CN218103960U - Control device convenient for heat dissipation - Google Patents

Abstract

The utility model discloses a control device convenient for heat dissipation, which aims to solve the heat dissipation problem of the control device existing in the field of automation equipment, and comprises a shell, wherein a circuit board and a heat dissipation channel are arranged inside the shell; one side of the heat conducting plate is connected with the circuit board, and the other side of the heat conducting plate extends towards the heat dissipation channel and is provided with a plurality of heat dissipation scales; a heat sink disposed within the heat dissipation channel. The utility model discloses the heat that well circuit board produced disperses to the heat dissipation passageway in through the heat dissipation scale of heat-conducting plate to give off to the casing outside through the heat abstractor in the heat dissipation passageway, thereby realize the heat dissipation to controlling means.

Description

Control device convenient for heat dissipation

Technical Field

The utility model relates to an automation equipment technical field especially relates to a controlling means convenient to heat dissipation.

Background

In the automation equipment technology, because the controller inevitably needs to generate heat in the working process, the heat needs to be quickly conducted to the outside in time through the heat dissipation structure, otherwise the functions of related electronic elements of the controller are affected, even the related electronic elements of the controller are burnt, and finally the controller cannot work. Therefore, the heat dissipation performance of the controller is directly related to the service life of the controller. The heat radiation structure of the existing controller has the problems of poor heat radiation effect, uneven heat radiation, complex processing and mounting procedures and the like, and greatly influences the use experience and the service life of a product.

SUMMERY OF THE UTILITY MODEL

The utility model provides a controlling means convenient to heat dissipation aims at solving one of the technical problem that exists among the prior art at least.

The technical scheme of the utility model be a controlling means convenient to heat dissipation, it includes: the heat dissipation device comprises a shell, wherein a circuit board and a heat dissipation channel are arranged inside the shell; one side of the heat conducting plate is connected with the circuit board, and the other side of the heat conducting plate extends towards the heat radiating channel and is provided with a plurality of heat radiating scales; and the heat dissipation device is arranged in the heat dissipation channel.

Furthermore, the back side of the shell is provided with a plurality of air inlets, the right side of the shell is provided with a plurality of air outlets, and the air inlets and the air outlets are communicated through a heat dissipation channel.

Furthermore, the heat dissipation channel is parallel to the heat conduction plate, the heat dissipation device comprises a plurality of heat dissipation fans, and the heat dissipation fans are arranged towards the air outlet.

Furthermore, the radiating fins are parallel to the radiating channel.

Furthermore, a clamping groove is formed in the inner side of the shell, the width of the clamping groove is matched with the thickness of the circuit board, and the circuit board is clamped in the clamping groove.

Further, still include the heat dissipation frame, the heat dissipation frame is fixed in the casing, and the heat dissipation frame is provided with the installation cavity with heat conduction board looks adaptation, and the heat-conducting plate setting is in the installation cavity.

Further, the heat conducting plate is fixed with the heat radiating frame through a plurality of bolt pieces.

Further, the heat conducting plate is made of copper materials.

Further, a heat-conducting silicone grease coating is arranged on one side of the heat-conducting plate facing the circuit board.

The utility model discloses an at least, following beneficial effect has:

1. the heat generated by the circuit board is dissipated into the heat dissipation channel through the heat dissipation scales of the heat conduction plate and is dissipated to the outer side of the shell through the heat dissipation device in the heat dissipation channel, so that the heat dissipation of the control device is realized;

2. the heat-conducting plate is fixedly installed by arranging the heat-radiating frame, so that the position between the heat-conducting plate and the circuit board is stable, and the heat-conducting plate is prevented from interfering with components on the circuit board;

3. through set up heat conduction silicone grease coating on the heat-conducting plate, help the guide to collect the heat on the guide circuit board to improve the efficiency that the heat was dispersed.

Drawings

Fig. 1 is a general schematic diagram of a control device according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view of a control device according to an embodiment of the present invention.

