CN219456832U - Heat abstractor and intelligent interaction equipment - Google Patents

Abstract

The application relates to a heat abstractor and intelligent interaction equipment. The heat abstractor is used for installing on the control mainboard in order to dispel the heat to the control mainboard, and heat abstractor includes: the first radiator is provided with a radiating air duct, an air duct inlet of the radiating air duct is communicated with an air outlet of the fan, and the first radiator is used for being matched with a first functional area on the control main board in a heat transfer manner; and the second radiator is arranged on the first radiator and is used for being matched with a second functional area on the control main board in a heat transfer way. The heat converged on the first radiator is finally transferred with the heat radiation wind flowing through the heat radiation wind channel, and the heat radiation wind after heat absorption and temperature rising is discharged from the heat radiation wind channel to take away the heat, so that the effect of timely and effectively radiating and cooling the control main board is achieved. Therefore, heat generated by controlling the operation of the main board is prevented from being conducted to the hard disk, so that the temperature of the hard disk is prevented from being abnormally increased, and the working temperature of the intelligent interaction device is ensured to be kept at a normal range value, so that better use performance and reliability are maintained.

Description

Heat abstractor and intelligent interaction equipment

Technical Field

The application relates to the technical field of equipment heat dissipation, in particular to a heat abstractor and intelligent interaction equipment.

Background

With the continuous improvement of the electronic technology, various electronic devices are designed and manufactured to meet the demands of different use situations such as work, study and life of consumers. The computer integrated machine is used as a new computer integrating the host and the display, and is popular with more and more consumers by virtue of the advantages of small volume, light weight, convenience in carrying and placing, attractive appearance and the like.

However, with the continuous shrinking of the volume of the computer integrated machine and the continuous enrichment of the use functions, the number of electronic components in the computer integrated machine is increased, and the integration level is also increased, so that the heat dissipation performance of the computer integrated machine is not ideal, for example, in the operation process, the heat generated by the control main board is easily transferred to the hard disk, so that the temperature of the hard disk is abnormally increased, and the use performance and reliability of the computer integrated machine are further affected.

Disclosure of Invention

Based on the above, it is necessary to provide a heat dissipating device and an intelligent interaction device for solving the problems of insufficient heat dissipation performance and poor usability and reliability.

In one aspect, the present application further provides a heat dissipating device, configured to be mounted on a control motherboard to dissipate heat from the control motherboard, where the heat dissipating device includes:

a fan;

the first radiator is provided with a radiating air duct, and an air duct inlet of the radiating air duct is communicated with an air outlet of the fan; the method comprises the steps of,

a second heat sink in heat transfer engagement with the first heat sink;

the first radiator is used for radiating the first functional area of the control main board, and the second radiator is used for radiating the second functional area of the control main board.

The heat radiator is arranged in the intelligent interaction equipment, and is used for being assembled and matched with the control main board, when the intelligent interaction equipment works, after the control main board generates high-temperature heat, the fan is rapidly started to work, radiating wind is pumped into the radiating air duct of the first radiator, at the moment, the first radiator can exchange heat with the first functional area on the control main board, so that heat generated by the first functional area is transferred onto the first radiator, meanwhile, the second radiator can exchange heat with the second functional area on the control main board, so that heat generated by the second functional area is transferred onto the second radiator firstly and then onto the first radiator, heat collected on the first radiator is finally transferred with radiating wind flowing through the radiating air duct, and radiating wind after heat absorption and temperature rise is discharged from the radiating air duct to take away the heat, so that the effect of timely and effective radiating and cooling the control main board is achieved. Therefore, heat generated by controlling the operation of the main board is prevented from being conducted to the hard disk, so that the temperature of the hard disk is prevented from being abnormally increased, and the working temperature of the intelligent interaction device is ensured to be kept at a normal range value, so that better use performance and reliability are maintained.

The technical scheme of the application is further described below:

in one embodiment, the first functional area is provided with a CPU, and the heat dissipating device further includes a first heat conducting member, where the first heat conducting member is disposed on the first heat sink and is in heat transfer fit with the CPU.

