CN209861420U - Module power supply mounting structure - Google Patents
Module power supply mounting structure Download PDFInfo
- Publication number
- CN209861420U CN209861420U CN201920108558.XU CN201920108558U CN209861420U CN 209861420 U CN209861420 U CN 209861420U CN 201920108558 U CN201920108558 U CN 201920108558U CN 209861420 U CN209861420 U CN 209861420U
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- China
- Prior art keywords
- power supply
- heat dissipation
- shell
- heat
- mounting structure
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 238000005192 partition Methods 0.000 claims abstract description 22
- 238000009434 installation Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 description 8
- 238000000926 separation method Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a module power supply installation structure, which comprises a shell and a plurality of power supplies arranged in the shell, wherein the power supplies are in rectangular structures, the power supplies are provided with heat dissipation grooves, a mounting frame is arranged in the shell and comprises a plurality of vertical and parallel division plates, the power supplies are arranged between two adjacent division plates, and the heat dissipation grooves are attached to the surfaces of the division plates; the heat dissipation device comprises a power supply, a partition plate and a heat dissipation fan, wherein the partition plate is attached to the surface of the power supply and provided with a heat conduction groove, the heat conduction groove is vertically arranged and is perpendicular to the heat conduction groove, the inner surface of a shell is provided with the heat dissipation fan, the heat dissipation fan is located in the length direction of the heat conduction groove, the position, located on the heat dissipation fan, of the shell is provided with a heat dissipation hole, and an air outlet of the heat dissipation. The utility model discloses the effect that has higher radiating efficiency.
Description
Technical Field
The utility model belongs to the technical field of a module power's technique and specifically relates to a module power mounting structure is related to.
Background
The module power supply is a power supply which can be directly attached to a printed circuit board and can supply power for an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array and other digital or analog loads. Generally, such modules are referred to as point-of-load power supply systems or point-of-use power supply systems. Due to the obvious advantages of the modular structure, the modular power supply is widely applied to the communication fields of exchange equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, and automotive electronics, aerospace and the like.
The existing module power supply generally has a rectangular structure including two or more power supplies arranged in a shell, and particularly, when the structure is formed by combining a plurality of power supplies together, the heat generated by the power supplies is large, and if the heat is not dissipated in time, the temperature in the shell rises, so that the working efficiency of circuit components in the shell is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a module power mounting structure, it has the effect of higher heat dissipation efficiency.
The above object of the present invention is achieved by the following technical solutions:
a module power supply installation structure comprises a shell and a plurality of power supplies arranged in the shell, wherein the power supplies are of rectangular structures, heat dissipation grooves are formed in the power supplies, an installation frame is arranged in the shell and comprises a plurality of vertical separation plates which are arranged in parallel, a power supply is arranged between every two adjacent separation plates, and the heat dissipation grooves are attached to the surfaces of the separation plates; the heat dissipation device comprises a power supply, a partition plate and a heat dissipation fan, wherein the partition plate is attached to the surface of the power supply and provided with a heat conduction groove, the heat conduction groove is vertically arranged and is perpendicular to the heat conduction groove, the inner surface of a shell is provided with the heat dissipation fan, the heat dissipation fan is located in the length direction of the heat conduction groove, the position, located on the heat dissipation fan, of the shell is provided with a heat dissipation hole, and an air outlet of the heat dissipation.
Through adopting above-mentioned technical scheme, during the use, a plurality of powers are the rectangle structure, and power parallel placement is between the division board, radiator fan during operation, and the air current that radiator fan produced flows along the length direction of heat-conducting groove, and the length direction perpendicular to heat-radiating groove's of heat-conducting groove length direction, and the heat-conducting groove takes the heat from every heat-radiating groove to from louvre outflow casing, thereby can have great radiating efficiency to the power when a plurality of powers of placing in the casing.
The utility model discloses further set up to: the side of the power supply, which faces away from the heat dissipation fan, is provided with a supporting plate, the supporting plate is perpendicular to the partition plate, the supporting plate and the partition plate are integrally arranged to form a whole, one surface, opposite to the heat dissipation holes, of the shell is provided with air inlets, and the air inlets and the supporting plate are arranged at intervals.
Through adopting above-mentioned technical scheme, the layer board supports in the below of power, and the layer board is perpendicular with the division board to interval setting between layer board and casing, thereby the cold air current that the air intake got into reaches in the casing earlier, shunts along the radiating groove again, thereby further improves the radiating efficiency to the power.
The utility model discloses further set up to: a support frame is arranged between the power supply and the supporting plate, the support frame is fixed on the power supply, and the power supply and the supporting plate are arranged at intervals.
Through adopting above-mentioned technical scheme, set up the support frame between power and the layer board to make the distance between power and the layer board adjust, make things convenient for some air current directly to enter into the heat conduction inslot, accelerate the air current in every heat conduction inslot.
The utility model discloses further set up to: the support frame is in a shape like a Chinese character 'ji', and the middle part of the support frame in the shape like a Chinese character 'ji' is fixed on the power supply.
