CN214375575U

CN214375575U - Heat dissipation module and head-mounted device

Info

Publication number: CN214375575U
Application number: CN202120376442.1U
Authority: CN
Inventors: 王国岩; 苗盼盼
Original assignee: Goertek Optical Technology Co Ltd
Current assignee: Goertek Techology Co Ltd
Priority date: 2021-02-18
Filing date: 2021-02-18
Publication date: 2021-10-08
Anticipated expiration: 2031-02-18

Abstract

The utility model belongs to the technical field of head-mounted products, in particular to a heat dissipation module and a head-mounted device; the heat dissipation module comprises a main board heat dissipation fin, wherein side heat dissipation fins are respectively arranged at two sides of the main board heat dissipation fin, a heat conduction piece is arranged between the main board heat dissipation fin and the two side heat dissipation fins, and a fan is respectively arranged at each side heat dissipation fin; the head-mounted equipment comprises a shell, a main board support, a main board assembly and a heat dissipation module, wherein the main board heat dissipation fins are attached to the main board assembly, two side heat dissipation fins are arranged at the left side edge and the right side edge of the main board support respectively, fan positions corresponding to the two sides of the shell are provided with shell air outlet holes respectively, and a shell air inlet is formed in the shell. On the heat transfer that mainboard subassembly produced the mainboard fin, on the lateral part fin of rethread heat-conducting piece with heat conduction to both sides, increased heat radiating area, the fan can accelerate the air flow moreover with the quick heat that looses to the bandeau equipment outside, has solved the problem that current head-mounted apparatus's radiating efficiency is low.

Description

Heat dissipation module and head-mounted device

Technical Field

The utility model belongs to the technical field of wear the product, especially, relate to a heat dissipation module and head-mounted apparatus.

Background

More and more head-mounted devices (such as VR all-in-one machines and the like) appear in daily life, along with the development of technology and the improvement of user's demand, head-mounted devices develop towards miniaturization and light and thin, and the function that possesses is more and more moreover, and during the use, the heat that produces is also more and more. The heat dissipation efficiency of the existing head-mounted equipment is low, so that the temperature rise of the head-mounted equipment is too high, and the use of a user is seriously influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation module and head-mounted device aims at solving the problem that current head-mounted device's radiating efficiency is low.

The utility model discloses a heat dissipation module, heat dissipation module includes the mainboard fin the both sides department of mainboard fin is equipped with the lateral part fin respectively mainboard fin and two be equipped with the heat-conducting piece between the lateral part fin, every lateral part fin department is equipped with the fan respectively.

As an improvement, the two side radiating fins are oppositely arranged, and the two fans are respectively arranged on the outer sides of the two side radiating fins.

As an improvement, the shell of the fan is fixedly connected with the side radiating fins.

As an improvement, the heat conducting part is of an integrated structure and is fixedly connected with the main board radiating fin and the two side radiating fins respectively.

As an improvement, the heat conducting piece is a heat pipe or a metal strip.

As an improvement, mounting grooves are respectively arranged on the main board radiating fins and the two side radiating fins, and the parts of the heat conducting pieces corresponding to the mounting grooves are fixed in the mounting grooves.

As an improvement, the mounting groove arranged on the side radiating fin is a groove body protruding out of the side radiating fin, and the mounting groove arranged on the main board radiating fin is a groove sunken into the main board radiating fin.

The utility model also discloses a head-mounted apparatus, head-mounted apparatus includes the shell, installs mainboard support in the cavity is enclosed into to the shell, fixes mainboard subassembly on the mainboard support and the heat dissipation module, the mainboard fin with the laminating of mainboard subassembly, two lateral part fins set up respectively mainboard support's left and right sides limit department fan department that corresponds both sides on the shell is equipped with the shell exhaust vent respectively be equipped with the shell air intake on the shell.

As an improvement, an avoiding recess is further formed in the lower side of the shell, and the shell air inlet is formed in the avoiding recess.

As an improvement, the left and right sides punishment of mainboard support do not is connected with the holding cell body, both sides the notch of holding cell body sets up relatively, the homonymy the lateral part fin with the fan is fixed and is being corresponded the side the storage tank is internal the cell body exhaust vent is equipped with in the cell wall of holding cell body with the position department that the shell air intake corresponds.