In one embodiment, the first functional area is provided with a CPU, the heat dissipating device further includes a first heat conducting member, a boss is formed on a side of the first heat sink facing the control motherboard, and the first heat conducting member is disposed on the boss and is in heat transfer fit with the CPU.

In one embodiment, the second functional area is provided with a capacitor device, a recess is formed in a side face, facing the control main board, of the second radiator, a second heat conducting piece is arranged in the recess, and the second heat conducting piece is in heat transfer fit with the capacitor device extending into the recess.

In one embodiment, the number of the avoidance concave parts is at least two, the avoidance concave parts are arranged in a step shape in the thickness direction of the second radiator, the second heat conducting pieces are arranged in each avoidance concave part, and different second heat conducting pieces are respectively used for being in heat transfer fit with the capacitor devices with different heights.

In one embodiment, the heat dissipating device further comprises a first wind shielding member mounted on an outer wall of the first heat sink and arranged close to an air duct outlet of the heat dissipating air duct.

In one embodiment, the heat dissipating device further includes a second wind shielding member, the first heat sink adopts a fin-shaped heat dissipating structure, an opening side communicated with the heat dissipating air duct is further formed on one side of the first heat sink facing away from the control main board, and the second wind shielding member is sealed and covered on the opening side.

On the other hand, the application also provides intelligent interaction equipment, which comprises the heat dissipation device:

a display;

the base body is connected with the display in a supporting way and is provided with an installation cavity, a heat radiation air inlet and an air outlet which are communicated with the installation cavity;

the control main board is arranged in the mounting cavity, the control main board comprises the first functional area and the second functional area, the first radiator is used for radiating the first functional area of the control main board, and the second radiator is used for radiating the second functional area of the control main board;

the air inlet of the heat dissipation air duct is communicated with the air inlet of the fan, and the air duct outlet of the heat dissipation air duct is communicated with the air outlet.

In one embodiment, the control main board is further provided with a through-air hole, and the heat dissipation air inlet is communicated with the air inlet of the fan through the through-air hole.

In one embodiment, the base comprises a stand column and a base, one end of the stand column is connected with the display in a supporting mode, the other end of the stand column is connected with the base, and the stand column is provided with the installation cavity, the heat dissipation air inlet and the air outlet.

In one embodiment, the upright post comprises a front shell, a rear shell and side decorative strips, wherein the front shell is detachably connected with the rear shell, the side decorative strips are detachably connected with the front shell and the rear shell respectively, and the front shell, the rear shell and the side decorative strips enclose the mounting cavity.

In one embodiment, the inner side wall of the front shell is provided with a bracket, and the control main board is mounted on the bracket.

In one embodiment, the heat dissipation air inlet is formed in the front shell and is arranged in a first grid structure, and the air outlet is formed in the side decorative strip and is arranged in a second grid structure.

In one embodiment, the inner side wall of the rear shell is convexly provided with a first wind shielding wall and a second wind shielding wall which are arranged at intervals, an air guide channel is formed between the first wind shielding wall and the second wind shielding wall, one end of the air guide channel is communicated with an air channel outlet of the heat dissipation air channel, and the other end of the air guide channel is communicated with the air outlet.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model.

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an intelligent interaction device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of another view of fig. 1.

Fig. 3 is a schematic structural diagram of a heat dissipating device.

Fig. 4 is a schematic structural diagram of another view of fig. 3.

Fig. 5 is a schematic structural diagram of the control motherboard.

Fig. 6 is an assembly structure diagram of a heat sink and a control motherboard.

Fig. 7 is a schematic structural view of the rear case.

Fig. 8 is a schematic structural view of another view of fig. 7.

Fig. 9 is a schematic structural view of the front case.

Fig. 10 is a schematic diagram of the fastening of fig. 9 at another view angle.

Fig. 11 is a schematic structural view of an assembly of a control motherboard and a heat sink mounted on a front case.

FIG. 12 is a schematic view of a side molding structure.

