceed the size range of the graphics card itself due to the limitation of the installation method and size specifications. And the matching fan also occupies a part of the volume of the heat sink, so the actual heat dissipation area of the heat sink is limited.

Second, if water cooling is used, the high cost will not be said. Water tanks, pumps, radiators, fans, water pipes, etc., which are compatible with water cooling, need to increase the size and weight of the chassis. And the installation is cumbersome, and the user needs to have a certain professional ability when installing water cooling.

Third, the discrete graphics card is perpendicular to the air inlet of the side panel of the chassis. If air cooling is adopted, the cold air flowing in from the air inlet is disturbed by the common disorder of the CPU cooling fan and the graphics card cooling fan on the main board, and the cold air outside the chassis cannot be completely and unidirectionally flowed through the independent graphics card radiator. Efficient heat dissipation, because the unscientific and tight air duct in the chassis, the cold air flowing into the independent graphics card and the CPU radiator is caught with the returning hot air, which affects the heat exchange effect of the radiator.

Fourth, the discrete graphics card heatsinks are placed in parallel horizontally, which is very unfavorable for the natural upward movement of the air heat flow.

In the traditional desktop mainframe, the discrete graphics card is directly inserted vertically into the graphics card slot of the motherboard. Since the main board and the discrete graphics card are both large-sized hardware in the chassis, the space in which the two are vertically mounted is large in size. But this way is very compatible with the hardware.

4) Cooling air duct: The design of the cooling air duct in the traditional desktop mainframe is unscientific and disordered, and almost all of them have the phenomenon of returning hot air. And in order to increase the cooling effect of the CPU or the discrete graphics card, blindly increase the size of the heat sink to solve. It is not simple and effective to transfer and expand by means of the metal casing of the chassis itself. Scatter a part of the heat source.

In addition, the fan speed and the noise generated by it have always been a major contradiction between air cooling and heat dissipation. The fan speed in a traditional desktop mainframe usually has two forms: one is a fixed speed, and the other is a temperature-controlled speed by connecting a motherboard PWM jack. The former, regardless of the temperature inside the chassis is always a speed, unscientific; the latter, the fan must first have a PWM function, and then enter the motherboard BISS to open, set, the user needs to have certain professional knowledge. Moreover, there are many types of fans, and if the fan in the PWM speed control mode is too noisy or the wind speed is too small, there is almost no way for the user to effectively adjust.

5) Power supply: The power supply box in the traditional desktop mainframe is large in size. Its function is to directly convert the input municipal AC power into DC output of different voltage values required by each hardware, and connect with each hardware by using many RVV wires, plus The design of the traditional mainframe is backward, which causes the various wires of the inner box of the mainframe to be densely packed and criss-crossed. This greatly wastes the space in the mainframe and affects the aesthetics of the mainframe, and also hinders the convenience of the user. .

Summary of the invention

In order to overcome the defects of the prior art, the utility model aims to provide a computer main box which can effectively reduce the thickness of the chassis, is small in size and light in weight.

A further objective is to adapt to the design of the ultra-thin chassis structure, and to facilitate the re-layout of the computer mainframe structure of the computer hardware.

The utility model is realized by the following technical solutions:

A computer mainframe box includes a computer mainframe casing and computer hardware, and the computer hardware comprises a main board, a hard disk or a power supply box, and a corresponding heat sink, wherein the computer main box casing is provided with a metal partition and a metal partition Dividing the cavity formed by the outer casing of the computer main body into two, the main board is fixed on one side of the metal partition, the side is the front side of the metal partition, and the hard disk or the power supply box is disposed on the other side of the metal partition, The side is the back of the metal partition. The main board, the hard disk or the power supply box are all parallel to the side of the metal partition. The front or back of the partition or the partition is provided with a circuit, and the above-mentioned circuit of the partition is provided with a partition socket for mating connection with the computer hardware.

The computer hardware further includes a discrete graphics card, and the independent graphics card is arranged in parallel with the side of the metal partition. The hard disk includes a 3.5-inch hard disk and a 2.5-inch hard disk.

An optical drive is mounted in parallel on the metal partition.

The housing of the mainframe has a matching integral "U"-shaped sliding cover housing, and the sliding cover is made of a transparent or translucent or opaque material.

An ultra-thin flat shape is closely adhered or embedded in the front and/or back or the partition of the inner partition of the chassis The circuit, the thickness of the conductor in the circuit is ≤ 0.5mm. The computer hardware is correctly connected to each other through the baffle sockets corresponding to the above-mentioned circuits, or directly connected to the exposed conductive circuit contacts on the baffle by the special interface of the hardware. Conducted after contact.

An ultra-thin flat-shaped circuit that is closely attached or embedded in or on the inner partition of the chassis, hereinafter referred to as a "separator circuit". These are connected to the corresponding baffle circuit through the bulkhead socket, the wire and the corresponding baffle circuit, and the computer hardware mounted on the matching bare conductive baffle circuit is mounted on the side of the baffle in parallel or parallel contact. Or on both sides.

The separator circuit and the separator are insulated from each other, and the height of the flat conductor circuit surface is not higher than the height of the peripheral separator surface. The entire separator circuit surface has a tight coverage of the insulation and wear layer.

The separator is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate, an ultra-thin insulating copper plate embedded partition plate or a metal-based conductive coating Layer circuit separator.

The separator is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate, and the glass fiber/semi-glass fiber-based PCB circuit board is formed into a wiring circuit and a physical physical dimension required for the design, and the separator is an aluminum alloy or a copper metal plate is formed on one side or both sides of the separator to form a groove matching the shape and thickness of the PCB circuit board, and the PCB circuit board is closely attached to the corresponding groove on the partition plate. Inside, the surface of the PCB board is at the same plane height as the surface of the partition plate. The above-mentioned embedded PCB circuit board has a tight covering of the insulating and wear-resistant layers on the entire surface.

The partition plate is made of the same material as the metal casing or the skeleton of the mainframe of the computer, and is integrally formed by heat-melting or squeezing the material through a mold to integrally form the partition plate with the metal casing or skeleton of the mainframe of the computer.

The partition and the metal skeleton or the outer casing of the mainframe are separated and independent, and the partition is welded and fixed to the metal frame of the chassis or the inner wall of the outer casing.

The spacer socket is directly soldered or contacted to the corresponding spacer circuit. The hardware interface types of the partition socket include 7pin SATA 2.0 data interface, 7pin SATA 3.0 data interface, SATA Express hard disk interface, SAS hard disk interface, SATA 7+15pin data + power hard disk interface, SATA 7+6pin data + power optical drive interface, motherboard Power-on boot pin POWER SW, motherboard reset pin RESET SW, USB 3.0 19/20pin jack, USB 2.0 9pin jack, motherboard audio pin HD AUDIO, discrete graphics PCI-E slot, motherboard main power supply slot, The motherboard auxiliary power supply slot and the discrete graphics auxiliary power supply slot, or any combination of the above hardware interfaces.

The bottom of the baffle socket is arranged with the corresponding pins of the socket, and the corresponding mounting position of the baffle circuit has a soldering point, and the pin at the bottom of the baffle socket is directly soldered and fixed at the corresponding baffle circuit position. on.

Or the bottom of the spacer socket is arranged with the corresponding pins of the socket, and the pins are bare The conductive metal dome is in the form of a protruding positioning pin at the periphery of the elastic piece at the bottom of the partition socket, and a corresponding mounting position on the partition has a mounting structure with a concave structure, and the inner concave portion has Arranged with bare conductive circuit contact points, corresponding positioning holes are provided on the outer periphery of the inner concave portion, and the partition socket is fastened to the corresponding mounting position on the partition by screws/expansion pins. The conductive metal dome at the bottom of the spacer socket is in contact with the circuit contact point in the corresponding concave region on the spacer, and the protruding positioning pin at the bottom of the spacer socket is also corresponding to the mounting position on the spacer. The positioning holes are inserted one by one to match.

A plurality of main board support columns are distributed and fixed on one side of the partition plate, and the surface is set as a front surface of the partition plate, and the height of the support column protrudes from the board surface is 4-7 mm, and the distribution position of the main board support column is The mounting holes on the corresponding supported motherboards are matched one by one, and the main board support columns are made of conductive metal.

The main board support column has an internal thread hole perpendicular to the surface of the partition plate or a bayonet hole matched with the expansion bayonet. The main board support column suspends the main board parallel to the front surface of the partition plate, and the back side of the main board is separated from the main board. The front side of the board is opposite, and the main board is fixed to the main board support column of the partition by screws or expansion pins.

The separator substrate is a conductive metal plate, which is designed as a main bearing conductor of a DC negative/ground transmission of a computer main box, and each computer hardware is in contact with a conductive metal separator through a separator socket or directly to the hardware. The DC negative circuit/ground in the middle is electrically connected to the metal separator.

The main board is backed by the front side of the partition plate, and the north end side of the main board near the CPU position faces downward in a geographical orientation. The west end of the main board, that is, the end side of the main board with the I/O interface group faces the tail of the chassis.

In the area projected to the front side of the partition at the north end of the main board, a partition socket is disposed on the front side of the partition near the auxiliary power supply socket on the main board, and the bottom stitch of the partition socket is in circuit communication with the corresponding partition. One end of the wire is inserted into the main board auxiliary power supply slot on the main board, and the other end of the wire is inserted into the baffle socket to communicate with the corresponding power supply circuit on the main board.

The heat sink of the CPU in the computer mainframe includes a CPU additional heat sink and a CPU heat sink, the CPU heat sink is fixed by an H-bridge press buckle bracket, and the H-bridge press buckle bracket includes two sliding rods. The middle sections of the two sliding rods are parallel to each other, and both ends of the two sliding rods are bent, and each of the bent sections of the two sliding rods has a movement on the section. Supporting column, the bottom end of the supporting column has an expansion chuck, the expansion chuck is sized and dimensioned to match the mounting hole of the CPU heat sink on the main board, and is disposed on a parallel section of the two sliding rods a bridge bar which is freely movable in the direction of the axis of the two sliding rods, wherein the intermediate portion of the bridge bar has an inner groove structure, wherein the two sliding rods are resilient material members or bridge bars A resilient material member, the two sliding rods and the bridge bar combination together form the "H" type structure.

One end of the CPU attached heat sink is a flat vacuum heat pipe evaporation end, and the other end is welded with heat dissipation The vacuum heat pipe condensation end of the fin. The section between the two ends of the CPU additional heat sink is processed into a bellows shape, and the bottom of the condensation end of the CPU attached heat sink is flat, and is fixed on the inner wall of the metal shell of the chassis closest to the CPU position by screws or snaps. Therefore, part of the heat of the CPU heat-conducting base is transferred to the heat-dissipating fins on the metal casing of the chassis and the condensation end of the CPU.

The CPU heat sink is a vacuum heat pipe type heat sink, and the bottom of the CPU heat sink has a heat conductive base mounted on the CPU chip. On the edge of the heat-conducting base of the CPU heat sink, there is a groove perpendicular to the direction of the vacuum heat pipe arranged on the heat-conducting base, and the shape of the groove is just matched with the evaporation end of the CPU attached heat sink, and the CPU is additionally cooled. After the evaporation end of the device fits into the groove at the edge of the heat-conducting base, it is fastened to the edge of the heat-conducting base with a cover plate and a screw. The front side of the thermal base is directly parallel to the surface of the CPU chip. The substantially central position of the back surface of the heat-conducting base has a convex structure, and the concave sliding groove of the middle portion of the bridge pressing rod can just buckle the protruding structure, and the bridge pressing rod is placed on the back surface of the heat-conductive base.

The heat conducting base is a convex structure that is fastened to the back of the CPU chip by a bridge pressing rod, and the bridge pressing rod is movablely fixed on the two sliding rods, and the two sliding rods are passed through the movable supporting column The upper chucks are respectively inserted into the four CPU heat sink mounting holes on the main board, and finally the expansion pins are inserted into the supporting pin holes, thereby fastening the entire clip bracket together with the CPU heat sink on the main board.

The mainframe of the computer is vertical, and one end of the main board is close to the north end of the main board, and the north end of the main board is upward. The inner wall of the outer casing of the main board near the south end of the main board is the top inner wall of the main body, and the inner wall is vertically higher than the front surface of the main board. In the long strip-shaped area of 15~45mm, a long strip-shaped socket is arranged to form an expansion socket of the inner wall of the chassis. The inner wall expansion socket includes three kinds of interfaces, DC+5V and DC negative power supply interface, 7+6pin SATA optical drive interface and 7+15pin SATA hard drive interface.

The inner wall expansion socket adopts a long strip PCB circuit board to concentrate the wires, the long strip PCB circuit board closely fits the inner wall of the chassis, the circuit board portion extends to the edge of the partition plate surface, and the extension of the long strip PCB circuit board The circuit is connected to the corresponding circuit on the partition, and is fixed by welding. That is, the pins on the bottom of the expansion socket are fixedly connected to the corresponding circuits on the elongated PCB circuit board by soldering or contact activities, and the circuits passing through the extension portions are in communication with the corresponding spacer circuits. The interface of the inner wall expansion socket faces parallel to the face of the partition.

A board I/O baffle partition card slot is disposed at a position on the edge of the main board of the I/O interface group on the west end of the main board, and the slot is about 1 mm wide and has a seam depth. Straight groove/hole slit of 2~3mm, total length of slot/opening ≥ total length of main board I/O bezel (main board back panel). Before loading the motherboard into the main unit, first insert a long side of the main board I/O bezel (main board back panel) into the partition groove/hole, and then the entire main board I/O bezel ( The rear panel of the system board is snapped into the matching hole in the motherboard I/O bezel (main board rear bezel) at the rear of the chassis.

The hardware installed in the space behind the partition includes a separate graphics card including a heat sink, a hard disk, a turbo fan, a power supply box, a power distribution module, and a temperature control module, and are all mounted in parallel on the partition. The surface of the back side of the partition is in the form of a flat, thermally conductive metal plate in addition to the contact point of the inner concave plate circuit matching the power supply box, the bulkhead socket and the power distribution module.

The PCB surface of the discrete graphics card is disposed on the back of the motherboard parallel to the motherboard PCB surface. The sockets of the I/O interface group on the discrete graphics card face the same direction as the sockets of the I/O interface group on the motherboard.

A heat sink is mounted on one side of the PCB of the discrete graphics card, and the other side of the independent graphics card PCB on which the heat sink is not mounted is opposite to the back of the motherboard.

The parallel display card and the main board have a parallel heat-conducting material partition plate. The side of the separate graphics card with the heat sink is opposite to the partition plate surface, and the other side of the PCB on the independent graphics card is not parallel to the computer. The side panel of the outer casing of the main unit.

The edge of the PCB board on which the I/O interface group is located on the independent graphics card is convex in the direction of the I/O interface group socket, and the edge of the PCB board where the I/O interface group on the motherboard is located is 15 to 40 mm. distance.

The heat sink mounted on the discrete graphics card is provided with a plurality of vacuum heat pipes and a heat conducting base, and a plurality of heat dissipating fins arranged in parallel are arranged to form a main body portion of the heat sink. The heat sink is flat in shape and partially has irregularities. Construction and partial bending of the vacuum heat pipe. The heat conducting base is disposed on one side of the flat heat sink, and the surface is a front surface of the heat sink, and a back surface of the heat sink is in parallel to the partition surface.

The vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes on the heat sink are closely attached or embedded on the heat conduction base in an orderly manner, and the flat side of the heat conduction base is flattened. On the GPU chip of the discrete graphics card; some or all of the condensation ends of the vacuum heat pipes are distributed on the back side of the flat heat sink.

A condensation end of a portion of the vacuum heat pipe on the heat conducting base of the heat sink extends to the inner wall of the metal shell of the main body, and is closely attached to the inner wall of the metal shell of the main body in parallel.

The condensation end of the vacuum heat pipe distributed on the back surface of the heat sink is parallel to the surface of the partition plate, and the condensation end of the vacuum heat pipe is parallelized to the side of the partition plate surface to be flat, and is in parallel with the surface of the partition plate. The other side of the condensation end of the vacuum heat pipe is in close contact with or welded to some or all of the heat sink fins. The heat dissipation fins are perpendicular to the surface of the partition plate, and the air passage direction formed by the arrangement is parallel to the direction of the socket of the I/O interface group on the independent graphics card or at an angle of ≤45°.