Due to the adoption of the technical scheme, the heat dissipation module comprises the main board cooling fins, the lateral cooling fins are respectively arranged at the two sides of the main board cooling fins, the heat conducting piece is arranged between the main board cooling fins and the two lateral cooling fins, and the fan is respectively arranged at each lateral cooling fin; the head-mounted equipment comprises a shell, a mainboard support, a mainboard assembly and a heat dissipation module, wherein the mainboard support is arranged in a cavity defined by the shell, the mainboard assembly is fixed on the mainboard support, the mainboard cooling fins are attached to the mainboard assembly, two side cooling fins are respectively arranged at the left side edge and the right side edge of the mainboard support, the fan positions corresponding to the two sides on the shell are respectively provided with a shell air outlet, and a shell air inlet is formed in the shell. Mainboard fin and the laminating of the mainboard subassembly of bandeau equipment, two lateral part fin set up the left and right sides limit department of mainboard support respectively, and on the heat transfer that mainboard subassembly produced arrived the mainboard fin, on the lateral part fin of rethread heat-conducting piece with heat conduction to both sides, heat radiating area has been increased, do not is equipped with the fan in every lateral part fin punishment moreover, thereby can accelerate the air flow with the quick heat dissipation to the bandeau equipment outside of loosing, can improve the radiating efficiency, the utility model discloses a radiating module and head-mounted device have solved the problem that the radiating efficiency of current head-mounted device is low.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipation module according to the present invention;

fig. 2 is a schematic view of an installation structure of the heat dissipation module of the present invention;

fig. 3 is a schematic perspective view of the head-mounted device of the present invention;

the heat-conducting element comprises 11 main board radiating fins, 12 side radiating fins, 13 heat-conducting elements, 14 a fan, 20 a main board support, 21 a containing groove body, 22 a groove body air outlet, 30 a shell, 31 a shell air outlet, 32 a shell air inlet, 33 and an avoiding recess.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It should be noted that if the present invention relates to a directional indication (for example, up, down, front, back, etc.), the directional indication is only used to explain the relative position relationship between the components in a specific posture, and if the specific posture changes, the directional indication changes accordingly; if reference is made in the present application to the description of "first", "second", etc., then the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated.

Fig. 1 to fig. 3 are the structural schematic diagram of the heat dissipation module and the head-mounted device of the present invention, wherein, fig. 1 shows the utility model discloses a heat dissipation module's spatial structure schematic diagram, fig. 2 shows the utility model discloses a heat dissipation module's mounting structure schematic diagram, fig. 3 shows the utility model discloses a head-mounted device's spatial structure schematic diagram. For the sake of convenience, only the parts relevant to the present invention are shown in the drawings.

As shown in fig. 1, the heat dissipation module includes a main board heat sink 11, side heat sinks 12 respectively disposed at two sides of the main board heat sink 11, a heat conducting member 13 disposed between the main board heat sink 11 and the two side heat sinks 12, and a fan 14 disposed at each side heat sink 12.

During the installation, with the mainboard subassembly laminating of mainboard fin 11 and bandeau equipment, set up relevant position department respectively with two lateral part fin 12, the heat transfer that the mainboard subassembly of bandeau equipment produced is to mainboard fin 11 on, rethread heat-conducting piece 13 conducts the heat to the lateral part fin 12 of both sides on, heat radiating area has been increased, do not be equipped with fan 14 in every lateral part fin 12 punishment in addition, thereby can accelerate the air flow with the quick heat that looses to the bandeau equipment outside, can improve the radiating efficiency, the utility model discloses a radiating module has solved the problem that current head-mounted device's radiating efficiency is low.

In the present invention, the two side fins 12 are disposed oppositely, and the two fans 14 are disposed outside the two side fins 12, respectively.

Typically, the housing of the fan 14 is fixedly attached to the side fins 12.

The utility model discloses in, heat-conducting piece 13 formula structure as an organic whole, respectively with mainboard fin 11, two lateral part fins 12 fixed connection, specific theory, heat-conducting piece 13 is the heat pipe, of course, this heat-conducting piece 13 also can be the metal strip that the material that heat conductivility is high such as copper made.

For the convenience of installation, mounting grooves are respectively formed in the main board radiating fins 11 and the two side radiating fins 12, and the part of the heat conducting piece 13 corresponding to the mounting grooves is fixed in the mounting grooves, generally, the fixing is realized in a clamping manner, a heat conducting glue bonding manner and the like. Specifically, the mounting groove provided on the side heat sink 12 is a groove body protruding out of the side heat sink 12; the mounting groove arranged on the main board radiating fin 11 is a concave groove towards the main board radiating fin 11, so that the thickness of the mounting position of the main board radiating fin 11 and the heat conducting piece 13 can be prevented from being too large.

