CN213343145U - Electronic device - Google Patents
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- CN213343145U CN213343145U CN202022411238.7U CN202022411238U CN213343145U CN 213343145 U CN213343145 U CN 213343145U CN 202022411238 U CN202022411238 U CN 202022411238U CN 213343145 U CN213343145 U CN 213343145U
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- electronic device
- heat
- heat dissipation
- portable electronic
- assembly
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Abstract
The utility model discloses an electronic equipment, include: a portable electronic device and a base detachably mounted with the portable electronic device; wherein, portable electronic device includes: a first housing; the first heat dissipation assembly is arranged in the first shell and is used for contacting with a heat source; the base includes: the second shell is provided with a plurality of ventilation openings; and the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly. The utility model discloses in through place the base in the second radiator unit in, both solved portable electronic device's thickness problem, noise problem and heat dissipation problem, promoted portable electronic device's duration under the low-load state again, make portable electronic device possible thinner and zero noise, thereby portable electronic device can dispose the treater of high-power consumption and promote portable electronic device's performance.
Description
Technical Field
The utility model belongs to the heat abstractor field, concretely relates to electronic equipment.
Background
Along with the development of science and technology, more and more portable electronic device has made things convenient for people's life in entering into people's life, has become the indispensable important instrument of people, and present panel computer dispels the heat because of the fan that small, thickness are thin's requirement and can't install the big amount of wind, so in order to satisfy the heat dissipation requirement, the treater consumption of general panel computer is all lower, and the performance is relatively poor.
Therefore, in view of the above technical problems, it is necessary to provide an electronic device.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide an electronic device to achieve good heat dissipation.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an electronic device, comprising:
a portable electronic device and a base detachably mounted with the portable electronic device;
wherein, portable electronic device includes:
a first housing;
the first heat dissipation assembly is arranged in the first shell and used for realizing heat transfer with a heat source;
a base, comprising:
the second shell is provided with a plurality of ventilation openings;
the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly; and is configured to:
when the portable electronic device is matched with the base, the first radiating assembly is contacted with the second radiating assembly, heat generated by the heat source is transferred to the second radiating assembly through the first radiating assembly, and radiating airflow flows through the radiating channel so as to take away the heat on the second radiating assembly;
when the portable electronic device is separated from the base, heat generated by the heat source is dissipated to the outside through the first heat dissipation assembly.
In one embodiment, the first heat dissipation assembly includes a first vapor chamber in thermal communication with a heat source and in thermal communication with a second heat dissipation assembly when the portable electronic device and the base are mounted in cooperation.
In one embodiment, heat transfer between the first soaking plate and the heat source is generated through a heat pipe.
In one embodiment, the first soaking plate is formed with a first connecting portion for heat transfer with the heat pipe, and a second connecting portion for contact with the second heat dissipating component in a state where the portable electronic device and the base are mounted in cooperation.
In one embodiment, the second heat dissipation assembly includes a fan and a heat dissipation fin assembly installed in cooperation with the fan and in a state where the portable electronic device and the base are installed in cooperation with each other to achieve heat transfer with the first heat dissipation assembly, an internal flow channel is formed in the heat dissipation fin assembly, the internal flow channel has an air inlet opening and an air outlet opening, the air inlet opening is installed in cooperation with an air outlet of the fan, and the air outlet opening is communicated with the outside through a vent.
In one embodiment, the second heat dissipation assembly further comprises a second vapor chamber mounted on the heat dissipation fin assembly and in thermal communication with the first heat dissipation assembly when the portable electronic device and the base are mounted in a mated manner.
In one embodiment, the heat dissipation fin assembly comprises a first mounting plate, a second mounting plate and fins arranged between the first mounting plate and the second mounting plate, an internal flow passage is formed between the fins and the first mounting plate and between the fins and the second mounting plate, and the second vapor chamber is arranged on the first mounting plate or the second mounting plate.