FIG. 13 is a schematic view of the front and rear shells and side molding assembled to form a pillar.

Reference numerals illustrate:

100. an intelligent interaction device; 10. a display; 11. a backlight module; 20. a base; 21. a column; 211. a front shell; 211a, a heat dissipation wind inlet; 211b, a bracket; 212. a rear case; 212a, a first wind shield wall; 212b, a second wind shield wall; 212c, an air guide channel; 213. side edge decorative strips; 213a, exhaust outlet; 22. a base; 30. a control main board; 31. a first functional area; 32. a second functional area; 33. a wind hole; 40. a heat sink; 41. a fan; 42. a first heat sink; 421. an air duct inlet; 422. an air duct outlet; 43. a second heat sink; 431. avoiding the concave part; 44. a connecting frame; 45. a first heat conductive member; 46. a second heat conductive member; 47. a first wind shielding member; 48. and a second wind shielding member.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

At present, the heat productivity of the control motherboard 30 is high due to the higher and higher integration degree and the richer functional degree of the traditional computer integrated machine, and the existing heat dissipation structure for the control motherboard 30 has certain design defects, so that the heat generated by the control motherboard 30 can still be conducted to the hard disk, the abnormal rise of the temperature of the hard disk is caused, and the use performance and reliability of the computer integrated machine can be affected. Based on this, this application proposes an intelligent interaction device 100, when the intelligent interaction device 100 works, after the control motherboard 30 generates high temperature heat, the fan 41 is rapidly started to work, heat dissipation wind is pumped into the heat dissipation air duct of the first heat dissipation air duct 42, at this time, the first heat dissipation air duct 42 can exchange heat with the first functional area 31 on the control motherboard 30, so that the heat generated by the first functional area 31 is transferred to the first heat dissipation air duct 42, meanwhile, the second heat dissipation air duct 43 can exchange heat with the second functional area 32 on the control motherboard 30, so that the heat generated by the second functional area 32 is transferred to the second heat dissipation air duct 43 first, then transferred to the first heat dissipation air duct 42, the heat collected on the first heat dissipation air duct 42 finally transfers heat with the heat dissipation wind flowing through the heat dissipation air duct, and the heat dissipation wind after heat absorption and temperature rising is discharged from the heat dissipation air duct to take away the heat, thereby achieving the effect of timely and effective heat dissipation and temperature reduction of the control motherboard 30. In this way, heat generated by controlling the operation of the motherboard 30 is prevented from being conducted to the hard disk, which causes abnormal rise of the hard disk temperature, and the operation temperature of the intelligent interaction device 100 is ensured to be kept at a normal range value, so that better use performance and reliability are maintained.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an intelligent interaction device according to an embodiment of the present application. Fig. 2 is a schematic structural diagram of another view of fig. 1.

The intelligent interaction device 100 provided by the application can be specifically any one of a computer integrated machine, a notebook computer, a tablet computer and the like. For example, the intelligent interaction device 100 is configured as a computer all-in-one machine in the present application.

Referring to fig. 1 and 2, the intelligent interaction device 100 includes a display 10, a base 20, a control main board 30 and a heat dissipation device 40, the base 20 is supported and connected to the display 10, the base 20 is provided with a mounting cavity, a heat dissipation air inlet 211a and an air outlet 213a which are communicated with the mounting cavity, the control main board 30 and the heat dissipation device 40 are both disposed in the mounting cavity, and the heat dissipation device 40 drives heat dissipation air to enter the mounting cavity along the heat dissipation air inlet 211a to dissipate heat of the control main board 30, and then is discharged from the air outlet 213a, so as to achieve the purpose of heat dissipation and temperature reduction of the control main board 30.