The GPU chip of the independent graphics card is vertically projected to the center of the back area of the PCB of the graphics card, and the insulating silica gel is pasted or placed, and the heat generated by the insulating silica gel is pressed by the side panel of the main box sliding cover to fix the heat conduction of the heat sink. The base is separated from the surface of the discrete graphics card GPU chip or the back of the heat sink The flat side of the condensing end of the air-heating duct is in close contact with the surface of the partition plate to conduct thermal energy.

The discrete graphics card is connected to the corresponding discrete graphics card slot on the motherboard through the interface matching paddle socket or the graphics card adapter card and the extension cable.

When a separate graphics card and a heat sink are not mounted on the location area where the discrete graphics card is mounted on the partition, the power box or/and the hard disk may be installed in parallel on the position of the partition. And the hard disk or/and power box is directly connected to the corresponding bulkhead circuit through a matching bulkhead socket or/and directly.

The cold end surface of the semiconductor refrigerating sheet is disposed in parallel with the inner wall of the top or bottom of the metal shell of the chassis, and a heat conducting metal sheet is flatly attached to the hot end surface of the semiconductor refrigerating sheet. The evaporation end of the vacuum heat pipe is fitted, and the condensation end of the vacuum heat pipe is closely attached to the inner wall of the tail of the metal casing of the casing, and the heat of the semiconductor refrigeration chip is transmitted to the rear casing of the chassis to dissipate heat.

The positive and negative power supply circuits of the semiconductor refrigerating sheet are connected to corresponding power supply circuits on the separator through matched spacer sockets.

The power supply box in the mainframe of the computer is provided with an input port and an output port of the power source, and one side of the output port on the power box is in contact with the partition surface. The output port of the power box is provided with a transmission structure that can be directly connected to the corresponding circuit on the partition in the chassis. There is no third-party socket or plug-in connection between the output port of the power box and the corresponding circuit on the partition in the mainframe of the computer.

The side on which the output port of the power supply box is located is the largest area of the surface of the outer casing, and the surface is set as the bottom surface of the power supply box. And the bottom surface of the power box opposite to the partition surface of the chassis is mounted in parallel with the surface of the partition plate.

A contact copper piece protruding from the bottom surface of the power supply box by 0.5 to 3 mm is arranged neatly and orderly in the power output port on the bottom surface of the power supply box. The front faces of the contact pads are smooth and bare, and the inwardly facing sides of the contact pads are fixed to elastic members that are insulated from other circuits, and the elastic members are fixed in the power box.

The contact copper piece in the output port of the bottom surface of the power supply box may be connected with one or more circuits of the DC positive output circuit, the DC negative output circuit, and the connected municipal AC circuit in the power supply box according to circuit design requirements. . And the contact copper pieces defined by different circuits are independent and insulated from each other, and the contact copper piece is also insulated from the bottom surface of the power supply box.

The bottom surface of the power supply box has a plurality of raised positioning pins on the bottom surface thereof, and the output ports and the positioning pins of the bottom surface of the power supply box are respectively in the size specification and position in the area where the power supply box is mounted on the inner partition of the power box. The direction and circuit define the concave circuit contact points and positioning holes that are perfectly matched in the phase. Concave electricity The surface of the contact point is barely conductive, but is insulated from the spacer, and the contact points of the concave circuit are respectively connected to the circuits on the corresponding spacer.

The bottom surface of the power box is a flat metal conductive material except the output port, and the output DC negative/ground circuit in the power box is connected to the bottom surface of the conductive power box. The power box is fastened to the metal partition surface of the chassis by screws or expansion pins, and is in contact with the surface of the metal separator.

The outer casing of the power supply box is made of a large-area heat-conducting metal material, and the internal heating element directly contacts the inner wall of the metal casing of the power supply box, or the heating element is connected to the inner wall of the metal casing of the power supply box through a vacuum heat pipe. The power box is fastened and dissipated by screwing or expanding the pin on the metal partition surface of the chassis.

The overall shape of the power supply box is a flat square body, and the maximum thickness of the power supply box is ≤31 mm, wherein the length is ≤150 mm, the width is ≤110 mm, or the length is ≤260 mm, and the width is ≤120 mm.

The power input port circuit of the power box is defined as a municipal AC input and a DC power supply of a required voltage value; the power output port circuit of the power box is defined as a DC output of the required voltage value and a municipal AC output.

The side of the power distribution module that is in contact with the back surface of the partition plate is a bottom surface, and the bottom surface is provided with a "DC input port" and a "DC output port", and both the "DC input port" and the "DC output port" are provided. A plurality of contact copper sheets protruding from the bottom surface by 0.5 to 3 mm are arranged neatly and orderly. The front faces of the contact copper sheets are smooth and bare and electrically conductive. The inwardly facing sides of the contact copper sheets are fixed on the elastic material members insulated from other circuits, and the elastic material members are fixed in the power distribution module. .

The contact copper piece in the "DC input port" on the bottom surface of the power distribution module is connected to the DC input circuit in the power distribution module; the contact copper pieces in the "DC output port" on the bottom surface of the power distribution module are respectively connected to the power distribution module The DC output power supply of different output voltage values is connected. The contact copper pieces defined by different circuits are independent and insulated from each other, and the contact copper piece is also insulated from the bottom surface of the power distribution module.

On the bottom surface of the power distribution module, a plurality of protruding positioning pins are disposed in addition to the “DC input port” and the “DC output port”, and the area of the power distribution module installed on the partition plate respectively has a bottom surface of the power distribution module. The "DC input port", "DC output port" and the positioning pin and the positioning pin are completely matched in the size specification, position direction, and circuit definition. The surface of the contact point of the concave circuit is barely conductive, but is insulated from the partition, and the contact points of the concave circuit are respectively connected to the corresponding separator circuit.

The bottom surface of the power distribution module is a flat metal conductive material except for the "DC input port" and the "DC output port", and the DC output negative/ground circuit in the power distribution module is connected to the metal bottom surface of the power distribution module. through. The power distribution module is fastened to the metal partition surface of the chassis by screws or expansion pins in parallel, and is in contact with the surface of the metal separator.

The contact copper piece in the "DC input port" on the bottom surface of the power distribution module is matched with the corresponding concave circuit contact point on the partition plate, and then the DC output of the power supply box to the above-mentioned baffle circuit is introduced into the distribution. The electric module is converted into a DC power supply of different voltage values required by each hardware device, and then the DC power supply of the different voltage values is passed through the contact copper pieces in the "DC output port" on the bottom surface of the power distribution module. After the corresponding concave circuit contact points are matched and docked, the DC power supplies of the different voltage values are respectively transmitted to the corresponding diaphragm circuits.

In the middle section of the back of the inner partition of the chassis, a power distribution module is installed near the back edge of the partition of the front panel of the chassis, and the power distribution module is integrated with one or more of the following interfaces. One or more sockets, bulkhead sockets: 6/8pin discrete graphics auxiliary power supply slot, 24pin motherboard main power supply slot, turbo fan power supply interface, 7+15pin SATA hard drive interface, SATA Express hard drive interface, SAS hard drive interface, USB 3.0 19/20pin jack, USB 2.0 9pin jack, 7+6pin SATA optical drive interface.

The power distribution module further integrates a temperature control module, and the power distribution module provides power supply and installation location space and/or circuit routing structure for the temperature control module.

The computer mainframe is provided with an intelligent temperature control system, including a manual adjustment switch, a temperature control module, a fan, and a temperature probe. The manual adjustment switch is disposed on the casing of the casing for convenient operation by the user, and the temperature control module and the fan are located in the chassis. The required temperature position is placed next to the CPU heat sink or the graphics card heat sink, and is in the downwind air duct of the radiator airflow. The temperature control module is also connected with the manual adjustment switch, the fan and the temperature probe.

There is a motherboard mounting hole between the PCI-E slot on the motherboard and the memory module slot. The temperature probe is connected to the corresponding motherboard support column on the partition. The temperature probe includes the following two forms:

1) Fixed type, the temperature probe is column-shaped as a whole, the upper end is a temperature probe component, and the size can just pass through the corresponding motherboard mounting hole; the lower end is the pin of the temperature probe component, which is fixed on the corresponding diaphragm circuit by soldering, and the temperature The probe body is perpendicular to the front surface of the partition plate, and the motherboard mounting holes between the PCI-E slot and the memory module slot on the main board are mapped on the front side of the partition plate;

2) The movable type, the motherboard mounting hole mapping between the motherboard PCI-E slot and the memory module slot corresponds to the position of the front side of the partition, and has a temperature probe socket. The temperature probe socket is soldered and fixed on the corresponding diaphragm circuit, and its height is not higher than the height of the other motherboard support columns. When the motherboard is correctly mounted on the inner partition of the chassis, there is a rod-shaped temperature probe and the upper end is a temperature probe. Component, the lower end is the connection plug. Insert the lower end of the rod-shaped temperature probe through the motherboard mounting hole between the PCI-E slot and the memory module slot on the motherboard. In the temperature probe socket on the partition, the temperature probe is in proper communication with the corresponding circuit on the partition, and the temperature probe element at the upper end is above the front surface of the main board for reading the air temperature at the position.

The computer mainframe has an air-dissipating heat dissipation air duct, and the heat dissipation method adopts an exhaust air-cooling heat dissipation, wherein a turbo fan for exhausting air outside the chassis is installed at the tail of the chassis, and the whole machine has two large mains. The air inlet and two small auxiliary air inlets, the two large main air inlets are the CPU air inlet and the video card air inlet, and the two small auxiliary air inlets are the bottom air inlet and the side air inlet.

The CPU air inlet is located on the side of the chassis shell and has a large opening in the position of the CPU heat sink; the air inlet of the graphics card is located at the front of the chassis shell, and has a large strip corresponding to the area where the independent graphics card is installed in the chassis. The air inlet of the bottom of the box is located on the bottom casing of the chassis, and a partition opening is formed between the partition plate in the chassis and the two intersecting lines extending perpendicularly to the bottom plate of the chassis; the side air inlet is located in the casing The left side panel has a small elongated opening near the top and front of the chassis.

A turbo fan is mounted in both the front space of the partition and the back space of the partition.

The front space of the partition plate is the I/O interface group of the main board at a position on the west end of the main board, and the height of the components on the main board of the main board at the west end of the remaining main board I/O interface group is within 18 mm. Therefore, the space above the main board is relatively wide, and the west end of the main board is close to the outer casing of the chassis. Therefore, a turbo fan is installed on the inner wall of the rear casing of the chassis at the position of the main board, and the air outlet of the turbo fan is connected to the opening of the rear casing of the chassis to discharge the airflow to the outside of the casing.

Ventilation holes are formed in the partition plate, and one side of the turbo fan is mounted on the back surface of the partition plate against the ventilation holes. One side of the turbo fan extracts air from the gap between the partition plate and the main plate through a vent hole in the partition plate; the other side of the turbo fan extracts air in the space behind the partition plate. The air outlet of the turbo fan is connected to the opening of the rear casing of the chassis, and all the extracted air is discharged outside the casing;

The turbofan mounted on the inner wall of the rear casing of the chassis includes the following two forms:

1) fixed type, that is, the turbo fan is fixed to the inner wall of the rear casing of the chassis by screws or mounting slots;

2) movable type, the guide rail is installed on the two frames perpendicular to the air outlet of the turbo fan, and the opening of the fan is installed at the rear of the chassis, and the shape and size of the opening are just the same as the air outlet of the turbo fan. The cross sections match. A rail chute is mounted vertically on the inner wall of the outer casing of the casing.

The turbine fan with rails is matched to the rail chute on the inner wall of the rear casing of the chassis, and the turbo fan is free to move inside and outside the chassis through the opening in the rear casing of the chassis.

When the installed turbo fan blocks the disassembly and assembly of the hardware inside the chassis, the turbo fan can be moved outside the chassis. After the hardware in the standby box is disassembled, the turbo fan is moved back to the inner wall of the chassis. The entire chassis of the suction-type heat dissipating air passage is in addition to the above-mentioned four inlet openings and the optical drive into the opening of the disc, and then There is no other air inlet hole, and the fan in the tail of the chassis continuously draws the air in the box to the outside of the box, causing the air pressure in the box to be lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets to the box. in vivo. The cold air flowing into the air inlet of the CPU flows through the corresponding CPU heat sink, and after the heat is absorbed, the cold air becomes a heat flow. Since the main chassis is vertical, the CPU heat sink is in the lower half and the turbo fan is in the upper half. The higher temperature heat flow to the top of the chassis due to its natural lift and the suction of the turbo fan. The lower temperature part of the heat flow is absorbed by the turbo fan on the back of the partition, and flows to the partition through the gap between the edge of the partition and the inner wall of the front outer casing of the chassis. Inside the lower half of the space. Since the lower half of the back side of the metal partition is a power supply box or a hard disk that is mounted in parallel, the heat flow flowing into the lower temperature can absorb the heat generated by the power supply box and a part of the hard disk.

The cold air flowing into the air inlet of the graphics card directly flows through the corresponding graphics card heatsink, the upper half of the back of the metal partition, and the inner top of the chassis in the back space of the partition. A venting hole is formed in the central portion of the partition, and a ventilating hole is being fitted to the venting hole on the back side of the partition. The cold air flowing into the air inlet of the bottom of the box flows through the lower half of the front of the partition and the lower half of the back of the main board. Since the lower part of the back side of the metal partition is a power supply box or a hard disk that is mounted in parallel, a part of the heat is transmitted to the lower half of the metal partition, and the cold air that flows in from the air inlet of the bottom of the box absorbs the tropical air; another part of the heat It is mainly transmitted to the tail and bottom of the metal casing of the chassis for heat dissipation; and a part of the heat is absorbed by the lower temperature heat flow remaining after the above-mentioned CPU air inlet flows.

Considering that the high-power discrete graphics card generates a large amount of heat, and the air inlet of the graphics card is limited, a side air inlet is also added, and the inflowing cold air mainly absorbs the area in the back space of the chassis and the upper part of the back side of the small partition. The heat of the area.

The cold air flowing in the four air inlets is heat-exchanged with the heat sink, the metal partition, the heating hardware, and the inner wall of the metal casing of the chassis, and then becomes a heat flow of the air, and is installed in a plurality of turbo fans at the upper half and the tail of the chassis. Exhaust from the outside of the box.

The beneficial effects of the utility model are:

The utility model is suitable for an ultra-thin computer mainframe box. The ultra-thin mainframe box is about 1/6 of a traditional full-tower chassis. In the case of fully loaded hardware, the ultra-thin mainframe box is about half the weight of a conventional full-tower chassis. This ultra-thin mainframe can meet almost all conventional motherboard models (such as ATX, M-ATX, ITX, etc.) on the market. It can be installed to support all 3.5-inch hard drives and 2.5-inch hard drives. It can be installed to support all full height and half. High, ultra-long, high-power discrete graphics card, can be installed to support notebook optical drive within 14mm thickness. The hardware in the main chassis has been rearranged and the connection form is defined. There is a metal plate in the box, and the hardware is installed in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately. The main box has a matching integrated "U". Glyph slider housing (this slider housing can be transparent, The translucent material provides an extremely simple operating mode for the user to open/close the main unit. The overall one has excellent heat dissipation performance and humanized one-button intelligent temperature control system. The CPU heatsink, discrete graphics heatsink, power supply box, and exhaust fan in this ultra-thin mainframe are all custom-sized models that match this chassis. The setting of specific related components has the following advantages:

1) The main board support column on the partition has the same function as the traditional one, but there is one more use here. Because the main board support column is electrically conductive and connected to the partition. Because this ultra-thin chassis is designed with the metal separator as the DC negative pole of the whole machine and the grounding bearing main conductor. The mounting hole of the PC motherboard is connected with the output DC negative pole and the grounding position of the main board. The conductive screw or the bayonet is fixed to the main board support column of the partition plate through the main board mounting hole, thereby realizing the partial DC negative output of the main board output. / Direct connection between the grounding and the metal partition, part of the DC negative pole/grounding output from the main board is transmitted to the metal partition through the main board support column, and then the bottom of the power supply box and the metal partition board surface are contacted and returned to the power supply box. . In the traditional PC mainframe, a large number of wires are connected to the power supply slot of the main board, and all the DC negative output of the main board is directly transmitted back to the power supply box, which requires a large number of wires and takes up a lot of space.