Reference numerals: a housing 100; an air intake hole 101; an air outlet 102; a card slot 103; a circuit board 200; a heat dissipation channel 300; a heat conductive plate 400; heat dissipation fins 401; a thermally conductive silicone grease coating 402; a heat sink 500; the heat dissipation frame 600.

Detailed Description

The following description will describe several embodiments of the present invention, including the embodiments corresponding to the accompanying drawings, it being understood that the drawings are for assisting understanding of the technical features and aspects of the present invention, and should not be interpreted as limiting the scope of the present invention.

The conception, specific structure and resulting technical effects of the present invention will be made clear and fully described with reference to the accompanying drawings and examples, so as to fully understand the objects, aspects and effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It should be noted that, unless otherwise specifically limited, when a feature is referred to as being "fixed," "connected," or "mounted" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature, and the terms "fixed," "connected," or "mounted" are used broadly, those skilled in the art can reasonably determine the specific meaning of the above-mentioned terms in the present disclosure in combination with the details of the technical solutions.

It should be noted that the description of the directions or positional relationships indicated by the upper, lower, left, right, top, bottom, front, back, inner, outer, etc. used in the present invention is the directions or positional relationships based on the drawings or the embodiments, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.

It should be noted that, as used herein, the term "and/or" includes any combination of one or more of the associated listed items, a plurality of which means one or more, a plurality of which means two or more, greater than, less than, more than, etc. are understood to exclude the present numbers, and greater than, less than, etc. are understood to include the present numbers.

It should be noted that the description of the first and second embodiments of the present invention is only for the purpose of distinguishing technical features, and is not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features.

It is to be understood that, unless otherwise specifically defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1 and 2, in some embodiments, a control device for facilitating heat dissipation according to the present invention includes: the heat dissipation device comprises a shell 100, wherein a circuit board 200 and a heat dissipation channel 300 are arranged in the shell 100, the circuit board 200 is vertically arranged in the shell 100, and the heat dissipation channel 300 is horizontally arranged along the left and right direction of the shell 100; the heat conducting plate 400 is a rectangular plate, the heat conducting plate 400 is vertically arranged and parallel to the circuit board 200, one side surface of the heat conducting plate 400 is abutted against the circuit board 200, the other side surface of the heat conducting plate 400 is internally provided with a plurality of radiating fins 401 extending towards the radiating channel 300, and the radiating fins 401 are arranged at intervals along the horizontal direction; heat abstractor 500, heat abstractor 500 set up in heat dissipation channel 300, the utility model discloses in, the heat that circuit board 200 produced disperses to heat dissipation channel 300 in through the heat dissipation scale 401 of heat-conducting plate 400 to give off to the casing 100 outside through heat abstractor 500 in the heat dissipation channel 300, thereby realize the heat dissipation to controlling means.

Further, referring to fig. 1 and 2, a plurality of air inlets 101 are disposed on the back side of the casing 100, a plurality of air outlets 102 are disposed on the right side of the casing 100, the air inlets 101 and the air outlets 102 are communicated through a heat dissipation channel 300, in more detail, a section of the heat dissipation channel 300 communicating with the air outlets 102 is parallel to the heat conduction plate 400 and the heat dissipation scale 401, the heat dissipation device 500 includes a plurality of heat dissipation fans, the heat dissipation fans are disposed toward the air outlets 102, the heat dissipation fans generate air flow, so that external cold air is sucked in from the air inlets 101 and is discharged through the air outlets 102 after exchanging heat with the heat dissipation scale 401 in the heat dissipation channel 300, and by disposing the heat dissipation channel 300 parallel to the heat conduction plate 400 and the heat dissipation scale 401, the cold air generated by the heat dissipation fans can be fully contacted with the heat dissipation scale 401, and the heat exchange effect is greatly improved.

Further, referring to fig. 2, a card slot 103 is disposed on the inner side of the housing 100, the card slot 103 is used for fixedly mounting the circuit board 200, the width of the card slot 103 is adapted to the thickness of the circuit board 200, and the circuit board 200 is clamped in the card slot 103, so that the circuit board 200 can be conveniently mounted, dismounted and replaced, and the maintenance of the device is facilitated.