In one embodiment, the heat pipe is installed in cooperation with the heat source through an installation plate.
In one embodiment, the ventilation openings include a first ventilation opening and a second ventilation opening, and the first ventilation opening and the second ventilation opening respectively correspond to the heat dissipation channel.
Compared with the prior art, the utility model has the advantages of it is following:
the utility model discloses in through place the base in the second radiator unit in, both solved portable electronic device's thickness problem, noise problem and heat dissipation problem, promoted portable electronic device's duration under the low-load state again, make portable electronic device possible thinner and zero noise, thereby portable electronic device can dispose the treater of high-power consumption and promote portable electronic device's performance.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic side view of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a portable electronic device according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a base according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a base according to an embodiment of the present invention;
fig. 5 is a schematic view of an internal structure of a base according to an embodiment of the present invention;
fig. 6 is a schematic side view of a heat dissipating fin assembly according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention;
fig. 8 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present invention;
fig. 9 is a schematic diagram of an internal structure of an electronic device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. However, the present invention is not limited to the embodiments, and the structural, method, or functional changes made by those skilled in the art according to the embodiments are all included in the scope of the present invention.
The utility model discloses an electronic equipment, include:
a portable electronic device and a base detachably mounted with the portable electronic device;
wherein, portable electronic device includes:
a first housing;
the first heat dissipation assembly is arranged in the first shell and is in heat transfer with the heat source;
a base, comprising:
the second shell is provided with a plurality of ventilation openings;
the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly; and is configured to:
when the portable electronic device is matched with the base, the first radiating assembly is contacted with the second radiating assembly, heat generated by the heat source is transferred to the second radiating assembly through the first radiating assembly, and radiating airflow flows through the radiating channel so as to take away the heat on the second radiating assembly;
when the portable electronic device is separated from the base, heat generated by the heat source is dissipated to the outside through the first heat dissipation assembly.
The present invention will be further described with reference to the following specific examples.
Referring to fig. 1, an electronic device includes: a portable electronic device 10 and a base 20 detachably mounted to the portable electronic device 10, wherein the portable electronic device 10 is a tablet computer, and the base 20 is a magnetic keyboard.
Referring to fig. 2, the portable electronic device 10 includes a first housing 11 and a first heat dissipation assembly installed in the first housing 11 and performing heat transfer with a heat source, the first heat dissipation assembly is installed in cooperation with the heat source through an installation plate 123, the heat source is generally a high-power component such as a CPU, and the like, wherein the first heat dissipation assembly includes a heat pipe 121 and a first soaking plate 122 installed in cooperation with the heat pipe 121, the heat pipe 121 is installed in cooperation with the heat source through the installation plate 123, the heat pipe 121, the first soaking plate 122 and the installation plate 123 are installed together by welding, the installation plate 123 is made of a copper material, the installation plate 123 is attached to the heat source so as to guide heat generated by the heat source to the heat pipe 121, and the heat on the heat pipe 121 is transferred to the first.
Further, the first soaking plate 122 is formed with a first connection portion 1221 connected to the heat pipe 121 and a second connection portion 1222 connected to the first connection portion 1221, the first connection portion 1221 and the second connection portion 1222 are formed by bending, a bending angle between the first connection portion 1221 and the second connection portion 1222 is 90 ° to 120 °, preferably 90 °, and a side surface of the first connection portion 1221 and the heat pipe 121 are closely attached by welding, thereby ensuring a heat conduction effect.
Referring to fig. 2, the bottom of the first housing 11 has a first opening, the second connecting portion 1222 is located in or protrudes from the first opening, and the bottom of the second connecting portion 1222 is higher than the bottom of the first housing 11 or the bottom of the second connecting portion 1222 is flush with the bottom of the first housing 11 or the bottom of the second connecting portion 1222 protrudes from the bottom of the first housing 11.