2) The cover plate is concealed/covered with an ultra-thin flat circuit, which may be referred to as a "invisible circuit spacer". By redefining the layout within the host computer, the hardware compatibility is excellent (supporting more than 99% of the conventional hardware on the market). It also subtly realizes that the same location space can be installed according to different needs of users, and the chassis volume is reduced to a minimum when the utilization of the space position in the chassis and the free collocation are improved: First, the invisible circuit partition is highly efficient. It solves the signal and power transmission between hardware, rearranges the hardware, and greatly reduces the size of the chassis. Second, it provides a platform for mounting fixed support for each hardware. Third, because of the metal matrix partition and the chassis metal casing. Connected to provide good thermal and thermal support for parallel mounting of hardware mounted on the back of the bulkhead.

3) The partition socket is to directly or indirectly connect the hardware in the chassis to the corresponding partition circuit according to the interface type of different hardware; the advantage of the FFC line is that it is ultra-thin soft, precise, and can pass a large current, suitable for Docking between the bulkhead socket and the hardware for a short distance. The bulkhead sockets are soldered or contacted directly to the corresponding bulkhead circuit.

First, some hardware in the chassis can be directly plugged into a matching bulkhead socket for use. Such as 3.5-inch, 2.5-inch hard drive, because it is the hardware used more often, so that the design can be used directly, very fast and user-friendly. Hardware that cannot be plugged directly into the bulkhead socket uses the shortest threaded connection concept to connect the hardware to the matching bulkhead socket with a cord. It also greatly reduces the wiring between the hardware, making the whole machine simple and beautiful.

Second, the movable partition socket is generally used for the design of different hardware in the same partition position. That is, increase the number and type of hardware that can be extended in the chassis without increasing the size of the chassis.

Third, since the mounting position of the movable bulkhead socket on the bulkhead circuit is an inner concave area, there is a circuit contact point of the bare conductor in the concave area. When other hardware is installed in the same position, the surface height of the bare circuit contact point in the recessed area is lower than the height of the surrounding spacer surface, so that a short circuit is not caused by touching other hardware. When the recessed area is not used, the recessed area can be filled with a matching insulating patch to isolate insulation and dust.

4) Main board orientation: The main board is backed by the front of the partition plate and is fixed parallel to the main board support column on the front side of the partition. Because the main box is a vertical design, on the one hand, the center of gravity of the whole machine should be moved down as much as possible, and the end of the main board close to the CPU position is obviously biased; on the other hand, the air heat flow in the chassis is continuously flowing upwards and concentrated in the chassis. The upper layer of space. Therefore, the following effects are obtained: First, the end of the motherboard placed on the CPU is obviously biased, and the downward placement allows the overall center of gravity of the chassis to be moved downward, so that the chassis is more stable in the vertical state. Second, since the chassis is vertical, the air heat flow is rising upwards, and the temperature of the lower airflow of the chassis is lower than that of the upper airflow of the chassis. Therefore, the north end of the motherboard near the CPU is placed downward, which is more conducive to the heat dissipation effect of the CPU heat sink in the airflow.

5) The CPU heat sink is fixedly connected with the heat-conducting base. The heat-conducting base is fastened to the CPU chip by the protruding structure of the backrest of the bridge, and the bridge is fixed to the two sliding rods. On the upper side, the two sliding rods are respectively inserted into the mounting holes of the four CPU heat sinks on the main board through the chucks on the movable supporting column, and finally the expansion pins are inserted into the pin holes of the supporting pins, thereby bringing the entire buckle bracket together The CPU heatsink is fastened together on the motherboard. Its role is as follows:

First, since the bridge pressure rod in the buckle passes through the convex structure at the center of the back surface of the heat conduction base, the downward pressure of the buckle is concentrated on the central area of the heat conduction base, so that the contact surface between the heat conduction base and the CPU chip is stressed. Very uniform, making the thermal conductivity between them stable.

Secondly, because the sliding rod, the bridge bar and even the convex structure on the back of the heat-conducting base of the buckle are resilient structural materials, the heat-conducting base and the CPU chip are not caused by excessive force or imbalance during manual fastening. The thermal conductivity of the contact between the surfaces changes too much, and it is not easy to deform and bend the main board.

Thirdly, because the buckle bracket adopts movable fixed design in many places, it is almost compatible with all conventional motherboard models. The fasteners are few and light, the disassembly and assembly operation is extremely convenient, and the disassembly and assembly can be completed in 10 seconds.

Fourth, since the convex structure on the back surface of the heat-conducting base can move in the concave sliding groove in the bridge pressing rod, the bridge pressing rod can move on the sliding rod, so the entire CPU heat sink can be in a small range in any direction in the plane of the main board. Panning greatly reduces the chance that the CPU heatsink edge will not be properly installed due to the conflict with the location of the components on the motherboard.

6) CPU additional heat sink: for high-power CPU heat, without using water cooling, without increasing the size of the chassis and sacrificing CPU heat sink compatibility, the best solution is to use a vacuum heat pipe to CPU Part of the heat on the chip is quickly transferred to the metal case of the chassis for heat dissipation. Its role: First, because the CPU additional heat sink is a mobile installation, users can freely choose whether to install according to the needs, without having to change the entire CPU heatsink. Greatly save the user's economic expenses. Second, although the chassis is small in size, it cleverly utilizes the metal casing of the chassis to quickly transfer part of the CPU heat to the casing for heat dissipation, which greatly increases the effective area of heat dissipation. Third, due to the special design of the air inlet hole in the bottom plate (bottom casing) of the ultra-thin chassis, the heat transferred from the CPU additional heatsink can be taken away by the airflow more quickly, and the heat is transferred to the chassis. The location affects the heat dissipation of other hardware. Fourth, since the evaporation end and the condensation end of the CPU additional heat sink are processed into a bellows shape, the flexibility of the vacuum heat pipe is greatly improved, and the user is easier to operate and adapt to different types of main boards.

7) Inner wall expansion socket: First, cleverly and efficiently utilize the free space above the south end of the motherboard. Since the notebook optical drive and the 2.5-inch hard disk are very small and light, the heat generation is very low, so the impact on the center of gravity and heat dissipation of the entire chassis is almost can be omitted. Second, because the motherboard has a lot of pins, slots and traces on the south end, it affects the appearance. Just parallel to the notebook optical drive, 2.5-inch hard drive installed in this position on the motherboard, can be subtly blocked, so that the overall layout of the chassis is more beautiful. Third, considering the computer hardware of the optical drive, most users use the frequency very low, so the user-friendly inner wall expansion socket is designed to be active installation type, and the user can choose whether to install according to his own use requirements.

8) Mainboard I/O baffle partition card slot: Since the main chassis adopts the ultra-thin design concept, in order to minimize the thickness space required for the main board in the chassis, the main board I/O bezel (The motherboard back panel) The side near the back of the motherboard snaps into the slot in the partition. This solution uses the original I/O bezel (board backplane) of the motherboard to minimize the required thickness of the motherboard in the main chassis, and the installation method is as simple as the traditional chassis.

9) Backspace of the partition: Considering the need for parallel mounting of various hardware mounted on the back of the partition, there is a certain need for heat dissipation, so the back of the partition is not only matched with the power supply box, power distribution module, and bulkhead socket. In addition to the contact points of the baffle circuit, the surface of other areas on the back side of the baffle is presented as a flat, thermally conductive metal plate.

Independent graphics card back-mounted installation structure:

1 Internal dispersion type: Its role is first, the parallel connection and close-range placement between the main board and the independent graphics card greatly reduce the occupied space volume. Second, because the I/O interfaces of the mid- to high-end discrete graphics cards are mostly double-layered, considering the need to fully compatible with all graphics cards, and to minimize the space occupied by them, it is ingenious to I/ on the discrete graphics card. The O interface area is partially translated out of the west end of the motherboard. Plus there is no barrier between the I/O interface area of the discrete graphics card and the motherboard, so that regardless of the discrete graphics card Whether the I/O interface is single-layer or double-layer does not affect its installation and use in the chassis, achieving the same compatibility as the traditional chassis.

2 external dispersion: its role is the first, the motherboard and the independent graphics card use parallel, close-range placement, greatly reducing the occupied space. Second, the biggest advantage of this method is that you do not need to modify the radiator and fan of the discrete graphics card, you can use the original radiator and fan of the discrete graphics card. And this way is very compatible. The disadvantage is that the required chassis space is larger than the "inside" type.

10) Internal-discrete independent graphics card heatsink: Its role is first, the internal-scattering discrete graphics card heatsink is thin and flat, occupying a small volume. Second, since the heat sink is intimately contacted with the metal partition or the inner wall of the metal casing of the case through the condensation section of the vacuum heat pipe, and the graphics card heatsink fan is not mounted on the heat sink, there is no additional space for occupying the heat sink. Therefore, the actual heat dissipation area of the discrete graphics card is greatly increased. Third, due to the heat dissipation of the metal separator and the chassis metal casing itself, the material cost and the quality of the graphics card heatsink are greatly saved. Fourth, because the strip-shaped fins of the graphics card heat sink have a certain angle of inclination with the geographical vertical direction, it is beneficial to the natural upward lift of the air heat flow.

11) Fixing method between internal discrete graphics card cooler and discrete graphics card

In the traditional desktop mainframe, the discrete graphics card is directly inserted vertically into the graphics card slot of the motherboard. Since the motherboard and the discrete graphics card are both large-sized hardware in the chassis, the space occupied by the two vertically is large, but the compatibility of the hardware is good.

It has the following functions: First, the fixed heat sink achieves a historic speed in the ease of installation with a discrete graphics card, and is installed in almost one second. Secondly, the fixed heat sink is pressed by the elastic silicone pad to vertically project the GPU chip to the center of the back of the graphics card PCB, so that the surface of the GPU chip is flat on the front surface of the heat conductive base. Because of the central force, the force between the GPU chip and the thermal base is naturally balanced. Third, the user no longer has to worry about the heat transfer effect caused by the uneven force of the four screws when installing the conventional heat sink. Fourth, because some computer mainframes use centralized display or nuclear display, there is no separate graphics card in the mainframe. At this time, the position of the discrete graphics card on the partition is idle. The hard disk or/and power box can be mounted in parallel at this position on the back of the partition according to the user's needs. Make full use of the free position to make the space on the back of the partition multi-functional.

12) Ultra-thin contact type power supply box: small in size, it is directly connected to the separator circuit through the power supply output port on the bottom surface. Due to the large contact area of the interface circuit, large current transmission can be performed. The power box also converts the input AC to a stable DC, but only converts the highest value of DC power required to output the hardware (currently the maximum DC voltage required in the main chassis is +12V). The highest voltage DC output is converted to the voltage DC required by each hardware via the "power distribution module" on the bulkhead circuit, and then connected to the corresponding hardware via the "separator socket". If the power supply of a single power supply box is insufficient, it can be connected in parallel in the chassis. Install 2 to 3 power supply boxes to double the power supply. This ultra-thin power supply box has a concentrated internal heat source and a concentrated heat source. The large size of the power box housing is made of aluminum alloy. The heat element inside the power box is directly attached to the aluminum alloy case, or the vacuum heat pipe is connected to the aluminum alloy case, and most of the heat is quickly transferred to the power box case. . Because the power box is closely parallel to the metal partition or a part of the metal wall of the chassis, through the metal partition or the metal casing of the chassis, and the ventilation inside the chassis to achieve large-area efficient heat dissipation.

Function: First, the reason is that the DC output of the power box is directly contacted and transmitted to the corresponding diaphragm circuit on the partition plate because the contact area is large and the fit is tight, and a large current can be stably passed. Second, due to the extremely compact structure inside the power box, and the direct connection to the diaphragm circuit for transmission and transmission, no wires are required. The space occupied by the power box in the chassis is greatly reduced. Thirdly, the power box passes through a large area and close contact with the partition or the inner wall of the casing, not only smoothly connects the DC negative pole/ground in the power box to the metal partition, but also solves the heat dissipation of the power box in an ingenious and efficient manner. The problem. Fourth, since the power supply box is connected through the contact point of the concave partition circuit on the partition plate, when the power supply box is not installed here, after filling the concave area with the insulating sheet, the other space can be installed in this position space. hardware. Achieve multi-effect matching of the same location space in the chassis.

13) Construction and installation location of the power distribution module:

First, since the bottom surface of the power distribution module uses the same large-area pressure-contact conductive transmission structure as that of the power supply box bottom surface structure, stable transmission of large current can be performed between the power distribution module and the partition circuit.

Second, a power distribution module is installed in the middle section of the back of the inner partition of the chassis, near the back edge of the partition of the front panel of the chassis. The above location is also very close to the independent graphics card auxiliary power supply slot, the turbo fan on the back of the partition, the hard disk or power supply box on the back of the partition, and the main power supply slot on the main board on the front of the partition, and the power distribution A socket/separator socket that matches these hardware interfaces is integrated into the module. This allows the power outlet/separator socket on the power distribution module to interface with these hardware with the shortest connection thread. The space volume occupied by the computer hardware is greatly reduced, and the structure inside the chassis is simple and beautiful. Third, since the power supply trace is very short, the wire resistance of the wire connecting the wires is small, and the conductor cross-sectional area required for the wire is small. The FFC line can be used to connect the wires, making the wire wires thinner and more convenient. Fourth, since the temperature control module is integrated in the power distribution module, the structure space is more efficient and compact, and the power distribution module and the temperature control module are integrated into one body, which is convenient for the user to disassemble and use.

14) One-button intelligent temperature control system: This ultra-thin chassis is used as a desktop-level mainframe. In order to meet the demanding requirements of users at all levels for heat dissipation and mute, a fool-type intelligent temperature control is adopted. That is, through a control knob on the chassis shell, manually adjust the speed range of the fan inside the chassis (that is, the section that allows the highest value of the fan speed to the lowest value), and then the temperature control module in the chassis monitors the temperature according to the temperature probe feedback. Degree, intelligent regulation of the specific speed of the fan at this time, and the value of the fan speed is always in this speed range.

This allows a variety of users to control the balance of heat and noise in the host. This one-button temperature control system can also be applied to notebooks and all-in-ones.

The fool-type one-key intelligent temperature control system of the utility model has the advantages of excellent user operation and very humanization. Secondly, it is no longer necessary to consider whether the fan has a PWM function, and does not need to enter the motherboard BISS to open and set. The third heat dissipation and noise are perfectly balanced.

15) Suction-type cooling air duct: Since the whole chassis has four inlet air inlets and optical drives into the opening of the disc, there are no other air inlet holes. Since the fan in the tail of the chassis continuously draws the air in the box to the outside of the box, the air pressure in the box is lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets to the box. Therefore, it has the following effects:

First, due to the sealed design of the whole machine in addition to several air inlets. In addition, the hardware layout in the chassis is scientific and concise, and the generated wind resistance is small. Due to the small size of the chassis, when the exhaust type is adopted, the air pressure difference generated in the cabinet is more obvious than that of the large chassis, and the air passage formed in the chassis has a large air flow and a high wind speed.

Second, because the air duct formed by the low pressure generated by the suction in the chassis, and the hardware arrangement is scientific and simple, the wind resistance is small, the air in the air duct flows in an orderly manner, and the phenomenon of returning hot air does not occur. For example, the graphics card windshield on the back of the partition plate simply and efficiently flows the cold air of the air inlet of the graphics card through the heat sink of the independent graphics card without being disturbed by the heat flow in other spaces in the chassis.

Third, due to the form of air blowing, when the airflow encounters the real object, the air pressure on the surface of the object (the "air pressure" is not the "barometric pressure difference", my previous typo!) will rise, and the air pressure will increase to the heat state. It is not conducive to the heat exchange between the surface of the object and the air of the airflow; if the exhaust type is adopted, the air pressure on the surface of the airway in the air duct is slightly decreased, and the air of the low pressure air is more likely to absorb the heat and expand its volume, which is beneficial to the surface between the physical object and the airflow. Heat exchange.

Fourth, the turbo fan installed in the idle position on the west end of the main board uses the idle position to exhaust and dissipate heat. There is no additional increase in the size of the chassis, and the movable mounting structure does not affect the disassembly and assembly of the hardware at all.

Fifthly, the above four air inlet openings are equipped with an air filter to filter the dust entering the air in the box, so that the main box is kept clean and has good ventilation and heat dissipation performance for a long time.

16) Semiconductor cooling and cooling: Due to the traditional water cooling or air cooling, no matter the size or heat dissipation area design, the temperature of the heating chip or component in the mainframe of the computer is always higher than the ambient temperature of the main box, especially In high temperature environments and with high power CPUs and discrete graphics. If the metal partition in the chassis, the bottom of the metal case of the chassis, or the inner wall of the top is flat, the semiconductor is mounted. The cold film is cooled and cooled, and part of the heat energy in the main box is quickly transmitted to the tail of the metal casing of the chassis through the vacuum heat pipe for heat dissipation, which not only can obviously achieve the cooling effect in the main box, but also does not increase the extra volume of the main box.