Fig. 3 is a schematic structural diagram of the heat dissipating device 40, fig. 4 is a schematic structural diagram of another view of fig. 3, fig. 5 is a schematic structural diagram of the control motherboard 30, and fig. 6 is an assembly structure diagram of the heat dissipating device 40 and the control motherboard 30. Referring to fig. 3 to 6, a heat dissipating device 40 in an embodiment of the present application is configured to be mounted on a control motherboard 30 to dissipate heat of the control motherboard 30, specifically, heat generated by the operation of the control motherboard 30 can be timely dissipated by the heat dissipating device 40, so as to avoid heat conduction to functional devices such as a hard disk, and reduce negative effects caused by high temperature.

Illustratively, the heat sink 40 includes a fan 41, a first heat sink 42, and a second heat sink 43.

The first radiator 42 is provided with a heat dissipation air duct, an air duct inlet 421 of the heat dissipation air duct is communicated with an air outlet of the fan 41, and the first radiator 42 is used for being in heat transfer fit with the first functional area 31 on the control main board 30; the second heat sink 43 is mounted on the first heat sink 42, and the second heat sink 43 is adapted to be in heat-transferring engagement with the second functional area 32 on the control motherboard 30.

In summary, implementing the technical scheme of the embodiment has the following beneficial effects: the heat dissipating device 40 of the above-mentioned scheme is applied to the intelligent interaction device 100 and is used for being assembled and matched with the control motherboard 30, when the intelligent interaction device works, after the control motherboard 30 generates high-temperature heat, the fan 41 is rapidly started to work, heat dissipation wind is pumped into the heat dissipation air channel of the first heat dissipation device 42, at the moment, the first heat dissipation device 42 can exchange heat with the first functional area 31 on the control motherboard 30, so that the heat generated by the first functional area 31 is transferred to the first heat dissipation device 42, meanwhile, the second heat dissipation device 43 can exchange heat with the second functional area 32 on the control motherboard 30, so that the heat generated by the second functional area 32 is transferred to the second heat dissipation device 43 firstly, then transferred to the first heat dissipation device 42, the heat collected on the first heat dissipation device 42 is finally transferred to the heat dissipation wind flowing through the heat dissipation air channel, and the heat dissipation wind after temperature rising is discharged from the heat dissipation air channel to take away the heat, so as to achieve the effect of timely and effective heat dissipation of the control motherboard 30. In this way, heat generated by controlling the operation of the motherboard 30 is prevented from being conducted to the hard disk, which causes abnormal rise of the hard disk temperature, and the operation temperature of the intelligent interaction device 100 is ensured to be kept at a normal range value, so that better use performance and reliability are maintained.

With continued reference to fig. 5 to 13, a backlight module 11 is disposed on the back side of the display 10; the base 20 comprises a base and a stand column 21 with an installation cavity formed in the base, one end of the stand column 21 is in supporting connection with the display 10, in particular to the rear side wall of the backlight module 11, the other end of the stand column 21 is connected with the base 22, and the stand column 21 is also provided with a heat dissipation air inlet 211a and an air outlet 213a which are communicated with the installation cavity; the control main board 30 is provided with a wind through hole 33; the heat dissipating device 40 is installed on the control main board 30 and in the upright post 21 together with the control main board 30, the heat dissipating air inlet 211a is communicated with the air inlet of the fan 41 through the air passing hole 33, and the air channel outlet 422 of the heat dissipating air channel is communicated with the air outlet 213 a.

Compared with the prior art in which the heat dissipating device 40 and the control motherboard 30 are directly integrated on the back side of the display 10, the heat dissipating device 40 and the control motherboard 30 are mounted inside the upright post 21 outside the backlight module 11 in this embodiment, so that the heat dissipating device 40 is closer to the heat dissipating air inlet 211a and the air outlet 213a, the length of the heat dissipating channel is shortened, the heat dissipating speed is increased, and meanwhile, the heat backlog in the area of the backlight module 11 is reduced.

Specifically, in some embodiments, the pillar 21 includes a front case 211, a rear case 212, and a side molding 213, the front case 211 is detachably connected to the rear case 212, the side molding 213 is detachably connected to the front case 211 and the rear case 212, and the front case 211, the rear case 212, and the side molding 213 define a mounting cavity.