Referring to fig. 3 in combination with fig. 4, the base 20 includes a second housing 21, the second housing 21 has a groove 211, the groove 211 is located at one end of the second housing 21, the second housing 21 includes a bottom plate 212 and a cover plate 213 mounted on the bottom plate 212, the cover plate 213 includes a third connecting portion 2131, a fourth connecting portion 2132, a fifth connecting portion 2133 and a sixth connecting portion 2134 connected in sequence, the third connecting portion 2131, the fourth connecting portion 2132, the fifth connecting portion 2133 and the sixth connecting portion 2134 are all mounted on the bottom plate 212 by a side plate, an included angle between the third connecting portion 2131 and the fourth connecting portion 2132 is 100 ° to 160 °, preferably 140 °, the fourth connecting portion 2132 and the fifth connecting portion 2133 form a V-shaped groove 211, an included angle between the fourth connecting portion 2132 and the fifth connecting portion 2133 is 90 ° to 120 °, preferably 90 °, the sixth connecting portion 2134 is connected to the bottom plate 212 by bending itself, the groove 211 is used for placing the portable electronic device 10, the second opening has been seted up on the recess 211, and is concrete, the second opening is seted up on fourth connecting portion 2132, when portable electronic device 10 placed in the recess 211 of base 20, guarantee that second opening and first opening are corresponding, first casing 11 is placed on fourth connecting portion 2132, the lateral wall of first casing 11 leans on fifth connecting portion 2133, thereby all install magnet in first casing 11 and the recess 211 and can guarantee that first casing 11 is steady to be placed in recess 211.
Referring to fig. 4 and fig. 5, a second heat dissipation assembly is installed in the second housing 21, the second heat dissipation assembly is installed in a containing cavity formed between the cover plate 213 and the bottom plate 212, a heat dissipation channel is formed in the second heat dissipation assembly, specifically, the second heat dissipation assembly includes a fan 241, a heat dissipation fin assembly 242 installed in cooperation with the fan 241, an internal flow channel is formed in the heat dissipation fin assembly 242, the internal flow channel of the heat dissipation fin assembly 242 has an air inlet opening and an air outlet opening, the air inlet opening is installed in cooperation with an air outlet of the fan 241, the air outlet opening is communicated with the outside, and a heat dissipation channel is formed between the internal flow channel of the fan 241 and the internal flow channel of the heat dissipation fin assembly.
Referring to fig. 5, the second housing 21 is provided with a plurality of ventilation openings, the heat dissipation channel is communicated with the ventilation openings, specifically, the ventilation openings include a first ventilation opening 22 and a second ventilation opening 23, the first ventilation opening 22 and the second ventilation opening 23 correspond to two ends of the heat dissipation channel respectively, the first ventilation opening 22 and the second ventilation opening 23 are both provided on the bottom plate 212, wherein the first ventilation opening 22 is located below the air inlet of the fan 241, the second ventilation opening 23 corresponds to the air outlet opening of the internal flow channel of the heat dissipation fin assembly 242, the end of the bottom plate 212 close to the air outlet opening of the heat dissipation fin assembly 242 has a bent portion 2121, and the second ventilation opening 23 is provided on the bent portion 2121 to ensure that the air outlet opening corresponds to the internal flow channel of the heat dissipation fin assembly 242.
Referring to fig. 6, the heat dissipation fin assembly 242 includes a first mounting plate 2421, a second mounting plate 2422, and fins 2423 installed between the first mounting plate 2421 and the second mounting plate 2422, wherein the first mounting plate 2421 and the second mounting plate 2422 are distributed vertically, a plurality of fins 2423 are arranged side by side, and an internal flow channel of the heat dissipation fin assembly 242 is formed between the fins 2423 and the first mounting plate 2421 and the second mounting plate 2422.
Referring to fig. 8 in combination with fig. 7, the second heat sink further includes a second soaking plate 243 mounted on the heat dissipating fin assembly 242, and further, the second soaking plate 243 is mounted on the first mounting plate 2421, the second soaking plate 243 completely covers the upper surface of the first mounting plate 2421, and the second connecting portion 1222 is in contact with the second soaking plate 243 for heat transfer in a state that the portable electronic device 10 and the base 20 are cooperatively mounted.