DRAWINGS

Figure 1 is a schematic structural view of a computer mainframe of the utility model (1);

Figure 2 is a schematic view of the structure of the mainframe of the computer of the utility model (2);

Figure 3 is a schematic view of the structure of the mainframe of the computer of the utility model (3);

Figure 4 is a schematic structural view of the mainframe of the computer of the utility model (4);

Figure 5 is a schematic view of the structure of the mainframe of the computer of the utility model (5);

Figure 6 is a schematic view of the structure of the mainframe of the computer of the utility model (6);

Figure 7 is a schematic structural view of a computer mainframe of the utility model (7);

Figure 8 is a schematic structural view of a computer mainframe of the utility model (eight);

Figure 9 is a schematic structural view (1) of the utility model of the utility model;

Figure 10 is a schematic view showing the structure of the partition of the computer mainframe of the utility model (2);

Figure 11 is a schematic view of the structure of the utility model of the mainframe of the utility model (3);

Figure 12 is a schematic view showing the structure of the partition of the computer mainframe of the utility model (4);

Figure 13 is a schematic view showing the structure of a computer mainframe box with a sliding cover installed in the utility model;

Figure 14 is a schematic view showing the structure of the slider of the present invention;

Figure 15 is a schematic view showing the structure of the utility model when a graphics card is mounted thereon;

Figure 16 is a schematic structural view of a graphics card mounted on the partition of the utility model;

17 is a schematic structural view of a separate graphics card heat sink of the present invention;

Figure 18 is a schematic structural view of the power supply box of the present invention;

19 is a schematic structural view of a power distribution module of the present invention;

Figure 20 is a schematic structural view of the movable partition plate socket of the present invention;

21 is a schematic structural view of the CPU heat sink of the present invention when installed;

FIG. 22 is a schematic structural view of the mounting and fixing device of the CPU heat sink of the present invention.

The following is a description of the logo in each figure:

1, the main box shell; 11, the top of the main box shell; 12, the bottom of the main box shell; 13, the tail of the main box shell; 14, the side top air inlet; 15, the bottom of the box air inlet; 16, the main board I / O block Plate partition card slot; 17, exhaust air opening; 18, manual adjustment switch;

2, slide cover; 21, slide front panel (front of the chassis shell); 22, CPU air inlet; 23, graphics card air inlet; 24, into the opening of the disc; 25, dust-proof net;

3, partition; 31, main board support column; 32, partition circuit; 33, concave contact point; 34, fixed partition socket; 35, movable partition socket; 36, positioning hole; 37, temperature probe ; 38, ventilation holes; 39, graphics card windshield;

4, motherboard; 41, motherboard I / O interface group; 42, CPU chip; 43, PCI-E / graphics card slot; 44, memory slot; 45, motherboard main power supply slot; 46, motherboard auxiliary power supply slot 47, motherboard mounting hole; 5, buckle; 51, support column, also known as buckle support column; 52, sliding rod; 53, bridge pressure rod; 54, expansion pin;

6, CPU heatsink; 61, (CPU) thermal base; 62, (CPU) vacuum heat pipe; 63, (CPU) heat sink fins; 64, CPU additional heatsink;

7, discrete graphics; 70, discrete graphics PCB; 71, discrete graphics I / O interface group; 72, GPU chip; 73, independent graphics card auxiliary power supply slot; 74, (independent graphics) gold finger;

8, independent graphics card radiator; 81, (independent graphics card radiator) thermal base; 82, (independent graphics card radiator) vacuum heat pipe; 83, (independent graphics card radiator) cooling fins;

9, power box; 91, bottom; 92, output port; 93, contact copper; 94, positioning pin;

10, power distribution module; 101, (the bottom of the power distribution module); 102, DC input port; 103, DC output port; 104, shrapnel;

201, fan; 202, 2.5-inch hard disk; 203, hard disk; 204, optical drive; 205, expansion socket; 206, silicone pad; 208, motherboard I / O baffle.

detailed description

The present invention will be further described below in conjunction with the accompanying drawings:

As shown in FIG. 1 to FIG. 14, a computer case includes a main body case 1 frame and a computer hardware, wherein the computer hardware includes a main board 4, a hard disk 203/power box 9 and a corresponding heat sink, and the main case 1/skeleton is provided. There is a partition 3 which divides the cavity formed by the main casing 1/skeleton into two, and the main plate 4 is fixed on one side of the partition 3, which is the front surface of the partition 3. A hard disk 203/power supply box 9 is provided on the other side of the partition 3, which is the back surface of the partition 3. The main board 4, the hard disk 203/the power supply box 9 are all parallel to the side surface of the partition plate 3, and the circuit board 3 is provided with a circuit on the front side or/and the back side or the partition plate 3, and the circuit board 3 is provided with computer hardware for circuit connection. Baffle socket. When the separator 3 is made of a metal material, it is called a metal separator.

The computer mainframe is a vertical ultra-thin computer mainframe, and the overall outline is a flat square body, but the partial corners and planes have different angles or configurations, and the volume is about 1/6 of that of a conventional PC mainframe, and the hardware is fully loaded. In this case, this ultra-thin host is about half the weight of a traditional PC mainframe. At the same time, it is possible to install motherboard 4 models (such as ATX, M-ATX, ITX, etc.) that support almost all PCs currently on the market. An optical drive 204 is mounted on the partition 3, and a notebook optical drive 204 supporting a thickness of 14 mm is preferentially mounted. The hardware in this ultra-thin host has been rearranged and the connection form definition. There is a metal plate in the box, and the hardware is installed in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately; this ultra-thin host has a matching integrated "U" The glyph slide 2 housing (this slider 2 housing can be a transparent, translucent material) provides an extremely simple operating mode for the user to open/close the main unit. The front surface of the partition plate 3 is further provided with a main board support column 31 (on which the main board 4 is mounted), a partition 3 invisible circuit, a partition socket, a CPU heat sink 6 buckle 5, a CUP additional heat sink, an inner wall expansion socket 205, and a main board. I/O baffle spacer card slot 16.

The specific structure is as follows:

01) Main board support column 31

The front surface of the partition plate 3 is provided with a main plate support column 31, and the main plate 4 is fixed to the surface of the partition plate 3 through the main plate support column 31. The main board support column 31 has an internal thread hole perpendicular to the plate surface of the partition plate 3 or a bayonet hole matched with the expansion bayonet. The main board support column 31 suspends the main board 4 in parallel on the front surface of the partition plate 3, and the main board 4 The back surface is opposite to the front surface of the partition plate 3, and the main plate 4 is fixed in the main plate support column 31 on the partition plate 3 by screws or expansion bayons. The main board 4 and the partition 3 are suspended so that the protruding pins on the circuit board on the back side of the main board 4 do not come into contact with the surface of the partition 3 to cause a short circuit.

A plurality of main board support columns 31 are disposed on the front surface of the partition plate 3, and the height of the board surface of the partition plate 3 is 4-7 mm, and the distribution positions of the main board support columns 31 are opposite to the mounting holes of the corresponding supporting main board 4. One by one match. The main board support column 31 is made of a conductive metal material and is fastened and electrically connected to the partition plate 3.

The main board support column 31 in the present application not only has the function of the main board support column 31 in the conventional chassis, but also because the ultra-thin PC main box is designed as the main body of the DC negative/ground bearing of the whole machine, and the conventional main board The mounting hole is connected to the output DC negative pole and the grounding of the main board 4, and the conductive screw or the bayonet pin is fixed in the main board supporting column 31 of the partition plate 3 through the main board mounting hole 47, that is, the output DC negative pole of the main board 4 is realized/ The ground is in direct communication with the partition 3.

02) Separator 3 with stealth circuit

The above circuit is a flat conductor circuit and the maximum thickness of the conductor is ≤0.5 mm, and the flat conductor circuit and the separator 3 are insulated from each other, and the surface height of the flat conductor circuit is not higher than the height of the surface of the partition plate 3 around it, except for the socket. The entire surface of the circuit outside the area is covered by an insulating and wear-resistant layer. A plurality of pieces of hardware are mounted in parallel on both sides of the partition plate 3, and most of the wires connected between the respective hardware are covered on the surface of the partition plate 3 or embedded in the partition plate 3 by the above-mentioned very flat conductor circuit, and are densely packed. Arrange and concentrate The line effectively solves the signal and power transmission between the hardware, rearranges the hardware, and greatly reduces the size of the chassis.

The partition plate 3 is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate 3, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate 3, an ultra-thin insulating copper plate embedded partition plate 3 or a metal base. Conductive coated circuit separator 3. A platform for mounting fixed supports can be provided for each hardware.

Preferably, the separator 3 is a glass fiber/semi-glass fiber-based printed circuit-embedded separator 3, wherein the glass fiber/semi-glass fiber is a substrate, and the glass fiber/semi-glass is formed to meet the design requirements of the circuit wiring and the physical shape. The fiber-based PCB circuit board, the partition plate 3 is a metal plate made of aluminum alloy or copper, and a groove which is opposite to the shape and size of the corresponding PCB circuit board is processed at a position of one or both sides of the partition plate 3, The PCB circuit board is closely attached to the corresponding recess in the partition 3, so that the surface of the PCB circuit board is at the same plane height as the surface of the partition 3 on which it is placed. Since the flat conductor circuit on the separator 3 is closely integrated with the separator 3, the entire circuit surface is covered with the insulating layer and the wear layer except for the solder joints and the contact points of the circuit, so that almost no visible is observed. The circuit on the spacer 3 is collectively referred to as "invisible circuit spacer 3". The flat conductor circuit on the hidden circuit board 3 is hereinafter referred to as "separator circuit 32". The partition 3 of the embedded PCB circuit board is covered with an insulating layer and a wear layer.

The specific operation process is to process a groove having a depth of 0.1 to 1 mm on the partition plate 3. The position, shape and size of the groove are determined according to the specific requirements of the wire, and then the ultra-thin printed integrated PCB circuit board is filled to the concave surface. In the groove, the groove of the separator 3 and the surface of the PCB circuit board are insulated and coated, and the PCB circuit board is seamlessly fastened in the corresponding groove of the separator 3 by an adhesive. After tightening, the surface height of the PCB circuit board is basically the same as the height of the board surface of the partition plate 3, and finally the insulating and wear-resistant coating is applied on the entire surface of the partition plate 3 in which the PCB circuit board is fastened. Therefore, the partition 3 is integrated with the surface of the PCB circuit board, and the circuit inside is hardly seen.

Since the heat dissipation and heat dissipation of the back surface of the separator 3 is required, and the simplified design and process are integrated, the PCB circuit board is uniformly embedded in the front surface of the separator 3.

Preferably, the partition plate 3 is an ultra-thin insulating copper sheet embedded with the partition plate 3, that is, a process of etching, CNC milling or die-molding, and processing the position of the metal plate (separator 3) where the wires need to be routed. The desired shape and size of the groove. The copper sheet with a thickness of 0.05-0.5 mm is made into various traces required for the design by etching or die stamping and shearing process, and the outermost contour specifications of the copper traces are densely arranged and the metal The shape and size of the grooves on the flat plate (separator 3) match. The groove on the metal plate (separator 3) and the processed ultra-thin copper piece are routed, the surface is insulated, and finally the ultra-thin insulating copper piece is closely embedded in the metal plate (separator 3) by an adhesive. In the corresponding groove position, the surface height of the ultra-thin copper wire is not higher than the surface height of the surrounding metal plate (separator 3). This process plan is suitable The circuit traces that are arranged with excessive current are designed on the metal plate (separator 3).

Preferably, the partition 3 is an FPC flexible wire interposing partition 3, except that the embedded circuit material is an FPC flexible wire row, and other processes embedded in the separator 3 and the above-mentioned "glass fiber/semi-glass fiber base printing" The circuit board embedded partition 3" is basically the same.

Preferably, the separator 3 is a metal-based conductive coating circuit separator 3, that is, the metal surface is covered with an insulating layer, and then the liquid/colloidal/powder conductive coating is used to paint the desired trace circuit on the insulating layer. After curing by air drying or high temperature, a stable conductive circuit coating is formed, and finally the insulation and wear layer are covered on the entire circuit board 3 (except for the partial area connected to the bulkhead socket). The coatings and processes used in this solution are relatively expensive.

The partition plate 3 is made of the same material as the metal casing or the skeleton of the computer case, and is integrally formed by heat-melting or squeezing the material through a mold. The metal frame or casing of the partition 3 and the computer case may also be separated and separated, and the partition 3 is welded and fixed to the metal frame of the case or the inner wall of the case. Because the partition 3 is connected to the metal casing of the casing, it provides good heat conduction and heat dissipation support for the hardware that is mounted in parallel on the surface of the partition 3 in parallel. The above-mentioned "metal casing of the chassis" is the "main casing 1" in the figure.

The process of the separator 3 having the metal invisible circuit fixedly connected with the metal casing or the skeleton of the main box is: an integral type, that is, the partition 3 is integrated with the metal casing or the skeleton of the main box, and the material is thermally melted by a mold. Or integrally formed after extrusion. Then, the process is processed on the partition 3 in the formed main box, so that the ultra-thin circuit traces required for the design are arranged on/in the partition 3; the reflow soldering, the partition 3 and the metal frame or the outer casing of the chassis are Separate and independent, the ultra-thin circuit traces required for the design have been processed on/in the separator 3, and then the parts to be connected and fixed to the metal frame of the chassis or the inner wall of the case are soldered first, and the combination is matched. After that, it is placed in a reflow device for reflow soldering. After cooling out, the partition 3 is tightly fixed to the metal frame or casing of the chassis.

03) partition socket

The separator socket is directly soldered or contacted to the circuit of the corresponding partition 3. The hardware interface type of the partition socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk 203 interface, SAS hard disk 203 interface, SATA 7 +15pin data + power supply hard disk 203 interface, SATA7 + 6pin data + power supply optical drive 204 interface, motherboard 4 boot pin POWER SW, motherboard 4 restart pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin socket , the audio pin HD AUDIO of the motherboard 4, the PCI-E 16X slot of the discrete graphics card 7, the main power supply 24pin slot of the motherboard 4, the auxiliary power supply 4/8 pin slot of the motherboard 4, and the auxiliary power supply 6/8 pin of the discrete graphics card 7. A slot, or any combination of the above hardware interfaces. Some hardware in the main chassis can be directly inserted into the bulkhead socket, and some need to connect the hardware to the corresponding bulkhead socket through the FFC line, so the partition is inserted. The sockets have different interface types and shape sizes in order to match the hardware. The bulkhead socket interfaces the hardware in the main chassis with the corresponding bulkhead circuit 32 according to the interface type of the different hardware. The advantage of the FFC line is that it is ultra-thin, soft, accurate, and capable of passing large currents. It is suitable for short-distance docking between the bulkhead and the hardware.

The "separator socket" described above is a general term for the following "welded/fixed bulkhead socket" and "movable bulkhead socket".

The bulkhead sockets are divided into welded and movable types according to the layout and design requirements in the chassis. The bottom of the "separator socket" is arranged with the corresponding pins (pins) of the socket. The corresponding mounting position of the spacer circuit 32 has solder joints, and the pins (pins) at the bottom of the "separator socket" are arranged. Direct soldering is fixed to the solder joint location of the corresponding spacer circuit 32. The welded bulkhead socket is also referred to as a fixed bulkhead receptacle 34.

In the movable type, the bottom of the "baffle socket" is arranged with the corresponding pins (pins) of the socket, and these pins (pins) are in the form of exposed conductive metal domes 104, and the metal at the bottom of the "separator socket" There are a plurality of positioning pins 94 around the shrapnel 104. The movable bulkhead socket 35 is generally used for the design of different hardware in the same partition 3 position, that is, to increase the number and type of hardware that can be extended in the chassis without increasing the volume of the chassis.

The area on the bulkhead circuit 32 for mounting the "moving bulkhead receptacle 35" has a concave configuration 33 in which the exposed conductive, flat circuit contacts are arranged in an orderly manner, said "circuit contact point". It is the "concave contact point 33" in the figure. There are a plurality of positioning holes 36 in the partition 3 on the outer periphery of the concave area, and the size, the number, and the hole distance of the positioning holes 36 are completely identical with the matching positioning pins 94 at the bottom of the "moving bulkhead socket 35". .