Further, referring to fig. 2, the heat dissipation module further includes a heat dissipation frame 600, the heat dissipation frame 600 is fixed in the casing 100 by screws, the heat dissipation frame 600 is a rectangular frame, the heat dissipation frame 600 is provided with a rectangular installation cavity matched with the heat conduction plate 400, the heat conduction plate 400 is clamped in the installation cavity and is fixedly connected with the heat dissipation frame by four groups of bolt members, the heat conduction plate 400 is fixedly installed by setting the heat dissipation frame 600, the position between the heat conduction plate 400 and the circuit board 200 is ensured to be stable, and the heat conduction plate 400 is prevented from interfering with components on the circuit board 200.

Furthermore, the heat conducting plate is prepared by adopting a copper material, and the copper material has good heat conduction and heat dissipation performance so as to ensure the heat dissipation efficiency of the heat conducting plate. Correspondingly, the material of the heat conducting plate of the present invention is not limited to the copper material in this embodiment, and can also be other heat dissipating materials such as aluminum or aluminum alloy.

Further, referring to fig. 2, the heat conductive plate 400 is provided with a heat conductive silicone grease coating 402 on a side of the circuit board 200, and the heat conductive silicone grease coating 402 has a heat conductive function, which helps to guide, collect and guide heat on the circuit board 200, thereby improving heat dissipation efficiency.

It is noted that, in the description, terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment", etc., may be applied to describe several embodiments of the present invention, and specific features, structures, materials or characteristics of several embodiments may be combined in a manner consistent with the principles and spirit of the present invention.

Although some embodiments of the present invention have been shown and described in the present specification, the present invention should not be limited to the above embodiments as long as the technical effects of the present invention can be achieved by the same or equivalent means, and changes, modifications, equivalent substitutions and equivalent variations of these embodiments without departing from the spirit and the spirit of the present invention should be included in the protection scope of the present disclosure.

Claims (7)

1. A control device facilitating heat dissipation, comprising:

the heat dissipation device comprises a shell (100), wherein a circuit board (200) and a heat dissipation channel (300) are arranged in the shell (100), a plurality of air inlets (101) are arranged on the back side of the shell (100), a plurality of air outlets (102) are arranged on the right side of the shell (100), and the air inlets (101) are communicated with the air outlets (102) through the heat dissipation channel (300);

the heat-conducting plate (400), one side of the heat-conducting plate (400) is connected with the circuit board (200), and the other side of the heat-conducting plate (400) is internally provided with a plurality of radiating scales (401) extending towards the radiating channel (300);

a heat sink (500), the heat sink (500) disposed within the heat dissipation channel (300);

the heat dissipation channel (300) is parallel to the heat conduction plate (400), and the heat dissipation device (500) comprises a plurality of heat dissipation fans which are arranged towards the air outlet (102).

2. The control device for facilitating heat dissipation of claim 1, wherein the heat dissipation scale (401) is parallel to the heat dissipation channel (300).

3. The control device convenient for heat dissipation according to claim 1, wherein a card slot (103) is disposed on an inner side of the housing (100), a width of the card slot (103) is adapted to a thickness of the circuit board (200), and the circuit board (200) is clamped in the card slot (103).

4. The control device for facilitating heat dissipation of claim 1, further comprising a heat dissipation frame (600), wherein the heat dissipation frame (600) is fixed in the housing (100), the heat dissipation frame (600) is provided with a mounting cavity matched with the heat conduction plate (400), and the heat conduction plate (400) is arranged in the mounting cavity.

5. The control device for facilitating heat dissipation of claim 4, wherein the heat conductive plate (400) is fixed to the heat dissipation frame (600) by a plurality of bolt members.

6. The control device for facilitating heat dissipation of claim 1, wherein the heat conducting plate (400) is made of copper material.

7. A control device for facilitating heat dissipation according to claim 1, wherein the side of the heat conductive plate (400) facing the circuit board (200) is provided with a heat conductive silicone grease coating (402).

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