Referring to fig. 6 in combination with fig. 7 and 8, the first mounting plate 2421 forms a first bending portion 24211 and a second bending portion 24212 by bending toward the bottom of the second case 21, the bending angle between the first bending portion 24211 and the second bending portion 24212 is 100 ° to 160 °, preferably 140 °, the second soaking plate 243 is bent in cooperation with the first mounting plate 2421, the second soaking plate 243 at the top of the first bending portion 24211 is in contact with the second connecting portion 1222, in order to ensure better fit contact between the second soaking plate 243 and the second connecting portion 1222, the second soaking plate 243 at the top of the first bending portion 24211 has a protruding portion 2431 having a width equal to that of the second connecting portion 1222, the protruding portion 2431 protrudes from or is lower than the top of the second opening, the protruding portion 2431 is integrally formed with the second soaking plate 243, whether the protruding portion 2431 is provided or not may be determined as needed, the second soaking plate 1222 can be better contacted with the second connecting portion 1222 by the protruding portion 2431, it should be noted that, since the first opening and the second opening have a certain thickness and the second connecting portion 1222 is located in the first opening or protrudes from the first opening, the contact portion of the second soaking plate 243 and the second connecting portion 1222 may be located in the first opening or the second opening, may also be located between the first opening and the second opening, and may of course be located in the first casing 11 or the second casing 21 by design.
In this embodiment, the size of the contact surface of the second connecting portion 1222 and the size of the contact surface of the second soaking plate 243 contacting with the second connecting portion 1222 can be made as required to ensure that there is enough contact surface between the two, thereby ensuring the heat transfer effect.
Referring to fig. 6 in combination with fig. 7 and 8, the second mounting plate 2422 forms a third bending part 24221 and a fourth bending part 24222 by bending toward the bottom of the second housing 21, the bending angle between the third bending part 24221 and the fourth bending part 24222 is 100 ° to 160 °, preferably 140 °, the portable electronic device 10 and the base 20 have a good mounting angle by bending the first mounting plate 2421 and the second mounting plate 2422, the user can use the portable electronic device conveniently, the internal flow channel of the heat sink assembly 242 corresponds to the second ventilation opening 23, and the second mounting plate 2422 has a certain gap between the second mounting plate 2422 and the second housing 21 below by bending the second mounting plate 2422, so that the contact area between the second housing 21 and the heat sink assembly 242 is reduced, and excessive heat transfer to the second housing 21 is prevented.
In a state where the portable electronic device 10 and the cradle 20 are separated, the heat generated by the heat source is guided to the heat pipe 121, the heat pipe 121 guides the heat to the first soaking plate 122, and the first soaking plate 122 contacts with the outside air to dissipate the heat.
Referring to fig. 9, in a state that the portable electronic device 10 and the base 20 are installed in a matching manner, at this time, the first soaking plate 122 contacts the second soaking plate 243, heat generated by the heat source is guided to the first soaking plate 122 through the heat pipe 121, the first soaking plate 122 transfers the heat to the second soaking plate 243, further, the heat is transferred to the heat dissipating fin assembly 242 through the second soaking plate 243 and is filled in the inner flow channel of the heat dissipating fin assembly 242, at this time, the fan 241 rotates to absorb outside air through the first ventilation opening 22, the generated heat dissipating airflow flows through the inner flow channel of the heat dissipating fin assembly 242 and flows out through the second ventilation opening 23, so as to take away the heat on the heat dissipating fin assembly 242, of course, the heat on the fan 241 is also taken away, when the fan 241 changes the direction, the outside air is absorbed through the second ventilation opening 23, the outside air flows through the inner flow channel of the heat dissipating fin assembly 242 and brings the heat on the heat dissipating fin assembly 242 into the air together with the heat on the heat In the fan 241, the fan 241 blows heat outward through the first ventilation opening 22.