When the bottom of the movable bulkhead receptacle 35 faces the mounting area on the bulkhead circuit 32, only the contact points of the circuit contacts in the recessed area of the movable bulkhead receptacle 35 of the interface type and the bulkhead circuit 32 are arranged. When the circuit definition and the socket direction are completely matched, the positioning pin 94 at the bottom of the movable partition socket 35 can be inserted into the positioning hole 36 of the concave portion of the partition circuit 32, and finally the movable type by the screw/expansion bayonet The baffle receptacle 35 is fixed to the partition 3, and the conductive metal dome 104 at the bottom of the "moving baffle receptacle 35" and the circuit contact point in the recessed area of the baffle circuit 32 are completely and accurately connected one by one. . Since the mounting position of the movable partition socket 35 on the partition circuit 32 is an inner concave portion, there is a bare circuit contact point in the concave portion, and the bare circuit in the concave portion is when other hardware is mounted at the same position. The surface height of the contact point is lower than the height of the surface of the surrounding partition 3, so that a short circuit is not caused by touching other hardware. When the recessed area is not used, the recessed area can be filled with a matching insulating patch to isolate insulation and dust.

In short, the bottom of the bulkhead socket is arranged with the corresponding pins of the socket, and the separator circuit 32 phase There should be solder joints at the installation position, the pins at the bottom of the spacer socket are directly soldered and fixed to the corresponding spacer circuit 32; or the bottom of the spacer socket is arranged with the corresponding pins of the socket, and these The pins are in the form of exposed conductive metal domes 104. Locating pins 94 are provided around the periphery of the springs 104 at the bottom of the bulkhead socket, and the area on the partition 3 for mounting the bulkhead sockets is concave. In the structure, the exposed conductive and flat circuit contact points are arranged in order in the concave area, and the corresponding positioning holes 36 are arranged on the partition 3 on the outer periphery of the concave area, and the partition socket is fixed by the screw/expansion pin On the partition 3, the conductive metal dome 104 at the bottom of the spacer socket is in precise contact with the circuit contact points in the recessed area on the spacer 3.

Some hardware in the main chassis can be directly inserted into the "separator socket", such as the 3.5-inch, 2.5-inch hard disk 202, because it is the hardware used more often, so that the design can be directly plugged in, very fast and user-friendly. Hardware that can't be plugged directly into the "baffle socket" uses the concept of the shortest threaded connection, and the cable is used to connect the hardware to the matching "baffle socket", which also greatly reduces the routing between hardware. Make the whole machine simple and beautiful.

04) Motherboard 4 orientation

As described above, the main board 4 is backed by the front surface of the partition plate 3 and is fixed in parallel to the main plate support column 31 on the front surface of the partition plate 3. Because the main box is a vertical design, on the one hand, the center of gravity of the whole machine should be moved down as much as possible, and the end of the main board 4 close to the CPU position is obviously biased, and the downward placement can lower the overall center of gravity of the main box, so that the main box On the other hand, the main box is vertical, and the air heat flow inside it is continuously rising, and is concentrated in the upper space of the main box. Compared with the upper air flow, the temperature of the lower airflow of the main box is required. It is low, so it is placed close to the north end of the motherboard 4 near the CPU, which is more conducive to the heat dissipation effect of the CPU heat sink 6 in the airflow.

Therefore, the north end side of the main board 4 near the CPU position is downward (can be vertical, or the angle between the downward direction and the vertical direction is ≤ 5°), and the west end side of the main board 4 (ie, one end of the main board I/O interface group 41) Facing the tail portion 13 of the chassis, the back surface of the main board 4 faces the front surface of the partition plate 3, and is fixed to the main board support column 31 parallel to the partition plate 3. Due to the angular position between the north end side and the west end side of the main board 4, there is a main board auxiliary power supply slot 46, which is projected on the front side of the main board 4 on the front side of the main board 4 on the front side of the main board 4, close to this. The partition 3 of the main board auxiliary power supply slot 46 has a bulkhead socket at the front side. The bottom pin (pin) of the baffle socket is sequentially connected to the output +12V DC and the DC negative (ground) in the baffle circuit 32, and is inserted into the main board auxiliary power supply slot 46 on the main board 4 through one end of the wire. The other end of the wire is inserted into the bulkhead socket for communication, so that the corresponding power supply circuit on the partition 3 communicates with the main board auxiliary power supply slot 46 on the main board 4.

That is, the main board 4 is backed by the front side of the partition 3, and the north end side of the main board 4 near the CPU position faces down, the main board 4 The west end, that is, one end of the main board I/O interface group 41 faces the tail of the chassis.

Projected on the north end of the main board 4 to the area on the front surface of the partition 3, a partition socket is disposed on the front side of the partition 3 adjacent to the auxiliary power supply slot of the main board 4, and the bottom stitch of the partition socket is connected to the partition circuit 32. One end of the wire is inserted into the motherboard auxiliary power supply slot 46 on the main board 4, and the other end of the wire is inserted into the bulkhead socket to connect the corresponding power supply circuit of the partition 3 to the main board auxiliary power supply slot 46 on the main board 4. .

05) CPU heat sink and CPU heat sink mounting fixture

The heat sink of the computer CPU includes a CPU additional heat sink 64 and a CPU heat sink 6. The CPU heat sink 6 is fixed by an H-bridge clamp device, that is, the mounting and fixing device of the CPU heat sink, the H-bridge press buckle The bracket comprises two sliding rods 52. The middle sections of the two sliding rods 52 are parallel to each other, and the two sliding rods 52 are bent at both ends, and are at an angle of 45° outward, at the two ends of the two sliding rods 52. Each of the bent sections has a support post 51 movable on the section. The bottom of the support post 51 has an expansion chuck. The size and shape of the expansion chuck are the same as the CPU heat sink 6 on the main board 4. The mounting holes are matched. Then, there are four movable support columns 51 at the two ends of the two sliding rods 52. Because of different types of the main board 4, the hole spacing between the mounting holes of the four CPU heat sinks 6 is different, so the sliding rod 52 is different. The support columns 51 at both ends are designed to be movable, and can meet the hole spacing requirements of various CPU heat sink 6 mounting holes, and are matched and fixed. The H-type bridge buckle bracket is the aforementioned buckle 5. The support post 51 is also referred to as a clip support post.

A bridge bar 53 which is freely movable in the direction of the axis of the two slide bars 52 is provided in a section parallel to the middle of the two slide bars 52, and the intermediate section of the bridge bar 53 has an inner groove structure. The two sliding rods 52 are resilient material members or the bridge pressing rods 53 are resilient material members. Since the sliding rod 52 of the buckle 5, the bridge pressing rod 53 and even the convex structure on the back surface of the heat-conducting base are resilient material, the heat-conducting base and the CPU chip are not caused by excessive force or imbalance during manual fastening. 42 The thermal conductivity of the contact between the surfaces changes too much, and it is not easy to deform and bend the main board 4. The two sliding rods 52 and the bridge pressing rods 53 are combined to form the "H" type structure, so the fastener 5 of the CPU is referred to as an "H-shaped bridge fastener bracket".

One end of the CPU additional heat sink 64 is a flat vacuum heat pipe evaporation end, and the other end is a vacuum heat pipe condensation end to which the (CPU) heat sink fin 63 is welded, and the CPU is attached to the heat sink 64. The corrugated tube greatly enhances the flexibility of the (CPU) vacuum heat pipe 62, making it easier for the user to operate and adapt to different types of motherboards 4. The bottom of the condensation end of the CPU additional heat sink 64 is flat, and is fixed on the inner wall of the metal casing of the chassis closest to the CPU by screws or snaps, thereby transferring part of the heat of the CPU heat-conducting base 61 to the metal casing of the chassis and the CPU is attached. The heat sink fins on the condensation end of the heat sink 64 dissipate heat.

The CPU heat sink 6 is a vacuum heat pipe type heat sink, and the bottom of the CPU heat sink 6 has a heat conducting base mounted on the CPU chip 42. On the edge of the heat-conducting base of the CPU heat sink 6, there is a groove perpendicular to the direction of the vacuum heat pipe arranged on the heat-conducting base, and the shape of the groove is just matched with the evaporation end of the CPU additional heat sink 64, the CPU After the evaporating end of the additional heat sink 64 fits into the groove of the edge of the heat-conducting base, it is fastened to the edge of the heat-conducting base by a cover plate and a screw. The front side of the thermally conductive base is directly parallel to the surface of the CPU chip 42. The substantially central position of the back surface of the heat-conducting base has a convex structure, and the concave sliding groove of the middle portion of the bridge pressing rod 53 can just buckle the protruding structure, and the bridge pressing rod 53 is placed on the back surface of the heat-conductive base. Since the bridge pressing rod 53 of the buckle 5 passes through the convex structure at the center of the back surface of the heat-conducting base, the downward pressure generated when the buckle 5 is tightened is concentrated on the central area of the heat-conductive base, so that the heat-conductive base and the CPU chip 42 are The contact surfaces are evenly stressed, making the thermal conductivity between them stable.

The heat conducting base is attached to the CPU chip 42 by a protruding structure that is fastened to the back surface thereof by the bridge pressing rod 53, and the bridge pressing rod 53 is movably fixed to the two sliding rods 52, and the two sliding rods 52 are movable. The chucks on the support columns 51 are respectively inserted into the mounting holes of the four CPU heat sinks 6 on the main board 4, and finally the expansion pins 54 are inserted into the pin holes supported therein, thereby the entire clip 5 brackets together with the CPU heat sink 6 Fastened together on the main board 4. Since the convex structure on the back surface of the heat conducting base can move in the concave sliding rail groove in the bridge pressing rod 53, the bridge pressing rod 53 can move on the sliding rod 52, so that the entire CPU heat sink 6 can be small in any direction in the plane of the main board 4. The translation of the range greatly reduces the chance that the edge of the CPU heat sink 6 will not be properly installed due to the conflict with the position of the components on the motherboard 4.

The CPU additional heat sink 64 adopts a movable installation mode, and the user can freely select whether to install according to requirements, without replacing the entire CPU heat sink 6, which greatly saves the user's economic expenses. Although the main chassis is small in size, it cleverly utilizes the metal casing of the chassis to quickly transfer part of the CPU heat to the casing for heat dissipation, which greatly increases the effective area of heat dissipation.

Since the buckle 5 bracket adopts a movable fixed design in many places, it is almost compatible with all conventional motherboard models. The buckle 5 has few accessories and light weight, and the disassembly and assembly operation is extremely convenient, and the disassembly and assembly can be completed in 10 seconds.

Moreover, the bottom 12 of the ultra-thin PC main box casing has an elongated strip-shaped air inlet opening, which increases the airflow exchange around the bottom plate of the chassis; and because of this long opening, the partition 3 is greatly hindered. The heat on the chassis floor area in the front space is transferred to the chassis floor area of the back space of the partition 3 and the partition 3 itself, so that the CPU attached to the chassis floor installed in the front space of the partition 3 is attached with the heat sink 64. The heat transferred can be taken away by the airflow more quickly, and it will not be transmitted to other parts of the chassis and affect the heat dissipation of other hardware.

06) inner wall expansion socket 205

The computer chassis is vertical, the motherboard 4 is placed close to the CPU end, that is, the north end of the motherboard 4 is downward, the south end of the motherboard 4 is upward, and the inner wall of the chassis casing near the south end of the motherboard 4 is the top inner wall of the chassis, and the inner wall is vertically high. In the long strip-shaped area of the front surface of the

main board

4, 15 to 45 mm, a long strip-shaped socket is movably mounted to form an inner wall expansion socket 205. The inner wall expansion socket 205 includes three interfaces, DC+5V and DC negative. Power supply interface, 7+6pin SATA optical drive 204 interface and 7+15pin SATA hard drive interface.

The inner wall expansion socket 205 adopts a long strip PCB circuit board to concentrate the wires, the long strip PCB circuit board closely fits the inner wall of the chassis, the circuit board portion extends to the edge of the front surface of the partition plate 3, and the extension of the long strip PCB circuit board The upper circuit is connected to the corresponding circuit on the partition 3, and is fixed by welding. The pins on the bottom of the interface socket are fixed on the corresponding circuit of the long PCB circuit board by soldering or contact, and the socket interface is oriented parallel to the surface of the partition 3.

Considering the computer hardware of the optical drive 204, most users use the frequency very low, so the user-friendly "inner wall expansion socket 205" is designed to be an active installation type, and the user can select whether to install according to his own use requirements.

When the notebook optical drive 204 or the 2.5-inch hard disk 202 is inserted into the inner wall expansion socket 205, the notebook optical drive 204 or the 2.5-inch hard disk 202 is parallel to the main board 4 and is located above the south end side of the main board 4. Considering the practicability, the input port of the notebook optical drive 204 faces the front of the main chassis. Cleverly and efficiently utilized the free space above the south end of the motherboard 4, since the notebook optical drive 204 and the 2.5-inch hard disk 202 are very light and low in heat generation, the influence on the center of gravity and heat dissipation of the entire chassis can be neglected. In addition, since the motherboard 4 has a lot of pins, slots and wires on the south end side, the effect is beautiful, and the notebook optical drive 204 and the 2.5-inch hard disk 202 which are installed in parallel at the position of the main board 4 can be subtly blocked and the whole chassis can be shielded. The arrangement is more beautiful.

07) Main board I/O bezel partition card slot 16

A board I/O baffle partition slot 16 is disposed at a position on the edge of the main board 4 where the I/O interface group is located on the west end of the main board 4, and the slot is opened. Straight groove/hole slit of about 1mm, seam depth of 2~3mm, total length of slot/opening ≥ total length of main board I/O baffle 208 (main board 4 tailgate), loading main board 4 into main unit Before the box, first insert a long side of the motherboard I/O baffle 208 (the main board 4 back panel) into the groove/hole of the partition 3, and then the entire main board I/O bezel 208 (main board 4) The tailgate) is snapped into the matching hole in the motherboard I/O bezel 208 (main board 4 tailgate) at the rear of the chassis. Since the mainframe adopts the ultra-thin design concept, in order to minimize the height space required for the motherboard 4 in the chassis, the motherboard I/O barrier 208 (the motherboard 4 tailgate) is close to the back of the motherboard 4. One side snaps into the slot of the partition 3 and is mounted in a manner that is as simple as a conventional chassis.

The hardware installed in the space on the back side of the partition 3 includes a separate graphics card 7 including a heat sink, a power supply box 9, a turbo fan 201, a hard disk 203, and a power distribution module 10, all of which are mounted in parallel on the partition 3, due to the parallel stickers. A variety of hardware mounted on the back of the partition 3 has a certain requirement for heat dissipation, so that the back surface of the partition 3 is in contact with the concave partition circuit 32 which is matched with the power supply box 9, the partition socket, and the power distribution module 10. In addition, the surface of the other areas on the back side of the spacer 3 is presented as a flat, thermally conductive metal plate. The specific structure is as follows:

08) Standalone graphics card 7

The discrete graphics card 7 is disposed in parallel with the back surface of the spacer 3. This ultra-thin computer chassis can be installed to support all full-height, half-height, ultra-long, high-power discrete graphics cards7. The I/O interface on the discrete graphics card 7 is oriented the same as the I/O interface on the motherboard 4, and the I/O interface area on the discrete graphics card 7 is offset from the edge of the motherboard 4 PCB board, and the edge of the motherboard 4 PCB is set. The edge of the PCB board of the /O interface, that is, the west end edge of the motherboard 4. The above-mentioned "I/O interface on the discrete graphics card 7" is the "independent graphics I/O interface group 71" in the figure, and the above "I/O interface on the motherboard 4" is the "mainboard I/O interface group 41" in the figure. ".

Parallel installation of the discrete graphics card 7 on the back of the motherboard 4 includes the following two forms:

1 Internal dispersion type: There is a parallel heat conduction material partition plate 3 between the independent graphics card 7 and the main board 4. The side of the independent graphics card 7 with the heat sink is opposite to the surface of the partition plate 3, and the PCB surface of the independent graphics card 7 is close to The side panel of the outer casing of the computer case, that is, one side of the slide cover 2 in FIG. The "PCB board of the discrete graphics card 7" is the "independent graphics card PCB board 70" in the figure. The end side of the PCB board on which the I/O interface group 71 on the discrete graphics card 7 is located is oriented in the direction in which the I/O interface is oriented, and the end side of the PCB board on which the I/O interface group on the main board 4 is located 15 ~40mm distance. The motherboard 4 and the PCB card of the discrete graphics card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space volume.