For ease of understanding, the installation of the heat dissipation module is described below with reference to fig. 2:

generally, the mainboard assembly of the head-mounted device is fixed on the mainboard support 20, the mainboard cooling fins 11 of the heat dissipation module are correspondingly arranged at the mainboard support 20, and the two side cooling fins 12 are respectively arranged at the left side and the right side of the mainboard support 20, so that the heat dissipation module is prevented from influencing the installation and the arrangement of the internal structure of the head-mounted device.

According to the drawing, the utility model discloses in still relate to a head-mounted device, this head-mounted device includes shell 30, install mainboard support 20 and fix the mainboard subassembly on mainboard support 20 in the cavity that the shell 30 encloses, still include above-mentioned heat dissipation module, the mainboard fin 11 and the mainboard subassembly laminating of this heat dissipation module, two lateral part fins 12 of this heat dissipation module set up left and right both sides limit department at mainboard support 20 respectively, fan 14 punishment that corresponds both sides on shell 30 do not is equipped with shell exhaust vent 31, still be equipped with shell air intake 32 on shell 30.

The utility model discloses in, still be equipped with the sunken 33 of dodging that is used for dodging user's nose in the downside department of shell 30, shell air intake 32 sets up and is dodging sunken 33 department. Because the position of the housing 30 corresponding to the avoiding recess 33 is located in the middle of the housing 30, that is, the housing air inlet 32 is arranged in the middle of the housing 30, the air in the cavity defined by the housing 30 and the air outside can flow conveniently, and the heat dissipation efficiency can be further improved.

The utility model discloses in, for the convenience of installing lateral part fin 12, fan 14, the left and right sides limit department at mainboard support 20 is connected with holding cell body 21 respectively, and the notch of the holding cell body 21 of both sides sets up relatively, and the lateral part fin 12 of homonymy is fixed in the holding cell body 21 that corresponds the side with fan 14, is equipped with cell body exhaust vent 22 in the cell wall of holding cell body 21 and the position department that shell air intake 32 corresponds.

Specifically, the main board bracket 20 is integrally connected with the two accommodating grooves 21, so that the processing is convenient.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A heat dissipation module comprises main board heat dissipation fins and is characterized in that side heat dissipation fins are arranged on two sides of each main board heat dissipation fin respectively, a heat conduction piece is arranged between each main board heat dissipation fin and each two side heat dissipation fins, and a fan is arranged on each side heat dissipation fin respectively.

2. The heat dissipation module of claim 1, wherein the two side fins are disposed opposite to each other, and the two fans are disposed outside the two side fins, respectively.

3. The thermal module of claim 2, wherein the housing of the fan is fixedly attached to the side fins.

4. The thermal module of any one of claims 1 to 3, wherein the thermal conductor is a one-piece structure and is fixedly connected to the main plate fin and the two side fins.

5. The heat dissipation module of claim 4, wherein the heat conducting member is a heat pipe or a metal strip.

6. The heat dissipating module of claim 4, wherein a mounting groove is formed on each of the main plate heat sink and the two side heat sinks, and a portion of the heat conducting member corresponding to the mounting groove is fixed in the mounting groove.

7. The heat dissipation module of claim 6, wherein the mounting groove formed on the side heat sink is a groove protruding from the side heat sink, and the mounting groove formed on the main board heat sink is a groove recessed into the main board heat sink.

8. A head-mounted device comprises a shell, a main board support arranged in a cavity enclosed by the shell, and a main board assembly fixed on the main board support, and is characterized by further comprising the heat dissipation module set forth in any one of claims 1 to 7, wherein the main board heat dissipation fins are attached to the main board assembly, the two side heat dissipation fins are respectively arranged at the left side edge and the right side edge of the main board support, the fan positions corresponding to the two sides of the shell are respectively provided with a shell air outlet, and the shell is provided with a shell air inlet.

9. The headset of claim 8 wherein an escape recess is further provided at the underside of the housing, the housing air inlet being provided at the escape recess.

10. The head-mounted device of claim 8, wherein the left and right sides of the main board support are respectively connected with an accommodating groove body, the notches of the accommodating groove bodies on the two sides are arranged oppositely, the side radiating fins and the fan on the same side are fixed in the accommodating groove bodies on the corresponding sides, and a groove body air outlet is formed in the position, corresponding to the air inlet of the shell, of the groove wall of the accommodating groove body.