Through adopting above-mentioned technical scheme, the support frame is the n font, and the space that occupies is smaller on the one hand, and on the other hand can make elastic support between power and the layer board, reduces power and layer board vibration impact.
The utility model discloses further set up to: the casing includes body and lid, and the lid is whole to be the U-shaped, and the mounting bracket setting is in this internal, seted up on the body with lid matched with breach, and the power is located this internal.
Through adopting above-mentioned technical scheme, the lid is the U-shaped, makes things convenient for the power to place on the mounting bracket of this internal to the power is located this internally, makes to form sufficient air current space between lid and the power, makes things convenient for the air current to distribute in the radiating groove.
The utility model discloses further set up to: the mounting bracket is provided with a barrier strip, the barrier strip is perpendicular to the partition plate and fixed on the side edge of the partition plate, and the barrier strip is positioned on one side of the power supply close to the notch.
Through adopting above-mentioned technical scheme, the blend stop is fixed on the side of division board to the blend stop is located the power and is close to one side of breach, makes things convenient for the power to place the back between the division board, blocks the power, prevents that the power from deviating from.
The utility model discloses further set up to: the circuit board is fixed on one side of the power supply close to the notch, and the side edge of the circuit board is attached to the surface of the shell where the cooling fan is located.
Through adopting above-mentioned technical scheme, when the circuit board was fixed in the one side that the power is close to the breach, the one end that the circuit board is close to radiator fan was in the encapsulated situation, avoided the air current directly to run off from the louvre, further accelerated the radiating efficiency of power.
The utility model discloses further set up to: the shell is made of aluminum alloy materials.
Through adopting above-mentioned technical scheme, the casing is made for aluminum alloy material, and the heat conduction efficiency of casing is higher to further accelerate the heat dissipation to the power.
To sum up, the utility model discloses a beneficial technological effect does:
1. when the heat dissipation fan works, airflow generated by the heat dissipation fan flows along the length direction of the heat conduction grooves, the length direction of the heat conduction grooves is perpendicular to the length direction of the heat dissipation grooves, the heat conduction grooves carry heat from each heat dissipation groove and flow out of the shell from the heat dissipation holes, and therefore the heat dissipation efficiency of a plurality of power supplies placed in the shell is high;
2. the support plate is supported below the power supply, the support plate is perpendicular to the partition plate, and the support plate and the shell are arranged at intervals, so that cold air flow entering from the air inlet firstly reaches the shell and then is divided along the heat dissipation groove, and the heat dissipation efficiency of the power supply is further improved;
3. when fixing the power and being close to one side of breach through the circuit board, the circuit board is close to radiator fan's one end and is in the encapsulated situation, avoids the air current directly to run off from the louvre, further accelerates the radiating efficiency of power.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic diagram of the explosion structure of the present invention;
FIG. 3 is a schematic view of the connection structure of the body and the power supply;
fig. 4 is a partially enlarged schematic view of a portion a in fig. 2.
In the figure, 1, a housing; 11. a body; 12. a cover body; 13. a notch; 14. heat dissipation holes; 15. an air inlet; 2. a power source; 21. a heat sink; 3. a mounting frame; 31. a partition plate; 311. a heat conducting groove; 32. a support plate; 4. a heat radiation fan; 5. a support frame; 6. blocking strips; 7. a circuit board.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, for the utility model discloses a module power supply mounting structure, including casing 1 and the inside power 2 that is provided with casing 1, casing 1 is made for aluminum alloy material, and casing 1 includes body 11 and lid 12, and lid 12 wholly is the U-shaped, and lid 12 covers casing 1 that forms the rectangle on body 11, has seted up breach 13 corresponding with lid 12 on body 11, and the edge of lid 12 is the same with the edge of breach 13 to make lid 12 link together with body 11.
Referring to fig. 3, a mounting frame 3 is provided in the body 11, the mounting frame 3 includes a plurality of parallel separation plates 31, the separation plates 31 are vertically disposed, two adjacent separation plates 31 are spaced apart from each other, the power supply 2 has a rectangular structure, the surface of the power supply 2 is attached to the separation plates 31, one power supply 2 is sandwiched between two adjacent separation plates 31, and the number of the power supplies 2 is plural. The surface of the power supply 2 attached to the partition plate 31 is provided with the heat dissipation grooves 21, the heat dissipation grooves 21 are horizontally formed, the surface of the power supply 2 attached to the partition plate 31 is provided with the heat conduction grooves 311, the heat conduction grooves 311 are vertically arranged, and the directions of the heat conduction grooves 311 and the heat dissipation grooves 21 are perpendicular, so that when airflow passes through the heat conduction grooves 311, heat of the power supply 2 can be taken away from each heat dissipation groove 21.