Specifically, there is a metal plate between the discrete graphics card 7 and the motherboard 4, that is, the motherboard 4 is mounted parallel to one side of the metal plate, the metal plate is opposite to the back surface of the motherboard 4, and the independent graphics card 7 is mounted in parallel on the other side of the metal plate. The discrete graphics card 7 has a facing metal plate of the GPU chip 72, and the discrete graphics card 7 is placed in parallel on the back side of the motherboard 4 near the south end region.

As described above, the 7I/O interface of the discrete graphics card is oriented in the same direction as the 4I/O interface of the motherboard, and in the direction in which their I/O interfaces are oriented, the edge of the PCB board where the independent graphics card 7I/O interface is located protrudes from the motherboard 4I/ The distance between the edge of the PCB board where the O interface is located is 15 to 40 mm, that is, the I/O interface area on the discrete graphics card 7 is translated to the west end of the motherboard 4. Moreover, there is no partition 3 between the portion of the independent graphics card 7I/O interface area protruding from the west end of the main board 4 and the main board 4. Since the I/O interfaces of the high-end discrete graphics card 7 are mostly double-layered, it is ingenious to separate the I/O on the discrete graphics card 7 in consideration of being fully compatible with all the graphics cards and minimizing the space occupied by the graphics card. The interface area is partially translated out of the west end of the motherboard 4. In addition, there is no barrier between the 7I/O interface area of the discrete graphics card and the motherboard 4, so that the I/O interface of the discrete graphics card 7 is single-layer or double-layer, which does not affect its installation in the chassis. , to achieve the same good compatibility with the traditional chassis. The discrete graphics card 7 communicates with the corresponding graphics card slot 43 on the motherboard 4 through a riser card or an extension cable.

2 External type: The side (back side) on which the heat sink cannot be mounted on the discrete graphics board PCB board 70 faces the back of the motherboard 4. The board 4 and the discrete graphics card 7 do not necessarily have the partition 3, and the PCB board where the 7I/O interface of the discrete graphics card is located The edge does not have to protrude from the edge of the PCB where the 4I/O interface of the motherboard is located. The discrete graphics card 7 communicates with the corresponding graphics card slot on the motherboard 4 through a riser card or an extension cable. The motherboard 4 and the discrete graphics card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space. The biggest advantage of this method is that it does not need to modify the heatsink and fan 201 of the discrete graphics card 7, and the original heatsink and fan 201 of the discrete graphics card 7 can be used, and the compatibility is good in this way. The disadvantage is that the required chassis space is larger than the "inside" type.

09) Internal discrete graphics card cooler 8

The heat sink mounted on the discrete graphics card 7 is provided with a vacuum heat pipe 82 and a heat conducting base 81. The vacuum heat pipe has an evaporation end and a condensation end, and the evaporation end of all the vacuum heat pipes on the heat sink directly or indirectly with the independent graphics card 7 The GPU chip 72 is in contact with each other, and the condensation end of some or all of the vacuum heat pipes is directly or indirectly contacted with the partition 3 or the inner wall of the metal casing of the chassis. The "chassis metal casing" is the "main casing 1" in the figure.

The discrete graphics card heatsink 8 is a flat heatsink as a whole, and has a small footprint. It comprises aluminum or copper fins 83 arranged in parallel spaced, 2-8 vacuum heat pipes and 1 or 2 of said heat conducting bases. The aluminum or copper heat sink fins form the main part of the flat heat sink, and the flat heat sink is mounted in parallel on the discrete graphics card 7 or on the back surface of the bulkhead 3, and the heat conductive base is disposed on the front surface of the heat sink, the surface of the back surface of the heat sink The condensing end of the flat vacuum heat pipe is arranged in a row, and the evaporation end of the vacuum heat pipe is in close contact with a copper or aluminum heat conductive base. The condensing end of the vacuum heat pipe is extruded into a semi-arc or flat shape through a die, and is closely attached to the fin. The condensing end of the semi-arc/flat vacuum heat pipe on the back side of the heat sink is also in parallel with the separator. 3 Conduct heat on the back side.

Or the flat heat sink further comprises arranged vacuum heat pipes, each vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded in the order On the thermally conductive base, the condensation end of the vacuum heat pipe is extruded through the die into a "D" shape in cross section, that is, a flat side is formed at the condensation end of the vacuum heat pipe, and the flat side is opposite to the back surface of the heat sink. Parallel, and a portion of the non-flat side formed by the condensation end of the "D" shaped vacuum heat pipe is fixed to the back surface of the heat sink in combination with the heat sink fin of the heat sink. When the back of the flat heat sink When mounted in parallel or in contact with the face of the partition, the flat side of the condensing end of the "D" shaped vacuum heat pipe will be in parallel contact with the surface of the partition for heat conduction.

Since the heat sink is intimately in contact with the partition wall 3 or the inner wall of the metal casing of the chassis through the condensation section of the vacuum heat pipe, and the graphics card heatsink fan 201 is not mounted on the heat sink, there is no additional space for the heat sink, so The actual heat dissipation area of the discrete graphics card 7 is greatly increased. Moreover, the partition 3 for heat dissipation and the metal casing of the chassis exist themselves, which also greatly saves the material cost and the quality of the graphics card heat sink.

The heat sink is fixed to the mounting position of the independent graphics card 7 on the back of the partition 3. The heat sink is provided with one or more heat conducting bases, and the heat conducting base is closely fitted with the evaporation end of the vacuum heat pipe, and the vacuum is installed. The condensation end of the heat pipe is processed into a flat shape, and is closely attached to the back surface of the separator 3 or the inner wall of the metal casing of the casing, and the heat-dissipating fins arranged in parallel are arranged in close contact with the partition plate 3 having the flat vacuum heat pipe. On the back or on the inner wall of the metal housing of the chassis.

Specifically, because the discrete graphics card 7 has one side of the GPU chip 72 parallel to the partition 3, the side of the discrete graphics card 7 facing the partition 3 and the partition 3 have a space in which a separate graphics card heat sink 8 is mounted. The heat dissipating fins in the heat sink are arranged in parallel and spaced apart, and the strip fins perpendicular to the partition 3 have a certain oblique angle with the geographical vertical direction. The heat conducting base of the heat sink is in close contact with the surface of the GPU chip 72 of the discrete graphics card 7, and the "evaporation section" in the vacuum heat pipe is tightly embedded in the heat conducting base; the "condensing section" of the other part of the vacuum heat pipe is distributed The back surface of the separator 3 is disposed between the heat dissipating fins and the separator 3 and the heat dissipating fins. Or distributed on the inner wall of the metal casing of the chassis near the graphics card, and closely fits the inner wall of the casing.

That is, the heat in the 7 GPU chip 72 of the discrete graphics card is conducted by the "evaporation section" of the vacuum heat pipe which is conducted by the heat-conducting base close to the surface, and is quickly transferred to the "condensation section" by the "evaporation section". The heat-dissipating fins, the partitions 3, or the metal casing of the chassis, which are in close contact with the "condensing section", exchange heat with the air for a large area to achieve heat dissipation.

10) Fixing method between the internal discrete type of graphics card heatsink 8 and the independent graphics card 7

Due to the "internal discrete graphics card cooler 8", hereinafter referred to as "graphic card cooler". The "graphics card" in the following is the "independent graphics card 7" in the figure. The "chassis cover/cover" in the following is the "slider 2" in the figure, and the "PCB board of the discrete graphics card 7" is shown in the figure. "Independent graphics card board 70". According to the design of the main box and user requirements, it is divided into two forms:

Active: After the graphics card heatsink is properly installed and fixed with the discrete graphics card board 70, the digital finger socket of the graphics card is inserted into the graphics card slot in the back space of the chassis, and the graphics card heatsink is parallel to the back of the partition 3. touch. Then, the GPU chip 72 of the discrete graphics card 7 is vertically projected onto the graphics card PCB. The center of the back is pasted/mounted with a matching insulating elastic silicone pad 206. When the chassis cover is pushed through the slot in the chassis, the spacing between the cover and the PCB of the discrete graphics card 7 is smaller than the size of the elastic silicone pad 206. After the elastic silicone pad 206 is squeezed, a rebound pressure is generated to vertically act on the back of the discrete graphics card board 70. Since the graphics card heatsink is fixed to the discrete graphics card board 70, the resulting pressure eventually causes the graphics card heatsink to adhere to the surface of the spacer 3. A part of the heat in the graphics card heat sink is efficiently conducted to the partition 3 for heat dissipation.

Fixed type: the graphics card heat sink is firstly mounted in parallel to the corresponding partition 3 position on the back space of the chassis. At this time, the "condensing section" of the vacuum heat pipe 82 in the heat sink is closely related to the surface of the partition 3 or the inner wall of the metal casing of the chassis. fit. Then, a matching insulating elastic silicone pad 206 is pasted/mounted in a center position of the vacant discrete graphics 7 GPU chip 72 vertically projected to the back of the graphics card PCB.

The vacant discrete graphics card 7 has a GPU chip 72 facing the graphics card heatsink, and the gold finger interface on the discrete graphics card 7 is correctly inserted into the matching graphics card slot, and the GPU chip 72 and the graphics card of the discrete graphics card 7 are fixed. The heat conductive base 81 of the heat sink is close to each other. After the chassis cover is pushed through the slot in the chassis, the spacing between the cover and the PCB of the discrete graphics card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed to generate a rebound pressure. Vertically acts on the back of the discrete graphics PCB board 70. After the center of the back surface of the GPU chip 72 on the discrete graphics card 7 is subjected to the vertical pressure in the direction of the spacer 3, the surface of the GPU chip 72 is in parallel with the front surface of the thermal conduction base 81 of the graphics card heat sink.

The discrete graphics card 7 has been historically fast and easy to install with a fixed graphics card heatsink, installed in almost a second. Since the GPU chip 72 is subjected to the center position of the back, the surface of the GPU chip 72 can be smoothly attached to the surface of the heat-conducting base 81 of the graphics card heat sink, so that the force between the GPU chip 72 and the heat-conductive base 81 is naturally balanced, and the user Don't worry about the heat transfer effect caused by the uneven force of the four screws when installing the traditional heat sink.

11) The power supply box 9 of the present invention

The power box 9 is an ultra-thin contact type power supply box 9, which is provided with a bottom surface 91, a top surface and a side surface, and is provided with an input port of a power source and an output port 92 of a power source. The output port 92 of the power box 9 is directly provided. There is no transmission structure between the output port 92 of the power box 9 and the corresponding circuit on the partition 3 in the computer case, and the transmission structure that is connected to the circuit corresponding to the circuit board 3 in the computer case. The three plugs and sockets are connected.

The side of the power supply box 9 which is in parallel with the surface of the partition plate 3 is set as the bottom surface of the power supply box 9. On the bottom surface of the power supply box 9, there are two sets of contact copper pieces 93 having protrusions of 0.5 to 3 mm, and the first group is arranged in an orderly manner. The independent contact copper piece 93 has a front surface which is very smooth and bare and electrically conductive, and the front surface of each contact copper piece 93 is parallel to the bottom surface of the power supply box 9, and the back surface of the contact copper piece 93 is fixed at One layer of insulating elastic rubber On the glue, the insulating elastic rubber is fixed in the power box 9, and the back surface of each contact copper piece 93 is only connected to the positive DC 12V output circuit in the power box 9. Each contact copper piece 93 has a positive area of 0.2 to 1 cm 2 ; the second set of copper pieces is a contact spring piece 104 which communicates with a VC 220 V circuit in the power supply box 9. And the two sets of contact copper sheets 93 and the bottom surface of the power supply box 9 are insulated from each other. a concave contact contact on the back surface of the partition 3 and matching the power supply installation area, and the bare contact circuit in the concave contact is in one-to-one correspondence with the contact copper piece 93 on the bottom surface of the power supply. There are a plurality of positioning holes 36 in the power supply installation area. The bottom surface of the power supply box 9 is flat and smooth except for the positioning pins 94 and the conductive contact copper pieces 93 which are protruded by 0.5 to 3 mm, and the bottom surface of the power supply box 9 is provided. It is connected to the negative DC 12V output circuit and the ground in the power supply box 9, and the power supply box 9 is fixed to the partition 3 by the fastening of the power supply box 9 by fastening screws.

Another power transmission port of the power box is in the form of: the power input port and the power output port of the power box are merged into an integrated port on the bottom surface of the power box, and the integrated port is directly The bare conductive circuit corresponding to the spacer is pressed and contacted to form a contact copper strip group, and each contact copper strip in the contact copper strip group may have different circuit definitions and respectively Connected to the corresponding circuit in the power box. The bottom surface of the power box is mounted in parallel to a corresponding circuit area mounted on the partition surface.

The following is a scheme in which the bottom surface output port 92 of the power supply box 9 is in the form of a metal dome 104.

The power box 9 is mounted in parallel on the surface of the partition 3 in the chassis. The largest side of the power box 9 has its bottom surface, which is made of a conductive metal material and directly contacts the surface of the spacer 3 in parallel. The bottom of the power box 9 has an "output port 92". A plurality of bare conductive metal domes 104 are arranged in the output port 92 in a flat and orderly manner. The metal domes 104 are insulated from the bottom surface of the metal material of the power supply box 9, and the surface height of the metal domes 104 is protruded. The surface of the bottom surface of the power supply box 9 is 0.5 to 3 mm.

The metal dome 104 in the "output port 92" is divided into two groups of larger areas and smaller areas. The power box 9 has an "input port" into which the municipal alternating current or the matching direct current outside the chassis is inserted into the power box 9 by inserting a wire plug. A part of the municipal alternating current is converted into a stable direct current output by the power box 9, wherein the direct current positive pole is connected with a group of metal shrapnel 104 having a larger area in the "output port 92", and the direct current negative pole/ground is connected to the bottom surface of the conductive metal of the power supply box 9. The other part of the municipal alternating current is connected to a group of metal domes 104 of smaller area in the "output port 92".

There are a plurality of protruding positioning pins 94 on the bottom surface of the power box 9, and a region of the partition 3 on which the power supply box 9 is mounted has a concave partition circuit 32 and a plurality of positioning holes 36, and a concave partition. Circuit 32 has exposed conductive, smooth, flat circuit contacts. And the concave-shaped spacer circuit 32 on the partition 3 and the positioning hole 36 and the metal elastic piece 104 in the "output port 92" of the bottom surface of the power supply box 9 and the protruding positioning pin 94 are in the size specification, The alignment position and the circuit definition are perfectly matched. Put the power box 9 at the bottom Facing the mounting area of the partition 3, the positioning pin 94 on the bottom surface of the power supply box 9 is completely matched with the positioning hole 36 on the partition 3, and the power supply box 9 is fastened by a screw/expansion bayonet. On the partition 3 . At this time, each set of conductive metal domes 104 in the "output port 92" at the bottom of the power box 9 and the corresponding concave-shaped diaphragm circuit 32 on the partition 3 are completely precisely matched and one-touch contact. Since the power supply box 9 is connected through the contact point of the concave partition circuit 32 on the partition 3, when the power supply box 9 is not mounted here, the concave area is filled with a matching insulating sheet, and the position can be at this position. Space to install additional hardware. Achieve multi-effect matching of the same location space in the chassis. At the same time, due to the extremely compact structure in the power box 9, and the direct connection with the diaphragm circuit 32 for transmission and power supply, no wires are used, which greatly reduces the space occupied by the power box 9 in the chassis.

Circuit definition: Considering the different power supply requirements of different users for the mainframe, two installation positions of the power supply box 9 are designed in the chassis, and two power supply boxes 9 can be installed at the same time and used in parallel. The partition 3 also has two corresponding recessed diaphragm circuits 32 contact points. Wherein the municipal alternating current is connected to the "input port" of the first power supply box 9 by a wire plug, and a group of metal domes 104 having a smaller area in the bottom surface "output port 92" are transmitted to the partition plate 3 through the spacer circuit 32. The second inner recessed diaphragm circuit 32 corresponds to the contact point, and the second power supply box 9 is properly mounted at the contact point of the second inner concave diaphragm circuit 32. That is, the municipal alternating current is input to the second power supply box 9 through the corresponding contact point of the second inner concave diaphragm circuit 32 to be converted into a desired stable direct current. The converted DC positive electrode in the second power supply box 9 communicates with a group of metal domes 104 having a larger area in the "output port 92", and passes through the contact point and the spacer circuit corresponding to the second concave-shaped spacer circuit 32. 32 transmits the DC positive pole to "Power Distribution Module 10".