According to the technical scheme provided by the utility model, the utility model discloses following beneficial effect has:
the utility model discloses in through place the base in the second radiator unit in, both solved portable electronic device's thickness problem, noise problem and heat dissipation problem, promoted portable electronic device's duration under the low-load state again, make portable electronic device possible thinner and zero noise, thereby portable electronic device can dispose the treater of high-power consumption and promote portable electronic device's performance.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. An electronic device, comprising:
a portable electronic device and a base detachably mounted with the portable electronic device;
wherein, portable electronic device includes:
a first housing;
the first heat dissipation assembly is arranged in the first shell and is in heat transfer with the heat source;
a base, comprising:
the second shell is provided with a plurality of ventilation openings;
the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly; and is configured to:
when the portable electronic device is matched with the base, the first radiating assembly is contacted with the second radiating assembly, heat generated by the heat source is transferred to the second radiating assembly through the first radiating assembly, and radiating airflow flows through the radiating channel so as to take away the heat on the second radiating assembly;
when the portable electronic device is separated from the base, heat generated by the heat source is dissipated to the outside through the first heat dissipation assembly.
2. The electronic apparatus of claim 1, wherein the first heat dissipation assembly comprises a first thermal spreader in thermal communication with a heat source and in thermal communication with a second heat dissipation assembly when the portable electronic device and the base are cooperatively mounted.
3. The electronic device of claim 2, wherein heat transfer between the first vapor chamber and the heat source occurs via a heat pipe.
4. The electronic apparatus according to claim 3, wherein the first vapor chamber is formed with a first connection portion that achieves heat transfer with the heat pipe, and a second connection portion that comes into contact with the second heat dissipating member in a state where the portable electronic device and the cradle are fitted.
5. The electronic device of claim 1, wherein the second heat dissipation assembly comprises a fan and a heat dissipation fin assembly installed in cooperation with the fan and configured to perform heat transfer with the first heat dissipation assembly when the portable electronic device and the base are installed in cooperation, an internal flow channel is formed in the heat dissipation fin assembly, the internal flow channel has an air inlet opening and an air outlet opening, the air inlet opening is installed in cooperation with an air outlet of the fan, and the air outlet opening is communicated with the outside through a vent.
6. The electronic apparatus of claim 5, wherein the second heat dissipation assembly further comprises a second heat spreader mounted on the heat dissipation fin assembly and in thermal communication with the first heat dissipation assembly when the portable electronic device and the base are mounted in mating relation.
7. The electronic device of claim 6, wherein the heat sink fin assembly comprises a first mounting plate, a second mounting plate, and fins mounted between the first mounting plate and the second mounting plate, the fins forming an internal flow channel with the first mounting plate and the second mounting plate, the second heat spreader plate being mounted on the first mounting plate or the second mounting plate.
8. The electronic device of claim 3, wherein the heat pipe is mounted in cooperation with a heat source via a mounting plate.
9. The electronic device of claim 1, wherein the vents comprise a first vent and a second vent, the first vent and the second vent corresponding to the heat dissipation channel, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022411238.7U CN213343145U (en) | 2020-10-26 | 2020-10-26 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022411238.7U CN213343145U (en) | 2020-10-26 | 2020-10-26 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213343145U true CN213343145U (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022411238.7U Active CN213343145U (en) | 2020-10-26 | 2020-10-26 | Electronic device |
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| Country | Link |
|---|---|
| CN (1) | CN213343145U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188814A (en) * | 2020-10-26 | 2021-01-05 | 太仓欣华盈电子有限公司 | Electronic device |
-
2020
- 2020-10-26 CN CN202022411238.7U patent/CN213343145U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188814A (en) * | 2020-10-26 | 2021-01-05 | 太仓欣华盈电子有限公司 | Electronic device |
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