Referring to fig. 2 and 3, the heat dissipating fan 4 is disposed in the length direction of the heat conducting groove 311, the heat dissipating fan 4 is fixed on the inner sidewall of the body 11, a heat dissipating hole 14 is disposed at a position of the heat dissipating fan 4 on the body 11, an air outlet of the heat dissipating fan 4 faces the heat dissipating hole 14, and the hot air sucked out by the heat dissipating fan 4 is discharged to the outside of the housing 1 through the heat dissipating hole 14. In the length direction of the heat conduction groove 311, the power supply 2 is provided with a support frame 5 for the fixed surface of the heat dissipation fan 4, the support frame 5 is shaped like a Chinese character 'ji', the middle part of the shape like a Chinese character 'ji' of the support frame 5 is fixed on the power supply 2, one end of the power supply 2 close to the heat dissipation fan 4 is provided with a support plate 32, the support frame 5 is positioned between the support plate 32 and the power supply 2, the support plate 32 is horizontally perpendicular to the partition plate 31, and the support plate 32 and the. One side of the body 11 opposite to the heat dissipation hole 14 is provided with an air inlet 15, and the air inlet 15 enters cold air flow into the body 11.
Referring to fig. 2, the mounting frame 3 is provided with a barrier 6, the barrier 6 is perpendicular to the partition plate 31, the barrier 6 is fixed on the side of the partition plate 31, and the barrier 6 is located on the side of the power supply 2 close to the notch 13. The barrier 6 can block the power supply 2 between the partition plates 31, thereby preventing the power supply 2 from being separated from between the partition plates 31. One end of the power supply 2 close to the heat dissipation fan 4 is provided with a circuit board 7, the circuit board 7 is fixed on one side of the power supply 2 close to the notch 13, and the side edge of the circuit board 7 is attached to the surface of the shell 1 where the heat dissipation fan 4 is located. When the air current enters the shell 1, the air current can be prevented from directly flowing out from the heat dissipation wind close to the power supply 2, and therefore the heat brought away by the air current is improved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (8)
1. The utility model provides a module power mounting structure, includes casing (1) and a plurality of power (2) of setting in casing (1), and a plurality of power (2) are the rectangle structure, its characterized in that: the heat dissipation device is characterized in that heat dissipation grooves (21) are formed in the power supply (2), an installation rack (3) is arranged in the shell (1), the installation rack (3) comprises a plurality of partition plates (31) which are vertically arranged and arranged in parallel, the power supply (2) is placed between every two adjacent partition plates (31), and the heat dissipation grooves (21) are attached to the surfaces of the partition plates (31); division board (31) paste and seted up heat-conducting groove (311) on power (2) surface, heat-conducting groove (311) vertical setting to radiating groove (21) are perpendicular with heat-conducting groove (311), be provided with radiator fan (4) on casing (1) internal surface, radiator fan (4) are located the length direction of heat-conducting groove (311), louvre (14) have been seted up to the position that lies in radiator fan (4) on casing (1), and the air outlet of radiator fan (4) is towards louvre (14).
2. The modular power supply mounting structure of claim 1, wherein: one side of the power supply (2) back to the heat dissipation fan (4) is provided with a supporting plate (32), the supporting plate (32) is perpendicular to the partition plate (31), the supporting plate (32) and the partition plate (31) are integrally arranged to form, one surface of the shell (1) opposite to the heat dissipation hole (14) is provided with an air inlet (15), and the air inlet (15) and the supporting plate (32) are arranged at intervals.
3. The modular power supply mounting structure according to claim 1 or 2, wherein: a support frame (5) is arranged between the power supply (2) and the supporting plate (32), the support frame (5) is fixed on the power supply (2), and the power supply (2) and the supporting plate (32) are arranged at intervals.
4. The modular power supply mounting structure of claim 3, wherein: the support frame (5) is in a shape like a Chinese character 'ji', and the middle part of the support frame (5) in the shape like a Chinese character 'ji' is fixed on the power supply (2).
5. The modular power supply mounting structure of claim 4, wherein: the shell (1) comprises a body (11) and a cover body (12), the cover body (12) is integrally U-shaped, the mounting frame (3) is arranged in the body (11), a notch (13) matched with the cover body (12) is formed in the body (11), and the power supply (2) is located in the body (11).
6. The modular power supply mounting structure of claim 5, wherein: be provided with blend stop (6) on mounting bracket (3), blend stop (6) perpendicular to division board (31), blend stop (6) are fixed on the side of division board (31), and blend stop (6) are located power (2) and are close to one side of breach (13).
7. The modular power supply mounting structure of claim 6, wherein: one end of the power supply (2) close to the heat dissipation fan (4) is provided with a circuit board (7), the circuit board (7) is fixed on one side of the power supply (2) close to the notch (13), and the side edge of the circuit board (7) is attached to the surface of the shell (1) where the heat dissipation fan (4) is located.
8. The modular power supply mounting structure of claim 1, wherein: the shell (1) is made of an aluminum alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920108558.XU CN209861420U (en) | 2019-01-22 | 2019-01-22 | Module power supply mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920108558.XU CN209861420U (en) | 2019-01-22 | 2019-01-22 | Module power supply mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209861420U true CN209861420U (en) | 2019-12-27 |
Family
ID=68930764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920108558.XU Expired - Fee Related CN209861420U (en) | 2019-01-22 | 2019-01-22 | Module power supply mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209861420U (en) |
-
2019
- 2019-01-22 CN CN201920108558.XU patent/CN209861420U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191227 Termination date: 20220122 |