The converted DC negative electrode in the power supply box 9 is connected to the bottom surface of the conductive metal of the power supply box 9. As can be seen from the above, the bottom surface of the power supply box 9 is mounted in parallel on the partition 3, and the partition 3 in the chassis serves as the main conductor of the DC negative/ground bearing of the whole machine. Therefore, the metal bottom surface of the power supply box 9 and the surface of the partition plate 3 are in close contact with each other and are electrically conductive. The DC negative electrode on the partition 3 can pass through the conductive metal bottom surface of the power supply box 9 to transmit a large area and a large current to the DC negative circuit in the power supply box 9. The reason why the DC output of the power supply box 9 is directly contacted and transmitted to the corresponding partition circuit 32 of the partition 3 is because the contact area is large and the fit is tight, and a large current can be stably passed. Moreover, the power supply box 9 is in close contact with the partition plate 3 or the inner wall of the metal casing of the casing, and not only the DC negative electrode/ground in the power supply box 9 is smoothly connected to the partition plate 3, but also the smart and efficient solution is solved. The power supply box 9 has a problem of heat dissipation.

The power box 9 is generally in the shape of a flat hexahedron. The maximum thickness of the power box 9 is ≤31 mm, wherein the length ≤150 mm, the width ≤110 mm; or the length ≤260 mm, the width ≤120 mm, the input port of the power supply box 9 is the input DC 12V or VC 220V, the output port 92 of the power box 9 is output DC 12V or VC 220V.

The overall outline of the power box 9 is a flat square body, and the specific size and shape depend on the design requirements and the power level.

The heat dissipation mode of the power supply box 9: The ultra-thin power supply box 9 has a compact internal structure and a concentrated heat source. The outer casing of the power box 9 is made of aluminum alloy. The heat element in the power box 9 is directly attached to the aluminum alloy case, or the vacuum heat pipe is connected to the aluminum alloy case, and most of the heat is quickly transferred to the power box. 9 metal casings. Because the power box 9 is closely parallel to the partition 3 or a part of the inner wall of the metal casing of the chassis, the partition 3 or the metal casing of the chassis, together with the ventilation inside the chassis, achieves large-area efficient heat dissipation.

12) Power distribution module 10

The side of the power distribution module 10 that is in contact with the back surface of the partition 3 is a bottom surface 102. The bottom surface is provided with a "DC input port 102" and a "DC output port 103", a "DC input port 102" and a "DC output. A plurality of contact copper pieces 93 protruding from the bottom surface by 0.5 to 3 mm are arranged neatly and orderly in the port 103". The front faces of the contact copper strips 93 are smooth, bare and electrically conductive. The inwardly facing back faces of the copper strips 93 are fixed on an elastic material member insulated from other circuits, and the elastic material members are fixed to the power distribution. Within module 10.

A plurality of raised positioning pins 94 are disposed on the bottom surface of the power distribution module 10 except for the "DC input port 102" and the "DC output port 103", and the area of the power distribution module 10 is mounted on the partition plate 3 respectively. The "DC input port 102", the "DC output port 103" and the positioning pin 94 on the bottom surface of the electric module 10 are completely correctly matched to the concave circuit contact point and the positioning hole 36 in the size specification, the position direction, and the circuit definition. The surface of the contact point of the concave circuit is barely conductive, but is insulated from the spacer 3, and the contact points of the concave circuit are respectively connected to the corresponding spacer circuit 32.

The power distribution module 10 further integrates a temperature control module, and the power distribution module 10 provides power supply and installation location space and/or circuit routing structure for the temperature control module.

Structure circuit definition: the contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is in communication with the DC input circuit in the power distribution module 10; the contact in the "DC output port 103" on the bottom surface of the power distribution module 10 The copper sheets 93 are each in communication with a DC output supply of different output voltage values within the power distribution module 10. The contact copper pieces 93 defined by different circuits are independent and insulated from each other, and the contact copper piece 93 is also insulated from the bottom surface of the power distribution module 10.

The contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is matched with the corresponding concave circuit contact point on the partition plate 3, and then the power supply box 9 is output to the above-mentioned partition circuit 32. The DC in the system is imported into the power distribution module 10 and converted into DC power supplies of different voltage values required by the hardware devices, and the DC power of the different voltage values is transmitted through the "DC output port 103" on the bottom surface of the power distribution module 10. After the contact copper pieces 93 are matched and matched with the corresponding concave circuit contact points on the partition 3, the DC power supplies of the different voltage values are respectively transmitted to the corresponding diaphragm circuits 32.

In the middle section of the back of the partition 3 in the chassis, the power distribution module 10 is mounted on the back edge of the partition 3 adjacent to the front panel of the chassis, and the power distribution module 10 is integrated with one or more of the following One or more sockets and partition sockets matching the type interface: 6/8pin discrete graphics auxiliary power supply slot 73, 24pin motherboard main power supply slot 45, turbo fan 201 power supply interface, 7+15pin SATA hard disk 203 interface, SATA Express Hard disk 203 interface, SAS hard disk 203 interface, USB 3.0 19/20pin socket, USB 2.09pin socket, 7+6pin SATA optical drive interface.

The bottom surface of the power distribution module 10 is a flat metal conductive material except for the "DC input port 102" and the "DC output port 103", and the DC output negative/ground circuit in the power distribution module 10 is connected to the metal bottom surface of the power distribution module 10. through. The power distribution module 10 is fastened to the surface of the inner partition 3 of the chassis by screws or expansion pins in parallel, and is in contact with the surface of the partition 3 for large-area contact. In addition, one or more hardware-matched sockets or bulkhead sockets are integrated on the power distribution module 10, and are directly inserted into the matching socket/separator sockets of the power distribution module 10 through wires or the hardware self-contained interfaces. Connected. Therefore, the DC negative/ground of the hardware in communication with the socket/separator socket integrated on the power distribution module 10 is conducted to the partition 3 through the metal conductive bottom surface of the power distribution module 10. As can be seen from the above, the spacer 3 is in contact with the conductive bottom surface of the power supply box 9,

Therefore, the bottom surface of the power distribution module 10 is finally connected to the bottom surface of the power supply box 9, that is, the DC negative/ground circuits of the two are in communication.

As known from the above, because the power distribution module 10 is a DC power supply that converts the DC voltage of a single voltage value transmitted from the power box 9 into different voltage values required by each hardware, and the power distribution module 10 integrates one or A variety of socket/separator sockets that match the hardware interface. That is, the DC power supply of each voltage value converted and outputted in the power distribution module 10 is partially connected to the integrated socket/separator socket, and the corresponding power supply is transmitted to the matching by wire or hardware in-line. In the hardware, the DC power supply of each part of the output voltage value is respectively turned on to the corresponding contact point through the "DC output port 103" on the bottom surface of the power distribution module 10 via the matching concave plate circuit 32 contact point on the partition plate 3, respectively. In the bulkhead circuit 32, the bulkhead receptacles that are in communication with the bulkhead circuitry 32 are each interfaced with an interface/slot of computer hardware to be powered.

Since the bottom surface of the power distribution module 10 uses the same large-area pressure-contact conductive transmission structure as that of the power supply box 9, the large-current stable transmission can be performed between the power distribution module 10 and the bulkhead circuit 32. Moreover, a plurality of hardware interface sockets and/or temperature control modules are integrated in the power distribution module 10, so that the structural design is more efficient and compact, and the integrated power distribution module 10 has a multifunctional integrated structure, which is convenient for the user to disassemble and assemble. use.

13) Intelligent temperature control system

The intelligent main control system is provided in the mainframe of the computer, including a manual adjustment switch 18, a temperature control module, a fan 201, and a temperature probe 37. The manual adjustment switch 18 is disposed on the casing of the casing for convenient operation by the user, and the temperature control module and the fan 201 are located. The required position in the chassis, the temperature probe 37 is placed beside the CPU heatsink 6 or the graphics card heatsink, and is in the downwind duct of the radiator airflow, the temperature control module is simultaneously with the manual adjustment switch 18, the fan 201, the temperature probe 37 Connected. Firstly, manually adjusting the gear position of the switch 18 has limited the highest value and the lowest value segment of the voltage output from the temperature control module to the fan 201; secondly, the temperature probe 37 belongs to a thermistor, and the ambient temperature of the temperature probe 37 is high. Will change its own resistance value, the temperature control module connected with the temperature probe 37, according to the value fed back by the temperature probe 37, accurately output the corresponding supply voltage to the fan 201 in the voltage section, thereby realizing the real-time through the temperature probe 37 The purpose of automatically changing the speed of the fan 201 by monitoring the ambient temperature.

The main board support column 31 type temperature probe 37, because the desktop machine does not necessarily have a separate graphics card 7, and the temperature of the CPU can more objectively reflect the change of the temperature of the whole machine, so it is necessary to be near the CPU heat sink 6 Place a temperature probe 37.

A motherboard mounting hole 47 is defined between the PCI-E slot on the motherboard 4 and the memory module slot 44. The mounting hole is correspondingly connected to the corresponding motherboard support post 31 of the partition 3 to mount the temperature probe 37. This temperature probe 37 includes the following two forms:

1 fixed type, the temperature probe 37 is generally columnar, the upper end is a temperature probe 37 element, the size can just pass through the corresponding motherboard mounting hole 47; the lower end is the pin of the temperature probe 37 component, fixed to the corresponding partition circuit 32 by welding And the temperature probe 37 is entirely perpendicular to the front surface of the partition plate 3, and the main board mounting holes 47 located between the PCI-E slot and the memory module slot 44 on the main board 4 are mapped on the front surface of the partition plate 3;

In the movable type, the main board mounting hole 47 between the main board 4PCI-E slot and the memory stick slot 44 is mapped to a position corresponding to the front surface of the partition 3, and has a socket of the temperature probe 37. The temperature probe 37 socket is soldered and fixed on the corresponding partition circuit 32, and its height is not higher than the height of the other main board support columns 31. When the main board 4 is correctly mounted on the inner partition 3 of the chassis, there is a rod-shaped temperature probe. 37, the upper end is the temperature probe 37 component, and the lower end is the connection plug. The lower end of the rod-shaped temperature probe 37 is inserted into the motherboard mounting hole 47 between the PCI-E slot and the memory module slot 44 of the main board 4, and inserted into the temperature probe 37 socket on the partition 3, at this time, the temperature probe 37 It is in proper communication with the corresponding circuit on the partition 3, and the upper temperature probe 37 element is located above the front surface of the main board 4 for reading the temperature of the air flow at the position.

The computer chassis adopts the above intelligent temperature control system, which has excellent user operation and is very user-friendly. It is no longer necessary to consider whether the fan 201 has a PWM function, and does not need to enter the motherboard 4BISS to open and set, and the heat dissipation and noise can be perfectly dynamic. balance.

14) Cooling air duct

The air-cooling air duct is arranged in the computer case, and the air-dissipating air-cooling heat-dissipating method is adopted. The turbo fan 201 for exhausting the air outside the chassis is installed at the tail portion 13 of the chassis, and the whole machine has two large mains. The tuyere and two small auxiliary air inlets, the two large main air inlets are the CPU air inlet 22 and the video card air inlet 23, and the two small auxiliary air inlets are the box bottom air inlet 15 and the side top air inlet 14.

The CPU air inlet 22 is located on the right side panel of the chassis shell, and has a large opening near the CPU heat sink 6; the video card air inlet 23 is located at the front of the chassis shell, and has a position corresponding to the area of the chassis in which the discrete graphics card 7 is mounted. a large elongated opening; the bottom air inlet 15 is located on the bottom casing of the chassis, and an elongated opening is formed between the partition 3 in the chassis and the two intersecting lines extending perpendicularly from the main board 4 to the bottom plate of the chassis. The side air inlet 14 has a small elongated opening at a position on the left side panel of the cabinet casing near the top portion 11 and the front portion of the cabinet.

In the air-suction type air-dissipating air passage, except for the above-mentioned four air inlet openings and the optical drive 204 into the dish opening 24, there is no other air inlet hole, and the fan 201 in the tail of the chassis continuously pulls the air in the box. Outside the box, the air pressure inside the box is lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets to the box. Usually, when the rapid airflow generated by the air blowing form encounters the real object, the air pressure on the surface of the object will rise, and the air pressure will increase to the heat state, which is not conducive to the heat exchange between the surface of the object and the air of the airflow; The air pressure on the surface of the air passage slightly decreases, and the low-pressure air will more absorb the heat and expand its own volume, which is beneficial to the heat exchange between the surface of the object and the air of the air.

The cold air flowing in from the CPU inlet 22 flows through the corresponding CPU radiator 6, and the cold air becomes a heat flow after absorbing the heat. Since the main chassis is vertical, the CPU heat sink 6 is in the lower half and the turbo fan 201 is in the upper half. The higher temperature heat flow flows to the top of the chassis due to its natural lift and the suction of the turbo fan 201, and the lower temperature part of the heat flow is absorbed by the turbo fan 201 on the back side of the partition 3, between the edge of the partition 3 and the inner wall of the front panel 21 of the sliding cover. The gap flows into the lower half of the space on the back of the partition 3. Since the lower half of the back surface of the partition 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, the heat flow flowing therethrough can absorb the heat generated by the power supply box 9 and a part of the hard disk 203.

The cold air flowing in the air inlet 23 of the graphics card directly flows through the corresponding independent graphics card heat sink 8, the upper half of the back surface of the partition 3, and the inner top of the chassis in the back space of the partition 3. In the middle position on the back side of the partition 3, that is, below the mounting area of the discrete graphics card 7, a graphics card windshield 39 is disposed between the position of the video card inlet 23 and the turbo fan 201 on the back of the partition 3. The card windshield 39 is simultaneously sealed and touched. The back of the partition 3 and the inner wall of the slider 2. The cold air of the air inlet 23 of the graphics card is simply and efficiently drained through the heat sink of the independent graphics card 7 to absorb heat, and finally extracted by the turbo fan 201, and the air passage is not disturbed by the heat flow in other spaces in the chassis.

Since the vent hole 38 is opened in the central portion of the partition 3, the turbo fan 201 is attached to the vent hole 38 on the back surface of the partition 3. The cold air flowing in the inlet vent 15 of the tank flows through the lower half of the front surface of the partition 3 and the lower half of the back surface of the main plate 4. Since the lower half of the back surface of the partition plate 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, a part of the heat generation is transmitted to the lower half of the partition plate 3, and the cold air flowing in from the air inlet 15 of the tank bottom is taken away by the cold air; The other part of the heat is mainly transferred to the tail and bottom of the metal casing of the chassis for heat dissipation; and a part of the heat is absorbed by the lower temperature heat flow remaining after the CPU inlet 22 flows as described above.

Considering that the high-power discrete graphics card 7 generates a large amount of heat, and the air intake of the video card inlet 23 is limited, a side air inlet 14 is also added, and the inflowing cold air mainly absorbs the area and a small portion of the chassis in the back space of the partition 3. The heat in the upper end region of the back of the partition 3. The cold air flowing in the four air inlets exchanges heat with each radiator, the partition 3, the heating hardware, and the inner wall of the metal casing of the chassis to become an air heat flow, and is installed in a plurality of turbo fans at the upper half and the tail of the chassis. 201 is discharged outside the box.

In addition to several air inlets, the sealed design of the whole machine, together with the hardware arrangement in the chassis, is scientific and concise, and the generated wind resistance is small. In addition, the ultra-thin PC mainframe has a small volume. When the air is exhausted, the air pressure difference generated in the cabinet is more obvious than that of the large chassis. The airflow formed in the chassis is large and the wind speed is fast. Moreover, the air passage formed by the low pressure generated by the suction, together with the scientific arrangement of the hardware, is simple, the wind resistance is small, the air in the air passage flows in an orderly manner, and the phenomenon of returning hot air does not occur.

An air filter 25 is arranged on the four air inlet openings to filter dust entering the air in the box, so that the main box is kept clean and has good ventilation and heat dissipation performance for a long time.