The front shell 211 is arranged close to the display 10, the rear shell 212 is arranged far away from the display 10, and the front shell 211 and the rear shell 212 are detachably assembled in any one mode of buckling connection, screwing connection, magnetic attraction connection and the like. One side of the width direction is open after the side decorative strip 213 is connected, the side decorative strip 213 is used for sealing and installing at the open position, and any one mode of buckle connection, screw connection, magnetic attraction connection and the like can be adopted between the side decorative strip 213 and the front shell 211 as well as between the side decorative strip 213 and the rear shell 212.

Further, a bracket 211b is provided on an inner sidewall of the front case 211, and the control main board 30 is mounted on the bracket 211b. So that the bracket 211b facilitates loading and fixing the control main board 30 and the heat sink 40.

Further, the heat dissipation air inlet 211a is formed at the front case 211 and is provided with a first grid structure, and the air outlet 213a is formed at the side molding 213 and is provided with a second grid structure. During operation, the heat dissipation air in the external environment flows through the fan 41 and the heat dissipation air channel of the first radiator 42 in sequence after passing through the heat dissipation air inlet 211a under the suction effect of the fan 41, and the hot air formed after absorbing heat is finally discharged to the outside of the upright post 21 from the air outlet 213a, so that the effect of timely discharging and cooling the heat generated by the control main board 30 is achieved.

It should be noted that, the heat dissipation air inlet 211a and the air outlet 213a are designed into a grid structure, which can effectively prevent dust and insects and mice in the external environment from entering the device to damage the electrical components, and improve the aesthetic degree of the product to a certain extent.

With continued reference to fig. 3 and 4, in addition, the heat dissipating device 40 further includes a connecting frame 44, and the fan 41 is assembled and connected with the first heat sink 42 through the connecting frame 44. Therefore, the connecting frame 44 can reliably assemble and fix the fan 41 and the first radiator 42 into a whole, and the overall structural stability of the heat dissipation device 40 is ensured.

For example, in the present embodiment, the connecting frame 44 is a closed or semi-closed annular bracket 211b, which is sleeved at the assembling interface of the fan 41 and the first radiator 42, and is screwed and fixed with the fan 41 and the first radiator 42 respectively by using a threaded connecting piece (such as a screw).

In still other embodiments, the first functional area 31 is provided with a CPU, and the heat dissipating device 40 further includes a first heat conducting member 45, where the first heat conducting member 45 is disposed on the first heat sink 42 and is in heat transfer engagement with the CPU. Alternatively, as an alternative to the above embodiment, the first functional area 31 is provided with a CPU, the heat dissipating device 40 further includes a first heat conducting member 45, a boss is formed on a side of the first heat sink 42 facing the control motherboard 30, and the first heat conducting member 45 is disposed on the boss and is in heat transfer fit with the CPU.

When in operation, the CPU (central processing unit) is used as the computing and control core of the computer system, and is the final execution unit for information processing and program running, so that the heat productivity is relatively maximum during operation, and the heat conduction member 45 is in contact with the CPU to perform heat exchange more rapidly and effectively, so that heat is conducted from the CPU to the first radiator 42, and better heat dissipation efficiency is ensured.

It will be appreciated that the heat transfer engagement of the first heat conducting member 45 with the CPU may mean that the heat transfer is effected by direct contact of the first heat conducting member 45 with the CPU, or by an intermediate heat transfer medium.

Further, the second functional area 32 is provided with a capacitor device, a recess 431 is formed on a side of the second heat sink 43 facing the control motherboard 30, a second heat conducting member 46 is disposed in the recess 431, and the second heat conducting member 46 is in heat transfer fit with the capacitor device extending into the recess 431. When the capacitor device works, the capacitor device can generate heat, and at the moment, the second heat conduction piece 46 can be in contact with the capacitor device quickly and effectively to conduct heat from the capacitor device to the second radiator 43 and then to the first radiator 42, so that the purpose of radiating and cooling the capacitor device is achieved.