15) Turbofan 201

A turbo fan 201 is mounted in the front space of the partition 3 and the back space of the partition 3,

The front space of the partition 3 has an I/O interface group of the main board 4 at a positional area on the west end of the main board 4, and a component on the main board 4 of the left side of the main board 4 remaining on the side of the main board I/O interface group 41. The height is less than 18mm, so the space above the main board 4 is relatively wide, and the west end of the main board 4 is close to the outer casing of the chassis. Therefore, a turbo fan 201 is installed on the inner wall of the casing rear casing at the position of the main board 4, and the air outlet of the turbo fan 201 is connected to the opening 17 of the casing rear casing to discharge the airflow to the outside of the casing. The turbo fan 201 installed in the idle position of the west end of the main board 4 utilizes the idle position for exhausting heat efficiently and efficiently, without additionally increasing the volume of the chassis, and the movable mounting structure does not affect the disassembly and assembly of the hardware at all. .

A vent hole 38 is formed in the partition plate 3, and one side of the turbo fan 201 is attached to the back surface of the partition plate 3 against the vent hole 38. One side of the turbo fan 201 draws air in the gap between the partition plate 3 and the main plate 4 through the vent hole 38 in the partition plate 3; the other side of the turbo fan 201 extracts air in the space behind the partition plate 3. The air outlet of the turbo fan 201 is connected to the opening of the rear casing of the chassis, and all the extracted air is discharged outside the casing;

The turbofan 201 mounted on the inner wall of the rear casing of the chassis contains the following two forms:

1 fixed type, that is, the turbo fan 201 is fixed to the inner wall of the rear casing of the chassis by screws or mounting slots;

2 movable type, a guide rail is mounted on two frames perpendicular to the air outlet of the turbo fan 201, and an opening is provided in the position of the fan 201 installed in the rear casing of the chassis, and the shape and size of the opening are exactly the same as those of the turbo fan 201. The cross section of the air outlet is matched. A rail chute is vertically mounted on the inner wall of the casing rear casing, and the rail-equipped turbofan 201 is matched with the rail chute on the inner wall of the casing tail casing, and the turbo fan 201 is opened through the casing tail casing. The hole can be freely moved inside and outside the chassis. When the installed turbo fan 201 blocks the disassembly and assembly of the hardware in the chassis, the turbo fan 201 can be moved to the outside of the chassis, and the hardware in the standby box is disassembled and then This turbo fan 201 is moved back to the inner wall of the casing.

The utility model is not limited to the above specific implementation manner. In the above description, the computer mainframe box is customarily referred to as a computer mainframe in Chinese, and the computer mainframe is also referred to as a computer chassis. Further developments made by those of ordinary skill in the art in accordance with the present invention fall within the scope of the present invention.

Claims

A computer mainframe includes a mainframe casing and computer hardware, the computer hardware comprises a main board, a hard disk; and/or a power supply box; and a corresponding heat sink; wherein:

The computer mainframe is vertical, and has a suction-type cooling air duct therein, and the heat dissipation method adopts an exhaust air-cooling heat dissipation, wherein a turbo fan for exhausting the outside of the chassis is installed at a tail of the chassis, and the turbo fan is The air outlet is connected to the opening of the rear casing of the chassis. The whole machine has a main air inlet and an auxiliary air inlet. The main air inlet includes a computer CPU air inlet, and the auxiliary air inlet includes a bottom air inlet and/or a side air inlet, and the CPU radiator is under Half, the turbo fan is in the upper half.
A computer main body box according to claim 1, wherein:

a partition plate is arranged in the outer casing of the computer main body, and the partition plate divides a cavity formed by the outer casing of the main computer case into two parts, and the main board is fixed on the side surface of one side of the partition plate, and the surface of the side plate is a partition plate. The front side, the hard disk and/or the power supply box are disposed on the side of the other side of the partition, and the side of the side is the back of the partition;

The main board is in parallel or parallel with the front surface of the partition, and the hard disk and/or the power supply box are in parallel or parallel with the back surface of the partition;

An electric circuit is disposed on the front surface or the back surface of the partition or in the partition plate, or an electric circuit is disposed on the front surface and the back surface of the partition plate, and the partition plate is provided with a partition socket for matching and connecting with computer hardware. The bulkhead receptacle is electrically connected to the circuitry thereon.
The computer mainframe according to claim 2, wherein one end of the main board near the CPU is a north end side of the main board, and in the front space of the partition board, an end side of the main board having an I/O interface group is a west end side of the main board, and a west end side of the main board is adjacent to the main board. a chassis tail casing, the turbo fan is mounted on an inner wall of the chassis tail casing above the main board at the position;

A turbo fan is installed in the space behind the partition, and a vent hole is formed in a central portion of the partition, and one side of the turbo fan is mounted on the back surface of the partition against the vent hole, so that the surface of the turbo fan passes through the partition The venting holes on the plate extract the air in the gap between the partition plate and the main plate, and the other side of the turbo fan extracts the air in the space behind the partition.
The computer mainframe according to claim 3, wherein the west end portion of the main board adjacent to the main board I/O interface group has a component height of 18 mm or less on the main board, so that the space above the main board is empty. wide.
The computer mainframe according to claim 3, wherein the main air inlet further comprises a video card air inlet, and the video card air inlet and the computer CPU air inlet constitute a main air inlet, and the air suction type heat dissipation. In the air duct, except for the air inlet of the main air inlet and the air inlet of the computer CPU and the air inlet and side air inlet of the auxiliary air inlet, there are 4 air inlets and optical drive holes, and no other The wind hole, the fan in the tail of the chassis continuously pumps the air inside the box to the outside of the box, causing the air pressure in the box to be lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets to the box.

The cold air flowing into the air inlet of the CPU flows through the corresponding CPU heat sink, and the cold air becomes heat flow after absorbing the heat thereof, and the heat flow with higher temperature flows to the top of the chassis and the lower temperature portion due to the natural lift and the suction force of the turbo fan. The heat flow is absorbed by the turbo fan on the back of the partition, and flows through the gap between the edge of the partition and the inner wall of the front outer casing of the partition to the lower half of the back of the partition. The lower half of the back of the metal partition is a power supply that is mounted in parallel. The box and/or hard disk, which flows into the lower temperature heat stream, absorbs the heat generated by the power box and/or part of the hard disk.

The cold air flowing in the air inlet of the graphics card directly flows through the corresponding graphics card heat sink, the upper half of the back surface of the metal partition, and the inner top of the chassis in the back space of the partition, under the action of the turbo fan installed on the central portion of the partition, The cold air flowing into the air inlet of the bottom of the box flows through the lower half of the front side of the partition and the lower half of the back of the main board. A part of the heat generated by the power supply box or the hard disk is transmitted to the lower half of the partition, and the cold air that flows into the air inlet of the bottom of the box absorbs the cold air. Another part of the heat is transferred to the tail and bottom of the metal casing of the chassis for heat dissipation.

The function of the side air inlet is that the heat output of the high-power independent graphics card is large, and the air volume of the air inlet of the video card is limited, so that the cold air flowing in the air mainly absorbs the area in the back space of the chassis and the upper part of the back surface of the small partition. The heat of the area.
The computer mainframe according to claim 5, wherein the CPU air inlet is located on a side of the casing shell and has a large opening at a position facing the CPU heat sink; the air inlet of the graphics card is located at the front of the casing and inside the casing. There is a large elongated opening in the corresponding position of the area where the discrete graphics card is installed; the air inlet of the bottom of the box is located on the bottom casing of the chassis, and the partition in the chassis extends perpendicularly to the motherboard to the two intersecting lines on the bottom plate of the chassis. There is a slender opening; the side air inlet has a small elongated opening at the left side of the chassis shell near the top and front of the chassis.
The computer mainframe according to claim 1, wherein the turbo fan mounted on the inner wall of the casing rear casing comprises the following two alternative forms:

1) fixed type, that is, the turbo fan is fixed to the inner wall of the rear casing of the chassis by screws or mounting slots;

2) movable type, rails are installed on the two frames perpendicular to the air outlet of the turbo fan, and there are openings in the fan mounting position at the rear of the chassis, and the shape and size of the opening are exactly the same as the turbo fan The cross-section of the air outlet is matched, and a guide rail is exactly perpendicular to the opening on the inner wall of the outer casing of the chassis. The turbo fan with the guide rail matches the guide chute on the inner wall of the rear casing of the chassis, and the turbo fan passes The opening on the rear casing of the chassis can be freely moved inside and outside the chassis. When the installed turbo fan blocks the disassembly and assembly of the hardware inside the chassis, the turbo fan can be moved to the outside of the chassis, and the hardware in the standby box is disassembled. Then, move the turbo fan back to the inner wall of the chassis.
The computer mainframe according to claim 2, wherein the back surface of the partition and/or the inner wall of the top or bottom of the metal casing of the casing are in parallel with the cold end surface of the semiconductor refrigerating sheet, and the hot end surface of the semiconductor refrigerating sheet The flat heat-conducting metal piece is closely attached to the evaporation end of the vacuum heat pipe, and the condensation end of the vacuum heat pipe is closely attached to the inner wall of the tail of the metal casing of the casing, and the semiconductor refrigeration chip is emitted. Heat is transferred to the rear housing of the chassis for heat dissipation.
The computer mainframe according to claim 8, wherein the positive and negative power supply circuits of the semiconductor refrigerating sheet are connected to the corresponding power supply circuit on the partition through the matching bulkhead socket.
The computer mainframe according to claim 2, wherein one side of the output port on the power box is in contact with the partition surface, and the output port of the power box is directly connected to the partition in the chassis. The transmission structure of the circuit is pressed after the pressure is applied, and the third-party socket and the plug-in line are not connected between the output port of the power supply box and the corresponding circuit on the partition in the mainframe of the computer.
A power supply box for a mainframe power supply box according to claim 10, wherein a side on which the output port of the power supply box is located is a plane having the largest area among the surface of the outer casing, and the surface is set as a bottom surface of the power supply box, and the power supply is The power output port on the bottom surface of the box is arranged neatly and orderly with contact copper pieces protruding from the bottom of the power box by 0.5~3mm. The front faces of the contact copper sheets are smooth and bare, and the contact copper is exposed. The inwardly facing back surface is fixed on an elastic material member insulated from other circuits, and the elastic material member is fixed in the power supply box. The bottom surface of the power supply box has a plurality of raised positioning pins on the bottom surface. In the area where the power box is mounted on the inner partition of the chassis, there are respectively concave circuit contact points and positioning holes which are completely matched with the output port and the positioning pin of the bottom surface of the power box in the size specification, the position direction and the circuit definition; The surface of the contact point of the concave circuit is barely conductive, but is insulated from the partition, and the contact points of the concave circuit are respectively connected to the circuits on the corresponding partition. The bottom surface of the power supply box is a flat metal conductive material except the output port, and the output DC negative/ground circuit in the power supply box is connected to the bottom surface of the conductive power supply box, and the power supply box is tightly attached by screws or expansion pins. Solid on the metal partition surface inside the chassis, and a large area contact conduction with the surface of the metal separator;

The outer casing of the power supply box is made of a large-area heat-conducting metal material, and the internal heating element directly contacts the inner wall of the metal casing of the power supply box, or the heating element is connected to the inner wall of the metal casing of the power supply box through a vacuum heat pipe, and the power supply box is screwed or expanded. The bayonet pins are fastened in parallel to the metal partition surface of the chassis for heat conduction and heat dissipation;

The overall shape of the power supply box is a flat square body, and the maximum thickness of the power supply box is ≤31 mm, wherein the length is ≤150 mm, the width is ≤110 mm, or the length is ≤260 mm, and the width is ≤120 mm.
The computer mainframe according to claim 2, wherein the one side of the back surface of the partition plate contacts the power distribution module and is provided as a bottom surface, and the bottom surface is provided with a "DC input port" and a "DC output port". The "DC input port" and the "DC output port" are arranged neatly and orderly with contact copper pieces protruding from the bottom surface by 0.5 to 3 mm. The front faces of the contact copper pieces are smooth and flat, bare. Conductive, the inwardly facing sides of the contact copper sheets are fixed on an elastic material member insulated from other circuits, and the elastic material members are fixed in the power distribution module.

The contact copper piece in the "DC input port" on the bottom surface of the power distribution module is connected to the DC input circuit in the power distribution module; the contact copper pieces in the "DC output port" on the bottom surface of the power distribution module are respectively connected to the power distribution module The DC output power supply of different output voltage values is connected. The contact copper pieces defined by different circuits are independent and insulated from each other, and the contact copper piece is also insulated from the bottom surface of the power distribution module.
The computer mainframe according to claim 12, characterized in that: on the bottom surface of the power distribution module, a plurality of protruding positioning pins are arranged in addition to the "DC input port" and the "DC output port", and are mounted on the partition plate. The area of the power distribution module has a concave circuit contact point which is completely matched with the "DC input port", "DC output port" and the positioning pin of the bottom surface of the power distribution module in the size specification, the position direction, and the circuit definition. The positioning hole, the surface of the contact point of the concave circuit is barely conductive, but is insulated from the partition, and the contact points of the concave circuit are respectively connected to the corresponding separator circuit.
The computer mainframe according to claim 13, wherein the bottom surface of the power distribution module is a flat metal conductive material except for a "DC input port" and a "DC output port", and a DC output negative electrode in the power distribution module. The grounding circuit is connected to the metal bottom surface of the power distribution module, and the power distribution module is fastened to the inner partition surface of the chassis by screws or expansion pins, and a large-area contact conduction is performed between the surface and the surface of the partition plate.

The contact copper piece in the "DC input port" on the bottom surface of the power distribution module is matched with the corresponding concave circuit contact point on the partition plate, and then the DC output of the power supply box to the above-mentioned baffle circuit is introduced into the distribution. In the electrical module, the DC power supply of different voltage values required for each hardware device is converted, and then the above difference is The DC power supply of the voltage value is respectively transmitted through the contact copper pieces in the "DC output port" on the bottom surface of the power distribution module through the matching contact points of the corresponding concave circuit on the partition plate, and then the DC power supplies of the different voltage values are separately transmitted. To the corresponding separator circuit.
The computer mainframe according to claim 12, wherein a power distribution module is installed in an intermediate section on the back side of the inner partition of the chassis, and a rear side edge of the partition of the front panel of the chassis outer casing is mounted, and the power distribution is The module incorporates one or more of the following sockets that match one or more of the following types of interfaces: 6/8pin discrete graphics auxiliary power supply slot, 24pin motherboard main power supply slot, turbofan power supply interface, 7+15pin SATA Hard disk interface, SATA Express hard disk interface, SAS hard disk interface, USB 3.0 19/20pin socket, USB 2.0 9pin socket, 7+6pin SATA optical drive interface.
The computer mainframe according to claim 12, wherein the power distribution module further integrates a temperature control module, and the power distribution module provides power supply and installation location space and/or circuit routing structure for the temperature control module.
The computer mainframe according to claim 1, wherein the computer mainframe is provided with an intelligent temperature control system, including a manual adjustment switch, a temperature control module, a fan, and a temperature probe, and the manual adjustment switch is disposed on the casing of the casing. It is convenient for users to operate. The temperature control module and fan are located in the required position inside the chassis. The temperature probe is placed next to the CPU heat sink or the graphics card heat sink, and is in the downwind duct of the radiator airflow. The temperature control module is simultaneously adjusted with manual adjustment. The switch, fan, and temperature probe are connected.
The computer mainframe according to claim 17, wherein a PCI-E slot on the main board and a memory module slot have a motherboard mounting hole corresponding to the corresponding motherboard support post on the partition. The temperature probe includes the following two alternative forms:

1) Fixed type, the temperature probe is column-shaped as a whole, the upper end is a temperature probe component, and the size can just pass through the corresponding motherboard mounting hole; the lower end is the pin of the temperature probe component, which is fixed on the corresponding diaphragm circuit by soldering, and the temperature The probe body is perpendicular to the front surface of the partition plate, and the motherboard mounting holes between the PCI-E slot and the memory module slot on the main board are mapped on the front side of the partition plate;

2) The movable type, the motherboard mounting hole mapping between the motherboard PCI-E slot and the memory module slot corresponds to the position of the front side of the partition, and has a temperature probe socket. The temperature probe socket is soldered and fixed on the corresponding diaphragm circuit, and its height is not higher than the height of the other motherboard support columns. When the motherboard is correctly mounted on the inner partition of the chassis, there is a rod-shaped temperature probe and the upper end is a temperature probe. Component, the lower end is the connection plug. Insert the lower end of the rod-shaped temperature probe through the motherboard mounting hole between the PCI-E slot and the memory module slot on the motherboard. In the temperature probe socket on the partition, the temperature probe is in proper communication with the corresponding circuit on the partition, and the temperature probe element at the upper end is above the front surface of the main board for reading the air temperature at the position.