It will be appreciated that the heat transfer engagement of the second heat transfer member 46 with the CPU may mean that the heat transfer of the second heat transfer member 46 is in direct contact with the CPU, or that both are accomplished via an intermediate heat transfer medium.

Different types of capacitive devices are typically mounted on the control motherboard 30, and the different types of capacitive devices are typically different in size and are characterized directly by different mounting heights on the control motherboard 30. On the basis of the above embodiment, the avoiding concave portions 431 are provided in at least two and are arranged in a stepped manner in the thickness direction of the second radiator, and each avoiding concave portion 431 is internally provided with a second heat conducting member 46, and different second heat conducting members 46 are respectively used for heat transfer fit with the capacitor devices having different heights. Therefore, the second heat sink 43 can simultaneously adapt to the assembly requirements of the capacitor devices with different heights, avoid the interference problem, and synchronously dissipate heat and cool the capacitor devices with different heights.

Alternatively, the first heat conducting member 45 and the second heat conducting member 46 may be any one or a combination of heat conducting silica gel, heat conducting silicone grease, and the like, and may be flexibly selected according to actual needs.

In addition, the control main board 30 is further provided with a wire plug seat, and the wire plug seat is conveniently connected with the fan 41 to supply power to the fan 41, and meanwhile, the start and stop work, power and the like of the fan 41 are conveniently controlled and adjusted.

In still other embodiments, the heat sink 40 further includes a first wind shield 47, the first wind shield 47 being mounted on an outer wall of the first heat sink 42 and disposed proximate to the air duct outlet 422 of the heat dissipation air duct. Specifically, the first wind shielding member 47 is made of wind shielding foam and has a U-shaped structure, and is fixed on three adjacent outer surfaces of the first radiator 42 by adhesion, which is effective in preventing backflow of heat energy discharged from the air duct outlet 422 of the heat dissipation air duct.

Specifically, in the installation state, the wind shielding foam is adhered to the long strip-shaped part of the large surface of the first radiator 42 facing the control main board 30, and the surface of the control main board 30 is adhered closely, so that the fit gap between the first radiator 42 and the control main board 30 is blocked, and the purpose of preventing heat energy from flowing back is achieved.

Further, the heat dissipating device 40 further includes a second wind shielding member 48, the first heat sink 42 adopts a fin-shaped heat dissipating structure, an opening side communicating with the heat dissipating air duct is further formed on a side of the first heat sink 42 facing away from the control motherboard 30, and the second wind shielding member 48 is hermetically covered on the opening side. For example, the second wind shielding member 48 adopts a Mylar, and the Mylar covers the opening side of the heat dissipation air duct, so that the air leakage problem on the opening side can be prevented, the heat can be carried and discharged by the air, and the heat dissipation and cooling effects on the control main board 30 are ensured.

With continued reference to fig. 7, further, a first wind-shielding wall 212a and a second wind-shielding wall 212b are arranged on the inner side wall of the rear housing 212 in a protruding manner, an air guiding channel 212c is formed between the first wind-shielding wall 212a and the second wind-shielding wall 212b, one end of the air guiding channel 212c is communicated with an air channel outlet 422 of the heat dissipation air channel, and the other end of the air guiding channel 212c is communicated with the air outlet 213 a. During installation, the aforementioned air shielding foam (i.e., the first air shielding member 47) can just be in abutting engagement with the end surfaces of the first air shielding wall 212a and the second air shielding wall 212b and the inner wall of the front housing 211, so that the air duct outlet 422 of the heat dissipation air duct forms a circumferential seal, even if the air guide channel 212c can form a seal cavity, the heat dissipation air discharged from the air duct outlet 422 can only flow directly to the air outlet 213a under the guiding action of the first air shielding wall 212a and the second air shielding wall 212b, thereby discharging the heat outside the upright post 21, and realizing the effect of more effectively discharging the heat.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (15)

1. A heat dissipating device for mounting on a control motherboard to dissipate heat from the control motherboard, the heat dissipating device comprising:

a fan;

the first radiator is provided with a radiating air duct, and an air duct inlet of the radiating air duct is communicated with an air outlet of the fan; the method comprises the steps of,

a second heat sink in heat transfer engagement with the first heat sink;

the first radiator is used for radiating the first functional area of the control main board, and the second radiator is used for radiating the second functional area of the control main board.

2. The heat sink of claim 1, further comprising a connector through which the fan is assembled with the first heat sink.

3. The heat sink of claim 1 wherein the first functional area is provided with a CPU, the heat sink further comprising a first thermally conductive member disposed in heat transfer engagement with the CPU and the first heat sink.

4. The heat dissipating device of claim 1, wherein the first functional area is provided with a CPU, and further comprising a first heat conducting member, wherein a boss is formed on a side of the first heat sink facing the control motherboard, and wherein the first heat conducting member is disposed on the boss and is in heat transfer engagement with the CPU.

5. The heat dissipating device of claim 1, wherein the second functional area is provided with a capacitive device, a recess is formed in a side of the second heat sink facing the control motherboard, and a second heat conducting member is disposed in the recess and is in heat transfer fit with the capacitive device extending into the recess.

6. The heat dissipating device according to claim 5, wherein at least two of the avoiding recesses are provided and arranged stepwise in a thickness direction of the second heat sink, the second heat conducting members are each provided in each of the avoiding recesses, and different ones of the second heat conducting members are each adapted to be heat-transferred to be engaged with the capacitor devices having different heights.

7. The heat sink of any one of claims 1 to 6, further comprising a first wind shield mounted on an outer wall of the first heat sink and disposed proximate an air duct outlet of the heat dissipation air duct.

8. The heat dissipating device of any one of claims 1 to 6, further comprising a second wind shield, wherein the first heat sink is of a fin-shaped heat dissipating structure, an open side communicating with the heat dissipating air duct is further formed on a side of the first heat sink facing away from the control motherboard, and the second wind shield is hermetically covered on the open side.

9. An intelligent interaction device, characterized by comprising a heat dissipating arrangement according to any of claims 1 to 8:

a display;

the base body is connected with the display in a supporting way and is provided with an installation cavity, a heat radiation air inlet and an air outlet which are communicated with the installation cavity;

the control main board is arranged in the mounting cavity, the control main board comprises the first functional area and the second functional area, the first radiator is used for radiating the first functional area of the control main board, and the second radiator is used for radiating the second functional area of the control main board;

the air inlet of the heat dissipation air duct is communicated with the air inlet of the fan, and the air duct outlet of the heat dissipation air duct is communicated with the air outlet.

10. The intelligent interaction device of claim 9, wherein the control motherboard is further provided with a through-air hole, and the heat dissipation air inlet is communicated with the air inlet of the fan through the through-air hole.

11. The intelligent interaction device of claim 9, wherein the base comprises a stand column and a base, one end of the stand column is in supporting connection with the display, the other end of the stand column is connected with the base, and the stand column is provided with the installation cavity, the heat dissipation air inlet and the air outlet.

12. The intelligent interactive apparatus according to claim 11, wherein the upright comprises a front shell, a rear shell and side trim strips, the front shell is detachably connected with the rear shell, the side trim strips are detachably connected with the front shell and the rear shell respectively, and the front shell, the rear shell and the side trim strips enclose the mounting cavity.

13. The intelligent interactive apparatus according to claim 12, wherein a bracket is provided on an inner side wall of the front case, and the control main board is mounted on the bracket.

14. The intelligent interactive apparatus according to claim 12, wherein the heat radiation air inlet is formed in the front case and is provided in a first grid structure, and the air outlet is formed in the side molding and is provided in a second grid structure.

15. The intelligent interaction device of claim 12, wherein the inner side wall of the rear shell is convexly provided with a first wind-shielding wall and a second wind-shielding wall which are arranged at intervals, an air guide channel is formed between the first wind-shielding wall and the second wind-shielding wall, one end of the air guide channel is communicated with an air channel outlet of the heat dissipation air channel, and the other end of the air guide channel is communicated with the air outlet.